Adjustable semiconductor chip packaging colloid filling and sealing device

Abstract

The invention discloses an adjustable semiconductor chip packaging colloid filling and sealing device which comprises a bottom frame, a sliding plate adheres to the middle of the upper end of the bottom frame, one side of the sliding plate is in bolt connection with a second motor, the output end of the second motor is fixedly connected with a second lead screw through a coupler, and the second lead screw and the sliding plate are rotationally connected. A movable plate is slidably connected to the surface of the sliding plate, the movable plate and the second lead screw are in threaded connection, and an anti-flowing assembly is arranged on one side of the upper end of the bottom frame. The purification structure is divided into two surfaces, when one surface of the purification structure loses the effect due to long-time purification, the other surface can be quickly switched for continuous purification, and the trouble of frequently replacing the purification structure can be reduced while the space is saved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor chip packaging technology, and specifically relates to an adjustable semiconductor chip packaging colloid potting device. Background Technology

[0002] Semiconductor chips are miniature electronic devices that integrate transistors, resistors, and other components onto a thin film using semiconductor materials such as silicon and germanium as a substrate and through precision processes such as photolithography and etching. They are the core of the electronics and information industry. They achieve information processing, storage, and transmission through circuits. Transistors act as switching units, using "0" and "1" signals to complete logic processing. The higher the integration level (such as nanometer-level processes), the stronger the performance and the lower the energy consumption. Chips are small in size and highly efficient, and are widely used in consumer electronics, communication equipment, artificial intelligence, aerospace, medical, and industrial control fields. They are a key support for digital development. Manufacturing requires collaboration among multiple disciplines such as materials science and precision engineering, involving over a hundred processes and extremely high technological barriers. From the purification of high-purity silicon to nanometer-level photolithography, every step relies on cutting-edge technology and process innovation, making it an important indicator of technological strength.

[0003] After the existing semiconductor chip potting machine has finished potting, it usually gathers the potted chips aside. Once a certain number have been gathered, the chips are moved into the curing chamber to cure the adhesive on the chips. However, during this gathering and moving process, the adhesive can easily run due to chip tilting, vibration when handling the chips, or accidental contact with the adhesive, resulting in poor chip potting effect. Therefore, further improvements to the adhesive potting device are needed to address this problem. Summary of the Invention

[0004] The purpose of this invention is to provide an adjustable semiconductor chip encapsulation colloid potting device, which has the advantage of pre-curing the adhesive surface layer on the surface of the encapsulated chip.

[0005] The above-mentioned technical objective of the present invention is achieved through the following technical solution: an adjustable semiconductor chip encapsulation colloid potting device, including a base frame, a slide plate is bonded to the middle of the upper end of the base frame, a second motor is bolted to one side of the slide plate, a second lead screw is fixedly connected to the output end of the second motor through a coupling, and the second lead screw and the slide plate are rotatably connected, a movable plate is slidably connected to the surface of the slide plate, and the movable plate and the second lead screw are threadedly connected, and an anti-flow component is provided on one side of the upper end of the base frame;

[0006] A vertical frame is welded to the upper end of the base frame. A first motor is bolted to one side of the vertical frame. The output end of the first motor is fixedly connected to a first lead screw via a coupling, and the first lead screw is rotatably connected inside the vertical frame. A sliding plate is slidably connected inside the vertical frame, and the sliding plate is threadedly connected to the first lead screw. A sprayer is slidably connected inside the sliding plate. A nozzle is welded to the lower end of the sprayer. An electric push rod is bolted to the upper end of the sliding plate, and the piston end of the electric push rod is bolted to the upper end of the sprayer. A delivery pipe is fixedly connected to one side of the sprayer. A pump body is fixedly connected to one end of the delivery pipe. A glue tank is bolted to the surface of the pump body. A connecting pipe is fixedly connected to the other end of the pump body, and the connecting pipe is located inside the glue tank.

