Liquid cooling heat dissipation device and electronic equipment

Abstract

The embodiment of the invention provides a liquid cooling heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation. The liquid cooling heat dissipation device comprises a first cold plate assembly, at least one locking assembly and at least one second cold plate assembly. The first cold plate assembly is used for making contact with the lower surface of a part to be cooled. The second cold plate assemblies are rotationally connected with the first cold plate assembly, the second cold plate assemblies correspond to the locking assemblies in a one-to-one mode, and the second cold plate assemblies rotate so as to be switched between a closed state in which the second cold plate assemblies make contact with the upper surface of the to-be-cooled part and an open state in which the second cold plate assemblies are away from the upper surface of the to-be-cooled part. And in the closed state, the locking assemblies lock the corresponding second cold plate assemblies and the first cold plate assemblies. And in the opening state, the locking assembly unlocks the corresponding second cold plate assembly and the first cold plate assembly. According to the liquid cooling heat dissipation device, the heat exchange capacity of the used cooling liquid is higher than that of air, heat generated by the to-be-cooled part can be rapidly absorbed and taken away, and the heat dissipation effect of the to-be-cooled part is good.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a liquid cooling heat dissipation device and electronic equipment. Background Technology

[0002] As the demands for data throughput and storage density in high-performance computing scenarios such as servers and data centers continue to increase, solid-state drives (SSDs) are widely used due to their compact size and excellent read / write performance. However, during high-speed read / write operations, the controller chip and flash memory chips of SSDs generate a significant amount of heat. If this heat cannot be dissipated in time, the SSD temperature will become too high, triggering overheat protection mechanisms, leading to a decrease in drive performance, and in severe cases, even affecting data security and hardware lifespan.

[0003] In related technologies, air cooling is the primary method for heat dissipation of solid-state drives (SSDs) due to its relatively low cooling cost. Air cooling typically involves adding metal heat sinks to the surface of the SSD to increase the heat dissipation area, and then using the flow of external air to carry away the heat accumulated on the metal heat sinks.

[0004] However, air has poor heat exchange capacity, resulting in poor heat dissipation performance of solid-state drives. Summary of the Invention

[0005] This application provides a liquid cooling heat dissipation device and electronic device, which utilizes the heat exchange capacity of the coolant which is higher than that of air, and can quickly absorb and remove the heat generated by the component to be cooled, so that the heat dissipation effect of the component to be cooled is better.

[0006] In a first aspect, embodiments of this application provide a liquid cooling heat dissipation device, including a first cold plate assembly, at least one locking assembly, and at least one second cold plate assembly. The first cold plate assembly is used to contact the lower surface of a component to be cooled. The second cold plate assembly is rotatably connected to the first cold plate assembly, and each second cold plate assembly corresponds to one locking assembly. The second cold plate assembly rotates to switch between a closed state in contact with the upper surface of the component to be cooled and an open state away from the upper surface of the component to be cooled. In the closed state, the locking assembly locks the corresponding second cold plate assembly and the first cold plate assembly. In the open state, the locking assembly unlocks the corresponding second cold plate assembly and the first cold plate assembly.

[0007] In some possible implementations, the first cold plate assembly has at least one fixing hole. The locking assembly includes at least one slider and at least one slide rod. The slider is slidably connected to the second cold plate assembly, and the slide rod, slider, and fixing hole correspond one-to-one, with the slide rod connected to the corresponding slider. The slider slides relative to the second cold plate assembly to cause the corresponding slide rod to disengage from or insert into the corresponding fixing hole, thereby unlocking or locking the second cold plate assembly.

[0008] In some possible implementations, the slider has a groove, the extension direction of which forms an angle with the sliding direction of the slider.

[0009] The slide bar includes a sliding section and a locking section connected to each other. The sliding section is inserted into the slide groove and can slide along the slide groove. The extension direction of the fixing hole is at an angle to the extension direction of the slide groove, and the extension direction of the fixing hole is at an angle to the sliding direction of the slider.

[0010] The slider slides to drive the sliding section to slide, and causes the locking section to disengage from or insert into the fixing hole.

[0011] In some possible implementations, the slider slides from the outside in, causing the sliding section to move in a direction away from the fixing hole, and causing the locking section to disengage from the fixing hole.

[0012] In some possible implementations, the locking assembly further includes a reset member that connects the slider to the second cold plate assembly. In the open state, the reset member is compressed. In the closed state, the reset member extends to apply a preload to the slider, thereby keeping the locking assembly locked between the second cold plate assembly and the first cold plate assembly.

[0013] In some possible implementations, the locking component includes at least one detachable connector. The first cold plate assembly has at least one first connection hole, and the second cold plate assembly has at least one second connection hole. The detachable connector is sequentially inserted into the second connection hole and the first connection hole to detachably connect the first cold plate assembly and the second cold plate assembly.

[0014] In some possible implementations, the liquid cooling heat dissipation device further includes at least two rotary joints, which are rotatably connected to and communicate with the first cold plate assembly. A second cold plate assembly corresponds to at least two rotary joints, which are connected to and communicate with their respective second cold plate assemblies.

[0015] In some possible implementations, the liquid cooling device also includes a thermal pad disposed between at least one of the first cold plate assembly and the second cold plate assembly and the component to be cooled.

[0016] In some possible implementations, there are two second cold plate assemblies, which are spaced apart and rotate in opposite directions.

[0017] Secondly, embodiments of this application provide an electronic device, including any of the liquid cooling heat dissipation devices provided in the first aspect and at least one heat-dissipating component connected to the liquid cooling heat dissipation device.

[0018] The liquid cooling heat dissipation device and electronic device provided in this application embodiment contact the lower surface of the component to be cooled via a first cold plate assembly, and the second cold plate assembly contacts the upper surface of the component when closed, allowing both the upper and lower surfaces of the component to exchange heat with the cold plates. Because the coolant flowing inside the cold plates has a high specific heat capacity and good fluidity, its heat exchange capacity is higher than that of air. It can quickly absorb the heat generated by the component and remove it through the circulation of the coolant, thereby improving the heat dissipation efficiency of the component. Compared to traditional air cooling, liquid cooling can remove more heat in the same amount of time, effectively reducing the operating temperature of the component, preventing performance degradation and triggering of overheat protection mechanisms due to overheating, and thus ensuring the continuous high-performance operation of the component.

