Heat dissipation structure, electronic equipment and radiator

Abstract

The invention discloses a heat radiation structure, electronic equipment and a heat radiator, the heat radiation efficiency of the electronic equipment is improved, the occupied space of the heat radiation structure is small, and the structure of the electronic equipment is compact. The heat dissipation structure comprises a cage, the cage is provided with a first slot and a second slot, the first slot and the second slot are stacked, a heat dissipation cavity is formed between the first slot and the second slot, a top plate of the first slot is provided with a first hollow structure, and a top plate of the second slot is provided with a second hollow structure; the radiator is provided with a first heat conduction end and a second heat conduction end; the first heat conduction end is arranged in the first hollow structure in a penetrating mode and used for abutting against a first to-be-cooled device in the first inserting groove so that heat of the first to-be-cooled device can be guided out, and the second heat conduction end is located in the heat dissipation cavity, arranged in the second hollow structure in a penetrating mode and used for abutting against a second to-be-cooled device in the second inserting groove so that heat of the second to-be-cooled device can be guided out. And the heat of the second to-be-radiated device is led out.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, in particular to a heat dissipation structure, an electronic device and a heat sink. BACKGROUND

[0002] With the rapid development of the communication industry and the large-scale construction of data centers, the demand for optical communication equipment is expanding and upgrading. Moreover, optical communication equipment gradually develops in the direction of high speed, long distance and integration. With the increasing processing capacity of optical communication equipment, more optical modules and external devices need to be configured for communication. When high-density port layout is performed on the optical communication equipment, the optical cage with a laminated structure can accommodate more optical modules. Due to the high arrangement density of the optical modules and the large power consumption of the optical modules, heat accumulation is easily caused and difficult to dissipate, which affects the working performance of the optical modules. SUMMARY

[0003] The heat dissipation structure, the electronic device and the heat sink provided by the present application improve the heat dissipation efficiency of the electronic device, and the heat dissipation structure occupies less space, making the electronic device compact.

[0004] In a first aspect, the present application provides a heat dissipation structure, comprising:

[0005] a cage, the cage having a first slot and a second slot, the first slot and the second slot being arranged in layers, and a heat dissipation cavity being arranged between the first slot and the second slot, a top plate of the first slot having a first hollow structure, and a top plate of the second slot having a second hollow structure;

[0006] a heat sink, the heat sink having a first heat conduction end and a second heat conduction end;

[0007] the first heat conduction end is arranged in the first hollow structure and is used to abut against a first device to be cooled in the first slot to conduct heat of the first device to be cooled out, and the second heat conduction end is located in the heat dissipation cavity and is arranged in the second hollow structure and is used to abut against a second device to be cooled in the second slot to conduct heat of the second device to be cooled out.

[0008] In the above embodiment, the cage can be specifically an optical cage in an optical communication device, and the device to be cooled is an optical module. The cage includes two parallel housings and a partition plate, and the partition plate separates the housings into three spaces, from top to bottom, a first slot, a heat dissipation cavity, and a second slot. The first heat-conducting end of the heat sink extends into the first slot from the first hollow structure and is attached to the first device to be cooled, thereby conducting heat away. The second heat-conducting end extends into the second slot from the second hollow structure and is attached to the second device to be cooled, thereby reducing the accumulation of heat in the slot. In addition, the optical cage is provided with a heat dissipation cavity, and the heat sink makes full use of the internal space of the optical cage, so that the heat dissipation structure occupies a smaller space.

[0009] In an embodiment, the heat sink includes a heat-conducting member, which is U-shaped and includes a first end and a second end. The first end is located outside the cage and opposite the first hollow structure, and the second end is located in the heat dissipation cavity and opposite the second hollow structure.

[0010] In an embodiment, the first heat-conducting end includes a first heat sink and the first end. The first heat sink is connected to one side of the first end facing the first hollow structure, and the first heat sink is arranged in the first hollow structure and abuts against the first device to be cooled.

[0011] In an embodiment, the first heat-conducting end further includes a first elastic heat-conducting body connected between the first end and the first heat sink.

[0012] In an embodiment, the heat dissipation structure further includes a first elastic member connected between the first heat sink and the cage. The first elastic member is used to drive the first heat sink to approach the device to be cooled.

[0013] In an embodiment, the heat sink further includes a cold plate connected to one side of the first end away from the first elastic heat-conducting body.

[0014] In an embodiment, the first elastic heat-conducting body is a heat-conducting pad or a metal spring.

[0015] In an embodiment, the heat sink further includes a cold plate, and the first heat-conducting end further includes a second elastic heat-conducting body located between the first end and the cold plate.

[0016] In an embodiment, the second elastic heat-conducting body is a heat-conducting pad.

[0017] In an embodiment, the second heat-conducting end comprises a second heat sink and the second end, the second heat sink is connected to one side of the second end facing the second hollow structure, and the second heat sink is arranged in the second hollow structure and abuts against the second device to be cooled.

