Method and device for estimating stripping of bonding wire of IGBT (Insulated Gate Bipolar Translator) module

Abstract

The invention relates to the technical field of IGBT (Insulated Gate Bipolar Translator) module detection, in particular to a method and a device for estimating stripping of a bonding wire of an IGBT module. The device further comprises a detection mechanism and an analysis module, the detection mechanism is installed on the transmission mechanism, and the analysis module is installed in the detection mechanism. The transmission mechanism conveys the IGBT module, and the detection mechanism cooperates with the analysis module to detect the IGBT module. The IGBT modules are conveyed to the detection mechanism through the transmission mechanism, the IGBT modules are detected through cooperation of the detection mechanism and the analysis module, whether bonding wires of the IGBT modules are stripped or not is judged, and then the IGBT modules with the bonding wires stripped and the IGBT modules without the bonding wires stripped are separately sent out through the transmission mechanism, so that the practicability of the equipment is improved.

Description

Technical Field

[0001] This invention relates to the technical field of IGBT module testing, and in particular to a method and apparatus for estimating bond wire stripping in IGBT modules. Background Technology

[0002] IGBT modules are widely used in high-power power conversion applications such as new energy power generation, electric vehicles, and industrial frequency converters. Internally, multiple aluminum or copper wires are typically used to bond the chip electrodes to external terminals to carry the main current. After prolonged exposure to power cycling, mechanical vibration, and thermal stress, the bond wire interfaces are prone to lift-off or breakage, leading to increased module on-resistance, localized overheating, and ultimately system failure. Therefore, early and accurate detection of the bond wire condition is a key technology for achieving predictive maintenance of power modules and improving system reliability.

[0003] Currently, the detection methods for bond wire degradation generally involve disassembling the IGBT module for inspection, which is time-consuming, labor-intensive, and can easily affect the sealing effect of the IGBT module. Other methods, such as the X-ray scanner disclosed in invention patent CN102422178B and the fiber optic eddy current ultrasonic composite non-destructive testing instrument and method disclosed in invention patent CN118604117B, detect whether the bond wires in the IGBT module have peeled off. However, this method requires sending the IGBT module to a specialized laboratory, which is cumbersome and costly, resulting in poor practicality. Therefore, there is an urgent need for a method and device for estimating bond wire peeling in IGBT modules to improve upon these problems. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a method and apparatus for estimating IGBT module bond wire stripping by using a transmission mechanism to transport IGBT modules to a testing mechanism, where the testing mechanism, in conjunction with an analysis module, tests the IGBT modules to determine if they have bond wire stripping. The transmission mechanism then separates IGBT modules with and without bond wire stripping, thereby improving the practicality of the equipment.

[0005] The apparatus for estimating the stripping of bond wires in an IGBT module according to the present invention includes a transmission mechanism; it also includes a detection mechanism and an analysis module, wherein the detection mechanism is mounted on the transmission mechanism and the analysis module is mounted in the detection mechanism; The transmission mechanism delivers the IGBT module, and the detection mechanism, in conjunction with the analysis module, detects the IGBT module. The IGBT modules are transported to the testing mechanism via a transmission mechanism. The testing mechanism, in conjunction with the analysis module, tests the IGBT modules to determine if there is any bond wire stripping. The transmission mechanism then separates the IGBT modules with bond wire stripping from those without, thereby improving the practicality of the equipment.

[0006] Preferably, the detection mechanism includes a sorting mechanism, an adapter, a plug, and a pressure sensor. The sorting mechanism is mounted on the transmission mechanism. The bottom of the adapter has a reserved slot with a terminal interface. The plug and pressure sensor are both mounted on the bottom of the adapter, with the pressure sensor located in the reserved slot. The adapter is snapped onto the sorting mechanism. The adapter is snapped onto the sorting mechanism, and the plug is inserted into the sorting mechanism. Then, the transmission mechanism pushes the IGBT module into the reserved slot, causing the IGBT module to press the pressure sensor into the adapter. The sorting mechanism then snaps the IGBT module into the reserved slot, and the terminals on the IGBT module are inserted into the terminal interfaces in the reserved slot. Simultaneously, the sorting mechanism, in conjunction with the adapter and the analysis module, detects the IGBT module. After detection, the sorting mechanism adjusts the position of the IGBT module, and then releases the IGBT module, causing it to fall onto the transmission mechanism.