[0019] Furthermore, since the first cold plate assembly and the second cold plate assembly are in contact with the upper and lower surfaces of the component to be scald, respectively, double-sided heat dissipation of the component to be scald is achieved. Compared with the solution of setting cold plates on only one side, double-sided heat dissipation increases the heat dissipation area, thereby improving the heat dissipation efficiency.

[0020] Furthermore, when it is necessary to replace or maintain the heat sink component, the locking mechanism unlocks the second cold plate assembly from the first cold plate assembly, allowing the second cold plate assembly to rotate into the open position. At this point, the second cold plate assembly is positioned away from the upper surface of the heat sink component, providing ample operating space for its placement and removal. Operators can quickly remove or install the heat sink component with simple unlocking and rotation operations, simplifying the disassembly and assembly process, shortening disassembly and assembly time, and improving efficiency. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0023] Figure 2 Another structural schematic diagram of the electronic device provided in the embodiments of this application;

[0024] Figure 3 A schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of this application;

[0025] Figure 4 This is another schematic diagram of the liquid cooling heat dissipation device provided in the embodiments of this application;

[0026] Figure 5 An exploded view of another structure of the liquid cooling heat dissipation device provided in the embodiments of this application;

[0027] Figure 6 This is another schematic diagram of the liquid cooling heat dissipation device provided in the embodiments of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10. Liquid cooling heat dissipation device; 20. Component to be cooled; 30. Circuit board;

[0030] 100, First cold plate assembly; 110, First cold plate; 120, Liquid inlet pipe; 130, Liquid outlet pipe; 140, Fixing hole; 150, First protrusion; 160, Guide surface; 170, First connecting hole;

[0031] 200, Locking assembly; 210, Slider; 211, Slide groove; 212, Clearance opening; 220, Slide rod; 221, Sliding section; 222, Locking section; 223, Slot; 230, Reset component; 240, First fixing post; 250, Detachable connector;

[0032] 300, Second cold plate assembly; 310, Second cold plate; 320, Second protrusion; 330, Limiting component; 331, First limiting segment; 332, Second limiting segment; 340, Support component; 341, Support hole; 350, Second fixing post; 360, Second connecting hole;

[0033] 400. Rotary joint;

[0034] 500. Thermal pad.

[0035] To facilitate understanding of the embodiments of this application, the spline curves and arrows used in the reference numerals in the accompanying drawings are explained below: the components indicated by spline curves without arrows can be solid components, that is, components with solid structures; the components indicated by spline curves with arrows can be virtual components, that is, components without solid structures; in some cases, the components indicated by spline curves with arrows can also be assemblies with solid structures or virtual structures.

[0036] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the description of the embodiments of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships (if present), are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Where there is no conflict, embodiments of this application and the various features thereof can be combined with each other, all of which are within the scope of protection of this application.

[0039] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 2 This is another structural schematic diagram of the electronic device provided in the embodiments of this application.

[0040] The electronic devices provided in this application can be computing and data processing devices, communication and network devices, or consumer electronics and entertainment devices, etc. Specifically, the electronic devices can be computers, servers, communication base stations, optical communication equipment, routers, switches, mobile phones, etc.

[0041] like Figure 1 and Figure 2 As shown, this application embodiment provides an electronic device, including a liquid cooling heat dissipation device 10 and at least one heat-dissipating component 20 connected to the liquid cooling heat dissipation device 10. The liquid cooling heat dissipation device 10 can perform liquid cooling heat dissipation on the heat-dissipating component 20.

[0042] The heatsink 20 can be a central processing unit (CPU), a graphics processing unit (GPU), a hard drive, etc. For example, the heatsink 20 can be a solid-state drive (SSD), and the SSD interface can be a SATA interface, an M.2 interface, an NVMe interface, or a PCIe interface, etc.

[0043] In some embodiments, such as Figure 1 and Figure 2 As shown, the electronic device may further include a circuit board 30, which can be connected to the heat sink 20. The circuit board 30 is used to implement the electrical connection to the heat sink 20.

[0044] In some embodiments, the electronic device may further include a housing, and the liquid cooling heat dissipation device 10 and the heat-dissipating component 20 may be disposed within the housing. The housing may be used to accommodate and protect the liquid cooling heat dissipation device 10 and the heat-dissipating component 20.

[0045] Currently, with the increasing demands for data throughput and storage density in high-performance computing scenarios such as servers and data centers, solid-state drives (SSDs) are widely used due to their compact size and excellent read / write performance. However, during high-speed read / write operations, the controller chip and flash memory chips of SSDs generate a significant amount of heat. If this heat cannot be dissipated in time, it will cause the SSD temperature to become too high, triggering the overheat protection mechanism, leading to a decrease in drive performance, and in severe cases, even affecting data security and hardware lifespan.

[0046] In related technologies, air cooling is the primary method for heat dissipation of solid-state drives (SSDs) due to its relatively low cooling cost. Air cooling typically involves adding metal heat sinks to the surface of the SSD to increase the heat dissipation area, and then using the flow of external air to carry away the heat accumulated on the metal heat sinks.

[0047] However, air has poor heat exchange capacity, resulting in poor heat dissipation performance of solid-state drives.

[0048] However, air has poor heat exchange capacity. When solid-state drives (SSDs) are operating under high load, air cooling alone is insufficient to quickly transfer and dissipate heat, resulting in poor heat dissipation. Furthermore, traditional air cooling methods offer limited protection for SSDs. During transport or in environments subject to vibration, SSDs are prone to loosening or detachment, affecting system stability and reliability. In addition, existing cooling systems often require tools to remove the heatsink when replacing or maintaining an SSD, a cumbersome and time-consuming process that reduces maintenance efficiency.

[0049] Figure 3 This is a schematic diagram of a liquid cooling heat dissipation device 10 provided in an embodiment of this application. Figure 4 This is another structural schematic diagram of the liquid cooling heat dissipation device 10 provided in the embodiments of this application.