[0018] In an embodiment, the heat dissipation structure further comprises a second elastic member, the second elastic member is arranged on the bottom plate of the first slot, the bottom plate of the first slot is arranged opposite to the top plate of the second slot, the second end is located between the elastic member and the second heat sink, and the second elastic member is used to drive the second heat-conducting end to be close to the second device to be cooled.

[0019] In an embodiment, the cage comprises a side wall, the side wall is provided with a avoiding slot at a corresponding position of the heat dissipation cavity, and the avoiding slot is used to avoid the heat-conducting member.

[0020] In an embodiment, the cage comprises an upper shell and a lower shell, the first slot is located in the upper shell, the second slot is located in the lower shell, and the upper shell and the lower shell are detachably connected.

[0021] In an embodiment, the cage comprises an upper shell and a lower shell, the first slot and the heat dissipation cavity are located in the upper shell, and the second slot is located in the lower shell.

[0022] The upper shell comprises a first shell and a second shell, the first shell and the lower shell are fixedly connected, the second shell is detachably connected between the first shell and the lower shell, and the second shell is located at one end of the upper shell away from the insertion port of the first slot.

[0023] In an embodiment, the cage comprises a plurality of first slots arranged in a first direction and a plurality of second slots arranged in the first direction, the first slots and the second slots correspond to each other in a second direction, and the first direction, the second direction and the insertion direction of the first device to be cooled are perpendicular to each other.

[0024] The heat dissipation structure comprises a plurality of heat sinks, and each corresponding first slot and second slot is provided with a heat sink.

[0025] The heat sink comprises a heat-conducting member, the heat-conducting member is connected to the first heat-conducting end and the second heat-conducting end, and the projection of each heat-conducting member along the first direction does not overlap.

[0026] Secondly, embodiments of this application also provide an electronic device, which includes at least one of the above-described heat dissipation structures, wherein the at least one heat dissipation structure is arranged sequentially along a first direction.

[0027] Thirdly, embodiments of this application also provide a heat sink, comprising:

[0028] A heat-conducting component, which is U-shaped, includes a first end and a second end. The first end has a first planar portion and a second planar portion that are opposite to each other. The first planar portion faces the second end. The second end has a third planar portion that is opposite to the first end.

[0029] A first heat spreader block is connected to the first planar portion;

[0030] The second heat exchanger is connected to the third planar portion;

[0031] A cold plate, the cold plate being connected to the second planar portion;

[0032] Along the arrangement direction of the first end and the second end, the first heat exchange block and the second heat exchange block are spaced apart by a preset distance.

[0033] In one embodiment, the heat sink further includes a first elastic heat conductor disposed between the first heat spreader and the first planar portion.

[0034] In one embodiment, the heat sink further includes a second elastic heat conductor disposed between the second planar portion and the cold plate. Attached Figure Description

[0035] Figure 1 A schematic diagram of a heat dissipation structure provided for an embodiment of this application;

[0036] Figure 2 A schematic diagram of a heat dissipation structure provided for another embodiment of this application;

[0037] Figure 3 A schematic diagram of a heat dissipation structure provided for another embodiment of this application;

[0038] Figure 4 A schematic diagram of the structure of a first elastic element provided for an embodiment of this application;

[0039] Figure 5 An assembly diagram of a first elastic element, a first heat-spreading block, and a cage provided for an embodiment of this application;

[0040] Figure 6A schematic diagram of a heat dissipation structure provided for another embodiment of this application;

[0041] Figure 7 A schematic diagram of a heat dissipation structure provided for another embodiment of this application;

[0042] Figure 8 A side view of a heat dissipation structure provided for an embodiment of this application;

[0043] Figure 9 A side view of a heat dissipation structure provided for another embodiment of this application;

[0044] Figure 10 An exploded view of a cage provided for an embodiment of this application;

[0045] Figure 11 A schematic diagram of the open state of a cage is provided for another embodiment of this application;

[0046] Figure 12 A front view of a heat dissipation structure provided for an embodiment of this application;

[0047] Figure 13 A diagram showing the installation positions of multiple heat sinks provided in one embodiment of this application;

[0048] Figure 14 A diagram showing the installation positions of multiple heat sinks according to another embodiment of this application;

[0049] Figure 15 A schematic diagram of a heat sink provided for an embodiment of this application;

[0050] Figure 16 A schematic diagram of another heat sink provided for an embodiment of this application;

[0051] Figure 17 This is a schematic diagram of another heat sink provided for an embodiment of this application.

