Power distribution device and battery pack

Abstract

The invention provides a power distribution device and a battery pack. The power distribution device comprises a shell, a to-be-detected piece and a sampling assembly, the sampling assembly comprises a base body, a temperature sensor and a heat conduction piece. The base body is connected to the shell, and the temperature sensor is connected to the base body; the heat-conducting member comprises a heat-conducting body and a vibration absorbing part, one end of the heat-conducting body is connected to the temperature sensor, the other end of the heat-conducting body extends out of the base body and is connected to the to-be-detected member, and the vibration absorbing part is connected to the heat-conducting body. Therefore, if the heat conduction body vibrates in the use process of the power distribution device, the vibration energy of the heat conduction body can be absorbed through the vibration absorption part, so that the heat conduction piece has relatively good stability in the temperature acquisition and data transmission process, and the sampling assembly has relatively high sampling accuracy; and the risk that the sampling assembly is easy to loosen due to vibration in the use process, so that the sampling accuracy is poor is reduced.

Description

Technical Field

[0001] This application belongs to the field of battery manufacturing technology, specifically relating to a power distribution device and a battery pack. Background Technology

[0002] The power distribution device of a battery pack typically includes a sampling component and an electrical component to be tested. The sampling component includes a temperature sensor to collect temperature signals from the component under test, such as a relay or fuse, and transmits the temperature signals to the circuit board, which plays a relatively important role.

[0003] In existing technologies, sampling components are prone to loosening due to vibration during use, resulting in poor sampling accuracy. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide a power distribution device and battery pack that overcomes the problem that existing sampling components are prone to loosening due to vibration, resulting in poor sampling accuracy.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application provide a power distribution device, which includes: a housing, a device to be tested, and a sampling assembly; The sampling component includes: a substrate, a temperature sensor, and a heat-conducting component; The substrate is connected to the housing, and the temperature sensor is connected to the substrate; The thermally conductive component includes a thermally conductive body and a vibration-absorbing part. One end of the thermally conductive body is connected to the temperature sensor, and the other end of the thermally conductive body extends out of the substrate and is connected to the device to be tested. The vibration-absorbing part is connected to the thermally conductive body.

[0006] Optionally, the heat-conducting body includes a connecting end and a collection end spaced apart, and the component to be tested includes a detection end; The connecting end is connected to the temperature sensor, the collecting end is connected to the detection end, the vibration absorbing part is connected between the connecting end and the collecting end, and at least a portion of the vibration absorbing part and the collecting end extend outside the substrate.

[0007] Optionally, the acquisition end is attached to the detection end; The housing includes a bottom wall, and the connecting end is spaced apart from the bottom wall.

[0008] Optionally, the vibration absorption part is a bent plate, one end of which is connected to the connecting end, and the other end of which is bent toward the collecting end.

[0009] Optionally, the substrate is provided with a mounting groove, the temperature sensor is embedded in the mounting groove, and the connection end is located in the mounting groove and connected to the temperature sensor.

[0010] Optionally, the sampling assembly further includes an insulating element connected to the temperature sensor and sealing the mounting groove to seal the temperature sensor.

[0011] Optionally, the sampling component further includes a conductive element connected to the temperature sensor, and the conductive element is spaced apart from the heat-conducting element; The insulating element includes a protruding partition located between the thermally conductive element and the conductive element to provide insulation between them.

[0012] Optionally, the substrate includes a first surface and a second surface disposed opposite to each other, the mounting groove is disposed on the first surface, and at least a portion of the vibration absorbing part and the collecting end extends from the second surface to the substrate.

[0013] Optionally, the substrate is a plastic part, and the substrate, the temperature sensor, and the heat-conducting component are integrally injection molded structures.

[0014] Secondly, embodiments of this application provide a battery pack, which includes the aforementioned power distribution device.