[0007] Preferably, the sorting mechanism includes a locking mechanism, a housing, a rotating shaft, a support platform, a gear ring, a drive motor, a gear, and a socket. The housing is mounted on the transmission mechanism, the support platform is rotatably mounted on the housing via the rotating shaft, the gear ring is mounted on the bottom of the rotating shaft, the drive motor is fixedly mounted in the housing, the gear is mounted on the output shaft of the drive motor, and the gear and the gear ring are meshed. A limit groove is provided on the support platform, and circuit and signal lines are provided in the support platform. The socket is installed in the limit groove, and the locking mechanism is installed at the bottom of the support platform. The adapter is placed into the support platform. The adapter is inserted into the slot on the card and the plug is inserted into the socket. Then the circuit and signal line on the adapter and the support are connected. The adapter is then locked by the locking mechanism. After the IGBT module is inserted into the reserved slot at the bottom of the adapter, the IGBT module is limited by the locking mechanism. After the IGBT module is tested, the drive motor is turned on. Through the meshing of the gear and the gear ring, the support is driven to rotate, the position of the IGBT module is adjusted, and then the locking mechanism is used to release the IGBT module, so that the IGBT module falls onto the transmission mechanism.

[0008] Preferably, the locking mechanism includes a first locking mechanism and a second locking mechanism, and the adapter is provided with a groove; The locking mechanism includes a slide rail, an electric slider, and a limit bracket. The slide rail is installed on the bottom of the support platform, the electric slider is slidably installed on the slide rail, and the limit bracket is installed on the electric slider. The second locking mechanism includes a locking plate, a knob, and a support cylinder. The locking plate is rotatably mounted on the top of the support platform. The knob and the support cylinder are both mounted on the locking plate. The bottom of the support cylinder is equipped with a ball bearing, and a spring is installed inside the support cylinder. After the adapter is placed in the slot of the support platform, the locking plate is rotated to align the support cylinder with the groove on the adapter. The elasticity of the spring inside the support cylinder causes the ball bearing to engage in the groove of the adapter, thus limiting the adapter. After the IGBT module presses the pressure sensor into the adapter, the electric slider slides on the slide rail, causing the limit frame to lock the IGBT module.

[0009] Preferably, the transmission mechanism includes a worktable, an electric push rod, a lifting platform, two sets of conveyor belts, and two sets of drive motors. The electric push rod and the two sets of conveyor belts are all mounted on the worktable, the lifting platform is mounted on the electric push rod, and the two sets of drive motors are respectively mounted on the two sets of conveyor belts, providing power to the two sets of conveyor belts. By rotating the support platform, the adapter seat is moved above the lifting platform, and the IGBT module is placed on the lifting platform. By extending the electric push rod, the IGBT module is inserted into the reserved slot of the adapter seat. Then, by moving the electric slider, the limit frame clamps the IGBT module. After the IGBT module is inspected, it is determined whether the IGBT module has bond wire peeling. Then, by rotating the support platform and moving the electric slider, the IGBT module with bond wire peeling is placed on one set of conveyor belts and sent out by the operation of this set of conveyor belts. The IGBT module without bond wire peeling is placed on the other set of conveyor belts and sent out by the operation of the other set of conveyor belts.

[0010] Preferably, the analysis module includes: Signal injection module: generates a frequency-adjustable and amplitude-stable AC current signal and transmits the AC current signal to the IGBT module; Voltage acquisition module: Acquires collector-emitter voltage data of IGBT module and generates amplitude-frequency response curve to provide accurate data for data processing module; Data processing module: Extracts the resonant frequency corresponding to the first parallel resonant peak from the amplitude-frequency response curve, compares the extracted resonant frequency with the pre-calibrated initial resonant frequency, and calculates the equivalent inductance increment of the bond line based on the upward shift of the extracted resonant frequency relative to the pre-calibrated initial resonant frequency. Output module: Transmits signals to the sorting and conveying mechanisms, and displays the data parameters and test results during the detection process to the staff.

[0011] Preferably, the signal injection module includes: Direct digital frequency synthesizer: As a fully digital programmable signal source, it generates sinusoidal voltage signals with precise controllable frequency and phase; Operational amplifier: It forms a voltage-controlled current source, converting the low-power voltage signal output from the direct digital frequency synthesizer into an AC current signal with constant amplitude; Transformer: It achieves electrical isolation and signal coupling, blocks the high voltage of the DC bus, and transmits only the AC current excitation signal.

