Electronic component
By using an integrated heat dissipation fin assembly design, combined with a heat-conducting shroud and heat dissipation channels, the contradiction between heat dissipation efficiency and manufacturing cost in traditional electronic components is resolved, achieving both high-efficiency heat dissipation and cost savings.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2026-03-10
AI Technical Summary
Traditional electronic components face challenges in balancing heat dissipation efficiency and manufacturing cost of circuit board components, especially due to the high manufacturing cost caused by the complex structure of heat sink fins.
The heat dissipation fin assembly is made of one piece, including a base, fins and a heat conduction cover. The heat dissipation channel is formed by the heat conduction cover and the base is thermally coupled to the heat source, so as to achieve effective heat conduction and heat dissipation, eliminating the need to manufacture a complex heat dissipation fin assembly.
It effectively improves the heat dissipation efficiency of circuit board assemblies while reducing the manufacturing cost of electronic components. By simplifying the structural design of the heat dissipation fin assembly, it reduces the cost of manufacturing complex molds.
Smart Images
Figure CN121645776A_ABST
Abstract
Description
Technical Field
[0001] This application relates to an electronic component, and more particularly to an electronic component including a heat source and a heat sink assembly. Background Technology
[0002] Generally, to maximize space utilization, electronic components increasingly consist of two adjacent circuit board assemblies. In such components, each circuit board assembly requires a dedicated heat sink to effectively cool the two circuit board assemblies.
[0003] However, due to the complex structure of the heat sink fin assembly, complex molds need to be developed during manufacturing. Therefore, the method of manufacturing a dedicated heat sink fin assembly for each circuit board assembly (i.e., developing a dedicated mold) significantly increases the manufacturing cost of electronic components. In other words, traditional electronic components struggle to balance the heat dissipation efficiency of the circuit board assembly with the manufacturing cost of the electronic component. Summary of the Invention
[0004] Therefore, it is necessary to provide an electronic component that addresses the above issues by balancing the heat dissipation efficiency of the circuit board assembly with the manufacturing cost of the electronic component.
[0005] The technical solution is as follows:
[0006] This application provides an electronic component, including:
[0007] A first circuit board assembly includes a first circuit board and a first heat source disposed on the first circuit board;
[0008] A second circuit board assembly includes a second circuit board and a second heat source disposed on the second circuit board, wherein the first circuit board and the second circuit board are spaced apart; and
[0009] A heat dissipation fin assembly is located between a first circuit board and a second circuit board, and includes a base portion, multiple fin portions, and a heat-conducting cover portion. The base portion has a perforation. The multiple fin portions and the heat-conducting cover portion all protrude from the same side of the base portion. The heat-conducting cover portion covers the perforation and surrounds at least one heat dissipation channel communicating with the perforation. The base portion is thermally coupled to the second heat source, and the opposite sides of the heat-conducting cover portion are thermally coupled to the base portion and the first heat source, respectively.
[0010] The technical solution will be further explained below:
[0011] In one embodiment, the base portion, the plurality of fin portions, and the heat-conducting cover portion are integrally formed.
[0012] In one embodiment, the first heat source and the second heat source are offset from each other along a stacking direction of the first circuit board and the second circuit board.
[0013] In one embodiment, a windproof film is also included, which is disposed on the side of the base portion away from the plurality of fin portions and the heat-conducting cover portion and shields the perforation.
[0014] In one embodiment, the heat-conducting cover has a first thermal coupling surface, a second thermal coupling surface, two ventilation surfaces, and at least one heat dissipation channel. The first thermal coupling surface and the second thermal coupling surface are arranged back to back. The two ventilation surfaces are arranged back to back and connected between the first thermal coupling surface and the second thermal coupling surface. The at least one heat dissipation channel passes through the two ventilation surfaces. The first thermal coupling surface is thermally coupled to the base portion, and the second thermal coupling surface is thermally coupled to the first heat source. The perforation is arranged opposite to the first thermal coupling surface.
[0015] In one embodiment, the heat-conducting cover further includes at least one partition plate, and the number of the at least one heat dissipation channels is multiple, and the at least one partition plate is used to separate the multiple heat dissipation channels communicating with the hole.
[0016] In one embodiment, the arrangement direction of the plurality of heat dissipation channels is perpendicular to the protrusion direction of the plurality of fin portions protruding from the base portion.
