Electronic device

Abstract

The invention discloses an electronic device which comprises a shell, a first heat source, a second heat source and a fan. The shell is provided with a first cavity, a second cavity, a first air inlet, a second air inlet, a first air outlet and a second air outlet. The first air inlet and the first air outlet are communicated with the first cavity. The second air inlet and the second air outlet are communicated with the second cavity. The first air outlet is adjacent to the second air outlet. The second heat source is disposed in the first chamber and partially exposed to the second chamber. The fan is arranged in the first cavity and used for generating first airflow which enters from the first air inlet and leaves from the first air outlet after passing through the first heat source. When the first air flow leaves from the first air outlet, a second air flow which enters from the second air inlet and leaves from the second air outlet after passing through the part, exposed to the second cavity, of the second heat source is induced.

Description

Technical Field

[0001] This invention relates to an electronic device. Background Technology

[0002] Commonly known methods of heat dissipation in electronic devices typically involve collecting heat from the primary heat source via heat pipes to heat sink fins, and then actively cooling the device through airflow generated by a fan. However, in addition to the primary heat source, electronic devices often have other secondary heat sources that also require cooling. Without adding a fan, passive cooling methods are commonly used to handle the heat generated by these secondary heat sources. For example, copper foil or graphite sheets are attached to the secondary heat sources to conduct heat to the device's surface, and then heat is dissipated through convection with external air. However, passive cooling is less effective than active cooling. Summary of the Invention

[0003] This invention addresses the problem of poor heat dissipation in passive heat dissipation in an electronic device.

[0004] An electronic device according to the present invention includes a housing, a first heat source, a second heat source, and a fan. The housing has a first chamber, a second chamber, a first air inlet, a second air inlet, a first air outlet, and a second air outlet. The first chamber and the second chamber are independent of each other. The first air inlet and the first air outlet communicate with the first chamber. The second air inlet and the second air outlet communicate with the second chamber. The first air outlet and the second air outlet are adjacent to each other. The first heat source is disposed in the first chamber. The second heat source is disposed in the first chamber and partially exposed to the second chamber. The fan is disposed in the first chamber to generate a first airflow that enters from the first air inlet, passes through the first heat source, and exits from the first air outlet. When the first airflow exits from the first air outlet, it attracts a second airflow that enters from the second air inlet, passes through the second heat source, is partially exposed to the second chamber, and exits from the second air outlet.

[0005] In one embodiment of the present invention, the portion of the housing having a first air outlet is perpendicular to the portion of the housing having a second air outlet.

[0006] In one embodiment of the present invention, the first heat source includes a first heating component, a first heat-conducting component, and a first heat dissipation fin. The first heat-conducting component is thermally connected to the first heating component and the first heat dissipation fin. A first airflow passes through the first heat dissipation fin.

[0007] In one embodiment of the present invention, the first heat-conducting component includes at least one of a heat-conducting block, a copper foil, and a heat pipe.

[0008] In one embodiment of the present invention, the portion of the second heat source exposed in the second chamber is integrally formed with the first heat dissipation fins.

[0009] In one embodiment of the present invention, the second heat source includes a second heating element, a second heat-conducting element, and a second heat dissipation fin. The second heat-conducting element is thermally connected to the second heating element and the second heat dissipation fin. The second heat dissipation fin is exposed in a second chamber. A second airflow passes through the second heat dissipation fin.

[0010] In one embodiment of the present invention, the second heat-conducting component includes at least one of a heat-conducting block, a copper foil, and a heat pipe.

[0011] In one embodiment of the present invention, the electronic device further includes a circuit board. A first heat source and a second heat source are disposed on the circuit board.

[0012] In one embodiment of the present invention, the electronic device further includes a shielding net disposed on the housing and shielding the first air outlet and the second air outlet.

[0013] In one embodiment of the present invention, the first air inlet and the second air inlet are combined together.

[0014] Based on the above, in the electronic device of the present invention, the second airflow caused by the first airflow can actively dissipate heat from the second heat source, resulting in a better heat dissipation effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the external appearance of an electronic device according to an embodiment of the present invention;

[0016] Figure 2 yes Figure 1 A partial cross-sectional view of an electronic device;

[0017] Figure 3 This is a partial cross-sectional view of an electronic device according to another embodiment of the present invention;

[0018] Figure 4 This is a partial schematic diagram of an electronic device according to another embodiment of the present invention;

[0019] Figure 5 This is a schematic diagram of the appearance of an electronic device according to another embodiment of the present invention. Detailed Implementation

