Coating device and coating method

Abstract

Embodiments of the present disclosure provide a coating apparatus and a coating method. The coating apparatus includes: a first material supply unit configured to coat a first mixture layer on a first surface of a substrate having a mark repeatedly formed in a machine direction; a first sensor configured to sense the first mixture layer and the mark; and a processor configured to determine a location of the first mixture layer based on the marker.

Description

Technical Field

[0001] This disclosure relates to coating equipment and coating methods. More specifically, this disclosure relates to coating equipment and coating methods used in the manufacturing process of secondary batteries. Background Technology

[0002] While primary batteries are not designed to be (re)charged, secondary (also known as rechargeable) batteries are designed to be discharged and recharged. Low-capacity secondary batteries are widely used in portable small electronic devices such as smartphones, feature phones, laptops, digital cameras, and camcorders, while high-capacity secondary batteries are widely used as power sources for motors in hybrid and electric vehicles, and for storing electricity (e.g., household and / or utility-scale power storage). A secondary battery typically includes an electrode assembly containing positive and negative electrodes, a housing that houses the two electrodes, and electrode terminals connected to the electrode assembly.

[0003] In the manufacturing process of electrode plates for secondary batteries, a paste can be applied to a substrate that moves in one direction to form a mixture region on the electrode. The mixture region has a periodic pattern, and various methods are used to reduce errors in pattern formation. However, the accuracy of pattern formation in the mixture region can be reduced due to slippage of the moving substrate and / or inaccurate measurements.

[0004] The information disclosed in this Background section is intended to enhance understanding of the background of this disclosure. This section may contain information that does not constitute related (or prior art). Summary of the Invention

[0005] Embodiments of this disclosure provide coating apparatus and coating method.

[0006] Embodiments of this disclosure provide a coating apparatus comprising: a first material supply unit configured to coat a first mixture layer on a first surface of a substrate, the substrate including markings repeatedly formed along a machine direction; a first sensor configured to sense the first mixture layer and the markings; and a processor configured to calculate the position of the first mixture layer based on the markings.

[0007] Embodiments of this disclosure provide a coating apparatus comprising: a first material supply unit configured to coat a first mixture layer on a first surface of a substrate, the substrate including markings repeatedly formed along a machine direction; a first sensor configured to sense the first mixture layer and the markings; and a processor configured to determine the position of the first mixture layer based on the markings.

[0008] According to an embodiment, the first sensor can sense the position of the marker and the distance between the marker and the first mixture layer.

[0009] In one embodiment, the first sensor is configured to sense the position of the markers and the distance between each marker and the first mixture layer.

[0010] According to an embodiment, the first mixture layer may include a first edge and a second edge perpendicular to the machine direction, and the processor may measure a first distance between the first edge and a first mark adjacent to the first edge.

[0011] In one embodiment, the marking includes a first marking, wherein the first mixture layer includes a first edge and a second edge perpendicular to the machine direction, and wherein the processor is configured to determine a first distance between the first edge and the first marking adjacent to the first edge.

[0012] According to an implementation, the processor can measure a second distance between the second edge and a second mark adjacent to the second edge.

[0013] In one implementation, the marker further includes a second marker, and wherein the processor is configured to determine a second distance between the second edge and the second marker adjacent to the second edge.

[0014] According to the implementation, the processor can use a first distance and a second distance to calculate the length of the first mixture layer in the machine direction.

[0015] In one implementation, the processor is configured to determine the length of the first mixture layer in the machine direction based on a first distance and a second distance.

[0016] According to an embodiment, the coating apparatus may further include a second material supply unit configured to coat a second mixture layer on a second surface of a substrate. Furthermore, the first and second surfaces may be opposite surfaces of the substrate, and the processor may control the second material supply unit based on a first distance to adjust the distance between the second mixture layer and the first mark.

[0017] In one embodiment, the coating apparatus further includes: a second material supply unit configured to coat a second mixture layer on a second surface of a substrate, wherein the second surface is opposite to the first surface, and wherein a processor is configured to control the second material supply unit based on a first distance.

[0018] According to an implementation, the processor can adjust the distance between the second mixture layer and the first mark to be the same as the first distance.

[0019] In one implementation, the processor is configured to adjust the third distance between the third edge of the second mixture layer perpendicular to the machine direction and the first mark to be substantially the same as the first distance.

[0020] According to an implementation, the processor can adjust the distance between the second mixture layer and the first mark to be different from the first distance.

[0021] In one implementation, the processor is configured to adjust a third distance between the third edge of the second mixture layer perpendicular to the machine direction and the first mark to be different from the first distance.

[0022] According to an implementation, the processor can adjust the distance between the second mixture layer and the first mark, such that the combined thickness of the first mixture layer and the second mixture layer is equal to or less than a predetermined thickness.

[0023] In one embodiment, the processor is configured to adjust a third distance between the third edge of the second mixture layer perpendicular to the machine direction and the first mark, such that the combined thickness of the first mixture layer and the second mixture layer is equal to or less than a predetermined thickness.

[0024] According to the implementation, the processor can measure a second distance between the second edge and the second mark adjacent to the second edge, and control the second material supply unit based on the first distance and the second distance to adjust the length of the second mixture layer in the machine direction.

[0025] In one implementation, the processor is configured to determine a second distance between a second edge and a second mark adjacent to the second edge, and to control a second material supply unit based on a first distance and a second distance.

[0026] According to the implementation method, the first material supply unit or the second material supply unit may be spaced apart from the substrate by a predetermined distance, and the processor may control the first material supply unit or the second material supply unit to adjust the predetermined distance.

[0027] In one embodiment, the first material supply unit or the second material supply unit is spaced apart from the substrate by a predetermined distance, and wherein the processor is configured to control the first material supply unit or the second material supply unit to adjust the predetermined distance.

[0028] According to an embodiment, the coating apparatus may further include: a second sensor, arranged in a transverse direction parallel to the machine direction, to measure the thickness of the first mixture layer or the thickness of the second mixture layer.

[0029] In one embodiment, the coating apparatus further includes a second sensor placed in a lateral direction perpendicular to the machine direction to measure the thickness of the first or second mixture layer.

[0030] According to an implementation, the second sensor may include a first sensing unit and a second sensing unit, and the processor may reduce the predetermined distance in response to a situation where the difference between the thickness measured by the first sensing unit and the thickness measured by the second sensing unit is equal to or greater than a predetermined thickness.

[0031] In one embodiment, the second sensor includes a first sensing unit and a second sensing unit, wherein the processor is configured to reduce a predetermined distance in response to a difference between the thickness measured by the first sensing unit and the thickness measured by the second sensing unit being equal to or greater than a predetermined thickness.

[0032] According to an embodiment, the marking may include a first marking and a second marking, and the coating apparatus may further include a marking unit that forms the first marking and the second marking spaced apart by a predetermined distance.

[0033] According to the implementation, each of the markings can be in the shape of a line parallel to the lateral direction perpendicular to the machine direction.

[0034] Embodiments of this disclosure provide a coating method comprising: coating a first mixture layer onto a first surface of a substrate including marks repeatedly formed along a machine direction by a first material supply unit, the marks having a first mark and a second mark; measuring at least one of a first distance between the first mark and the first mixture layer and a second distance between the second mark and the first mixture layer by a first sensor; adjusting the position of a second mixture layer disposed on a second surface of the substrate by means of a processor controlling a second material supply unit using at least one of the first and second distances; and coating the second mixture layer onto the second surface of the substrate by the second material supply unit. Furthermore, the first surface and the second surface are opposite surfaces of the substrate.