[0052] Figure label:

[0053] 100-Cage; 200-Radiator; 101-First slot; 102-Second slot; 103-Heat dissipation cavity; 1011-First hollow structure; 1021-Second hollow structure; 201-First heat-conducting end; 202-Second heat-conducting end; 001-First device to be cooled; 002-Second device to be cooled; 203-Heat-conducting component; 2031-First end; 2032-Second end; 2011-First heat spreader; 2021-Second heat spreader; 2033-First planar portion; 204-Cold plate; 2034-Second planar portion; 2012-First elastic heat conductor; 1-First elastic component; 11-Feet; 12-Connecting part; 121-Bending section; 2041-Interface material layer; 2013-Second... Elastic heat conductor; 2035 - Third plane portion; 2036 - Connecting section; 104 - Side wall; 1041 - Avoidance slot; 2 - Second elastic element; 1001 - Upper shell; 1002 - Lower shell; 10110 - Top plate of the first slot; 1012 - Bottom plate of the first slot; 1013 - First side plate; 1014 - Second side plate; 10210 - Top plate of the second slot; 1022 - Bottom plate of the second slot; 1023 - Third side plate; 1024 - Fourth side plate; 10011 - First shell; 10012 - Second shell; X - First direction; Y - Second direction; 20301 - First heat conductor; 20302 - Second heat conductor; 20303 - Third heat conductor; 20304 - Fourth heat conductor Detailed Implementation

[0054] To address the problem of heat accumulation and poor performance in electronic devices with high-density port arrays, embodiments of this application provide a heat dissipation structure, a heat sink, and an electronic device. To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description, in conjunction with the accompanying drawings, illustrates the embodiments of this application.

[0055] First, let's introduce the application scenario: In optical communication equipment, the optical module is one of the main heat sources. The heat dissipation of the optical module mainly relies on the heat sink located above it. The fins of this heat sink exchange heat with the air via convection, thus removing heat from inside the optical module. However, this air convection requires a considerable amount of space. With the iterative design of optical modules, their power consumption has increased rapidly, significantly increasing the requirements for the fin area and airflow of the heat sink. This, in turn, brings a series of problems such as increased fan power consumption and noise. Due to the high port density of the equipment, the internal heat dissipation space is limited, especially in double-layer optical cage applications, where the heat dissipation space for the lower layer of the optical cage is even more restricted, and the heat dissipation conditions are even more stringent.

[0056] To address the aforementioned issues, this application provides a heat dissipation structure, an electronic device, and a heat sink, which improves the heat dissipation efficiency of the electronic device. Furthermore, the heat dissipation structure occupies less space, making the electronic device structure more compact.

[0057] Figure 1 A schematic diagram of a heat dissipation structure provided for an embodiment of this application, as shown below. Figure 1 As shown, an embodiment of this application provides a heat dissipation structure, which includes a cage 100 and a radiator 200. The cage 100 has slots into which a device to be cooled is plugged and unplugged. Specifically, the cage 100 has a first slot 101 and a second slot 102 stacked together, with a heat dissipation cavity 103 between the first slot 101 and the second slot 102. The top plate of the first slot 101 has a first hollow structure 1011, and the top plate of the second slot 102 has a second hollow structure 1021. The radiator 200 has a first heat-conducting end 201 and a second heat-conducting end 202. The first heat-conducting end 201 passes through the first hollow structure 1011 and is used to abut against the first device to be cooled 001 in the first slot 101 to conduct heat away from the first device to be cooled 001. The second heat-conducting end 202 is located in the heat dissipation cavity 103 and passes through the second hollow structure 1021 to abut against the second heat-dissipating device 002 in the second slot 102 so as to conduct heat out of the second heat-dissipating device 002.

[0058] In the above embodiment, the cage 100 can specifically be an optical cage in an optical communication device, and the device to be cooled is an optical module. The cage 100 includes a shell and two parallel partitions, which divide the shell into three spaces, from top to bottom: a first slot 101, a heat dissipation cavity 103, and a second slot 102. The first heat-conducting end 201 of the heat sink 200 extends from the first hollow structure 1011 into the first slot 101 and is in contact with the first device to be cooled 001, dissipating its heat. The second heat-conducting end 202 extends from the second hollow structure 1021 into the second slot 102 and is in contact with the second device to be cooled 002, dissipating its heat, thus reducing the accumulation of heat in the slot of the device to be cooled. Furthermore, the cage 100 is provided with a heat dissipation cavity 103, and the heat sink 200 makes full use of the internal space of the cage 100, making the heat dissipation structure occupy less space.

[0059] In one embodiment, the heat sink 200 includes a heat-conducting element 203, which is U-shaped and includes a first end 2031 and a second end 2032. The first end 2031 is located outside the cage 100 and opposite to the first perforated structure 1011, while the second end 2032 is located in the heat dissipation cavity 103 and opposite to the second perforated structure 1021. The heat-conducting element 203 is used to connect the first heat-conducting end 201 and the second heat-conducting end 202, dissipating heat from the two devices to be cooled. The U-shaped heat-conducting element 203 allows the heat sink 200 to fully utilize the upper and lower spaces of the cage 100, making the heat sink 200 structure compact.