[0007] Using the above technical solution, during use, pre-treated epoxy resin (suitable for the insulation and sealing requirements of chip packaging) is injected into the glue tank. Then, the chip substrate to be potted is placed on the surface of the movable plate, ensuring accurate substrate positioning. During potting, the second motor is activated, causing the second ribbon to drive the movable plate to slide along the slide plate, moving the first chip to be potted on the substrate directly below the nozzle. This facilitates potting the chips vertically on the substrate surface. Subsequently, the first motor is activated, and the first lead screw drives the sliding plate to fine-tune the lateral position of the nozzle, ensuring alignment with the chip. The dispensing area facilitates dispensing of epoxy resin onto chips positioned laterally on the substrate surface. The electric actuator is then activated to adjust the nozzle height (typically 2-5mm from the chip surface to avoid glue splashing). During dispensing, because the connecting tube is located at the bottom of the glue tank, the pump draws epoxy resin from the tank upwards through the connecting tube (pre-treated epoxy resin is injected into the tank; the pump model is a single-screw pump). The pump then delivers this resin through the delivery pipe to the sprayer, which ultimately controls the epoxy resin... The epoxy resin is sprayed from inside the nozzle onto the chip surface, completing the encapsulation of a single chip. Epoxy resin is suitable for chip encapsulation because of its excellent insulation properties, which protect the circuit from short circuits; its good fluidity, which can fill tiny gaps; its strong sealing properties after curing, which isolate moisture, dust, and other contaminants; its stable mechanical properties, combining hardness and toughness, which can buffer vibration and impact; its wide range of high and low temperature resistance, which can adapt to the temperature differences of chip operation; and its strong chemical inertness and aging resistance, which can maintain the protective effect for a long time. After the chips on the substrate surface are encapsulated, the second motor runs and the second lead screw rotates, which drives the movable plate to move into the anti-flow component. The anti-flow component uses high temperature to cure a layer on the outer surface of the adhesive. During the curing process, the epoxy resin will produce harmful gases, which will be further purified. The purification structure is divided into two sides. When one side of the purification structure loses its effectiveness due to long-term purification, it can be quickly switched to the other side for continuous purification. This saves space and reduces the trouble of frequently changing the purification structure. Repeat the above steps and adjust by "vertical + horizontal" to complete the encapsulation of all chips on the substrate.

[0008] The present invention is further configured such that: the anti-flow component includes a processing shell, the processing shell is welded to one side of the upper end of the base frame, a first hole is opened on one side of the processing shell, an opening and closing plate is detachably connected inside one side of the processing shell, a connecting plate is welded to one end of one side of the opening and closing plate, a curved plate is welded to one end of the processing shell, and a telescopic spring is connected between the curved plate and the connecting plate through a spring fixing component.

[0009] Using the above technical solution, the opening and closing plate can be pulled out from inside the processing shell, which will expose the first hole.

[0010] The present invention is further configured such that: a mounting shell is welded to one side of the processing shell, a rotating rod is welded inside the mounting shell, a baffle is rotatably connected to the surface of the rotating rod, and a placement plate is welded to both sides of the inner wall of the processing shell.

[0011] Using the above technical solution, when the baffle is pushed from the outside by the substrate (with chips on its surface) during the movement process, the baffle will rotate inside the mounting shell using a rotating rod, and the placement plate is used to place the substrate and chips.

[0012] The present invention is further configured such that: a second hole is provided on one side of the processing shell, a third hole is provided on the upper end of the processing shell, a vertical plate is welded to one side of the upper end of the processing shell, and a fourth hole is provided on the surface of the vertical plate.

[0013] Using the above technical solution, the second hole facilitates the entry of the substrate and chip into the processing shell, and the fourth hole is connected to the hole on the surface of the shell.

[0014] The present invention is further configured such that: a support ring is welded to the upper end of the upright plate, and a rotating shaft is rotatably connected to both sides of the upper end of the upright plate, and the rotating shaft is disposed inside the support ring; a fixing plate is fixedly connected to the upper end of the rotating shaft, and a limit shell is welded to both ends of both sides of the fixing plate.

[0015] Using the above technical solution, the rotating shaft is used for the rotation of the fixing plate, the inside of the fixing plate is used for fixing the iron sheet, and the limiting shell is used for limiting the first activated carbon cotton after installation.

[0016] The present invention is further configured such that: an iron sheet is fixedly connected inside the fixed plate; a fixed shell is welded to both ends of the iron sheet; a spring rod is bolted to both sides of the fixed shell; a clamping plate is bolted to the piston ends of the two sets of spring rods; a first activated carbon cotton is detachably connected between both sides of the iron sheet and the four sets of clamping plates; and the clamping plate and the fixed shell are slidably connected.

[0017] Using the above technical solution, when the first activated carbon cotton is located inside the clamping plate, the spring push rod will push the clamping plate to hold the first activated carbon cotton on the surface, thereby fixing the position of the first activated carbon cotton.

[0018] The present invention is further configured such that: the surfaces of the two sets of first activated carbon cotton are detachably connected to a top cover, a second activated carbon cotton is bonded to the top of the top cover, a third activated carbon cotton is bonded to the inner wall of the top cover, and weight blocks are welded to both sides of the outer surface of the top cover.

