Cooling and heating mattress

Abstract

The invention discloses a cooling and heating mattress which comprises a mattress structure, a cooling and heating mattress main machine, a water inlet extension pipe and a water outlet extension pipe, the mattress structure comprises a mattress body, a water diversion joint and a plurality of circulating pipes; a groove structure is formed in the surface of the pad body; one end of each circulation pipe is communicated with the flow dividing branch pipe of the water dividing connector, the other end of each circulation pipe is communicated with the backflow branch pipe of the water dividing connector, each circulation pipe is embedded into the corresponding groove structure and forms a U-shaped pipeline, and the circulation pipes form a plurality of U-shaped pipelines of different sizes; the cooling and heating mattress main machine comprises a double-layer water tank, the double-layer water tank is provided with an outer-layer water supplementing tank and an inner circulation tank which are sleeved with each other, a water supplementing hole is formed in the outer wall of the inner circulation tank, the inner circulation tank is provided with a circulation water inlet and a circulation water outlet, and the outer-layer water supplementing tank is communicated with the inner circulation tank through the water supplementing hole. According to the cold and warm mattress, the structure of the mattress and the structure of the main machine of the cold and warm mattress are improved, energy loss is effectively reduced, and efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of heated and cooled mattress technology, specifically a heated and cooled mattress. Background Technology

[0002] A heated / cooled mattress uses a liquid medium. The main unit heats or cools the liquid medium, which is then channeled through pipes inside the mattress to exchange heat with the body, thus achieving the desired heating or cooling effect.

[0003] Heated and cooled mattresses include mattresses with internal water channels and the main unit of the mattress. Mattresses with internal water channels generally use a long-distance single-pipe circulation temperature conduction structure design. This structure results in significant energy loss of the refrigerant or heating medium during circulation, making the cooling or heating efficiency of the main use area of ​​the mattress (i.e., the area that the user's body mainly contacts) low, and unable to quickly reach the set temperature. At the same time, because the single-pipe circulation path is too long, the refrigerant or heating medium is prone to accumulation at the beginning / end of the circulation (i.e., the edge area of ​​the mattress), causing the edge area to be too low or too high, creating a significant temperature difference between areas and affecting sleep comfort. In addition, most existing mattresses use traditional fiber cotton as the filling material, which can create a feeling of discomfort after the pipe installation. Existing heated and cooled mattress main units generally use a dual water tank setting, such as an independent cavity design where the water storage tank and the circulating water tank are arranged side by side, side by side, or separated from each other. However, this type of dual-tank structure has the following drawbacks in practical applications: 1. It requires a completely independent cavity partition structure, resulting in a significant occupation of the internal space of the main unit, making the overall size of the main unit larger and reducing the product's integration; 2. It requires two sets of independent inlet / outlet water pipes and control pumps, resulting in twice the number of pipe interfaces compared to a single-tank system. The design of multiple interfaces and multiple pipes not only increases the assembly difficulty but also increases the risk of water leakage at pipe connections, affecting the safety of product use; 3. The increased complexity of the piping system increases the energy loss of refrigerant / heating medium during the circulation process, resulting in a large amount of energy waste and a lower product energy efficiency ratio. Summary of the Invention

[0004] To address the aforementioned shortcomings, this invention proposes a heated and cooled mattress, which solves the problems of high energy loss and low energy efficiency in existing heated and cooled mattresses.

[0005] To achieve this objective, the present invention adopts the following technical solution: A heated and cooled mattress includes a mattress structure, a heated and cooled mattress main unit, a water inlet extension pipe, and a water outlet extension pipe; The mattress structure includes a mattress body, a water distribution connector, and several flow pipes; the surface of the mattress body has a groove structure; one end of each flow pipe is connected to the branch pipe of the water distribution connector, and the other end of each flow pipe is connected to the return branch pipe of the water distribution connector. Each flow pipe is embedded in the groove structure to form a U-shaped pipe. Several flow pipes form several U-shaped pipes of different sizes, and the U-shaped pipes are nested in order from smallest to largest. The heated and cooled mattress main unit includes a shell, an electronic control module, a water tank module, and a semiconductor refrigeration module. The top of the shell has a water inlet, and the bottom rear side of the shell has a main return water section and a main outlet water section. The electronic control module, the water tank module, and the semiconductor refrigeration module are detachably installed inside the shell. The water tank module includes a double-layer water tank, which has an outer replenishment tank and an inner circulation tank nested together. The outer wall of the inner circulation tank has a water inlet hole, and the inner circulation tank has a circulation inlet and a circulation outlet. The outer replenishment tank and the inner circulation tank are connected through the water inlet hole. The outer replenishment chamber has a water inlet connected to the water inlet. The circulation outlet is connected to the inlet of the semiconductor refrigeration module via a water pump. The circulation inlet is connected to the outlet of the main return water section. The inlet of the main return water section is connected to the outlet pipe of the water distribution connector through the outlet extension pipe, and the inlet of the main outlet water section is connected to the outlet of the semiconductor refrigeration module; the outlet of the main outlet water section is connected to the inlet pipe of the water distribution connector through the inlet extension pipe. The electronic control module controls the operating status of the water tank module and the semiconductor refrigeration module.

[0006] To further explain, the main unit of the heated and cooled mattress also includes an air duct structure, and the electronic control module, the water tank module, the air duct structure and the semiconductor refrigeration module are arranged sequentially from front to back in the inner cavity of the outer shell and are detachably installed respectively. The air duct structure has air guide surfaces on its left and right sides, which are used to divide the inner cavity into two air inlet channels. The air duct structure has a cavity at its bottom, which runs through the front and back direction and is used to accommodate the pipe. The outer shell has a first ventilation opening on its left and right sides, and a second ventilation opening on its rear wall. The first ventilation openings correspond to the left and right sides of the air duct structure, and the air outlet of the air duct structure faces the front end of the heat dissipation component of the semiconductor cooling module.

[0007] To further explain, the front end face of the air duct structure is also provided with a water tank installation area, which is composed of two vertical plates facing each other. The two vertical plates extend forward along the front end face of the air duct structure, and the surface of the vertical plates is provided with several countersunk holes.

[0008] To further explain, the cavity below the air duct structure is formed by an arched tunnel, and the top outer wall of the arched tunnel is connected to the air guide surface and the first ventilation opening by an arc segment.