[0060] In one embodiment, the first heat-conducting end 201 includes a first heat-spreading block 2011 and a first end 2031 of a heat-conducting element 203. The first heat-spreading block 2011 is connected to the side of the first end facing the first hollow structure 1011, and the first heat-spreading block 2011 passes through the first hollow structure 1011 and abuts against the first heat-dissipating device 001.

[0061] In one embodiment, the heat-conducting element 203 is a flat tube, and its outer surface includes a first planar portion 2033. The first heat-spreading block 2011 is connected to the first planar portion 2033, making the first heat-spreading block 2011 and the heat-conducting element 203 fit more tightly, thereby improving heat transfer efficiency.

[0062] In one embodiment, the heat sink 200 further includes a cold plate 204, which is connected to the side of the first end 2031 opposite to the first heat spreader 2011. The outer surface of the heat-conducting element 203 also includes a second planar portion 2034. This second planar portion 2034 and the first planar portion 2033 are located on opposite sides of the first end 2031. The cold plate 204 is connected to the second planar portion 2034, resulting in a tighter fit between the cold plate 204 and the heat-conducting element 203, thus improving heat transfer efficiency. Compared to air cooling, liquid cooling has higher heat dissipation efficiency.

[0063] Figure 2 A schematic diagram of a heat dissipation structure provided for another embodiment of this application, as shown below. Figure 2 As shown, in one embodiment, the first heat-conducting end 201 further includes a first elastic heat conductor 2012, which is connected between the first end 2031 and the first heat-spreading block 2011.

[0064] The aforementioned first elastic heat conductor 2012 is elastic, specifically it can be a thermal pad or a metal spring. When the first heat-dissipating device 001 is inserted into the first slot 101, the first elastic heat conductor 2012 can maintain the contact pressure between the first heat-spreading block 2011 and the first heat-dissipating device 001, so that the first heat-spreading block 2011 and the first heat-dissipating device 001 are in close contact, thereby improving the heat transfer efficiency, and can also ensure the heat conduction capacity between the first heat-spreading block 2011 and the heat-conducting component 203.

[0065] Figure 3 A schematic diagram of a heat dissipation structure provided for another embodiment of this application. Figure 4 A schematic diagram of the structure of a first elastic member provided for an embodiment of this application. Figure 5 This is an assembly diagram of a first elastic element, a first heat-spreading block, and a cage provided for embodiments of this application. (In conjunction with...) Figures 3-5 As shown, in one embodiment, the heat dissipation structure further includes a first elastic member 1. The first elastic member 1 is connected to the first heat spreader 2011 and the cage 100. The first elastic member 1 is used to bring the first heat spreader 2011 closer to the first heat dissipation device 001, thereby ensuring a tight fit between the first heat spreader 2011 and the first heat dissipation device 001. Specifically, the first elastic member 1 is a frame structure with two opposing legs 11 and a connecting portion 12. The legs 11 are connected to both sides of the cage 100, and the two ends of the connecting portion 12 are respectively connected to the two legs 11. The connecting portion 12 of the first elastic member 1 has a bent section 121 that protrudes towards the first heat spreader 2011. The top of the first heat spreader 2011 contacts the bent section 121. When the first heat dissipation device 001 is not inserted into the first slot 101, the first elastic member 1 is in a potential energy state. When the first heat-dissipating device 001 is inserted into the first slot 101, the first heat-dissipating device 001 pushes the first heat-spreading block 2011 upward, and the bent section 121 is pressed upward by the first heat-spreading block 2011, thereby causing the first elastic member 1 to undergo slight deformation and enter an energy storage state. The restoring force of the bent section 121 tending to return to its natural state presses the first heat-spreading block 2011 downward, so that the first heat-spreading block 2011 can always be in contact with the first heat-dissipating device 001, ensuring a tight connection between the first heat-spreading block 2011 and the first heat-dissipating device 001, and further improving the heat transfer efficiency.

[0066] Continue to refer to Figure 3 To further improve the heat transfer efficiency between the cold plate 204 and the heat-conducting component 203, in one embodiment, an interface material layer 2041 may be provided between the cold plate 204 and the first end 2031. Specifically, the interface material layer 2041 may be a silicone grease layer.

[0067] Figure 7 A schematic diagram of a heat dissipation structure provided for another embodiment of this application, as shown below. Figure 7As shown, in one embodiment, the first heat-conducting end 201 further includes a second elastic heat-conducting body 2013, which is located between the first end 2031 and the cold plate 204. The second elastic heat-conducting body 2013 can be a heat-conducting pad, used to reduce the thermal resistance between the heat-conducting component 203 and the cold plate 204, and improve the heat transfer efficiency.