[0015] In this embodiment, the power distribution device includes a housing, a device to be tested, and a sampling assembly. The sampling assembly includes a substrate, a temperature sensor, and a thermally conductive component. The substrate is connected to the housing, and the temperature sensor is connected to the substrate. The thermally conductive component includes a thermally conductive body and a vibration-absorbing part. One end of the thermally conductive body is connected to the temperature sensor, and the other end extends out of the substrate and is connected to the device to be tested. The vibration-absorbing part is connected to the thermally conductive body. This arrangement allows both the temperature sensor and the thermally conductive component to be mounted on the substrate, resulting in a high degree of integration between the temperature sensor, the thermally conductive component, and the substrate. Furthermore, by connecting one end of the thermally conductive body to the temperature sensor and the other end extending out of the substrate and connected to the device to be tested, the thermally conductive component can acquire the temperature of the device to be tested and transmit the acquired temperature to the temperature sensor. Furthermore, a vibration absorption section is provided connected to the heat-conducting body. If the heat-conducting body vibrates during the use of the power distribution device, the vibration energy of the heat-conducting body can be absorbed by the vibration absorption section. This makes the heat-conducting component have better stability during temperature acquisition and data transmission, and makes the sampling component have higher sampling accuracy. It also reduces the risk that the sampling component may become loose due to vibration during use, resulting in poor sampling accuracy.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of the sampling component of the power distribution device described in the embodiments of this application; Figure 2 This is an exploded view of the sampling component of the power distribution device described in the embodiments of this application; Figure 3 This is an exploded view of the power distribution device described in the embodiments of this application.

[0018] Reference numerals: 200-Housing; 100-Sampling component; 10-Base; 20-Temperature sensor; 30-Heat-conducting component; 35-Heat-conducting body; 31-Connecting end; 32-Collection end; 33-Vibration absorption part; 210-Bottom wall; 12-Mounting groove; 40-Insulating component; 50-Conductive component; 41-Partition; 13-First surface; 14-Second surface; 60-Detection component; 61-Detection end. Detailed Implementation

[0019] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0020] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] Reference Figures 1 to 3 The diagram shows a structural schematic of a power distribution device according to an embodiment of this application. The power distribution device may specifically include: a housing 200, a component to be tested 60, and a sampling component 100. The sampling component 100 includes: a substrate 10, a temperature sensor 20, and a heat-conducting component 30; The substrate 10 is connected to the housing 200, and the temperature sensor 20 is connected to the substrate 10; The heat-conducting component 30 includes a heat-conducting body 35 and a vibration-absorbing part 33. One end of the heat-conducting body 35 is connected to the temperature sensor 20, and the other end of the heat-conducting body 35 extends to the outside of the substrate 10 and is connected to the test piece 60. The vibration-absorbing part 33 is connected to the heat-conducting body 35.

[0024] In this embodiment, both the temperature sensor 20 and the heat-conducting element 30 are mounted on the substrate 10, resulting in a high degree of integration between the temperature sensor 20, the heat-conducting element 30, and the substrate 10. One end of the heat-conducting body 35 is connected to the temperature sensor 20, and the other end extends out of the substrate 10 and connects to the device under test 60. This allows the heat-conducting element 30 to collect the temperature of the device under test 60 and transmit the collected temperature to the temperature sensor 20. Furthermore, a vibration-absorbing part 33 is connected to the heat-conducting body 35. If the heat-conducting body 35 vibrates during the use of the power distribution device, the vibration energy can be absorbed by the vibration-absorbing part 33. This improves the stability of the heat-conducting element 30 during temperature acquisition and data transmission, resulting in higher sampling accuracy for the sampling component 100 and reducing the risk of poor sampling accuracy due to loosening caused by vibration during use.

[0025] In this embodiment, the vibration absorbing part 33 can be elastic and capable of elastic deformation. When the heat-conducting body 35 vibrates, it absorbs vibration energy through elastic deformation, thereby giving the heat-conducting component 30 better stability. For example, the vibration absorbing part 33 can be a spring sheet structure or a bent structure, etc. This embodiment does not limit the specific type of the vibration absorbing part 33.