[0035] Embodiments of this disclosure provide a coating method comprising: coating a first mixture layer on a first surface of a substrate, the substrate including markings repeatedly formed along a machine direction, the markings including a first mark and a second mark; determining at least one selected from a first distance and a second distance, the first distance being the distance between a first edge of the first mixture layer and a first mark adjacent to the first edge, the second distance being the distance between a second edge of the first mixture layer and a second mark adjacent to the second edge; adjusting the position of a second mixture layer to be placed on a second surface of the substrate, the second surface being opposite to the first surface, using at least one selected from the first distance and the second distance; and coating the second mixture layer on the second surface of the substrate.

[0036] According to an implementation, adjusting the position of the second mixture layer may include: the processor controlling the distance between the second mixture layer and the first mark to be equal to the first distance.

[0037] In one implementation, the adjustment includes adjusting a third distance to be substantially equal to a first distance, the third distance being the distance between the edge of the second mixture layer and the first mark.

[0038] According to an implementation, adjusting the position of the second mixture layer may include: the processor controlling the distance between the second mixture layer and the first mark, such that the combined thickness of the first mixture layer and the second mixture layer is equal to or less than a predetermined thickness.

[0039] In one implementation, the adjustment includes adjusting a third distance such that the combined thickness of the first mixture layer and the second mixture layer is equal to or less than a predetermined thickness, wherein the third distance is the distance between the edge of the second mixture layer and the first mark.

[0040] According to an implementation, adjusting the position of the second mixture layer may include: the processor using a second distance to control the distance between the second mixture layer and the second mark.

[0041] In one implementation, the adjustment includes: adjusting a fourth distance using a second distance, the fourth distance being the distance between the edge of the second mixture layer and the second mark.

[0042] According to an embodiment, the above coating method may further include at least one of the following: after coating the first mixture layer, the processor calculates the thickness deviation of the first mixture layer in the lateral direction and adjusts the gap between the first surface and the first material supply unit configured to coat the first mixture layer; or after adjusting the position of the second mixture layer, the processor calculates the thickness deviation of the second mixture layer in the lateral direction and adjusts the gap between the second surface and the second material supply unit configured to coat the second mixture layer.

[0043] In an embodiment, the coating method further includes: after coating the first mixture layer, determining the thickness deviation of the first mixture layer in the lateral direction, and adjusting the gap between the first surface and the first material supply unit configured to coat the first mixture layer; or after adjustment, determining the thickness deviation of the second mixture layer in the lateral direction, and adjusting the gap between the second surface and the second material supply unit configured to coat the second mixture layer.

[0044] According to some embodiments of this disclosure, by controlling the coating start point of the mixture layer respectively disposed on opposite surfaces of the substrate, the number of thickness difference regions in the mixture layer can be reduced, and thus the degradation of the electrode plate quality can be reduced or the quality of the electrode plate can be improved.

[0045] According to some embodiments of this disclosure, by measuring the coating start point of the first mixture layer disposed on the first surface and then adjusting the coating start point of the second mixture layer disposed on the second surface, the degradation of the electrode plate quality can be reduced or the quality of the electrode plate can be improved.

[0046] According to some embodiments of this disclosure, by reducing the thickness deviation in the lateral direction (TD) of each of the mixture layers respectively disposed on opposite surfaces of the substrate, the degradation of the electrode plate quality can be reduced or the quality of the electrode plate can be improved.

[0047] According to some embodiments of this disclosure, electrode plates with high yield can be provided by reducing the number of thickness difference regions in the electrode plate or by keeping the thickness of the electrode plate below a predetermined thickness. Attached Figure Description

[0048] The accompanying drawings illustrate embodiments of the present disclosure, and together with the detailed description thereof, further describe aspects and features of the present disclosure. Therefore, this disclosure should not be construed as limited to the drawings:

[0049] Figure 1 This is a schematic diagram of an electrode plate manufacturing apparatus including a coating apparatus according to an embodiment of the present disclosure.

[0050] Figure 2 This is a schematic diagram of a coating apparatus according to an embodiment of the present disclosure.

[0051] Figure 3 This is a schematic diagram of a coating apparatus according to an embodiment of the present disclosure, wherein a first sensor measures the positional relationship between a first mixture layer on a first surface and a first mark and a second mark.

[0052] Figure 4A is a cross-sectional view of an electrode plate on a substrate coated with a mixture using conventional coating equipment.

[0053] Figure 4B This is a cross-sectional view of an electrode plate coated with a mixture on a substrate using a coating apparatus according to an embodiment of the present disclosure.

[0054] Figure 5A This is a cross-sectional view of the mixture region of the electrode plate formed by the coating apparatus according to an embodiment of the present disclosure.

[0055] Figure 5B This is a cross-sectional view of the mixture region of the electrode plate formed by the coating apparatus according to an embodiment of the present disclosure.

[0056] Figure 5C This is a cross-sectional view of the mixture region of the electrode plate formed by the coating apparatus according to an embodiment of the present disclosure.

[0057] Figure 6A This is a perspective view of a coating apparatus according to an embodiment of the present disclosure.

[0058] Figure 6B This is a perspective view of a coating apparatus according to an embodiment of the present disclosure.

[0059] Figure 7 This is a cross-sectional view of a coating apparatus according to an embodiment of the present disclosure.

[0060] Figure 8 This is a flowchart illustrating a coating method according to an embodiment of the present disclosure.

[0061] Explanation of important figure labels

[0062] 10: Coating equipment; 100: Material supply unit

[0063] 110: First material supply unit; 120: Second material supply unit

[0064] 200: First sensor; 220: Second sensor

[0065] 300: Processor; 400: Roller Unit

[0066] 500: Marker unit Detailed Implementation

[0067] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Based on the principle that the inventor can be his / her own lexicographer to appropriately define the concepts of terms in order to best illustrate his / her invention, the terms or words used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted as having meanings and concepts consistent with the technical spirit of the present disclosure.

[0068] The embodiments described in this specification and the constructions shown in the accompanying drawings are only some of the embodiments of this disclosure and do not represent all the technical ideas, aspects, and features of this disclosure. Accordingly, it should be understood that various equivalents and modifications that can replace or modify the embodiments described herein can be made at the time of filing this application.

[0069] It will be understood that when a layer or element is referred to as being "between" two layers, it can be the only layer between those two layers, or one or more intermediary layers may exist. It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to," or "linked to" another element or layer, the element or layer can be directly on, connected to, or linked to the other element or layer, or one or more intermediary elements or layers may exist. When an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly linked to" another element or layer, no intermediary element or layer exists. For example, when a first element is described as being "linked" or "connected" to a second element, the first element can be directly linked to or connected to the second element, or the first element can be indirectly linked to or connected to the second element via one or more intermediary elements.

[0070] The embodiments described herein can be illustrated with reference to the cross-sectional and / or plan views that serve as exemplary views of this disclosure. In the drawings, the thickness of films and regions may be enlarged for effective description of the technical content. Therefore, regions presented as examples in the drawings have general properties, and the shapes of the illustrated regions may be used to illustrate specific shapes of device regions. Therefore, this should not be construed as limiting the scope of this disclosure. Although terms such as first, second, and third are used to describe various components in the various embodiments herein, these components should not be limited to these terms. These terms are used only to distinguish one component from another. The embodiments described and illustrated herein include supplementary embodiments thereof. Throughout the specification, the same reference numerals refer to the same elements.

[0071] As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.” Expressions such as “at least one of” and “any one of”, when placed after a list of elements, modify the entire list of elements without modifying individual elements in that list. When phrases such as “at least one of A, B, and C,” “at least one selected from the group of A, B, and C,” or “at least one selected from A, B, and C” are used to specify a list of elements A, B, and C, the phrase may refer to any and all suitable combinations or subsets of A, B, C, A and B, A and C, B and C, or A and B and C, A, B, and C. As used herein, the terms “use,” “used,” and “being used” may be considered synonymous with the terms “utilized,” “exploited,” and “being exploited,” respectively. As used herein, the terms “substantially,” “approximately,” and similar terms are used as approximate terms rather than terms of degree and are intended to describe inherent biases in measurements or calculations that will be recognized by one of ordinary skill in the art.