[0068] Figure 6 This is a schematic diagram of a heat dissipation structure provided for another embodiment of this application. Please refer to... Figures 1-3 and Figure 6 In one embodiment, the second heat-conducting end 202 includes a second heat-spreading block 2021 and a second end 2032 of a heat-conducting element 203. The second heat-spreading block 2021 is connected to the side of the second end 2032 of the heat-conducting element 203 facing the second hollow structure 1021. The second heat-spreading block 2021 passes through the second hollow structure 1021 and abuts against the second heat-dissipating device 002 so that the heat of the second heat-dissipating device 002 can be discharged.

[0069] like Figure 7 As shown, in one embodiment, the heat dissipation structure further includes a second elastic member 2. The second elastic member 2 is installed on the side of the bottom plate of the first slot 101 facing the second hollow structure. The bottom plate of the first slot 101 and the top plate of the second slot 102 are arranged opposite to each other. The second end 2032 of the heat-conducting member 203 is located between the second elastic member 2 and the second heat-spreading block 2021. The second elastic member 2 is used to drive the second heat-conducting end 202 closer to the second heat-dissipating device 002.

[0070] In one specific embodiment, the second elastic element 2 can be a sheet, a spring, or an elastic thermal pad.

[0071] The second end 2032 of the heat-conducting element 203 has the same structure as the first end 2031 of the heat-conducting element 203, and may also have two planar portions that are opposite to each other. Specifically, the heat-conducting element 203 includes a third planar portion 2035, which is located on the side of the second end 2032 facing the second hollow structure 1021. The second heat-spreading block 2021 is mounted on the third planar portion 2035 to increase the contact area and thus improve the heat transfer efficiency.

[0072] In one embodiment, the heat-conducting element 203 may specifically be a heat-conducting pipe. The heat-conducting pipe has an inner cavity, in which a capillary structure is provided, and the inner cavity is filled with a heat-conducting medium.

[0073] In some of the above embodiments, the first heat-conducting end 201 and the second heat-conducting end 202 of the heat sink 200 are connected by a heat-conducting component 203, and the two heat-conducting ends share a single cold plate 204, thus reducing the volume of the heat sink 200. The first heat-spreading block 2011 and the second heat-spreading block 2021 are both made of metal and can have the same size. The first heat-spreading block 2011 and the second heat-spreading block 2021 are elongated strips, with their length extending along the insertion direction of the device to be cooled, thereby increasing the contact area between the first heat-spreading block 2011 and the second heat-spreading block 2021 and the device to be cooled.

[0074] Figure 8 A side view of a heat dissipation structure provided for an embodiment of this application, such as... Figure 8 As shown, the heat-conducting component 203 further includes a connecting section 2036, the two ends of which are respectively connected to a first end 2031 and a second end 2032. In one embodiment, the connecting section 2036 is located on the outer side of the cage 100. The cage 100 includes a side wall 104, which is parallel to the insertion direction of the device to be cooled. A clearance slot 1041 is provided at the corresponding position of the side wall 104 and the heat dissipation cavity 103. The opening of the clearance slot 1041 extends toward the rear end of the cage 100. The clearance slot 1041 is used to avoid the heat-conducting component 203, so that the heat-conducting component 203 can pass through the side wall 104 of the cage 100 and extend to the outside of the cage 100. And when the radiator 200 is installed, the second heat-spreading block 2021 of the second heat-conducting end 202 can pass through the clearance slot 1041 and be installed inside the cage.

[0075] Figure 9 A side view of a heat dissipation structure provided for another embodiment of this application, such as... Figure 9 As shown, in one embodiment, the aforementioned clearance slot 1041 can also be an oblong hole, the length of which extends along the insertion direction of the first heat-dissipating device 001. This is to prevent the heat sink 200 from being misaligned due to assembly tolerances and thus unable to be properly assembled when it is assembled with the cage 100.

[0076] Figure 10 An exploded view of a cage provided for an embodiment of this application, such as... Figure 10As shown, to facilitate the assembly of the radiator 200 and the cage 100, the cage 100 can be designed as a splicing structure. In one embodiment, the cage 100 includes an upper shell 1001 and a lower shell 1002. A first slot 101 is located in the upper shell 1001, and a second slot 102 is located in the lower shell 1002. The upper shell 1001 and the lower shell 1002 are detachably connected. The cage 100 adopts a split structure. During assembly, the upper shell 1001 and the lower shell 1002 are separated. After the first heat-conducting end 201 of the radiator 200 is connected to the first hollow structure 1011, the assembled upper shell 1001 and the radiator 200 are joined together as a whole to the lower shell 1002, so that the second heat-conducting end 202 is inserted into the second hollow structure 1021 and contacts the second heat-dissipating device 002.

