Heat pipe component, three-dimensional vapor chamber module, heat dissipation device and electronic equipment

Abstract

The embodiment of the invention provides a heat pipe component, a three-dimensional vapor chamber module, a heat dissipation device, electronic equipment and a manufacturing method of the heat pipe component. The heat pipe component is applied to the three-dimensional uniform-temperature plate module and comprises a pipe part and an end part, one end of the pipe part is an open end, the inner wall of the pipe part is provided with a first capillary structure, the end part is connected with the other end of the pipe part in a sealed mode, the end part and the pipe part form a first inner cavity, the inner wall and the outer wall of the end part are flat surfaces respectively, and in addition, the first capillary structure is arranged on the inner wall of the end part. And the inner wall of the end part is provided with a second capillary structure. According to the technical scheme of the embodiment of the invention, the heat dissipation performance of the three-dimensional vapor chamber module can be improved, so that heat dissipation can be performed on the electronic equipment more efficiently.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a heat pipe component, a three-dimensional heat spreader module, a heat dissipation device, an electronic device, and a method for manufacturing the heat pipe component. Background Technology

[0002] With the increasing integration of the electronics industry, the heat generated by electronic devices is rising dramatically. Three-dimensional vapor chambers (3DVCs) are three-dimensional heat conduction structures that combine heat pipe components, vapor chambers (VCs), and heat dissipation fins. Improving the heat dissipation performance of 3DVCs to more efficiently cool electronic devices is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0003] This application provides a heat pipe component, a three-dimensional vapor chamber module, a heat dissipation device, an electronic device, and a method for manufacturing the heat pipe component, so as to improve the heat dissipation performance of the three-dimensional vapor chamber module.

[0004] According to one aspect of this application, a heat pipe component is provided for use in a three-dimensional heat exchanger module, comprising a pipe section and an end section, wherein one end of the pipe section is an open end and the inner wall of the pipe section has a first capillary structure, the end section is sealed to the other end of the pipe section and forms a first inner cavity with the pipe section, wherein the inner wall and outer wall of the end section are flat surfaces, and the inner wall of the end section has a second capillary structure.

[0005] According to the heat pipe component of this application embodiment, both the inner and outer walls of its ends are flat surfaces. A flat surface can be understood as a surface without significant inclination or obvious elevation or depression. This achieves at least the following technical effects: Firstly, the number of fin units connecting the heat dissipation fins to the heat pipe component is relatively large, allowing for more thorough thermal contact between the heat pipe component and the heat dissipation fins. The heat from the heat pipe component can be dissipated more efficiently through the heat dissipation fins, and the heat pipe component essentially has no ineffective sections where heat dissipation cannot be achieved through the heat dissipation fins. Secondly, the flat inner wall of the end facilitates the fabrication of the second capillary structure, preventing the accumulation of liquid working fluid on the inner wall of the end. This allows the liquid working fluid to flow quickly and smoothly back into the cavity of the vapor chamber component of the three-dimensional vapor chamber module through the second and first capillary structures. Therefore, the heat pipe component of this application embodiment, when applied to a three-dimensional vapor chamber module, can effectively improve the heat dissipation performance of the three-dimensional vapor chamber module, thereby enabling more efficient heat dissipation for electronic devices.

[0006] In some embodiments, the flat surface is a plane or a gently curved surface. Depending on the actual manufacturing process used for the heat pipe component, its ends may present as a plane or a gently curved surface after manufacturing. A gently curved surface has a smaller curvature and is also a flat surface; therefore, the above-mentioned technical effects can also be achieved.

[0007] In some embodiments, the edges of the flat surface are chamfered. The chamfer can serve as a transition structure between the end and the tube section, which not only facilitates the fabrication of the heat pipe component but also facilitates the assembly of the heat pipe component with the heat dissipation fins and reduces the risk of damage to the heat pipe component. Since the inner wall of the end is still a flat surface, it also facilitates the fabrication of capillary structures.

[0008] In some embodiments, the maximum axial dimension of the end portion along the tube is no greater than 3 mm. When the flat surface is a plane, the maximum axial dimension of the end portion along the tube can be used to represent the thickness of the end portion. Designing the thickness of the end portion to be no greater than 3 mm, which is relatively thin, is more conducive to heat dissipation of the heat pipe component. When the flat surface is a gently curved surface, the maximum axial dimension of the end portion along the tube can be used to represent the height of the bulge of the end portion relative to the other end of the tube. Designing this bulge height to be no greater than 3 mm, which is relatively flat, facilitates the fabrication of a second capillary structure on the inner wall of the end portion. On the other hand, it ensures that the heat pipe component has virtually no ineffective sections that cannot dissipate heat through the heat dissipation fins.

[0009] In some embodiments, the first capillary structure is uniformly distributed on the inner wall of the tube, and the second capillary structure is uniformly distributed on the inner wall of the end. This allows the liquid working fluid to flow back into the inner cavity of the heat exchanger more smoothly through the second and first capillary structures.

[0010] In some embodiments, the flat surface is orthogonal to the axial direction of the tube. In other embodiments, the flat surface forms an angle of less than 90° with the axial direction of the tube. Given that the inner and outer walls of the end are designed as flat surfaces, the end can be designed accordingly based on the specific assembly structure of the heat pipe component, the vapor chamber component, and the heat dissipation fins.

[0011] In some embodiments, the cross-section of the tube is circular, elliptical, polygonal, or oblong. The cross-sectional shape of the tube can be flexibly selected according to the design requirements of the three-dimensional heat exchanger module. In some embodiments, the cross-sectional dimensions of the tube can remain consistent at any position in the axial direction.

[0012] According to one aspect of this application, a three-dimensional vapor chamber module is provided, comprising a vapor chamber component, heat dissipation fins, a heat pipe component of any of the foregoing embodiments, and a two-phase working fluid. The vapor chamber component has a second inner cavity, the inner wall of which has a capillary structure. Heat dissipation fins are disposed on one side of the vapor chamber component and have mounting holes, the heat dissipation fins comprising multiple fin units, wherein the mounting holes penetrate the multiple fin units. A heat pipe component is disposed in the mounting holes and connected to the vapor chamber component and the heat dissipation fins respectively, wherein the shape of the pipe portion matches the shape of the mounting hole, and the open end is sealed and communicates with the second inner cavity. The two-phase working fluid fills the first and second inner cavities and is capable of converting between a vapor phase and a liquid phase.