[0009] To further explain, the air guide surface is an arc-shaped surface, and the left and right sides of the air duct structure are symmetrically recessed with the arc-shaped surface, and the arc-shaped surface is arranged vertically, with the guide ends of the two arc-shaped surfaces connected; the guide start end of the arc-shaped surface is connected to the first ventilation opening.

[0010] Further explanation: The semiconductor cooling module includes a cooling and heating component and a fan component; the cooling and heating component includes a cooling device, a heat dissipation component, and a heat conduction component. The cooling device has a cold end and a hot end, and water boxes that communicate with each other are respectively provided on the outer side of the cold end and the hot end. The heat dissipation component is located directly above the cooling device and includes a plurality of heat sinks arranged in sequence at intervals. There are multiple heat conduction components, and each heat sink has a through hole corresponding to the heat conduction component. All through holes corresponding to the same heat conduction component are coaxially opened. One end of the heat conduction component is fixed to the hot end of the cooling device, and the other end passes through the corresponding through holes. The heat conduction component is connected to the heat sink, and the area where the heat conduction component passes through the heat dissipation component is a vertically arranged straight section. The fan assembly is installed between the front end of the heat dissipation component and the air duct structure, or the fan assembly is installed between the rear end of the heat dissipation component and the second ventilation section. The water inlet of the semiconductor cooling module is the water inlet of one of the water boxes, and both the water inlet and outlet of the water box are located below the water box.

[0011] To further explain, the cooling and heating assembly includes two pre-installation plates, which are positioned opposite each other and spaced apart. The cooling device and the heat dissipation component are both installed between the two pre-installation plates, and the outer side of each pre-installation plate has several reserved holes.

[0012] Further explanation: the pre-installation plate has a window in the area corresponding to the refrigeration device; the pre-installation plate is a sheet metal part, and the pre-installation plate includes a vertical plane, a bent side edge, a bent top edge, and a bent bottom edge. The two sides of the vertical plane are respectively bent inward to form the bent side edge, and the bent side edge is provided with the reserved hole. The bent side edge is also provided with a first mounting hole for mounting to the bottom of the heat dissipation component. The top edge of the vertical plane is bent inward to form the bent top edge, and the bent top edge is provided with a second mounting hole for mounting to the top of the heat dissipation component. The bottom edge of the vertical plane is bent outward to form the bent bottom edge, and the bent bottom edge is provided with a connection hole for connecting to the outer casing.

[0013] To further explain, it also includes a filter screen, which is detachably installed at the water inlet.

[0014] Further explanation: the double-layer water tank is equipped with a liquid level sensor and a first temperature limiter; the inlet and outlet pipes of the water distribution connector are respectively equipped with temperature sensors; the liquid level sensor, the first temperature limiter, and the temperature sensors are respectively electrically connected to the electronic control module; the heat-conducting component is equipped with a second temperature limiter. When the water level in the double-layer water tank is lower than the low water level value, the liquid level sensor sends a water shortage signal to the electronic control module, and the electronic control module controls the water pump to stop working. When the temperature inside the double-layer water tank is higher than the preset value, the first temperature limiter sends an overheat signal to the electronic control module, and the electronic control module controls the TEC chip in the semiconductor cooling module to stop working. The temperature sensor is used to acquire the water temperature at the inlet pipe and the outlet pipe, and feeds the water temperature back to the electronic control module, which controls the voltage input to the TEC chip, thereby controlling the cooling / heating temperature of the TEC chip; When the temperature of the heat-conducting component is higher than the preset value, the second temperature limiter sends a signal that the heat pipe temperature is too high to the electronic control module, and the electronic control module controls the TEC chip in the semiconductor cooling module to stop working.

[0015] The technical solution of the present invention may include the following beneficial effects: 1. The circulation tubes in the mattress structure are embedded in the groove structure of the mattress body to avoid direct contact with the human body, prevent the human body from being touched, eliminate the feeling of foreign objects, and improve the comfort of the hot and cold mattress. At the same time, by reducing the contact between the circulation tubes and the outside air, the generation of condensation and energy loss can be reduced, and the heat preservation effect can be improved. 2. By combining several U-shaped pipes for flow control, multiple parallel flows are achieved, effectively reducing the output pressure of the water pump in the heating and cooling unit; 3. The main unit of the heated mattress contains three separate functional modules: the electronic control module, the water tank module, and the semiconductor cooling module. Each module can be assembled independently, avoiding piecemeal work during final assembly, reducing production complexity, speeding up assembly, reducing error rate, and making the overall manufacturing process more efficient and reliable. 4. The internal micro-circulation design of the double-layer water tank effectively reduces energy loss in the hot and cold mattresses, further improving their efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a heated and cooled mattress according to one embodiment of the present invention; Figure 2 This is a schematic diagram of the mattress structure in one embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the water distribution connector in one embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the water distribution connector and the flow pipe in one embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the pad in one embodiment of the present invention; Figure 6 This is a schematic diagram of the pipeline structure of a flow pipe in one embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the hot and cold mattress main unit (omitting one side panel of the outer shell) in one embodiment of the present invention; Figure 8 This is a schematic diagram of the air duct structure in one embodiment of the present invention; Figure 9 This is a schematic diagram of the water tank module in one embodiment of the present invention; Figure 10 This is a top view of the outer water supply tank according to one embodiment of the present invention; Figure 11 yes Figure 10 A schematic cross-sectional view of section AA in the middle; Figure 12 yes Figure 11 A magnified view of a portion of region C in the middle; Figure 13 This is a schematic diagram of the internal structure of the outer water supply tank in one embodiment of the present invention; Figure 14 This is a schematic diagram of the support frame according to one embodiment of the present invention; Figure 15 This is an exploded and dissected schematic diagram of a portion of the structure of the main unit of the heating and cooling mattress according to one embodiment of the present invention; Figure 16 This is a schematic diagram of the structure of a cooling and heating assembly according to one embodiment of the present invention; Figure 17 This is a schematic diagram of the structure of the pre-installed plate in one embodiment of the present invention; The components include: mattress structure 1, heated / cooled mattress main unit 2, water inlet extension pipe 3, water outlet extension pipe 4, mattress body 11, water distribution connector 12, flow pipe 13, groove structure 111, longitudinal groove 1111, transverse groove 1112, transverse groove one 11121, transverse groove two 11122, receiving groove 1113, water inlet pipe 121, water outlet pipe 122, branch pipe 123, return branch pipe 124, outer shell 201, first vent 202, second vent 203. Ventilation vent 203, main return water section 204, main outlet water section 205, water inlet 206, electrical control module 21, water tank module 22, semiconductor refrigeration module 23, refrigeration and heating components 231, fan assembly 232, refrigeration device 2311, heat dissipation component 2312, heat sink 23121, through hole 23122, heat conduction component 2313, water box 2314, pre-installation plate 2315, reserved hole 2315-1, vertical plane 23 151. Bending side edge 23152. Bending top edge 23153. Bending bottom edge 23154. L-shaped support 2316. Window 2315-2. First mounting hole 2315-3. Second mounting hole 2315-4. Air duct structure 24. Air guide surface 241. Cavity 2442. Vertical plate 243. Reinforcing plate 244. Countersunk hole 2431. Top cover pre-positioning groove 2432. Outer water supply tank 221. Inner circulation tank 222. Water supply 2211, water inlet 2221, round hole 22211, strip hole 22212, circulating water inlet 2222, circulating water outlet 2223, water pump 223, filter screen 224, mounting part 222-1, bottom of inner circulation tank 222-2, bottom mounting part 222-21, support frame 225, receiving cavity 22501, horizontal top 2251, limiting part 22511, vertical side part 2252, mounting part 22521. Detailed Implementation

