Ceramic packaging inverted pressure welding tool and pressure welding method

Abstract

The invention provides a ceramic packaging inverted pressure welding tool and a pressure welding method. The pressure welding tool comprises a base and a pressurizing assembly. The tool comprises a base, multiple levels of limiting grooves are formed in the base, the multiple levels of limiting grooves are integrally formed in the base, the multiple levels of limiting grooves are sequentially arranged in the vertical direction, the groove body contours are matched with different structural parts of the ceramic packaging part respectively, and the ceramic packaging part is in an inverted state when the tool is used. Pins, a substrate, a surrounding frame and other parts can be sequentially and correspondingly arranged in all levels of limiting grooves, and through the integrally-arranged limiting groove structure, the positioning precision is improved. The pressurizing assembly comprises a pressing and abutting piece, a fastening piece and a support, the support is fixedly installed on the base, the pressing and abutting piece is located above the base and corresponds to the ceramic packaging part in the limiting groove, one end of the fastening piece is connected into a screw hole preset in the support through threads, and the other end of the fastening piece extends to the position above the pressing and abutting piece in the vertical direction and abuts against the upper surface of the pressing and abutting piece; and the pressure applied to the pressing piece can be adjusted.

Description

Technical Field

[0001] This application belongs to the field of welding tooling technology, and more specifically, relates to a ceramic encapsulation inverted pressure welding tooling and a pressure welding method. Background Technology

[0002] Currently, the welding process for ceramic packaging mainly adopts hard soldering or soft soldering. The former mostly uses silver-copper solder, while the latter mainly uses gold-tin solder. Regardless of the welding method used, special tooling is required to position the product to ensure welding accuracy. The level of welding accuracy directly determines the yield of subsequent product assembly and the overall airtight performance. If the positioning is inaccurate, it is very easy to cause problems such as poor bonding of the welding interface and sealing failure, which seriously affects the product quality.

[0003] In conventional welding fixture designs, to accommodate the structural characteristics of leaded ceramic packaged products, a multi-layered stacked positioning structure is typically used: the bottom layer holds the ceramic package leads for initial support and positioning; the second layer holds the ceramic substrate to support the leads and further define their position; and the third layer holds the frame to align it with the substrate. For leaded ceramic packaged products, at least three layers of graphite fixtures are required for basic positioning. Furthermore, to prevent poor adhesion due to thermal expansion or uneven pressure during welding, additional counterweights (or pressure blocks) are placed above each layer to increase downward pressure. However, this multi-layered fixture inevitably leads to a cumulative effect of positioning errors. The machining accuracy deviations, assembly gaps, and minute displacements of the interlayer contact surfaces in each layer are amplified during the multi-layer transfer, ultimately causing positioning misalignment or even positioning failure during welding, thus reducing the overall yield rate of the ceramic packaged products. Summary of the Invention

[0004] This application provides a ceramic encapsulation inverted pressure welding fixture and pressure welding method to solve the technical problem of low positioning accuracy during ceramic encapsulation welding in the prior art.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: A ceramic encapsulation inverted pressure bonding fixture is provided, comprising: The base has multiple levels of limiting grooves, and the ceramic encapsulation components are sequentially placed in each level of the limiting grooves; The pressurizing assembly includes a pressing member, a fastener, and a bracket. The bracket is mounted on the base. The pressing member presses against a ceramic encapsulation component within the limiting groove. The fastener is threaded to the bracket, and one end of the fastener presses against the pressing member. The fastener is rotated to adjust the pressure applied to the pressing member.

[0006] As a further improvement to the above technical solution: Optionally, the multi-level limiting groove includes a first-level limiting groove, a second-level limiting groove, and a third-level limiting groove stacked sequentially. The second-level limiting groove is located above the first-level limiting groove, and the third-level limiting groove is located above the second-level limiting groove. The projected areas of the first-level limiting groove, the second-level limiting groove, and the third-level limiting groove increase progressively along the setting direction.

[0007] Optionally, the frame of the ceramic encapsulation component is placed in the primary limiting groove, the side wall of the primary limiting groove has a first positioning boss, the first positioning boss abuts against the frame, and the primary limiting groove also has a first vent hole, the first vent hole connecting the primary limiting groove and the secondary limiting groove.