[0013] Based on the design scheme of the heat pipe component in the aforementioned embodiments of this application, on the one hand, the heat pipe component and the heat dissipation fins can have more sufficient thermal contact, so that the heat of the heat pipe component can be dissipated more efficiently through the heat dissipation fins. On the other hand, the liquid working fluid can quickly and smoothly flow back to the second inner cavity through the second capillary structure and the first capillary structure. Therefore, the heat dissipation performance of the three-dimensional heat dissipation plate module is better, and it can dissipate heat from electronic devices more efficiently.

[0014] In some embodiments, the heat pipe component does not extend beyond the mounting hole, and the pipe portion is connected to each of the plurality of fin units. In these embodiments, the heat pipe component essentially has no ineffective sections where heat cannot be dissipated through the heat dissipation fins, allowing for sufficient heat conduction between the heat pipe component and the heat dissipation fins. Furthermore, since the closed end of the heat pipe component does not extend beyond the heat dissipation fins, it has a minimal impact on the overall size of the 3D vapor chamber module. Consequently, the 3D vapor chamber module is more compact and can be used in more confined installation spaces.

[0015] In some embodiments, the axial direction of the tube is orthogonal to the surface of each of the plurality of fin units. In other embodiments, the axial direction of the tube forms an angle of less than 90° with the surface of each of the plurality of fin units. In all these embodiments, the tube can fully contact the heat dissipation fins in a 360° circumferential direction.

[0016] In some embodiments, the heat pipe component is interference-fitted to the mounting hole, thereby achieving a reliable connection and sufficient thermal contact between the heat pipe component and the heat sink fins. In other embodiments, the heat pipe component is welded to the mounting hole. This not only achieves a reliable connection and sufficient thermal contact between the heat pipe component and the heat sink fins, but also reduces the machining accuracy requirements for the heat pipe component and the mounting hole by using solder to fill the gap between them, thus reducing production costs.

[0017] In some embodiments, the heat dissipation fins include multiple mounting holes, and the three-dimensional vapor chamber module includes multiple heat pipe components disposed in the multiple mounting holes in a one-to-one correspondence. These embodiments employ multiple heat pipe components and arrange these multiple heat pipe components in a two-dimensional direction, which enables the three-dimensional vapor chamber module to dissipate heat more efficiently and uniformly.

[0018] According to one aspect of this application, a heat dissipation device is provided for cooling electronic devices. The heat dissipation device includes a three-dimensional vapor chamber module as described in any of the foregoing embodiments, and a mounting component for fixing the three-dimensional vapor chamber module to the electronic device. In these embodiments, the heat dissipation device and the electronic device are independent products, and can be assembled or disassembled using the mounting component. The heat dissipation device can be used with various electronic devices. Because the three-dimensional vapor chamber module has superior heat dissipation performance, the heat dissipation device can more efficiently cool the electronic device, thereby improving the performance and reliability of the heat-generating electronic components.

[0019] According to one aspect of this application, an electronic device is provided, comprising a heat-generating electronic component and a three-dimensional vapor chamber module of any of the foregoing embodiments, wherein the three-dimensional vapor chamber module is used to dissipate heat from the heat-generating electronic component. In these embodiments, the three-dimensional vapor chamber module is assembled in the electronic device as a heat dissipation component. Because the three-dimensional vapor chamber module has superior heat dissipation performance, it can dissipate heat from the heat-generating electronic component more efficiently, thereby improving the operating performance and reliability of the heat-generating electronic component.

[0020] According to one aspect of this application, a method for manufacturing a heat pipe component as described in the foregoing embodiments is provided, comprising:

[0021] A pipe fitting is provided, which has openings at both ends and has a first capillary structure on its inner wall;

[0022] One end of the pipe fitting is subjected to a tube shrinking process to obtain a tube shrinking section, wherein the part of the pipe fitting that is not subjected to the tube shrinking process is the tube part of the heat pipe component;

[0023] A sealing welding process is applied to the reduced pipe section to seal one end of the pipe fitting and obtain a welded end.

[0024] A flattening process is performed on the welded ends to obtain flattened ends; and

[0025] A second capillary structure is formed on the inner wall of the flattened end to obtain the end of the heat pipe component.

[0026] The manufacturing method of the basic application embodiment can produce a heat pipe component as described in the foregoing embodiment, which can be applied to a three-dimensional heat exchanger module as described in the foregoing embodiment to effectively improve the heat dissipation performance of the three-dimensional heat exchanger module, thereby enabling more efficient heat dissipation for electronic devices.

[0027] The specific process used to form the second capillary structure is not limited. In some embodiments, forming the second capillary structure on the inner wall of the flattened end includes forming the second capillary structure on the inner wall of the flattened end by means of 3D printing or powder metallurgy. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the axial cross-sectional structure of a heat pipe component according to some embodiments of this application;

[0029] Figure 2A This is a schematic diagram of the cross-sectional structure of a heat pipe component applied to a three-dimensional heat exchanger module according to some embodiments of this application;

[0030] Figure 2B For some embodiments of the three-dimensional heat spreader module in this application Figure 2A A schematic diagram of the cross-sectional structure at point BB;

[0031] Figure 3 This application provides cross-sectional schematic diagrams of some comparative heat pipe components applied to a three-dimensional heat exchanger module.

[0032] Figure 4 This application provides cross-sectional schematic diagrams of some comparative heat pipe components applied to a three-dimensional heat exchanger module.

[0033] Figure 5 This is a schematic diagram of the axial cross-sectional structure of a heat pipe component according to some embodiments of this application;

[0034] Figure 6 This is a schematic diagram of the cross-sectional structure of a heat pipe component applied to a three-dimensional heat exchanger module according to some embodiments of this application;

[0035] Figure 7 For some embodiments of the three-dimensional heat spreader module in this application Figure 2A A schematic diagram of the cross-sectional structure at point BB;

[0036] Figure 8 This is a schematic diagram illustrating the application of a heat dissipation device according to some embodiments of this application in an electronic device;

[0037] Figure 9 This is a schematic diagram of an electronic device according to some embodiments of this application;

[0038] Figure 10 This is a schematic flowchart illustrating a method for manufacturing a heat pipe component according to some embodiments of this application;

[0039] Figure 11 This is a schematic diagram illustrating the manufacturing process of heat pipe components according to some embodiments of this application.

