Die bonding equipment based on EtherCAT communication

Abstract

The invention discloses die bonding equipment based on EtherCAT communication. The die bonding equipment comprises a suction nozzle driving unit, a die bonding suction nozzle, a main controller, a plurality of EtherCAT air pressure detection cards and an EtherCAT bus network. The EtherCAT air pressure detection card is configured to store a control word-parameter set mapping table; obtaining a stage control word from the main controller; calling a corresponding preset parameter set; the air channel regulation and control component is controlled to regulate the air pressure and on-off in the nozzle; and the air pressure value is comprehensively processed locally based on the parameter set to generate a state judgment result, and then the result is returned. According to the invention, the EtherCAT bus is used for replacing RS485, the detection card is endowed with local processing capability of integrating gas circuit control and intelligent detection, microsecond-level adaptive control and detection are realized, the technical problems of asynchronous control feedback, poor real-time performance and high false alarm rate caused by communication delay of a traditional die bonder are fundamentally solved, and the detection card is suitable for large-scale popularization and application. And the die bonding precision and the production efficiency are obviously improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonding equipment, and particularly relates to a die bonding equipment based on EtherCAT communication. BACKGROUND

[0002] A die bonder is a key device in the process of semiconductor packaging and LED manufacturing, and its core function is to accurately pick up a wafer and mount it to a designated position. In the device, a die bonder suction nozzle is a direct execution component for performing the picking and mounting actions. Its working principle is to generate negative pressure (vacuum) through an internal air path to adsorb the wafer, and after completing the movement positioning, the wafer is released by releasing the negative pressure or converted into positive pressure. Therefore, the stability and reliability of the internal air pressure of the die bonder suction nozzle is one of the key factors to determine the working accuracy and yield of the die bonder.

[0003] The air pressure detection system of the current mainstream die bonder usually adopts a master-slave RS485 bus communication architecture, which specifically includes:

[0004] a suction nozzle driving unit;

[0005] a die bonder suction nozzle mounted on the suction nozzle driving unit and driven by the suction nozzle driving unit to perform the picking and mounting actions on the chip;

[0006] a master controller serving as a communication master station and integrated with an RS485 master station interface;

[0007] one or more RS485 air pressure detection cards, each of which is installed at the suction nozzle driving unit and arranged close to the corresponding die bonder suction nozzle; wherein each RS485 air pressure detection card serves as an RS485 slave station and is connected with the air path of one or more die bonder suction nozzles through a vacuum air pipe, and is used to collect the air pressure value in the nozzle of the die bonder suction nozzle;

[0008] an RS485 bus (usually a twisted pair line) for communication connecting the master controller to each RS485 air pressure detection card.

[0009] The working process of the existing die bonder is as follows:

[0010] (1) Data acquisition: the RS485 air pressure detection card monitors the air pressure value in the nozzle of the die bonder suction nozzle connected thereto in real time, and converts the analog signal into digital data;

[0011] (2) Data uploading: the RS485 air pressure detection card as a slave station uploads the converted digital data through the RS485 bus after receiving the polling instruction of the master controller (master station);

[0012] (3)Centralized processing and judgment: the main controller receives data from all RS485 air pressure detection cards, performs centralized processing and filtering in the central processing unit, compares with the preset fixed threshold, and finally judges the working state of each die bonding suction nozzle (such as normal, insufficient air pressure, etc.);

[0013] Specifically, in the die bonder, it is impossible to directly observe whether the die bonding suction nozzle can reliably adsorb or release the chip, therefore, the air pressure value in the nozzle is the key indicator to judge its working state. The main controller compares the air pressure value in the nozzle reported by the RS485 air pressure detection card (i.e. the digital data transmitted by the RS485 bus) with the preset threshold, thereby diagnosing the state of the die bonding suction nozzle, and the core judgment is as follows:

[0014] ① Normal: in the pickup stage, the air pressure value in the nozzle rapidly decreases to the target vacuum degree (such as-80kPa); in the mounting stage, the air pressure smoothly recovers to atmospheric pressure (0kPa). This indicates that the adsorption and release actions are accurate and correct;

[0015] ② Insufficient air pressure (insufficient vacuum degree): in the pickup stage, the air pressure value in the nozzle does not reach the target vacuum degree. This indicates that air leakage may occur, the chip may not be sucked up, or the chip may fall off during transportation, etc.