[0026] Specifically, in this embodiment, the housing 200 is used to accommodate the various structural components of the test piece 60 and the sampling assembly 100. The base 10 of the sampling assembly 100 is connected to the housing 200, which gives the sampling assembly 100 better structural stability and improves the stabilization effect. For example, the base 10 can be snapped onto the housing 200, which is easy to assemble and has a simple structure.

[0027] For example, in this embodiment of the application, the component to be tested 60 can be a relay or a fuse, etc., and its temperature change has a significant impact on its electrical performance. Therefore, it is necessary to collect its temperature value through the sampling component 100 and monitor it in real time.

[0028] In this embodiment, for example, the heat-conducting body 35 and the vibration-absorbing part 33 of the heat-conducting component 30 can be an integrally formed structure with good connection strength. For example, the heat-conducting body 35 and the vibration-absorbing part 33 can be metal parts, such as nickel-plated copper T2, which has good thermal conductivity and good structural stability. In addition, the heat-conducting body 35 and the vibration-absorbing part 33 can also be silver-plated copper T2, chromium zirconium copper, beryllium bronze, or other aluminum alloys, etc. The specific materials of the heat-conducting body 35 and the vibration-absorbing part 33 are not limited in this embodiment.

[0029] Optionally, in the embodiments of this application, such as Figure 2As shown, the heat-conducting body 35 includes a connecting end 31 and a sensing end 32 spaced apart, and the device under test 60 includes a sensing end 61. The connecting end 31 is connected to the temperature sensor 20, the sensing end 32 is connected to the sensing end 61, and the vibration-absorbing part 33 is connected between the connecting end 31 and the sensing end 32. At least a portion of the vibration-absorbing part 33 and the sensing end 32 extend outside the substrate 10. For example, the connecting end 31, the vibration-absorbing part 33, and the sensing end 32 can form a Z-shaped structure. In this way, a relatively reliable connection between the heat-conducting body 35 and the temperature sensor 20 is achieved through the connecting end 31, and a relatively reliable connection between the heat-conducting body 35 and the sensing end 61 of the device under test 60 is achieved through the sensing end 32. Since the portion extending beyond the substrate 10 is more prone to vibration, the vibration absorption part 33 is connected between the connection end 31 and the acquisition end 32, and at least part of the vibration absorption part 33 and the acquisition end 32 are provided to extend beyond the substrate 10. This allows the vibration energy generated by the acquisition end 32 to be absorbed by the vibration absorption part 33, and prevents the vibration from being transmitted to the connection end 31 and affecting the sampling effect.

[0030] In this embodiment, optionally, the acquisition end 32 is attached to the detection end 61; the housing 200 includes a bottom wall 210, and the connecting end 31 is spaced apart from the bottom wall 210. For example, the acquisition end 32 can be a planar structure. The attachment of the acquisition end 32 to the detection end 61 provides a larger contact area and higher contact reliability, further improving electrical reliability. The connection end 31 is also spaced apart from the bottom wall 210 of the housing 200, creating a gap between them. This allows at least a portion of the vibration absorption portion 33 connected to the connection end 31 and the acquisition end 32 to extend outside the base 10, providing the vibration absorption portion 33 with deformation space to absorb the vibration energy transmitted from the acquisition end 32 to the connection end 31.

[0031] Optionally, in this embodiment, the vibration absorption part 33 is a bent plate, with one end connected to the connecting end 31 and the other end bent towards the collecting end 32. This forms an L-shaped bent structure, allowing the bent plate to deform and absorb vibration energy. This results in the vibration absorption part 33 having a good absorption effect on the vibration generated between the collecting end 32 and the connecting end 31, and the structure is simple and has good reliability.

[0032] For example, in this embodiment, one end of the bent plate has a chamfered structure between it and the connecting end 31, thereby achieving a smoother transition between the connecting end 31 and the vibration absorption part 33. The other end of the bent plate also has a chamfered structure between it and the collecting end 32, thereby achieving a smoother transition between the collecting end 32 and the vibration absorption part 33.