[0040] Figure label:

[0041] Reference numerals in the accompanying drawings of the embodiments of this application:

[0042] 100 - Three-dimensional heat spreader module; 100a - Evaporator side; 100b - Condenser side; 10 - Heat pipe component; 10a - Open end; 10b - Closed end;

[0043] 20 - Heat dissipation plate component; 30 - Heat dissipation fins; 11 - Tube section; 110 - First capillary structure; 12 - End; 13 - First inner cavity;

[0044] 120 - Second capillary structure; 121 - Chamfer; 20a - Lower cover plate; 20b - Upper cover plate; 201a - Recess; 21 - Second inner cavity; 22 - Capillary structure;

[0045] 31-Assembly hole; 32-Fin unit; 33-Connection structure; 200-Heat dissipation device; 300, 400-Electronic equipment;

[0046] 130 - Mounting component; 140 - Heating electronic component; 410 - Fitting; 411 - Reduced tube section; 412 - Welded end; 413 - Flattened end;

[0047] 500 - Manufacturing method; S501~S505 - Steps; 420 - Tube shrinking mold; 421a - Upper mold; 421b - Lower mold.

[0048] The reference numerals in the comparative drawings of this application are:

[0049] 001a, 001b - 3D vapor chamber module; 021a, 021b - vapor chamber component; 030a, 030b - heat dissipation fins; 010a, 010b - heat pipe component;

[0050] L1, L2 - Invalid segments. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0052] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0053] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0054] With the increasing integration of the electronics industry, the heat generated by electronic devices has increased dramatically. Typically, heat dissipation modules are needed to cool these devices, with heat pipes and vapor chambers being commonly used components in these modules.

[0055] Heat pipes transfer heat through the evaporation and condensation of a two-phase working fluid within a fully enclosed vacuum tube shell, transferring the liquid working fluid between the cold and hot ends via capillary action of the capillary structure. A vapor chamber is a vacuum cavity with an inner wall capillary structure and filled with a two-phase working fluid, typically comprising an evaporation zone and a condensation zone. In the evaporation zone, the liquid working fluid absorbs heat from the heat source and transforms into a vapor phase. In the condensation zone, the vapor phase condenses and dissipates heat, transforming back into a liquid phase. The liquid working fluid then flows back to the evaporation zone via capillary action of the capillary structure. Compared to heat pipes, vapor chambers can conduct heat in two dimensions, thus offering higher heat dissipation efficiency.

[0056] A three-dimensional vapor chamber module is a heat dissipation module that combines heat pipe components, vapor chamber components, and heat dissipation fins to create a three-dimensional heat conduction structure. Compared to a vapor chamber, a three-dimensional vapor chamber module can conduct heat in three dimensions, thus achieving higher heat dissipation efficiency.

[0057] In some three-dimensional vapor chamber modules in related technologies, it is difficult to achieve sufficient heat conduction between the closed end of the heat pipe component and the heat dissipation fins, thus restricting the further improvement of the heat dissipation efficiency of the three-dimensional vapor chamber module.

[0058] In view of this, the present application provides a heat pipe component, a three-dimensional vapor chamber module, a heat dissipation device, an electronic device, and a method for manufacturing the heat pipe component, so as to improve the heat dissipation performance of the three-dimensional vapor chamber module, thereby enabling more efficient heat dissipation for electronic devices.

[0059] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0060] like Figure 1 , Figure 2A and Figure 2B As shown, where, Figure 1 This is a schematic diagram of the axial cross-sectional structure of the heat pipe component 10 according to some embodiments of this application. Figure 2A This is a schematic cross-sectional view of the heat pipe component 10 applied to a three-dimensional heat spreader module 100 according to some embodiments of this application. Figure 2BFor some embodiments of the present application, the three-dimensional heat spreader module 100 is in Figure 2A A schematic diagram of the cross-sectional structure at point BB.

[0061] like Figure 1 As shown, the heat pipe component 10, as one of the components of the three-dimensional heat spreader module 100, mainly includes a pipe section 11 and an end section 12. One end of the pipe section 11 is an open end 10a, and the inner wall of the pipe section 11 has a first capillary structure 110. The end section 12 is sealed to the other end of the pipe section 11. The end section 12, as the closed end 10b of the heat pipe component 10, together with the pipe section 11, forms a first inner cavity 13. The outer wall of the end section 12 away from the first inner cavity 13 (hereinafter referred to as the outer wall) and the inner wall of the end section 12 near the first inner cavity 13 (hereinafter referred to as the inner wall) are both flat surfaces, and the inner wall of the end section 12 has a second capillary structure 120.

[0062] In the embodiments of this application, "flat surface" can be understood as a surface without significant tilt or obvious rise or fall, and it is not limited to a plane. For example, it can also be a gently curved surface with a small curvature, or it can have chamfers at the edges.

[0063] like Figure 2A As shown, a three-dimensional vapor chamber module 100 according to some embodiments of this application mainly includes a heat pipe component 10, a vapor chamber component 20, heat dissipation fins 30, and a two-phase working fluid (not shown in the figure). The vapor chamber component 20 has a second inner cavity 21, the inner wall of which has capillary structures 22. The heat dissipation fins 30 are disposed on one side of the vapor chamber component 20 and have mounting holes 31. The heat dissipation fins 30 include a plurality of fin units 32, and the mounting holes 31 penetrate the plurality of fin units 32. The heat pipe component 10 is disposed in the mounting holes 31 and is respectively connected to the vapor chamber component 20 and the heat dissipation fins 30. The tube portion 11 of the heat pipe component 10 matches the shape of the mounting holes 31, and the aforementioned open end 10a of the heat pipe component 10 is sealed and connected to the second inner cavity 21. The two-phase working fluid fills the first inner cavity 13 and the second inner cavity 21, and can transform between the vapor phase and the liquid phase with temperature changes. The multiple fin units 32 of the heat dissipation fins 30 can be kept spaced apart from each other by the connecting structure 33. The two-phase working fluid can be selected from, but is not limited to, at least one of pure water, ethylene glycol, alcohol, or ammonia.