[0019] Using the above technical solution, both the second and third activated carbon cotton are used to purify and absorb harmful gases, and the weight block is used to prevent the top cover from being blown away by the gas due to its light weight after installation.

[0020] The present invention is further configured such that: two sets of second through holes are provided on both sides of the surface of the upper cover and the second activated carbon cotton, two sets of first through holes are provided on both sides of the upper cover, and the second through holes are detachably connected to the clamping plate, and the first through holes are detachably connected to the spring top rod.

[0021] Using the above technical solution, the second through hole and the first through hole are respectively fitted onto the surface of the clamping plate and the spring push rod. The second through hole can limit the clamping plate and prevent it from moving.

[0022] The invention is further configured such that: slide rails are welded to both sides of the upper end of the processing shell, and rectangular plates are slidably connected to the surfaces of the two sets of slide rails; a heater is bolted to one side of the rectangular plate, and a housing is bolted to the other side of the rectangular plate; a fan blade is rotatably connected inside the housing; and a third motor is fixedly connected to one end of the fan blade via a coupling, with the third motor bolted inside the housing.

[0023] Using the above technical solution, the heater is used to heat the epoxy resin adhesive on the chip surface. When the third motor is running, it will drive the fan blades to rotate, thereby drawing the harmful gas inside the processing shell upward.

[0024] In summary, the present invention has the following beneficial effects:

[0025] In use, pre-treated epoxy resin (suitable for the insulation and sealing requirements of chip packaging) is injected into the glue tank. Then, the chip substrate to be potted is placed on the movable plate surface, ensuring accurate substrate positioning. During potting, the second motor is activated, causing it to drive the movable plate along the slide plate, moving the first chip to be potted on the substrate directly below the nozzle. This facilitates potting the chips vertically on the substrate surface. Then, the first motor is activated, and the first lead screw drives the sliding plate to fine-tune the lateral position of the nozzle, ensuring it is aligned with the chip potting area. This facilitates encapsulation of chips positioned laterally on the substrate surface. The electric actuator is then activated, and the nozzle height is adjusted (typically 2-5mm from the chip surface to avoid adhesive splashing). During encapsulation, because the connecting tube is located at the bottom of the adhesive tank, the pump draws epoxy resin from the tank upwards through the connecting tube (pre-treated epoxy resin is injected into the tank; the pump model is a single-screw pump). The pump then delivers this adhesive through the delivery pipe to the sprayer. Finally, the sprayer controls the flow of epoxy resin from... The epoxy resin is sprayed from inside the nozzle onto the chip surface, completing the encapsulation of a single chip. Epoxy resin is suitable for chip encapsulation because of its excellent insulation properties, which protect the circuit from short circuits; its good fluidity, which can fill tiny gaps; its strong sealing properties after curing, which isolate moisture, dust and other contaminants; its stable mechanical properties, which combine hardness and toughness, and can buffer vibration and impact; its wide range of high and low temperature resistance, which can adapt to the temperature differences of chip operation; and its strong chemical inertness and aging resistance, which can maintain the protective effect for a long time. After the chips on the substrate surface are encapsulated, the second motor runs and the second lead screw rotates, which drives the movable plate to move into the anti-flow component. The anti-flow component uses high temperature to cure a layer of the glue on the outer surface. During the curing process, the epoxy resin will produce harmful gases, which will be further purified. The purification structure is divided into two sides. When one side of the purification structure loses its effectiveness due to long-term purification, it can be quickly switched to the other side for continuous purification. This saves space and reduces the trouble of frequently changing the purification structure. Repeat the above steps and adjust the "vertical and horizontal" to complete the encapsulation of all chips on the substrate. Attached Figure Description

[0026] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the present invention;

[0027] Figure 2 This is a schematic perspective view of the glue container structure of the present invention;

[0028] Figure 3 This is a schematic perspective view of the slide rail structure of the present invention;

[0029] Figure 4 This is a schematic perspective view of the shell structure of the present invention;

[0030] Figure 5 This is a schematic perspective view of the vertical plate structure of the present invention;

[0031] Figure 6 This is a schematic perspective view of the first activated carbon cotton structure of the present invention;

[0032] Figure 7 This is a schematic perspective view of the upper cover structure of the present invention;

[0033] Figure 8 This is a schematic perspective view of the rotating shaft structure of the present invention;

[0034] Figure 9 This is a schematic perspective view of the baffle structure of the present invention;

[0035] Figure 10 This is a schematic perspective view of the pump body structure of the present invention;

[0036] Figure 11 This is a schematic perspective view of the placement plate structure of the present invention.

