Laser and light source device

Abstract

The invention discloses a laser and a light source device, and belongs to the technical field of photoelectricity. The laser comprises a substrate, a frame body and a light-emitting chip. The substrate can comprise a connecting part, and the frame body can be connected with the connecting part. An area of a connection region between the connection portion and the frame in the substrate may be smaller than an area of a side of the frame facing the connection portion. Thus, under the condition that the frame body is connected with the connecting part in a welding mode to achieve fixed connection of the frame body and the substrate, the area of the welding area between the frame body and the connecting part can be smaller than the area of the face, facing the connecting part, of the frame body, and therefore the contact area between the frame body and the substrate is reduced; therefore, the welding area between the frame body and the substrate is reduced, so that after the connecting part and the frame body are welded together, the residual stress between the frame body and the substrate is small, and the reliability of the connection between the frame body and the substrate is high.

Description

Technical Field

[0001] This application relates to the field of optoelectronic technology, and in particular to a laser and a light source device. Background Technology

[0002] With the development of optoelectronic technology, lasers are being used more and more widely, for example in welding, cutting and laser display.

[0003] Lasers typically include a package structure and a light-emitting chip. The package structure usually includes a substrate and a frame, with the frame and light-emitting chip fixed to the substrate. The frame can surround the light-emitting chip. Currently, the frame is usually fixed to the substrate by soldering.

[0004] However, the current method of fixing the frame and substrate together by welding results in large residual stress between the frame and substrate, leading to low reliability of the packaging structure. Summary of the Invention

[0005] This application provides a laser and a light source device. It can solve the problem of low reliability in the welding between the frame and the substrate in existing lasers. The technical solution is as follows:

[0006] On the one hand, a laser is provided, comprising: a substrate, a frame, and a light-emitting chip;

[0007] The substrate includes: a substrate body, a support platform, and a connecting portion, wherein the support platform and the connecting portion are both disposed on the substrate body;

[0008] The frame is distributed around the support platform, and the frame is connected to the connecting part;

[0009] The light-emitting chip is fixedly connected to the support platform on the side opposite to the substrate body;

[0010] Wherein, the area of ​​the connection region between the connecting part and the frame is smaller than the area of ​​the side of the frame facing the connecting part.

[0011] Optionally, the side of the connecting portion away from the substrate body is connected to the side of the frame facing the substrate body.

[0012] Optionally, the connecting portion is annular, and the support platform is located within the area enclosed by the connecting portion;

[0013] Alternatively, the connecting portion may include a plurality of sub-connecting segments distributed around the support platform, and a partition groove between any two adjacent sub-connecting segments distributed around the periphery of the support platform.

[0014] Optionally, in a direction perpendicular to the substrate body, the height of the connecting portion is less than or equal to the height of the support platform.

[0015] Optionally, in a direction parallel to the substrate body, there is a first gap between the connecting portion and the support platform.

[0016] Optionally, the substrate includes at least two connecting portions, each of the connecting portions being distributed around the support platform, and at least two of the connecting portions being nested together, with a second gap between two adjacent connecting portions in a direction parallel to the substrate body;

[0017] Wherein, the orthographic projections of at least two of the connecting portions on the substrate body are located within the orthographic projection of the frame on the substrate body.

[0018] Optionally, the connecting part is connected to the side of the frame opposite to the support platform on the side facing the support platform.

[0019] Optionally, the substrate includes two connecting portions, which are distributed on opposite sides of the frame; the substrate body has two clearance grooves on one side of the support platform, and the two clearance grooves correspond one-to-one with the two connecting portions.

[0020] In the extension direction parallel to the substrate body and perpendicular to the connecting portion, each connecting portion can extend into the corresponding clearance groove, and the width of each connecting portion is smaller than the width of the corresponding clearance groove.

[0021] Optionally, the frame has a light-transmitting hole, a portion of the support platform is located within the light-transmitting hole, and the inner wall of the light-transmitting hole contacts the outer surface of the support platform.

[0022] Optionally, the substrate includes two support platforms, and the frame has two light-transmitting holes corresponding one-to-one with the two support platforms;

[0023] In this configuration, a portion of the support platform is located within the corresponding light-transmitting hole, and the inner wall of the light-transmitting hole is in contact with the outer surface of the corresponding support platform.

[0024] Optionally, the substrate body, the support platform, and the connecting part are integrally molded structures made of oxygen-free copper material; the frame material includes ceramic material.

[0025] On the other hand, a light source device is also provided, comprising: a housing, and a laser mounted on the housing, wherein the laser is any of the lasers described above.