[0072] It will be understood that although the terms "first," "second," "third," etc., can be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0073] In this document, for ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” are used to describe the relationship between one element or feature as shown in the figures and another (or several) other elements or features. It will be understood that, in addition to the orientation shown in the figures, spatial relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features will be oriented “above” or “above” other elements or features. Thus, the term “below” can include both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or oriented in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0074] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “an” are intended to include the plural forms as well. It will be further understood that, when used in this specification, the terms “comprising,” “including,” “containing,” and / or “including” designate the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0075] Furthermore, any numerical range disclosed and / or enumerated herein is intended to include all subranges with the same numerical precision contained within the enumerated range. For example, the range "1.0 to 10.0" is intended to include, for instance, the range between the enumerated minimum value of 1.0 and the enumerated maximum value of 10.0 (inclusive), such as 2.4 to 7.6; that is, all subranges having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0. Any maximum numerical limit enumerated herein is intended to include all smaller numerical limits, and any minimum numerical limit enumerated herein is intended to include all larger numerical limits. Therefore, the applicant reserves the right to amend this specification (including the claims) to expressly enumerate any subranges contained within the range expressly recited herein.

[0076] Referring to two compared elements, features, etc., as "identical" can mean that they are "substantially identical." Therefore, the phrase "substantially identical" can include cases with a deviation considered low in the art (e.g., 5% or less). Additionally, when a parameter is said to be consistent in a given region, this can mean that it is consistent in terms of average value.

[0077] Throughout this specification, unless otherwise stated, each element may be singular or plural.

[0078] Placing any element "above (or below)" or "above (below)" another element can mean that the arbitrary element can contact the upper (or lower) surface of the element, and that another element can be located between the element and the arbitrary element disposed on (or below) the element.

[0079] Additionally, it will be understood that when a component is referred to as “connected,” “linked,” or “attached” to another component, these components can be directly “connected,” “linked,” or “attached” to each other, or another component can be “between” these components.

[0080] Throughout this specification, unless otherwise stated, when “A and / or B” is used, it means A, B, or A and B. That is, “and / or” includes any or all combinations of the enumerated items. Unless otherwise stated, when “C to D” is used, it means C or more and D or fewer.

[0081] The terminology used in this specification is for describing embodiments of this disclosure and is not intended to limit this disclosure.

[0082] As used herein, the term "machine orientation" or "MD orientation" can refer to the direction in which the electrode plate is transported by a conveying device such as a conveyor roller during the electrode plate manufacturing process. In embodiments, the MD orientation may be used interchangeably with the full-length orientation of the electrode plate, but is not limited thereto.

[0083] As used herein, the term "lateral direction" or "TD direction" can refer to a horizontal direction perpendicular to the MD direction on the plane of the electrode plate. In embodiments, the TD direction may be used interchangeably with the full-width direction of the electrode plate, but is not limited thereto.

[0084] Figure 1 This is a schematic diagram of an electrode plate manufacturing apparatus EMA that includes a coating apparatus according to an embodiment of the present disclosure.

[0085] The electrode plate manufacturing equipment EMA may include a supply roller SR for supplying substrate S, a coating section EC, an extrusion section EP, a grooving section EN, and a collection section EG.

[0086] The substrate S can be supplied by a supply roller SR. The substrate S may include a first surface and a second surface that are opposite to each other. Lines perpendicular to the first surface and the second surface may also be perpendicular to the MD direction of the substrate S. A mixture (slurry) supplied from the tips of the material supply units MS1 and MS2 in the coating section EC can be coated onto the first surface and / or the second surface as mixture layers EML1 and EML2 to form the mixture region EMR of the electrode plate E. The material supply units MS1 and MS2 may be arranged close to rollers R1 and R2, respectively. To ensure that the mixture region EMR of the electrode plate E is formed in a flat and flush manner, rollers R1 and R2 may be arranged parallel to each other but in opposite directions, applying tension in the MD direction of the electrode plate E. As the substrate S passes through the coating section EC, the electrode plate E with the mixture region EMR can be formed. The mixture layers EML1 and EML2 included in the electrode plate E are omitted after passing through the coating section EC. Coating apparatus 10 (see Figure 2 It can be arranged in the coating section EC of the electrode plate manufacturing equipment EMA.

[0087] The extrusion section EP allows the electrode plate E to pass between two extrusion rollers PR1 and PR2 to flatten the mixture layers EML1 and EML2 coated on the substrate S of the electrode plate E. This process ensures that the mixture layers EML1 and EML2, as well as the electrode plate E, have a consistent thickness and that the surface of the electrode plate E is smooth.

[0088] After passing through the extrusion section EP, the electrode plate E can proceed to the slotted section EN. In an embodiment, in the slotted section EN, the uncoated areas of the electrode plate E where the mixture layers EML1 and EML2 are not coated onto the electrode plate E can be cut or punched to form a terminal piece portion.

[0089] The collection section EG can store or accommodate the electrode plates E that are slotted while passing through the slotted section EN. Depending on the type of secondary battery, the collection section EG may include elements such as winding rollers or storage containers.

[0090] Figure 2 This is a schematic diagram of a coating apparatus 10 according to an embodiment of the present disclosure. Figure 3 This is a schematic diagram of a coating apparatus 10 according to an embodiment of the present disclosure, in which the first sensor 200 measures the positional relationship between the first mixture layer EML1 on the first surface P1 and the first mark MK1 and the second mark MK2. Figure 4A is a cross-sectional view of an electrode plate E1 coating a mixture on a substrate S using conventional coating equipment. Figure 4BThis is a cross-sectional view of an electrode plate E2 coated with a mixture on a substrate S using a coating apparatus 10 according to an embodiment of the present disclosure.

[0091] refer to Figures 2 to 4B The coating apparatus 10 may include a first material supply unit 110 for coating a first mixture layer EML1 on a first surface P1 of a substrate S, repeatedly forming marks MK on the substrate S along the MD direction. The coating apparatus 10 may further include a first sensor 200 for sensing the first mixture layer EML1 and the marks MK, and a processor 300 for calculating the position of the first mixture layer EML1 based on the marks MK. The first sensor 200 can sense the position of the marks MK and the distance between each mark MK and the first mixture layer EML1. The first mixture layer EML1 may include a first edge ES1 and a second edge ES2, both horizontally perpendicular to the MD direction, and the processor 300 can measure a first distance d1 between the first edge ES1 and the first mark MK1 adjacent to the first edge ES1. The coating apparatus 10 may further include a second material supply unit 120 for coating a second mixture layer EML2 on a second surface P2 of the substrate S. Based on the first distance d1, the processor 300 can control the second material supply unit 120 to adjust the distance between the second mixture layer EML2 and the first mark MK1. The first surface P1 and the second surface P2 may be surfaces of the substrate S that are opposite to each other. Advantageously, this configuration can reduce the thickness difference caused by the first mixture layer EML1 and the second mixture layer EML2 on the electrode plate E, or can minimize the overall thickness fluctuation of the electrode plate E.

[0092] In the coating apparatus 10, the substrate S can be supplied by a supply roller SR. The substrate S can move in one direction, which can correspond to the MD direction. The direction of movement of the substrate S can be changed when the substrate S comes into contact with rollers 401 and 410, etc. When a mixture layer EML1 or EML2 is coated on at least one surface of the substrate S by the coating apparatus 10, an electrode plate E can be formed. In the electrode plate E, the area not coated with the mixture layers EML1 and EML2 can correspond to the uncoated area UCR, while the area coated with the mixture layers EML1 and EML2 can correspond to the mixture region EMR. Each of the mixture layers EML1 and EML2 can include an active material, a conductive agent, and a binder, etc. Depending on the type of active material included in the mixture region EMR on the substrate S, the electrode plate E can include a positive electrode plate or a negative electrode plate. In one embodiment, the mixture region EMR includes a positive active material, and the electrode plate E can include a positive electrode plate. In another embodiment, the mixture region EMR includes a negative active material, and the electrode plate E can include a negative electrode plate.

