Circuit board processing method and system

Abstract

The invention discloses a circuit board processing method and system, and belongs to the technical field of circuit board processing and manufacturing, and the method comprises the steps: obtaining the coordinate height of a supporting surface, and determining residual thickness monitoring data according to the coordinate height of the supporting surface and a preset residual thickness target parameter, therefore, the residual thickness monitoring data can be called to control the residual thickness of the circuit board. The upper surface coordinate height of the circuit board placed on the supporting surface is acquired, and the depth control monitoring data is determined according to the upper surface coordinate height of the circuit board and the preset depth control target parameter, so that the depth control monitoring data can be called to control the depth of the circuit board. By the adoption of the machining method, the requirements for depth control and residual thickness control can be met at the same time, machining precision is guaranteed, repeated plate feeding and discharging actions are reduced, production time is saved, machining efficiency is improved, and the risk that a depth control mode or a residual thickness mode is omitted can be effectively avoided.

Description

Technical Field

[0001] This application belongs to the field of circuit board processing and manufacturing technology, specifically relating to a circuit board processing method and system. Background Technology

[0002] During PCB (Printed Circuit Board) molding, certain processes require controlling the molding depth, retaining a portion of the thickness in the inner groove or outer shape. This is commonly referred to as depth-controlled molding or blind forming. Currently, to meet the processing requirements of balancing depth control and residual thickness, repeated board loading and unloading operations are necessary to complete the depth-controlled and residual thickness modes separately, lengthening processing time and impacting production efficiency. Summary of the Invention

[0003] Purpose of the invention: This application provides a circuit board processing method to overcome the technical problem of needing repeated board loading and unloading operations when processing requirements are met while taking into account both depth control and residual thickness; another purpose of this application is to provide a circuit board processing system.

[0004] Technical solution: A circuit board processing method according to an embodiment of this application includes:

[0005] Obtain the coordinate height of the support surface, which is the surface on the workbench used to support the circuit board; determine the residual thickness monitoring data based on the coordinate height of the support surface and the preset residual thickness target parameters;

[0006] Obtain the coordinate height of the upper surface of the circuit board placed on the support surface, and determine the depth control monitoring data based on the coordinate height of the upper surface of the circuit board and the preset depth control target parameters;

[0007] The circuit board is processed based on the residual thickness monitoring data and the depth control monitoring data.

[0008] In some embodiments, obtaining the coordinate height of the support surface includes: controlling a detection device to touch the support surface to obtain coordinate information data of the support surface; and obtaining the coordinate height of the support surface from the coordinate information data.

[0009] And / or,

[0010] Obtaining the coordinate height of the upper surface of a circuit board placed on the support surface includes: controlling a detection device to touch the upper surface of the circuit board to obtain coordinate information data of the upper surface of the circuit board; and obtaining the coordinate height of the upper surface of the circuit board from the coordinate information data.

[0011] In some embodiments, the detection device includes a probe.

[0012] In some embodiments, after determining the residual thickness monitoring data, the method further includes:

[0013] Obtain the coordinate height of the lower surface of the circuit board placed on the support surface. If the deviation between the coordinate height of the lower surface and the coordinate height of the support surface exceeds a preset deviation threshold, then redetermine the residual thickness monitoring data based on the coordinate height of the lower surface and the residual thickness target parameter.

[0014] The circuit board is processed based on the redefined residual thickness monitoring data and the depth control monitoring data.

[0015] In some embodiments, before obtaining the coordinate height of the support surface, the method further includes:

[0016] Display the interface in response to user commands;

[0017] The system receives parameters input by the user in the interface, including the residual thickness target parameter and the depth control target parameter, and saves the parameters to memory.

[0018] In some embodiments, after obtaining the coordinate height of the support surface, the method further includes:

[0019] The coordinates of the support surface are saved to memory.

[0020] In some embodiments, the residual thickness monitoring data is configured to be: a target coordinate height calculated based on the coordinate height of the support surface and the target residual thickness parameter;

[0021] And / or,

[0022] The depth control monitoring data is configured as follows: the target coordinate height is calculated based on the upper surface coordinate height of the circuit board and the depth control target parameters.