[0037] Figure label:

[0038] 1. Base frame; 2. Upright frame; 3. First motor; 4. First lead screw; 5. Moving plate; 6. Electric push rod; 7. Sprayer; 8. Spray nozzle; 9. Supply pipe; 10. Glue tank; 11. Second motor; 12. Slide plate; 13. Movable plate; 14. Anti-flow assembly; 1401. Machining shell; 1402. Mounting shell; 1403. Rotating rod; 1404. Baffle; 1405. First hole; 1406. Second hole; 1407. Opening and closing plate; 1408. Slide rail; 1409. Heater; 1410. Rectangular plate; 1411. Housing; 1412. Fan blade; 1413. Third motor; 1414. Upright plate; 141 5. Fourth hole; 1416. Support ring; 1417. Rotating shaft; 1418. Fixing plate; 1419. Limiting shell; 1420. Spring top rod; 1421. Fixing shell; 1422. Clamping plate; 1423. First activated carbon cotton; 1424. Top cover; 1425. Second activated carbon cotton; 1426. Weight block; 1427. Third activated carbon cotton; 1428. First through hole; 1429. Second through hole; 1430. Placement plate; 1431. Third hole; 1432. Iron sheet; 1433. Connecting plate; 1434. Telescopic spring; 1435. Bend plate; 15. Second lead screw; 16. Pump body; 17. Connecting pipe. Detailed Implementation

[0039] The present invention will be further described in detail below with reference to the accompanying drawings.

[0040] Example 1:

[0041] refer to Figure 1-11An adjustable semiconductor chip encapsulation colloid potting device includes a base frame 1, a slide plate 12 is bonded to the middle of the upper end of the base frame 1, a second motor 11 is bolted to one side of the slide plate 12, a second lead screw 15 is fixedly connected to the output end of the second motor 11 through a coupling, and the second lead screw 15 is rotatably connected to the slide plate 12, a movable plate 13 is slidably connected to the surface of the slide plate 12, and the movable plate 13 is threadedly connected to the second lead screw 15, and an anti-flow component 14 is provided on one side of the upper end of the base frame 1;

[0042] A vertical frame 2 is welded to the upper end of the base frame 1. A first motor 3 is bolted to one side of the surface of the vertical frame 2. The output end of the first motor 3 is fixedly connected to a first lead screw 4 via a coupling. The first lead screw 4 is rotatably connected inside the vertical frame 2. A sliding plate 5 is slidably connected inside the vertical frame 2. The sliding plate 5 is threadedly connected to the first lead screw 4. A sprayer 7 is slidably connected inside the sliding plate 5. A nozzle 8 is welded to the lower end of the sprayer 7. An electric push rod 6 is bolted to the upper end of the sliding plate 5. The piston end of the electric push rod 6 is bolted to the upper end of the sprayer 7. A delivery pipe 9 is fixedly connected to one side of the sprayer 7. A pump body 16 is fixedly connected to one end of the delivery pipe 9. A glue tank 10 is bolted to the surface of the pump body 16. A connecting pipe 17 is fixedly connected to the other end of the pump body 16. The connecting pipe 17 is located inside the glue tank 10.

[0043] Brief description of usage: During use, pre-treated epoxy resin (suitable for the insulation and sealing requirements of chip packaging) is injected into the glue tank 10. The chip substrate to be glued is then placed on the surface of the movable plate 13, ensuring accurate substrate positioning. During glue application, the second motor 11 is activated, causing the second screw 15 to slide the movable plate 13 along the slide plate 12, moving the first chip to be glued on the substrate directly below the nozzle 8. This facilitates glue application to the vertically oriented chips on the substrate surface. Then, the first motor 3 is activated, and the first lead screw 4 drives the sliding plate 5 to slide, fine-tuning the lateral position of the nozzle 8 to ensure proper application. The pre-chip potting area facilitates potting of chips located laterally on the substrate surface. Then, the electric push rod 6 is activated, and the height of the nozzle 8 is adjusted (typically 2-5mm from the chip surface to avoid glue splashing). During potting, because the connecting pipe 17 is located at the bottom of the glue tank 10, when the pump body 16 is running, it uses the connecting pipe 17 to draw epoxy resin from the glue tank 10 upwards (pre-treated epoxy resin is injected into the glue tank 10; the pump body 16 is a single-screw pump). The pump body 16 then delivers this glue from the delivery pipe 9 to the sprayer 7. Finally, the sprayer 7 controls the epoxy resin adhesive to be sprayed from inside the nozzle 8 onto the chip surface, completing the encapsulation of a single chip. Epoxy resin adhesive is suitable for chip encapsulation because it has excellent insulation properties, protecting circuits from short circuits; good fluidity, filling tiny gaps; strong sealing after curing, isolating moisture, dust, and other contaminants; stable mechanical properties, combining hardness and toughness, which can buffer vibration and impact; a wide range of high and low temperature resistance, adapting to chip operating temperature differences; and strong chemical inertness and aging resistance, maintaining its protective effect for a long time. After the chip encapsulation on the substrate surface is completed, with the operation of the second motor 11 and the second filament... Rotating rod 15 will move movable plate 13 into anti-flow component 14. Anti-flow component 14 will use high temperature to cure a layer on the outer surface of the adhesive. During the curing process, epoxy resin adhesive will produce harmful gases. These gases will be further purified. The purification structure is divided into two sides. When one side of the purification structure loses its effect due to long-term purification, it can be quickly switched to the other side for continuous purification. While saving space, it can reduce the trouble of frequently changing the purification structure. Repeat the above steps and complete the potting of all chips on the substrate by adjusting "vertical and horizontal".