[0093] In one embodiment, electrode plate E is a positive electrode plate, substrate S may include aluminum foil, etc., and the mixture region EMR may include transition metal oxides, etc., as the positive electrode active material. In another embodiment, electrode plate E is a negative electrode plate, substrate S may include copper (Cu) or nickel (Ni) foil, and the mixture region EMR may include graphite, etc., as the negative electrode active material. However, this disclosure is not limited to these examples, and substrate S or mixture region EMR may include other materials suitable for their respective electrodes.

[0094] In one embodiment, the substrate S may include a first surface P1 and a second surface P2 on which hybrid layers EML1 and EML2 may be coated, respectively. The first surface P1 and the second surface P2 may be surfaces opposite to each other. In one embodiment, a line perpendicular to the first surface P1 may be perpendicular to both the MD direction and the TD direction, and a line perpendicular to the second surface P2 may also be perpendicular to both the MD direction and the TD direction.

[0095] In an embodiment, the substrate S may include a plurality of repeatedly formed marks MK. The plurality of marks MK may be arranged on at least one of a first surface P1 and a second surface P2 of the substrate S. The plurality of marks MK may be arranged on both the first surface P1 and the second surface P2 of the substrate S, and one of the marks MK on the first surface P1 may correspond to one of the marks MK on the second surface P2. In an embodiment, the positions of two corresponding marks MK along the MD direction of the substrate S may be identical. In an embodiment, the line connecting two corresponding marks MK may be perpendicular to either the first surface P1 or the second surface P2. The plurality of marks MK on the first surface P1 may be spaced apart along the MD direction at a predetermined interval w. The predetermined interval w between the marks MK may range from approximately 1 mm to approximately 20 mm. However, this disclosure is not limited to this, and the predetermined interval w between the marks MK may be selected and determined taking into account the length of the EMR region in the MD direction. Each mark MK may be in the shape of a line parallel to the TD direction. However, this disclosure is not limited to this, and each mark MK may have other shapes such as circles or polygons.

[0096] The coating apparatus 10 may include a material supply unit 100 for coating a mixture onto a substrate S. The material supply unit 100 may include a first material supply unit 110 and a second material supply unit 120. The first material supply unit 110 may coat the mixture onto a first surface P1 of the substrate S to form a first mixture layer EML1. The second material supply unit 120 may coat the mixture onto a second surface P2 of the substrate S to form a second mixture layer EML2.

[0097] In one embodiment, a first mixture layer EML1 may be formed on a first surface P1 of the substrate S, and then a second mixture layer EML2 may be formed on a second surface P2 of the substrate S. The formation position of the second mixture layer EML2 on the second surface P2 may be selected and determined based on the formation position of the first mixture layer EML1 formed on the first surface P1. In another embodiment, the substrate S coated with the first mixture layer EML1 is moving in one direction, and the timing of the opening and closing of the second material supply unit 120 may be determined based on the position of the first mixture layer EML1 on the first surface P1.

[0098] The coating apparatus 10 may include a first sensor 200 for sensing a first mixture layer EML1 and markers MK. In one embodiment, the first sensor 200 can sense the position of the markers MK and the distance between each of the markers MK and the first mixture layer EML1. The first sensor 200 can sense regions SA and EA on a first surface P1 of the substrate S, regions SA and EA respectively including two horizontally perpendicular end edges ES1 and ES2 of the first mixture layer EML1 in the MD direction. In one embodiment, the first sensor 200 can sense a start region SA near a starting point of the first mixture layer EML1 in the MD direction. The sensed start region SA may include information about the position of a first edge ES1 of the first mixture layer EML1 and the position of at least one marker adjacent to the first edge ES1. The sensed start region SA may include information about the distance between the first edge ES1 and at least one marker adjacent to the first edge ES1. One of a first marker MK1 and a third marker MK3 may be selected as the marker MK adjacent to the first edge ES1. In one embodiment, the first sensor 200 can sense the distance d1 between the first mark MK1 and the first edge ES1, where the extension of the first mark MK1 contacts the first mixture layer EML1.

[0099] In one embodiment, the first sensor 200 can sense a termination region EA near the termination point of the first mixture layer EML1 in the MD direction. The sensed termination region EA may include information about the position of the second edge ES2 of the first mixture layer EML1 and the position of at least one marker adjacent to the second edge ES2. The sensed termination region EA may also include information about the distance between the second edge ES2 and at least one marker adjacent to the second edge ES2. One of a second marker MK2 and a fourth marker MK4 can be selected as the marker MK adjacent to the second edge ES2. In one embodiment, the first sensor 200 can sense a distance d2 between the second marker MK2 and the second edge ES2, where the extension of the second marker MK2 contacts the first mixture layer EML1.

[0100] In one embodiment, the first sensor 200 can sense the number of markers MK in which the extension of the marker MK contacts the first mixture layer EML1.

[0101] In an implementation, the first sensor 200 may include a CCD camera. However, this disclosure is not limited thereto, and the first sensor 200 may include other means capable of sensing at least one of the positions of the first mixture layer EML1 and the marker MK, and the distance between the first mixture layer EML1 and the marker MK.

[0102] The coating apparatus 10 may include a processor 300. The processor 300 may calculate the position of a first mixture layer EML1 based on a marker MK. The processor 300 may be connected to a first sensor 200 and receive information sensed by the first sensor 200. The processor 300 may measure the distance between the first mixture layer EML1 and the marker MK based on the information received from the first sensor 200. This result may be used by the processor 300 to adjust the distance between a second mixture layer EML2 and the marker MK. The formation position of the second mixture layer EML2 may be adjusted using the marker MK as a reference point. In one embodiment, the processor 300 may control the opening and closing of a second material supply unit 120 to adjust the distance between the second mixture layer EML2 formed by the second material supply unit 120 and the first marker MK1. In another embodiment, the processor 300 may control the opening time of the second material supply unit 120 to adjust the length of the second mixture layer EML2 and also adjust the distance between the second mixture layer EML2 and the second marker MK2. In one embodiment, the processor 300 can move the second material supply unit 120 in the MD direction to adjust the distance between the second mixture layer EML2 formed by the second material supply unit 120 and the first mark MK1.

[0103] In one embodiment, the processor 300 can measure a first distance d1 between a first edge ES1 of the first mixture layer EML1 and a first mark MK1 adjacent to the first edge ES1. In another embodiment, the processor 300 can measure a second distance d2 between a second edge ES2 of the first mixture layer EML1 and a second mark MK2 adjacent to the second edge ES2. In another embodiment, the processor 300 can use the first distance d1 and the second distance d2 to calculate the length of the first mixture layer EML1 in the MD direction. In yet another embodiment, the processor 300 can calculate the internal length by multiplying the number of marks MK in the first mixture layer EML1 obtained from the first sensor 200, where the extension of a mark MK contacts the first mixture layer EML1, by each of a predetermined interval w between two adjacent marks in the marks MK. The internal length is then added to the first distance d1 and the second distance d2 to calculate the length of the first mixture layer EML1 in the MD direction. In yet another embodiment, instead of measuring the first distance d1 and the second distance d2, the first sensor 200 can sense a third distance between a third mark MK3 and the first edge ES1, and a fourth distance between a fourth mark MK4 and the second edge ES2. In an implementation, the length of the first mixture layer EML1 in the MD direction can be calculated by adding the length of the inner length to the predetermined interval w between the two marks MK twice the length of the inner length, and then subtracting the first distance d1 and the second distance d2 from the sum.