[0026] The beneficial effects of the technical solutions provided in this application include at least the following:

[0027] The substrate in the laser may include a connecting portion, and the frame in the laser may be connected to the connecting portion. The area of ​​the connection region between the connecting portion and the frame in the substrate can be smaller than the area of ​​the side of the frame facing the connecting portion. Thus, when the frame is connected to the connecting portion by welding to achieve a fixed connection between the frame and the substrate, the area of ​​the welding region between the frame and the connecting portion can be smaller than the area of ​​the side of the frame facing the connecting portion. Therefore, compared to the prior art where the side of the frame facing the substrate is welded to the substrate, the frame in this application is fixedly connected to the substrate by welding to the connecting portion, reducing the contact area between the frame and the substrate, that is, reducing the welding area between the frame and the substrate. Consequently, after the connecting portion and the frame are welded together, the residual stress between the frame and the substrate is smaller, improving the reliability of the connection between the frame and the substrate. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is an exploded view of a laser provided in an embodiment of this application;

[0030] Figure 2 This is a cross-sectional view of a laser provided in an embodiment of this application;

[0031] Figure 3 This is a top view of a substrate provided in an embodiment of this application;

[0032] Figure 4 This is a top view of another substrate provided in an embodiment of this application;

[0033] Figure 5 This is a top view of another substrate provided in the embodiments of this application;

[0034] Figure 6 This is another exploded view of a laser provided in an embodiment of this application;

[0035] Figure 7 This is a cross-sectional view of another laser provided in an embodiment of this application;

[0036] Figure 8 This is a schematic diagram of the structure of a substrate provided in an embodiment of this application;

[0037] Figure 9 This is a schematic diagram of another substrate structure provided in an embodiment of this application;

[0038] Figure 10 This is an exploded view of another laser provided in the embodiments of this application;

[0039] Figure 11 This is a cross-sectional view of another laser provided in the embodiments of this application;

[0040] Figure 12 These are comparative diagrams of a prior art and the present application, provided in an embodiment of this application;

[0041] Figure 13 This is a schematic diagram of the structure of a laser provided in an embodiment of this application;

[0042] Figure 14 This is a top view of a laser provided in an embodiment of this application;

[0043] Figure 15 This is a top view of a light-transmitting hole in a frame provided in an embodiment of this application. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0045] This application provides a laser, please refer to the embodiments thereof. Figure 1 and Figure 2 , Figure 1 This is an exploded view of a laser provided in an embodiment of this application. Figure 2 This is a cross-sectional view of a laser provided in an embodiment of this application. The laser may include: a substrate 100, a frame 200, and a light-emitting chip 300.

[0046] The substrate 100 in the laser may include: a substrate body 101, a support stage 102, and a connecting portion 103. Both the support stage 102 and the connecting portion 103 in the substrate 100 may be disposed on the substrate body 101.

[0047] The frame 200 in the laser can be distributed around the support platform 102 in the substrate 100, and the frame 200 can be connected to the connecting part 103 in the substrate 100. Here, the frame 200 can be welded to the connecting part 103 to achieve a fixed connection between the frame 200 and the substrate 100.

[0048] The light-emitting chip 300 in the laser can be fixedly connected to the side of the support platform 102 in the substrate 100 away from the substrate body 101. The light-emitting chip 300 fixed on the support platform 102 can be used to emit laser light to realize the light emission of the laser.

[0049] In this application, the area of ​​the connection region between the connecting portion 103 in the substrate 100 and the frame 200 can be smaller than the area of ​​the side of the frame 200 facing the connecting portion 103. Here, the area of ​​the connection region between the connecting portion 103 and the frame 200 is the same as the area of ​​the side of the connecting portion 103 facing the frame 200; that is, the area of ​​the side of the connecting portion 103 facing the frame 200 can be smaller than the area of ​​the side of the frame 200 facing the connecting portion 103. Thus, when the frame 200 is connected to the connecting portion 103 by welding to achieve a fixed connection between the frame 200 and the substrate 100, the area of ​​the welding region between the frame 200 and the connecting portion 103 can be smaller than the area of ​​the side of the frame 200 facing the connecting portion 103. Therefore, compared to the prior art where the side of the frame 200 facing the substrate 100 is welded to the substrate 100, in this application, the frame 200 is fixedly connected to the substrate 100 by welding to the connecting part 103. This reduces the contact area between the frame 200 and the substrate 100, which means reducing the welding area between the frame 200 and the substrate 100. Consequently, after the connecting part 103 and the frame 200 are welded together, the residual stress between the frame 200 and the substrate 100 is smaller, improving the reliability of the connection between the frame 200 and the substrate 100.

[0050] It should be noted that, in the extension direction perpendicular to the connecting portion 103, the width D1 of the area where the connecting portion 103 in the substrate 100 contacts the frame 200 can be smaller than the width D2 of the frame 200. Here, in the extension direction perpendicular to the connecting portion 103, the width D1 of the area where the connecting portion 103 contacts the frame 200 is the width of the connecting portion 103, that is, the width of the connecting portion 103 can be smaller than the width D2 of the frame 200. This ensures that the area of ​​the side of the connecting portion 103 facing the frame 200 can be smaller than the area of ​​the side of the frame 200 facing the connecting portion 103.