[0016] ③ Excessive air pressure (incomplete pressure relief): in the mounting stage, the air pressure value in the nozzle does not effectively rise. This indicates that the die bonding suction nozzle may not have completely released the chip, resulting in the chip sticking to the die bonding suction nozzle, etc.

[0017] Although the above-mentioned scheme based on RS485 bus is mature in technology and low in cost, with the continuous improvement of the speed and accuracy requirements of the die bonder, the scheme exposes the following difficult-to-overcome technical problems:

[0018] (1) Low communication rate, poor system real-time performance: RS485 bus usually adopts half-duplex communication, and the maximum rate is generally only 10Mbps. The actual effective bandwidth is greatly affected by the number of slave stations and distance, resulting in a long communication period (usually ≥10ms). This makes the feedback of air pressure monitoring have significant delay, and the system cannot respond to air pressure sudden changes in high-speed operation in time.

[0019] (2) Limited anti-interference capability, reliability challenge: in the complex electromagnetic interference environment inside the die bonder, although RS485 bus adopts differential transmission, it still needs to rely on complex shielding and grounding design to ensure communication reliability, otherwise data errors may occur, leading to false alarms or missed detection.

[0020] (3) System rigidity, unable to realize adaptive detection: this is the most core defect. Due to low communication efficiency, the main controller is difficult to adjust the detection parameters (such as alarm threshold, filter coefficient, etc.) of each RS485 air pressure detection card in real time and dynamically according to the different working stages of the die bonder (such as high-speed movement, accurate positioning, picking up, mounting, etc.). The system can only use a set of fixed and compromised parameter settings. The consequence is: in the "picking up" stage which requires high sensitivity, the system may miss the adsorption failure due to insufficient sensitivity of the parameters; in the "high-speed movement" stage with more vibration, the system may produce a large number of false alarms due to the over-sensitivity of the parameters. This contradiction seriously restricts the further improvement of production efficiency and equipment performance.

[0021] Therefore, there is an urgent need in the prior art for a new technical solution to solve the inherent defects of RS485 bus architecture in speed, reliability and flexibility.

[0022] The above information disclosed in the background section is included only to enhance the understanding of the background of the present disclosure, and thus can include information that does not form the prior art that is already known to those of ordinary skill in the art. SUMMARY

[0023] An object of the present application is to provide an EtherCAT communication-based die bonder that can effectively solve the problems of high system false alarm rate and poor flexibility caused by the large communication delay, weak anti-interference ability, and inability to adjust detection parameters in real time of the existing die bonder due to the use of RS485 bus.

[0024] To achieve the above object, the present application provides an EtherCAT communication-based die bonder, comprising:

[0025] a nozzle driving unit;

[0026] a die bonder nozzle mounted on the nozzle driving unit for picking up and mounting chips under the driving of the nozzle driving unit;

[0027] a main controller integrated with an EtherCAT master controller;

[0028] a plurality of EtherCAT air pressure detection cards, each of which is connected to and controls the air pressure and on-off of a plurality of die bonder nozzles through an air path control component, and collects the air pressure value in the corresponding die bonder nozzle; the EtherCAT air pressure detection card is integrated with an EtherCAT slave station controller;

[0029] an EtherCAT bus network that communicatively connects the EtherCAT master controller to each EtherCAT slave station controller;

[0030] The EtherCAT gas pressure detection card is configured to:

[0031] A control word-parameter set mapping table is stored, which defines preset parameter sets corresponding to different stage control words;

[0032] A stage control word indicating a current working stage is obtained from process data periodically sent by the main controller through the EtherCAT bus network;

[0033] Based on the stage control word, the corresponding preset parameter set is called from the control word-parameter set mapping table;

[0034] According to the stage control word and / or the called preset parameter set, a control instruction is generated to control the gas path regulation component corresponding to the die bonding suction nozzle to be regulated, so as to realize the regulation of the in-nozzle gas pressure and the on-off of the gas path;

[0035] Based on the called preset parameter set, the collected in-nozzle gas pressure value is processed locally to generate a state judgment result;

[0036] The judgment result data containing the state judgment result is returned to the main controller through the EtherCAT bus network.