[0012] Preferably, the voltage acquisition module includes: High-precision differential amplifier: for measuring the collector-emitter voltage of IGBTs; Anti-aliasing filter: Filters the signal before analog-to-digital conversion; Analog-to-digital converter: Converts analog voltage signals into digital signals.

[0013] Preferably, the data processing module includes: Microcontroller: It obtains the pre-calibrated initial resonant frequency from the memory, compares the pre-calibrated initial resonant frequency with the obtained resonant frequency, and analyzes and determines whether there is any bond wire peeling in the IGBT module; Memory: Stores the overall operating data of the analysis module and the analysis results of the microcontroller.

[0014] The method for estimating bond wire stripping in an IGBT module according to the present invention includes the following steps: S1. Inject a variable frequency AC current signal between the DC positive terminal and the DC negative terminal of the IGBT module. The frequency scanning range of the AC current signal covers 50kHz to 2MHz. S2. During the scanning process, the amplitude-frequency response curve of the collector-emitter voltage of the IGBT module is acquired synchronously. S3. Extract the resonant frequency fp corresponding to the first parallel resonant peak from the amplitude-frequency response curve; S4. Compare the measured fp with the pre-calibrated initial resonant frequency fp0, and calculate the equivalent inductance increment of the bond wire based on the upward shift of fp relative to fp0. S5. When the upward displacement exceeds a predetermined threshold, it is determined that at least one bond wire has been peeled off, and a corresponding degradation indication signal is output.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. By monitoring the relative drift of the resonant frequency rather than the absolute voltage amplitude, the influence of junction temperature changes and DC bus voltage fluctuations on the detection results is fundamentally eliminated. This enables highly robust bond wire state estimation even under complex actual operating conditions. 2. It can determine whether there is bond wire stripping in the IGBT module without disassembling the IGBT module; 3. The overall structure is simple, and it enables the delivery of IGBT modules during and after the testing process, improving the convenience of testing. Attached Figure Description

[0016] Figure 1 This is a first isometric structural schematic diagram of the device for estimating the bond wire stripping of IGBT modules according to the present invention; Figure 2 This is the present invention. Figure 1 A magnified structural diagram of part A in the diagram; Figure 3 This is a second isometric structural schematic diagram of the device for estimating the bond wire stripping of IGBT modules according to the present invention; Figure 4 This is a front view schematic diagram of the device for estimating the bonding wire stripping of IGBT modules according to the present invention; Figure 5 This is a front view cross-sectional structural diagram of the sorting mechanism of the present invention; Figure 6 This is a schematic diagram of the first isometric structure of the adapter of the present invention; Figure 7 This is a schematic diagram of the second isometric structure of the adapter of the present invention; Figure 8 This is a schematic diagram of the analysis module of the present invention.

[0017] The following are labels in the attached diagram: 1. Adapter; 2. Plug; 3. Pressure sensor; 4. Reserved slot; 5. Housing; 6. Rotating shaft; 7. Support platform; 8. Gear ring; 9. Drive motor one; 10. Gear; 11. Socket; 12. Slide rail; 13. Electric slider; 14. Limit frame; 15. Locking plate; 16. Knob; 17. Support cylinder; 18. Workbench; 19. Electric push rod; 20. Lifting platform; 21. Conveyor belt; 22. Drive motor two. Detailed Implementation

