Transfer substrate, two-dimensional material transfer device and two-dimensional material transfer method

Abstract

The invention provides a transfer substrate, a two-dimensional material transfer device and a two-dimensional material transfer method, and relates to the technical field of semiconductor film material processing and preparation. The transfer substrate comprises a transparent substrate, a photo-thermal conversion layer, a photo-thermal release layer and a bonding layer, the photo-thermal conversion layer at least exposes part of the transparent substrate, and the orthographic projection of the bonding layer on the transparent substrate is overlapped with the orthographic projection of the photo-thermal conversion layer on the transparent substrate. In this way, the alignment condition of the two-dimensional material and the target substrate can be detected through the area where the photothermal conversion layer is not arranged, and therefore high-precision non-contact fixed-point transfer is achieved.

Description

Technical Field

[0001] This application relates to the field of semiconductor thin film material processing and preparation technology, and more specifically, to a transfer substrate, a two-dimensional material transfer device, and a two-dimensional material transfer method. Background Technology

[0002] Two-dimensional materials are materials in which electrons can move freely in only two dimensions at the nanoscale (planar motion), including but not limited to nanofilms, superlattices, and quantum wells. Due to their excellent electrical conductivity, thermal conductivity, and mechanical strength, they exhibit enormous application potential in nanoelectronics, optoelectronics, semiconductors, and electronic materials—fields involved in device fabrication. However, how to transfer two-dimensional materials from a growth substrate to a target substrate has become a pressing problem for researchers in this field. Existing transfer methods face challenges such as low transfer efficiency, small transfer area, and susceptibility to material damage. Summary of the Invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a transfer substrate, a two-dimensional material transfer device, and a two-dimensional material transfer method.

[0004] In a first aspect, embodiments of this application provide a two-dimensional material transfer device, the two-dimensional material transfer device comprising a transparent substrate, a photothermal conversion layer, a photothermal release layer and an adhesive layer, wherein the side of the transparent substrate is a light-transmitting side; The photothermal conversion layer is located on one side of the transparent substrate, and the photothermal conversion layer exposes at least a portion of the transparent substrate. The photothermal conversion layer is used to absorb light energy and convert the light energy into heat energy, which is then transferred to the photothermal release layer. The photothermal conversion layer is located on the periphery of the photothermal conversion layer and on the side of the photothermal conversion layer away from the transparent substrate. The photothermal release layer is used to decompose into gas under the action of thermal energy to transfer the two-dimensional material located on the adhesive layer to the target substrate. The orthographic projection of the adhesive layer on the transparent substrate overlaps with the orthographic projection of the photothermal conversion layer on the transparent substrate, and the adhesive layer is used to bond the two-dimensional material to be transferred.

[0005] In one possible implementation, the transfer substrate further includes a metal layer; The metal layer is located between the photothermal release layer and the adhesive layer, and the metal layer is used to block the heat energy generated by the photothermal conversion layer from passing through the photothermal release layer.

[0006] In one possible implementation, the orthographic projection of the metal layer onto the transparent substrate coincides with the orthographic projection of the photothermal conversion layer onto the transparent substrate.

[0007] In one possible implementation, the material of the photothermal conversion layer includes a tungsten-titanium alloy, and the thickness of the photothermal conversion layer is 200nm-400nm in the direction perpendicular to the transparent substrate. The photothermal emission layer is made of polyphthalamide, and its thickness is 40 nm-60 nm in the direction perpendicular to the transparent substrate.

[0008] In one possible implementation, the material of the metal layer includes copper and chromium; The thickness of the metal layer is 50nm-200nm in the direction perpendicular to the transparent substrate.

[0009] In one possible implementation, the transparent substrate is made of materials including quartz and sapphire.

[0010] Secondly, embodiments of this application also provide a two-dimensional material transfer device, applied to the transfer substrate described in any one of the first aspects; The two-dimensional material transfer device includes a light-emitting unit, an imaging unit, and a support platform. The support platform includes a first support platform and a second support platform arranged opposite to each other. The first support platform is used to fix the transfer substrate, and the second support platform is used to fix the target substrate. The light-emitting unit and the imaging unit are located on the side of the first support platform away from the second support platform, and the light-emitting direction of the light-emitting unit is towards the light-transmitting side of the transfer substrate; The imaging unit is used to detect the alignment deviation between the two-dimensional material and the target substrate; The first support platform and the second support platform are used to adjust the relative position of the transfer substrate and the target substrate based on the alignment deviation detected by the imaging unit.