[0104] In one embodiment, the processor 300 can use a reference length of the first hybrid layer EML1 input to the processor 300 in the MD direction to calculate the length of the first hybrid layer EML1 in the MD direction. In this embodiment, the predetermined interval w between every two markers MK is approximately 5 mm, and the reference length of the first hybrid layer EML1 input to the processor 300 in the MD direction is approximately 20 mm. With the first distance d1 and the second distance d2 measured by the first sensor 200 being approximately 2.3 mm and approximately 2.9 mm respectively, the sum of the first distance d1 and the second distance d2 is approximately 5.2 mm. From the sum obtained by adding approximately 5.2 mm to the product of the predetermined interval w between two markers MK and any natural number, the processor 300 can select the sum closest to the reference length in the MD direction and determine the selected sum as the length of the first hybrid layer EML1 in the MD direction. In this embodiment, the actual length of the first hybrid layer EML1 in the MD direction can be calculated to be approximately 20.2 mm. However, this disclosure is not limited thereto, and the processor 300 may use various other methods to calculate the length of the first mixture layer EML1 in the MD direction.

[0105] The coating apparatus 10 may further include a roller unit 400. The roller unit 400 may contact the substrate S to apply tension to the substrate S. The direction of the tension applied to the substrate S may be two opposite directions parallel to the MD direction. The roller unit 400 may contact the substrate S to ensure that the substrate S is flattened. As the substrate S advances, the roller unit 400 may rotate accordingly. Furthermore, the roller unit 400 may change the travel direction of the substrate S. The roller unit 400 may include a plurality of rollers 401 and 410. A first roller 410 may be arranged near the first material supply unit 110, and the substrate S may be disposed between the first roller 410 and the first material supply unit 110. The first roller 410 may be placed on a second surface P2, and the substrate S may be stretched flatter under tension acting in two opposite directions parallel to the MD direction. As a result, the first mixture layer EML1 coated by the first material supply unit 110 can be uniformly coated over the entire area where the first mixture layer EML1 is applied. Similarly, the substrate S may be arranged on a second roller 420 (see...). Figure 7 The second roller 420 can be placed on the first surface P1, and the substrate S can be stretched flatter under tension acting in two opposite directions parallel to the MD direction. As a result, the second mixture layer EML2 coated by the second material supply unit 120 can be uniformly coated over the entire area where the second mixture layer EML2 is applied.

[0106] The coating apparatus 10 may further include a marking unit 500 provided for forming a plurality of marks MK. The marking unit 500 may form a first mark MK1 and a second mark MK2 among a plurality of marks MK to be spaced apart from each other along the MD direction. The plurality of marks MK formed by the marking unit 500 may be arranged at regular intervals, but this disclosure is not limited thereto. In embodiments, the marking unit 500 may include a laser or other similar device, in which case the plurality of marks may be laser-marked. However, this disclosure is not limited thereto, and the plurality of marks MK formed by the marking unit 500 may be formed by another means or device.

[0107] Referring to Figure 4A, in a conventional case, the distance d11 between the first mark MK1 and the first edge ES11 of the first mixture layer EML1 coated on the first surface P1 of the exemplary electrode plate E1 can be different from the distance d21 between the first mark MK1 and the first edge ES21 of the second mixture layer EML2 coated on the second surface P2 of the exemplary electrode plate E1. The difference between the two distances d11 and d21 can be caused by process errors. Furthermore, the distance d12 between the second mark MK2 and the second edge ES12 of the first mixture layer EML1 coated on the first surface P1 of the exemplary electrode plate E1 can also be different from the distance d22 between the second mark MK2 and the second edge ES22 of the second mixture layer EML2 coated on the second surface P2 of the exemplary electrode plate E1. The difference between the two distances d12 and d22 can be caused by process errors. When winding the electrode plate E1, the distance d22 between the second edge ES22 and the second mark MK2 can be smaller than the distance d12. However, due to process errors, the difference between the two distances d12 and d22 may be less than or greater than the expected difference. Due to these process errors, an exemplary electrode plate E1 manufactured in a conventional coating apparatus may include multiple regions with varying thicknesses within the electrode plate E1. This may lead to reduced yield of the manufactured electrode plate E1, reduced quality of the electrode plate E1, and an increased likelihood of defects in the secondary battery including the electrode plate E1.

[0108] On the other hand, reference Figure 4BEmbodiments of this disclosure provide a coating apparatus 10 having a distance d21 between the first mark MK1 and the first edge ES21 of the second mixture layer EML2 coated on the second surface P2 of the electrode plate E2, substantially the same as the distance d21 between the first mark MK1 and the first edge ES11 of the first mixture layer EML1 coated on the first surface P1 of the electrode plate E2. In embodiments, the coordinates of the starting point of the first mixture layer EML1 and the starting point of the second mixture layer EML2 can be substantially the same in the MD direction. This alignment can be achieved because, based on information about the first mixture layer EML1 and the first mark MK1 sensed by the first sensor 200 in the coating apparatus 10, the processor 300 can control the second material supply unit 120 to adjust the coating of the second mixture layer EML2. Similarly, the distance d12 between the second mark MK2 and the second edge ES12 of the first mixture layer EML1 coated on the first surface P1 of the electrode plate E2 can be substantially the same as or different from the distance d22 between the second mark MK2 and the second edge ES22 of the second mixture layer EML2 coated on the second surface P2 of the electrode plate E2. In an embodiment, the electrode plates E2 are stacked to form a stacked electrode assembly, and the two distances d12 and d22 can be substantially the same. In an embodiment, the electrode plates E2 are wound to form a wound electrode assembly, and the two distances d12 and d22 can be different from each other, and the difference between the two distances d12 and d22 can be appropriately selected based on the position of the mixture region EMR within the wound electrode assembly.

[0109] In the coating apparatus 10, the positions and distances between the first mixture layer EML1 and the marker MK formed on the first surface P1 of the substrate S can be sensed, thereby allowing the second mixture layer EML2 to be placed on the second surface P2 of the substrate S at a desired position. The electrode plate E2 manufactured using the coating apparatus 10 can have fewer areas with thickness variations than the electrode plate E1 manufactured using conventional coating equipment. In embodiments, the coating apparatus 10 can reduce the formation of areas with thickness variations on the electrode plate E2. In embodiments, the coating apparatus 10 can control the position of the areas with thickness variations on the electrode plate E2. Advantageously, this arrangement can improve the quality of the electrode plate E2, increase the manufacturing yield of the electrode plate E2, and improve the performance of the secondary battery containing the electrode plate E2 and / or reduce the likelihood of defects.

[0110] Figure 5A This is a cross-sectional view of the mixture region of the electrode plate E3 formed by the coating apparatus according to an embodiment of the present disclosure. Figure 5B This is a cross-sectional view of the mixture region of the electrode plate E4 formed by the coating apparatus according to an embodiment of the present disclosure. Figure 5CThis is a cross-sectional view of the mixture region of the electrode plate E5 formed by the coating apparatus according to an embodiment of the present disclosure.

[0111] refer to Figures 5A to 5C The EMR region of the electrode plate E formed by the coating equipment can vary in thickness along the MD direction. When the mixture is supplied from the material supply unit 100 to form the mixture layers EML1 and EML2, the mixture may be unevenly distributed on the substrate S along the MD direction, and each of the mixture layers EML1 and EML2 may have inconsistent thickness. This inconsistent thickness along the MD direction may be caused by the characteristics of the material supply unit 100 or the properties of the mixture itself.

[0112] refer to Figure 5A In electrode plate E3, the distance d11 between the first mark MK1 and the first edge ES11 of the first mixture layer EML1 can be substantially equal to the distance d21 between the first mark MK1 and the first edge ES21 of the second mixture layer EML2. The positions of the protruding portion B1 of the first mixture layer EML1 and the protruding portion B2 of the second mixture layer EML2 can overlap each other based on coordinates in the MD direction. The protruding portions B1 and B2 refer to the portions of mixture layers EML1 and EML2 with the maximum thickness. Therefore, the maximum thickness t1 of the mixture region EMR of electrode plate E3 can be increased. In an embodiment, the distance d12 between the second mark MK2 and the second edge ES12 of the first mixture layer EML1 is greater than the distance d22 between the second mark MK2 and the second edge ES22 of the second mixture layer EML2.