[0037] Optionally, the preset parameter set includes filtering parameters, detection threshold values, trend judgment parameters, and delay parameters;

[0038] The "processing the collected in-nozzle gas pressure value locally based on the called preset parameter set" includes:

[0039] The in-nozzle gas pressure value is sampled multiple times to obtain sampling data;

[0040] The filtering parameters in the preset parameter set are used to filter the sampling data to obtain a real-time gas pressure value;

[0041] According to the trend judgment parameters, the change trend of the real-time gas pressure value is analyzed;

[0042] The comparison result of the real-time gas pressure value and the detection threshold value, and the analysis result of the change trend are integrated, and the effective time of state judgment is determined according to the delay parameters to generate the state judgment result.

[0043] Optionally,

[0044] When the stage control word indicates a wafer picking stage, the corresponding detection threshold value is a first threshold value;

[0045] When the stage control word indicates a high-speed moving stage, the corresponding detection threshold is a second threshold;

[0046] The second threshold is lower than the first threshold.

[0047] Optionally, the stage control word is used to indicate that the die bonding device is in different working stages including standby, die picking, positioning or die bonding.

[0048] Optionally, the stage control word and the judgment result data are transmitted through a process data object communication channel of the EtherCAT bus network.

[0049] The control word-parameter set mapping table is configured or updated by the master controller through a service data object communication channel of the EtherCAT bus network.

[0050] Optionally, the state judgment result is represented by a specific bit in a state word.

[0051] The state word is included in the judgment result data and is used to indicate normal, insufficient air pressure or excessive air pressure.

[0052] Optionally, the communication cycle of the EtherCAT bus network is less than or equal to 1 millisecond.

[0053] Optionally, the EtherCAT air pressure detection card is further configured to:

[0054] When the state judgment result is abnormal, a watchdog timeout mechanism is triggered or a specific alarm bit in the judgment result data is used to alarm the master controller.

[0055] Optionally, the EtherCAT bus network adopts linear topology or ring topology to connect the EtherCAT master controller and each EtherCAT slave controller.

[0056] Optionally, the preset parameter set further includes a response speed parameter.

[0057] The EtherCAT air pressure detection card is configured to:

[0058] According to the current working stage, the response speed of detection is changed by adjusting the response speed parameter, wherein a shorter alarm delay time is set in the die picking or die bonding stage which requires fast response, and a longer alarm delay time is set in the high-speed moving stage which is susceptible to interference to suppress false alarms.

[0059] The beneficial effects of the present application are that a die bonding device based on EtherCAT communication is provided, and the working process is as follows:

[0060] S10: store the control word-parameter set mapping table: the EtherCAT air pressure detection card locally stores a control word-parameter set mapping table, which defines the mapping relationship between different stage control words and corresponding preset parameter sets.

[0061] S20: obtain the stage control word indicating the current working stage: the main controller periodically sends process data through the EtherCAT bus network. The EtherCAT air pressure detection card obtains the stage control word from the process data.

[0062] S30: call the corresponding preset parameter set: the EtherCAT air pressure detection card calls the corresponding preset parameter set from the control word-parameter set mapping table based on the stage control word.

[0063] S40: control the air path: the EtherCAT air pressure detection card generates control instructions according to the stage control word and / or the called preset parameter set, and drives the air path control components (such as electrical proportional valves or pneumatic switches) connected thereto to accurately control the air pressure of the die bonding suction nozzle and the air path on-off.

[0064] S50: generate the state judgment result: the EtherCAT air pressure detection card processes the collected air pressure value in the nozzle locally based on the called preset parameter set, and generates a state judgment result.

[0065] S60: return the judgment result data: the EtherCAT air pressure detection card returns the judgment result data containing the state judgment result to the main controller through the EtherCAT bus network.

[0066] This architecture changes the centralized processing under the traditional RS485 architecture into a distributed control and intelligent detection processing. By realizing real-time control of the air path, autonomous mapping of parameters and local judgment of the state on each EtherCAT air pressure detection card, and replacing the communication backbone with a high-speed EtherCAT bus network, the problem of asynchronous control instructions and detection feedback, slow system response and inability to adjust parameters in real time caused by large RS485 communication delay is fundamentally solved, laying a hardware foundation for realizing high-precision adaptive die bonding process. BRIEF DESCRIPTION OF DRAWINGS

[0067] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0068] Figure 1 The structure schematic diagram of the die bonding equipment based on EtherCAT communication provided for the embodiments.