[0011] Thirdly, embodiments of this application also provide a two-dimensional material transfer method, applied to the two-dimensional material transfer apparatus described in the second aspect, the method comprising: The transfer substrate is fixed by the first support platform, and the two-dimensional material to be transferred is bonded by the adhesive layer of the transfer substrate. The alignment deviation between the two-dimensional material and the target substrate is detected by the imaging unit. Based on the alignment deviation detected by the imaging unit, the relative position between the transfer substrate and the target substrate is adjusted until the alignment deviation between the two-dimensional material and the target substrate is less than a preset deviation. The transparent layer of the transfer substrate is irradiated by the light-emitting unit, causing the photothermal release layer to decompose into gas, thereby transferring the two-dimensional material located on the adhesive layer to the target substrate.

[0012] In one possible implementation, prior to the step of adsorbing the transfer substrate via the first support platform and adhering the two-dimensional material to be transferred via the adhesive layer of the transfer substrate, the method further includes a step of fabricating the transfer substrate, which includes: Provide a transparent substrate; A photothermal conversion layer is formed on one side of the transparent substrate, wherein the photothermal conversion layer exposes at least a portion of the transparent substrate, and the photothermal conversion layer is used to absorb light energy and convert the light energy into heat energy and transfer it to the photothermal release layer; A photothermal release layer is formed on the periphery of the photothermal conversion layer and on the side of the photothermal conversion layer away from the transparent substrate. The photothermal release layer is used to decompose into gas under the action of thermal energy to transfer the two-dimensional material located on the adhesive layer to the target substrate. An adhesive layer is formed on the side of the photothermal release layer away from the transparent substrate, wherein the orthographic projection of the adhesive layer on the transparent substrate overlaps with the orthographic projection of the photothermal conversion layer on the transparent substrate, and the adhesive layer is used to bond the two-dimensional material to be transferred.

[0013] In one possible implementation, prior to the step of forming an adhesive layer on the side of the photothermal release layer away from the transparent substrate, the method further includes a step of forming a metal layer, which includes: A metal material layer is formed on the side of the photothermal release layer away from the transparent substrate by magnetron sputtering or electron beam thermal evaporation. The metal material layer is etched to obtain a metal layer, wherein the orthographic projection of the metal layer on the transparent substrate coincides with the orthographic projection of the photothermal conversion layer on the transparent substrate.

[0014] Based on any of the above aspects, the transfer substrate, two-dimensional material transfer device, and two-dimensional material transfer method provided in the embodiments of this application include a transparent substrate, a photothermal conversion layer, a photothermal release layer, and an adhesive layer. The photothermal conversion layer exposes at least a portion of the transparent substrate, and the orthographic projection of the adhesive layer on the transparent substrate overlaps with the orthographic projection of the photothermal conversion layer on the transparent substrate. In this way, the alignment of the two-dimensional material with the target substrate can be detected through the area where the photothermal conversion layer is not provided, thereby achieving high-precision non-contact point transfer. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of the structure of a transfer substrate provided in an embodiment of this application. Figure 1 ; Figure 2 A schematic diagram of the structure of a transfer substrate provided in an embodiment of this application. Figure 2 ; Figure 3 A schematic diagram of the structure of a two-dimensional material transfer device provided in an embodiment of this application; Figure 4 A schematic flowchart of a two-dimensional material transfer method provided in an embodiment of this application; Figure 5 for Figure 4 Corresponding process flow diagram; Figure 6 A schematic diagram of a sub-process of the two-dimensional material transfer method provided in the embodiments of this application; Figure 7 for Figure 6 The corresponding process flow diagram. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0020] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0023] To address the problems in the existing technology, please refer to... Figure 1 This application provides a transfer substrate 10, which includes a transparent substrate 110, a photothermal conversion layer 120, a photothermal release layer 130, and an adhesive layer 140. The transparent substrate 110 is located on a light-transmitting side, and the adhesive layer 140 is located on an adhesive side. The transfer substrate 10 can adhere the two-dimensional material to be transferred via the adhesive side. The transparent substrate 110 is made of materials including, but not limited to, quartz, sapphire, etc.

