Wafer clamp device for semiconductor detection

Abstract

The invention discloses a wafer clamp device for semiconductor detection, and the device comprises a handle, and a clamping assembly is disposed in the handle in a sliding manner. The clamping assembly comprises a first clamping plate and a second clamping plate; clamping pieces are arranged at one end of the first clamping plate and one end of the second clamping plate; the other end of the second clamping plate is fixedly connected with a first supporting frame, and the other end of the first clamping plate slides in the first supporting frame. The handle is further provided with a button, the button is pressed downwards so that the first clamping plate can move downwards, and the button is sleeved with an arranged spring so that the first clamping plate can be reset. Air channels are formed in the first clamping plate and the second clamping plate; one end of the air channel is connected with an external air source, the clamping piece is further provided with an air outlet, and the air source is guided to blow towards the wafer through the air outlet. On the basis, the phenomenon that the wafer is damaged in the transfer process is reduced and avoided, and the wafer can be cooled.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, specifically to a wafer fixture device for semiconductor inspection. Background Technology

[0002] Currently, after debonding, the wafers are manually transferred to the cleaning machine by touch. Because waiting for the wafers to cool completely takes too long, in order to improve efficiency and speed, the wafers are transferred by hand before they are fully cooled. This method of transfer poses a significant risk of burns to the operator's hands or wafer breakage from slipping. The operation is not standardized or regulated. Summary of the Invention

[0003] The purpose of this invention is to provide a wafer fixture device for semiconductor inspection, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a wafer clamping device for semiconductor inspection, comprising a handle, wherein a clamping assembly is slidably mounted inside the handle; the clamping assembly includes a first clamping plate and a second clamping plate; one end of the first clamping plate and the second clamping plate is provided with a clamping piece; wherein the other end of the second clamping plate is fixedly connected to a first support frame, and the other end of the first clamping plate slides within the first support frame; the handle is also provided with a button, pressing the button downwards causes the first clamping plate to move downwards, and a spring is provided on the button to cause the first clamping plate to reset; both the first clamping plate and the second clamping plate are provided with air channels inside; one end of the air channel is connected to an external air source, and the clamping piece is also provided with an air outlet, through which the air source is guided to blow onto the wafer.

[0005] As a preferred technical solution of the present invention: a first sliding groove is provided on the side of the first support frame, and a first bolt passes through the first sliding groove and is connected to a first internal threaded hole provided on the first clamping plate.

[0006] As a preferred technical solution of the present invention: the side of the handle is also provided with a second sliding groove, and after the pushing block passes through the second sliding groove, it is connected to the side of the first support frame which is also provided with a second internal thread hole.

[0007] As a preferred technical solution of the present invention: the middle part of the first clamping plate is provided with a third sliding groove, and the second bolt is provided to pass through the third sliding groove and connect to the bottom of the button.

[0008] As a preferred embodiment of the present invention, it further includes a second support frame, and guides the first clamping plate to slide at one end of the handle through the second support frame.

[0009] As a preferred embodiment of the present invention: the cross-sections of the second support frame and the first support frame are both rectangular, and the outer end face of the second support frame is flush with the outer end face of the handle.

[0010] As a preferred technical solution of the present invention: the clamp is semi-circular, the number of air passages is two, the clamp is provided with a branch pipe for connection, and one end of the air outlet is also connected to the branch pipe.

[0011] As a preferred technical solution of the present invention: the end of the air passage away from the clamp is provided with a pipe connector, and the number of air outlets is multiple and evenly distributed on the end face of the clamp.

[0012] As a preferred embodiment of the present invention: the end of the handle away from the clamping assembly is provided with an end cap, and the middle of the end cap is provided with a quick connector, which is connected to the pipe connector through a hose.

[0013] As a preferred technical solution of the present invention: at least the first clamping plate and the second clamping plate are made of PEEK.