[0050] like Figure 3 and Figure 4 As shown in the figure, an embodiment of this application discloses a liquid cooling heat dissipation device 10, including a first cold plate assembly 100, at least one locking assembly 200, and at least one second cold plate assembly 300. The first cold plate assembly 100 is used to contact the lower surface of the component 20 to be cooled. The second cold plate assembly 300 is rotatably connected to the first cold plate assembly 100, and the second cold plate assembly 300 corresponds one-to-one with the locking assembly 200.

[0051] The second cold plate assembly 300 rotates to switch between a closed state in contact with the upper surface of the heat-dissipating component 20 and an open state away from the upper surface of the heat-dissipating component 20. For example... Figure 4 As shown, in the closed state, the locking component 200 locks the corresponding second cold plate assembly 300 and the first cold plate assembly 100. Figure 3 As shown, in the open state, locking component 200 unlocks the corresponding second cold plate component 300 and first cold plate component 100.

[0052] The liquid cooling heat dissipation device 10 provided in this application embodiment contacts the lower surface of the component to be cooled 20 via a first cold plate assembly 100, and the second cold plate assembly 300 contacts the upper surface of the component to be cooled 20 when closed, enabling heat exchange between both the upper and lower surfaces of the component to be cooled 20 and the cold plates. Because the coolant flowing inside the cold plates has a high specific heat capacity and good fluidity, its heat exchange capacity is higher than that of air, allowing it to quickly absorb the heat generated by the component to be cooled 20 and carry it away through the circulation of the coolant, thereby improving the heat dissipation efficiency of the component to be cooled 20. Compared to traditional air cooling, liquid cooling can remove more heat in the same amount of time, effectively reducing the operating temperature of the component to be cooled 20, preventing performance degradation and triggering of overheat protection mechanisms due to overheating, and thus ensuring the continuous high-performance operation of the component to be cooled 20.

[0053] In this case, since the first cold plate assembly 100 and the second cold plate assembly 300 are in contact with the upper and lower surfaces of the component to be scaldredged 20 respectively, double-sided heat dissipation of the component to be scaldredged 20 is achieved. Compared with the solution of setting cold plates on only one side, double-sided heat dissipation increases the heat dissipation area, thereby improving the heat dissipation efficiency.

[0054] Furthermore, the second cold plate assembly 300 is connected to the first cold plate assembly 100 via a rotatable connection, allowing the second cold plate assembly 300 to flexibly switch between a closed state and an open state. In the closed state, the second cold plate assembly 300 is in close contact with the upper surface of the component to be scald 20. At this time, the second cold plate assembly 300 and the first cold plate assembly 100 clamp the component to be scald 20 from both above and below. This clamping action not only achieves the heat dissipation function but also provides reliable mechanical fixation for the component to be scald 20. Since the second cold plate assembly 300 is locked to the first cold plate assembly 100 by the locking assembly 200 in the closed state, a stable clamping structure is formed. Even during the transportation of electronic equipment or in a vibrating working environment, the component to be scald 20 can be firmly fixed between the first cold plate assembly 100 and the second cold plate assembly 300, effectively preventing the component to be scald 20 from loosening or falling off due to vibration, thus improving the stability and reliability of the electronic equipment operation.

[0055] Meanwhile, when it is necessary to replace or maintain the heat sink component 20, the locking component 200 unlocks the second cold plate component 300 from the first cold plate component 100, allowing the second cold plate component 300 to rotate into the open state. At this point, the second cold plate component 300 is positioned away from the upper surface of the heat sink component 20, providing ample operating space for its removal and placement. Operators can quickly remove or install the heat sink component 20 with simple unlocking and rotation operations, simplifying the disassembly and assembly process, shortening the time, and improving efficiency.

[0056] Furthermore, the locking components 200 are configured in a one-to-one correspondence with the second cold plate components 300, ensuring that each second cold plate component 300 can independently perform locking and unlocking operations. When the liquid cooling heat dissipation device 10 includes multiple second cold plate components 300, each second cold plate component 300 can be operated separately according to actual needs without interfering with each other, improving the flexibility of the device's use. For example, when it is necessary to replace only one of the heat dissipation components 20, only the corresponding second cold plate component 300 needs to be unlocked, while the other second cold plate components 300 remain locked to continue dissipating heat and securing the other heat dissipation components 20, avoiding any adverse effects on the entire electronic device.

[0057] In some embodiments, the first cold plate assembly 100 and the second cold plate assembly 300 may be copper parts, aluminum parts, etc.

[0058] In some embodiments, the first cold plate assembly 100 may have a first cooling channel for supplying coolant flow. The shape of the first cooling channel may be straight, serpentine, or the like.

[0059] In some embodiments, the second cold plate assembly 300 may have a second cooling channel for supplying coolant flow. The shape of the second cooling channel may be straight, serpentine, or similar.

[0060] In some embodiments, the inner walls of both the first and second cooling channels may have needle-shaped or fin-shaped heat dissipation fins, which can further increase the heat dissipation area, enhance the turbulence effect, and thus improve the heat dissipation performance.

[0061] Figure 5 This is an exploded view of another structure of the liquid cooling heat dissipation device 10 provided in an embodiment of this application. In the figure, X is defined as the sliding direction of the slider 210, Y as the extending direction of the fixing hole 140, Z as the vertical direction, and M as the extending direction of the slide groove 211. In some embodiments, the extending direction of the slide groove 211 may be perpendicular to the vertical direction. In some embodiments, the sliding direction of the slider 210 may be parallel to the width direction of the liquid cooling heat dissipation device 10. In some embodiments, the direction in which the slide rod 220 is inserted into or pulled out of the fixing hole 140 may be parallel to the extending direction of the fixing hole 140. In some embodiments, the extending direction of the fixing hole 140 may be parallel to the length direction of the liquid cooling heat dissipation device 10. In some embodiments, the vertical direction may be parallel to the thickness direction of the liquid cooling heat dissipation device 10.