[0020] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0021] Figure 1 This is a schematic diagram of the appearance of an electronic device according to an embodiment of the present invention. Figure 2 yes Figure 1 A partial cross-sectional view of the electronic device. Please refer to... Figure 1 and Figure 2The electronic device 100 of this embodiment includes a housing 110, a first heat source 120, a second heat source 130, and a fan 140. The housing 110 has a first chamber C12, a second chamber C14, a first air inlet H12, a second air inlet H14, a first air outlet H16, and a second air outlet H18. The first chamber C12 and the second chamber C14 are independent. That is, the gas in the first chamber C12 and the gas in the second chamber C14 will not have substantial mutual convection, but this does not mean that the first chamber C12 and the second chamber C14 are completely airtightly separated. The first air inlet H12 and the first air outlet H16 connect to the first chamber C12. The second air inlet H14 and the second air outlet H18 connect to the second chamber C14. The first air outlet H16 and the second air outlet H18 are adjacent. Therefore, the airflow leaving the first air outlet H16 passes through the second air outlet H18, disturbing the airflow in the second chamber C14. In other words, whether the first air outlet H16 and the second air outlet H18 are adjacent is also related to the velocity and flow rate of the airflow leaving the first air outlet H16. The higher the velocity and the greater the flow rate of the airflow leaving the first air outlet H16, the greater the distance between the first air outlet H16 and the second air outlet H18 can be, and it can still disturb the airflow in the second chamber C14.

[0022] Both the first heat source 120 and the second heat source 130 are located in the first chamber C12. Although the second heat source 130 is located in the first chamber C12, a portion of the second heat source 130 is exposed in the second chamber C14. A fan 140 is located in the first chamber C12 to generate a first airflow F12 that enters from the first air inlet H12, passes through the first heat source 120, and exits from the first air outlet H16. That is, the fan 140 can generate the first airflow F12, and the first heat source 120 is actively cooled by the first airflow F12 passing through it.

[0023] When the first airflow F12 exits from the first outlet H16, it creates a relatively low-pressure environment in the vicinity of the first outlet H16. Therefore, the gas in the adjacent second inlet H14 is drawn outward from the second chamber C14 by the low pressure. In other words, the first airflow F12 attracts a second airflow F14. Conversely, the higher the velocity of the first airflow F12, the higher the velocity of the second airflow F14 will be. The second airflow F14 enters the second chamber C14 from the second inlet H14 and exits from the second outlet H18 after being exposed to the second chamber C14 by the second heat source 130.

[0024] In the electronic device 100 of this embodiment, a fan 140 is only disposed in the first chamber C12 for active heat dissipation. However, by utilizing the design that the first air outlet H16 and the second air outlet H18 are adjacent, a second airflow F14 can also be generated in the second chamber C14 to achieve the effect of active heat dissipation. Therefore, it is not necessary to increase the number of fans 140 to improve heat dissipation efficiency, and the problems of increased cost and larger size caused by increasing the number of fans 140 can also be avoided.

[0025] In this embodiment, the portion of the housing 110 with the first air outlet H16 can be perpendicular to the portion of the housing 110 with the second air outlet H18. That is, the air outlet surface of the first air outlet H16 is perpendicular to the air outlet surface of the second air outlet H18. In this way, the first airflow F12 has a better traction effect on the second airflow F14, and no wind pressure is generated from the second air outlet H18 into the interior of the second chamber C14.

[0026] In this embodiment, the first heat source 120 includes a first heating component 122, a first heat-conducting component 124, and a first heat dissipation fin 126. The first heat-conducting component 124 thermally connects the first heating component 122 and the first heat dissipation fin 126. A first airflow F12 passes through the first heat dissipation fin 126. That is, the heat generated by the first heating component 122 can be transferred to a suitable location for the first heat dissipation fin 126 via the first heat-conducting component 124, and then the heat transferred to the first heat dissipation fin 126 is carried away by the first airflow F12. The first heating component 122 may be a component with a large heat generation in a central processing unit or other electronic device. Since the fan 140 directly generates the first airflow F12 to dissipate heat from the first heating component 122, it can better ensure that the first heating component 122 obtains sufficient heat dissipation efficiency to maintain normal operation. The first heat-conducting component 124 includes, for example, a heat-conducting block, copper foil, heat pipe, graphene sheet, or other suitable heat-conducting components, at least one of these.

[0027] In this embodiment, the second heat source 130 includes a second heating component 132, a second heat-conducting component 134, and a second heat dissipation fin 136. The second heat-conducting component 134 thermally connects the second heating component 132 and the second heat dissipation fin 136. The second heat dissipation fin 136 is exposed in the second chamber C14. A second airflow F14 passes through the second heat dissipation fin 136. That is, the heat generated by the second heating component 132 can be transferred to a suitable location for the second heat dissipation fin 136 via the second heat-conducting component 134, and then the heat transferred to the second heat dissipation fin 136 is carried away by the first airflow F12. Specifically, in this embodiment, the second heat dissipation fin 136 is located within the second chamber C14. The second heating component 132 can be a relatively low-heat-generating component in a photosensitive and imaging chip or other electronic device. Although the first airflow F12 directly generated by the fan 140 cannot dissipate heat from the second heat-generating component 132, the second airflow F14 generated by the first airflow F12 can actively dissipate heat from the second heat sink 136, ensuring that the second heat-generating component 132 obtains sufficient heat dissipation efficiency to maintain normal operation. The second heat-conducting component 134 includes, for example, at least one of a heat-conducting block, copper foil, heat pipe, graphene sheet, or other suitable heat-conducting component.