[0069] In the drawings:

[0070] 1, die bonding nozzle;

[0071] 2, main controller;

[0072] 3, EtherCAT air pressure detection card;

[0073] 4, EtherCAT bus network;

[0074] 5, air path regulation component. DETAILED DESCRIPTION

[0075] In the present application, the term "embodiment" means that the specific features, structures or properties described in connection with the embodiments can be included in at least one embodiment of the present application. The term "embodiment" appearing at various places in the specification does not necessarily refer to the same embodiment, and does not particularly limit the independence or association between other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, each technical feature mentioned in each embodiment can be combined in any way to form a corresponding implementable technical solution.

[0076] Unless otherwise defined, the meanings of the technical terms used herein are the same as those commonly understood by those skilled in the art to which the present application belongs; the use of related terms herein is only for the purpose of describing specific embodiments, and is not intended to limit the present application.

[0077] In the description of the present application, the phrase "and / or" is a description of the logical relationship between the objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this paper generally represents that the associated objects before and after are a kind of "or" logical relationship.

[0078] In the present application, the terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, primary and secondary or order relationship between the entities or operations.

[0079] In the present application, the terms "comprising", "containing", "having", or other similar phrases, used in the description of the present application, without more limitations, are intended to cover the non-exclusive inclusion, and the terms do not exclude the presence of additional elements in the process, method or product comprising the elements, so that the process, method or product comprising a series of elements can not only include those defined elements, but also include other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0080] As the same understanding as in the "Guidelines for Examination", in the present application, the terms "greater than", "less than", "exceeding", etc. are understood as not including the number; the terms "above", "below", "within", etc. are understood as including the number. In addition, in the description of the embodiments of the present application, the meaning of "multiple" is more than two (including two), and similar terms related to "multiple" are also understood in this way, for example, "multiple groups", "multiple times", etc. unless otherwise explicitly specified.

[0081] In the description of the embodiments of the present application, the spatial-related terms used, such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "perpendicular", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. The indicated orientation or position relationship is based on the orientation or position relationship shown in the specific embodiment or the drawing, and is only for the convenience of describing the specific embodiment of the present application or for the reader to understand, and does not indicate or imply that the indicated device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0082] Unless otherwise explicitly specified or limited, in the description of the embodiments of the present application, the terms "mounting", "connecting", "connecting", "fixing", "setting", etc. should be understood broadly. For example, the "connection" can be a fixed connection, or a detachable connection, or an integral setting; it can be a mechanical connection, or an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art to which the present application belongs, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0083] The present application aims to provide an EtherCAT communication-based die bonding equipment, which can effectively solve the problems of large communication delay, weak anti-interference ability, high system false alarm rate caused by the inability to adjust the detection parameters in real time, poor flexibility, etc. of the existing die bonder due to the use of RS485 bus.

[0084] Referring to Figure 1 The hardware basis of the die bonding equipment based on EtherCAT communication provided by the embodiment includes a suction nozzle driving unit, a die bonding suction nozzle 1, a main controller 2, a plurality of EtherCAT air pressure detection cards 3, an EtherCAT bus network 4, and an air path regulation assembly 5.

[0085] The die bonding suction nozzle 1 is installed on the suction nozzle driving unit, which accurately controls the motion trajectory of the die bonding suction nozzle 1, so that the die bonding suction nozzle 1 performs the actions of picking up and placing chips. The main controller 2 serves as the control core of the system and integrates an EtherCAT master controller. Each EtherCAT air pressure detection card 3 serves as an EtherCAT slave station, integrates an EtherCAT slave station controller, and is in communication with one or more die bonding suction nozzles 1 through a vacuum air pipe, and is responsible for collecting the air pressure values in the nozzles of the die bonding suction nozzles 1. The EtherCAT master controller and all EtherCAT slave station controllers are connected through the EtherCAT bus network 4.

[0086] Optionally, the suction nozzle driving unit is a rotary swing arm rotating around the Z axis, a bidirectional direct drive module, or an XYZ three-direction direct drive module, etc.

[0087] Optionally, each EtherCAT air pressure detection card 3 is installed and fixed on the suction nozzle driving unit and arranged close to the corresponding die bonding suction nozzle 1.