[0008] Optionally, the ceramic substrate and solder pad of the ceramic packaging component are placed in the secondary limiting groove. The side wall of the secondary limiting groove has a second positioning boss, which abuts against the ceramic substrate. The secondary limiting groove also has a second vent hole, which connects the secondary limiting groove and the tertiary limiting groove.

[0009] Optionally, the pins of the ceramic encapsulation component are placed in the three-level limiting groove. The sidewall of the three-level limiting groove has a third positioning boss, which abuts against the pins. The three-level limiting groove also has a third vent hole, which connects the three-level limiting groove to the external atmosphere.

[0010] Optionally, the thickness of the primary limiting groove is less than the thickness of the frame of the ceramic packaging component, and the thickness of the secondary limiting groove is less than the thickness of the ceramic substrate and the solder pad of the ceramic packaging component.

[0011] Optionally, the bracket includes a column and a crossbeam, one end of the column is mounted on the base, the crossbeam is mounted on the other end of the column, the crossbeam is provided with threaded holes, and the fastener is connected to the threaded holes.

[0012] Optionally, the base has a plurality of the limiting grooves, and the crossbeam has a plurality of threaded holes corresponding to the limiting grooves.

[0013] Optionally, the base is a graphite base.

[0014] Compared with the prior art, the advantages of the ceramic encapsulation inverted pressure welding fixture and pressure welding method provided in this application are as follows: The ceramic encapsulation inverted pressure welding fixture provided in this application includes a base and a pressure assembly. The base has multi-level limiting grooves integrally formed on it. Each level of limiting groove is arranged sequentially along the vertical direction, and its contour is adapted to different structural parts of the ceramic encapsulation component. When the fixture is used, the ceramic encapsulation component is in an inverted state, and its pins, substrate, and frame can be sequentially placed within each level of the limiting groove. This integrally formed limiting groove structure avoids the inconsistency in positioning references caused by the separate assembly of traditional multi-layer fixtures, effectively improving positioning accuracy and reducing the cumulative error caused by inter-layer transfer. The pressurizing assembly includes a pressing member, a fastener, and a bracket. The bracket is fixedly installed on the side wall or end of the base. The pressing member is located above the base and corresponds to the ceramic encapsulation component in the limiting groove. Its shape matches the top surface contour of the ceramic encapsulation component to apply pressure evenly. The fastener is a screw structure. One end of it is threaded into a pre-set screw hole on the bracket, and the other end extends vertically to the top of the pressing member and abuts against its upper surface. By rotating the fastener, it can be driven to move axially, thereby adjusting the pressure applied to the pressing member and achieving stable pressing of the ceramic encapsulation component during the welding process.

[0015] This fixture's multi-level limiting grooves, through an integrated design, not only meet the chip positioning requirements during eutectic bonding of ceramic packaged chips, but also simultaneously limit the relative position of the substrate and the frame. This allows chip eutectic bonding and substrate frame bonding to be completed under the same fixture positioning, thereby simultaneously achieving two bonding processes in a single sintering process. This simplifies the traditional process that requires step-by-step positioning and multiple sintering, and helps improve the efficiency and product consistency of ceramic packaged bonding.

[0016] This application also provides a method for inverted pressure bonding of ceramic encapsulation, comprising the following steps: The frame of the ceramic encapsulation component is placed in the first-level limiting groove of the base, which is the base of the ceramic encapsulation inverted pressure welding fixture mentioned above. The ceramic substrate and solder pad of the ceramic package component are placed in the secondary limiting groove of the base, and the pins of the ceramic package component are placed in the tertiary limiting groove of the base. The pressing member is pressed against the ceramic substrate, the fastener is threaded to the bracket, and one end of the fastener rests against the pressing member. The fastener is rotated to adjust the pressure applied by the fastener to the pressing member. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A three-dimensional structural schematic diagram of the ceramic encapsulation inverted pressure welding fixture provided in this application; Figure 2 A schematic diagram of the base of the ceramic encapsulation inverted pressure welding fixture provided in this application; Figure 3 This is a partially enlarged and cross-sectional structural diagram of the base of the ceramic encapsulation inverted pressure welding fixture provided in this application.

[0019] The following are the labeling elements in the figure: 1. Base; 11. Limiting groove; 111. Primary limiting groove; 1111. First positioning boss; 1112. First vent hole; 112. Secondary limiting groove; 1121. Second positioning boss; 1122. Second vent hole; 113. Tertiary limiting groove; 1131. Third positioning boss; 1132. Third vent hole; 2. Pressurizing component; 21. Pressing component; 22. Fastener; 23. Bracket; 231. Column; 232. Beam. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0024] like Figure 1 As shown, this application provides a ceramic encapsulation inverted pressure welding fixture, including a base 1 and a pressure assembly 2.