[0017] In one embodiment, the base includes a bottom plate and two side plates, which are respectively connected to opposite sides of the bottom plate so that the two side plates and the bottom plate together form two ventilation openings. The perforation is opened in the bottom plate. The plurality of fin portions and the heat-conducting cover portion protrude from the same side of the bottom plate. The side of the bottom plate away from the plurality of fin portions is thermally coupled to the second heat source. The two ventilation surfaces of the heat-conducting cover portion are arranged opposite to the two ventilation openings in a one-to-one correspondence.
[0018] In one embodiment, two sealing gaskets are further included, one of which is sandwiched between one of the two side plates and the first circuit board, and the other of the two sealing gaskets is sandwiched between the other of the two side plates and the first circuit board.
[0019] In one embodiment, a fan is also included, which is located on the same side of the heat sink fin assembly as the first circuit board assembly. The fan is fixed to the base portion of the heat sink fin assembly and is used to guide an airflow through the at least one heat dissipation channel and flow to the plurality of fin portions.
[0020] In the aforementioned electronic component, the base of the heat sink fin assembly is thermally coupled to the second heat source, and the opposite sides of the heat conduction cover are thermally coupled to the base of the heat sink fin assembly and the first heat source, respectively, with the heat conduction cover forming at least one heat dissipation channel. Through this configuration, the heat conduction cover not only serves as a heat conduction medium between the first heat source and the heat sink fin assembly, but also solves the problem of blocking cold air through the heat dissipation channel design. Therefore, by using only a single heat sink fin assembly and its heat conduction cover, the heat generated by the first and second heat sources can be effectively absorbed, thus saving the cost of manufacturing multiple complex heat sink fin assemblies. In this way, both the heat dissipation efficiency of the first and second circuit board assemblies and the manufacturing cost of the electronic component can be balanced.
[0021] Furthermore, since the base has pores that connect to the heat dissipation channel, the heat conduction cover can be easily assembled to the base, thereby further reducing the manufacturing cost of electronic components. Attached Figure Description
[0022] Figure 1 This is a three-dimensional structural diagram of an electronic component according to an embodiment of the present invention.
[0023] Figure 2 for Figure 1 The electronic components are shown in a side section diagram along the sectional line 2-2.
[0024] Figure 3 for Figure 1 A three-dimensional structural diagram of the heat dissipation fin assembly of the electronic components.
[0025] Figure 4 for Figure 2 A partially enlarged structural diagram of the electronic components.
[0026] Explanation of reference numerals in the attached figures:
[0027] 10. Electronic component; 100. First circuit board assembly; 110. First circuit board; 120. First heat source; 200. Second circuit board assembly; 210. Second circuit board; 220. Second heat source; 300. Heat sink fin assembly; 310. Base portion; 311. Base plate; 3110. Perforation; 312. Side plate; 315. Ventilation opening; 320. Fin portion; 330. Thermal conductive cover portion; 331. First thermal coupling interface; 332. Second thermal coupling interface; 333. Ventilation surface; 334. Heat dissipation channel; 335. Partition plate; 340. Thermal conductive bump; 400. Sealing gasket; 500. Windproof film; 600. Fan; S. Stacking direction; A. Arrangement direction; P. Protrusion direction. Detailed Implementation
[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0029] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0030] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0032] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0033] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0034] Please see Figure 1 and Figure 2 , Figure 1 This is a three-dimensional structural diagram of an electronic component according to an embodiment of the present invention. Figure 2 for Figure 1 The electronic component is shown in a side sectional view along section line 2-2. In this embodiment, the electronic component 10 includes, for example, a first circuit board assembly 100, a second circuit board assembly 200, a heat sink fin assembly 300, two sealing gaskets 400, a windproof film 500, and a fan 600.
[0035] The first circuit board assembly 100 includes a first circuit board 110 and a first heat source 120 disposed on the first circuit board 110. The second circuit board assembly 200 includes a second circuit board 210 and a second heat source 220 disposed on the second circuit board 210. The first circuit board 110 and the second circuit board 210 are disposed at a distance.
[0036] In addition, such as Figure 2 As shown, the first heat source 120 and the second heat source 220 are offset from each other, for example, along a stacking direction S of the first circuit board 110 and the second circuit board 210.
[0037] Please see Figures 2 to 4 . Figure 3 for Figure 1 A three-dimensional structural diagram of the heat dissipation fin assembly of the electronic components. Figure 4 for Figure 2 A partially enlarged structural diagram of the electronic components.