[0017] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0018] In the description of this invention, it should be understood that the terms "length", "middle", "upper", "lower", "left", "right", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "assembly," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] like Figures 1-15 As shown, an embodiment of the present invention, a heated and cooled mattress, includes a mattress structure 1, a heated and cooled mattress main unit 2, a water inlet extension pipe 3, and a water outlet extension pipe 4. The mattress structure 1 includes a mattress body 11, a water distribution connector 12, and several flow pipes 13; the surface of the mattress body 11 is provided with a groove structure 111; one end of the flow pipe 13 is connected to the branch pipe 123 of the water distribution connector 12, and the other end of the flow pipe 13 is connected to the return branch pipe 124 of the water distribution connector 12, and each flow pipe 13 is embedded in the groove structure 111 to form a U-shaped pipe, and several flow pipes 13 form several U-shaped pipes of different sizes, and several U-shaped pipes are nested in order from small to large; The heated and cooled mattress main unit 2 includes a housing 201, an electronic control module 21, a water tank module 22, and a semiconductor cooling module 23. The top of the housing 201 has a water inlet 206, and the bottom of the rear side of the housing 201 has a main water return section 204 and a main water outlet section 205. The electronic control module 21, the water tank module 22, and the semiconductor cooling module 23 are detachably installed inside the housing 201. The water tank module 22 includes a double-layer water tank, which has an outer replenishment tank 221 and an inner circulation tank 222 nested together. The inner circulation tank 222 has a water replenishment hole 2221 on its outer wall, a circulation inlet 2222 and a circulation outlet 2223. The outer water replenishment tank 221 and the inner circulation tank 222 are connected through the water replenishment hole 2221. The outer water replenishment chamber has a water replenishment outlet 2211 that communicates with the water tank module 22. The circulation outlet 2223 is connected to the inlet of the semiconductor cooling module 23 through a water pump 223. The circulation inlet 2222 is connected to the outlet of the main return water section 204. The inlet of the main return water section 204 is connected to the outlet pipe 122 of the water distribution connector 12 through the outlet extension pipe 4; the inlet of the main outlet water section 205 is connected to the outlet of the semiconductor cooling module 23; the outlet of the main outlet water section 205 is connected to the inlet pipe 121 of the water distribution connector 12 through the inlet extension pipe 3. The electronic control module 21 controls the operating status of the water tank module 22 and the semiconductor cooling module 23.

[0022] In order to reduce energy loss and further improve efficiency, the present invention proposes the following structural improvements to the mattress structure 1 and the main unit of the heated / cooled mattress 2: In mattress structure 1, the circulation tube 13 is embedded in the groove structure 111 of the mattress body 11 to avoid direct contact with the human body, prevent the human body from being affected, eliminate the feeling of foreign objects, and improve the comfort of the hot and cold mattress. At the same time, by reducing the contact between the circulation tube 13 and the outside air, the generation of condensation and energy loss can be reduced, resulting in a good heat preservation effect.

[0023] Secondly, the core improvement of mattress structure 1 lies in the combination of several U-shaped circulation pipes 13, achieving multi-path parallel operation and effectively reducing the output pressure of the water pump 223 in the heating and cooling unit. Compared with the traditional long-distance single-pipe circulation, the above design allows the water pump 223 to maintain normal operation without high power, which not only extends the service life of the water pump 223 but also improves energy efficiency. In addition, the several U-shaped pipes are arranged sequentially from small to large, with the small U-shaped pipes being short pipes and the large U-shaped pipes being long pipes. The short pipes have low resistance and fast flow rates, providing a stronger water flow to the key areas (the main usage area of ​​mattress structure 1 - the middle area), making the cooling / heating effect of the middle area of ​​mattress structure 1 more obvious; the long pipes are responsible for the circulation of the edge areas. The above layout ensures the cooling effect of the main usage area while preventing the edge areas from becoming too cold.

[0024] The main unit 2 of the heated and cooled mattress contains three separate functional modules: an electronic control module 21, a water tank module 22, and a semiconductor cooling module 23. Each module can be assembled independently, avoiding piecemeal work during final assembly, reducing production complexity, speeding up assembly, lowering error rates, and making the overall manufacturing process more efficient and reliable. This design also facilitates future expansion or modification; for example, adding new functions only requires adjusting specific modules without redesigning the entire product.

[0025] The proposed double-layer water tank design achieves internal micro-circulation within the water tank module 22. Internal micro-circulation refers to the circulation within the inner circulation tank 222. Water returning from the mattress structure 1 mixes with the water in the inner circulation tank 222 through the circulation inlet 2222 and then flows out through the circulation outlet 2223, rather than the entire double-layer water tank. This effectively reduces temperature loss and accelerates the cooling speed. At the same time, although the inner circulation tank 222 and the outer water replenishment tank 221 are not completely isolated, the outer water replenishment tank 221 provides insulation for the inner circulation tank 222, further improving energy efficiency. Compared with the traditional double water tanks arranged side by side or separated from each other in the existing technology, this design is simpler and more practical, effectively solving the problems of low integration and low efficiency of the water tank module 22 in the existing technology of the heating and cooling mattress host 2.