[0025] The base 1 is provided with multi-level limiting grooves 11, which are integrally formed on the base 1. The limiting grooves 11 of each level are arranged in sequence along the vertical direction and the groove contours are adapted to different structural parts of the ceramic packaging component. When the ceramic packaging component is used in the tooling, it is in an inverted state, and its pins, substrate and frame can be placed in the limiting grooves 11 of each level in sequence. Through the integrally set limiting groove structure, the problem of inconsistent positioning reference caused by the separate assembly of traditional multi-layer tooling is avoided, which effectively improves the positioning accuracy and reduces the cumulative error caused by inter-layer transfer.

[0026] The pressurizing assembly 2 includes a pressing member 21, a fastener 22, and a bracket 23. The bracket 23 is fixedly installed on the side wall or end of the base 1. The pressing member 21 is located above the base 1 and corresponds to the ceramic encapsulation component in the limiting groove 11. Its shape matches the top surface contour of the ceramic encapsulation component to apply pressure evenly. The fastener 22 is a screw structure. One end of it is threaded into a pre-set screw hole on the bracket 23, and the other end extends vertically to the top of the pressing member 21 and abuts against its upper surface. By rotating the fastener 22, it can be driven to move axially, thereby adjusting the pressure applied to the pressing member 21 and achieving stable pressing of the ceramic encapsulation component during the welding process.

[0027] The multi-level limiting groove 11 of this tooling, through its integrated design, can not only meet the positioning requirements of the chip during eutectic bonding of ceramic packaged chips, but also simultaneously limit the relative position of the substrate and the frame. This allows the chip eutectic bonding and substrate frame bonding to be completed under the same tooling positioning, thereby simultaneously realizing the two bonding processes in one sintering process. This simplifies the traditional process that requires step-by-step positioning and multiple sintering, and helps to improve the efficiency of ceramic packaged bonding and product consistency.

[0028] like Figure 2 and Figure 3As shown, in some specific embodiments of this application, the multi-level limiting groove 11 specifically includes a first-level limiting groove 111, a second-level limiting groove 112, and a third-level limiting groove 113 stacked sequentially. The three are distributed in a stepped manner along the direction perpendicular to the surface of the base 1. The second-level limiting groove 112 is located directly above the first-level limiting groove 111, and the third-level limiting groove 113 is located directly above the second-level limiting groove 112, forming a three-level accommodating structure from top to bottom. When projected vertically downwards from the upper surface of base 1, the projection area of ​​the first-level limiting groove 111 is the smallest, the projection area of ​​the second-level limiting groove 112 is larger than that of the first-level limiting groove 111, and the projection area of ​​the third-level limiting groove 113 is the largest, forming a progressively expanding projection outline. This structural design with progressively increasing projection area not only ensures the precise matching of each level of limiting groove with different structural parts of the ceramic packaging component, but also achieves the overall positioning of the ceramic packaging component from the frame to the substrate and then to the pins through the stepped groove layout, so that the relative positional relationship of each component in the inverted state can be stably maintained, providing a reliable positioning basis for subsequent chip eutectic bonding and substrate frame bonding.

[0029] like Figure 2 and Figure 3 As shown in some specific embodiments of this application, when the ceramic encapsulation component is placed upside down on the tooling, its frame portion is placed within the primary limiting groove 111. At this time, the contour of the primary limiting groove 111 is adapted to the outer peripheral wall of the frame, and is used to circumferentially limit the frame. A first positioning boss 1111 is provided on one side wall of the primary limiting groove 111. The first positioning boss 1111 extends from the side wall into the groove. When the frame is placed into the primary limiting groove 111, the side of the first positioning boss 1111 abuts against the outer peripheral wall of the frame, limiting the horizontal displacement of the frame through surface contact, and ensuring the positional accuracy of the frame within the groove. A first vent hole 1112 is also provided at the bottom of the primary limiting groove 111. The first vent hole 1112 penetrates the bottom wall of the primary limiting groove 111, and its lower end opening is connected to the secondary limiting groove 112, while its upper end opening is located at the bottom of the primary limiting groove 111. When the frame is placed in the primary limiting groove 111, the gas generated by the melting of the solder during subsequent welding can be discharged through the first vent hole 1112 to the space where the secondary limiting groove 112 is located. This prevents the frame from not fitting tightly to the bottom of the groove due to gas retention, which would affect the positioning stability of the frame and the interface bonding effect during subsequent welding. Through the supporting action of the first positioning boss 1111 and the venting function of the first vent hole 1112, the primary limiting groove 111 can reliably fix the position of the frame and provide a channel for gas discharge during the welding process, ensuring the positioning accuracy of the frame in the tooling and the stability of the welding process.