[0113] refer to Figure 5B and Figure 5CThe processor 300 can adjust the placement of the second mixture layer EML2 such that the positions of the protrusions B1 of the first mixture layer EML1 and the protrusions B2 of the second mixture layer EML2, based on their coordinates in the MD direction, do not overlap but are spaced apart. In an embodiment, the processor 300 can adjust the opening and closing timing of the second material supply unit 120 to control the distance between the second mixture layer EML2 and the first mark MK1. In an embodiment, the processor 300 can control the placement of the second mixture layer EML2 such that the thickness of the mixture region EMR does not exceed a predetermined thickness, and can adjust the distance between the second mixture layer EML2 and the first mark MK1. The predetermined thickness can be one of several thickness values ​​input or stored in the processor 300. Accordingly, the distance d21 between the first edge ES21 of the second mixture layer EML2 and the first mark MK1 can be different from the distance d11 between the first edge ES11 of the first mixture layer EML1 and the first mark MK1. The difference between the two distances d11 and d21 can be appropriately selected by the processor 300 to reduce thickness variations in the mixture region EMR.

[0114] refer to Figure 5B The processor 300 can accelerate the opening timing of the second material supply unit 120, such that the distance d21 between the first mark MK1 and the first edge ES21 of the second mixture layer EML2 on the second surface P2 of the electrode plate E4 is greater than the distance d11 between the first mark MK1 and the first edge ES11 of the first mixture layer EML1 on the electrode plate E4. In this configuration, the protruding portion B1 of the first mixture layer EML1 and the protruding portion B2 of the second mixture layer EML2 can be spaced apart from each other without overlapping based on the coordinates in the MD direction. Furthermore, compared with the case where the two protruding portions B1 and B2 overlap based on the coordinates in the MD direction, the maximum thickness t2 of the mixture region EMR in the electrode plate E4 can be reduced. In an embodiment, the distance d12 between the second mark MK2 and the second edge ES12 of the first mixture layer EML1 is greater than the distance d22 between the second mark MK2 and the second edge ES22 of the second mixture layer EML2.

[0115] refer to Figure 5CThe processor 300 can delay the opening timing of the second material supply unit 120, such that the distance d21 between the first mark MK1 and the first edge ES21 of the second mixture layer EML2 on the second surface P2 of the electrode plate E5 is less than the distance d11 between the first mark MK1 and the first edge ES11 of the first mixture layer EML1 on the electrode plate E5. In this configuration, the protruding portion B1 of the first mixture layer EML1 and the protruding portion B2 of the second mixture layer EML2 can be spaced apart from each other without overlapping based on coordinates in the MD direction. Furthermore, compared to the case where the two protruding portions B1 and B2 overlap based on coordinates in the MD direction, the maximum thickness t3 of the mixture region EMR in the electrode plate E5 can be reduced. The distance d12 between the second mark MK2 and the second edge ES12 of the first mixture layer EML1 is less than the distance d22 between the second mark MK2 and the second edge ES22 of the second mixture layer EML2. However, this disclosure is not limited to this, and the processor 300 can appropriately select the length of the second mixture layer EML2 in the MD direction using the length of the first mixture layer EML1 in the MD direction calculated by the processor 300.

[0116] In the coating apparatus 10, the positions and distances between the first mixture layer EML1 and the mark MK formed on the first surface P1 of the substrate S can be sensed. Then, a second mixture layer EML2 can be placed such that the protruding portions B1 of the first mixture layer EML1 and B2 of the second mixture layer EML2 do not overlap and are spaced apart. Because the protruding portions B1 of the first mixture layer EML1 and B2 of the second mixture layer EML2 are spaced apart in the MD direction, preventing them from overlapping, the maximum thickness and thickness variation of the electrode plate E can be reduced. Therefore, this arrangement can improve the quality of the electrode plate E, increase the manufacturing yield of the electrode plate E, and improve the performance of the secondary battery containing the electrode plate E and / or reduce the likelihood of defects.

[0117] Figure 6A This is a perspective view of a coating apparatus 10 according to an embodiment of the present disclosure. Figure 6B This is a perspective view of a coating apparatus 10 according to an embodiment of the present disclosure. Figure 7 This is a cross-sectional view of a portion of a coating apparatus 10 according to an embodiment of the present disclosure.

[0118] refer to Figure 6A and Figure 6B The coating apparatus 10 may further include a second sensor 220 arranged parallel to the TD direction and used to measure the thickness of the first mixture layer EML1 or the second mixture layer EML2. (See reference) Figure 6A The second sensor 220 may be a component separate from the first sensor 200 and may be electrically connected to the processor 300. (See reference) Figure 6B The second sensor 220 may be a component integrated with the first sensor 200 and may be electrically connected to the first sensor 200. In an embodiment, the second sensor 220 is configured to measure the thickness of the second mixture layer EML2, and the second sensor 220 may be a component separate from the first sensor 200. The second sensor 220 may include a first sensing unit 221 and a second sensing unit 222. The first sensing unit 221 may measure the thickness of the first mixture layer EML1 in a region near the outer side in the TD direction of the first mixture layer EML1. In an embodiment, the first sensing unit 221 may measure the thickness of a first region A1 located on the left-hand side of the first mixture layer EML1 in the TD direction. The second sensing unit 222 may measure the thickness of a second region A2 located at the center of the first mixture layer EML1 in the TD direction. In an embodiment, the second sensor 220 may further include a third sensing unit 223, and the third sensing unit 223 may measure the thickness of a third region A3 located on the right-hand side of the first mixture layer EML1 in the TD direction. The positions of the first to third zones A1, A2 and A3 can be appropriately selected by considering the location used to calculate the thickness deviation of the first mixture layer EML1 in the TD direction.

[0119] The processor 300 of the coating apparatus 10 can calculate the thickness difference of the first mixture layer EML1 in the TD direction using at least two of the first region A1, the second region A2, and the third region A3. In one embodiment, the processor 300 can calculate the thickness deviation of the first mixture layer EML1 in the TD direction using either the thickness difference between the second region A2 and the first region A1 or the thickness difference between the third region A3 and the first region A1. However, this disclosure is not limited to this, and the thickness difference of the first mixture layer EML1 in the TD direction can be calculated using various methods. For more accurate measurement, the second sensor 220 may include four or more sensing units.

[0120] The processor 300 of the coating apparatus 10 can reduce the gap between the first material supply unit 110 and the first roller 410 in response to a thickness difference of the first mixture layer EML1 in the TD direction exceeding a predetermined thickness range, or increase the gap between the first material supply unit 110 and the first roller 410 in response to a thickness difference of the first mixture layer EML1 in the TD direction being less than a predetermined thickness range. In an embodiment, the gap between the first material supply unit 110 and the first roller 410 can be reduced in response to a thickness difference between the second region A2 and the first region A1 being greater than a predetermined thickness. The gap between the first material supply unit 110 and the first roller 410 can be adjusted by moving the first material supply unit 110 in the direction toward the first roller 410. In an embodiment, the gap between the first material supply unit 110 and the first roller 410 can be adjusted to be between approximately 0.05 mm and approximately 0.3 mm, but is not limited thereto.