[0038] The heat dissipation fin assembly 300 is located between the first circuit board 110 and the second circuit board 210, and includes a base portion 310, a plurality of fin portions 320, and a heat-conducting cover portion 330. The base portion 310 includes a bottom plate 311 and two side plates 312. The two side plates 312 are respectively connected to opposite sides of the bottom plate 311 so that the two side plates 312 and the bottom plate 311 together form two ventilation openings 315. The bottom plate 311 has a perforation 3110. The fin portions 320 and the heat-conducting cover portions 330 both protrude from the same side of the bottom plate 311. The side of the bottom plate 311 away from the fin portions 320 can be thermally coupled to the second heat source 220, for example, through a heat-conducting bump 340 and a heat-conducting pad (not shown).
[0039] The heat-conducting cover 330 has a first thermal coupling surface 331, a second thermal coupling surface 332, two ventilation surfaces 333, and multiple heat dissipation channels 334. The first thermal coupling surface 331 and the second thermal coupling surface 332 are arranged back-to-back with each other. The two ventilation surfaces 333 are arranged back-to-back with each other and connected between the first thermal coupling surface 331 and the second thermal coupling surface 332. In addition, the two ventilation surfaces 333 are arranged opposite to the two ventilation openings 315 one-to-one. The heat-conducting cover 330 covers the hole 3110 and surrounds the multiple heat dissipation channels 334 that communicate with the hole 3110. These heat dissipation channels 334 penetrate the two ventilation surfaces 333. The first thermal coupling surface 331 is thermally coupled to the base plate 311, and the second thermal coupling surface 332 is thermally coupled to the first heat source 120. The second thermal coupling surface 332 can be thermally coupled to the first heat source 120, for example, through a heat dissipation pad (not shown). A hole 3110 is formed in the base plate 311 and is disposed opposite to the first thermal coupling surface 331. In this embodiment, the base portion 310, the fin portions 320 and the heat-conducting cover portion 330 are integrally formed, for example, by means of mold misalignment (i.e., by breaking) during die casting, so that the base plate 311 has a hole 3110.
[0040] Furthermore, in this embodiment, the heat-conducting cover 330 also has a plurality of partition plates 335. These partition plates 335 are used to separate a plurality of heat dissipation channels 334 communicating with the perforation 3110. In other embodiments, the number of heat dissipation channels may also be single. That is, in other embodiments, the heat-conducting cover may not need to have partition plates.
[0041] Furthermore, in this embodiment, as Figure 2As shown, one of the two sealing gaskets 400 is sandwiched between one of the two side plates 312 and the first circuit board 110, and the other of the two sealing gaskets 400 is sandwiched between the other of the two side plates 312 and the first circuit board 110, to improve the airtightness between the heat sink assembly 300 and the first circuit board 110. The two sealing gaskets 400 are, for example, foam. It should be noted that in other embodiments, if the power of the first heat source and the second heat source is low, the electronic components may not need to include the sealing gaskets 400.
[0042] Furthermore, in this embodiment, as Figure 4 As shown, the arrangement direction A of the multiple heat dissipation channels 334 is, for example, perpendicular to the protrusion direction P of the fins 320 protruding from the base plate 311. Therefore, cool air can flow more smoothly through the heat dissipation channels 334 and to the fins 320. In other words, the resistance encountered by the cool air flowing through the heat dissipation channels 334 and to the fins 320 is relatively small. However, in other embodiments, if the power of the first heat source and the second heat source is low, the arrangement direction of the heat dissipation channels may also be parallel to the protrusion direction of the fins protruding from the base plate.
[0043] Furthermore, in this embodiment, as Figure 4 As shown, a windproof film 500 is disposed on the side of the base plate 311 away from the fin portion 320 and the heat-conducting cover portion 330 and covers the perforation 3110 to improve the airtightness between the heat dissipation fin assembly 300 and the first circuit board 110. The windproof film 500 is, for example, Mylar. It should be noted that in other embodiments, if the power of the first heat source and the second heat source is low, the electronic components may not need to include the windproof film 500.
[0044] Please refer to this again. Figure 1 and Figure 2 The fan 600 and the first circuit board assembly 100 are both located on the same side of the heat sink fin assembly 300. The fan 600 may, for example, be fixed to the base 310 of the heat sink fin assembly 300 and used to guide an airflow (not shown) through the heat dissipation channel 334 and flow to the fin portion 320. In other embodiments, the electronic component may not require a fan 600, and an external fan may be used to guide the airflow.
[0045] In the electronic component of the above embodiment, the base of the heat sink fin assembly is thermally coupled to the second heat source, and the opposite sides of the heat conduction cover are thermally coupled to the base of the heat sink fin assembly and the first heat source, respectively, with the heat conduction cover forming at least one heat dissipation channel. Through this configuration, the heat conduction cover not only serves as a heat conduction medium between the first heat source and the heat sink fin assembly, but also solves the problem of blocking cold air through the heat dissipation channel design. Therefore, by using only a single heat sink fin assembly and its heat conduction cover, the heat generated by the first and second heat sources can be effectively absorbed, thus saving the cost of manufacturing multiple complex heat sink fin assemblies. In this way, both the heat dissipation efficiency of the first and second circuit board assemblies and the manufacturing cost of the electronic component can be balanced.