[0030] like Figure 2 and Figure 3As shown in some specific embodiments of this application, the ceramic substrate of the ceramic packaging component and the solder pad located between it and the frame are placed together in the secondary limiting groove 112. The groove contour of the secondary limiting groove 112 is adapted to the external dimensions of the ceramic substrate, and the groove depth takes into account the thickness of the solder pad, so that the solder pad can be laid flat between the corresponding contact surfaces of the substrate and the frame in the primary limiting groove 111. The side wall of the secondary limiting groove 112 is provided with a second positioning boss 1121, which extends from the side wall into the groove. When the ceramic substrate is placed in the secondary limiting groove 112, the side of the second positioning boss 1121 abuts against the outer side wall of the ceramic substrate. The surface contact restricts the horizontal displacement of the ceramic substrate, ensuring the positional accuracy of the ceramic substrate relative to the frame in the primary limiting groove 111, thereby ensuring that the solder pad can be accurately positioned in the corresponding area of ​​the interface between the substrate and the frame to be welded. The side wall of the secondary limiting groove 112 is also provided with a second exhaust hole 1122, which penetrates the secondary limiting groove 112 and its opening is connected to the tertiary limiting groove 113.

[0031] When the ceramic substrate and solder pads are placed in the secondary limiting groove 112, the gas generated by the melting of the solder during the welding process can be discharged through the second vent hole 1122 to the space where the tertiary limiting groove 113 is located. This avoids gas stagnation, which could lead to poor adhesion between the substrate and the bottom of the groove or air bubbles between the solder pads and the substrate / frame interface, thus affecting the bonding strength and airtightness of the welding interface. Through the supporting action of the second positioning boss 1121 and the venting function of the second vent hole 1122, the secondary limiting groove 112 can reliably fix the position of the ceramic substrate and solder pads and provide a channel for gas discharge during the welding process, ensuring the bonding quality of the welding interface between the substrate and the frame and the stability of the welding process.

[0032] like Figure 2 and Figure 3As shown in some specific embodiments of this application, the pins of the ceramic package component are placed in a three-level limiting groove 113. The contour of the three-level limiting groove 113 is adapted to the external dimensions of the pin, and the groove depth is determined according to the length of the pin, so that the pin can be completely accommodated in the groove and the top end is exposed outside the groove or corresponds to the pressing member 21, in order to meet the positioning requirements of the lower part of the pin in the inverted state. A third positioning boss 1131 is provided on one side wall of the three-level limiting groove 113. The third positioning boss 1131 extends from the side wall into the groove. When the pin is placed in the three-level limiting groove 113, the side of the third positioning boss 1131 abuts against the outer side wall of the pin. The surface contact restricts the horizontal displacement of the pin, ensuring the positional accuracy of the pin relative to the ceramic substrate in the two-level limiting groove 112, so that the pin and the pad on the substrate are accurately aligned, providing a positioning basis for the subsequent electrical connection or soldering of the pin and the substrate. A third vent 1132 is provided on the side wall or bottom of the three-level limiting groove 113. The third vent 1132 penetrates the wall of the three-level limiting groove 113, with one end connected to the internal space of the three-level limiting groove 113 and the other end connected to the external atmosphere. When the pin is placed in the three-level limiting groove 113, if there is an air gap between the pin and the groove wall, or if gas is generated due to temperature rise during welding, it can be discharged to the external atmosphere in time through the third vent 1132. This avoids the pin not fitting tightly to the groove wall due to gas retention, or the pin's positioning stability being affected by air pressure, thereby preventing problems such as poor soldering or misalignment when the pin is welded to the substrate. Through the support of the third positioning boss 1131 and the venting function of the third vent 1132, the three-level limiting groove 113 can effectively position the pin and provide a channel for gas discharge during welding, ensuring the positioning accuracy of the pin in the tooling and the bonding quality of the interface with the substrate.