[0023] In some embodiments, after processing the circuit board, the method further includes:

[0024] Obtain the coordinate height of the upper surface of another circuit board placed on the support surface, and obtain the depth control monitoring data of the other circuit board based on the depth control target parameters and the coordinate height of the upper surface of the other circuit board;

[0025] Based on the residual thickness monitoring data and the depth control monitoring data of the other circuit board, the other circuit board is processed.

[0026] In some embodiments, the circuit board is processed, including:

[0027] Based on the residual thickness monitoring data, perform residual thickness mode operation to ensure that the circuit board meets the residual thickness target;

[0028] Based on the depth monitoring data, a depth control mode operation is performed to ensure that the circuit board meets the depth control target.

[0029] In some embodiments, the supporting surface is the upper surface of the wood pulp board disposed on the workbench.

[0030] Accordingly, an embodiment of this application provides a circuit board processing system, including a circuit board processing device, which is configured to perform the circuit board processing method described above.

[0031] Beneficial Effects: The circuit board processing method of this application embodiment obtains the coordinate height of the support surface, which corresponds to the height of the bottom surface of the circuit board placed on the support surface. Based on the coordinate height of the support surface and preset residual thickness target parameters, residual thickness monitoring data can be determined, thereby enabling the use of residual thickness monitoring data to control the residual thickness of the circuit board. By obtaining the coordinate height of the upper surface of the circuit board placed on the support surface, and based on the upper surface coordinate height of the circuit board and preset depth control target parameters, depth control monitoring data can be determined, thereby enabling the use of depth control monitoring data to control the depth of the circuit board. Processing the circuit board based on the residual thickness monitoring data and the depth control monitoring data can simultaneously meet the requirements for depth control and residual thickness control, ensuring processing accuracy. Using this processing method, the processing requirements for both depth control and residual thickness can be met with only one board loading, reducing repeated board loading and unloading operations, saving production time, and improving processing efficiency. Furthermore, the residual thickness monitoring data and depth control monitoring data are called synchronously, achieving both depth control and residual thickness control in a single production run, effectively avoiding the risk of omissions in either the depth control mode or the residual thickness mode.

[0032] The circuit board processing system of this application includes a circuit board processing device configured to perform the circuit board processing method described above. Therefore, this circuit board processing system can achieve all the technical features and beneficial effects of the circuit board processing method described above, which will not be repeated here. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A flowchart of a circuit board processing method provided in an embodiment of this application;

[0035] Figure 2 A schematic diagram showing the simultaneous fabrication of residual thickness and depth control;

[0036] Figure 3A flowchart illustrating the circuit board fabrication method described in some embodiments of this application;

[0037] Reference numerals: 10-wood pulp board; 100-support surface; 20-circuit board; 200-upper surface of circuit board; 210-target position for depth control and residual thickness; 30-bakelite board. Detailed Implementation

[0038] Before introducing the solutions of the embodiments of this application, the relevant technologies will first be described:

[0039] In related technologies, depth-controlled molding is divided into two modes: the first is the depth-controlled mode, which uses the top of the circuit board as a reference for depth control; the second is the residual thickness-controlled mode, which uses the wood pulp board on the bottom of the circuit board as a reference for residual thickness control. For circuit boards requiring simultaneous manufacturing in both modes, the current approach is to manufacture them separately. First, the residual thickness mode program is called up, the residual thickness manufacturing parameters are set, and the circuit board in residual thickness mode is manufactured. Then, the depth-controlled mode program is called up, the depth-controlled manufacturing parameters are set, and the same circuit board is manufactured using the depth-controlled mode. Using the current method requires creating two programs and switching parameters between them. During the manufacturing process, the circuit board needs to be repeatedly loaded and unloaded, increasing processing time. In batch manufacturing of circuit boards, there is a risk of missing residual thickness or depth-controlled molding steps.

[0040] In view of this, embodiments of this application provide a circuit board processing method, which aims to overcome the above-mentioned technical problems.