[0062] In some embodiments, such as Figure 5 As shown, the first cold plate assembly 100 may include a first cold plate 110, an inlet pipe 120, and an outlet pipe 130. Both the inlet pipe 120 and the outlet pipe 130 are connected to the first cold plate 110. A first cooling channel is located within the first cold plate 110, and both the inlet pipe 120 and the outlet pipe 130 can communicate with the first cooling channel. Thus, coolant can enter the first cooling channel through the inlet pipe 120 and flow out of the first cooling channel through the outlet pipe 130, thereby removing heat from the heat-dissipating component 20.

[0063] In some embodiments, the coolant may be a water-based coolant, an oil-based / hydrocarbon coolant, etc. Specifically, the coolant may be deionized water, an aqueous solution of ethylene glycol / propylene glycol, etc.

[0064] In some embodiments, the liquid cooling heat dissipation device 10 may further include a temperature sensor. The temperature sensor may be disposed on at least one of the first cold plate assembly 100, the second cold plate assembly 300, and the heat-dissipating component 20, and the temperature sensor may be used to detect temperature.

[0065] In some possible implementations, such as Figure 5As shown, the first cold plate assembly 100 has at least one fixing hole 140. The locking assembly 200 includes at least one slider 210 and at least one slide rod 220. The slider 210 is slidably connected to the second cold plate assembly 300. The slide rod 220, slider 210, and fixing hole 140 correspond one-to-one, and the slide rod 220 is connected to the corresponding slider 210. The slider 210 slides relative to the second cold plate assembly 300 to cause the corresponding slide rod 220 to disengage from or insert into the corresponding fixing hole 140, thereby unlocking or locking the second cold plate assembly 300.

[0066] Specifically, slider 210 is slidably connected to the second cold plate assembly 300, allowing slider 210 to slide relative to the second cold plate assembly 300. Sliding rod 220 is connected to slider 210; when slider 210 slides, sliding rod 220 moves accordingly. Disengaging sliding rod 220 from fixing hole 140 unlocks the second cold plate assembly 300 from the first cold plate assembly 100, while inserting sliding rod 220 into fixing hole 140 locks the second cold plate assembly 300 from the first cold plate assembly 100. The entire locking and unlocking process can be completed simply by pushing slider 210, making operation convenient and efficient.

[0067] The operator can directly push the slider 210 to slide by hand without the need for special tools such as screwdrivers and wrenches, which can quickly complete the disassembly and assembly of the heat dissipation component 20, shorten the disassembly and assembly time, and improve the disassembly and assembly efficiency.

[0068] In addition, the mating structure of slider 210, slider 220 and fixing hole 140 is simple and reliable, with low processing difficulty and low manufacturing cost, and is not prone to failure, which improves the reliability and service life of locking assembly 200.

[0069] In some embodiments, such as Figure 5 As shown, the first cold plate assembly 100 may further include at least one first protrusion 150, which is connected to the first cold plate 110 and extends upward in a vertical direction. Fixing holes 140 are correspondingly provided on the first protrusion 150. The protrusion can provide a larger connection area, which facilitates the connection between the first cold plate 110 and the slide rod 220.

[0070] In some examples, a portion of the first cooling channel is located within the first cold plate 110, and another portion is located within the first protrusion 150. Both the inlet pipe 120 and the outlet pipe 130 can be connected to the first protrusion 150, and both the inlet pipe 120 and the outlet pipe 130 can communicate with the first cooling channel located within the first protrusion 150.

[0071] In some examples, such as Figure 5As shown, the first protrusion 150 has a guide surface 160, which may or may not contact the second cold plate assembly 300. When the guide surface 160 contacts the second cold plate assembly 300, it can support the second cold plate assembly 300 during rotation. For example, the guide surface 160 can be an arc surface, such as a circular arc surface.

[0072] In some embodiments, the fixing hole 140 can be a through hole or a blind hole.

[0073] In some embodiments, the shape of the fixing hole 140 can be a regular shape such as a circle or a square, or it can be an irregular shape.

[0074] In some embodiments, the shape of the slide bar 220 can be a regular shape such as a circle or a square, or it can be an irregular shape.

[0075] In some possible implementations, such as Figure 2 As shown, the second cold plate assembly 300 may include a second cold plate 310 and at least one second protrusion 320. The second protrusion 320 is connected to the second cold plate 310 and extends upward in a vertical direction. A portion of the second cooling channel is located within the second cold plate 310, and another portion is located within the second protrusion 320. The second protrusion 320 can be rotatably connected to and communicate with the second cold plate assembly 300. For example, the second protrusion 320 can be rotatably connected to and communicate with the first protrusion 150.

[0076] In some possible implementations, such as Figure 5 As shown, the second cold plate assembly 300 may further include at least two limiting members 330, which are connected to the second cold plate 310. The slider 210 is configured to be located in the area enclosed by the limiting members 330 and the second cold plate 310. The limiting members 330 and the second cold plate 310 can jointly restrict the displacement of the slider 210 in the sliding direction perpendicular to the slider 210, thereby allowing the slider 210 to slide in a predetermined direction and preventing the sliding path from deviating.

[0077] In some embodiments, such as Figure 5 As shown, the limiting member 330 may include a first limiting segment 331 and a second limiting segment 332. The first limiting segment 331 is connected to the first cold plate 110, extends vertically upward, and is located to the side of the slider 210. The second limiting segment 332 is connected to the first limiting segment 331, extends horizontally, and is located to one side of the top surface of the slider 210. Thus, the limiting member 330 can limit the slider 210.

[0078] Alternatively, in some other possible implementations, the second cold plate 310 may have a guide groove, and the slider 210 may be located within the guide groove, sliding along the extension direction of the guide groove. The guide groove restricts the sliding direction of the slider 210, ensuring that the slider 210 moves along a predetermined trajectory and avoiding locking failure caused by slider 210 offset.

[0079] Alternatively, in some other possible implementations, the second cold plate assembly 300 may also include a slide rail disposed on the second cold plate 310, and the slider 210 may be slidably connected to the slide rail. For example, the slide rail may be a linear guide, a lead screw drive mechanism, etc.

[0080] In some possible implementations, anti-slip textures or rubber pads can be provided on the slider 210. Anti-slip textures or rubber pads can increase the friction between the finger and the slider 210, prevent the finger from slipping during operation, and improve the safety and controllability of operation.