[0044] Example 2:

[0045] Based on Example 1, and referring to Figure 3-9 , Figure 11The anti-flow component 14 includes a processing shell 1401, which is welded to one side of the upper end of the base frame 1. A first hole 1405 is opened on one side of the processing shell 1401. An opening and closing plate 1407 is detachably connected inside one side of the processing shell 1401. A connecting plate 1433 is welded to one end of one side of the opening and closing plate 1407. A bending plate 1435 is welded to one end of the processing shell 1401. A telescopic spring 1434 is connected between the bending plate 1435 and the connecting plate 1433 through a spring fixing component.

[0046] A mounting shell 1402 is welded to one side of the processing shell 1401. A rotating rod 1403 is welded inside the mounting shell 1402. A baffle 1404 is rotatably connected to the surface of the rotating rod 1403. Placement plates 1430 are welded to both sides of the inner wall of the processing shell 1401.

[0047] A second hole 1406 is provided on one side of the processing shell 1401, a third hole 1431 is provided at the upper end of the processing shell 1401, a vertical plate 1414 is welded to one side of the upper end of the processing shell 1401, and a fourth hole 1415 is provided on the surface of the vertical plate 1414.

[0048] A support ring 1416 is welded to the upper end of the upright plate 1414. A rotating shaft 1417 is rotatably connected to both sides of the upper end of the upright plate 1414. The rotating shaft 1417 is located inside the support ring 1416. A fixing plate 1418 is fixedly connected to the upper end of the rotating shaft 1417. A limit shell 1419 is welded to both ends of the fixing plate 1418.

[0049] An iron sheet 1432 is fixedly connected inside the fixed plate 1418. Fixed shells 1421 are welded to both ends of the iron sheet 1432. Spring push rods 1420 are bolted to both sides of the fixed shells 1421. Clamping plates 1422 are bolted to the piston ends of the two sets of spring push rods 1420. First activated carbon cotton 1423 is detachably connected between the two sides of the iron sheet 1432 and the four sets of clamping plates 1422. The clamping plates 1422 and the fixed shells 1421 are slidably connected.

[0050] The two sets of first activated carbon cotton 1423 are detachably connected to the top cover 1424. The top of the top cover 1424 is bonded with the second activated carbon cotton 1425. The inner wall of the top cover 1424 is bonded with the third activated carbon cotton 1427. The outer surfaces of the top cover 1424 are welded with weight blocks 1426.

[0051] The upper cover 1424 and the second activated carbon cotton 1425 are provided with two sets of second through holes 1429 on both sides of the surface. The upper cover 1424 is provided with two sets of first through holes 1428 on both sides. The second through holes 1429 are detachably connected to the clamping plate 1422, and the first through holes 1428 are detachably connected to the spring top rod 1420.

[0052] The upper end of the processing shell 1401 is welded with slide rails 1408 on both sides. The surfaces of the two sets of slide rails 1408 are slidably connected to a rectangular plate 1410. A heater 1409 is bolted to one side of the rectangular plate 1410, and a shell 1411 is bolted to the other side of the rectangular plate 1410. A fan blade 1412 is rotatably connected inside the shell 1411. One end of the fan blade 1412 is fixedly connected to a third motor 1413 through a coupling, and the third motor 1413 is bolted to the inside of the shell 1411.