[0014] The beneficial effects of the present invention using the above technical solution are as follows: pressing the button causes the first clamping plate to move towards the second clamping plate, so that the two clamping plates can hold the wafer, reducing the problem of burns caused by manual handling; at the same time, the air duct can also guide the airflow to blow onto the wafer surface, which reduces the high temperature from baking the user's hands and reduces the need for equipment in the next process of wafer baking; in particular, the clamping assembly can also slide inside the handle, so that the exposed length of the two clamping plates can be freely adjusted, so that the two clamping plates can be clamped at different positions on the wafer, and the clamping plates can also increase the contact area between the clamping assembly and the wafer, reducing and avoiding the phenomenon of wafer breakage during transfer. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of the present invention; Figure 2 This is a cross-sectional schematic diagram of the main structure of the present invention; Figure 3 for Figure 2 A magnified view of a portion of point A in the middle; Figure 4 This is an exploded view of the main structure of the present invention; Figure 5 A schematic diagram of the main structure of the clamping assembly of the present invention; Figure 6 for Figure 5 A magnified view of a portion of point B in the middle; Figure 7 This is a schematic cross-sectional view of the first clamping plate of the present invention; Figure 8 for Figure 7 A magnified view of a portion of point C in the middle; Figure 9 for Figure 7 A magnified view of a portion of point D in the middle; Figure 10 This is a schematic diagram of the back structure of the first clamping plate of the present invention; Figure 11 This is a schematic diagram showing the state when the wafer is clamped according to the present invention.

[0016] In the diagram: 1. Handle; 2. Push block; 3. Clamping assembly; 31. First clamping plate; 310. Branch pipe; 311. Clamping piece; 312. Air passage; 313. Third slide groove; 314. First internal threaded hole; 315. Air outlet; 32. Second clamping plate; 33. Second support frame; 34. First support frame; 35. First slide groove; 36. Second internal threaded hole; 37. First bolt; 38. Pipe connector; 4. Button; 5. Spring; 6. Second slide groove; 7. End cap; 8. Second bolt; 9. Quick connector. Detailed Implementation

[0017] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "upper surface," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

[0018] Please see Figure 1-11This invention provides an embodiment of a wafer clamping device for semiconductor inspection, comprising a handle 1, wherein a clamping assembly 3 is slidably mounted inside the handle 1; the clamping assembly 3 includes a first clamping plate 31 and a second clamping plate 32; one end of the first clamping plate 31 and the second clamping plate 32 is provided with a clamping piece 311; wherein the other end of the second clamping plate 32 is fixedly connected to a first support frame 34, and the other end of the first clamping plate 31 slides within the first support frame 34; since the clamping assembly 3 can slide within the handle 1, specifically, when the wafer is stationary, the handle 1 slides within a cavity, and the first support frame 34 slides within the cavity, thus pulling the clamping assembly 3 outward increases the length of the clamping assembly 3 exposed outside the handle 1, so that the clamping assembly 3 can be clamped near the center of the wafer; pushing the clamping assembly 3 inward causes the clamping piece 311 to clamp the wafer at the edge of the wafer. In addition, the clamping plate 311 can increase the contact area between the clamping component 3 and the wafer, reduce and avoid damage to the wafer during the transfer process, and the use of clamps to hold the wafer can reduce the risk of users being burned.

[0019] Meanwhile, since the handle 1 is also equipped with a button 4, pressing the button 4 downwards causes the first clamping plate 31 to move downwards. Therefore, only pressing the button 4 is needed to cause the first clamping plate 31 to move downwards, so that the device can complete the clamping action of the wafer. When the external force of the button 4 is removed, the spring 5 is provided and sleeved on the button 4 to cause the first clamping plate 31 to return to its original position. Therefore, the device can complete the clamping and releasing actions with a simple structure, which facilitates the clamping and releasing of the wafer. Compared with a clamping device with two clamping plates connected by a pin at one end and an open structure at the other end, this device uses the overall translational movement of the first clamping plate 31 to make surface contact with the wafer after contact, and the wafer is subjected to uniform force, which can avoid the problem of the wafer surface being crushed or deformed after being clamped.

[0020] In particular, both the first clamping plate 31 and the second clamping plate 32 are provided with air channels 312 inside; one end of the air channel 312 is connected to an external air source, and the clamping plate 311 is also provided with an air outlet 315, through which the air source is guided to blow onto the wafer. Therefore, an external air source can be used to cool the wafer, which reduces the high temperature from baking the user's hands and reduces the equipment required for the next process of wafer baking.