[0018] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0019] Example: Figures 1 to 8 As shown, the device for estimating the stripping of bond wires in an IGBT module includes a transmission mechanism; it also includes a detection mechanism and an analysis module, with the detection mechanism mounted on the transmission mechanism and the analysis module mounted in the detection mechanism. The transmission mechanism delivers the IGBT module, and the detection mechanism, in conjunction with the analysis module, detects the IGBT module. The detection mechanism includes a sorting mechanism, an adapter 1, a plug 2, and a pressure sensor 3. The sorting mechanism is mounted on the transmission mechanism. The bottom of the adapter 1 is provided with a reserved slot 4, and a terminal interface is provided in the reserved slot 4. The plug 2 and the pressure sensor 3 are both mounted on the bottom of the adapter 1, and the pressure sensor 3 is located in the reserved slot 4. The adapter 1 is snapped onto the sorting mechanism. The sorting mechanism includes a locking mechanism, a housing 5, a rotating shaft 6, a support platform 7, a gear ring 8, a drive motor 9, a gear 10, and an insertion hole 11. The housing 5 is mounted on the transmission mechanism. The support platform 7 is rotatably mounted on the housing 5 via the rotating shaft 6. The gear ring 8 is mounted on the bottom of the rotating shaft 6. The drive motor 9 is fixedly mounted in the housing 5. The gear 10 is mounted on the output shaft of the drive motor 9, and the gear 10 and the gear ring 8 are meshed. The support platform 7 is provided with a limit groove. The support platform 7 is provided with circuit and signal lines. The insertion hole 11 is installed in the limit groove. The locking mechanism is installed at the bottom of the support platform 7. The locking mechanism includes a locking mechanism one and a locking mechanism two, and the adapter 1 is provided with a groove; The locking mechanism includes a slide rail 12, an electric slider 13, and a limit frame 14. The slide rail 12 is installed on the bottom of the support platform 7, the electric slider 13 is slidably installed on the slide rail 12, and the limit frame 14 is installed on the electric slider 13. The second locking mechanism includes a locking plate 15, a knob 16, and a support cylinder 17. The locking plate 15 is rotatably mounted on the top of the support platform 7. The knob 16 and the support cylinder 17 are both mounted on the locking plate 15. The bottom of the support cylinder 17 is provided with a ball bearing, and the inside of the support cylinder 17 is provided with a spring. The transmission mechanism includes a workbench 18, an electric push rod 19, a lifting platform 20, two sets of conveyor belts 21, and two sets of drive motors 22. The electric push rod 19 and the two sets of conveyor belts 21 are both mounted on the workbench 18, the lifting platform 20 is mounted on the electric push rod 19, and the two sets of drive motors 22 are respectively mounted on the two sets of conveyor belts 21, and the two sets of drive motors 22 provide power to the two sets of conveyor belts 21 respectively. The analysis module includes: Signal injection module: generates a frequency-adjustable and amplitude-stable AC current signal and transmits the AC current signal to the IGBT module; Voltage acquisition module: Acquires collector-emitter voltage data of IGBT module and generates amplitude-frequency response curve to provide accurate data for data processing module; Data processing module: Extracts the resonant frequency corresponding to the first parallel resonant peak from the amplitude-frequency response curve, compares the extracted resonant frequency with the pre-calibrated initial resonant frequency, and calculates the equivalent inductance increment of the bond line based on the upward shift of the extracted resonant frequency relative to the pre-calibrated initial resonant frequency. Output module: Transmits signals to the sorting and conveying mechanisms, and displays the data parameters and test results during the detection process to the staff; The signal injection module includes: Direct digital frequency synthesizer: As a fully digital programmable signal source, it generates sinusoidal voltage signals with precise controllable frequency and phase; Operational amplifier: It forms a voltage-controlled current source, converting the low-power voltage signal output from the direct digital frequency synthesizer into an AC current signal with constant amplitude; Transformer: It achieves electrical isolation and signal coupling, blocks the high voltage of the DC bus, and transmits only the AC current excitation signal; The voltage acquisition module includes: High-precision differential amplifier: for measuring the collector-emitter voltage of IGBTs; Anti-aliasing filter: Filters the signal before analog-to-digital conversion; Analog-to-digital converter: converts analog voltage signals into digital signals; The data processing module includes: Microcontroller: It obtains the pre-calibrated initial resonant frequency from the memory, compares the pre-calibrated initial resonant frequency with the obtained resonant frequency, and analyzes and determines whether there is any bond wire peeling in the IGBT module; Memory: Stores the overall operating data of the analysis module and the analysis results of the microcontroller; Place the adapter 1 into the slot on the support platform 7 and insert the plug 2 into the socket 11. This connects the adapter 1 to the circuit and signal lines on the support platform 7, facilitating signal transmission detection. Rotate the locking plate 15 to align the support cylinder 17 with the groove on the adapter 1. The elasticity of the spring inside the support cylinder 17 causes the ball bearings to engage in the groove of the adapter 1, limiting the position of the adapter 1. Then, turn on the drive motor 9, which rotates through the meshing of the gear 10 and the gear ring 8, causing the support platform 7 to rotate and connect the adapter. The IGBT module is placed on the lifting platform 20 and moved above the base 1. The electric push rod 19 extends, inserting the IGBT module into the pre-drilled slot 4 of the adapter base 1. After the IGBT module presses the pressure sensor 3 into the adapter base 1, the electric slider 13 slides on the slide rail 12, causing the limit frame 14 to lock the IGBT module in place. Then, a frequency-adjustable, amplitude-stable AC current signal is generated by the signal injection module and transmitted to the IGBT module. The voltage is then measured... The collection module acquires collector-emitter voltage data of the IGBT module and generates an amplitude-frequency response curve, providing accurate data for the data processing module. The data processing module then extracts the resonant frequency corresponding to the first parallel resonant peak from the amplitude-frequency response curve and compares the extracted resonant frequency with a pre-calibrated initial resonant frequency. Based on the upward shift of the extracted resonant frequency relative to the pre-calibrated initial resonant frequency, the equivalent inductance increment of the bond wire is calculated. The output module then transmits the signal to the sorting and transmission mechanisms. Simultaneously, the data parameters and test results during the testing process are displayed to the operators. After testing, the support platform 7 rotates again, and the electric slider 13 moves to place IGBT modules with bond wire stripping onto a set of conveyor belts 21. These conveyor belts then transport the modules out. IGBT modules without bond wire stripping are placed on another set of conveyor belts 21 and transported out, thus improving the practicality of the equipment.