[0053] Brief description of the usage process: During the process of moving the chip into the processing housing 1401, the substrate with the chip installed will first contact the baffle 1404. At this time, the substrate will push the baffle 1404 to rotate using the rotating rod 1403, thereby moving the substrate and the chip into the processing housing 1401. At this time, the substrate will be located on the upper surface of the two sets of placement plates 1430. Then, the second motor 11 will run in the opposite direction, driving the second lead screw 15 to rotate in another direction, thereby resetting the movable plate 13. When the movable plate 13 moves outward and resets from inside the processing housing 1401, the baffle 1404 will be blocked by the other side of the mounting housing 1402, so the baffle... Board 1404 does not rotate in another direction using lever 1403. Therefore, as movable board 13 moves out of processing housing 1401, baffle 1404 pushes the substrate to rest on the surface of two sets of placement boards 1430. After the substrate and chip are positioned, the rectangular plate 1410 on the surface of the two sets of slide rails 1408 is slid, causing the rectangular plate 1410 to move heater 1409 to the position corresponding to the third hole 1431. Then, heater 1409 is activated to heat the adhesive on the chip surface, causing the outer surface layer of the adhesive to cure. [Within the temperature resistance range of the substrate, 80-110℃ is the optimal range for balancing speed and safety, and the shortest surface curing time can be compressed to 3-15 minutes.] [Minutes (higher temperature, shorter time)] During the curing of the epoxy resin adhesive outer surface, the new chip is being potted. After the new chip is potted, the cured chip is removed, and the new chip is cured. During the curing of the epoxy resin adhesive outer layer, as the epoxy resin adhesive is cured at high temperature, amine curing agents will release irritating amines, formaldehyde, and nitrogen oxides; acid anhydrides will release organic acids and carbon monoxide; the main chain decomposes at ultra-high temperature to produce benzene series compounds, aldehydes, ketones, etc.; there may also be benzene series compounds or halogenated gases volatilized from the diluent, all of which are toxic and irritating. Therefore, immediately after curing, the rectangular plate 1410 on the surface of the sliding rail 1408 is slidable, so that the rectangular plate 1410 drives the housing 1411 to move to the position corresponding to the third hole 1431. At this time, the third The three motors 1413 will be running, driving the fan blades 1412 to rotate. The rotation of the fan blades 1412 will draw harmful gases upwards from inside the processing housing 1401 (the holes on one side of the processing housing 1401 can be used for ventilation when the fan blades 1412 draw out harmful gases, mainly to significantly reduce the emission of harmful gases). Since the fourth hole 1415 is connected to the third hole 1431, these harmful gases will eventually be discharged into the iron sheet 1432. Ultimately, these harmful gases will be absorbed by the first activated carbon cotton 1423, the second activated carbon cotton 1425, and the third activated carbon cotton 1427. When the purification effect of the first activated carbon cotton 1423 on one side of the iron sheet 1432 is insufficient, the top cover 1424 can be removed from the surface of the iron sheet 1432.Then, with the fixing plate 1418 as the center, the iron sheet 1432 is bent to the other side (the characteristics of the iron sheet 1432 are similar to those of the iron strip, and it can be bent at will), so that the iron sheet 1432 is bent to the other side into an arc shape. Then, the adjusted iron sheet 1432 is rotated using the pivot 1417, so that the two sets of iron sheets 1432 are recombined into a complete cylindrical shape. At this time, the unused first activated carbon cotton 1423 on the other side is located inside the arc-shaped iron sheet 1432, thus completing the replacement of the first activated carbon cotton 1423. This method not only saves space, but also avoids the trouble of frequently replacing the first activated carbon cotton 1423. Then, the top cover 1424 is put back on the top of the iron sheet 1432. When installing the top cover 1424, it will be respectively... Using the second through hole 1429 and the first through hole 1428, along with the corresponding clamping plate 1422 and spring push rod 1420, the installation of the upper cover 1424 is quickly aligned and limited. The weight block 1426 is used to increase the weight of the upper cover 1424, preventing excessive gas from entering the iron sheet 1432 and causing the upper cover 1424 to move. The inner wall of the upper cover 1424 is provided with a second activated carbon cotton 1425 and a third activated carbon cotton 1427. The second and third activated carbon cotton 1425 and 1427 also absorb harmful gases. Furthermore, because the first activated carbon cotton 1423 is replaceable, even if the purification effect of the second and third activated carbon cotton 1425 and 1427 decreases, the purification of harmful gases will not be significantly affected. 1425 has a certain degree of air permeability and can be used for the discharge of purified gas. When the first activated carbon cotton 1423 is disassembled and needs to be replaced with a new one, the entire sheet of first activated carbon cotton 1423 can be folded in half from the middle. Then, pull the two clamping plates 1422 on both sides of one end of the iron sheet 1432 outwards, so that the two sets of clamping plates 1422 move to both sides and compress the spring rod 1420 on one side respectively. Then, pass one end of the first activated carbon cotton 1423 through the two sets of clamping plates 1422 and pull the first activated carbon cotton 1423 to one side (the surface of the clamping plates 1422 is relatively smooth and is made of polished stainless steel). At this time, the spring rod 1420 will push the clamping plates 1422 to clamp the surface of the first activated carbon cotton 1423. When the first activated carbon cotton 1423 is pulled a certain distance, it will pass through the limiting shell 1419 and finally pull out the last two sets of clamping plates 1422. When one end of the first activated carbon cotton 1423 is placed inside the two sets of clamping plates 1422, the spring push rod 1420 will push the clamping plates 1422 to clamp the surface of the first activated carbon cotton 1423, thus completing the installation and replacement of the first activated carbon cotton 1423. The support ring 1416 is used to support the bottom of the fixing shell 1421 and can also be used to prevent harmful gas leakage. After the epoxy resin adhesive layer on the chip surface is cured, the connecting plate 1433 is pushed to one side, so that the connecting plate 1433 drives the opening and closing plate 1407 to move to one side inside the processing shell 1401. During the movement of the connecting plate 1433...The telescopic spring 1434 will be compressed, and after the first hole 1405 is opened, the substrate and chip can be removed from the first hole 1405 using a tool. After the substrate and chip are removed, the telescopic spring 1434 will push the opening and closing plate 1407 to automatically seal the first hole 1405. These operations can greatly reduce the risk of harmful gases being inhaled by the human body due to their emission into the air.