[0033] In some specific embodiments of this application, the thickness of the primary limiting groove 111 is designed to be less than the thickness of the frame of the ceramic packaging component, and the thickness of the secondary limiting groove 112 is designed to be less than the sum of the thicknesses of the ceramic substrate and the solder pad of the ceramic packaging component.

[0034] When the thickness of the primary limiting groove 111 is less than that of the frame, the top surface of the frame can protrude from the primary limiting groove 111 when the frame is placed in the primary limiting groove 111. This avoids the frame sinking too much due to the groove being too deep, which would affect its relative height position with the substrate in the secondary limiting groove 112.

[0035] The thickness of the secondary limiting groove 112 is less than the sum of the thicknesses of the ceramic substrate and the welding piece. When the ceramic substrate and the welding piece are placed together in the secondary limiting groove 112, the top surfaces of the substrate and the welding piece protrude from the secondary limiting groove 112, ensuring sufficient contact between the welding interface of the substrate and the frame. By setting the thicknesses of the primary limiting groove 111 and the secondary limiting groove 112 to be less than the thickness of the corresponding placed components, necessary space allowance can be provided for the welding process between components while ensuring positioning accuracy. This prevents the components from being positioned too tightly or too loosely due to excessive groove depth, thereby improving the uniformity of interface bonding and the stability of welding quality during welding.

[0036] like Figure 1 As shown, in some specific embodiments of this application, the bracket 23 includes a column 231 and a crossbeam 232. One end of the column 231 is installed on the side or end of the base 1, and its installation method can be welding, bolting, or direct integral molding to ensure that the position between the bracket 23 and the base 1 is fixed. The other end of the column 231 extends upward in a direction perpendicular to the surface of the base 1, and the crossbeam 232 is installed at this extended end. The length direction of the crossbeam 232 is adapted to the arrangement direction of the multi-level limiting grooves 11 so that the pressing member 21 below it can cover the ceramic encapsulation components above all the limiting grooves. The crossbeam 232 is provided with a threaded hole that runs through the thickness direction of the crossbeam 232. The fastener 22 is a screw structure, one end of which is screwed into the threaded hole on the crossbeam 232, and the other end extends downward in a vertical direction and faces the upper surface of the pressing member 21. When the fastener 22 is rotated, it can move axially along the threaded hole, transmitting pressure through its contact with the pressing member 21. This allows for adjustment of the pressure applied to the pressing member 21, thereby controlling the pressing force on the ceramic encapsulated components within the limiting groove. Through the combined structure of the column 231 and the beam 232, the bracket 23 provides stable support for the fastener 22, ensuring the directionality and uniformity of pressure transmission. Combined with the pressing member 21, this synchronously applies pressure to each ceramic encapsulated component within the multi-level limiting groove 11, which helps maintain the relative positional accuracy and interface adhesion between components during the welding process.

[0037] like Figure 1 and Figure 2As shown in some specific embodiments of this application, the base 1 is provided with several sets of multi-level limiting grooves 11. Each set of multi-level limiting grooves 11 includes a first-level limiting groove 111, a second-level limiting groove 112, and a third-level limiting groove 113 as described above. The limiting grooves 11 are arranged at intervals along the length or width of the base 1 to accommodate the simultaneous positioning requirements of multiple ceramic encapsulation components. The crossbeam 232 is part of the bracket 23, and its length direction corresponds to the distribution direction of each set of limiting grooves 11 on the base 1. The crossbeam 232 is provided with several threaded holes, the number of which is consistent with the number of sets of limiting grooves 11 on the base 1, and the position of each threaded hole corresponds to the position of the pressing member 21 in a set of limiting grooves 11. Specifically, each threaded hole on the crossbeam 232 is through along its thickness direction, and the number of fasteners 22 is the same as the number of threaded holes. Each fastener 22 is screwed into the corresponding threaded hole, and its lower end presses against the pressing member 21 provided above the corresponding set of limiting grooves 11. When each fastener 22 is rotated, the pressure applied by the corresponding pressing component 21 can be adjusted independently, thereby achieving pressure control for each group of ceramic encapsulation components and ensuring that multiple ceramic encapsulation components maintain a stable pressing state during the welding process. By cooperating with several limiting grooves 11 on the base 1 and several corresponding threaded holes on the crossbeam 232, this fixture can simultaneously perform positioning and pressurization operations on multiple ceramic encapsulation components, improving the efficiency of the welding operation. At the same time, through the corresponding group structure, the independent adjustability of the pressure on each ceramic encapsulation component is ensured, avoiding the impact of abnormal pressure on a single component on the welding quality of the entire batch of products.