[0051] In summary, this application provides a laser, including a substrate, a frame, and a light-emitting chip. The substrate may include a connecting portion, and the frame may be connected to the connecting portion. The area of ​​the connection region between the connecting portion and the frame in the substrate can be smaller than the area of ​​the side of the frame facing the connecting portion. Thus, when the frame is connected to the connecting portion by welding to achieve a fixed connection between the frame and the substrate, the area of ​​the welding region between the frame and the connecting portion can be smaller than the area of ​​the side of the frame facing the connecting portion. Therefore, compared to the prior art where the side of the frame facing the substrate is welded to the substrate, the frame in this application is fixedly connected to the substrate by welding to the connecting portion, reducing the contact area between the frame and the substrate, i.e., reducing the welding area between the frame and the substrate. Consequently, after the connecting portion and the frame are welded together, the residual stress between the frame and the substrate is smaller, improving the reliability of the connection between the frame and the substrate.

[0052] In this application, the connection between the connecting portion 103 in the substrate 100 and the frame 200 can be implemented in the following two ways:

[0053] In the first implementation, such as Figure 1 As shown, the side of the connecting portion 103 in the substrate 100 facing away from the substrate body 101 can be connected to the side of the frame 200 facing the substrate body 101. That is, in the direction perpendicular to the side of the substrate body 101 where the support platform 102 is distributed, the side of the connecting portion 103 facing away from the substrate body 101 can be connected to the side of the frame 200 facing the substrate body 101. Thus, on the side parallel to the substrate body 101 where the support platform 102 is distributed, the area of ​​the side of the connecting portion 103 facing the frame 200 can be smaller than the area of ​​the side of the frame 200 facing the connecting portion 103.

[0054] In this application embodiment, the form of the connection portion 103 in the substrate 100 is various. This application embodiment will illustrate with the following two possible cases as examples:

[0055] In the first possible scenario, please refer to Figure 3 , Figure 3 This is a top view of a substrate provided in an embodiment of this application. The connecting portion 103 in the substrate 100 may be annular, and the support platform 102 may be located within the area enclosed by the connecting portion 103. That is, the connecting portion 103 in the substrate 100 may extend around the support platform 102. For example, when the orthographic projection of the support platform 102 on the substrate body 101 is rectangular, the area enclosed by the annular connecting portion 103 may also be rectangular.

[0056] In the second possible scenario, please refer to... Figure 4 , Figure 4This is a top view of another substrate provided in an embodiment of this application. The connecting portion 103 in the substrate 100 may include a plurality of sub-connecting segments 1031. The plurality of sub-connecting segments 1031 in the connecting portion 103 may be distributed around the support platform 102, and a partition groove may be provided between any two adjacent sub-connecting segments 1031 on the periphery of the support platform 102. In this way, the side of the frame 200 facing the substrate body 101 is connected to the side of the plurality of sub-connecting segments 1031 facing away from the substrate body 101. Thus, compared with the case where the connecting portion 103 is annular, the connection between the frame 200 and the plurality of sub-connecting segments 1031 can further reduce the contact area between the frame 200 and the substrate 100. Therefore, after the frame 200 and the plurality of sub-connecting segments 1031 are welded together, the welding area between the frame 200 and the substrate 100 is further reduced, thereby further reducing the residual stress between the frame 200 and the substrate 100.

[0057] Optional, such as Figure 3 and Figure 4 As shown, in the direction parallel to the substrate body 101, there may be a first gap between the connecting portion 103 and the support platform 102. That is, the connecting portions 103 distributed around the support platform 102 will not be in close contact with the support platform 102. In this way, in the direction parallel to the substrate body 101, the middle portion of the side of the frame 200 facing the connecting portion 103 can be connected to the connecting portion 103.

[0058] Optional, please refer to Figure 5 , Figure 5 This is a top view of another substrate provided in the embodiments of this application. The substrate 100 in the laser may include at least two connecting portions 103. Each connecting portion 103 in the substrate 100 may be distributed around the support platform 102, and at least two connecting portions 103 may be nested. In the direction parallel to the substrate body 101, there may be a second gap between two adjacent connecting portions 103.

[0059] It should be noted that the substrate 100 in the laser may include at least one support platform 102. For example, the substrate 100 may include two support platforms 102, and the side of each support platform 102 facing away from the substrate body 101 can be used to fix the light-emitting chip 300. Thus, when the substrate 100 includes two support platforms 102 and at least two connecting portions 103, such as Figure 3 As shown, a connecting part 103 may surround the periphery of a support platform 102, or, as... Figure 5 As shown, a support platform 102 may be surrounded by multiple connecting parts 103, and the multiple connecting parts 103 may be nested around the support platform 102.

[0060] In this configuration, the orthographic projections of at least two connecting portions 103 in the substrate 100 onto the substrate body 101 can both lie within the orthographic projection of the frame 200 onto the substrate body 101. Thus, in a direction perpendicular to the substrate body 101, the side of the frame 200 facing the substrate body 101 can be connected to the side of a connecting portion 103 distributed around the support platform 102 that is away from the substrate body 101, or it can be connected to the side of multiple connecting portions 103 distributed around the support platform 102 that is away from the substrate body 101.

[0061] In this application, the ratio between the area of ​​the connection region between the connecting part 103 and the frame 200 and the area of ​​the side of the frame 200 facing the connecting part 103 can be between one-eighth and one-quarter. In this way, while ensuring that the fixed connection between the frame 200 and the substrate 100 through the connecting part 103 is relatively stable, it can also ensure that the contact area between the frame 200 and the substrate 100 is small.