[0026] The design of the groove structure 111 and the U-shaped pipe in the mattress structure 1 of this invention, combined with the internal micro-circulation design of the double-layer water tank, effectively reduces the energy loss of the hot and cold mattress and further improves its efficiency.

[0027] In one specific embodiment, the water distribution connector 12 includes an inlet pipe 121 and an outlet pipe 122. A plurality of branch pipes 123 are arranged at intervals along the length of the inlet pipe 121 on one side, and a plurality of return branch pipes 124 are arranged at intervals along the length of the outlet pipe 122 on one side. Each of the plurality of branch pipes 123 corresponds to one of the plurality of return branch pipes 124. Each branch pipe 123 is connected to the corresponding return branch pipe 124 through a flow pipe 13.

[0028] In one specific embodiment, the groove structure 111 includes a plurality of longitudinal grooves 1111, a plurality of transverse grooves 1112 and a plurality of receiving grooves 1113, wherein the width of the longitudinal grooves 1111 and the transverse grooves 1112 is smaller than the maximum width of the receiving grooves 1113. The longitudinal grooves 1111 are arranged along the width direction of the pad 11, and a plurality of the longitudinal grooves 1111 extend along the length direction of the pad 11 and penetrate the pad 11. The transverse grooves 1112 are arranged at intervals along the length direction of the pad 11, and a plurality of the transverse grooves 1112 extend along the width direction of the pad 11 and penetrate the pad 11. The pad 11 has corresponding receiving grooves 1113 below the longitudinal grooves 1111 and the transverse grooves 1112, respectively, and the receiving grooves 1113 are respectively connected to the bottom of the longitudinal grooves 1111 or the transverse grooves 1112.

[0029] The groove structure 111 is divided into a transverse groove 1112, a longitudinal groove 1111, and a receiving groove 1113. The transverse groove 1112 and the longitudinal groove 1111 are used to provide openings for the flow pipe 13 to be embedded in the receiving groove 1113, which can effectively prevent the flow pipe 13 from falling off the pad body 11 and ensure that the pad body 11 has good support capacity.

[0030] Furthermore, the pad 11 can be made of soft materials such as latex pad 11, sponge pad 11, or composite fiber cotton pad 11. Specifically, it can be a pressed structure pad. In a specific embodiment, the aforementioned groove structure can be formed in the fiber cotton layer pad, and a flow tube can be inserted through it. Preferably, the pad 11 is a sponge pad 11, and the longitudinal groove 1111, the transverse groove 1112, and the receiving groove 1113 are all formed by CNC cutting machine. The pad 11 achieves a grid-like groove structure through the setting of the longitudinal groove 1111 and the transverse groove 1112. In practical applications, the pad 11 can be grid-likely cut with cross-hatching using a CNC cutting machine according to the actual water channel requirements of the hot and cold mattress. The above process is not only more economical and efficient, but also allows for flexible adjustment of the direction of the flow tube 13 according to specific layout requirements. After cutting, the flow tube 13 is arranged according to the design requirements. The proposed pad 11 provides great flexibility for the arrangement of the flow tube 13, solving the problem of complex production of existing pads 11 suitable for hot and cold mattresses.

[0031] Furthermore, the receiving groove 1113 can be a teardrop-shaped groove, a circular groove, or a square groove. Preferably, it is a teardrop-shaped groove or a circular groove, which can fit and limit the flow tube 13, extending the service life of the pad 11.

[0032] To elaborate further, such as Figure 5 As shown, the several transverse channels 1112 are divided into several transverse first channels 11121 and several transverse second channels 11122. The interval length between the several transverse first channels 11121 is smaller than the interval length between the several transverse second channels 11122. The transverse first channel 11121 is used to accommodate the initial and final sections of the flow pipe 13 and the water distribution connector 12. The transverse second channel 11122 is used to accommodate the inner transverse section in the U-shaped pipe. The inner transverse section is basically located within the effective use area of ​​the heating / cooling mattress. Through the above-mentioned setting of different intervals, the flow can be effectively and quickly divided, while avoiding the water flow wriggling feeling caused by the dense arrangement of transverse sections in the use area.

[0033] Furthermore, the number of each of the branch pipes 123 and the return branch pipes 124 is not less than three, and the number of the flow pipes 13 is not less than three. Preferably, the number is four or five. In specific embodiments, both the water distribution connector 12 and the flow pipes 13 can be made of materials such as ABS, PP, and PE.

[0034] In another preferred embodiment, the heated and cooled mattress main unit 2 further includes an air duct structure 24, and the inner cavity of the outer shell 201 is arranged from front to back and the electronic control module 21, the water tank module 22, the air duct structure 24 and the semiconductor cooling module 23 are respectively detachably installed. like Figure 8As shown, the air duct structure 24 has air guide surfaces 241 on its left and right sides. The air guide surfaces 241 are used to divide the inner cavity into two air inlet channels. The air duct structure 24 has a cavity 2442 at its bottom. The cavity 2442 is arranged through the front and rear direction and is used to accommodate the pipe. The outer shell 201 has a first ventilation port 202 on its left and right sides respectively. The rear wall of the outer shell 201 has a second ventilation port 203. The first ventilation ports 202 correspond to the left and right sides of the air duct structure 24 respectively. The air outlet of the air duct structure 24 faces the front end of the heat dissipation component 2312 of the semiconductor cooling module 23.

[0035] Preferably, such as Figure 3 As shown, a plurality of reinforcing plates 244 are provided between the opposing surfaces of the two air guiding surfaces 241. The reinforcement plates 244 ensure the stability of the air duct structure 24.

[0036] To further explain, the electronic control module 21, water tank module 22, air duct structure 24, and semiconductor refrigeration module 23 are arranged from front to back in the inner cavity, with the electronic control module 21 located at the front end. The airflow direction formed in the inner cavity is from front to back, ensuring the safety of product use, effectively preventing moisture in the airflow from affecting the electronic control module 21, extending the service life of the electronic control module 21, and solving the problem of turbulent airflow in the inner cavity of existing heating and cooling units, which poses safety risks to the use of electrical appliances.