[0024] The photothermal conversion layer 120 can be located on one side of the transparent substrate 110, and the photothermal conversion layer 120 exposes at least a portion of the transparent substrate 110. The orthographic projection of the photothermal conversion layer 120 on the transparent substrate 110 lies within the orthographic projection of the photothermal release layer 130 on the transparent substrate 110. That is, the photothermal release layer 130 is located on the side of the photothermal conversion layer 120 away from the transparent substrate 110 and on the periphery of the photothermal conversion layer 120. The orthographic projection of the adhesive layer 140 on the transparent substrate 110 overlaps with the orthographic projection of the photothermal conversion layer 120 on the transparent substrate 110, so as to reduce the energy required to peel off the adhesive layer 140 and the peeling difficulty, and improve the transfer efficiency and yield.

[0025] The adhesive layer 140 not only effectively bonds the two-dimensional material but also provides good support for it, preventing wrinkles and curling during transfer. The photothermal conversion layer 120 absorbs light energy and converts it into heat energy, which is then transferred to the photothermal release layer 130. Under the influence of heat, the photothermal release layer 130 decomposes into gas, propelling the two-dimensional material on the adhesive layer 140 to the target substrate. The adhesive layer 140 can also slowly evaporate at high temperatures, reducing adhesive residue and enabling a non-contact, residue-free transfer process for two-dimensional materials.

[0026] The orthographic projection shape of the photothermal conversion layer 120 onto the transparent substrate 110 includes, but is not limited to, a rectangle or a circle, wherein the size of the orthographic projection shape of the photothermal conversion layer 120 onto the transparent substrate 110 is 50μm-200μm. For example, the size of the orthographic projection shape of the photothermal conversion layer 120 onto the transparent substrate 110 is 50nm, 55nm, 60nm, 80nm, 100nm, 120nm, 150nm, 170nm, 190nm, 195nm, and 200nm, etc. Preferably, the size of the orthographic projection shape of the photothermal conversion layer 120 onto the transparent substrate 110 is 250nm. The material of the photothermal conversion layer 120 includes, but is not limited to, tungsten-titanium alloy, and the thickness of the photothermal conversion layer 120 in the direction perpendicular to the transparent substrate 110 is 200nm-400nm. For example, the thickness of the photothermal conversion layer 120 in the direction perpendicular to the transparent substrate 110 is 200nm, 210nm, 230nm, 250nm, 300nm, 350nm, 380nm, 390nm and 400nm, etc. Preferably, the thickness of the photothermal conversion layer 120 in the direction perpendicular to the transparent substrate 110 is 300nm.

[0027] The material of the photothermal emission layer 130 includes, but is not limited to, polyphthalamide (PPA). The thickness of the photothermal emission layer 130 in the direction perpendicular to the transparent substrate 110 is 40 nm to 60 nm. For example, the thickness of the photothermal emission layer 130 in the direction perpendicular to the transparent substrate 110 is 40 nm, 41 nm, 43 nm, 45 nm, 50 nm, 55 nm, 58 nm, 59 nm, and 60 nm, etc. Preferably, the thickness of the photothermal emission layer 130 in the direction perpendicular to the transparent substrate 110 is 50 nm.

[0028] The material of the adhesive layer 140 includes, but is not limited to, polypropylene carbonate (PPC), and the thickness of the adhesive layer 140 in the direction perpendicular to the transparent substrate 110 is 300nm-600nm. For example, the thickness of the adhesive layer 140 in the direction perpendicular to the transparent substrate 110 is 300nm, 310nm, 330nm, 350nm, 400nm, 450nm, 500nm, 550nm, 580nm, 590nm, and 600nm, etc. Preferably, the thickness of the adhesive layer 140 in the direction perpendicular to the transparent substrate 110 is 450nm.

[0029] In the above structure, the photothermal conversion layer 120 exposes at least a portion of the transparent substrate 110, and the orthographic projection of the adhesive layer 140 on the transparent substrate 110 overlaps with the orthographic projection of the photothermal conversion layer 120 on the transparent substrate 110. In this way, the alignment of the two-dimensional material with the target substrate can be detected in the area where the photothermal conversion layer 120 is not provided, thereby achieving high-precision non-contact point transfer.