[0081] In some possible implementations, such as Figure 5 As shown, the slider 210 has a groove 211, and the extending direction of the groove 211 is (e.g.) Figure 5 The direction of M in the middle) and the sliding direction of slider 210 (e.g.) Figure 5 The X direction in the figure has an angle.

[0082] like Figure 5 As shown, the slide bar 220 includes a sliding section 221 and a locking section 222 connected to each other. The sliding section 221 is inserted into the slide groove 211 and can slide along the slide groove 211. The extension direction of the fixing hole 140 (e.g.) Figure 5 The Y direction in the slide 211 forms an angle with the extension direction of the slide groove 211, and the extension direction of the fixing hole 140 forms an angle with the sliding direction of the slider 210.

[0083] The slider 210 slides to drive the sliding section 221 to slide, and drives the locking section 222 to disengage from or insert into the fixing hole 140.

[0084] In this embodiment, since the extension direction of the groove 211 is at an angle to the sliding direction of the slider 210, when the slider 210 moves along its sliding direction, the sliding segment 221 will generate a movement trajectory different from the sliding direction of the slider 210 under the constraint of the groove 211, so that the sliding segment 221 can drive the locking segment 222 to move along a specific direction.

[0085] Since the extension direction of the fixing hole 140 is at an angle to the sliding direction of the slider 210, and the extension direction of the fixing hole 140 is at an angle to the extension direction of the groove 211, the sliding section 221 will undergo a direction change when sliding in the groove 211. This direction change can transform the sliding motion of the slider 210 into the insertion or disengagement motion of the locking section 222 relative to the fixing hole 140, thus achieving a clever change in the direction of motion without requiring the sliding direction of the slider 210 to be completely aligned with the extension direction of the fixing hole 140. This provides greater design freedom for the arrangement of the slider 210, allowing the slider 210 to be placed in a position that is more convenient for operators to access. The placement positions of the slide rod 220 and the slider 210 can also be reasonably selected according to the requirements of integration and miniaturization.

[0086] In some embodiments, the angle between the extending direction of the groove 211 and the sliding direction of the slider 210 can be 15° to 75°, for example, 30°, 45° or 60°.

[0087] In some embodiments, the angle between the extending direction of the fixing hole 140 and the sliding direction of the slider 210 can be 30° to 90°, for example, 30°, 60° or 90°. When the angle is 90°, the extending direction of the fixing hole 140 is perpendicular to the sliding direction of the slider 210. At this time, the insertion or disengagement direction of the locking segment 222 is orthogonal to the sliding direction of the slider 210, which facilitates a compact structural layout.

[0088] In some embodiments, the angle between the extending direction of the fixing hole 140 and the extending direction of the slide groove 211 can be 15° to 75°, for example, 30°, 45° or 60°.

[0089] In some embodiments, the shape of the groove 211 can be a regular shape such as a square or a semi-circular key, or it can be an irregular shape.

[0090] In some embodiments, the sliding segment 221 and the locking segment 222 can be connected by an integral molding process.

[0091] Alternatively, in some embodiments, the sliding segment 221 and the locking segment 222 can be connected by means of threaded connection, welding, riveting, or snap-fit. For example, as... Figure 5 As shown, the locking segment 222 has a slot 223, and the sliding segment 221 can be inserted into the slot 223.

[0092] In some embodiments, the shape of the sliding segment 221 can be a regular cylindrical shape such as a cylinder or a square column, or it can be an irregular cylindrical shape or a non-cylindrical shape.

[0093] In some embodiments, the locking segment 222 can be a regular cylindrical shape such as a cylinder or a square column, or it can be an irregular cylindrical shape or a non-cylindrical shape.

[0094] In some possible implementations, such as Figure 5 As shown, the second cold plate assembly 300 may further include at least one support member 340, which is connected to the second cold plate 310, and the support member 340 is positioned vertically (e.g., Figure 5 Extending upwards in the Z direction, the support member 340 has a support hole 341, and the locking segment 222 is inserted into the support hole 341. The support hole 341 and the fixing hole 140 are concentrically arranged.

[0095] With this configuration, the support member 340 can support and guide the locking section 222 to ensure that it moves in a predetermined direction, making the insertion and removal of the locking section 222 smoother. Furthermore, since the locking section 222 is inserted into the support hole 341 and the sliding section 221 is inserted into the slide groove 211, both the support member 340 and the slider 210 can constrain the slide rod 220, and the constraining directions are different, making it less likely for the slide rod 220 to disengage from the slide groove 211.

[0096] In some possible implementations, the slider 210 slides from the outside to the inside, causing the sliding section 221 to move in a direction away from the fixing hole 140, and causing the locking section 222 to disengage from the fixing hole 140.

[0097] With this configuration, when the operator needs to unlock the second cold plate assembly 300, he / she can directly press the slider 210 from the outside to the inside of the second cold plate assembly 300 by hand. As a result, the slider 210 slides from the outside to the inside under the pressure applied by the operator, thereby driving the sliding section 221 connected to the slider 210 to move in the direction away from the fixing hole 140, so that the locking section 222 gradually disengages from the fixing hole 140, and finally unlocks the second cold plate assembly 300 from the first cold plate assembly 100.

[0098] During this process, since the slider 210 is located on the outside of the second cold plate assembly 300, the operator does not need to put their hand into the narrow space between the second cold plate assembly 300 and the first cold plate assembly 100 to operate. Therefore, the operating space is more open and the operating posture is more natural and comfortable, thereby reducing the difficulty of operation and improving the convenience of unlocking operation.

[0099] Meanwhile, the pressing direction from the outside to the inside conforms to the natural operating habits of ergonomics, allowing operators to more intuitively perceive the pressing force and the movement of the slider 210, thereby controlling the unlocking process more accurately and avoiding unlocking failure or damage to the device due to operational errors.

[0100] In some embodiments, when viewed from the direction in which the slider 210 slides from the outside to the inside, when the groove 211 is located on the right side of the fixing hole 140, the extension direction of the groove 211 can be deflected counterclockwise relative to the direction in which the slider 210 slides from the outside to the inside, and the deflection angle is an acute angle. Thus, when the slider 210 slides from the outside to the inside, it can drive the locking segment 222 to disengage from the fixing hole 140.