[0062] It should be noted that, to ensure that the ratio between the area of ​​the connection region between the connecting portion 103 and the frame 200 and the area of ​​the side of the frame 200 facing the connecting portion 103 is between one-eighth and one-quarter, in the extension direction parallel to the substrate body 101 and perpendicular to the connecting portion 103, the ratio between the width D1 of the area where the connecting portion 103 contacts the frame 200 and the width D2 of the frame 200 can be between one-eighth and one-quarter. For example, in the extension direction parallel to the substrate body 101 and perpendicular to the connecting portion 103, the width D2 of the frame 200 can be 8 mm, and the width D1 of the area where the connecting portion 103 contacts the frame 200, that is, the width of the connecting portion 103, can be between 1 mm and 2 mm.

[0063] It should also be noted that when the side of the frame 200 facing the substrate body 101 is connected to the side of a connecting portion 103 distributed around the support platform 102 away from the substrate body 101, the ratio between the area of ​​the side of this connecting portion 103 facing the frame 200 and the area of ​​the side of the frame 200 facing the connecting portion 103 can range from one-eighth to one-quarter. When the side of the frame 200 facing the substrate body 101 is connected to the side of multiple connecting portions 103 distributed around the support platform 102 away from the substrate body 101, the ratio between the sum of the areas of the sides of the multiple connecting portions 103 facing the frame 200 and the area of ​​the side of the frame 200 facing the connecting portion 103 can range from one-eighth to one-quarter.

[0064] For the second implementation method, please refer to... Figure 6 and Figure 7 , Figure 6 This is another exploded view of a laser provided in an embodiment of this application. Figure 7This is a cross-sectional view of another laser provided in an embodiment of this application. The side of the connecting portion 103 in the substrate 100 facing the support platform 102 can be connected to the side of the frame 200 away from the support platform 102. Here, the frame 200 is distributed around the support platform 102. In the direction parallel to the side of the substrate body 101 where the support platform 102 is distributed, the connecting portion 103 can be distributed around the support platform 102, and the frame 200 can be located between the connecting portion 103 and the support platform 102. In this way, the side of the connecting portion 103 facing the support platform 102 can be connected to the side of the frame 200 away from the support platform 102.

[0065] Optionally, the substrate 100 may include two connecting portions 103, and these two connecting portions 103 may be distributed on opposite sides of the frame 200. In this way, in the direction parallel to the side of the substrate body 101 where the support platform 102 is distributed, both opposite sides of the frame 200 can be connected to the connecting portions 103 in the substrate 100, making the connection between the frame 200 and the substrate 100 more secure.

[0066] Optional, such as Figure 7 As shown, the substrate body 101 in the substrate 100 may have two clearance grooves K on one side of the distribution support platform 102, and these two clearance grooves K may correspond one-to-one with two connecting portions 103. In the extending direction parallel to the substrate body 101 and perpendicular to the connecting portion 103, each connecting portion 103 can extend into the corresponding clearance groove K, and the width D3 of each connecting portion 103 may be smaller than the width D4 of the corresponding clearance groove K.

[0067] It should be noted that, as Figure 6 and Figure 7 As shown, in the second optional implementation, the ratio between the area of ​​the connection region between the connecting part 103 and the frame 200 and the area of ​​the side of the frame 200 facing the connecting part 103 can be between one-eighth and one-quarter.

[0068] It should be noted that, as Figure 8 As shown, Figure 8 This is a schematic diagram of a substrate structure provided in an embodiment of this application. In this application, the substrate body 101 of the substrate 100 may have a recessed groove U. In a direction parallel to the substrate body 101, the recessed groove U may penetrate through portions of two opposing sides of the substrate body 101, and the side of the substrate body 101 where the support platform 102 is distributed may be recessed so that the support platform 102 can be located within the recessed groove U. That is, the recessed groove U may have a bottom surface P1 and two opposing sides P2. The support platform 102 in the substrate 100 may be located on the bottom surface P1 of the recessed groove U.

[0069] In the first implementation, such as Figure 8 As shown, the connecting portion 103 in the substrate 100 can be located in the recessed groove U and can be distributed around the support platform 102 on the bottom surface P1. In the direction perpendicular to the bottom surface P1 of the recessed groove U, the side of the connecting portion 103 in the substrate 100 away from the substrate body 101 can be connected to the side of the frame 200 facing the substrate body 101.

[0070] In the second implementation, such as Figure 9 As shown, Figure 9 This is a schematic diagram of another substrate structure provided in an embodiment of this application. The side of the frame 200 facing away from the support platform 102 can be directly connected to the side surface P2 of the recessed groove U. Alternatively, the connecting part 103 in the substrate 100 can be fixed on the side surface P2 of the recessed groove U and extend into the recessed groove U in a direction parallel to the bottom surface P1 of the recessed groove U, so that the side of the connecting part 103 facing the support platform 102 can be connected to the side of the frame 200 facing away from the support platform 102.