[0088] The EtherCAT air pressure detection card 3 is configured to:

[0089] store a control word-parameter set mapping table, the control word-parameter set mapping table defining a preset parameter set corresponding to a different stage control word;

[0090] from the process data periodically sent by the main controller 2 through the EtherCAT bus network 4, a stage control word indicating a current working stage is obtained;

[0091] based on the stage control word, the corresponding preset parameter set is called from the control word-parameter set mapping table;

[0092] according to the stage control word and / or the called preset parameter set, a control instruction is generated to control the air path regulation assembly corresponding to the die bonding suction nozzle 1 to be regulated, so as to realize the regulation of the air pressure in the nozzle and the air path on-off;

[0093] based on the called preset parameter set, the collected air pressure values in the nozzle are processed locally to generate a state judgment result;

[0094] The judgment result data containing the state judgment result is returned to the main controller 2 through the EtherCAT bus network 4.

[0095] In the present application, the EtherCAT air pressure detection card 3 is configured with an intelligent work flow, which realizes integrated distributed processing of air path control and air pressure detection judgment, and specifically includes the following steps:

[0096] S10: Store the control word-parameter set mapping table: the EtherCAT air pressure detection card 3 locally stores a control word-parameter set mapping table, which defines the mapping relationship between different stage control words and corresponding preset parameter sets.

[0097] S20: Obtain the stage control word indicating the current working stage: the main controller 2 periodically sends process data through the EtherCAT bus network 4. The EtherCAT air pressure detection card 3 obtains the stage control word from the process data.

[0098] S30: Call the corresponding preset parameter set: the EtherCAT air pressure detection card 3 calls the corresponding preset parameter set from the control word-parameter set mapping table based on the stage control word.

[0099] S40: Air path regulation: the EtherCAT air pressure detection card 3 generates control instructions according to the stage control word and / or the called preset parameter set, drives the air path regulation components (such as electrical proportional valves or pneumatic switches) connected thereto, to accurately control the air pressure of the die bonding suction nozzle 1 and the air path on-off.

[0100] S50: Generate state judgment result: the EtherCAT air pressure detection card 3 processes the collected mouth air pressure value locally based on the called preset parameter set, and generates a state judgment result.

[0101] S60: Return the judgment result data: the EtherCAT air pressure detection card 3 returns the judgment result data containing the state judgment result to the main controller 2 through the EtherCAT bus network 4.

[0102] The architecture changes centralized processing under the traditional RS485 architecture into processing integrating distributed control and intelligent detection. By realizing real-time control of the gas circuit, autonomous mapping of parameters and local judgment of states on each EtherCAT gas pressure detection card 3, and replacing the communication backbone with a high-speed EtherCAT bus network 4, the problem of asynchronization of control instructions and detection feedback, slow system response and inability to adjust parameters in real time caused by large RS485 communication delay is fundamentally solved, laying a hardware foundation for realizing a high-precision adaptive die bonding process.

[0103] Therefore, the die bonding equipment based on EtherCAT communication provided by the application can effectively solve the problems of high system false alarm rate, poor flexibility and the like caused by large communication delay, weak anti-interference ability and inability to adjust detection parameters in real time of the existing die bonder due to the use of the RS485 bus.

[0104] In the embodiment, the preset parameter set includes filtering parameters, detection threshold values, trend judgment parameters and delay parameters;

[0105] The "processing, based on the called preset parameter set, of the collected mouth air pressure values locally" includes:

[0106] S501: sampling the mouth air pressure values multiple times to obtain sampling data;

[0107] S502: filtering the sampling data by using the filtering parameters in the preset parameter set to obtain real-time air pressure values;

[0108] S503: analyzing the change trend of the real-time air pressure values according to the trend judgment parameters;

[0109] S504: comprehensively processing the comparison result of the real-time air pressure values and the detection threshold values and the analysis result of the change trend, and determining the effective time of state judgment according to the delay parameters to generate the state judgment result.

[0110] The above processing steps realize local intelligent judgment through the cooperation of multiple parameters in the preset parameter set:

[0111] (1) Filtering parameters: used for noise reduction processing of the sampling data to ensure the reliability of the basic data.

[0112] (2) Detection threshold values: used as a reference for judging the absolute value of the air pressure.

[0113] (3) Trend judgment parameters: used for analyzing the change trend (such as the amplitude and rate of rise or fall) of the air pressure, and taking the trend information as an important criterion to effectively avoid misjudgment caused by fluctuations in the air source pressure.

[0114] (4) Delay parameter: used to control the timing of state judgment, effectively suppress false alarms caused by transient interference pulses by avoiding the unstable stage of air pressure in the initial stage of mouth movement.