[0101] In some embodiments, when viewed from the direction in which the slider 210 slides from the outside to the inside, when the groove 211 is located to the left of the fixing hole 140, the extension direction of the groove 211 can be deflected clockwise relative to the direction in which the slider 210 slides from the outside to the inside, and the deflection angle is an acute angle. Thus, when the slider 210 slides from the outside to the inside, it can drive the locking segment 222 to disengage from the fixing hole 140.

[0102] In some possible implementations, such as Figures 3 to 5 As shown, the locking assembly 200 also includes a reset member 230, which connects the slider 210 and the second cold plate assembly 300. In the open state, the reset member 230 is compressed. In the closed state, the reset member 230 extends to apply a preload force to the slider 210, so that the locking assembly 200 retains the second cold plate assembly 300 locked to the first cold plate assembly 100.

[0103] Since the reset member 230 is in the extended state when closed, the reset member 230 applies a preload force to the slider 210. This preload force drives the slider 210 to move towards the locked position and remain in the locked position, thereby causing the slide bar 220 to be continuously inserted into the fixing hole 140. This allows the locking assembly 200 to continuously maintain the locked state of the second cold plate assembly 300 and the first cold plate assembly 100, preventing the slider 210 from being displaced due to external vibration or accidental contact and thus unlocking. Consequently, the position of the second cold plate assembly 300 in the closed state is more stable and reliable.

[0104] When the second cold plate assembly 300 is in a stable position, the second cold plate assembly 300 and the first cold plate assembly 100 can apply a stable and uniform clamping force to the heat dissipation component 20. This allows the second cold plate assembly 300 and the first cold plate assembly 100 to maintain a tight fit with the upper and lower surfaces of the heat dissipation component 20, reducing contact thermal resistance and thereby improving the heat transfer efficiency from the heat dissipation component 20 to the cold plate, thus improving the heat dissipation effect.

[0105] Meanwhile, the stable clamping state can also prevent the heat dissipation component 20 from shifting or loosening due to vibration during transportation or use, ensuring the installation reliability and working stability of the heat dissipation component 20.

[0106] In some embodiments, the reset member 230 may be a compression spring, a spring, a torsion spring, a rubber elastomer, etc.

[0107] In some embodiments, the reset member 230 may be disposed in the middle or on both sides of the slider 210.

[0108] In some embodiments, two or more reset members 230 may be provided between the slider 210 and the second cold plate assembly 300. Each reset member 230 may be distributed at intervals along a direction perpendicular to the sliding direction of the slider 210, so that the preload distribution is more uniform and the reliability of locking is improved.

[0109] In some embodiments, such as Figure 5 As shown, the slider 210 may have a clearance opening 212, and the reset member 230 may be located inside the clearance opening 212. One end of the reset member 230 is connected to the slider 210, and the other end is connected to the second cold plate 310.

[0110] With this configuration, the reset component 230 can be located within the area enclosed by the slider 210, that is, the reset component 230 is located within the area where the slider 210 is located, without having to occupy additional space outside the slider 210, thus enabling the miniaturization and integration of the liquid cooling heat dissipation device 10.

[0111] Furthermore, the clearance 212 can reduce the amount of material used in the slider 210 and reduce the weight of the slider 210, thereby achieving weight reduction and cost reduction of the liquid cooling heat dissipation device 10.

[0112] In some examples, such as Figure 5 As shown, the locking assembly 200 may further include a first fixing post 240, which can be connected to the slider 210 and is connected to one end of the reset member 230. The second cold plate assembly 300 may further include a second fixing post 350, which can be connected to the second cold plate 310 and is connected to the other end of the reset member 230. This configuration enables the reset member 230 to be connected.

[0113] Figure 6 This is another structural schematic diagram of the liquid cooling heat dissipation device 10 provided in the embodiments of this application.

[0114] Of course, in addition to including slider 210 and slider 220, in some other possible implementations, locking component 200 may not include slider 210 and slider 220. For example, as... Figure 6 As shown, the locking component 200 may include at least one detachable connector 250.

[0115] like Figure 6As shown, the first cold plate assembly 100 has at least one first connection hole 170, and the second cold plate assembly 300 has at least one second connection hole 360. The detachable connector 250 is sequentially inserted into the second connection hole 360 ​​and the first connection hole 170 to detachably connect the first cold plate assembly 100 and the second cold plate assembly 300.

[0116] Because the way the detachable connector 250 engages with the first connecting hole 170 and the second connecting hole 360 ​​is relatively simple, the locking and unlocking functions between the first cold plate assembly 100 and the second cold plate assembly 300 can be achieved without a complex mechanical structure, thereby reducing the manufacturing difficulty of the liquid cooling heat dissipation device 10. Furthermore, due to the simple engagement method, fewer parts are required, which can effectively reduce the manufacturing cost of the liquid cooling heat dissipation device 10.

[0117] In addition, the installation method of inserting the detachable connector 250 into the second connecting hole 360 ​​and the first connecting hole 170 is convenient to operate, has high assembly efficiency, and is easy to mass-produce.

[0118] In some embodiments, the detachable connector 250 is a threaded connector such as a bolt or screw. The threaded connector passes through the second connecting hole 360 ​​and the first connecting hole 170 in sequence, thereby enabling a detachable connection between the first cold plate assembly 100 and the second cold plate assembly 300. Both the second connecting hole 360 ​​and the first connecting hole 170 can be threaded holes.

[0119] Alternatively, in some embodiments, the detachable connector 250 is a pin, which is sequentially inserted into the second connecting hole 360 ​​and the first connecting hole 170, and can be fixed by a cotter pin or a snap ring, thereby achieving a detachable connection between the first cold plate assembly 100 and the second cold plate assembly 300. Both the second connecting hole 360 ​​and the first connecting hole 170 can be through holes.

[0120] Of course, in addition to being a threaded connector or a pin, the detachable connector 250 can also be a magnetic component, a snap-fit ​​component, etc. in some other embodiments.

