Electronic equipment, shell, diaphragm and heat dissipation material thereof
By coating a heat dissipation material layer containing phase change particles in resin onto the substrate surface of electronic devices, the heat dissipation problem of electronic devices in transient scenarios is solved, achieving efficient heat dissipation without increasing thickness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2026-03-10
AI Technical Summary
Existing electronic devices lack effective heat dissipation solutions in transient scenarios, leading to an increased rate of temperature rise and impacting user experience.
The structure employs a heat dissipation material layer coated on the surface of a substrate. The heat dissipation material layer is composed of resin material doped with phase change particles. The phase change particles are microcapsules encapsulating the phase change material. The film is formed by blending and dispersing to enhance heat dissipation efficiency.
It effectively reduces the instantaneous temperature rise of electronic devices, improves heat dissipation efficiency, solves the problem of excessive temperature rise rate of the whole machine, and does not increase the thickness of the product.
Smart Images
Figure CN121645774A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic device heat dissipation, in particular to an electronic device, a shell, a diaphragm and a heat dissipation material thereof. BACKGROUND
[0002] Electronic devices such as mobile phones, tablets, notebook computers and the like require thinness and portability, and at the same time have high performance and good temperature experience, so the heat dissipation performance of the product is becoming more and more important. In the current terminal field, in order to improve the performance of the product, the power consumption of CPU or GPU chip is generally dynamically controlled, and the running power consumption is dynamically adjusted according to the running program needs and the product temperature. For example, when some large programs or documents are started, the running power consumption is greatly increased for a short time to obtain higher performance, so as to shorten the program starting time and improve the user experience. In addition, the charging strategy of high-power wired and wireless charging is directly related to the whole machine temperature rise, and prolonging the whole machine temperature rise can effectively prolong the high-power charging time, and then shorten the whole machine power full charging time.
[0003] These transient scenarios put higher requirements on heat dissipation, and the industry currently lacks effective solutions, thereby limiting the performance improvement of the terminal. The current heat dissipation of terminal products such as mobile phones and tablets mainly aims at uniform temperature, and the ultra-high thermal conductivity of graphite sheet and gas-liquid two-phase heat sink is used to realize rapid dissipation of energy. Under the trend of thinness and lightness of the whole machine, the graphite sheet and the heat sink tend to be thinned and lightened, which leads to an increase in the temperature rise rate of the whole machine, and then leads to problems such as game frame rate reduction, charging current reduction and the like affecting the use experience. SUMMARY
[0004] The first aspect of the embodiment of the present application provides a diaphragm, which comprises:
[0005] a substrate;
[0006] a heat dissipation material layer, which is arranged in a stack with the substrate;
[0007] wherein the heat dissipation material layer comprises a resin material and phase change particles doped in the resin material, and the phase change particles comprise microcapsules and phase change materials coated in the microcapsules.
[0008] The second aspect, the embodiment of the present application provides a heat dissipation material, which comprises a resin material and phase change particles doped in the resin material, and the phase change particles comprise microcapsules and phase change materials and dyes coated in the microcapsules.
[0009] The third aspect, the embodiment of the present application provides a diaphragm, which comprises:
[0010] a substrate;
[0011] A heat dissipation material layer is arranged in a stack with the base material, wherein the heat dissipation material layer is formed by coating the heat dissipation material as described in the above embodiments.
[0012] In a fourth aspect, the embodiments of the present application provide a shell, which comprises a base plate and a diaphragm as described in the above embodiments, and the diaphragm is bonded to the base plate.
[0013] In a fifth aspect, the embodiments of the present application provide an electronic device, which comprises a shell as described in the above embodiments.