[0071] It should be noted that in the second implementation method, such as Figure 9 As shown, the two clearance grooves K of the substrate body 101 can be respectively distributed on two opposite sides P2 of the recessed groove U, and in the direction perpendicular to the bottom surface P1 of the recessed groove U, the clearance grooves K can be far away from the frame 200 relative to the recessed groove U. That is, in the direction perpendicular to the bottom surface P1 of the recessed groove U, after the side of the frame 200 facing the substrate body 100 contacts the bottom surface P1 of the recessed groove U, a part of the frame 200 can be suspended on the side of the clearance groove K facing the frame 200. And in the direction parallel to the bottom surface P1 of the recessed groove U, a part of the groove K can penetrate the side surface P2 of the recessed groove K, so that the connecting part 103 connected to the side surface of the recessed groove U can extend into the corresponding clearance groove K.

[0072] Please refer to the following in this application: Figure 10 and Figure 11 , Figure 10 This is an exploded view of another laser provided in the embodiments of this application. Figure 11 This is a cross-sectional view of another laser provided in an embodiment of this application. The frame 200 in the laser may have a light-transmitting hole V, and a portion of the support platform 102 may be located within the light-transmitting hole V, with the inner wall of the light-transmitting hole V in contact with the outer surface of the support platform 102. In this way, the light-emitting chip 300, which is fixed to the side of the support platform 102 away from the substrate body 101, can be sealed within the light-transmitting hole V of the frame 200.

[0073] Here, in this application, as Figure 10As shown, the laser may further include a light-transmitting sealing cover 400, which may be located on the side of the frame 200 away from the substrate 100, and may cover the light-transmitting through-hole V. Therefore, the light-emitting chip 300, fixed to the support platform 102 on the side away from the substrate body 101, can be sealed within the light-transmitting through-hole V by the support platform 102, the frame 200, and the light-transmitting sealing cover 400. Furthermore, the laser emitted by the light-emitting chip 400 can pass through the light-transmitting through-hole V and through the light-transmitting sealing cover 400 before exiting to the outside of the laser, thus enabling the laser to emit laser light.

[0074] In this application, the substrate 100 may include two support platforms 102, and the frame 200 may have two light-transmitting holes V corresponding one-to-one with the two support platforms 102. A portion of each support platform 102 may be located within the corresponding light-transmitting hole V, and the inner wall of each light-transmitting hole V may contact the outer surface of the corresponding support platform 102. Here, a light-transmitting sealing cover plate 400 located on the side of the frame 200 opposite to the substrate 100 may simultaneously cover both light-transmitting holes V to seal the light-emitting chips 300 located on the two support platforms 102.

[0075] Optionally, in the first implementation, such as Figure 11 As shown, in the direction perpendicular to the substrate body 101, the height H1 of the connecting portion 103 can be less than or equal to the height H2 of the support platform 102. Here, when the height H1 of the connecting portion 103 is less than the height H2 of the support platform 102, after the side of the connecting portion 103 facing away from the substrate body 101 is connected to the side of the frame 200 facing the substrate body 101, a portion of the support platform 102 can be located within the light-transmitting hole V of the frame 200, and the light-emitting chip fixed to the side of the support platform 102 facing away from the substrate body 101 can be sealed within the light-transmitting hole. When the height H1 of the connecting portion 103 is equal to the height H2 of the support platform 102, after the side of the connecting portion 103 facing away from the substrate body 101 is connected to the side of the frame 200 facing the substrate body 101, the entire support platform 102 is surrounded by the connecting portion 103.

[0076] It should be noted that when the connecting portion 103 is annular, after the side of the connecting portion 103 facing away from the substrate body 101 is welded to the side of the frame 200 facing the substrate body 101, the light-emitting chip 300 fixed on the support platform 102 surrounded by the annular connecting portion 103 can be sealed by the connecting portion 103 and the frame 200. Thus, whether the height H1 of the connecting portion 103 is less than the height H2 of the support platform 102, or whether the height H1 of the connecting portion 103 is equal to the height H2 of the support platform 102, the light-emitting chip 300 fixed on the side of the support platform 102 facing away from the substrate body 101 can be sealed.

[0077] When the connecting portion 103 includes a plurality of sub-connecting segments 1031, and there is a partition groove between any two adjacent sub-connecting segments 1031, the height H1 of the connecting portion 103 in the direction perpendicular to the substrate body 101 needs to be less than the height H2 of the support platform 102, so as to ensure that after the side of the connecting portion 103 away from the substrate body 101 is connected to the side of the frame 200 facing the substrate body 101, the light-emitting chip 300 fixed on the support platform 102 can be sealed by the outer side of the support platform 102 and the inner wall of the light-transmitting through hole V.

[0078] It should be noted that in the second implementation, in the direction perpendicular to the side of the substrate body 101 where the support platform 102 is distributed, the side of the frame 200 facing the substrate body 101 can contact the side of the substrate body 101 where the support platform 102 is distributed. In this way, the support platform 102 can be completely located within the light-transmitting hole V of the frame 200, and the inner wall of the light-transmitting hole V can contact the outer side of the support platform 102, so that the light-emitting chip 300 fixed on the side of the support platform 102 away from the substrate body 101 can be sealed within the light-transmitting hole V.