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0042] This application provides a circuit board processing method that can be applied to circuit board processing equipment. Specifically, circuit board processing equipment is mechanical equipment used to manufacture circuit boards. Depending on their function, circuit board processing equipment can be divided into several types, including: cutting equipment for cutting large-sized circuit board materials to the required size, such as cutting machines and CNC cutting machines; drilling equipment for drilling holes in circuit boards to install components or connect circuits, such as drilling machines and CNC drilling machines; color painting equipment for marking, numbering, or drawing device positions on circuit boards, such as screen printing machines and inkjet printers; pin header equipment for installing pin headers on circuit boards to connect other electronic devices or connect circuits, such as pin insertion machines and soldering machines; soldering equipment for soldering components on circuit boards to connect them to wires on the circuit board, such as manual soldering tools and soldering robots; and testing equipment for inspecting the quality and performance of circuit boards, including circuit continuity testing, electrical parameter measurement, etc., such as testing instruments and automatic testing equipment. Some of these devices perform circuit board processing by moving a spindle; for example, a drilling machine uses a spindle to drive a drill bit to drill holes in the circuit board.

[0043] As needed, the circuit board processing method of this application embodiment can be applied to at least one type of mechanical equipment described above for processing and manufacturing circuit boards.

[0044] Please see Figure 1 The flowchart illustrates a circuit board processing method according to an embodiment of this application. The circuit board processing method includes:

[0045] Step S101: Obtain the coordinate height of the support surface 100, which is the surface on the workbench used to support the circuit board; determine the residual thickness monitoring data based on the coordinate height of the support surface 100 and the preset residual thickness target parameters.

[0046] Step S102: Obtain the coordinate height of the upper surface 200 of the circuit board 20 placed on the support surface 100, and determine the depth control monitoring data based on the coordinate height of the upper surface 200 of the circuit board 20 and the preset depth control target parameters.

[0047] Step S103: Process the circuit board 20 according to the residual thickness monitoring data and depth control monitoring data.

[0048] This processing method can simultaneously meet the requirements for controlling both depth and residual thickness, ensuring processing accuracy. Furthermore, only one board loading is needed to achieve the processing requirements of both depth and residual thickness for the circuit board 20, reducing repeated board loading and unloading operations, saving production time, and improving processing efficiency. Moreover, the residual thickness monitoring data and depth monitoring data are accessed synchronously, achieving both control and residual thickness in a single process. This effectively avoids the risk of missing depth or residual thickness modes due to separate calls to two processing programs, facilitating smooth batch processing.

[0049] Optionally, the support surface 100 can be the upper surface of the workbench of the circuit board processing equipment, or the upper surface of the wood pulp board 10 set on the workbench, or the upper surface of the bakelite board 30 set on the workbench, or the upper surface of other pads.

[0050] The support surface 100 is used to directly support and carry the circuit board 20. When the circuit board 20 needs to be processed, the circuit board 20 is placed on the support surface 100, and the lower surface of the circuit board 20 is in contact with the support surface 100 so as to support it through the support surface 100.

[0051] Optionally, the coordinate height of the support surface 100 can be obtained through one or more methods. For example, the coordinate information data of the support surface 100 can be stored in memory in advance, and the coordinate height of the support surface 100 can be obtained by calling the coordinate information data in memory. For example, the coordinate height of the support surface 100 can be obtained by detection using a detection device on a circuit board processing device. Specifically, the coordinate information data of the support surface 100 can be obtained by controlling the detection device to touch the support surface 100, and then the coordinate height of the support surface 100 can be obtained from the coordinate information data. The detection device includes a probe, which can be a mechanically triggered probe. When the probe touches the support surface 100, a trigger signal is sent to the control system to record the corresponding coordinate information data. For example, the coordinate height of the support surface 100 can also be obtained by optical image recognition. With the help of image acquisition equipment and image processing algorithms, the coordinate height of the support surface 100 can be determined by recognizing known feature points, marks, or patterns on the support surface 100. Marking points can be pre-marked or arranged on the support surface 100 for recognition by an image recognition system. Alternatively, two or more of the above methods can be used simultaneously to obtain the coordinate height of the support surface 100 in order to improve accuracy.