[0033] Optionally, in this embodiment, the substrate 10 is provided with a mounting groove 12, the temperature sensor 20 is embedded in the mounting groove 12, and the connecting end 31 is located within the mounting groove 12 and connected to the temperature sensor 20. In this way, the mounting groove 12 provides a space for the temperature sensor 20 and provides good protection for the temperature sensor 20, preventing other external structures from affecting the data reception and transmission of the temperature sensor 20. Furthermore, placing the connecting end 31 within the mounting groove 12 ensures a more stable and reliable connection between the connecting end 31 and the temperature sensor 20.

[0034] For example, in this embodiment, the mounting groove 12 can be rectangular or square, etc., and can be set according to actual needs. This embodiment does not limit the specific shape of the mounting groove 12. The depth of the mounting groove 12 is greater than the thickness of the temperature sensor 20, so that the temperature sensor 20 is completely located within the mounting groove 12. The specific depth of the mounting groove 12 can be set according to actual needs, and this embodiment does not limit it.

[0035] Optionally, in the embodiments of this application, such as Figure 2 As shown, the sampling assembly 100 also includes an insulating component 40, which is connected to the temperature sensor 20 and seals the mounting groove 12 to seal the temperature sensor 20. In this way, the temperature sensor 20 is sealed by the insulating component 40, providing good sealing performance and preventing external dust and other contaminants from affecting it. Furthermore, the insulating component 40 has good insulation properties, preventing any impact on the electrical performance of the temperature sensor 20.

[0036] For example, in this embodiment, the insulating component 40 can be a potting compound. After the connection end 31 of the temperature sensor 20 and the heat-conducting component 30 is assembled in the mounting groove 12, potting compound can be applied to the mounting groove 12 to form the insulating component 40, which seals the temperature sensor 20. This allows the insulating component 40 to encapsulate the temperature sensor 20, providing a good sealing effect. For example, the potting compound can be epoxy resin. Alternatively, the insulating component 40 can also be a silicone block or a rubber block, which, when embedded in the mounting groove 12, can also provide a good seal and insulation effect for the temperature sensor 20. The specific type of the insulating component 40 is not limited in this embodiment.

[0037] Optionally, in this embodiment, the sampling component 100 further includes a conductive element 50 connected to the temperature sensor 20, and the conductive element 50 is spaced apart from the heat-conducting element 30; the insulating element 40 includes a protruding partition 41 located between the heat-conducting element 30 and the conductive element 50 to provide insulation between them. Thus, the signal from the temperature sensor 20 can be transmitted to the circuit board structure via the conductive element 50. The spaced arrangement of the conductive element 50 and the heat-conducting element 30, along with the protruding partition 41 of the insulating element 40 between them, ensures good electrical isolation through physical separation between the heat-conducting element 30 and the conductive element 50.

[0038] For example, in the embodiments of this application, the partition 41 can be a cuboid, a cube, or a frustum shape, etc., and can be set according to actual needs. The specific type of partition 41 is not limited in the embodiments of this application.

[0039] In this embodiment of the application, the conductive element 50 may include a positive conductive sheet and a negative conductive sheet. The positive and negative conductive sheets are spaced apart on the substrate 10. The substrate 10 forms a physical isolation between the positive and negative conductive sheets, which has a good electrical isolation effect and avoids short circuits.

[0040] For example, in the embodiments of this application, such as Figure 2 As shown, the temperature sensor 20 may include a chip, a positive pin, and a negative pin. The positive pin and the negative pin are respectively connected to the chip, and the positive pin and the negative pin are respectively connected to the negative conductive plate and the positive conductive plate of the conductive element 50, thereby realizing circuit conduction.