[0030] The inventors also discovered that during the process of the photothermal conversion layer 120 releasing heat energy to the photothermal release layer 130 to decompose it into gas, if the heat energy released by the photothermal conversion layer 120 exceeds the absorption threshold of the photothermal release layer 130, the excessive heat energy may penetrate the photothermal release layer 130 and directly act on the two-dimensional material located on the adhesive layer 140, thereby damaging the two-dimensional material.

[0031] To solve the above problems, please refer to... Figure 2 The transfer substrate 10 provided in this application further includes a metal layer 150, which is located between the photothermal release layer 130 and the adhesive layer 140. The metal layer 150 can block the heat generated by the photothermal conversion layer 120 from passing through the photothermal release layer 130. Furthermore, since the metal layer 150 has poor light transmittance, to facilitate the detection of the alignment between the two-dimensional material and the target substrate, the orthographic projection of the metal layer 150 on the transparent substrate 110 coincides with the orthographic projection of the photothermal conversion layer 120 on the transparent substrate 110. The material of the metal layer 150 may include copper, chromium, etc., and the thickness of the metal layer 150 in the direction perpendicular to the transparent substrate 110 is 50nm-200nm. For example, in the direction perpendicular to the transparent substrate 110, the thickness of the metal layer 150 is 50nm, 55nm, 60nm, 70nm, 100nm, 150nm, 180nm, 190nm, 195nm and 200nm, etc. Preferably, in the direction perpendicular to the transparent substrate 110, the thickness of the metal layer 150 is 125nm.

[0032] In this embodiment, a metal layer 150 is disposed between the photothermal release layer 130 and the adhesive layer 140, and the orthographic projection of the metal layer 150 on the transparent substrate 110 coincides with the orthographic projection of the photothermal conversion layer 120 on the transparent substrate 110. This not only reduces the energy required to peel off the adhesive layer 140 and the peeling difficulty, and improves the transfer accuracy and efficiency, but also blocks the heat generated by the photothermal conversion layer 120 from passing through the photothermal release layer 130, thus preventing the heat generated by the photothermal conversion layer 120 from damaging the two-dimensional material.

[0033] Based on the same inventive concept, please refer to Figure 3 This application also provides a two-dimensional material transfer device 30, which includes a light-emitting unit 310, an imaging unit 320, and a support platform 330. The support platform 330 includes a first support platform 331 and a second support platform 332 disposed opposite to each other. The first support platform 331 is used to adsorb the transfer substrate 10 in any of the above embodiments, and the second support platform 332 is used to adsorb the target substrate 220.

[0034] The light-emitting unit 310 and the imaging unit 320 can be located on the side of the first support platform 331 away from the second support platform 332. The light-emitting unit 310 emits light towards the light-transmitting side of the transfer substrate 10 to provide light energy to the transfer substrate 10. The light-emitting unit 310 includes a laser light source or a xenon lamp light source. For example, the light-emitting unit 310 may include an infrared laser 311 and a matching optical path 312.

[0035] The imaging unit 320 can detect the alignment deviation between the two-dimensional material and the target substrate 220 in areas of the transfer substrate 10 where the photothermal conversion layer 120 is not provided. This allows for adjustment of the relative positions of the transfer substrate 10 and the target substrate 220 via the first support platform 331 and the second support platform 332, achieving precise transfer of the two-dimensional material and improving transfer accuracy. The imaging unit 320 may include an image acquisition subunit 321, an image recognition subunit 322, and a microscopy subunit 323. The image acquisition unit 321 can capture images of the transfer substrate 10 and the target substrate 220 in areas of the transfer substrate 10 where the photothermal conversion layer 120 is not provided, and the image recognition subunit 322 obtains the alignment deviation between the transfer substrate 10 and the target substrate 220. The microscopy subunit 323... Exemplarily, the imaging unit 320 may include a CCD imaging component, a unique microscope, and a computer including an image recognition algorithm.

[0036] Based on the same inventive concept, this application also provides a two-dimensional material transfer method that can be applied to a two-dimensional material transfer device 30. Please refer to [link / reference] for details. Figure 4 and Figure 5 , Figure 4 This is a flowchart illustrating a two-dimensional material transfer method. Figure 5 for Figure 4 The corresponding process flow diagram. (See below for details.) Figure 4 and Figure 5 The steps of the two-dimensional material transfer method are described in detail.