[0077] In one specific embodiment, the upper housing 1001 includes a top plate 10110 of the first slot, a bottom plate 1012 of the first slot, and a first side plate 1013 and a second side plate 1014 disposed opposite to each other. The top plate 10110 and the bottom plate 1012 of the first slot are connected between the first side plate 1013 and the second side plate 1014. The bottom plate 1012 of the first slot also serves as the top plate of the heat dissipation cavity 103. The lower housing 1002 includes a top plate 10210 of the second slot, a bottom plate 1022 of the second slot, and a third side plate 1023 and a fourth side plate 1024 disposed opposite to each other. The top plate 10210 of the second slot also serves as the bottom plate of the heat dissipation cavity 103. The first side plate 1013 and the second side plate 1014 extend into the lower housing 1002. The first side plate 1013 can be connected to the third side plate 1023 by a snap-fit ​​connection, and the second side plate 1014 can be connected to the fourth side plate 1024 by a snap-fit ​​connection. After the upper shell 1001 and the lower shell 1002 are assembled, the bottom plate of the first slot, the top plate of the second slot, the first side plate 1013, and the second side plate 1014 form a heat dissipation cavity 103. The aforementioned clearance slot 1041 can be located on the first side plate 1013 or the second side plate 1014, or both the first side plate 1013 and the second side plate 1014 can be provided with clearance slots 1041. The protrusion direction of the heat-conducting component 203 can be selected according to actual assembly needs.

[0078] Figure 11 A schematic diagram of the open state of a cage is provided for another embodiment of this application, as shown below. Figure 11As shown, in another embodiment, the rear of the cage 100 is provided with a detachable structure to facilitate assembly of the radiator 200 with the cage 100. Specifically, one end of the cage 100 is open and the other end is closed. The opening refers to the insertion port of the first slot 101 and the second slot 102, and the end away from the insertion port is the closed tail end. The cage 100 includes an upper shell 1001 and a lower shell 1002. The first slot 101 and the heat dissipation cavity 103 are located in the upper shell 1001, and the second slot 102 is located in the lower shell 1002. The upper shell 1001 includes a first shell 10011 near the insertion port and a second shell 10012 near the tail end. When the second housing 10012 is opened, the cage 100 is L-shaped and the tail end of the cage 100 is open. The second heat-conducting end 202 of the radiator 200 can be inserted into the heat dissipation cavity 103 from the open tail end. After the radiator 200 is installed, the second housing 10012 is installed to the tail end of the cage 100 so that it is connected to the first housing 10011 and the lower housing 1002.

[0079] The connection between the second housing 10012 and the first housing 10011 can be a snap-fit ​​connection or a pivot connection; this application does not impose any specific restrictions.

[0080] Figure 12 A front view of a heat dissipation structure provided for an embodiment of this application. Figure 13 A diagram showing the installation positions of multiple heat sinks provided in one embodiment of this application, combined with... Figure 12 and Figure 13 In one embodiment, the cage 100 includes a plurality of first slots 101 arranged along a first direction X and a plurality of second slots 102 arranged along the first direction X. The first slots 101 and second slots 102 correspond one-to-one along a second direction Y. The first direction X, the second direction Y, and the insertion direction Z of the first heat-dissipating device 001 are perpendicular to each other. The heat dissipation structure includes a plurality of heat sinks 200, and one heat sink 200 is installed in each corresponding first slot 101 and second slot 102. The heat-conducting elements 203 of each heat sink 200 do not overlap in their orthographic projection along the first direction X.

[0081] In one specific embodiment, the cage 100 has a 2x4 port configuration, meaning it has eight slots: four first slots 101 on the upper layer and four second slots 102 on the lower layer. The heat dissipation structure includes four heat sinks 200, i.e., four heat-conducting elements 203. These four heat-conducting elements 203 are designated as a first heat-conducting element 20301, a second heat-conducting element 20302, a third heat-conducting element 20303, and a fourth heat-conducting element 20304. Each pair of first slots 101 and second slots 102 constitutes a mounting position. Along the first direction X, the cage 100 includes four sequentially arranged mounting positions. The first heat-conducting element 20301 is mounted in the first mounting position, the second heat-conducting element 20302 is mounted in the second mounting position, the third heat-conducting element 20303 is mounted in the third mounting position, and the fourth heat-conducting element 20304 is mounted in the fourth mounting position. The first heat-conducting element 20301 and the second heat-conducting element 20302 are located on the left side of the cage 100, while the third heat-conducting element 20303 and the fourth heat-conducting element 20304 are located on the right side of the cage 100. The first heat-conducting element 20301 and the fourth heat-conducting element 20304 have the same dimensions, and the second heat-conducting element 20302 and the third heat-conducting element 20303 have the same dimensions. The heat-conducting elements 203 on the left and right sides of the cage 100 are staggered. This arrangement ensures that adjacent heat-dissipating structures do not interfere with each other when multiple heat-dissipating structures are installed in the equipment, reduces space occupation, and makes the overall structure of the equipment compact.