[0041] Optionally, in this embodiment, the substrate 10 includes a first surface 13 and a second surface 14 disposed opposite to each other. A mounting groove 12 is disposed on the first surface 13, and at least a portion of the vibration absorption portion 33 and the sensing end 32 extend from the second surface 14 to the substrate 10. For example, the first surface 13 can be the top surface of the substrate 10, and the second surface 14 can be the bottom surface of the substrate 10. Disposing the mounting groove 12 on the top first surface 13 facilitates the use of a robotic arm to grasp the temperature sensor 20 and place it within the mounting groove 12 during machining, and also facilitates subsequent welding operations. Furthermore, the fact that at least a portion of the vibration absorption portion 33 and the sensing end 32 extend from the bottom second surface 14 to the substrate 10 facilitates the assembly between the sensing end 32 and the detection end 61.

[0042] In this embodiment, optionally, the substrate 10 is a plastic part, and the substrate 10, temperature sensor 20, and heat-conducting component 30 are integrally injection molded. Specifically, in this embodiment, the temperature sensor 20 is an electronic device, and the heat-conducting component 30 can be a metal part. The temperature sensor 20 and the heat-conducting component 30 can be injection molded by covering the plastic substrate 10 with the plastic part, and the part where the temperature sensor 20 and the heat-conducting component 30 are attached is exposed to avoid a small distance between the solder pads when soldering the temperature sensor 20 later, and at least part of the vibration absorption part 33 and the sensing end 32 of the heat-conducting component 30 extend outside the substrate 10. This allows the substrate 10, temperature sensor 20, and heat-conducting component 30 to be integrally injection molded, reducing processing steps and improving production efficiency.

[0043] For example, in this embodiment, the substrate 10, temperature sensor 20, heat-conducting component 30, and conductive component 50 can be integrally injection molded together. The plastic part of the substrate 10 can be polybutylene terephthalate, polyphenylene sulfide, or polyamide, etc., which have good heat resistance, electrical insulation, mechanical properties, and wear resistance, and are easy to process. The specific type of plastic part is not limited in this embodiment.

[0044] In summary, the power distribution device described in the embodiments of this application may include at least the following advantages: In this embodiment, the power distribution device includes a housing, a device to be tested, and a sampling assembly. The sampling assembly includes a substrate, a temperature sensor, and a thermally conductive component. The substrate is connected to the housing, and the temperature sensor is connected to the substrate. The thermally conductive component includes a thermally conductive body and a vibration-absorbing part. One end of the thermally conductive body is connected to the temperature sensor, and the other end extends out of the substrate and is connected to the device to be tested. The vibration-absorbing part is connected to the thermally conductive body. This arrangement allows both the temperature sensor and the thermally conductive component to be mounted on the substrate, resulting in a high degree of integration between the temperature sensor, the thermally conductive component, and the substrate. Furthermore, by connecting one end of the thermally conductive body to the temperature sensor and the other end extending out of the substrate and connected to the device to be tested, the thermally conductive component can acquire the temperature of the device to be tested and transmit the acquired temperature to the temperature sensor. Furthermore, a vibration absorption section is provided connected to the heat-conducting body. If the heat-conducting body vibrates during the use of the power distribution device, the vibration energy of the heat-conducting body can be absorbed by the vibration absorption section. This makes the heat-conducting component have better stability during temperature acquisition and data transmission, and makes the sampling component have higher sampling accuracy. It also reduces the risk that the sampling component may become loose due to vibration during use, resulting in poor sampling accuracy.

[0045] This application also proposes a battery pack, which includes the aforementioned power distribution device.

[0046] For example, in this embodiment, the battery pack can be a power battery pack to provide power to an electric vehicle, or it can be an energy storage battery pack used in an energy storage system. Furthermore, the battery pack can be a cylindrical battery pack, a prismatic battery pack, a pouch battery pack, or a blade battery pack, etc. This embodiment does not limit the specific type of battery pack.