[0038] In some specific embodiments of this application, the base 1 is made of graphite, i.e., a graphite base. Graphite has a high thermal conductivity and good thermal stability. During the ceramic encapsulation welding process, when the tooling enters the sintering furnace or other equipment with the product for high-temperature treatment, the graphite base can quickly and uniformly conduct heat, making the temperature distribution of each part of the ceramic encapsulation component within the multi-level limiting groove 11 more uniform, reducing the stress difference at the welding interface caused by local temperature differences, and helping to improve the consistency of welding quality. At the same time, graphite has good chemical stability and is not prone to chemical reaction with the metal plating or solder of the ceramic encapsulation component at high temperatures, which can avoid introducing impurities that affect the bonding performance of the welding interface. In addition, graphite is easy to process and shape, and can accurately prepare the primary limiting groove 111, the secondary limiting groove 112, and the tertiary limiting groove 113 with specific contours, ensuring the dimensional accuracy and geometric tolerance of each limiting groove, thereby providing an accurate positioning reference for the ceramic encapsulation component. The graphite base maintains a low surface roughness after processing, resulting in less friction at the contact surface with the ceramic encapsulation component. This facilitates the placement and removal of the ceramic encapsulation component. Simultaneously, under the pressure of the pressurizing component 2, it achieves relatively uniform contact, preventing component damage due to excessive local pressure. By setting the base 1 as a graphite base, the requirements for thermal conductivity uniformity, chemical stability, processing accuracy, and ease of use are balanced, providing a fundamental guarantee for the high-precision positioning and stable welding of the ceramic encapsulation component using this tooling.

[0039] This application provides a method for inverted bonding of ceramic encapsulation, comprising the following steps: First, the frame of the ceramic encapsulation component is placed in the primary limiting groove 111 of the base 1. The base 1 here is the base 1 of the ceramic encapsulation inverted pressure welding fixture described in the above embodiment, which is made of graphite material. The inner wall of the primary limiting groove 111 is provided with a first positioning boss 1111. When the frame is placed, the outer wall abuts against the first positioning boss 1111 to achieve horizontal positioning of the frame. The first exhaust hole 1112 at the bottom of the primary limiting groove 111 is connected to the secondary limiting groove 112 to discharge air that may be trapped when the frame is placed or gas generated during subsequent welding.

[0040] Next, the ceramic substrate of the ceramic package component and the solder pad located on one side of the substrate are placed together in the secondary limiting groove 112 of the base 1. The second positioning boss 1121 of the secondary limiting groove 112 abuts against the outer wall of the ceramic substrate to limit its horizontal position. The second vent hole 1122 at the bottom of the secondary limiting groove 112 is connected to the tertiary limiting groove 113 to discharge air or molten solder gas between the substrate and the solder pad. Then, the pin of the ceramic package component is placed in the tertiary limiting groove 113 of the base 1. The third positioning boss 1131 of the tertiary limiting groove 113 abuts against the outer wall of the pin to achieve positioning. The third vent hole 1132 of the tertiary limiting groove 113 is connected to the external atmosphere to discharge air or gas generated during welding between the pin and the groove wall. This completes the hierarchical positioning of the ceramic package component from the frame to the substrate and then to the pin in the inverted state.

[0041] Next, the pressing member 21 is placed on top of the ceramic substrate, making it contact the substrate surface. The shape of the pressing member 21 matches the contour of the substrate to ensure uniform pressure. The fastener 22 is a screw structure, one end of which is threaded to the corresponding threaded hole on the crossbeam 232 of the bracket 23, and the other end extends vertically to the pressing member 21 and abuts against its upper surface. The column 231 of the bracket 23 is fixed to the side of the base 1, and the crossbeam 232 spans across the multi-level limiting groove 11. By rotating the fastener 22 to drive it to move axially, the pressure applied to the pressing member 21 can be adjusted. During operation, a torque wrench is used to rotate the fastener 22 until the predetermined tightening pressure value is reached. At this time, the pressing member 21 transmits pressure to the ceramic substrate, and through the substrate and solder pads, it acts on the frame. At the same time, the pins remain stable within the three-level limiting groove 113, realizing tight fit between the components of the ceramic packaging component, providing stable positioning and pressure conditions for subsequent eutectic welding and substrate frame welding.