[0121] In some embodiments, the number of detachable connectors 250 can be two or more, and the two or more detachable connectors 250 can be distributed at intervals along the connection edge of the first cold plate assembly 100 and the second cold plate assembly 300, which can enhance the stability of the connection between the first cold plate assembly 100 and the second cold plate assembly 300.

[0122] In some possible implementations, such as Figure 5As shown, the liquid cooling heat dissipation device 10 further includes at least one rotary joint 400, which is rotatably connected to the first cold plate assembly 100 and communicates with the first cold plate assembly 100. A second cold plate assembly 300 corresponds to at least one rotary joint 400, which is connected to and communicates with the corresponding second cold plate assembly 300.

[0123] Because the rotary joint 400 is rotatably connected to the first cold plate assembly 100, when the second cold plate assembly 300 rotates relative to the first cold plate assembly 100, the rotary joint 400 can rotate with the second cold plate assembly 300, thereby preventing the second cold plate assembly 300 from twisting or pulling on the connecting pipeline during rotation. This design allows the second cold plate assembly 300 to smoothly switch between closed and open states without being affected by pipeline limitations, thus improving the ease of operation of the device.

[0124] The rotary joint 400 is connected to both the first cold plate assembly 100 and the second cold plate assembly 300. This connection allows coolant to flow from the first cold plate assembly 100 through the rotary joint 400 into the second cold plate assembly 300, or vice versa, thus achieving coolant circulation between the two assemblies. This configuration ensures continuous flow and renewal of coolant within both assemblies, preventing the coolant from losing its heat dissipation capacity due to localized overheating and ensuring continuous and effective heat dissipation for the heat sink 20.

[0125] It can be seen that the rotary joint 400 realizes both the rotation function and the coolant conduction function. This integrated design avoids the need to set up the rotation component and the liquid communication component separately, thus simplifying the structure of the device, reducing the number of parts, and lowering the manufacturing cost and assembly difficulty.

[0126] In addition, the second cold plate assembly 300 corresponds to at least two rotary joints 400, which are connected to the corresponding second cold plate assembly 300 and are in communication with the corresponding second cold plate assembly 300. The two rotary joints 400 can be used for the liquid inlet and liquid outlet of the second cold plate assembly 300 respectively, thereby realizing the circulation of coolant.

[0127] In some embodiments, the rotary joint 400 can be a single-channel rotary joint 400, that is, the rotary joint 400 has only one fluid channel inside.

[0128] Alternatively, in some other embodiments, the rotary joint 400 can be a dual-channel rotary joint 400, that is, the rotary joint 400 has two independent fluid channels inside, one channel for coolant inlet and the other channel for coolant return, thereby realizing coolant circulation and improving heat dissipation efficiency. It is understood that when the rotary joint 400 is a dual-channel rotary joint 400, the second cold plate assembly 300 can correspond to one rotary joint 400.

[0129] In some embodiments, the rotary joint 400 may be disposed on the side of the first cold plate assembly 100 such that the rotation axis of the rotary joint 400 is parallel to the main surface of the first cold plate assembly 100, so that the second cold plate assembly 300 can be flipped upward around the rotation axis without interfering with the first cold plate assembly 100.

[0130] In some embodiments, a sealing ring may be provided between the rotary joint 400 and the first cold plate assembly 100 to prevent coolant leakage at the connection between the rotary joint 400 and the first cold plate assembly 100, thereby improving the sealing performance of the device.

[0131] In some embodiments, a sealing ring may also be provided between the rotary joint 400 and the second cold plate assembly 300 to prevent coolant leakage at the connection between the rotary joint 400 and the second cold plate assembly 300, thereby improving the sealing performance of the device.

[0132] In some embodiments, the rotary joint 400 can be rotatably connected to the first cold plate assembly 100 via bearings or the like. For example, the rotary joint 400 can be rotatably connected to the first protrusion 150 via bearings or the like.

[0133] In some embodiments, the rotary joint 400 can be fixedly connected to the second cold plate assembly 300 by means of welding, screwing, bonding, etc. For example, the rotary joint 400 can be fixedly connected to the second protrusion 320 by means of welding, screwing, bonding, etc.

[0134] In some embodiments, the rotary joint 400 may be a quick connector.

[0135] In some embodiments, the rotary joint 400 may be made of stainless steel, copper, aluminum, etc.

[0136] In some possible implementations, such as Figure 5 As shown, the liquid cooling heat dissipation device 10 also includes a thermally conductive pad 500, which is disposed between at least one of the first cold plate assembly 100 and the second cold plate assembly 300 and the component 20 to be cooled.

[0137] The thermally conductive pad 500 serves as a transition medium between the first cold plate assembly 100 or the second cold plate assembly 300 and the heat-dissipating component 20. Its material typically possesses a certain degree of softness and elasticity. When the second cold plate assembly 300 rotates to the closed state, the thermally conductive pad 500 can undergo moderate deformation under the clamping force of the first cold plate assembly 100 and the second cold plate assembly 300, thereby better conforming to the microscopic uneven areas on the surface of the heat-dissipating component 20 and filling any small gaps that may exist between the cold plate and the heat-dissipating component 20. This increases the actual contact area between the thermally conductive pad 500 and the heat-dissipating component 20, and improves the efficiency of heat conduction.

[0138] Meanwhile, the softness of the thermal pad 500 allows it to act as a buffer when in contact with the heat-dissipating component 20, preventing the hard cold plate from directly pressing on the surface of the heat-dissipating component 20 and causing localized stress concentration. This reduces the possibility of physical damage such as scratches, wear, or indentations on the surface of the heat-dissipating component 20, which is especially important for the heat-dissipating component 20 with a relatively fragile or delicate surface, and can effectively extend the service life of the heat-dissipating component 20.

[0139] In addition, the thermal pad 500 can compensate for dimensional mismatch errors between the cold plate and the heat-dissipating component 20 caused by manufacturing tolerances, installation deviations or thermal expansion and contraction, ensuring good thermal contact under different working conditions and improving the stability and reliability of the heat dissipation system.

[0140] In some embodiments, the thermal pad 500 can be a silicone thermal pad 500, a graphene thermal pad 500, or a phase change thermal pad 500, etc.