[0115] In the above steps, the set of preset parameters as a whole of collaborative decision-making, gives EtherCAT air pressure detection card 3 higher intelligent judgment ability. It not only compares the threshold, but also can dynamically analyze the change process of air pressure based on trend judgment parameter (for example, in the crystal taking stage, even if the absolute value of air pressure is low due to air source fluctuation, as long as its rising trend meets the requirements, it can be determined as successful adsorption), and set the best judgment time according to the delay parameter (for example, ignore the short-term fluctuation in the initial stage of adsorption, and make the final judgment after the air pressure is stable), so as to effectively suppress false alarm.

[0116] This "sampling-filtering-dynamic analysis and delay decision" whole process completed on EtherCAT air pressure detection card 3 greatly reduces the operation burden of main controller 2, and maximally shortens the response time from detection to judgment, realizes the microsecond level, high reliability and real-time response.

[0117] Optionally, the stage control word is sent by the main controller 2, which is used to indicate the current working stage of the die bonding equipment based on EtherCAT communication. These stages include but are not limited to standby, crystal taking, positioning and mounting.

[0118] By binding the stage control word with the specific process stage (standby, crystal taking, positioning, mounting), the parameter switching of the EtherCAT air pressure detection card 3 has a clear direction, which ensures that the adaptive detection function can accurately and reliably integrate into the whole working process of the die bonder, and enhances the systematicness and practicality of the scheme.

[0119] Further, the adaptive adjustment function of the detection threshold of the EtherCAT air pressure detection card 3:

[0120] When the stage control word indicates the crystal taking stage, the EtherCAT air pressure detection card 3 will use the first threshold as the current detection threshold;

[0121] When the stage control word indicates the high-speed moving stage, the EtherCAT air pressure detection card 3 uses the second threshold as the current detection threshold, and the second threshold is lower than the first threshold.

[0122] Thus, the detection strategy is accurately matched with the process requirement. In the key wafer picking stage, the first threshold with higher absolute value is used to ensure that the slight air pressure leakage can be captured to prevent missing detection. In the high-speed moving stage with greater interference, the second threshold with lower absolute value is used to effectively suppress false alarms caused by vibration and the like. This directly solves the contradiction between false alarms and missing detection caused by parameter rigidity, and significantly improves the overall efficiency of the equipment.

[0123] In the embodiment, the stage control word and the judgment result data are transmitted through a process data object communication channel of the EtherCAT bus network 4; the process data object communication channel is used to transmit periodic data with high real-time requirement, and the transmission process protocol overhead is extremely small, and the data is directly embedded in the EtherCAT data frame, so that the microsecond-level delay of the instruction and the state feedback is ensured.

[0124] The control word-parameter set mapping table is configured or updated by the main controller 2 through a service data object communication channel of the EtherCAT bus network 4. The service data object communication channel adopts a request-response mechanism and is used to transmit non-periodic configuration parameters or diagnostic information that need to ensure integrity and reliability.

[0125] The above clearly shows the shunt transmission strategy of high-speed real-time data and reliable configuration data. The process data object communication channel is used to ensure the high efficiency and high real-time performance of the control and state update, and meets the high-speed operation requirement of the die bonding equipment. The service data object communication channel is used to ensure the accuracy of the parameter configuration, and provides flexible adaptation ability for the system.

[0126] In the embodiment, the state judgment result is represented by a specific bit in a state word. The state word is a data unit with a predefined data structure, which is included in the judgment result data returned to the main controller 2. By setting the specific bit in different positions of the state word (for example, the 0th bit represents normal, the 1st bit represents insufficient air pressure, and the 2nd bit represents excessive air pressure), a variety of device states and detection results can be clearly and efficiently encoded.

[0127] It can be understood that the encoding mode of the state word and the specific bit greatly simplifies the data amount of the judgment result data. Compared with transmitting complete diagnostic descriptions or lengthy error codes, this bit encoding mode only needs a few binary bits to convey rich state information, significantly reduces the communication load of the EtherCAT bus network 4, and further improves the real-time performance and scalability of the system.