[0054] Key Parameter Descriptions: Motor Model: First Motor 3 / Second Motor 11 are stepper motors; Third Motor 1413 is a DC motor (speed 1500-2000r / min, ensuring gas extraction efficiency); Pump Body Model 16: Single screw pump (suitable for the high viscosity characteristics of epoxy resin, with no residue during delivery); Heater 1409 Parameters: Heating temperature 80-110℃ (adjustable), heating power 500-800W (avoiding local overheating and chip damage); Activated Carbon Cotton Specifications: First Activated Carbon Cotton 1423, Second Activated Carbon Cotton 1425, and Third Activated Carbon Cotton 1427 are all high iodine value columnar activated carbon and non-woven fabric carriers;

[0055] It is important to note that the device should be maintained monthly, with a focus on checking the following: the telescopic performance of the spring rod 1420; the adsorption saturation of the first activated carbon cotton 1423, the second activated carbon cotton 1425, and the third activated carbon cotton 1427 (this can be determined by detecting the purified gas; replacement is required when the adsorption efficiency is below 80%); and the lubrication status of the first lead screw 4 and the second lead screw 15 (add high-temperature grease monthly). When using the heater 1409, it must be matched to the upper temperature limit of the chip substrate to avoid exceeding the substrate's temperature resistance and causing damage. When disassembling / installing the top cover 1424, ensure that the first through hole 1428 is precisely aligned with the spring rod 1420, and the second through hole 1429 is precisely aligned with the clamping plate 1422 to prevent the first activated carbon cotton 1423, the second activated carbon cotton 1425, and the third activated carbon cotton 1427 from shifting and affecting the purification effect.

[0056] It should be noted that parts have a lifespan and can be replaced during regular maintenance when they no longer meet performance requirements. Deterioration in performance due to prolonged use of parts is not a design defect of this application.

[0057] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. An adjustable semiconductor chip encapsulation colloid potting apparatus, comprising a base frame (1), characterized in that: A slide plate (12) is glued to the middle of the upper end of the base frame (1). A second motor (11) is bolted to one side of the slide plate (12). A second lead screw (15) is fixedly connected to the output end of the second motor (11) through a coupling. The second lead screw (15) and the slide plate (12) are rotatably connected. A movable plate (13) is slidably connected to the surface of the slide plate (12). The movable plate (13) and the second lead screw (15) are threadedly connected. An anti-flow component (14) is provided on one side of the upper end of the base frame (1).

2. The adjustable semiconductor chip encapsulation colloid potting device according to claim 1, characterized in that: The anti-flow component (14) includes a processing shell (1401), which is welded to one side of the upper end of the base frame (1). A first hole (1405) is provided on one side of the processing shell (1401). An opening and closing plate (1407) is detachably connected inside one side of the processing shell (1401). A connecting plate (1433) is welded to one end of one side of the opening and closing plate (1407). A bending plate (1435) is welded to one end of the processing shell (1401). A telescopic spring (1434) is connected between the bending plate (1435) and the connecting plate (1433) through a spring fixing component.