[0141] In some embodiments, the thermal pad 500 can be fixed to the first cold plate assembly 100 or the second cold plate assembly 300 by means of snap-fit, adhesive, fastener connection, etc.

[0142] Alternatively, in some other embodiments, the thermal pad 500 may not be fixed to the cold plate, but may be placed directly between the cold plate and the heat-dissipating component 20, which simplifies the installation process.

[0143] In some possible implementations, there are two second cold plate assemblies 300, which are spaced apart and rotate in opposite directions.

[0144] Specifically, two second cold plate assemblies 300 are located on opposite sides of the first cold plate assembly 100, and are rotatably connected to the first cold plate assembly 100. When the two second cold plate assemblies 300 rotate from the open state to the closed state, they rotate in opposite directions, i.e., one rotates clockwise and the other rotates counterclockwise, allowing both assemblies 300 to simultaneously approach and eventually contact the upper surface of the heat-dissipating component 20. When the two second cold plate assemblies 300 rotate from the closed state to the open state, they rotate in the same opposite directions, allowing them to simultaneously move away from the upper surface of the heat-dissipating component 20.

[0145] Because the two second cold plate assemblies 300 are spaced apart, they will not interfere with or collide with each other during rotation, thus ensuring that the two second cold plate assemblies 300 can smoothly switch between the closed and open states.

[0146] Meanwhile, the two second cold plate assemblies 300 rotate in opposite directions, allowing the operator to operate both second cold plate assemblies 300 simultaneously, facilitating the simultaneous rotation of both second cold plate assemblies 300 and improving operating efficiency.

[0147] It is understandable that when there are two heat dissipation components 20, the two heat dissipation components 20 can be installed into the liquid cooling heat dissipation device 10 separately, or the two heat dissipation components 20 can be installed into the liquid cooling heat dissipation device 10 at the same time.

[0148] It should be understood that the embodiments of this application are not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A liquid cooling heat dissipation device (10), characterized in that, include: A first cold plate assembly (100) is used to contact the lower surface of the heat dissipation component (20); At least one locking component (200); At least one second cold plate assembly (300) is rotatably connected to the first cold plate assembly (100), and the second cold plate assembly (300) corresponds one-to-one with the locking assembly (200). The second cold plate assembly (300) rotates to switch between a closed state in contact with the upper surface of the heat dissipation component (20) and an open state away from the upper surface of the heat dissipation component (20). In the closed state, the locking component (200) locks the corresponding second cold plate component (300) and the first cold plate component (100). In the open state, the locking component (200) unlocks the corresponding second cold plate component (300) and the first cold plate component (100).

2. The liquid cooling heat dissipation device (10) according to claim 1, characterized in that, The first cold plate assembly (100) has at least one fixing hole (140); the locking assembly (200) includes: At least one slider (210) is slidably connected to the second cold plate assembly (300); At least one slide bar (220), the slide bar (220), the slider (210) and the fixing hole (140) correspond one-to-one, and the slide bar (220) is connected to the corresponding slider (210); The slider (210) slides relative to the second cold plate assembly (300) to drive the corresponding slide rod (220) to disengage from or insert into the corresponding fixing hole (140) to unlock or lock the second cold plate assembly (300).

3. The liquid cooling heat dissipation device (10) according to claim 2, characterized in that, The slider (210) has a groove (211), and the extending direction of the groove (211) forms an angle with the sliding direction of the slider (210). The slide bar (220) includes a sliding section (221) and a locking section (222) connected to each other. The sliding section (221) is inserted into the slide groove (211) and can slide along the slide groove (211). The extension direction of the fixing hole (140) is at an angle to the extension direction of the slide groove (211), and the extension direction of the fixing hole (140) is at an angle to the sliding direction of the slider (210). The slider (210) slides to drive the sliding section (221) to slide, and drive the locking section (222) to disengage from or insert into the fixing hole (140).

4. The liquid cooling heat dissipation device (10) according to claim 3, characterized in that, The slider (210) slides from the outside to the inside, so as to drive the sliding section (221) to move in a direction away from the fixing hole (140), and drive the locking section (222) to disengage from the fixing hole (140).

5. The liquid cooling heat dissipation device (10) according to claim 2, characterized in that, The locking assembly (200) also includes a reset member (230) that connects the slider (210) to the second cold plate assembly (300). In the open state, the reset member (230) is compressed; In the closed state, the reset member (230) extends to apply a preload to the slider (210) so that the locking assembly (200) keeps the second cold plate assembly (300) locked to the first cold plate assembly (100).

6. The liquid cooling heat dissipation device (10) according to claim 1, characterized in that, The locking assembly (200) includes at least one detachable connector (250); The first cold plate assembly (100) has at least one first connection hole (170), and the second cold plate assembly (300) has at least one second connection hole (360). The detachable connector (250) is sequentially inserted into the second connection hole (360) and the first connection hole (170) to detachably connect the first cold plate assembly (100) and the second cold plate assembly (300).

7. The liquid cooling heat dissipation device (10) according to any one of claims 1-6, characterized in that, It also includes at least two rotary joints (400), which are rotatably connected to the first cold plate assembly (100) and are in communication with the first cold plate assembly (100); The second cold plate assembly (300) corresponds to at least two of the rotary joints (400), the rotary joints (400) are connected to the corresponding second cold plate assembly (300), and the rotary joints (400) are in communication with the corresponding second cold plate assembly (300).

8. The liquid cooling heat dissipation device (10) according to any one of claims 1-6, characterized in that, It also includes a thermal pad (500) disposed between at least one of the first cold plate assembly (100) and the second cold plate assembly (300) and the heat dissipation component (20).

9. The liquid cooling heat dissipation device (10) according to any one of claims 1-6, characterized in that, The number of the second cold plate assembly (300) is two, the two second cold plate assemblies (300) are arranged at intervals, and the two second cold plate assemblies (300) rotate in opposite directions.

10. An electronic device, characterized in that, It includes a liquid cooling heat dissipation device (10) as described in any one of claims 1-9 and at least one heat dissipation component (20) connected to the liquid cooling heat dissipation device (10).

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