[0128] In this embodiment, the communication cycle of the EtherCAT bus network 4 is less than or equal to 1 millisecond. The communication cycle refers to the time required for the master controller 2 to send process data to all slaves and retrieve input data from all slaves via the EtherCAT bus network 4. Thanks to the efficient hardware processing mechanism of the EtherCAT protocol, its communication cycle can easily reach the level of 100 microseconds to 1 millisecond or even shorter. Further shortening the communication cycle from the level of tens of milliseconds in the traditional RS485 scheme to the sub-millisecond level means that the monitoring frequency of the system on the state of the die bonding nozzle 1 gas pressure is increased by tens of times. This enables the system to respond to gas pressure mutations in near real time, providing a fundamental guarantee for accurate real-time control and high-frequency data acquisition.

[0129] Optionally, the EtherCAT gas pressure detection card 3 is further configured to:

[0130] When the state judgment result is abnormal, triggering the watchdog timeout mechanism or alarming the master controller 2 through a specific alarm bit in the judgment result data.

[0131] When the state judgment result is abnormal, the master controller 2 is alarmed through two mechanisms. The first is to trigger the watchdog timeout mechanism. If the master controller 2 stops sending periodic data frames due to failure, the watchdog timer of the slave will timeout, triggering a hardware alarm. The second is to set a specific alarm bit in the state word of the judgment result data to indicate an abnormal state.

[0132] This dual alarm mechanism constitutes the last line of defense of the system. The watchdog timeout mechanism provides independent hardware protection for master station or communication link failure. The specific alarm bit set through the data channel is used to report the abnormality of the gas pressure function of the device. The combination of the two mechanisms ensures that the system can be notified in time and reliably in any abnormal situation, so that safety measures can be taken to avoid the expansion of failure, significantly improving the intrinsic safety of the device.

[0133] In this embodiment, the EtherCAT bus network 4 connects the EtherCAT master controller and each EtherCAT slave controller in a linear topology or a ring topology.

[0134] In linear topology, data frames are passed from one station to the next, and finally back to the master. In ring topology, the physical connection forms a closed loop, providing redundant paths. Defining linear topology or ring topology is the best practice for typical EtherCAT applications. These two topologies are simple to wire and are particularly suitable for EtherCAT's "fly-by" data processing mechanism, which can minimize communication delay. In particular, ring topology, when a circuit is broken at a certain point in the line, communication can still be maintained, greatly enhancing the reliability and availability of the system, meeting the high requirements of equipment stability in industrial field.

[0135] In the embodiment, the preset parameter set further includes a response speed parameter;

[0136] The EtherCAT air pressure detection card 3 is configured to:

[0137] According to the current working stage, the response speed of detection is changed by adjusting the response speed parameter. Specifically, in the wafer picking stage or the mounting stage which requires fast response, the system sets a shorter alarm delay to achieve instantaneous response; in the high-speed moving stage which is susceptible to interference, a longer alarm delay is set to suppress false alarms caused by transient interference pulses.

[0138] The introduction of the response speed parameter makes the adaptive detection strategy more perfect and fine. It allows the system to dynamically adjust the "agility" of detection at different stages, rather than just adjusting the "sensitivity" (threshold) of detection. This achieves a better balance between false alarms and response speed, further optimizing the contradictory "false alarm rate" and "missed detection rate", so that the equipment can maintain optimal detection performance under complex working conditions.

[0139] In specific implementation, the master controller 2 serves as the control core of the die bonding equipment, and its hardware foundation generally includes but is not limited to: central processing unit (CPU), read-only memory (ROM), random access memory (RAM), and necessary input / output interfaces. The EtherCAT master controller can exist in the form of an independent communication coprocessor chip, or be integrated as an IP core in the system-level chip of the master controller 2.

[0140] Likewise, the EtherCAT air pressure detection card 3, in addition to the core EtherCAT slave controller, air pressure sensor and microprocessor, should also be understood to necessarily include common knowledge components necessary to implement its basic functions, such as: power management circuit for powering the sensor, signal conditioning circuit for amplifying and conditioning the raw signal of the air pressure sensor, non-volatile memory (such as EEPROM) for storing the control word-parameter set mapping table, and air path interface for connecting the vacuum air pipe and physical port for connecting the EtherCAT bus network 4. Those skilled in the art can understand that the specific selection and circuit design of the above components belong to the common knowledge in the art, and can be configured according to actual application requirements.

[0141] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of the present application, the patent protection scope of the present application should not be limited thereby. Any technical solutions obtained by replacing or modifying the equivalent structure or equivalent process based on the essential concept of the present application, using the content described in the specification and drawings of the present application, and directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, etc., are all included in the patent protection scope of the present application.