[0028] In this embodiment, the first heating element 122 of the first heat source 120 and the second heating element 132 of the second heat source 130 are respectively disposed on different circuit boards, but the present invention is not limited thereto. Furthermore, the first heat dissipation fin 126 of the first heat source 120 and the second heat dissipation fin 136 of the second heat source 130 are independent of each other, but the present invention is not limited thereto.

[0029] Figure 3 This is a partial cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to... Figure 3 The electronic device 200 in this embodiment and Figure 2 The electronic device 200 is substantially the same as the electronic device 100, except that the electronic device 200 in this embodiment also includes a circuit board 250. Furthermore, the first heating component 122 of the first heat source 120 and the second heating component 132 of the second heat source 130 are both disposed on the same circuit board 250. For example, the first heating component 122 of the first heat source 120 and the second heating component 132 of the second heat source 130 may be disposed on different sides of the circuit board 250, but the present invention is not limited thereto.

[0030] Figure 4 This is a partial schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to... Figure 4The diagram only shows the second chamber C14, fan 140, first heat-conducting component 324 of the first heat source, second heat-conducting component 334 of the second heat source, first heat dissipation fin 326 of the first heat source, and second heat dissipation fin 336 of the second heat source in the electronic device of this embodiment. The electronic device of this embodiment... Figure 2 The electronic device 100 is largely the same, except that in this embodiment, the second heat dissipation fin 336 of the second heat source exposed in the second chamber C14 is integrated with the first heat dissipation fin 326 of the first heat source. This simplifies the assembly process and improves assembly accuracy. In this embodiment, the first air outlet and the second air outlet are still adjacent, but are hidden within the second heat dissipation fin 336 and the first heat dissipation fin 326, or integrated into the common air outlet of the second heat dissipation fin 336 and the first heat dissipation fin 326. Similarly, in the above embodiments, the first air inlet and the second air inlet are independent. However, in other embodiments, the first air inlet and the second air inlet may also be combined, resulting in a simpler appearance.

[0031] Figure 5 This is a schematic diagram of the external appearance of an electronic device according to another embodiment of the present invention. Please refer to... Figure 5 The electronic device 200 in this embodiment and Figure 2 The electronic device 400 is largely the same as the one in the other embodiment, except that it further includes a shielding net 460 disposed on the housing 110 and shielding the first air outlet H16 and the second air outlet H18. This allows the electronic device 400 to have a more complete appearance.

[0032] In summary, in the electronic device of the present invention, the first air outlet of the first chamber and the second air outlet of the second chamber are adjacent to each other. The first airflow generated by the fan can actively dissipate heat from the first heat source 120, and the first airflow can also attract a second airflow to actively dissipate heat from the second heat source. Therefore, without the need for an additional fan, active heat dissipation can be achieved for both heat sources. The electronic device of the present invention has the advantages of excellent heat dissipation, low cost, and small size.

Claims

1. An electronic device, characterized by comprising: Comprising: a housing having a first chamber, a second chamber, a first air inlet, a second air inlet, a first air outlet, and a second air outlet, wherein the first chamber and the second chamber are independent of each other, the first air inlet and the first air outlet communicate the first chamber, the second air inlet and the second air outlet communicate the second chamber, and the first air outlet is adjacent to the second air outlet; a first heat source disposed in the first chamber; a second heat source disposed in the first chamber and partially exposed to the second chamber; and a fan disposed in the first chamber to generate a first airflow entering from the first air inlet, passing through the first heat source, and then exiting from the first air outlet, wherein the first airflow exiting from the first air outlet induces a second airflow entering from the second air inlet, passing through the second heat source exposed to the second chamber, and then exiting from the second air outlet. 2.The electronic device of claim 1, wherein, The housing has a portion with the first air outlet perpendicular to a portion with the second air outlet. 3.The electronic device of claim 1, wherein, The first heat source includes a first heat generating component, a first heat conducting component, and a first heat dissipation fin, the first heat conducting component thermally connects the first heat generating component and the first heat dissipation fin, and the first airflow passes through the first heat dissipation fin. 4.The electronic device of claim 3, wherein, The first heat conducting component includes at least one of a heat conducting block, a copper foil, and a heat pipe.

5. The electronic device as claimed in claim 3, characterized in that, The portion of the second heat source exposed to the second chamber is integrated with the first heat dissipation fin. 6.The electronic device of claim 1, wherein, The second heat source includes a second heat generating component, a second heat conducting component, and a second heat dissipation fin, the second heat conducting component thermally connects the second heat generating component and the second heat dissipation fin, and the second heat dissipation fin is exposed to the second chamber, and the second airflow passes through the second heat dissipation fin. 7.The electronic device of claim 5, wherein, The second heat conducting component includes at least one of a heat conducting block, a copper foil, and a heat pipe. 8.The electronic device of claim 1, wherein, Further comprising a circuit board, the first heat source and the second heat source are disposed on the circuit board. 9.The electronic device of claim 1, wherein, Further comprising a shielding net disposed on the housing and shielding the first air outlet and the second air outlet. 10.The electronic device of claim 1, wherein, The first air inlet and the second air inlet are combined together.

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