[0037] Step S100: Fix the transfer substrate and the target substrate through the first carrier platform and the second carrier platform respectively, and adhere the two-dimensional material to be transferred through the adhesive layer of the transfer substrate.

[0038] In this step, the transfer substrate 10 is first fixed to the first support platform 331 with screws, and the target substrate 220 is fixed to the second support platform 332 by vacuum adsorption. The adhesive layer 140 in the transfer substrate 10 faces away from the first support platform 331, and the target substrate 220 includes a silicon substrate. Next, the two-dimensional material 210 to be transferred is bonded to the adhesive layer 140 of the transfer substrate 10.

[0039] Step S200: The alignment deviation between the two-dimensional material and the target substrate is detected by the imaging unit. Based on the alignment deviation detected by the imaging unit, the relative position of the transfer substrate and the target substrate is adjusted until the alignment deviation between the two-dimensional material and the target substrate is less than the preset deviation.

[0040] In this step, the second support platform 332 carrying the target substrate 220 can be moved closer to the transfer substrate 10. Then, the imaging unit 320 acquires the area on the transfer substrate 10 where the photothermal conversion layer 120 is not provided, and acquires the alignment image of the transfer substrate 10 and the target substrate 220. Finally, the alignment deviation between the transfer substrate 10 and the target substrate 220 is obtained based on the alignment image. Specifically, the microscopy subunit 323 can first observe the position of the transfer substrate 10 and the target substrate 220, the imaging subunit 321 can acquire images of the transfer substrate 10 and the target substrate 220, and the image recognition subunit 322 can obtain the alignment deviation between the transfer substrate 10 and the target substrate 220 based on the alignment image. Next, based on the alignment deviation detected by the imaging unit 320, the relative positions of the transfer substrate 10 and the target substrate 220 are adjusted until the alignment deviation between the two-dimensional material 210 and the target substrate 220 is less than the preset deviation. After the alignment is completed, the first support platform 331 and / or the second support platform 332 are moved so that the transfer substrate 10 and the target substrate 220 are in contact for no less than 5 minutes.

[0041] Step S300: Irradiate the transparent layer of the transfer substrate by the light-emitting unit, causing the photothermal release layer to decompose into gas, and transfer the two-dimensional material located on the adhesive layer to the target substrate.

[0042] In this step, to improve transfer efficiency, the light-emitting unit 310 can be preheated before the transfer begins. The photothermal conversion layer 120 can absorb the light energy emitted by the light-emitting unit 310 and convert it into heat energy, which is then transferred to the photothermal release layer 130. Under the action of the heat energy, the photothermal release layer 130 decomposes into gas to transfer the two-dimensional material 210 onto the target substrate 220.

[0043] Furthermore, after step S300, the target substrate 220 after the transfer of the two-dimensional material 210 can be immersed in a metal etching solution to remove the residual metal layer 150. Then, the target substrate 220 after the metal layer 150 is removed is placed on a heating plate for baking. After the adhesive layer 140 evaporates due to heat, a target substrate 220 with no residue after the transfer of the two-dimensional material 210 is obtained.

[0044] In this embodiment, the imaging unit 320 detects the alignment deviation between the two-dimensional material 210 and the target substrate 220 in the area where the photothermal conversion layer 120 is not provided, and adjusts the alignment deviation between the two through the first support platform 331 and / or the second support platform 332, which can effectively improve the transfer accuracy and efficiency of the two-dimensional material 210 and realize high-precision non-contact fixed-point transfer.

[0045] Further, please refer to Figure 6 and Figure 7 Before step S100, the two-dimensional material transfer method provided in this application further includes the step of fabricating a transfer substrate 10, which can be achieved through the following steps.

[0046] Step S110: Provide a transparent substrate.

[0047] The transparent substrate 110 is made of materials including but not limited to quartz, sapphire, etc.

[0048] Step S120: Fabricate a photothermal conversion layer on one side of the transparent substrate.