[0079] In this application, the material of the substrate 100 may include various types. The embodiments of this application will be illustrated with the following two possible cases as examples:

[0080] In the first case, the substrate body 101 in the substrate 100 may include a circuit board, and the support platform 102 in the substrate 100 may have conductive parts. The conductive parts in the support platform 102 may be electrically connected to the light-emitting chip 300 and the circuit in the circuit board, respectively. Here, the circuit in the circuit board may be electrically connected to an external power source. Thus, through the conductive parts in the support platform 102 and the circuit board, the light-emitting chip 300 can be electrically connected to the external power source. In this way, the external power source can provide current to the light-emitting chip 300 to excite the light-emitting chip 300 to emit laser light.

[0081] In the second case, the substrate body 101, support platform 102, and connecting portion 103 in the substrate 100 can be an integrally molded structure made of oxygen-free copper. Here, oxygen-free copper is a heat dissipation material with excellent heat dissipation performance. Thus, after the light-emitting chip 300 is fixed on the side of the support platform 102 away from the substrate body 101, the heat generated by the light-emitting chip 300 during laser emission can be conducted away by the substrate 100 made of oxygen-free copper, ensuring the heat dissipation effect of the laser.

[0082] In the prior art, the substrate body in the substrate is made of Kovar alloy, the support platform in the substrate is made of oxygen-free copper, and the substrate body and the support platform are manufactured separately and then welded together.

[0083] Under the same heat dissipation conditions, for example, at a heat flux density of 4.747 × 10⁻⁶. 6 W / m 2 The heat transfer coefficient of the side of the substrate away from the light-emitting chip is 5000 W / m. 2 The heat transfer coefficient of the side of the support platform where the light-emitting chip is fixed is 10 W / m. 2 In the prior art, the temperature of the side of the support stage where the light-emitting chip is fixed can reach 125.6°C, and the temperature of the side of the substrate away from the light-emitting chip can reach 118.7°C. In this application, the temperature of the side of the support stage 102 in the substrate where the light-emitting chip is fixed can be 59.7°C, and the temperature of the side of the substrate body 101 away from the support stage 102 can be 118.7°C.

[0084] Therefore, the substrate 100 in this application is made of oxygen-free copper, which can ensure that during the process of the light-emitting chip 300 emitting laser, more of the heat emitted by the light-emitting chip 300 can be conducted to the outside through the substrate 100, so as to ensure that the laser has a good heat dissipation effect.

[0085] In this application, the material of the frame 200 in the laser may include ceramic materials. For example, the material of the frame 200 may be alumina or aluminum nitride. It should be noted that the coefficient of thermal expansion of ceramic materials differs significantly from that of oxygen-free copper materials. For example, the coefficient of thermal expansion of aluminum nitride is 4.8 × 10⁻⁶. -6 The thermal expansion coefficient of oxygen-free copper is 16.5 × 10⁻⁶ K. -6 1 / K. If the oxygen-free copper substrate and the ceramic frame are directly welded together, there will be a large welding stress, i.e., residual stress, between the oxygen-free copper substrate and the ceramic frame after welding, resulting in low reliability of the connection between the substrate and the frame.

[0086] Therefore, in this application, a connecting portion 103 is provided on the substrate 100, and the frame 200 can be welded to the connecting portion 103 to achieve a fixed connection between the frame 200 and the substrate 100. Since the area of ​​the region where the connecting portion 103 contacts the frame 200 is smaller than the area of ​​the side of the frame 200 facing the connecting portion 103 in the extension direction perpendicular to the connecting portion 103, the welding surface area between the connecting portion 103 and the frame 200 is smaller. Consequently, after the connecting portion 103 and the frame 200 are welded together, the residual stress between the frame 200 and the substrate 100 is smaller, thus improving the reliability of the connection between the frame 200 and the substrate 100.

[0087] like Figure 12 As shown, Figure 12 These are comparative diagrams of a prior art and the present application, provided in the embodiments of this application. Figure 12In the diagram, the horizontal axis represents the distance from the center of the weld, and the vertical axis represents the residual stress. From Figure 11 As can be seen, compared with the welding of oxygen-free copper substrate and ceramic frame in the prior art, in this application, after the frame 200 and the connecting part 103 are welded together, the residual stress between the frame 200 and the substrate 100 at the weld is significantly smaller, so the reliability of the connection between the frame 200 and the substrate 100 is higher.

[0088] It should be noted that in the second case, please refer to... Figure 13 , Figure 13 This is a schematic diagram of a laser structure provided in an embodiment of this application. The laser may further include conductive pins 501. A portion of the conductive pins 501 located within the area enclosed by the frame 200 can be used for electrical connection with the light-emitting chip 300, while a portion of the conductive pins 501 located outside the area enclosed by the frame 200 can be used for electrical connection with an external circuit. Thus, the conductive pins 501 enable electrical connection between the light-emitting chip 300 and an external power source. The external power source can then supply current to the light-emitting chip 300 to excite it to emit laser light.