[0082] Figure 14 A diagram showing the installation positions of multiple heat sinks provided for another embodiment of this application, as shown below. Figure 14 As shown, in another specific embodiment, the first heat-conducting element 20301, the second heat-conducting element 20302, the third heat-conducting element 20303, and the fourth heat-conducting element 20304 can all be located on the same side of the cage 100, with the dimensions of the first heat-conducting element 20301, the second heat-conducting element 20302, the third heat-conducting element 20303, and the fourth heat-conducting element 20304 increasing sequentially. For example, the heat-conducting elements can all be wound around the left side of the cage 100, or the heat-conducting elements 203 can all be wound around the right side of the cage 100. The configuration can be tailored to specific requirements, and this application does not impose any specific limitations.

[0083] It is worth noting that the cage 100 described above can also be a 2x2 port or a 2x6 port. The arrangement of the heat-conducting components 203 is not limited to the arrangement shown in the above embodiments.

[0084] Embodiments of this application also provide an electronic device including at least one of the above-described heat dissipation structures, wherein the at least one heat dissipation structure is arranged sequentially along a first direction. The heat-conducting elements 203 of the heat sinks 200 in each heat dissipation structure are staggered, and the heat-conducting elements 203 of adjacent heat dissipation structures do not interfere with each other, making full use of the internal space of the device and resulting in a compact device structure. Simultaneously, the heat dissipation structure can conduct heat away from the 200 heat sinks located in the lower cage 100, reducing heat accumulation and achieving good heat conduction.

[0085] Figure 15 A schematic diagram of a heat sink is provided for an embodiment of this application, as shown below. Figure 15 As shown, an embodiment of this application also provides a heat sink 200, which includes: a heat-conducting component 203, a first heat-spreading block 2011, a second heat-spreading block 2021, and a cold plate 204. The heat-conducting component 203 is U-shaped, including a first end 2031 and a second end 2032. The first end 2031 has a first planar portion 2033 and a second planar portion 2034 that are opposite to each other. The first planar portion 2033 faces the second end 2032, and the second end 2032 has a third planar portion 2035 that is opposite to the first end 2031. The first heat-spreading block 2011 is connected to the first planar portion 2033, the second heat-spreading block 2021 is connected to the third planar portion 2035, and the cold plate 204 is connected to the second planar portion 2034. Along the arrangement direction of the first end 2031 and the second end 2032, the first heat-spreading block 2011 and the second heat-spreading block 2021 are spaced apart by a predetermined distance. The heat sink 200 of this application has two heat-conducting ends, which can dissipate heat for two devices to be cooled at the same time. The two heat-conducting ends share one heat dissipation end (cold plate 204). It has a compact structure, occupies less space, and is suitable for heat dissipation of devices arranged in high density.

[0086] Figure 16 A schematic diagram of another heat sink structure provided for an embodiment of this application is shown below. Figure 16 As shown, in one embodiment, the heat sink further includes a first elastic heat conductor 2012, which is disposed between the first heat spreader 2011 and the first planar portion 2033. When the first heat spreader 2011 contacts the device to be cooled, the first elastic heat conductor 2012 enables the first heat spreader 2011 to maintain contact pressure with the device to be cooled, thereby improving heat transfer efficiency.

[0087] Figure 17 A schematic diagram of another heat sink structure provided for an embodiment of this application is shown below. Figure 17As shown, in one embodiment, the heat sink 200 further includes a second elastic heat conductor 2013, which is disposed between the second planar portion 2034 and the cold plate 204. The second elastic heat conductor 2013 can reduce the thermal resistance between the cold plate 204 and the heat conductor 203, thereby improving the heat transfer efficiency.

[0088] The first elastic heat conductor 2012 is a heat-conducting pad or a metal sheet, and the second elastic heat conductor 2013 can be a heat-conducting pad.

[0089] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A heat dissipating structure, characterized by comprising: The application relates to a heat dissipation structure. The heat dissipation structure comprises a cage, a heat dissipation device and a heat dissipation structure. The cage comprises a first slot and a second slot, and the first slot and the second slot are arranged in a stacked mode and are provided with a heat dissipation cavity. The top plate of the first slot is provided with a first hollow structure, and the top plate of the second slot is provided with a second hollow structure.

2. The heat dissipating structure according to claim 1, wherein The heat dissipation device comprises a first heat conduction end and a second heat conduction end.

3. The heat dissipating structure according to claim 2, wherein The first heat conduction end is arranged in the first hollow structure and is used for abutting against a first device to be cooled in the first slot so as to conduct heat of the first device to be cooled out.

4. The heat dissipating structure according to claim 3, wherein The second heat conduction end is arranged in the heat dissipation cavity and is arranged in the second hollow structure and is used for abutting against a second device to be cooled in the second slot so as to conduct heat of the second device to be cooled out.