[0121] In this embodiment, the adjustment of the gap between the first material supply unit 110 and the first roller 410 can be performed in real time. When the first material supply unit 110 is turned on and the first mixture layer EML1 begins to form, the thicknesses of the first to third regions A1, A2, and A3 can be obtained using the first to third sensing units 221, 222, and 223, respectively, all of which are parallel to the TD direction of the first mixture layer EML1. The processor 300 can use the thicknesses of the first to third regions A1, A2, and A3 to calculate the thickness deviation of the first mixture layer EML1 in the TD direction. Using the thickness deviation, the processor 300 can determine in real time whether to move the first material supply unit 110 and control its movement, thereby reducing the thickness difference of the first mixture layer EML1 in the TD direction. In this embodiment, when forming the currently placed mixture layer EML1, the adjustment of the gap between the first material supply unit 110 and the first roller 410 can be performed by reflecting the measurement results of the previously placed mixture layer EML1. However, this disclosure is not limited thereto, and the gap between the first material supply unit 110 and the first roller 410 can be adjusted in various ways.

[0122] In this embodiment, the gap between the first material supply unit 110 and the first roller 410 is reduced, and the mixture can be more uniformly distributed in the TD direction. In this embodiment, the thickness deviation of the first mixture layer EML1 in the TD direction can be reduced. As a result, the quality of the electrode plate E can be improved, the manufacturing yield of the electrode plate E can be increased, and the performance of the secondary battery containing the electrode plate E can be enhanced and / or the likelihood of defects can be reduced.

[0123] The second sensor 220's measurement of the thickness of the first mixture layer EML1 in the TD direction, the processor 300's calculation of the thickness deviation in the TD direction, and the adjustment of the gap between the first material supply unit 110 and the first roller 410 can also be applied to the second mixture layer EML2, the second material supply unit 120, and the second roller 420. (Reference) Figure 7 A substrate S coated with a first mixture layer EML1 can pass between a second roller 420 and a second material supply unit 120, and the second material supply unit 120 can coat a second mixture layer EML2 onto the substrate S. A second sensor 220 can sense the thickness of multiple regions of the second mixture layer EML2 in the TD direction, and a processor 300 can use the information received from the second sensor 220 to calculate the thickness deviation. Using this information, the processor 300 can adjust the gap h between the second material supply unit 120 and the second roller 420.

[0124] Figure 8 This is a flowchart illustrating a coating method according to an embodiment of the present disclosure.

[0125] The coating method includes the following steps: coating a first mixture layer onto a first surface of a substrate in which a mark including a first mark and a second mark are repeatedly formed along the MD direction by a first material supply unit (step S100); measuring at least one of a first distance between the first mark and the first mixture layer and a second distance between the second mark and the first mixture layer by a first sensor (step S200); adjusting the position of the second mixture layer disposed on the second surface of the substrate by a processor through controlling a second material supply unit using at least one of the first and second distances (step S300); and coating the second mixture layer onto the second surface of the substrate by the second material supply unit (step S400). The first surface and the second surface may refer to surfaces of the substrate located in opposite directions. In the coating method, when coating the second mixture layer, the position of the first mixture layer and the position of the mark and / or the distance between the first mixture layer and the first mark may be measured to adjust the position of the second mixture layer. The mark may be used as a reference point for placing the second mixture layer. In an embodiment, when coating the second mixture layer, the position of the first mixture layer and the position of the mark and / or the distance between the first mixture layer and the second mark may be measured to adjust the position of the second mixture layer and the length of the second mixture layer in the MD direction. The coating method can reduce the thickness variation of the electrode plate (the occurrence of step difference) caused by the placement of the first mixture layer and the second mixture layer, or can control the thickness of the electrode plate to not exceed a predetermined thickness.

[0126] The coating method may include step S100, in which a first mixture layer is coated by a first material supply unit onto a first surface of a substrate in which marks including a first mark and a second mark are repeatedly formed along the MD direction. The substrate may include a plurality of repeatedly formed marks. The plurality of marks may be in the shape of lines parallel to the TD direction. The first mark formed on the first surface of the substrate may be visible from a second surface, or a mark corresponding to the first mark may be formed on the second surface. The mixture supplied from the first material supply unit may be coated onto the first surface of the substrate to form the first mixture layer. The first mixture layer may be located at a first distance from the first mark, and a second mixture layer may be located at a first distance from the first mark. Here, the first distance may refer to the distance between the first mixture layer and the first mark in the MD direction. Furthermore, the first distance may be the shortest distance between the first mixture layer and the first mark in the MD direction.

[0127] The coating method may further include a step of forming marks on the substrate prior to step S100 of coating the first mixture layer. The marks may be formed at predetermined intervals. The predetermined interval between the marks may be in the range of about 1 mm to about 20 mm, but is not limited thereto.

[0128] A coating method according to an exemplary embodiment may include step S200 of measuring at least one of a first distance between a first marker and a first mixture layer and a second distance between a second marker and the first mixture layer by a first sensor. The first sensor can sense at least one of the first and second markers and the first mixture layer. In an embodiment, the first sensor can sense the positions of the first marker, the second marker, and the first mixture layer. Furthermore, using the information sensed by the first sensor, a processor can measure the first distance between the first marker and the first mixture layer and the second distance between the second marker and the first mixture layer. The first sensor may be electrically connected to the processor and transmit the sensed or measured information to the processor.

[0129] The coating method may include a step in which the processor calculates the length of the first mixture layer in the MD direction based on at least one of a first distance and a second distance measured in step S200. The processor may use both the first distance and the second distance to calculate the length of the first mixture layer in the MD direction. The method for the processor to calculate the length of the first mixture layer in the MD direction has been previously described, and therefore further description will be omitted here.

[0130] The coating method may include step S300, in which a processor controls a second material supply unit using at least one of a first distance and a second distance to adjust the position of a second mixture layer on a second surface of a substrate. The mixture supplied from the second material supply unit can be coated onto the second surface of the substrate to form a second mixture layer. Based on information received from a first sensor, the processor can control the second material supply unit to adjust the formation of the second mixture layer. In one embodiment, the processor can control the timing of opening and closing the second material supply unit to adjust the formation of the second mixture layer. In another embodiment, the processor can move the second material supply unit to adjust the formation of the second mixture layer. By controlling the second material supply unit, the processor can adjust the placement of the second mixture layer.

[0131] In one embodiment, the processor can adjust the placement of the second mixture layer using the position of the first mark and a first distance. In another embodiment, the processor can adjust the placement of the second mixture layer such that the distance between the second mixture layer and the first mark is substantially the same as the first distance. This can reduce the number of regions on the electrode plate with thickness variations caused by the formation of the first and second mixture layers. In yet another embodiment, the processor can adjust the placement of the second mixture layer such that the distance between the second mixture layer and the first mark differs from the first distance. In this case, the difference between the distance between the second mixture layer and the first mark and the first distance can be appropriately selected by the processor. In a third embodiment, when both the first and second mixture layers have protruding portions, the distance between the second mixture layer and the first mark can be adjusted to ensure that the combined thickness of the first and second mixture layers does not exceed a predetermined thickness. The processor can consider the thickness deviation of the electrode plate in the MD direction and set the second mixture layer by adjusting the distance between the second mixture layer and the first mark. This allows the electrode plate to be formed with a thickness less than or equal to a predetermined thickness.

[0132] In the coating method, the placement of the second mixture layer is based on the position of the first mixture layer on the substrate. As a result, the quality of the electrode plate can be improved, the manufacturing yield of the electrode plate can be increased, and the performance of the secondary battery containing the electrode plate can be enhanced and / or the possibility of defects can be reduced.

[0133] In one embodiment, step S300 of adjusting the position of the second mixture layer may include the processor controlling the second material supply unit using a second distance to adjust the distance between the second mixture layer and the second mark. Accordingly, the processor may adjust the placement of the second mixture layer and the length of the second mixture layer in the MD direction. In one embodiment, the processor may adjust the placement of the second mixture layer such that the distance between the second mixture layer and the second mark is substantially the same as the second distance. The manufactured electrode plate can be used in a stacked electrode assembly. In another embodiment, the processor may adjust the placement of the second mixture layer such that the distance between the second mixture layer and the second mark is different from the second distance. The difference between the distance between the second mixture layer and the second mark and the second distance can be appropriately selected by the processor. When the manufactured electrode plate is used in a wound electrode assembly, the distance between the second mixture layer and the second mark may be less than the second distance.