[0037] An air duct structure 24 is added between the water tank module 22 and the semiconductor module to achieve zoned airflow guidance within the heated and cooled mattress main unit 2, and provides another zone (cavity 2442) for pipe layout, improving heat dissipation efficiency and effectively reducing the operating noise of the heated and cooled mattress main unit 2. In addition, the two first ventilation ports 202 on the left and right sides of the outer casing 201 and the second ventilation port 203 at the rear present ventilation ports on three different surfaces. Users can adjust the airflow direction according to the actual placement position. First, it can avoid the hot air from the heated and cooled mattress main unit 2 blowing directly on the comfort, and second, it can place the noisiest side of the heated and cooled mattress main unit 2 against the wall to further reduce noise, thereby improving the user experience. The air duct structure 24 has a cavity 2442 at the bottom for the layout of pipes, so that the water outlet of the water tank module 22 inside the heated and cooled mattress main unit 2 is connected to the water inlet of the water box 2314 of the semiconductor cooling module 23, and the main return water section 204 of the heated and cooled mattress main unit 2 is connected to the circulation inlet 2222 of the water tank module 22. Through the setting of the air duct structure 24, effective zoning and air guiding are achieved, solving the technical problems of low heat dissipation efficiency, high noise, and safety hazards caused by the lack of air guiding in the existing heated and cooled mattress main unit 2, where airflow flows throughout the entire interior of the heated and cooled mattress main unit 2, including between pipes and around the water pump 223.

[0038] In another preferred embodiment, the front end face of the air duct structure 24 is further provided with a water tank installation area, which is composed of two vertical plates 243 facing each other. The two vertical plates 243 extend forward along the front end face of the air duct structure 24, and the surface of the vertical plates 243 is provided with a plurality of countersunk holes 2431.

[0039] The countersunk hole 2431 is designed for pre-assembly with the water tank module 22. During the production process, the assembled water inlet 206 can be pre-assembled with the air duct structure 24. With the countersunk hole 2431, when the pre-assembly is installed using screws, the screw caps can be hidden inside the countersunk hole 2431, so that the side wall of the air duct structure 24 can better fit the inner wall of the outer shell 201, making the overall structure more compact.

[0040] Preferably, the surface of the vertical plate 243 is further provided with a top cover pre-positioning groove 2432 to position and install the top cover of the outer shell 201.

[0041] In another preferred embodiment, the cavity 2442 is formed by an arched tunnel below the air duct structure 24, and the top outer wall of the arched tunnel is connected to the air guide surface 241 and the first ventilation opening 202 in an arc segment.

[0042] The air duct structure 24, through the design of an arched tunnel, ensures that the bottom of the ventilation duct also has a streamlined air-guiding surface. This air-guiding surface is used to guide the incoming air to the fan assembly 232, further improving heat dissipation efficiency. The connection between the top outer wall of the arched tunnel and the first ventilation opening 202 via an arc segment refers to a detachable joint, while the connection between the top outer wall of the arched tunnel and the arc-shaped surface via an arc segment refers to an arc-shaped transition. The arched tunnel and the arc-shaped surface are integrally formed.

[0043] It should be noted that the air guide surface 241 can be a flat or curved surface, and the air guide surface 241 can be set obliquely or vertically, which can be determined in combination with the installation position of the fan assembly 232 and the air inlet and outlet positions.

[0044] In another preferred embodiment, the air guide surface 241 is an arc-shaped surface, and the left and right sides of the air duct structure 24 are symmetrically recessed with the arc-shaped surfaces, and the arc-shaped surfaces are arranged vertically, with the guide ends of the two arc-shaped surfaces connected together; the guide start end of the arc-shaped surface is connected to the first ventilation port 202.

[0045] The air duct structure 24 has a symmetrical arc-shaped surface that divides the inner cavity of the heated and cooled mattress main unit 2 into two ventilation channels of the same size, making the airflow inside the heated and cooled mattress main unit 2 more stable. The connection between the guide end of the arc-shaped surface and the first vent 202 refers to a manually detachable splicing, not a connection.

[0046] The arc angles and dimensions (length, width, and height) involved in the aforementioned arc surfaces and arched tunnels need to be considered in conjunction with the actual dimensions and internal structural design of the heating and cooling mattress main unit 2. Specifically, the preferred range can be determined by those skilled in the art after comprehensively considering factors such as airflow direction, heat dissipation efficiency, and structural processing, using existing calculation and testing methods.

[0047] To further explain, the semiconductor cooling module 23 includes a cooling / heating component 231 and a fan component 232; as... Figure 16 As shown, the cooling and heating assembly 231 includes a cooling device 2311, a heat dissipation component 2312, and a heat conduction component 2313. The cooling device 2311 has a cold end and a hot end, and water boxes 2314 that communicate with each other are respectively provided on the outer side of the cold end and the hot end. The heat dissipation component 2312 is located directly above the cooling device 2311, and the heat dissipation component 2312 includes a plurality of heat dissipation fins 23121, which are arranged in sequence at intervals. The heat conduction component 2313 has multiple Each heat sink 23121 has a through hole 23122 corresponding to the heat conduction component 2313. All through holes 23122 corresponding to the same heat conduction component 2313 are coaxially opened. One end of the heat conduction component 2313 is fixed to the hot end of the cooling device 2311, and the other end passes through the corresponding through hole 23122. The heat conduction component 2313 is connected to the heat sink 23121. The area where the heat conduction component 2313 passes through the heat sink 2312 is a vertically arranged straight section. The fan assembly 232 is installed between the front end of the heat dissipation component 2312 and the air duct structure 24, or the fan assembly 232 is installed between the rear end of the heat dissipation component 2312 and the second ventilation section. The water inlet of the semiconductor cooling module 23 is the water inlet of one of the water boxes 2314, and both the water inlet and outlet of the water box 2314 are located below the water box 2314.

[0048] The design of the above-mentioned air duct components supports the fan assembly 232 to be placed at the front (front end of heat dissipation component 2312) or at the rear (rear end of heat dissipation component 2312). The design of the fan assembly 232 can be both blowing and sucking air. Those skilled in the art can choose according to actual design requirements, so that the internal layout of the heating and cooling mattress main unit 2 is flexible.

[0049] It should be noted that the fan assembly 232 is existing technology in the field of cooling fans. In a specific embodiment, the fan assembly 232 includes a fan frame and an impeller, the impeller being installed inside the fan frame. The fan frame has mounting holes, and the fan frame is generally square in shape. In other embodiments, a circular fan frame or a cooling fan with multiple impellers can also be used, depending on the product's heat dissipation requirements and structural design.

[0050] The water inlet and outlet of the water box 2314 are both located at the bottom, which is in line with the overall water circuit layout of the heating and cooling mattress main unit 2. This allows all the pipes to be moved to the bottom, and at the same time, the two sides of the semiconductor cooling module 23 can be designed to fit the inner wall of the outer shell 201, which is more conducive to the miniaturization and integration design of the heating and cooling mattress main unit 2.