[0052] It should be noted that in the description of this application, "coordinates" can be the coordinates corresponding to the coordinate system established based on the circuit board processing equipment, or the coordinates corresponding to the coordinate system established based on the geodetic coordinate system. The coordinate system used in the entire circuit board processing method should be unique, that is, the coordinates at different locations are different, and the coordinates are unique.

[0053] It should also be noted that in the description of this application, "coordinates" generally refers to three-dimensional coordinates, and "coordinate height" refers to the value corresponding to the Z-axis in three-dimensional coordinates.

[0054] In some embodiments, after obtaining the coordinate height of the support surface 100, the method further includes: saving the coordinate height of the support surface 100 into memory. The height of the support surface 100 is generally constant. By saving the coordinate height of the support surface 100 into memory, it can be retrieved at any time during manufacturing, reducing the time consumed in obtaining the coordinate height of the support surface 100 in subsequent processing and improving processing efficiency.

[0055] In some embodiments, the residual thickness monitoring data can be the target coordinate height calculated based on the coordinate height of the support surface 100 and the residual thickness target parameters. For example, please refer to [link to relevant documentation]. Figure 2 This diagram illustrates the target positions 210 for depth control and residual thickness when both are fabricated simultaneously. The coordinate height of the support surface 100 is Z0, and the target residual thickness parameter is Z1. Using the coordinate height of the support surface 100 as a reference, the target coordinate height Z' of the depth control and residual thickness target position 210 is calculated using Z0 and Z1. For example, the formula used could be: Z' = Z0 + Z1.

[0056] In some embodiments, after determining the residual thickness monitoring data, the method further includes: obtaining the lower surface coordinate height Z0' of the circuit board 20 placed on the support surface 100; if the deviation between the lower surface coordinate height Z0' and the coordinate height Z0 of the support surface 100 exceeds a preset deviation threshold E, i.e., |Z0'-Z0|>E, then the residual thickness monitoring data Z' is re-determined based on the lower surface coordinate height Z0' and the residual thickness target parameter Z1. For example, the formula used can be: Z'=Z0'+Z1. When processing the circuit board, the re-determined residual thickness monitoring data and depth monitoring data are used as processing parameters.

[0057] Optionally, the coordinate height of the upper surface 200 of the circuit board 20 can be obtained through one or more methods. For example, the coordinate height of the upper surface 200 of the circuit board 20 can be obtained by detection using a detection device on a circuit board processing equipment. Specifically, the detection device is controlled to touch the upper surface 200 of the circuit board 20 to obtain coordinate information data of the upper surface 200 of the circuit board 20, and then the coordinate height of the upper surface 200 of the circuit board 20 is obtained from the coordinate information data. The detection device includes a probe, which can be a mechanically triggered probe. When the probe touches the upper surface 200 of the circuit board 20, a trigger signal is sent to the control system to record the corresponding coordinate information data. For example, the coordinate height of the upper surface 200 of the circuit board 20 can also be obtained using optical image recognition. With the help of image acquisition equipment and image processing algorithms, the coordinate height of the upper surface 200 of the circuit board 20 can be determined by recognizing known feature points, marks, or patterns on the upper surface 200 of the circuit board 20. Marking points can be pre-marked or arranged on the upper surface 200 of the circuit board 20 for use by the image recognition system. Alternatively, both of the above methods can be used simultaneously to obtain the coordinate height of the upper surface 200 of the circuit board 20 in order to improve accuracy.

[0058] In some embodiments, the depth monitoring data can be a target coordinate height calculated based on the coordinate height of the upper surface 200 of the circuit board 20 and the depth control target parameters. For example, please refer to... Figure 2 The coordinate height of the upper surface 200 of the circuit board 20 is Z3, and the target thickness parameter is Z2. Based on the coordinate height of the upper surface 200 of the circuit board 20, the target coordinate height Z” of the depth control and residual thickness target position 210 is calculated using Z3 and Z2. For example, the formula used can be: Z” = Z3 - Z2.