5. The heat dissipating structure according to claim 4, wherein The heat dissipation device comprises a heat conduction member.

6. The heat dissipating structure according to claim 5, wherein The heat conduction member is in a U shape and comprises a first end and a second end.

7. The heat dissipating structure according to claim 4, wherein The first end is arranged outside the cage and is opposite to the first hollow structure.

8. The heat dissipating structure according to claim 3, wherein The second end is arranged in the heat dissipation cavity and is opposite to the second hollow structure.

9. The heat dissipating structure according to claim 8, wherein The first heat conduction end comprises a first heat equalizing block and the first end.

10. The heat dissipating structure according to claim 2, wherein The first heat equalizing block is connected to one side of the first end which is towards the first hollow structure.

11. The heat dissipating structure according to claim 10, wherein The first heat equalizing block is arranged in the first hollow structure and abuts against the first device to be cooled.

12. The heat dissipating structure according to claim 2, wherein The first heat conduction end further comprises a first elastic heat conduction body.

13. The heat dissipating structure according to claim 1, wherein The first elastic heat conduction body is connected between the first end and the first heat equalizing block. The heat dissipation structure further comprises a first elastic member. The first elastic member is connected to the first heat equalizing block and the cage. The first elastic member is used for driving the first heat equalizing block to be close to the first device to be cooled. The heat dissipation device further comprises a cold plate. The cold plate is connected to one side of the first end which is away from the first elastic heat conduction body. The first elastic heat conduction body is a heat conduction pad or a metal elastic sheet. The heat dissipation device further comprises a cold plate. The first heat conduction end further comprises a second elastic heat conduction body. The second elastic heat conduction body is arranged between the first end and the cold plate. The second elastic heat conduction body is a heat conduction pad. The second heat conduction end comprises a second heat equalizing block and the second end. The second heat equalizing block is connected to one side of the second end which is towards the second hollow structure. The second heat equalizing block is arranged in the second hollow structure and abuts against the second device to be cooled. The heat dissipation structure further comprises a second elastic member. The second elastic member is arranged on one side of a bottom plate of the first slot which is towards the heat dissipation cavity. The bottom plate of the first slot is arranged opposite to the top plate of the second slot. The second end is arranged between the second elastic member and the second heat equalizing block. The second elastic member is used for driving the second heat conduction end to be close to the second device to be cooled. The cage comprises a side wall. The side wall is provided with a avoiding slot which is arranged in a corresponding position of the heat dissipation cavity. The avoiding slot is used for avoiding the heat conduction member. The cage comprises an upper shell and a lower shell. The first slot is arranged in the upper shell, and the second slot is arranged in the lower shell. The upper shell and the lower shell are detachably connected.

14. The heat dissipating structure according to claim 1, wherein The cage comprises an upper shell and a lower shell, the first slot and the heat dissipation cavity are located in the upper shell, and the second slot is located in the lower shell; The upper shell comprises a first shell and a second shell, the first shell and the lower shell are fixedly connected, and the second shell is detachably connected between the first shell and the lower shell, and the second shell is located at one end of the upper shell away from the socket of the first slot.

15. The heat dissipating structure according to any one of claims 1 to 14, wherein The cage comprises a plurality of first slots arranged in a first direction and a plurality of second slots arranged in the first direction, the first slots correspond to the second slots one by one in a second direction, and the first direction, the second direction and the insertion direction of the first device to be cooled are perpendicular to each other; The heat dissipation structure comprises a plurality of heat sinks, and each corresponding first slot and second slot is provided with a heat sink; The heat sink comprises a heat conducting member connected to the first heat conducting end and the second heat conducting end, and the projection of each heat conducting member along the first direction does not overlap.

16. An electronic device, comprising: The heat dissipation structure comprises at least one heat dissipation structure according to any one of claims 1-15, and the at least one heat dissipation structure is arranged in sequence along a first direction.

17. A heat spreader, comprising: The heat dissipation structure comprises: A heat conducting member, the heat conducting member is U-shaped, comprising a first end and a second end, the first end has a first planar portion and a second planar portion facing away from each other, the first planar portion faces the second end, the second end has a third planar portion, and the third planar portion faces away from the first end; A first heat spreading block connected to the first planar portion; A second heat spreading block connected to the third planar portion; A cold plate connected to the second planar portion; Along the arrangement direction of the first end and the second end, the first heat spreading block is spaced apart from the second end by a predetermined distance.

18. The heat spreader of claim 17, wherein, The heat sink further comprises a first elastic heat conducting body, and the first elastic heat conducting body is arranged between the first heat spreading block and the first planar portion.

19. The heat spreader of claim 17, wherein, The heat sink further comprises a second elastic heat conducting body, and the second elastic heat conducting body is arranged between the second planar portion and the cold plate.

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