[0042] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A ceramic encapsulation inverted pressure welding fixture, characterized in that, include: The base (1) has a multi-level limiting groove (11), and the ceramic encapsulation component is placed in the limiting groove (11) at each level in sequence. The pressurizing assembly (2) includes a pressing member (21), a fastener (22) and a bracket (23). The bracket (23) is mounted on the base (1). The pressing member (21) presses against the ceramic encapsulation component in the limiting groove (11). The fastener (22) is threaded to the bracket (23). One end of the fastener (22) presses against the pressing member (21). The fastener (22) is rotated to adjust the pressure applied to the pressing member (21).

2. The ceramic encapsulation inverted pressure welding fixture as described in claim 1, characterized in that, The multi-level limiting groove (11) includes a first-level limiting groove (111), a second-level limiting groove (112), and a third-level limiting groove (113) stacked sequentially. The second-level limiting groove (112) is located above the first-level limiting groove (111), and the third-level limiting groove (113) is located above the second-level limiting groove (112). The projected area of ​​the first-level limiting groove (111), the second-level limiting groove (112), and the third-level limiting groove (113) increases progressively along the setting direction.

3. The ceramic encapsulation inverted pressure welding fixture as described in claim 2, characterized in that, The frame of the ceramic encapsulation component is placed in the primary limiting groove (111). The side wall of the primary limiting groove (111) has a first positioning boss (1111), which abuts against the frame. The primary limiting groove (111) also has a first vent hole (1112), which connects the primary limiting groove (111) and the secondary limiting groove (112).

4. The ceramic encapsulation inverted pressure welding fixture as described in claim 3, characterized in that, The ceramic substrate and solder pad of the ceramic packaging component are placed in the secondary limiting groove (112). The side wall of the secondary limiting groove (112) has a second positioning boss (1121), which abuts against the ceramic substrate. The secondary limiting groove (112) also has a second vent hole (1122), which connects the secondary limiting groove (112) and the tertiary limiting groove (113).

5. The ceramic encapsulation inverted pressure welding fixture as described in claim 4, characterized in that, The pins of the ceramic encapsulation component are placed in the three-level limiting groove (113). The sidewall of the three-level limiting groove (113) has a third positioning boss (1131), which abuts against the pins. The three-level limiting groove (113) also has a third vent (1132), which connects the three-level limiting groove (113) to the external atmosphere.

6. The ceramic encapsulation inverted pressure welding fixture as described in claim 4, characterized in that, The thickness of the primary limiting groove (111) is less than the thickness of the frame of the ceramic packaging component, and the thickness of the secondary limiting groove (112) is less than the thickness of the ceramic substrate and the solder pad of the ceramic packaging component.

7. The ceramic encapsulation inverted pressure welding fixture as described in any one of claims 1 to 6, characterized in that, The bracket (23) includes a column (231) and a crossbeam (232). One end of the column (231) is installed on the base (1), and the crossbeam (232) is installed on the other end of the column (231). The crossbeam (232) is provided with a threaded hole, and the fastener (22) is connected to the threaded hole.

8. The ceramic encapsulation inverted pressure welding fixture as described in claim 7, characterized in that, The base (1) has a plurality of the limiting grooves (11), and the crossbeam (232) has a plurality of threaded holes corresponding to the limiting grooves (11).

9. The ceramic encapsulation inverted pressure welding fixture as described in any one of claims 1 to 6, characterized in that, The base (1) is a graphite base.

10. A method for inverted pressure bonding of ceramic encapsulation, characterized in that, Includes the following steps: The frame of the ceramic encapsulation component is placed in the first-level limiting groove (111) of the base (1), wherein the base (1) is the base (1) of the ceramic encapsulation inverted pressure welding fixture according to any one of claims 1 to 9. The ceramic substrate and solder pad of the ceramic package component are placed in the secondary limiting groove (112) of the base (1), and the pins of the ceramic package component are placed in the tertiary limiting groove (113) of the base (1). Press the pressing member (21) against the ceramic substrate. The fastener (22) is threaded to the bracket (23), and one end of the fastener (22) rests against the pressing member (21). Rotate the fastener (22) to adjust the pressure applied by the fastener (22) to the pressing member (21).

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