[0064] Continue to refer to Figure 2AAs shown, the basic working principle of the three-dimensional vapor chamber module 100 is also illustrated. The dashed arrows roughly indicate the flow direction of the vapor phase working fluid, while the solid arrows roughly indicate the flow direction of the liquid phase working fluid. Based on the phase change of the two phases in the first inner cavity 13 and the second inner cavity 21, the three-dimensional vapor chamber module 100 can be divided into an evaporation side 100a and a condensation side 100b. The vapor chamber component 20 is located on the evaporation side 100a of the three-dimensional vapor chamber module 100. The side of the component without the heat dissipation fins 30 and heat pipe component 10 is used to contact electronic equipment or the heat-generating electronic components of electronic equipment (not shown in the figure). Thus, the liquid phase working fluid evaporates and absorbs heat in the second inner cavity 21, transforming into a vapor phase working fluid. The heat pipe component 10 and the heat dissipation fins 30 are disposed on the condensation side 100b of the three-dimensional heat spreader module 100. The heat pipe component 10 dissipates heat by conducting heat to the heat dissipation fins 30. The vapor working fluid condenses and releases heat in the first inner cavity 13 and is converted into a liquid working fluid. After the liquid working fluid adheres to the wall of the first inner cavity 13, it flows back to the second inner cavity 21 through the first capillary structure 110 and the second capillary structure 120, and then disperses in a two-dimensional direction through the capillary structure 22 on the wall of the second inner cavity 21.

[0065] like Figure 3 As shown, this is a cross-sectional structural diagram of a comparative three-dimensional vapor chamber module 001a of this application. The dashed arrows roughly indicate the flow direction of the vapor phase working fluid, and the solid arrows roughly indicate the flow direction of the liquid phase working fluid. The three-dimensional vapor chamber module 001a includes a vapor chamber component 021a, heat dissipation fins 030a, and a heat pipe component 010a. It can be seen that the heat pipe component 010a in this comparative example adopts a structural design different from the heat pipe component 10 in the above embodiments of this application. Specifically, the closed end of the heat pipe component 010a is sealed by a pressing process, resulting in its inner and outer walls not being flat surfaces. Thus, on the one hand, the closed end cannot fully contact the heat dissipation fins 030a, resulting in an ineffective section L1 in the heat pipe component 010a where heat dissipation cannot be achieved through the heat dissipation fins 030a, i.e., a portion of the heat dissipation area for heat conduction with the heat dissipation fins 030a is lost; on the other hand, due to the unevenness of the inner wall of the closed end, it is difficult to fabricate capillary structures, such as... Figure 3 As shown at point B1, some condensed liquid working fluid tends to accumulate at the closed end, thus preventing it from smoothly flowing back into the inner cavity of the heat spreader component 021a through the capillary structure, and consequently hindering the normal phase change cycle. These factors, to some extent, limit the improvement of the module's heat dissipation efficiency.

[0066] like Figure 4As shown, this is a cross-sectional structural diagram of another comparative example of the three-dimensional vapor chamber module 001b of this application. The dashed arrows roughly indicate the flow direction of the vapor phase working fluid, and the solid arrows roughly indicate the flow direction of the liquid phase working fluid. Similarly, this three-dimensional vapor chamber module 001b includes a vapor chamber component 021b, heat dissipation fins 030b, and a heat pipe component 010b. The closed end of the heat pipe component 010b is sealed by a pressing process, thus its inner and outer walls are not flat surfaces. It can be seen that it also has an ineffective section L2 where heat dissipation fins 030b cannot dissipate heat, easily accumulating liquid phase working fluid (such as...) at the closed end. Figure 4 (As shown at point B2 in the middle), in addition, the overall size of the three-dimensional heat pipe module 001b increases because the closed end of the heat pipe component 010b extends out of the heat dissipation fin 030b.

[0067] Return to the appendix to this application Figure 1 As shown, in the heat pipe component 10 according to an embodiment of this application, both the inner and outer walls of its end portion 12 are flat surfaces, thus making the end portion 12 flat. This is different from the above... Figure 3 and Figure 4 The comparative examples shown can achieve at least the following technical effects:

[0068] On the one hand, the number of fin units 32 connected to the heat pipe component 10 is relatively large, thus allowing for more thorough thermal contact between the heat pipe component 10 and the heat dissipation fins 30, and enabling the heat from the heat pipe component 10 to be dissipated more efficiently through the heat dissipation fins 30. For example, compared to Figure 3 As shown in the comparative example, the heat pipe component 10 can make thermal contact with each fin unit 32 of the heat dissipation fin 30, and the heat pipe component 10 essentially has no ineffective sections where heat cannot be dissipated through the heat dissipation fin 30. For example, compared to Figure 4 As shown in the comparative example, the heat pipe component 10 basically does not have any ineffective sections that cannot dissipate heat through the heat dissipation fins 30;

[0069] On the other hand, the inner wall of the end 12 is a flat surface, which facilitates the fabrication of capillary structures (i.e., the second capillary structure 120), allowing the liquid working medium to flow back to the second inner cavity 21 quickly and smoothly through the second capillary structure 120 and the first capillary structure 110, and the liquid working medium will hardly accumulate on the inner wall of the end 12.

[0070] Therefore, the heat pipe component 10 of this application embodiment is applied to the three-dimensional heat sink module 100, which can effectively improve the heat dissipation performance of the three-dimensional heat sink module 100, and thus, can dissipate heat from electronic devices more efficiently.

[0071] In some embodiments of this application, the first capillary structure 110 is uniformly distributed on the inner wall of the tube portion 11, and the second capillary structure 120 is uniformly distributed on the inner wall of the end portion 12, that is, the capillary structures are uniformly distributed on the wall surface of the first inner cavity 13. In the embodiments of this application, the liquid working fluid flows back to the second inner cavity 21 through the capillary action of the second capillary structure 120 and the first capillary structure 110, and is dispersed in a two-dimensional direction through the capillary action of the capillary structure 22 in the second inner cavity 21.

[0072] The essence of capillary action is a surface phenomenon related to surface flow and the equilibrium shape of the liquid surface caused by the existence of surface tension, such as the formation of droplets or curved liquid surfaces, and the rise or fall of the liquid surface in capillary pores. When the balance between surface tension and gravity is broken in the tiny channels of the capillary structure, the liquid will overcome gravity and rise or move. The capillary structure is uniformly distributed on the wall of the first inner cavity 13, which is conducive to giving full play to capillary action. It can not only avoid the local accumulation of liquid working fluid, but also make the liquid working fluid flow back to the second inner cavity 21 more uniformly, quickly and smoothly.