[0059] In some embodiments, the target positions 210 for depth control and residual thickness control are at the same coordinate height, that is, the target positions for depth control and residual thickness control are at the same coordinate height, satisfying Z' = Z". This further improves the machining accuracy while taking into account both depth control and residual thickness control.

[0060] In some embodiments, before obtaining the coordinate height of the support surface 100, the method further includes:

[0061] Display the interface in response to user commands;

[0062] The system receives parameters input by the user in the interface, including residual thickness target parameters and depth control target parameters, and saves the parameters to memory.

[0063] Optionally, user commands can be triggered by the user touching the program icon on the screen, by the user clicking the program icon on the screen with the mouse, or by the user pressing the physical button corresponding to the program.

[0064] Please see Figure 3 When receiving user instructions, step S201 is executed, which calls the program that simultaneously produces residual thickness and depth control, and opens the program interface.

[0065] The user can input parameters for simultaneously setting the residual thickness and depth control in the program interface. These parameters include target parameters for residual thickness and depth control, thus completing step S202. After receiving the parameters input by the user in the interface, the circuit board processing equipment can save the input parameters to memory for later retrieval in subsequent steps.

[0066] In step S203, the height of the wood pulp board 10 (i.e., the coordinate height of the support surface 100) is detected by a probe. Using the detected data and the parameters input by the user, the residual thickness monitoring data is automatically calculated and generated.

[0067] Place the circuit board 20 on the workbench (i.e., on the support surface 100) to complete step S204.

[0068] In step S205, the coordinate height of the upper surface 200 of the circuit board 20 is detected by a probe, and depth monitoring data is automatically calculated and generated using the detected data and the parameters input by the user.

[0069] In step S206, the cutting tool is used to process the circuit board. Specifically, based on the residual thickness monitoring data, a residual thickness mode operation is performed to ensure that the circuit board 20 meets the residual thickness target. Based on the depth control monitoring data, a depth control mode operation is performed to ensure that the circuit board 20 meets the depth control target. This ensures that the circuit board 20 meets both the residual thickness requirement and the depth control requirement.

[0070] In some embodiments, the circuit board processing method of this application is used to process and manufacture a batch of circuit boards 20. After processing a circuit board 20, the method further includes:

[0071] Obtain the coordinate height of the upper surface 200 of another circuit board 20 placed on the support surface 100. Based on the depth control target parameters and the coordinate height of the upper surface 200 of the other circuit board 20, obtain the depth control monitoring data of the other circuit board 20.

[0072] Based on the residual thickness monitoring data and the depth control monitoring data of another circuit board 20, the other circuit board 20 is processed. This eliminates the difference in coordinate height of the upper surface 200 of different circuit boards 20, accurately detects the coordinate height of the upper surface 200 of each circuit board 20, and thus accurately determines the depth control monitoring data of each circuit board 20, improving the accuracy of batch processing.

[0073] Accordingly, embodiments of this application also provide a circuit board processing system, which includes circuit board processing equipment configured to perform the circuit board processing method described above.

[0074] The circuit board processing method of this application is applied to a circuit board processing equipment, which may include a base, a crossbeam, a spindle assembly, a worktable, etc. The worktable is disposed on the base, and the crossbeam is mounted above the worktable. At least one spindle assembly is slidably mounted on the crossbeam, and the at least one spindle assembly moves along a first direction on the crossbeam. Each spindle assembly includes a first spindle and a second spindle. The bottom end of the first spindle clamps a first tool, and the bottom end of the second spindle clamps a second tool. The worktable is on the base and moves along a second direction. At least one processing position is provided on the worktable, and a target circuit board is placed on each processing position. The target circuit boards are of different types, with differences in materials, dimensions, thickness, hardness, etc., and the physical properties of different types of circuit boards vary greatly. However, these target circuit boards are all fixed within the processing area of ​​the worktable. There are various ways to fix the circuit boards on the worktable, including but not limited to: pneumatic clamps, bakelite boards, adsorption devices, etc. These fixing methods can ensure that the target circuit boards are stably and reliably fixed within the processing area of ​​the worktable, so that the high-speed moving tool does not displace the target circuit board during processing. Each spindle assembly corresponds one-to-one with each target circuit board. The first spindle holds the first tool, and the second spindle holds the second tool, moving along a third direction to process the corresponding target circuit board. The first direction, the second direction, and the third direction are perpendicular to each other.