[0051] In another preferred embodiment, the cooling and heating assembly 231 includes two pre-installation plates 2315, which are positioned opposite each other and spaced apart. The cooling device 2311 and the heat dissipation component 2312 are both positioned between the two pre-installation plates 2315. The outer side of each pre-installation plate 2315 has several pre-drilled holes 2315-1. The use of pre-installation plates 2315 allows for the individual assembly of the cooling and heating assembly 231. After individual assembly, the assembly can be combined with the main unit of the heated and cooled mattress 2, thereby improving production efficiency through modular assembly. In a specific embodiment, the reserved holes 2315-1 are respectively provided on the bottom, front end and rear end of the pre-installation plate 2315. The reserved holes 2315-1 located at the bottom are used for connecting the cooling and heating component 231 to the outer shell 201 of the cooling and heating mattress host 2. The reserved holes 2315-1 located on the front end or rear end are used for installing the fan component 232. Specifically, screws can be used for fixed installation.

[0052] In another preferred embodiment, such as Figure 17As shown, the pre-installation plate 2315 has a window 2315-2 in the area corresponding to the refrigeration device 2311; the pre-installation plate 2315 is a sheet metal part, and the pre-installation plate 2315 includes a vertical plane 23151, a bent side edge 23152, a bent top edge 23153, and a bent bottom edge 23154. The bent side edge 23152 is bent inward on both sides of the vertical plane 23151, and the bent side edge 23152 is provided with the reserved hole 2315-1. 3152 also has a first mounting hole 2315-3 for mounting to the bottom of the heat dissipation component 2312. The top edge of the vertical plane 23151 is bent inward to form a bent top edge 23153. The bent top edge 23153 has a second mounting hole 2315-4 for mounting to the top of the heat dissipation component 2312. The bottom edge of the vertical plane 23151 is bent outward to form a bent bottom edge 23154. The bent bottom edge 23154 has a connection hole for connecting to the outer casing 201. The opening of the window 2315-2 avoids the sheet metal parts from affecting the normal operation of the cooling device 2311, extends the service life of the cooling device 2311, and the window 2315-2 can also play a role in fixing the cooling device 2311. Furthermore, bending the top edge 23153 and bottom edge 23154 in different directions enables the fixed installation of the internal structure of the cooling and heating component 231 itself, and also facilitates the fixed installation between the overall cooling and heating component 231 and other components or the outer casing 201. The proposed pre-installation plate 2315 is used for the internal assembly of the semiconductor cooling module 23, providing good fixation and support for the heat dissipation component 2312, and for fixing and supporting the semiconductor cooling module 23 when it is fully assembled inside the cooling and heating mattress main unit 2. This allows the semiconductor cooling module 23 inside the cooling and heating mattress main unit 2 to be disassembled independently, facilitating installation and maintenance and improving production efficiency.

[0053] Preferably, L-shaped support members 2316 are respectively installed on the opposite surfaces of the two pre-installation plates 2315. The L-shaped support members 2316 are used to support the heat dissipation component 2312 and improve the structural stability of the pre-installation plate 2315.

[0054] In another preferred embodiment, a filter screen 224 is further included, which is detachably installed on the water inlet 206. The filter screen 224 is provided to block external impurities (such as animal hair and bedding lint) from entering the double-layered water tank, thus preventing interference with the operation of the water pump 223. In a specific embodiment, the filter screen 224 can be filter cotton (e.g., synthetic fiber filter cotton, non-woven filter cotton, glass fiber filter cotton, or activated carbon filter cotton), specifically detachably installed on the water inlet 206 via a filter cotton frame. This detachability can be achieved by using interlocking threads for screw-on installation and fixation through rotation, or by using a flexible snap-fit ​​structure to achieve detachability of the filter cotton frame.

[0055] In another preferred embodiment, a closed-loop water storage area is provided between the outer periphery of the inner circulation tank 222 and the inner wall of the outer water supply tank 221. The circulation inlet 2222 and the circulation outlet 2223 are both located at the bottom 222-2 of the inner circulation tank 222. The closed-loop water storage area refers to the water storage area surrounding the outer periphery of the inner circulation tank 222. This closed-loop water storage area isolates the outer periphery of the inner circulation tank 222, effectively reducing the feeling of coldness / heat when touched from the outside, and also preventing condensation on the outer wall that would occur with a separate inner circulation tank 222.

[0056] In another preferred embodiment, the outer water replenishment tank 221, the top of the inner circulation tank 222, and the outer periphery of the inner circulation tank 222 are integrally formed, and the vertical cross-section of the integrally formed structure is similar to a " The inner circulation box 222 is shaped like a "". The bottom surface of the outer periphery of the inner circulation box 222 is provided with a mounting part 222-1. The bottom 222-2 of the inner circulation box 222 is provided with a bottom mounting part 222-21 that cooperates with the mounting part 222-1. The bottom 222-2 of the inner circulation box 222 is sealed and installed on the bottom surface of the outer periphery of the inner circulation box 222.

[0057] In a specific embodiment, as shown in the figure, the mounting part 222-1 can be an annular groove, and the bottom mounting part 222-21 is an annular protrusion that mates with the annular groove. The annular protrusion is fitted into the annular groove and fixed with adhesive. In another embodiment, the bottom mounting part 222-21 can be an annular groove formed at the bottom 222-2 of the inner circulation box 222, and the corresponding mounting part 222-1 is an annular protrusion that is fitted into the annular groove and fixed with adhesive.

[0058] In another preferred embodiment, the outer water supply tank 221 consists of a lid and a body with an open opening. The lid covers the open opening of the body, and the water inlet 2211 is located on the lid. The top of the body and the inner circulation tank 222 are integrally formed with the outer circumference of the inner circulation tank 222. The bottom surface of the outer circumference of the inner circulation tank 222 is provided with a mounting part 222-1, and the bottom 222-2 of the inner circulation tank 222 is provided with a bottom mounting part 222-21 that cooperates with the mounting part 222-1. The bottom 222-2 of the inner circulation tank 222 is sealed and installed on the bottom surface of the outer circumference of the inner circulation tank 222. The separate design of the outer water supply tank 221 facilitates processing and reduces processing difficulty, while also facilitating subsequent assembly. In a specific embodiment, the lid and the body are fixed with adhesive.