[0073] In this embodiment, the main material of the heat pipe component 10, excluding the first capillary structure 110 and the second capillary structure 120, i.e., the outer layer material of the heat pipe component 10, is not limited in specific material type and can be copper, aluminum, or other high thermal conductivity materials. The specific material type of the first capillary structure 110 and the second capillary structure 120 of the heat pipe component 10, as well as the capillary structure of the heat spreader component 20, is not limited; for example, copper or other high thermal conductivity materials can be selected. Furthermore, depending on the specific processing technology of the capillary structure, these capillary structures can have many different structural forms. For example, these capillary structures can be three-dimensional printed capillary structures, powder sintered capillary structures, fine groove capillary structures, multi-layer mesh capillary structures, etc.

[0074] In the embodiments of this application, depending on the actual manufacturing process used for the heat pipe component 10, the inner and outer walls of its end 12 can be either flat or gently curved, that is, the aforementioned "flat surface" can be either flat or gently curved.

[0075] like Figure 1 As shown, in some embodiments, the inner and outer walls of the end 12 of the heat pipe component 10 are respectively planar. Figure 5 As shown, in some other embodiments, the inner and outer walls of the end 12 of the heat pipe component 10 are respectively gently curved surfaces. The curvature of a gently curved surface is small, and it is also a flat surface; therefore, the above-mentioned technical effects can also be achieved.

[0076] In some embodiments of this application, such as Figure 1As shown in the enlarged structure at point A, assuming the inner and outer walls of end 12 are designed to be flat, the edges of the inner and / or outer walls of end 12 can be chamfered 121. The chamfer 121 can be an oblique chamfer or a rounded chamfer. Figure 1 The diagram illustrates a chamfered edge on the outer wall of end 12. This chamfer serves as a transition structure between end 12 and pipe 11, facilitating the fabrication of the heat pipe component 10, the assembly of the heat pipe component 10 with the heat dissipation fins 30, and reducing the risk of damage to the heat pipe component 10. Furthermore, since the inner wall of end 12 remains entirely flat, it also facilitates the fabrication of capillary structures.

[0077] In some other embodiments of this application, the flat surfaces of the inner and / or outer walls of the end 12 may extend to the edge of the end 12, i.e., without a chamfer 121.

[0078] like Figure 1 As shown, in some embodiments of this application, the maximum dimension c of the end portion 12 of the heat pipe component 10 along the axial direction of the pipe portion 11 is no greater than 3 mm. In these embodiments, the maximum dimension of the end portion 12 along the axial direction of the pipe portion 11 can be used to represent the thickness of the end portion 12. Designing the thickness of the end portion 12 to be no greater than 3 mm, which is relatively thin, is more conducive to heat dissipation of the heat pipe component 10. In some embodiments, the thickness dimension c of the end portion 12 can be designed in conjunction with the thickness dimension of the pipe portion 11, and its specific value is not limited.

[0079] like Figure 5 As shown, when the flat surface is a gently curved surface, the maximum dimension of the end 12 along the axial direction of the tube 11 can be used to represent the height of the bulge of the end 12 relative to the end face of the tube 11. The height of the bulge is designed to be no more than 3 mm and relatively flat. On the one hand, it is convenient to make a second capillary structure 120 on the inner wall of the end 12. On the other hand, it can make the heat pipe component 10 basically free of ineffective sections that cannot dissipate heat through the heat dissipation fins 30.

[0080] In this embodiment of the application, "axial direction of the tube 11" can be understood as the direction of extension of the geometric center line of the tube 11, that is... Figure 1 and Figure 5 The direction of extension is indicated by the dashed line at the midpoint. The heat pipe component 10 is usually made of a metal material with good thermal conductivity, such as copper or aluminum. Since the outer wall of the end 12 usually does not contact the heat dissipation fins 30, a thinner thickness and a smaller bulge height are more conducive to heat dissipation of the heat pipe component 10.

[0081] Depending on the assembly structure of the heat pipe component 10, the heat spreader component 20, and the heat dissipation fins 30, the inner and outer walls of the end 12, i.e., the aforementioned "flat surface," can be orthogonal to the axis of the pipe section 11, or they can form an angle of less than 90° with the axis of the pipe section 11 (the angle between a straight line and a plane is usually defined as [0°, 90°]). Figure 1 As shown, this embodiment illustrates the case where the flat surface is orthogonal to the axial direction of the tube 11.

[0082] like Figure 2A As shown, in some embodiments, the axial direction of the tube 11 is orthogonal to the surface of the heat exchanger 20 near the heat dissipation fin 30, and also orthogonal to the surface of each fin unit 32 of the heat dissipation fin 30. Thus, the inner and outer walls of the end 12 can be designed as flat surfaces orthogonal to the axial direction of the tube 11.

[0083] like Figure 6 As shown, in some other embodiments of this application, the axial direction of the tube 11 forms an angle θ with the surface of the heat exchange plate member 20 near the heat dissipation fin 30, and also forms an angle θ with the surface of each fin unit 32 of the heat dissipation fin 30. In this way, the inner and outer walls of the end 12 can be designed as flat surfaces forming an angle θ with the axial direction of the tube 11.

[0084] It can be seen that, given that the inner and outer walls of the end 12 are designed as flat surfaces, the end 12 can be designed accordingly based on the specific assembly structure of the heat pipe component 10, the heat spreader component 20, and the heat dissipation fins 30.

[0085] like Figure 2A and Figure 6 As shown, in some embodiments of this application, the plurality of fin units 32 of the heat dissipation fins 30 can be designed to be arranged sequentially along a direction away from the heat spreader component 20. In these embodiments, the structural design of the heat pipe component 10 and the heat dissipation fins 30 is relatively simplified, and the processing, fabrication and assembly of the components are also convenient.

[0086] In this embodiment, the shape of the cross-section (i.e., the cross-section perpendicular to the axial direction) of the tube 11 is not limited, and may include, but is not limited to, a circle, an ellipse, a polygon, or an oblong shape, etc., and the cross-sectional dimensions of the tube 11 can remain consistent at any position along the axial direction of the tube 11. Figure 2B As shown, in some embodiments of this application, the cross-sectional shape of the tube 11 is designed to be circular. For example... Figure 7 As shown, in some other embodiments of this application, the cross-sectional shape of the tube 11 can also be designed as an elongated oval. These shapes facilitate the fabrication of the heat pipe component 10 and the heat dissipation fins 30 assembled therewith.