[0075] In the embodiments of this application, the circuit board processing equipment can be implemented as a drilling equipment, a forming equipment, a milling machine, a drilling and milling integrated machine, etc., and there is no limitation herein. In the embodiments of this application, the number of spindle assemblies of the circuit board processing equipment can be one, two, three, four, five, six, ten, twelve, etc., and each spindle assembly includes one, two, three, four, etc., and there is no limitation herein.

[0076] It is understandable that this circuit board processing system can achieve all the technical features and beneficial effects of the above-mentioned circuit board processing methods, which will not be elaborated here.

[0077] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0078] The circuit board processing method and system provided in the embodiments of this application have been described in detail above, and specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method of processing a circuit board, characterized by, The method comprises: obtaining a coordinate height of a support surface, the support surface being a surface on a worktable for supporting a circuit board; determining residual thickness monitoring data according to the coordinate height of the support surface and a preset residual thickness target parameter; obtaining a coordinate height of an upper surface of the circuit board placed on the support surface, and determining depth control monitoring data according to the coordinate height of the upper surface of the circuit board and a preset depth control target parameter; processing the circuit board according to the residual thickness monitoring data and the depth control monitoring data.

2. The method of claim 1, wherein The method comprises: controlling a detection device to touch the support surface to obtain coordinate information data of the support surface; and obtaining the coordinate height of the support surface from the coordinate information data; and / or controlling the detection device to touch the upper surface of the circuit board to obtain coordinate information data of the upper surface of the circuit board; and obtaining the coordinate height of the upper surface of the circuit board from the coordinate information data.

3. The method of processing a circuit board according to claim 2, wherein The detection device comprises a probe.

4. The method of claim 1, wherein After the residual thickness monitoring data is determined, the method further comprises: obtaining a coordinate height of a lower surface of the circuit board placed on the support surface; if a deviation between the coordinate height of the lower surface and the coordinate height of the support surface exceeds a preset deviation threshold, determining residual thickness monitoring data again according to the coordinate height of the lower surface and the residual thickness target parameter; and processing the circuit board according to the residual thickness monitoring data determined again and the depth control monitoring data. Before the coordinate height of the support surface is obtained, the method further comprises:

5. The method of claim 1, wherein displaying an interface in response to a user instruction; and receiving a parameter input by a user in the interface, the parameter comprising the residual thickness target parameter and the depth control target parameter, and saving the parameter to a memory. After the coordinate height of the support surface is obtained, the method further comprises: saving the coordinate height of the support surface to the memory.

6. The method of claim 1, wherein The residual thickness monitoring data is configured to calculate a target coordinate height according to the coordinate height of the support surface and the residual thickness target parameter; and / or The depth control monitoring data is configured to calculate a target coordinate height according to the coordinate height of the upper surface of the circuit board and the depth control target parameter.

7. The method of claim 1, wherein After the circuit board is processed, the method further comprises: obtaining a coordinate height of an upper surface of another circuit board placed on the support surface, and obtaining depth control monitoring data of the other circuit board according to the depth control target parameter and the coordinate height of the upper surface of the other circuit board; and processing the other circuit board according to the residual thickness monitoring data and the depth control monitoring data of the other circuit board. The processing of the circuit board comprises:

8. The method of claim 1, wherein performing residual thickness mode operation according to the residual thickness monitoring data to make the circuit board meet a residual thickness target; and performing depth control mode operation according to the depth control monitoring data to make the circuit board meet a depth control target. The support surface is an upper surface of a wood pulp board arranged on the worktable. The circuit board processing device is configured to perform the circuit board processing method according to any one of claims 1 to 10.

9. The method of claim 1, wherein ​ ​ ​ 10. The method of claim 1, wherein ​ 11. A circuit board processing system characterized by comprising: ​

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