[0059] In another specific embodiment, the outer wall of the outer water tank 221 is also provided with a number of mounting protrusions. The mounting protrusions are used to install and connect with the heating and cooling mattress host 2. Specifically, the mounting protrusions are provided with threaded grooves, and screws or bolts pass through the through holes of the outer shell 201 of the heating and cooling mattress host 2 and are threadedly connected in the threaded grooves.

[0060] In another preferred embodiment, such as Figure 13 As shown, a plurality of water replenishment holes 2221 are provided, and these holes are distributed on the top and / or sides of the inner circulation tank 222. The provision of these water replenishment holes 2221 allows for timely replenishment of water to the inner circulation tank 222. In a more preferred embodiment, the water replenishment holes 2221 are positioned close to the circulation outlet 2223. Combined with the placement of the circulation inlet 2222 and circulation outlet 2223, this reduces mutual interference between the various inflow and outflow water flows within the inner circulation tank 222, optimizing the water flow pattern within the inner circulation tank 222. In a preferred embodiment, the water replenishment hole 2221 is divided into a round hole 22211 and a strip hole 22212. Several round holes 22211 are respectively arranged on the top of the inner circulation tank 222. The round holes 22211 are not located directly below the water inlet 2211 of the outer water replenishment tank 221, so as to avoid the entry of gas into the inner circulation tank 222 during water replenishment, which would affect the operation of the water pump 223. Several strip holes 22212 are respectively vertically arranged on the side of the inner circulation tank 222. Both the round holes 22211 and the strip holes 22212 are set close to the circulation outlet 2223, so as to obtain a better water flow pattern.

[0061] In another preferred embodiment, a support frame 225 is further included, located below the outer water supply tank 221. The support frame 225 forms a receiving cavity 22501 directly below the outer water supply tank 221, which is used to accommodate the water pump 223. The water tank module 22 is designed as a vertically distributed module to facilitate modular installation within the heating / cooling mattress main unit 2. Furthermore, in addition to accommodating the water pump 223, the receiving cavity 22501 can also accommodate an anti-interference magnetic ring.

[0062] Preferably, such as Figure 14 As shown, the support frame 225 has an n-shaped structure, which consists of a horizontal top 2251 and two vertical sides 2252. The opposite sides of the horizontal top 2251 are respectively connected to the vertical sides 2252. The other two opposite sides of the horizontal top 2251 are respectively provided with limiting portions 22511 extending upward. The bottom of the vertical sides 2252 extends horizontally with an installation portion 22521. The installation portion 22521 is used for installation with the heating and cooling mattress main unit 2. The limiting portion 22511 is used to limit the outer water tank 221.

[0063] The support frame 225 with the above-mentioned n-shaped structure not only forms a receiving cavity 22501, but can also be used to fix the heating and cooling mattress main unit 2 and to limit the outer water tank 221, simplifying the internal structure of the heating and cooling mattress main unit 2 and facilitating the assembly of the water tank module 22.

[0064] In another preferred embodiment, the double-layer water tank is equipped with a liquid level sensor and a first temperature limiter, and the inlet pipe 121 and outlet pipe 122 of the water distribution connector 12 are respectively equipped with temperature sensors. The liquid level sensor, the first temperature limiter and the temperature sensor are respectively electrically connected to the electronic control module 21; the heat-conducting component 2313 is equipped with a second temperature limiter. When the water level in the double-layer water tank is lower than the low water level value, the liquid level sensor sends a water shortage signal to the electronic control module 21, and the electronic control module 21 controls the water pump 223 to stop working. When the temperature inside the double-layer water tank is higher than the preset value, the first temperature limiter sends an overheat signal to the electronic control module 21, and the electronic control module 21 controls the TEC chip in the semiconductor cooling module 23 to stop working. The temperature sensor is used to obtain the water temperature at the inlet pipe 121 and the outlet pipe 122, and feeds the water temperature back to the electronic control module 21. The electronic control module 21 controls the voltage input to the TEC chip, thereby controlling the cooling / heating temperature of the TEC chip. When the temperature of the heat-conducting component 2313 is higher than the preset value, the second temperature limiter sends a signal that the heat pipe temperature is too high to the electronic control module 21, and the electronic control module 21 controls the TEC chip in the semiconductor cooling module 23 to stop working.

[0065] By configuring the liquid level sensor, the first temperature limiter, and the temperature sensor, precise control of the return flow temperature is achieved, preventing the heating / cooling mattress main unit 2 from overheating and shutting down. Preferably, when the second temperature limiter sends a signal to the electronic control module 21 indicating that the heat pipe temperature is too high, the electronic control module 21 also cuts off the power to the heating / cooling mattress main unit 2 to prevent electrical malfunctions caused by overheating. In a specific embodiment, the first temperature limiter is installed slightly below the double-layer water tank to prevent overheating and safety incidents caused by sensor failure.

[0066] It should be noted that the electronic control module 21 is existing technology. In a specific embodiment, the electronic control module 21 includes a control board, a display screen, and several buttons. The control board is electrically connected to the water tank module 22, the semiconductor cooling module 23, the display screen, and the buttons. The buttons can be touch buttons, divided into several buttons for controlling different functions such as heating, cooling, starting, and turning off. The control board controls the operation of the water tank module 22 and the semiconductor cooling module 23 according to the triggering of different buttons. For example, when the user triggers the start button, the control board controls the water pump 223 in the water tank module 22 to start, obtains the current water temperature in the water tank module 22, determines whether heating / cooling is needed, and controls the semiconductor cooling module 23 to heat / cool, thereby realizing the start-up and operation of the heated and cooled mattress. The display screen is used to display the working status of the heated and cooled mattress host 2, including temperature, whether water needs to be added, Bluetooth / wireless functions, etc. The functions mentioned are all functions that can be realized by the existing heated and cooled mattress host 2 display screen and are not improvements of this invention, so they will not be described in detail.