[0049] In this step, a photoresist side can be fabricated first on one side of the transparent substrate 110, and then a photothermal conversion layer 120 can be fabricated on the side of the photoresist layer away from the transparent substrate 110. The photothermal conversion layer 120 exposes at least a portion of the transparent substrate 110 and is used to absorb light energy and convert it into heat energy, which is then transferred to the photothermal release layer 130. Specifically, a photothermal conversion material layer can be obtained by spin-coating a tungsten-titanium alloy or a light-absorbing film, and then patterned to obtain the photothermal conversion layer 120 that exposes at least a portion of the transparent substrate 110. Alternatively, the photoresist layer can be patterned first to obtain a photoresist layer that exposes at least a portion of the transparent substrate 110, and the photothermal conversion layer 120 can be obtained by spin-coating a tungsten-titanium alloy or a light-absorbing film at the location exposing the transparent substrate 110. Finally, the photoresist is removed.

[0050] Step S130: Fabricate a photothermal release layer on the periphery of the photothermal conversion layer and on the side of the photothermal conversion layer away from the transparent substrate.

[0051] In this step, polyphthalamide (PPA) can be spin-coated onto the periphery of the photothermal conversion layer 120 and the side of the photothermal conversion layer 120 away from the transparent substrate 110, and then baked and cured to obtain the photothermal release layer 130. The baking temperature can be 80℃-90℃, and the baking time is 1min-10min. The photothermal release layer 130 is used to decompose into gas under the action of thermal energy to transfer the two-dimensional material 210 located on the adhesive layer 140 to the target substrate 220.

[0052] Step S140: Create an adhesive layer on the side of the photothermal release layer away from the transparent substrate.

[0053] In this step, polypropylene carbonate can be spin-coated onto the side of the photothermal release layer 130 away from the transparent substrate 110, and then baked and cured to obtain the adhesive layer 140. The baking temperature can be 80℃-120℃, and the baking time is 1min-10min. The orthographic projection of the adhesive layer 140 on the transparent substrate 110 overlaps with the orthographic projection of the photothermal conversion layer 120 on the transparent substrate 110. The adhesive layer 140 is used to bond the two-dimensional material 210 to be transferred.

[0054] Furthermore, to prevent the heat generated by the photothermal conversion layer 120 from passing through the photothermal release layer 130 and to avoid damage to the two-dimensional material, a metal layer 150 can be fabricated between the photothermal release layer 130 and the adhesive layer 140 before step S140. Specifically, the transparent substrate 110 on which the photothermal release layer 130 is fabricated is first coated by magnetron sputtering or electron beam thermal evaporation to form a metal material layer on the side of the photothermal release layer 130 away from the transparent substrate 110. Then, the metal material layer is etched to obtain the metal layer 150, wherein the orthographic projection of the metal layer 150 on the transparent substrate 110 coincides with the orthographic projection of the photothermal conversion layer 120 on the transparent substrate 110, thereby reducing the energy required to peel off the adhesive layer 140 and the peeling difficulty, and improving the transfer accuracy and efficiency.

[0055] In summary, this application provides a transfer substrate, a two-dimensional material transfer device, and a two-dimensional material transfer method. The transfer substrate includes a transparent substrate, a photothermal conversion layer, a photothermal release layer, and an adhesive layer. The photothermal conversion layer exposes at least a portion of the transparent substrate, and the orthographic projection of the adhesive layer on the transparent substrate overlaps with the orthographic projection of the photothermal conversion layer on the transparent substrate. In this way, the alignment of the two-dimensional material with the target substrate can be detected through the area where the photothermal conversion layer is not provided, thereby achieving high-precision non-contact point transfer.

[0056] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A transfer substrate, characterized by, The transfer substrate comprises a transparent substrate, a light-heat conversion layer, a light-heat release layer and an adhesive layer, wherein one side of the transparent substrate is a light-transmitting side; The light-heat conversion layer is located on one side of the transparent substrate, and at least exposes part of the transparent substrate, and the light-heat conversion layer is used to absorb light energy and convert the light energy into heat energy to transfer to the light-heat release layer; The light-heat conversion layer is located on the side of the light-heat conversion layer and the side of the light-heat conversion layer away from the transparent substrate, and the light-heat release layer is used to decompose into a gas under the action of the heat energy to transfer the two-dimensional material on the adhesive layer to the target substrate; The orthogonal projection of the adhesive layer on the transparent substrate overlaps with the orthogonal projection of the light-heat conversion layer on the transparent substrate, and the adhesive layer is used to bond the two-dimensional material to be transferred.