[0020] The method for estimating bond wire stripping in IGBT modules includes the following steps: S1. Inject a variable frequency AC current signal between the DC positive terminal and the DC negative terminal of the IGBT module. The frequency scanning range of the AC current signal covers 50kHz to 2MHz. S2. During the scanning process, the amplitude-frequency response curve of the collector-emitter voltage of the IGBT module is acquired synchronously. S3. Extract the resonant frequency fp corresponding to the first parallel resonant peak from the amplitude-frequency response curve; S4. Compare the measured fp with the pre-calibrated initial resonant frequency fp0, and calculate the equivalent inductance increment of the bond wire based on the upward shift of fp relative to fp0. S5. When the upward displacement exceeds a predetermined threshold, it is determined that at least one bond wire has been peeled off, and a corresponding degradation indication signal is output.

[0021] The method and apparatus for estimating IGBT module bond wire stripping of the present invention can be implemented using common mechanical methods in terms of installation, connection, or setting. Any method that achieves the desired beneficial effect can be used. The adapter 1 can be replaced with different types depending on the IGBT model. The pressure sensor 3, drive motor 9, electric slider 13, electric push rod 19, conveyor belt 21, and drive motor 22 of the method and apparatus for estimating IGBT module bond wire stripping of the present invention are commercially available. Those skilled in the art only need to install and operate them according to the accompanying instruction manual, without requiring any creative effort from those skilled in the art.

[0022] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An apparatus for estimating the stripping of bond wires in an IGBT module, comprising a transmission mechanism; characterized in that, It also includes a testing mechanism and an analysis module. The testing mechanism is installed on the transmission mechanism, and the analysis module is installed in the testing mechanism. The transmission mechanism delivers the IGBT module, and the detection mechanism, in conjunction with the analysis module, detects the IGBT module.

2. The apparatus for estimating the bond wire stripping of an IGBT module as described in claim 1, characterized in that, The detection mechanism includes a sorting mechanism, an adapter (1), a plug (2), and a pressure sensor (3). The sorting mechanism is installed on the transmission mechanism. The bottom of the adapter (1) is provided with a reserved slot (4). A terminal interface is provided in the reserved slot (4). The plug (2) and the pressure sensor (3) are both installed on the bottom of the adapter (1), and the pressure sensor (3) is located in the reserved slot (4). The adapter (1) is snapped onto the sorting mechanism.

3. The apparatus for estimating the bond wire stripping of an IGBT module as described in claim 2, characterized in that, The sorting mechanism includes a locking mechanism, a housing (5), a rotating shaft (6), a support platform (7), a gear ring (8), a drive motor (9), a gear (10), and a socket (11). The housing (5) is mounted on the transmission mechanism. The support platform (7) is rotatably mounted on the housing (5) via the rotating shaft (6). The gear ring (8) is mounted on the bottom of the rotating shaft (6). The drive motor (9) is fixedly mounted in the housing (5). The gear (10) is mounted on the output shaft of the drive motor (9), and the gear (10) and the gear ring (8) are meshed. The support platform (7) is provided with a limit groove. The support platform (7) is provided with circuits and signal lines. The socket (11) is installed in the limit groove. The locking mechanism is installed at the bottom of the support platform (7).