[0067] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. A heated and cooled mattress, comprising a mattress structure, a heated and cooled mattress main unit, a water inlet extension pipe, and a water outlet extension pipe, characterized in that: The mattress structure includes a mattress body, a water distribution connector, and several flow pipes; the surface of the mattress body has a groove structure; one end of each flow pipe is connected to the branch pipe of the water distribution connector, and the other end of each flow pipe is connected to the return branch pipe of the water distribution connector. Each flow pipe is embedded in the groove structure to form a U-shaped pipe. Several flow pipes form several U-shaped pipes of different sizes, and the U-shaped pipes are nested in order from smallest to largest. The heated and cooled mattress main unit includes a shell, an electronic control module, a water tank module, and a semiconductor refrigeration module. The top of the shell has a water inlet, and the bottom rear side of the shell has a main return water section and a main outlet water section. The electronic control module, the water tank module, and the semiconductor refrigeration module are detachably installed inside the shell. The water tank module includes a double-layer water tank, which has an outer replenishment tank and an inner circulation tank nested together. The outer wall of the inner circulation tank has a water inlet hole, and the inner circulation tank has a circulation inlet and a circulation outlet. The outer replenishment tank and the inner circulation tank are connected through the water inlet hole. The outer replenishment chamber has a water inlet connected to the water inlet. The circulation outlet is connected to the inlet of the semiconductor refrigeration module via a water pump. The circulation inlet is connected to the outlet of the main return water section. The inlet of the main return water section is connected to the outlet pipe of the water distribution connector through the outlet extension pipe, and the inlet of the main outlet water section is connected to the outlet of the semiconductor refrigeration module; the outlet of the main outlet water section is connected to the inlet pipe of the water distribution connector through the inlet extension pipe. The electronic control module controls the operating status of the water tank module and the semiconductor refrigeration module.

2. The cooling and heating mattress according to claim 1, characterized in that: The main unit of the heated and cooled mattress also includes an air duct structure. The inner cavity of the outer shell is arranged from front to back and the electronic control module, the water tank module, the air duct structure and the semiconductor refrigeration module are detachably installed respectively. The air duct structure has air guide surfaces on its left and right sides, which are used to divide the inner cavity into two air inlet channels. The air duct structure has a cavity at its bottom, which runs through the front and back direction and is used to accommodate the pipe. The outer shell has a first ventilation opening on its left and right sides, and a second ventilation opening on its rear wall. The first ventilation openings correspond to the left and right sides of the air duct structure, and the air outlet of the air duct structure faces the front end of the heat dissipation component of the semiconductor cooling module.

3. The cooling and heating mattress according to claim 2, characterized in that: The front end of the air duct structure is also provided with a water tank installation area, which is composed of two vertical plates facing each other. The two vertical plates extend forward along the front end of the air duct structure, and the surface of the vertical plates is provided with several countersunk holes.

4. A cooling and heating mattress according to claim 2, characterized in that: The cavity is formed by an arched tunnel at the bottom of the air duct structure, and the top outer wall of the arched tunnel is connected to the air guide surface and the first ventilation opening by an arc segment.

5. A cooling and heating mattress according to claim 2, characterized in that: The air guide surface is an arc-shaped surface. The left and right sides of the air duct structure are symmetrically recessed with the arc-shaped surfaces, and the arc-shaped surfaces are arranged vertically. The guide ends of the two arc-shaped surfaces are connected; the guide beginning of the arc-shaped surface is connected to the first ventilation opening.

6. A cooling and heating mattress according to claim 1, characterized in that: The semiconductor cooling module includes a cooling and heating component and a fan component; the cooling and heating component includes a cooling device, a heat dissipation component, and a heat conduction component. The cooling device has a cold end and a hot end, and water boxes that communicate with each other are respectively provided on the outer side of the cold end and the hot end. The heat dissipation component is located directly above the cooling device. The heat dissipation component includes a plurality of heat sinks, which are arranged in sequence at intervals. There are multiple heat conduction components. Each heat sink has a through hole corresponding to the heat conduction component. All through holes corresponding to the same heat conduction component are opened coaxially. One end of the heat conduction component is fixed to the hot end of the cooling device, and the other end passes through the corresponding through holes. The heat conduction component is connected to the heat sink. The area where the heat conduction component passes through the heat dissipation component is a vertically arranged straight section. The fan assembly is installed between the front end of the heat dissipation component and the air duct structure, or the fan assembly is installed between the rear end of the heat dissipation component and the second ventilation section. The water inlet of the semiconductor cooling module is the water inlet of one of the water boxes, and both the water inlet and outlet of the water box are located below the water box.

7. A cooling and heating mattress according to claim 6, characterized in that: The cooling and heating assembly includes two pre-installation plates, which are positioned opposite each other and spaced apart. The cooling device and the heat dissipation component are both installed between the two pre-installation plates. Several reserved holes are provided on the outer side of the pre-installation plates.

8. A cooling and heating mattress according to claim 7, characterized in that: The pre-installation plate has a window in the area corresponding to the cooling device; the pre-installation plate is a sheet metal part, and the pre-installation plate includes a vertical plane, a bent side edge, a bent top edge, and a bent bottom edge. The two sides of the vertical plane are bent inwards to form the bent side edge, and the bent side edge is provided with the reserved hole. The bent side edge is also provided with a first mounting hole for mounting to the bottom of the heat dissipation component. The top edge of the vertical plane is bent inwards to form the bent top edge, and the bent top edge is provided with a second mounting hole for mounting to the top of the heat dissipation component. The bottom edge of the vertical plane is bent outwards to form the bent bottom edge, and the bent bottom edge is provided with a connection hole for connecting to the outer casing.

9. A cooling and heating mattress according to claim 1, characterized in that: It also includes a filter screen, which is detachably installed at the water inlet.

10. A cooling and heating mattress according to claim 1, characterized in that: The double-layer water tank is equipped with a liquid level sensor and a first temperature limiter. The inlet and outlet pipes of the water distribution connector are respectively equipped with temperature sensors. The liquid level sensor, the first temperature limiter, and the temperature sensors are respectively electrically connected to the electronic control module. The heat-conducting component is equipped with a second temperature limiter. When the water level in the double-layer water tank is lower than the low water level value, the liquid level sensor sends a water shortage signal to the electronic control module, and the electronic control module controls the water pump to stop working. When the temperature inside the double-layer water tank is higher than the preset value, the first temperature limiter sends an overheat signal to the electronic control module, and the electronic control module controls the TEC chip in the semiconductor cooling module to stop working. The temperature sensor is used to acquire the water temperature at the inlet pipe and the outlet pipe, and feeds the water temperature back to the electronic control module, which controls the voltage input to the TEC chip, thereby controlling the cooling / heating temperature of the TEC chip; When the temperature of the heat-conducting component is higher than the preset value, the second temperature limiter sends a signal that the heat pipe temperature is too high to the electronic control module, and the electronic control module controls the TEC chip in the semiconductor cooling module to stop working.

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