2. The transfer substrate of claim 1, wherein, The transfer substrate further comprises a metal layer; The metal layer is located between the light-heat release layer and the adhesive layer, and the metal layer is used to block the heat energy generated by the light-heat conversion layer from penetrating through the light-heat release layer.

3. The transfer substrate of claim 2, wherein, The orthogonal projection of the metal layer on the transparent substrate coincides with the orthogonal projection of the light-heat conversion layer on the transparent substrate.

4. The transfer substrate of claim 1, wherein, The material of the light-heat conversion layer comprises tungsten-titanium alloy, and the thickness of the light-heat conversion layer in the direction perpendicular to the transparent substrate is 200-400 nm; The material of the light-heat release layer comprises polyphthalamide, and the thickness of the light-heat release layer in the direction perpendicular to the transparent substrate is 40-60 nm.

5. The transfer substrate of claim 3, wherein, The material of the metal layer comprises copper and chromium; The thickness of the metal layer in the direction perpendicular to the transparent substrate is 50-200 nm.

6. The transfer substrate of claim 1, wherein, The material of the transparent substrate comprises quartz and sapphire.

7. A two-dimensional material transfer device, characterized by, The transfer substrate is applied to any one of claims 1-6; The two-dimensional material transfer device comprises a light-emitting unit, an imaging unit and a bearing platform, wherein the bearing platform comprises oppositely arranged first and second bearing platforms, the first bearing platform is used to fix the transfer substrate, and the second bearing platform is used to fix the target substrate; The light-emitting unit and the imaging unit are located on the side of the first bearing platform away from the second bearing platform, and the light-emitting direction of the light-emitting unit faces the light-transmitting side of the transfer substrate; The imaging unit is used to detect the alignment deviation of the two-dimensional material and the target substrate; The first and second bearing platforms are used to adjust the relative positions of the transfer substrate and the target substrate based on the alignment deviation detected by the imaging unit.

8. A two-dimensional material transfer method, characterized in that, The method is applied to the two-dimensional material transfer device of claim 7, and the method comprises: Fixing the transfer substrate through the first bearing platform and bonding the two-dimensional material to be transferred through the adhesive layer of the transfer substrate; Detecting the alignment deviation of the two-dimensional material and the target substrate through the imaging unit, adjusting the relative positions of the transfer substrate and the target substrate based on the alignment deviation detected by the imaging unit, and stopping until the alignment deviation of the two-dimensional material and the target substrate is less than a preset deviation. Irradiate the transparent layer of the transfer substrate by the light-emitting unit, so as to cause the photothermal release layer to decompose into gas, and transfer the two-dimensional material on the adhesive layer to a target substrate.

9. The method of claim 8, wherein, Before the step of adsorbing the transfer substrate by the first bearing platform and adhering the two-dimensional material to be transferred by the adhesive layer of the transfer substrate, the method further comprises the step of manufacturing the transfer substrate, which comprises: providing a transparent substrate; manufacturing a photothermal conversion layer on one side of the transparent substrate, wherein the photothermal conversion layer exposes at least part of the transparent substrate, and the photothermal conversion layer is used to absorb light energy and convert the light energy into heat energy to be transmitted to the photothermal release layer; manufacturing a photothermal release layer on the side of the photothermal conversion layer and the side of the photothermal conversion layer away from the transparent substrate, wherein the photothermal release layer is used to decompose into gas under the action of the heat energy, so as to transfer the two-dimensional material on the adhesive layer to a target substrate; manufacturing an adhesive layer on the side of the photothermal release layer away from the transparent substrate, wherein the adhesive layer is used to adhere the two-dimensional material to be transferred, and the orthographic projection of the adhesive layer on the transparent substrate overlaps the orthographic projection of the photothermal conversion layer on the transparent substrate.

10. The method of claim 9, wherein, Before the step of manufacturing the adhesive layer on the side of the photothermal release layer away from the transparent substrate, the method further comprises the step of manufacturing a metal layer, which comprises: performing magnetron sputtering or electron beam thermal evaporation on the transparent substrate with the manufactured photothermal release layer to form a metal material layer on the side of the photothermal release layer away from the transparent substrate; performing etching treatment on the metal material layer to obtain a metal layer, wherein the orthographic projection of the metal layer on the transparent substrate overlaps the orthographic projection of the photothermal conversion layer on the transparent substrate.

Images