[0021] Preferred, such as Figure 6As shown, the first support frame 34 has a first sliding groove 35 on its side, and a first bolt 37 passes through the first sliding groove 35 and connects to the first internal threaded hole 314 on the first clamping plate 31. Therefore, with the cooperation of the first sliding groove 35 and the first bolt 37, firstly, the first clamping plate 31 is guided to slide in a certain direction; secondly, the first support frame 34 can move with the two clamping plates; and thirdly, the first support frame 34 can be used to limit the movement of the two clamping plates, so as to facilitate the smooth movement of the first clamping plate 31. It should be noted that after the first bolt 37 is installed, the outer wall surface of the first bolt 37 is not higher than the outer wall surface of the first support frame 34.

[0022] Furthermore, since the handle 1 is also provided with a second sliding groove 6 on its side, and the push block 2 is connected to the second internal threaded hole 36 on the side of the first support frame 34 after passing through the second sliding groove 6, the push block 2 can slide in the second sliding groove 6 to drive one end of the clamping assembly 3 to slide outward or inward of the handle 1. Furthermore, when the two clamping plates clamp the wafer, the movement of the push block 2 can also drive the clamped wafer to move, so that the device can transfer the wafer position when the handle 1 is in different positions after clamping the wafer. Application scenarios include when the wafer is completely immersed in the container, after the two clamping plates clamp the wafer, pushing the push block 2 upward can remove the wafer immersed in the container without the handle 1 getting wet. Conversely, when the wafer needs to be placed in a deeper container, the handle 1 is above the liquid surface of the container, and pushing the push block 2 downward can ensure that the handle 1 does not get wet with the liquid inside the container and the wafer is stored.

[0023] Building upon the aforementioned functions, to simplify the device's structure, a third sliding groove 313 is provided in the middle of the first clamping plate 31. A second bolt 8 passes through the third sliding groove 313 and connects to the bottom of the button 4. Therefore, by using the second bolt 8 to pass through the third sliding groove 313 from the back of the first clamping plate 31 and connect to the screw hole on the button 4, wafer clamping is achieved without affecting the sliding of the entire clamping assembly 3 within the handle 1. Furthermore, after clamping the wafer, the second bolt 8 can slide within the third sliding groove 313 to ensure the directional movement of the wafer. It should be noted that after the second bolt 8 is installed on the button 4, its outer end face is not higher than the back of the first clamping plate 31. In specific designs, a countersunk groove can be machined on the outside of the third sliding groove 313 to accommodate the driving end of the second bolt 8. Similarly, a countersunk groove can be machined on the outside of the first sliding groove 35 to accommodate the driving part of the first bolt 37.

[0024] Based on the above solution, to further ensure the directional movement of the first clamping plate 31, a second support frame 33 is also included, which guides the first clamping plate 31 to slide at one end of the handle 1. Specifically, the cross-section of the second support frame 33 and the first support frame 34 are both rectangular, and the outer end face of the second support frame 33 is flush with the outer end face of the handle 1. Therefore, after the second support frame 33 is installed, the first clamping plate 31 moves within the two support frames, preventing the first clamping plate 31 from being directly exposed in the sliding cavity inside the handle 1, thus reducing the shaking phenomenon of the first clamping plate 31 during movement.

[0025] Based on the above scheme, to improve the heat dissipation effect of the wafer, the clamp 311 is semi-circular, the number of air channels 312 is two, the branch pipe 310 inside the clamp 311 is connected, and one end of the air outlet 315 is also connected to the branch pipe 310; furthermore, the end of the air channel 312 away from the clamp 311 is provided with a pipe connector 38, and the number of air outlets 315 is multiple and evenly distributed on the end face of the clamp 311. Therefore, the air flow is sufficient to facilitate rapid heat dissipation. At the same time, the clamp 311 is arc-shaped, so the air outlets 315 are also arc-shaped and distributed on the outer end face of the clamp 311. Therefore, the airflow can blow towards the wafer at different angles, and the airflows at various angles converge near the center of the wafer and continue to move outward along the surface of the wafer. At this time, the airflows collide with each other at the center of the wafer, and the flow path of the airflow is disordered, so as to increase the coverage area of ​​the airflow on the wafer, thereby improving the heat dissipation of the wafer to achieve the best results.