[0087] Reference Figure 2A and Figure 2BAs shown, some embodiments of this application also provide a three-dimensional vapor chamber module 100, which may include a heat pipe component 10 of any of the above embodiments, a vapor chamber component 20, heat dissipation fins 30, and a two-phase working fluid (not shown in the figure). The vapor chamber component 20 has a second inner cavity 21, the wall of which has capillary structures 22. The heat dissipation fins 30 are disposed on one side of the vapor chamber component 20 and have mounting holes 31, wherein the heat dissipation fins 30 include a plurality of fin units 32, and the mounting holes 31 penetrate the plurality of fin units 32. The heat pipe component 10 is disposed in the mounting holes 31 and is respectively connected to the vapor chamber component 20 and the heat dissipation fins 30. The tube portion 11 of the heat pipe component 10 matches the shape of the mounting holes 31, and the open end of the heat pipe component 10 is sealed and connected to the second inner cavity 21. The two-phase working fluid fills the first inner cavity 13 and the second inner cavity 21, and can transform between the vapor phase and the liquid phase with temperature changes.

[0088] The basic working principle of the three-dimensional vapor chamber module 100 has been described above and will not be repeated here. Based on the design of the heat pipe component 10 in the aforementioned embodiments of this application, on the one hand, the heat pipe component 10 and the heat dissipation fins 30 can have more sufficient thermal contact, so that the heat of the heat pipe component 10 can be dissipated more efficiently through the heat dissipation fins 30. On the other hand, the liquid working fluid can quickly and smoothly flow back to the second inner cavity 21 through the second capillary structure 120 and the first capillary structure 110, so that heat can be conducted between the vapor chamber module 20 and the electronic device or the heat-generating electronic component of the electronic device on the evaporation side 100a. Therefore, the three-dimensional vapor chamber module 100 has better heat dissipation performance and can dissipate heat from the electronic device more efficiently.

[0089] The specific structural form of the temperature distribution plate component 20 is not limited. For example... Figure 2A As shown, this is an example of a heat spreader component 20 that can be used in an embodiment of this application. The heat spreader component 20 includes a lower cover plate 20a and an upper cover plate 20b that are sealed together, forming a second inner cavity 21 of the heat spreader component 20. The walls of the second inner cavity 21 are uniformly distributed with capillary structures 22. In some embodiments, such as... Figure 2A As shown, the lower cover plate 20a may include a recess 201a for collecting liquid working fluid.

[0090] In some embodiments of this application, such as Figure 2A As shown, the open end of the heat pipe component 10 can be sealed and connected to a corresponding opening (not shown in the figure) on the heat spreader component 20, for example, by welding. In other embodiments of this application, the open end of the heat pipe component can be inserted into the second inner cavity to a certain depth; these embodiments are not shown in the figures.

[0091] like Figure 2AAs shown, in some embodiments of this application, the heat pipe component 10 does not extend beyond the mounting hole 31, and the pipe portion 11 of the heat pipe component 10 is connected to a plurality of fin units 32 respectively. That is, the heat pipe component 10 can make thermal contact with each fin unit 32 of the heat dissipation fin 30.

[0092] In these embodiments, the heat pipe component 10 has virtually no ineffective sections that cannot dissipate heat through the heat dissipation fins 30. The heat pipe component 10 can conduct heat sufficiently with the heat dissipation fins 30. Moreover, since the closed end of the heat pipe component 10 does not extend out of the heat dissipation fins 30, it has little impact on the overall size of the three-dimensional heat spreader module 100. As a result, the three-dimensional heat spreader module 100 is more compact and can be used in smaller installation spaces.

[0093] like Figure 2A As shown, in some embodiments of this application, the axial direction of the tube 11 is orthogonal to the surface of the heat exchanger member 20 near the heat dissipation fins 30, which facilitates the assembly and connection of the tube 11 and the heat exchanger member 20. Continuing to refer to... Figure 2A As shown, in this embodiment, the axial direction of the tube 11 is also orthogonal to the surface of each fin unit 32 of the heat dissipation fin 30, so that the tube 11 can fully contact the heat dissipation fin 30 in a 360° circumferential direction.

[0094] like Figure 6 As shown, in some other embodiments of this application, the axial direction of the tube 11 forms an angle θ less than 90° with the surface of the heat exchanger member 20 near the heat dissipation fin 30. This allows for an increase in the axial dimension of the tube 11 compared to an orthogonal arrangement, thereby increasing the contact area with the heat dissipation fin 30. Continuing to refer to... Figure 6 As shown, in these embodiments, the axial direction of the tube 11 is also at an angle of less than 90° to the surface of each fin unit 32 of the heat dissipation fin 30, so that the tube 11 can fully contact the heat dissipation fin 30 in a 360° circumferential direction.

[0095] In some embodiments of this application, the heat pipe component 10 and the mounting hole 31 can be interference-fitted to achieve a reliable connection and sufficient thermal contact between the heat pipe component 10 and the heat dissipation fins 30.

[0096] In some other embodiments of this application, the heat pipe component 10 and the mounting hole 31 can also be welded together. This not only enables a reliable connection and sufficient thermal contact between the heat pipe component 10 and the heat dissipation fins 30, but also reduces the processing accuracy requirements of the heat pipe component 10 and the mounting hole 31 by using solder to fill the gap between them, thereby reducing production costs.

[0097] This application embodiment does not limit the number of heat pipe components 10 included in the three-dimensional vapor chamber module 100. For example, the number of heat pipe components 10 can be one or more. To enable the three-dimensional vapor chamber module 100 to dissipate heat more efficiently and uniformly, multiple heat pipe components 10 can be used, and these multiple heat pipe components 10 can be uniformly arranged in a two-dimensional direction. Figure 2A and Figure 2B As shown, in some embodiments of this application, the three-dimensional heat spreader module 100 includes a plurality of heat pipe components 10, and the heat dissipation fins 30 include a plurality of mounting holes 31, with the plurality of heat pipe components 10 correspondingly disposed in the plurality of mounting holes 31.

[0098] The specific arrangement of the multiple fin units 32 of the heat dissipation fins 30 is not limited. For example... Figure 2A As shown, in some embodiments of this application, multiple fin units 32 are arranged sequentially in a direction away from the heat pipe component 20. The heat dissipation fins 30, as one of the assembly components of the three-dimensional heat pipe module 100, can be manufactured as a whole and assembled with the heat pipe component 10 and the heat pipe component 20.