[0089] In the second case, please refer to Figure 14 and Figure 15 , Figure 14 This is a top view of a laser provided in an embodiment of this application. Figure 15 This is a top view of a light-transmitting hole in a frame according to an embodiment of this application. The laser may further include: multiple light-emitting chips 300, multiple conductive pins 501, multiple conductive parts 502, and multiple wires 503. The multiple light-emitting chips 300 in the laser can be arranged in an array on the side of the support platform 102 away from the substrate body 101. For example, the multiple light-emitting chips 300 can be arranged in multiple columns. The multiple conductive pins 501 in the laser can be fixedly connected to two opposite sidewalls in the frame 200. The multiple conductive parts 502 in the laser can be fixed on the frame 200, and the multiple conductive parts 502 can correspond one-to-one with the multiple conductive pins 501. Each conductive pin 501 can be fixedly connected to the corresponding conductive part 502. The light-emitting chips 300 can be electrically connected to the conductive parts 502 through the wires 503.

[0090] Here, the multiple light-emitting chips 300 in the laser may include: a light-emitting chip 301 for emitting red laser light, a light-emitting chip 302 for emitting blue laser light, and a light-emitting chip 303 for emitting green laser light. Multiple light-emitting chips 300 emitting laser light of the same color can be arranged in a row and connected in series via wires 503. Two light-emitting chips at opposite ends of the series-connected chips can be electrically connected to two conductive parts 502, respectively. Two conductive pins 501, electrically connected to these two conductive parts 502, can be connected to the positive and negative terminals of an external power supply, respectively. The external power supply can then provide current to the light-emitting chips through the conductive pins 501 and the conductive parts 502, thereby exciting the series-connected light-emitting chips to emit laser light.

[0091] In this application, the number of conductive pins 501 in the laser can vary depending on the different arrangements of the light-emitting chips 300 used to emit lasers of different colors on the support stage 102.

[0092] In one possible case, such as Figure 14 As shown, on the side of one of the two support platforms 102 of the substrate 100 away from the substrate body 101, four light-emitting chips 301 for emitting red lasers can be fixed, and these four light-emitting chips 301 for emitting red lasers can be arranged in a row. On the side of the other support platform 102 away from the substrate body 101, three light-emitting chips 302 for emitting green lasers and two light-emitting chips 303 for emitting blue lasers can be fixed, and these three light-emitting chips 302 for emitting green lasers and two light-emitting chips 303 for emitting blue lasers can be arranged in a row.

[0093] In this way, the four light-emitting chips 301 used to emit red laser light can be connected in series by wires 503, and the two light-emitting chips 301 located at both ends of these four light-emitting chips 301 can be electrically connected to two conductive parts 502 respectively, and then electrically connected to the positive and negative terminals of an external power supply respectively through two conductive pins 501. For this purpose, the part of the support platform 102 surrounding the four light-emitting chips 301 used to emit red laser light in the frame 200 can be fixed with two conductive parts 502 and two conductive pins 501.

[0094] Similarly, three light-emitting chips 302 for emitting green laser light can be connected in series via wires 503. The two end chips 302 can be electrically connected to two conductive parts 502, and then to the positive and negative terminals of an external power supply via two conductive pins 501. Two light-emitting chips 303 for emitting blue laser light can be connected in series via wires 503. These two chips 303 can be electrically connected to two conductive parts 502, and then to the positive and negative terminals of an external power supply via two conductive pins 501. Therefore, the portion of the frame 200 surrounding the support platform 102 that holds the three light-emitting chips 302 and two light-emitting chips 303 can be fixed with four conductive parts 502 and four conductive pins 501.

[0095] In another possible case, such as Figure 15 As shown, each of the two support platforms 102 in the substrate 100 can be fixed with three light-emitting chips 301 for emitting red laser, two light-emitting chips 302 for emitting green laser, and one light-emitting chip 303 for emitting blue laser. Furthermore, the three light-emitting chips 301 for emitting red laser, the two light-emitting chips 301 for emitting green laser, and the one light-emitting chip 303 for emitting blue laser can be arranged in a row on one support platform 102.

[0096] In this way, three light-emitting chips 301 for emitting red laser light can be connected in series via wires 503. The two end chips 301 can be electrically connected to two conductive parts 502, and then connected to the positive and negative terminals of an external power supply via two conductive pins 501. Two light-emitting chips 302 for emitting green laser light can be connected in series via wires 503. These two chips 302 can be electrically connected to two conductive parts 502, and then connected to the positive and negative terminals of an external power supply via two conductive pins 501. One light-emitting chip 302 for emitting green laser light can be electrically connected to two conductive parts 502, and then connected to the positive and negative terminals of an external power supply via two conductive pins 501. Therefore, the portion of the frame 200 surrounding a support platform 102 can be fixed with three conductive parts 502 and three conductive pins 501.