[0046] Furthermore, the base portion has perforations that connect to the heat dissipation channels. In other words, the base portion, fin portion, and heat-conducting shroud portion of the heat sink assembly are integrally formed, for example, during die casting using a mold misalignment (i.e., perforation). In this way, there is no need to incur the cost of assembling the heat-conducting shroud portion to the base portion, thereby further reducing the manufacturing cost of electronic components.
[0047] In one embodiment of the present invention, the electronic component of the present invention can be applied to a server, which can be used for artificial intelligence (AI) computing, edge computing, or as a 5G server, cloud server, or vehicle networking server.
[0048] In one embodiment of the present invention, the electronic components of the present invention can be applied to in-vehicle devices, such as servers for in-vehicle computers or in-vehicle infotainment (IVI) systems, etc.; they can also be applied to 5G servers, cloud servers, or vehicle networking servers.
[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0050] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. An electronic assembly, characterized by include: A first circuit board assembly includes a first circuit board and a first heat source disposed on the first circuit board; A second circuit board assembly includes a second circuit board and a second heat source disposed on the second circuit board, wherein the first circuit board and the second circuit board are spaced apart; and A heat dissipation fin assembly is located between a first circuit board and a second circuit board, and includes a base portion, multiple fin portions, and a heat-conducting cover portion. The base portion has a perforation. The multiple fin portions and the heat-conducting cover portion all protrude from the same side of the base portion. The heat-conducting cover portion covers the perforation and surrounds at least one heat dissipation channel communicating with the perforation. The base portion is thermally coupled to the second heat source, and the opposite sides of the heat-conducting cover portion are thermally coupled to the base portion and the first heat source, respectively.
2. The electronic assembly of claim 1, wherein, The base, the plurality of fins, and the heat-conducting cover are integrally formed.
3. The electronic assembly of claim 1, wherein, The first heat source and the second heat source are offset from each other along a stacking direction of the first circuit board and the second circuit board.
4. The electronic assembly of claim 1, wherein, It also includes a windproof film, which is disposed on the side of the base portion away from the plurality of fin portions and the heat-conducting cover portion and shields the hole.
5. The electronic assembly of claim 1, wherein, The heat-conducting cover has a first thermal coupling surface, a second thermal coupling surface, two ventilation surfaces, and at least one heat dissipation channel. The first thermal coupling surface and the second thermal coupling surface are arranged back to back. The two ventilation surfaces are arranged back to back and connected between the first thermal coupling surface and the second thermal coupling surface. The at least one heat dissipation channel passes through the two ventilation surfaces. The first thermal coupling surface is thermally coupled to the base portion, and the second thermal coupling surface is thermally coupled to the first heat source. The perforation is arranged opposite to the first thermal coupling surface.
6. The electronic assembly of claim 5, wherein, The heat-conducting cover also has at least one partition plate, and the number of the at least one heat dissipation channels is multiple, and the at least one partition plate is used to separate the multiple heat dissipation channels that are connected to the hole.
7. The electronic assembly of claim 6, wherein, The arrangement direction of the plurality of heat dissipation channels is perpendicular to the protrusion direction of the plurality of fin portions protruding from the base portion.
8. The electronic assembly of claim 5, wherein, The base includes a bottom plate and two side plates. The two side plates are respectively connected to opposite sides of the bottom plate so that the two side plates and the bottom plate together form two ventilation openings. The perforation is opened in the bottom plate. The plurality of fin portions and the heat-conducting cover portion protrude from the same side of the bottom plate. The side of the bottom plate away from the plurality of fin portions is thermally coupled to the second heat source. The two ventilation surfaces of the heat-conducting cover portion are arranged opposite to the two ventilation openings in a one-to-one correspondence.
9. The electronic assembly of claim 8, wherein, It also includes two sealing gaskets, one of which is sandwiched between one of the two side plates and the first circuit board, and the other of the two sealing gaskets is sandwiched between the other of the two side plates and the first circuit board.
10. The electronic assembly of claim 1, wherein, It also includes a fan, which and the first circuit board assembly are located on the same side of the heat sink fin assembly. The fan is fixed to the base of the heat sink fin assembly and is used to guide an airflow through the at least one heat dissipation channel and flow to the plurality of fins.