[0047] The battery pack described in this application embodiment may include at least the following advantages: In this embodiment, the battery pack includes the aforementioned power distribution device, which includes a housing, a device under test, and a sampling assembly. The sampling assembly includes a substrate, a temperature sensor, and a thermally conductive component. The substrate is connected to the housing, and the temperature sensor is connected to the substrate. The thermally conductive component includes a thermally conductive body and a vibration-absorbing part. One end of the thermally conductive body is connected to the temperature sensor, and the other end extends out of the substrate and connects to the device under test. The vibration-absorbing part is connected to the thermally conductive body. This arrangement allows both the temperature sensor and the thermally conductive component to be mounted on the substrate, resulting in a high degree of integration between the temperature sensor, the thermally conductive component, and the substrate. Furthermore, by connecting one end of the thermally conductive body to the temperature sensor and the other end extending out of the substrate and connecting to the device under test, the thermally conductive component can acquire the temperature of the device under test and transmit the acquired temperature to the temperature sensor. Furthermore, a vibration absorption section is provided connected to the heat-conducting body. If the heat-conducting body vibrates during the use of the power distribution device, the vibration energy of the heat-conducting body can be absorbed by the vibration absorption section. This makes the heat-conducting component have better stability during temperature acquisition and data transmission, and makes the sampling component have higher sampling accuracy. It also reduces the risk that the sampling component may become loose due to vibration during use, resulting in poor sampling accuracy.

[0048] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0049] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A power distribution device, characterized in that, The power distribution device includes: a housing (200), a component to be tested (60), and a sampling assembly (100). The sampling component (100) includes: a substrate (10), a temperature sensor (20), and a heat-conducting component (30); The substrate (10) is connected to the housing (200), and the temperature sensor (20) is connected to the substrate (10). The heat-conducting component (30) includes a heat-conducting body (35) and a vibration-absorbing part (33). One end of the heat-conducting body (35) is connected to the temperature sensor (20), and the other end of the heat-conducting body (35) extends to the outside of the substrate (10) and is connected to the test piece (60). The vibration-absorbing part (33) is connected to the heat-conducting body (35).

2. The power distribution device according to claim 1, characterized in that, The heat-conducting body (30) includes a connection end (31) and a collection end (32) arranged at intervals, and the test piece (60) includes a detection end (61). The connecting end (31) is connected to the temperature sensor (20), the collecting end (32) is connected to the detection end (61), the vibration absorbing part (33) is connected between the connecting end (31) and the collecting end (32), and at least part of the vibration absorbing part (33) and the collecting end (32) extend outside the substrate (10).

3. The power distribution device according to claim 2, characterized in that, The acquisition end (32) is attached to the detection end (61); The housing (200) includes a bottom wall (210), and the connecting end (31) is spaced apart from the bottom wall (210).

4. The power distribution device according to claim 2, characterized in that, The vibration absorption part (33) is a bent plate, one end of which is connected to the connecting end (31), and the other end of which is bent toward the collection end (32).

5. The power distribution device according to claim 2, characterized in that, The substrate (10) is provided with a mounting groove (12), the temperature sensor (20) is embedded in the mounting groove (12), and the connecting end (31) is located in the mounting groove (12) and connected to the temperature sensor (20).

6. The power distribution device according to claim 5, characterized in that, The sampling assembly (100) also includes an insulating element (40) which is connected to the temperature sensor (20) and seals the mounting groove (12) to seal the temperature sensor (20).

7. The power distribution device according to claim 6, characterized in that, The sampling component (100) further includes a conductive element (50), which is connected to the temperature sensor (20), and the conductive element (50) is spaced apart from the heat-conducting element (30); The insulating element (40) includes a protruding partition (41) located between the heat-conducting element (30) and the conductive element (50) to provide insulation between the heat-conducting element (30) and the conductive element (50).

8. The power distribution device according to claim 5, characterized in that, The substrate (10) includes a first surface (13) and a second surface (14) facing away from each other. The mounting groove (12) is disposed on the first surface (13). At least a portion of the vibration absorption part (33) and the acquisition end (32) extend from the second surface (14) to the substrate (10).

9. The power distribution device according to claim 1, characterized in that, The substrate (10) is a plastic part, and the substrate (10), the temperature sensor (20) and the heat-conducting part (30) are integrally injection molded structures.

10. A battery pack, characterized in that, The battery pack includes the power distribution device as described in any one of claims 1-9.

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