[0099] like Figure 8 As shown, this application embodiment also provides a heat dissipation device 200 for dissipating heat from an electronic device 300. The heat dissipation device 200 includes a three-dimensional heat spreader module 100 of any of the foregoing embodiments, and a mounting member 130 for fixing the three-dimensional heat spreader module 100 to the electronic device 300.

[0100] The specific product type of electronic device 300 is not limited. For example, it can be a mobile phone, tablet computer, laptop computer, smart wearable device, in-vehicle computer, medical electronic device, server, router, switch, etc. It usually includes heat-generating electronic components, such as processor chip or memory chip.

[0101] The specific structural form of the mounting component 130 is not limited; for example, it can be an adhesive used to fix the three-dimensional heat spreader module 100 to the electronic device 300 (such as...). Figure 8 (as shown in the attached diagram), a spring clip (not shown) that clamps and fixes the three-dimensional heat spreader module 100 to the electronic device 300, or a magnetic attachment (not shown) that magnetically fixes the three-dimensional heat spreader module 100 to the electronic device 300, etc.

[0102] In these embodiments, the heat dissipation device 200 and the electronic device 300 are independent products, and they can be assembled or disassembled through the mounting component 130. The heat dissipation device 200 can be used with various electronic devices 300. Because the three-dimensional heat dissipation plate module 100 has better heat dissipation performance, the heat dissipation device 200 can dissipate heat from the electronic device 300 more efficiently, thereby improving the working performance and reliability of the heat-generating electronic components of the electronic device 300.

[0103] like Figure 9 As shown, this application embodiment also provides an electronic device 400, which includes a heat-generating electronic component 140 and a three-dimensional heat spreader module 100 of any of the foregoing embodiments, wherein the three-dimensional heat spreader module 100 is used to dissipate heat from the heat-generating electronic component 140.

[0104] The specific product type of electronic device 400 is not limited. For example, it can be a mobile phone, tablet computer, laptop computer, smart wearable device, in-vehicle computer, medical electronic device, server, router, switch, etc. It usually includes heat-generating electronic components, such as processor chip or memory chip.

[0105] In these embodiments, the three-dimensional vapor chamber module 100 is assembled in the electronic device 400 as a heat dissipation component. Because the three-dimensional vapor chamber module 100 has superior heat dissipation performance, it can dissipate heat from the heat-generating electronic component 140 more efficiently, thereby improving the operating performance and reliability of the heat-generating electronic component 140.

[0106] like Figure 10 and Figure 11 As shown, this application embodiment also provides a method 500 for manufacturing a heat pipe component 10, wherein the heat pipe component 10 can be the heat pipe component 10 described in the foregoing embodiments. The manufacturing method 500 includes the following steps S501 to S505.

[0107] In step S501, a tube 410 is provided, which has openings at both ends and has a first capillary structure 110 on its inner wall.

[0108] In this step, a suitable fitting 410 is selected based on the specific structural design of the heat pipe component being manufactured. For example, depending on the specific structural design of the heat pipe component, the cross-section of the fitting 410 can be circular, elliptical, polygonal, or oblong, etc. Figure 11 In the embodiment shown, the cross-sectional shape of the pipe 410 is circular, and a straight circular pipe can be selected.

[0109] In step S502, a tube shrinking process is performed on one end of the fitting 410 to obtain a tube shrinking section 411, wherein the part of the fitting 410 that has not undergone the tube shrinking process is the tube portion 11 of the heat pipe component 10.

[0110] The tube shrinking process can use a tube shrinking mold 420. The depth h of the notch and the slope angle α of the tube shrinking mold 420 can be designed based on experience or multiple adjustments to accurately shrink one end of the tube fitting 410.

[0111] In step S503, a sealing welding process is performed on the reduced pipe section 411 to close one end of the pipe fitting 410 and obtain the welded end 412.

[0112] Since the tube reduction process on one end of the fitting 410 cannot close the opening at that end, a sealing welding process can be performed on the reduced tube section 411. This can close the opening at that end and shorten the axial dimension of the reduced tube section 411 by utilizing the molten state of the weld. In this step, the thickness of the welded end 412 can be controlled by adjusting parameters such as the welding temperature, pressure, and time of the welding equipment.

[0113] In step S504, a flattening process is performed on the welded end 412 to obtain the flattened end 413.

[0114] In this step, the flattening process can use a flattening die (a type of stamping die) to apply pressure to the welded end 412 through the upper die 421a and the lower die 421b, causing the welded end 412 to undergo plastic deformation, thereby obtaining the flattened end 413 of the desired shape and size. After this step is completed, the inner and outer walls of the flattened end 413 are flat surfaces.

[0115] The specific structure of the flattening die can be designed based on the shape and size requirements of the heat pipe component 10, combined with experience or through multiple adjustments. For example, when the inner and outer walls of the end 12 of the heat pipe component 10 form an angle of less than 90° with the axial direction of the pipe 11, the structure of the flattening die also needs to be designed accordingly.

[0116] In step S505, a second capillary structure 120 is formed on the inner wall of the flattened end 413 to obtain the end 12 of the heat pipe component 10.

[0117] In the embodiments of this application, for example, the first capillary structure 110, the second capillary structure 120, etc. can be made of copper or other high thermal conductivity materials.

[0118] In step S505, since the inner wall of the flattened end 413 is a flat surface, it is easy to fabricate a relatively uniform second capillary structure 120. The specific process used to form the second capillary structure 120 is not limited. For example, the second capillary structure 120 can be formed on the inner wall of the flattened end 413 through 3D printing or powder metallurgy. 3D printing is a technology that manufactures solid parts by adding material layer by layer based on 3D data. In the 3D printing process, low-power laser sintering of metal powder can be used to form a loose and porous capillary structure. Powder metallurgy is a process technology that uses metal powder, or a mixture of metal powder and non-metal powder, as raw materials, and forms products through powder filling, shaping, and sintering.

[0119] According to the manufacturing method 500 of the present application embodiment, a heat pipe component 10 as described in the foregoing embodiment can be obtained. When applied to the three-dimensional heat exchanger module 100 of the foregoing embodiment, it can effectively improve the heat dissipation performance of the three-dimensional heat exchanger module 100, thereby enabling more efficient heat dissipation for electronic devices.