3. The adjustable semiconductor chip encapsulation colloid potting device according to claim 2, characterized in that: A mounting shell (1402) is welded to one side of the processing shell (1401). A rotating rod (1403) is welded inside the mounting shell (1402). A baffle (1404) is rotatably connected to the surface of the rotating rod (1403). Placement plates (1430) are welded to both sides of the inner wall of the processing shell (1401).

4. The adjustable semiconductor chip encapsulation colloid potting device according to claim 3, characterized in that: The processing shell (1401) has a second hole (1406) on one side, a third hole (1431) on the upper end of the processing shell (1401), a vertical plate (1414) welded to one side of the upper end of the processing shell (1401), and a fourth hole (1415) on the surface of the vertical plate (1414).

5. The adjustable semiconductor chip encapsulation colloid potting device according to claim 4, characterized in that: The upper end of the upright plate (1414) is welded with a support ring (1416), and both sides of the upper end of the upright plate (1414) are rotatably connected with a rotating shaft (1417), and the rotating shaft (1417) is set inside the support ring (1416). The upper end of the rotating shaft (1417) is fixedly connected with a fixing plate (1418), and both ends of the fixing plate (1418) are welded with limit shells (1419).

6. The adjustable semiconductor chip encapsulation colloid potting device according to claim 5, characterized in that: The fixed plate (1418) is internally fixedly connected to an iron sheet (1432). Both ends of the iron sheet (1432) are welded to fixed shells (1421). Both sides of the fixed shell (1421) are internally bolted to spring push rods (1420). The piston ends of the two sets of spring push rods (1420) are bolted to a clamping plate (1422). The iron sheet (1432) and the four sets of clamping plates (1422) are detachably connected to a first activated carbon cotton (1423). The clamping plate (1422) and the fixed shell (1421) are slidably connected.

7. The adjustable semiconductor chip encapsulation colloid potting device according to claim 6, characterized in that: The two sets of first activated carbon cotton (1423) are detachably connected to a top cover (1424). The top of the top cover (1424) is bonded with a second activated carbon cotton (1425), and the inner wall of the top cover (1424) is bonded with a third activated carbon cotton (1427). Weight blocks (1426) are welded to both sides of the outer surface of the top cover (1424).

8. The adjustable semiconductor chip encapsulation colloid potting device according to claim 7, characterized in that: Two sets of second through holes (1429) are provided on both sides of the surface of the top cover (1424) and the second activated carbon cotton (1425). Two sets of first through holes (1428) are provided on both sides of the top cover (1424). The second through holes (1429) are detachably connected to the clamping plate (1422), and the first through holes (1428) are detachably connected to the spring top rod (1420).

9. An adjustable semiconductor chip encapsulation colloid potting device according to claim 2, characterized in that: The upper sides of the processing shell (1401) are welded with slide rails (1408). The surfaces of the two sets of slide rails (1408) are slidably connected to a rectangular plate (1410). A heater (1409) is bolted to one side of the rectangular plate (1410), and a housing (1411) is bolted to the other side of the rectangular plate (1410). A fan blade (1412) is rotatably connected inside the housing (1411). One end of the fan blade (1412) is fixedly connected to a third motor (1413) through a coupling, and the third motor (1413) is bolted to the inside of the housing (1411).

10. The adjustable semiconductor chip encapsulation colloid potting device according to claim 1, characterized in that: A vertical frame (2) is welded to the upper end of the base frame (1). A first motor (3) is bolted to one side of the surface of the vertical frame (2). The output end of the first motor (3) is fixedly connected to a first lead screw (4) through a coupling. The first lead screw (4) is rotatably connected inside the vertical frame (2). A sliding plate (5) is slidably connected inside the vertical frame (2). The sliding plate (5) is threadedly connected to the first lead screw (4). A sprayer (7) is slidably connected inside the sliding plate (5). The lower end of the sprayer (7) is welded to... There is a nozzle (8), and an electric push rod (6) is bolted to the upper end of the moving plate (5). The piston end of the electric push rod (6) is bolted to the upper end of the sprayer (7). A delivery pipe (9) is fixedly connected to one side of the sprayer (7). A pump body (16) is fixedly connected to one end of the delivery pipe (9). A glue tank (10) is bolted to the surface of the pump body (16). A connecting pipe (17) is fixedly connected to the other end of the pump body (16). The connecting pipe (17) is located inside the glue tank (10).

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