[0134] The coating method may include step S400, in which a second material supply unit coats a second mixture layer onto a second surface of a substrate. In step S400, the processor may control the second material supply unit such that the second mixture layer is coated onto the second surface of the substrate.

[0135] The coating method may further include, after step S100 of coating the first mixture layer, adjusting the gap between the first material supply unit and the first surface by calculating the thickness deviation of the first mixture layer in the TD direction using a processor. A second sensor may be arranged parallel to the TD direction of the first mixture layer and may include multiple sensing units. Using the second sensor, multiple thicknesses of the first mixture layer in the TD direction can be measured. The processor connected to the second sensor can calculate the thickness deviation of the first mixture layer in the TD direction using the multiple thicknesses of the first mixture layer in the TD direction and adjust the gap between the first material supply unit and the first surface. In an embodiment, the thickness deviation of the first mixture layer in the TD direction is greater than a predetermined thickness, and the processor can reduce the distance between the first material supply unit and the first surface. As a result, the thickness deviation of the first mixture layer in the TD direction can be reduced. The step of adjusting the gap between the first material supply unit and the first surface may be performed after step S100 of coating the first mixture layer, but may also be performed in real time during step S100 of coating the first mixture layer.

[0136] The coating method may further include, after step S300 of adjusting the position of the second mixture layer, adjusting the distance between the second material supply unit coating the second mixture layer and the second surface by calculating the thickness deviation of the second mixture layer in the TD direction. The second sensor may be arranged parallel to the TD direction of the second mixture layer and may include multiple sensing units. Using the second sensor, multiple thicknesses of the second mixture layer in the TD direction can be measured. A processor connected to the second sensor can calculate the thickness deviation of the second mixture layer in the TD direction using the multiple thicknesses of the second mixture layer in the TD direction and adjust the gap between the second material supply unit coating the second mixture layer and the second surface. In an embodiment, the thickness deviation of the second mixture layer in the TD direction is greater than a predetermined thickness, and the processor can reduce the distance between the second material supply unit and the second surface. As a result, the thickness deviation of the second mixture layer in the TD direction can be reduced. The step of adjusting the gap between the second material supply unit and the second surface may be performed after step S400 of coating the second mixture layer, but it may also be performed in real time during step S300 of adjusting the position of the second mixture layer.

[0137] The coating method can measure the thickness deviation of the first or second mixture layer in the TD direction and reduce the thickness deviation of the first or second mixture layer. As a result, the quality of the electrode plate can be improved, the manufacturing yield of the electrode plate can be increased, the performance of the secondary battery containing the electrode plate can be enhanced, and / or the possibility of defects can be reduced.

[0138] Although this disclosure has been described with reference to the accompanying drawings illustrating embodiments and aspects thereof, this disclosure is not limited thereto. Various modifications and variations can be made by those skilled in the art within the scope of the technical spirit of this disclosure.

Claims

1. A coating apparatus, comprising: A first material supply unit is configured to coat a first mixture layer on a first surface of a substrate, the substrate including markings that are repeatedly formed along a machine direction; A first sensor is configured to sense the first mixture layer and the marker; as well as The processor is configured to determine the position of the first mixture layer based on the marker.

2. The coating equipment according to claim 1, wherein, The first sensor is configured to sense the position of the markers and the distance between each of the markers and the first mixture layer.

3. The coating equipment according to claim 2, wherein, The marking includes a first marking, wherein the first mixture layer includes a first edge and a second edge perpendicular to the machine direction, and wherein the processor is configured to determine a first distance between the first edge and the first marking adjacent to the first edge.

4. The coating equipment according to claim 3, wherein, The marker further includes a second marker, and wherein the processor is configured to determine a second distance between the second edge and the second marker adjacent to the second edge.

5. The coating apparatus according to claim 4, wherein, The processor is configured to determine the length of the first mixture layer in the machine direction based on the first distance and the second distance.

6. The coating apparatus according to claim 3, further comprising: The second material supply unit is configured to coat a second mixture layer on the second surface of the substrate. Wherein, the second surface is opposite to the first surface, and wherein the processor is configured to control the second material supply unit based on the first distance.

7. The coating apparatus according to claim 6, wherein, The processor is configured to adjust the third distance between the third edge of the second mixture layer perpendicular to the machine direction and the first mark to be the same as the first distance.

8. The coating apparatus according to claim 6, wherein, The processor is configured to adjust a third distance between the third edge of the second mixture layer perpendicular to the machine direction and the first mark to be different from the first distance.

9. The coating apparatus according to claim 6, wherein, The processor is configured to adjust a third distance between the third edge of the second mixture layer perpendicular to the machine direction and the first mark, such that the combined thickness of the first mixture layer and the second mixture layer is equal to or less than a predetermined thickness.

10. The coating apparatus according to claim 6, wherein, The processor is configured to determine a second distance between the second edge and a second mark adjacent to the second edge, and to control the second material supply unit based on the first distance and the second distance.

11. The coating apparatus according to claim 6, wherein, The first material supply unit or the second material supply unit is spaced apart from the substrate by a predetermined distance, and wherein the processor is configured to control the first material supply unit or the second material supply unit to adjust the predetermined distance.

12. The coating apparatus according to claim 11, further comprising: The second sensor is placed in a lateral direction parallel to the direction of the machine to measure the thickness of the first mixture layer or the second mixture layer.

13. The coating apparatus according to claim 12, wherein, The second sensor includes a first sensing unit and a second sensing unit, wherein the processor is configured to reduce the predetermined distance in response to a difference between the thickness measured by the first sensing unit and the thickness measured by the second sensing unit being equal to or greater than a predetermined thickness.

14. The coating apparatus according to claim 1, wherein, The marking includes a first mark and a second mark, and the coating device further includes a marking unit that forms the first mark and the second mark spaced apart by a predetermined distance.

15. The coating apparatus according to claim 14, wherein, Each of the markings is shaped like a line parallel to a transverse direction perpendicular to the direction of the machine.

16. A coating method, comprising: A first mixture layer is coated on a first surface of a substrate, the substrate including markings repeatedly formed along a machine direction, the markings including a first marking and a second marking; Determine at least one selected from a first distance and a second distance, wherein the first distance is the distance between a first edge of the first mixture layer and a first mark adjacent to the first edge, and the second distance is the distance between a second edge of the first mixture layer and a second mark adjacent to the second edge; The position of the second mixture layer to be placed on a second surface of the substrate, opposite to the first surface, is adjusted using at least one of the first distance and the second distance. as well as The second mixture layer is coated on the second surface of the substrate.

17. The coating method according to claim 16, wherein, The adjustments include: The third distance is adjusted to be equal to the first distance, wherein the third distance is the distance between the edge of the second mixture layer and the first mark.

18. The coating method according to claim 16, wherein, The adjustments include: The third distance is adjusted so that the combined thickness of the first mixture layer and the second mixture layer is equal to or less than a predetermined thickness, wherein the third distance is the distance between the edge of the second mixture layer and the first mark.

19. The coating method according to claim 16, wherein, The adjustments include: The fourth distance is adjusted using the second distance, which is the distance between the edge of the second mixture layer and the second mark.

20. The coating method according to claim 16, further comprising: After the coating of the first mixture layer, the thickness deviation of the first mixture layer in the lateral direction perpendicular to the machine direction is determined, and the gap between the first surface and the first material supply unit configured to coat the first mixture layer is adjusted. or After the adjustment, the thickness deviation of the second mixture layer in the lateral direction is determined, and the gap between the second surface and the second material supply unit configured to coat the second mixture layer is adjusted.

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