[0120] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat pipe member applied in a three-dimensional vapor chamber module, characterized in that, The heat pipe member comprises: a tube portion having an open end and a first capillary structure on an inner wall thereof; and an end portion sealingly connected to the other end of the tube portion and forming a first inner cavity with the tube portion, wherein an inner wall and an outer wall of the end portion are flat surfaces, and the inner wall of the end portion has a second capillary structure. 2.The heat pipe member according to claim 1, wherein the flat surfaces are planar or gently curved. 3.The heat pipe member according to claim 1, wherein an edge of the flat surface has a chamfer. 4.The heat pipe member according to any one of claims 1 to 3, wherein a maximum dimension of the end portion in an axial direction of the tube portion is not greater than 3 mm. 5.The heat pipe member according to any one of claims 1 to 4, wherein the first capillary structure is uniformly distributed on the inner wall of the tube portion; and the second capillary structure is uniformly distributed on the inner wall of the end portion. 6.The heat pipe member according to any one of claims 1 to 5, wherein the flat surfaces are orthogonal to the axial direction of the tube portion; or the flat surfaces form an angle of less than 90° with the axial direction of the tube portion. 7.The heat pipe member according to any one of claims 1 to 6, wherein a cross section of the tube portion is circular, elliptical, polygonal, or oblong.

8. A three-dimensional vapor chamber module, characterized by, The heat pipe member comprises: a tube portion having an open end and a first capillary structure on an inner wall thereof; and an end portion sealingly connected to the other end of the tube portion and forming a first inner cavity with the tube portion, wherein an inner wall and an outer wall of the end portion are flat surfaces, and the inner wall of the end portion has a second capillary structure. 2.The heat pipe member according to claim 1, wherein the flat surfaces are planar or gently curved. 3.The heat pipe member according to claim 1, wherein an edge of the flat surface has a chamfer. 4.The heat pipe member according to any one of claims 1 to 3, wherein a maximum dimension of the end portion in an axial direction of the tube portion is not greater than 3 mm. 5.The heat pipe member according to any one of claims 1 to 4, wherein the first capillary structure is uniformly distributed on the inner wall of the tube portion; and the second capillary structure is uniformly distributed on the inner wall of the end portion. 6.The heat pipe member according to any one of claims 1 to 5, wherein the flat surfaces are orthogonal to the axial direction of the tube portion; or the flat surfaces form an angle of less than 90° with the axial direction of the tube portion. 7.The heat pipe member according to any one of claims 1 to 6, wherein 13. A heat dissipation device for dissipating heat from electronic equipment, characterized in that, a cross section of the tube portion is circular, elliptical, polygonal, or oblong. The heat pipe member comprises: a tube portion having an open end and a first capillary structure on an inner wall thereof; and an end portion sealingly connected to the other end of the tube portion and forming a first inner cavity with the tube portion, wherein an inner wall and an outer wall of the end portion are flat surfaces, and the inner wall of the end portion has a second capillary structure. 2.The heat pipe member according to claim 1, wherein the flat surfaces are planar or gently curved. 3.The heat pipe member according to claim 1, wherein an edge of the flat surface has a chamfer. 4.The heat pipe member according to any one of claims 1 to 3, wherein a maximum dimension of the end portion in an axial direction of the tube portion is not greater than 3 mm. 5.The heat pipe member according to any one of claims 1 to 4, wherein the first capillary structure is uniformly distributed on the inner wall of the tube portion; and the second capillary structure is uniformly distributed on the inner wall of the end portion. 6.The heat pipe member according to any one of claims 1 to 5, wherein the flat surfaces are orthogonal to the axial direction of the tube portion; or the flat surfaces form an angle of less than 90° with the axial direction of the tube portion. 7.The heat pipe member according to any one of claims 1 to 6, wherein a cross section of the tube portion is circular, elliptical, polygonal, or oblong. The heat pipe member comprises: a tube portion having an open end and a first capillary structure on an inner wall thereof; and an end portion sealingly connected to the other end of the tube portion and forming a first inner cavity with the tube portion, wherein an inner wall and an outer wall of the end portion are flat surfaces, and the inner wall of the end portion has a second capillary structure. 2.The heat pipe member according to claim 1, wherein the flat surfaces are planar or gently curved. 3.The heat pipe member according to claim 1, wherein an edge of the flat surface has a chamfer. 4.The heat pipe member according to any one of claims 1 to 3, wherein a maximum dimension of the end portion in an axial direction of the tube portion is not greater than 3 mm. 5.The heat pipe member according to any one of claims 1 to 4, wherein the first capillary structure is uniformly distributed on the inner wall of the tube portion; and the second capillary structure is uniformly distributed on the inner wall of the end portion. 6.The heat pipe member according to any one of claims 1 to 5, wherein the flat surfaces are orthogonal to the axial direction of the tube portion; or the flat surfaces form an angle of less than 90° with the axial direction of the tube portion. 7.The heat pipe member according to any one of claims 1 to 6, wherein a cross section of the tube portion is circular, elliptical, polygonal, or oblong. The heat pipe member comprises: The three-dimensional vapor chamber module according to any one of claims 8-12; and A mounting member for fixing the three-dimensional vapor chamber module to the electronic device.

14. An electronic device, comprising: Comprising: A heat-generating electronic component; And The three-dimensional vapor chamber module according to any one of claims 8-12 for dissipating heat from the heat-generating electronic component.

15. A method of manufacturing a heat pipe member according to claim 1, characterized by, Comprising: Providing a tube member, both ends of the tube member being open, and an inner wall of the tube member having a first capillary structure; Performing a tube shrinking process on one end of the tube member to obtain a shrunk tube section, wherein a portion of the tube member that is not subjected to the tube shrinking process is the tube portion of the heat pipe member; Performing a sealing welding process on the shrunk tube section to close one end of the tube member and obtain a welded end portion; Performing a flattening process on the welded end portion to obtain a flattened end portion; and Forming a second capillary structure on an inner wall of the flattened end portion to obtain the end portion of the heat pipe member.

16. The method of manufacturing according to claim 15, wherein, Forming a second capillary structure on an inner wall of the flattened end portion, comprising: Forming a second capillary structure on an inner wall of the flattened end portion by three-dimensional printing or powder metallurgy process.

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