[0014] The diaphragm provided by the embodiments of the present application has the effect of improving heat dissipation efficiency by designing a structure of coating a heat dissipation material layer on the surface of a base material, wherein the material of the heat dissipation material layer is a phase change particle doped in resin, and the phase change particle is a structure of coating a phase change material in a microcapsule, so as to solve the problem of excessively high instantaneous temperature rise of an electronic device. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0016] Figure 1 is a structural schematic diagram of an embodiment of the diaphragm of the present application;
[0017] Figure 2 is a microstructure schematic diagram of an embodiment of the heat dissipation material layer of the present application;
[0018] Figure 3 is a structural schematic diagram of another embodiment of the diaphragm of the present application; Figure 2 is a structural schematic diagram of a phase change particle in the embodiment;
[0019] Figure 4 is a curve diagram of temperature and heat absorption of a solid-liquid phase change material;
[0020] Figure 5 is a structural schematic diagram of another embodiment of the diaphragm of the present application;
[0021] Figure 6 is a structural schematic diagram of still another embodiment of the diaphragm of the present application;
[0022] Figure 7 is a microstructure schematic diagram of another embodiment of the heat dissipation material of the present application;
[0023] Figure 8 is a microstructure schematic diagram of still another embodiment of the heat dissipation material of the present application;
[0024] Figure 9 is Figure 8 Structure diagram of phase change particles in an embodiment;
[0025] Figure 10a Structure diagram of film heat storage capacity test results of a layer of heat dissipation material with a thickness of 30um;
[0026] Figure 10b Structure diagram of film heat storage capacity test results of a layer of heat dissipation material with a thickness of 60um;
[0027] Figure 10c Structure diagram of film heat storage capacity test results of a layer of heat dissipation material with a thickness of 90um;
[0028] Figure 11 Structure diagram of an embodiment of a shell of the present application;
[0029] Figure 12 Structure diagram of an embodiment of an electronic device of the present application;
[0030] Figure 13 is Figure 12 Structure diagram of an embodiment of an electronic device of the present application;
[0031] Figure 14 Structure diagram of an embodiment of an electronic device of the present application. DETAILED DESCRIPTION
[0032] The present application will be further described below in conjunction with the accompanying drawings and embodiments. It is particularly pointed out that the following embodiments are only for illustrating the present application, but not for limiting the scope of the present application. Similarly, the following embodiments are only part of the embodiments of the present application, but not all the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art without making creative efforts are within the scope of protection of the present application.
[0033] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of components in a specific posture (as shown in the figures). If the specific posture changes, the directional indication will also change accordingly. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.
[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0035] As used herein, “electronic device” (or simply “terminal”) includes, but is not limited to, means configured to receive / transmit communication signals via a wired connection (such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), Digital Cable, Direct Cable Connection, and / or another data connection / network) and / or via a wireless interface (e.g., for cellular networks, Wireless Local Area Networks (WLANs), Digital Television Networks such as DVB-H networks, Satellite Networks, AM-FM Broadcast Transmitters, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a “wireless communication terminal,” a “wireless terminal,” or a “mobile terminal.” Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephone with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notepads, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or handheld receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.
[0036] To address the heat dissipation problem of electronic devices, this application first provides a diaphragm structure, please refer to... Figure 1 , Figure 1 This is a schematic diagram of the structure of a diaphragm according to an embodiment of this application. It should be noted that the diaphragm in this embodiment can be used in electronic devices to dissipate heat from the electronic devices, which may include mobile phones, tablets, laptops, wearable devices, etc. The diaphragm 100 in this embodiment includes a substrate 110 and a heat dissipation material layer 120.
[0037] Specifically, the heat dissipation material layer 120 and the substrate 110 are stacked. The substrate 110 can be made of a transparent resin material, such as PET. Please refer to [further details]. Figure 2 , Figure 2 This is a schematic diagram of the microstructure of a heat dissipation material layer according to an embodiment of this application. The heat dissipation material layer 120 includes a resin material 121 and phase change particles 122 doped in the resin material 121. Please refer to [link / reference]. Figure 3 , Figure 3 yes Figure 2 The schematic diagram of the phase change particle structure in the embodiment shows that the phase change particle 122 includes microcapsules 1221 and a phase change material 1222 encapsulated in the microcapsules 1221. The resin material 121 includes epoxy resin, polyurethane, polyester, acrylic resin, etc. The resin material 121 provides a dispersion medium for the phase change particle 122 and also enhances its strength, protecting the phase change particle 122 from failure due to external environmental influences.
[0038] Phase change materials (PCMs) are substances that change their state with temperature and can provide latent heat. The process by which PCMs change between different states (solid, liquid, and vapor) or undergo a phase change within the same state due to changes in external conditions is called a phase change process. During this process, the PCM absorbs or releases a large amount of latent heat. For example... Figure 3 As shown, Figure 4 This is a schematic diagram of the temperature and heat absorption curves of a solid-liquid phase change material. Taking a solid-liquid PCM material as an example, the horizontal axis represents the heat absorption, and the vertical axis represents the temperature of the PCM material. The PCM material is initially in a solid state, and its temperature increases as it absorbs heat. When the temperature rises to the phase change point, a phase change begins, absorbing latent heat. At this point, the temperature of the PCM material remains unchanged, and it is in a solid-liquid mixed state. After it completely turns into a liquid state, the temperature of the PCM material continues to rise as it absorbs heat.