[0026] To facilitate the connection between the external air tube and the handle 1, the end of the handle 1 away from the clamping assembly 3 is provided with an end cap 7, and a quick connector 9 is provided in the middle of the end cap 7. The quick connector 9 is connected to the tube connector 38 via a flexible hose. The tube connector 38 can also be a quick connector. Therefore, both the external air source and the air tube located inside the handle 1 offer the advantage of easy installation.

[0027] In addition, since the wafers need to have high precision, corrosion resistance, high temperature resistance and anti-static properties during the clamping process in order to avoid damaging the sensitive wafer surface, at least the first clamping plate 31 and the second clamping plate 32 are made of PEEK.

[0028] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and these variations still fall within the protection scope of the present invention.

Claims

1. A wafer chuck device for semiconductor inspection, characterized by: Handle (1), the inside of the handle (1) is slidably installed with a clamping assembly (3); The clamping assembly (3) comprises a first clamping plate (31) and a second clamping plate (32); the first clamping plate (31) is provided with a clamping piece (311) at one end of the second clamping plate (32); wherein the other end of the second clamping plate (32) is fixedly connected with the first support frame (34) provided, and the other end of the first clamping plate (31) slides in the first support frame (34); The handle (1) is also provided with a button (4), and the button (4) is pressed downward to move the first clamping plate (31) downward, and a spring (5) is provided on the button (4) to reset the first clamping plate (31); The inside of the first clamping plate (31) and the second clamping plate (32) is provided with an air duct (312); one end of the air duct (312) is connected with an external air source, and the clamping piece (311) is also provided with an air outlet (315), which guides the air source to blow towards the wafer.

2. The wafer chuck apparatus for semiconductor inspection according to claim 1, wherein: The side of the first support frame (34) is provided with a first sliding groove (35), and the first bolt (37) is provided to pass through the first sliding groove (35) and is connected with the first internal threaded hole (314) provided on the first clamping plate (31).

3. The wafer chuck apparatus for semiconductor inspection according to claim 1, wherein: The side of the handle (1) is also provided with a second sliding groove (6), and the pushing block (2) passes through the second sliding groove (6) and is connected with the second internal threaded hole (36) provided on the side of the first support frame (33).

4. The wafer chuck apparatus for semiconductor inspection according to claim 1, wherein: The middle part of the first clamping plate (31) is provided with a third sliding groove (313), and the second bolt (8) is provided to pass through the third sliding groove (313) and is connected with the bottom of the button (4).

5. The wafer chuck apparatus for semiconductor inspection according to any one of claims 1 to 4, wherein: It also comprises a second support frame (33), and the first clamping plate (31) is guided to slide at one end of the handle (1) through the second support frame (33).

6. The wafer chuck apparatus for semiconductor inspection of claim 6, wherein: The cross section of the second support frame (33) and the first support frame (34) is rectangular, and the outer end surface of the second support frame (33) is flush with the outer end surface of the handle (1).

7. The wafer chucking device for semiconductor inspection according to claim 5, wherein: The clamping piece (311) is semicircular, the number of air ducts (312) is two, the inside of the clamping piece (311) is provided with a branch pipe (310) connected, and one end of the air outlet (315) is also connected with the branch pipe (310) in communication.

8. The wafer chuck apparatus for semiconductor inspection of claim 5, wherein: The end of the air duct (312) away from the clamping piece (311) is provided with a pipe joint (38), and the number of air outlets (315) is multiple and uniformly distributed on the end surface of the clamping piece (311).

9. The wafer chuck apparatus for semiconductor inspection according to claim 8, wherein: The end of the handle (1) away from the clamping assembly (3) is also provided with an end cover (7), and the middle part of the end cover (7) is also provided with a quick connector (9), and the quick connector (9) is connected with the pipe joint (38) through a hose.

10. The wafer chucking device for semiconductor inspection according to claim 5, wherein: At least the material of the first clamping plate (31) and the second clamping plate (32) is PEEK.

Images