4. The apparatus for estimating the stripping of bond wires in an IGBT module as described in claim 3, characterized in that, The locking mechanism includes a locking mechanism one and a locking mechanism two, and the adapter (1) is provided with a groove; The locking mechanism includes a slide rail (12), an electric slider (13), and a limit frame (14). The slide rail (12) is installed on the bottom of the support platform (7), the electric slider (13) is slidably installed on the slide rail (12), and the limit frame (14) is installed on the electric slider (13). The second locking mechanism includes a locking plate (15), a knob (16) and a support cylinder (17). The locking plate (15) is rotatably mounted on the top of the support platform (7). The knob (16) and the support cylinder (17) are both mounted on the locking plate (15). The bottom of the support cylinder (17) is provided with a ball bearing, and the inside of the support cylinder (17) is provided with a spring.

5. The apparatus for estimating the bond wire stripping of an IGBT module as described in claim 1, characterized in that, The transmission mechanism includes a workbench (18), an electric push rod (19), a lifting platform (20), two sets of conveyor belts (21) and two sets of drive motors (22). The electric push rod (19) and the two sets of conveyor belts (21) are both installed on the workbench (18), the lifting platform (20) is installed on the electric push rod (19), and the two sets of drive motors (22) are respectively installed on the two sets of conveyor belts (21), and the two sets of drive motors (22) provide power to the two sets of conveyor belts (21) respectively.

6. The apparatus for estimating the bond wire stripping of an IGBT module as described in claim 1, characterized in that, The analysis module includes: Signal injection module: generates a frequency-adjustable and amplitude-stable AC current signal and transmits the AC current signal to the IGBT module; Voltage acquisition module: Acquires collector-emitter voltage data of IGBT module and generates amplitude-frequency response curve to provide accurate data for data processing module; Data processing module: Extracts the resonant frequency corresponding to the first parallel resonant peak from the amplitude-frequency response curve, compares the extracted resonant frequency with the pre-calibrated initial resonant frequency, and calculates the equivalent inductance increment of the bond line based on the upward shift of the extracted resonant frequency relative to the pre-calibrated initial resonant frequency. Output module: Transmits signals to the sorting and conveying mechanisms, and displays the data parameters and test results during the detection process to the staff.

7. The apparatus for estimating the bond wire stripping of an IGBT module as described in claim 6, characterized in that, The signal injection module includes: Direct digital frequency synthesizer: As a fully digital programmable signal source, it generates sinusoidal voltage signals with precise controllable frequency and phase; Operational amplifier: It forms a voltage-controlled current source, converting the low-power voltage signal output from the direct digital frequency synthesizer into an AC current signal with constant amplitude; Transformer: It achieves electrical isolation and signal coupling, blocks the high voltage of the DC bus, and transmits only the AC current excitation signal.

8. The apparatus for estimating the bond wire stripping of an IGBT module as described in claim 6, characterized in that, The voltage acquisition module includes: High-precision differential amplifier: for measuring the collector-emitter voltage of IGBTs; Anti-aliasing filter: Filters the signal before analog-to-digital conversion; Analog-to-digital converter: Converts analog voltage signals into digital signals.

9. The apparatus for estimating the bond wire stripping of an IGBT module as described in claim 6, characterized in that, The data processing module includes: Microcontroller: It obtains the pre-calibrated initial resonant frequency from the memory, compares the pre-calibrated initial resonant frequency with the obtained resonant frequency, and analyzes and determines whether there is any bond wire peeling in the IGBT module; Memory: Stores the overall operating data of the analysis module and the analysis results of the microcontroller.

10. A method for estimating bond wire stripping in an IGBT module, characterized in that, The method for detecting bond wire stripping of an IGBT module using the apparatus for estimating IGBT module bond wire stripping according to any one of claims 1 to 9 includes the following steps: S1. Inject a variable frequency AC current signal between the DC positive terminal and the DC negative terminal of the IGBT module. The frequency scanning range of the AC current signal covers 50kHz to 2MHz. S2. During the scanning process, the amplitude-frequency response curve of the collector-emitter voltage of the IGBT module is acquired synchronously. S3. Extract the resonant frequency fp corresponding to the first parallel resonant peak from the amplitude-frequency response curve; S4. Compare the measured fp with the pre-calibrated initial resonant frequency fp0, and calculate the equivalent inductance increment of the bond wire based on the upward shift of fp relative to fp0. S5. When the upward displacement exceeds a predetermined threshold, it is determined that at least one bond wire has been peeled off, and a corresponding degradation indication signal is output.

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