[0097] It should be noted that, in the arrangement direction of a row of light-emitting chips, multiple conductive parts 502 can be evenly distributed on both sides of the row of light-emitting chips. The laser may also include a transition platform 504. When the distance between the light-emitting chip and the conductive part 502 to which the light-emitting chip is to be connected is relatively large, the light-emitting chip can first be electrically connected to the transition platform 504 through a wire 503, and the transition platform 504 can then be electrically connected to the conductive part 502 through another wire 503, thus realizing the electrical connection between the light-emitting chip and the corresponding conductive part 502.

[0098] In summary, this application provides a laser, including a substrate, a frame, and a light-emitting chip. The substrate may include a connecting portion, and the frame may be connected to the connecting portion. The area of ​​the connection region between the connecting portion and the frame in the substrate can be smaller than the area of ​​the side of the frame facing the connecting portion. Thus, when the frame is connected to the connecting portion by welding to achieve a fixed connection between the frame and the substrate, the area of ​​the welding region between the frame and the connecting portion can be smaller than the area of ​​the side of the frame facing the connecting portion. Therefore, compared to the prior art where the side of the frame facing the substrate is welded to the substrate, the frame in this application is fixedly connected to the substrate by welding to the connecting portion, reducing the contact area between the frame and the substrate, i.e., reducing the welding area between the frame and the substrate. Consequently, after the connecting portion and the frame are welded together, the residual stress between the frame and the substrate is smaller, improving the reliability of the connection between the frame and the substrate.

[0099] This application also provides a light source device, which may include a housing and a laser mounted on the housing. The laser in the light source device can be any of the lasers described above. Here, this light source device can be used to provide laser light when installed in a laser device.

[0100] This application also provides a laser projection device, which may include a light source device, a light modulation device, and a projection lens. The light source device in the laser projection device can be the light source device described above. The light modulation device in the laser projection device can be located on the light-emitting side of the light source device, and the projection lens can be located on the light-emitting side of the light modulation device. The light modulation device in the laser projection device can be used to modulate the light emitted from the light source device to modulate the illumination beam incident on it into a projection beam according to the image signal, and project the projection beam onto the projection lens. The projection lens in the laser projection device can project the projection beam to form an image.

[0101] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0102] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser, characterized in that, include: Substrate, frame, and light-emitting chip; The substrate includes: a substrate body, a support platform, and a connecting portion, wherein the support platform and the connecting portion are both disposed on the substrate body; The frame is distributed around the support platform, and the frame is connected to the connecting part; The light-emitting chip is fixedly connected to the support platform on the side opposite to the substrate body; Wherein, the area of ​​the connection region between the connecting part and the frame is smaller than the area of ​​the side of the frame facing the connecting part.

2. The laser according to claim 1, characterized in that, The connecting part is connected to the side of the frame facing the substrate body on the side away from the substrate body.

3. The laser according to claim 2, characterized in that, The connecting part is annular, and the support platform is located within the area enclosed by the connecting part; Alternatively, the connecting portion may include a plurality of sub-connecting segments distributed around the support platform, and a partition groove between any two adjacent sub-connecting segments distributed around the periphery of the support platform.

4. The laser according to claim 2, characterized in that, In the direction perpendicular to the substrate body, the height of the connecting portion is less than or equal to the height of the support platform.

5. The laser according to claim 2, characterized in that, In a direction parallel to the substrate body, there is a first gap between the connecting portion and the support platform.

6. The laser according to claim 2, characterized in that, The substrate includes at least two connecting portions, each of which is distributed around the support platform, and at least two connecting portions are nested together. In a direction parallel to the substrate body, there is a second gap between two adjacent connecting portions. Wherein, the orthographic projections of at least two of the connecting portions on the substrate body are located within the orthographic projection of the frame on the substrate body.

7. The laser according to claim 1, characterized in that, The connecting part is connected to the side of the frame facing away from the support platform.

8. The laser according to claim 7, characterized in that, The substrate includes two connecting portions, which are distributed on opposite sides of the frame; the substrate body has two clearance grooves on one side of the support platform, and the two clearance grooves correspond one-to-one with the two connecting portions. In the extension direction parallel to the substrate body and perpendicular to the connecting portion, each connecting portion can extend into the corresponding clearance groove, and the width of each connecting portion is smaller than the width of the corresponding clearance groove.

9. The laser according to any one of claims 1 to 8, characterized in that, The frame has a light-transmitting hole, a portion of the support platform is located within the light-transmitting hole, and the inner wall of the light-transmitting hole is in contact with the outer surface of the support platform.

10. The laser according to claim 9, characterized in that, The substrate includes two support platforms, and the frame has two light-transmitting holes that correspond one-to-one with the two support platforms. In each of the support platforms, a portion is located within the corresponding light-transmitting hole, and the inner wall of each light-transmitting hole is in contact with the outer surface of the corresponding support platform.

11. The laser according to claim 10, characterized in that, The substrate body, the support platform, and the connecting part are integrally molded structures made of oxygen-free copper material; the frame is made of ceramic material.

12. A light source device, characterized in that, It includes: a housing, and a laser mounted on the housing, the laser being the laser according to any one of claims 1 to 11.

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