[0039] The extension of temperature rise due to phase change materials (PCMs) can be calculated using the following formula: Q = W * t = H * m; where Q is the heat absorbed or released, i.e., the heat capacity; W is the power consumption through the PCM material; t is the required duration of heat absorption; H is the latent heat of phase change of the PCM material; and m is the required mass of the PCM material. There are many types of PCMs, which can be classified into three main categories based on their chemical composition: inorganic materials, organic materials, and composite PCMs. This application uses a composite PCM, a microcapsule encapsulation technology, which utilizes film-forming materials to encapsulate solids or liquids to form microparticles with a core-shell structure (particle size 2-1000 μm, shell thickness typically 0.2-10 μm). The main preparation methods for microcapsules are interfacial polymerization and in-situ polymerization. Microcapsule encapsulation not only solves problems such as easy leakage, phase separation, and corrosion of PCMs, but also enhances the stability, specific surface area, and heat transfer efficiency of the core material PCM.
[0040] The technical solution in this application embodiment forms a heat dissipation material layer of a membrane by blending and dispersing microcapsule-encapsulated phase change material with resin. The resin crosslinks the microcapsule particles to provide strength, while the microcapsules provide the resin with high heat storage properties.
[0041] Please see Figure 5 , Figure 5 This is a schematic diagram of another embodiment of the diaphragm in this application. In this embodiment, the diaphragm 100 includes a substrate 110, a heat dissipation material layer 120, and an optical effect layer 130. The optical effect layer 130 is disposed between the heat dissipation material layer 120 and the substrate 110. Optionally, the optical effect layer 130 in this embodiment includes a stacked UV texture layer 131 and an optical coating layer 132. The UV texture layer 131 can be formed by roller-coating UV adhesive and then transferring it onto a master plate to form a UV texture. The optical coating layer 132 can be formed by electroplating discontinuous metal oxides or metal coatings to form an incremental or color layer. Pre-blended phase change microcapsule resin is coated onto the optical coating layer 132 by screen printing, utilizing the pigments in the resin to provide a base color and also to mask the diaphragm.
[0042] Please see Figure 6 , Figure 6 This is a schematic diagram of another embodiment of the diaphragm in this application. The diaphragm 100 in this embodiment includes a substrate 110, a heat dissipation material layer 120, an optical effect layer 130, and a light-shielding ink layer 140. The optical effect layer 130 is disposed between the heat dissipation material layer 120 and the substrate 110, and the light-shielding ink layer 140 is disposed on the side of the heat dissipation material layer 120 opposite to the optical effect layer 130. For detailed structure of the optical effect layer 130, please refer to the description of the foregoing embodiments; it will not be repeated here.
[0043] Optionally, the heat dissipation material layer 120 may also include a resin material 121 and phase change particles 122 doped in the resin material 121. The phase change particles 122 include microcapsules 1221 and phase change materials 1222 encapsulated within the microcapsules 1221. The resin material 121 includes epoxy resin, polyurethane, polyester, acrylic resin, etc. The resin material 121 provides a dispersion medium for the phase change particles 122 while also enhancing their strength, protecting the phase change particles 122 from failure due to external environmental influences. Since the n-alkane material (one type of phase change material 1222) encapsulated in the phase change microcapsules is white in the solid state and colorless in the liquid state, the heat dissipation material formed by blending does not possess high shielding properties. Therefore, a layer of traditional shielding ink is needed as a primer to reduce the film's light transmittance. Additionally, the film 100 in this embodiment also includes an optical adhesive layer 150, which is used to bond to the housing of the electronic device.
[0044] Please refer to the following: Figure 7 , Figure 7 This is a schematic diagram of the microstructure of another embodiment of the heat dissipation material of this application. The heat dissipation material layer 120 includes a resin material 121, phase change particles 122 doped in the resin material 121, and a dye 123. The dye 1223 can include inorganic and organic dyes, such as silica particles, organic pigments, ceramic powders, or carbon black powder. In this embodiment, the film's color can be enriched by doping the heat dissipation material layer with dye. In some embodiments, the dye can also be black, serving a masking function (for example, coating a heat dissipation material layer 120 that combines heat storage and masking functions, and printing 5µm to 150µm heat dissipation material onto the substrate 110 or optical effect layer 130 using screen printing), eliminating the need for a separate light-shielding ink layer on the film.