Claims

1. An EtherCAT communication-based die bonding apparatus, characterized by comprising: The device comprises: a nozzle driving unit; a die bonding nozzle (1) mounted on the nozzle driving unit and used to perform picking and placing actions on a chip under the driving of the nozzle driving unit; a main controller (2) integrated with an EtherCAT master controller; a plurality of EtherCAT air pressure detection cards (3), each of which is connected to and controls the air pressure and on-off of a plurality of die bonding nozzles (1) through an air path control component and collects the air pressure value in the nozzle corresponding to the die bonding nozzle (1); the EtherCAT air pressure detection card (3) is integrated with an EtherCAT slave station controller; an EtherCAT bus network (4) that communicatively connects the EtherCAT master controller to each EtherCAT slave station controller; wherein the EtherCAT air pressure detection card (3) is configured to: store a control word-parameter set mapping table that defines a preset parameter set corresponding to a different stage control word; obtain a stage control word indicating a current working stage from process data periodically sent by the main controller (2) through the EtherCAT bus network (4); call the corresponding preset parameter set from the control word-parameter set mapping table based on the stage control word; generate a control instruction based on the stage control word and / or the called preset parameter set to control the air path control component corresponding to the die bonding nozzle (1) to be controlled, so as to adjust the air pressure in the nozzle and the air path on-off; based on the called preset parameter set, process the collected air pressure value in the nozzle locally to generate a state judgment result; return the judgment result data containing the state judgment result to the main controller (2) through the EtherCAT bus network (4).

2. The equipment based on EtherCAT communication for die bonding according to claim 1, wherein, The preset parameter set includes filtering parameters, detection threshold values, trend judgment parameters, and delay parameters. The "processing the collected air pressure value in the nozzle locally based on the called preset parameter set" includes: sampling the air pressure value multiple times to obtain sampling data; filtering the sampling data using the filtering parameters in the preset parameter set to obtain a real-time air pressure value; analyzing the change trend of the real-time air pressure value according to the trend judgment parameters; comprehensively analyzing the comparison result of the real-time air pressure value and the detection threshold value and the analysis result of the change trend, and determining the effective time of state judgment according to the delay parameters to generate the state judgment result.

3. The die bonding device based on EtherCAT communication according to claim 2, wherein: when the stage control word indicates a picking stage, the corresponding detection threshold value is a first threshold value; when the stage control word indicates a high-speed moving stage, the corresponding detection threshold value is a second threshold value; wherein the second threshold value is lower than the first threshold value.

4. The equipment based on EtherCAT communication according to claim 3, wherein, The stage control word is used to indicate that the die bonding device is in different working stages including standby, picking, positioning, or placing.

5. The equipment based on EtherCAT communication according to claim 1, wherein, The phase control word and the judging result data are transmitted through a process data object communication channel of the EtherCAT bus network (4); The control word-parameter set mapping table is configured or updated by the master controller (2) through a service data object communication channel of the EtherCAT bus network (4).

6. The equipment based on EtherCAT communication according to claim 1, wherein, The state judging result is represented by a specific bit in a state word; The state word is included in the judging result data, and is used to indicate normal, insufficient air pressure or excessive air pressure.

7. The equipment based on EtherCAT communication according to claim 1, wherein, The communication cycle of the EtherCAT bus network (4) is less than or equal to 1 millisecond.

8. The equipment based on EtherCAT communication according to claim 1, wherein, The EtherCAT air pressure detection card (3) is further configured to: When the state judging result is abnormal, triggering a watchdog timeout mechanism or alarming the master controller (2) through a specific alarm bit in the judging result data.

9. The equipment based on EtherCAT communication according to claim 1, wherein, The EtherCAT bus network (4) connects the EtherCAT master controller and each EtherCAT slave controller in a linear topology or a ring topology.

10. The equipment based on EtherCAT communication according to claim 1, wherein, The preset parameter set further includes a response speed parameter; The EtherCAT air pressure detection card (3) is configured to: According to the current working phase, the response speed of detection is changed by adjusting the response speed parameter, wherein a shorter alarm delay time is set in the wafer picking or mounting phase which requires fast response, and a longer alarm delay time is set in the high-speed moving phase which is susceptible to interference to suppress false alarms.

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