[0045] Please refer to the following: Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of the microstructure of another embodiment of the heat dissipation material of this application. Figure 9 yes Figure 8The schematic diagram of the phase change particles in this embodiment shows that the heat dissipation material layer 120 includes a resin material 121 and phase change particles 122 doped in the resin material 121. Unlike the previous embodiments, the phase change particles 122 in this embodiment include microcapsules 1221 and phase change material 1222 and dye 123 encapsulated within the microcapsules 1221. The dye 123 can include inorganic and organic dyes, such as silica particles, organic pigments, ceramic powders, or carbon black powders. Unlike the previous embodiments, the dye in this embodiment is encapsulated in the microcapsules 1221, rather than being doped in the resin material 121. The phase change material provides heat storage capacity, and the dye provides color. By adjusting the doping ratio of the phase change material and the dye, the ink's color performance and heat storage capacity can be adjusted. In some embodiments, since the color characteristics of the phase change material cannot be completely masked, a masking ink layer is still needed as a base layer after the heat dissipation material layer 120 is formed. In other embodiments, a masking effect can be achieved by encapsulating a larger amount of dye in the microcapsule 1221, thus eliminating the need for a separate layer of masking ink for priming. By adjusting the core material encapsulated in the microcapsules, more application possibilities are provided. For example, co-encapsulating phase change materials and dyes can provide a base color for the membrane while simultaneously enabling heat storage.
[0046] The effect of the membrane in the embodiments of this application can be characterized by the enthalpy value of the membrane, please refer to the following: Figure 10a to Figure 10c ,in, Figure 10a This diagram illustrates the test results of the heat storage capacity of a membrane with a 30µm thick heat dissipation material layer. Figure 10b This diagram illustrates the test results of the heat storage capacity of a membrane with a 60µm thick heat dissipation material layer. Figure 10c This diagram illustrates the test results of the heat storage capacity of a membrane with a 90µm thick heat dissipation material layer. The membrane with this thick heat dissipation material layer provides a heat storage capacity of 14.3 J / g, while membranes with 60µm and 90µm thick heat dissipation material layers provide heat storage capacities of 23.6 J / g and 31.5 J / g, respectively.
[0047] This application also provides a housing that can be used in electronic devices, such as the casing of mobile phones, laptops, and tablets. Please refer to... Figure 11 , Figure 11This is a schematic diagram of a housing according to an embodiment of the present application. The housing 10 includes a substrate 200 and a diaphragm 100. The structure of the diaphragm 100 can be any of the structures described in the preceding embodiments; only one is illustrated in this embodiment. The substrate 200 can be transparent glass or resin material. In this embodiment, the diaphragm 100 includes a substrate 110, a heat dissipation material layer 120, an optical effect layer 130, a light-shielding ink layer 140, and an optical adhesive layer 150. The optical effect layer 130 is disposed between the heat dissipation material layer 120 and the substrate 110, and the light-shielding ink layer 140 is disposed on the side of the heat dissipation material layer 120 opposite to the optical effect layer 130. The optical effect layer 130 includes a stacked UV texture layer 131 and an optical coating layer 132. The UV texture layer 131 can be formed by roller coating UV adhesive and then transferring it onto the master plate. The optical coating layer 132 can be formed by electroplating discontinuous metal oxides or metal coatings to form an incremental or color layer. The pre-blended phase change microcapsule resin is coated onto the optical coating layer 132 by screen printing, which provides a base color using the pigments in the resin and also masks the film. The heat dissipation material layer 120 can be any of the aforementioned embodiments, and will not be described in detail here. The film 100 is bonded to the substrate 200 by the optical adhesive layer 150. In this embodiment, the film 100 includes the UV texture layer 131, the optical coating layer 132, the heat dissipation material layer 120, and the light-shielding ink layer 140 stacked sequentially. For a detailed description of the structure of the film 100, please refer to the relevant descriptions in the aforementioned embodiments, and will not be repeated here.
[0048] Furthermore, this application also provides an electronic device, which may include a mobile phone, tablet computer, laptop computer, wearable device, etc. A mobile phone is used as an example here for illustration. Please refer to the following: Figure 12 and Figure 13 , Figure 12 This is a schematic diagram of the structure of an embodiment of the electronic device of this application. Figure 13 yes Figure 12 The schematic diagram of the electronic device at point AA in this embodiment shows that the electronic device may include a display module 30, a housing 10 (which may be the back cover of a mobile phone in this embodiment), and a control circuit board 20. The housing 10 may be the structure described in the previous embodiments, and will not be detailed here. The display module 30 and the housing 10 cooperate to form an accommodating space 1000. The control circuit board 20 is disposed within the accommodating space 1000 and is electrically connected to the display module 30. The control circuit board 20 is used to control the display module 30. Detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art and will not be elaborated here.
[0049] Please see Figure 14 , Figure 14This is a schematic block diagram illustrating the structural composition of an embodiment of the electronic device described in this application. The electronic device can be a mobile phone, tablet computer, laptop computer, or wearable device, etc. This embodiment uses a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display module 30 in the above embodiment), a sensor 950, an audio circuit 960, a Wi-Fi module 970, a processor 980 (which may be the control circuit board 20 in the aforementioned embodiment), and a power supply 990. The RF circuit 910, memory 920, input unit 930, display unit 940, sensor 950, audio circuit 960, and Wi-Fi module 970 are all connected to the processor 980; the power supply 990 provides power to the entire electronic device.
[0050] Specifically, the RF circuit 910 is used to transmit and receive signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, and may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes infrared sensors, laser sensors, etc., used to detect user proximity signals, distance signals, etc.; the speaker 961 and the microphone 962 are connected to the processor 980 through the audio circuit 960 for transmitting and receiving sound signals; the Wi-Fi module 970 is used to receive and transmit Wi-Fi signals; and the processor 980 is used to process the data information of the electronic device. For specific structural features of the electronic device, please refer to the relevant descriptions in the above embodiments; detailed descriptions will not be provided here.
[0051] In this embodiment, the electronic device features a diaphragm on its casing. This diaphragm utilizes a structure where a heat-dissipating material layer is coated onto the substrate surface. The heat-dissipating material layer is composed of resin doped with phase change particles, which are microcapsules containing the phase change material. This design enhances the diaphragm's heat dissipation efficiency, thereby addressing the issue of excessive instantaneous temperature rise in electronic devices. By co-dispersing the microcapsule-encapsulated phase change material with the resin, replacing the masking ink used in decorative films for mobile phones, tablets, and other terminal products, the effect of reducing instantaneous temperature rise without increasing thickness is achieved.
[0052] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this application.
Claims
1. A diaphragm, characterized by The film sheet comprises: a substrate; a heat dissipation material layer stacked with the substrate; wherein the heat dissipation material layer comprises a resin material and phase change particles doped in the resin material, the phase change particles comprising microcapsules and a phase change material coated in the microcapsules.
2. The diaphragm of claim 1, wherein The film sheet further comprises an optical effect layer between the heat dissipation material layer and the substrate.
3. The diaphragm of claim 2, wherein, The optical effect layer comprises a UV texture layer and an optical coating layer stacked.
4. The diaphragm of claim 3, wherein, The film sheet further comprises a light shielding ink layer on a side of the heat dissipation material layer away from the optical effect layer.
5. The diaphragm of claim 3, wherein The heat dissipation material layer further comprises a dye doped in the resin material.
6. A heat dissipating material, characterized by, The heat dissipation material comprises a resin material and phase change particles doped in the resin material, the phase change particles comprising microcapsules and a phase change material and a dye coated in the microcapsules.
7. A diaphragm characterized by, The film sheet comprises: a substrate; a heat dissipation material layer stacked with the substrate, wherein the heat dissipation material layer is formed by coating the heat dissipation material of claim 6.
8. The diaphragm of claim 7, wherein, The film sheet further comprises an optical effect layer between the heat dissipation material layer and the substrate, and a light shielding ink layer on a side of the heat dissipation material layer away from the optical effect layer.
9. A housing characterized by, The housing comprises a substrate and the film sheet of any one of claims 1-5, 7-8, the film sheet being bonded to the substrate.
10. An electronic device, comprising: The electronic device comprises the housing of claim 9.