Laser module and preparation method thereof

Abstract

The invention discloses a laser module and a preparation method thereof, and relates to the technical field of sensors. The preparation method of the laser module comprises the steps that a substrate, a light-emitting part and a lens are provided, and position marks are arranged on the substrate, the light-emitting part and the lens; the light-emitting part is attached to the first surface of the substrate according to the position identification; the lens comprises a lens group and a support for fixing the lens group, the lens is installed on the first surface of the substrate according to the position identification, the support is connected with the edge of the substrate, and the support occupies a preset length in the light beam propagation direction so that a preset distance can be formed between the lens group and the light-emitting part; and supplying power to the substrate through the substrate, and testing the performance of the laser module. According to the laser module and the preparation method thereof, the assembly efficiency of the laser module can be improved.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and more specifically, to a laser module and its fabrication method. Background Technology

[0002] In recent years, line laser modules have been widely used in service robots, robotic vacuum cleaners, intelligent security systems, and industrial vision due to their advantages such as compact structure, high ranging accuracy, and strong resistance to ambient light interference. They have become one of the core components for realizing environmental perception and obstacle avoidance functions. Line laser modules are typically composed of key components such as a substrate, light-emitting elements (such as laser diodes), optical lenses, and image sensors. Their manufacturing process mainly includes die bonding, wire bonding, active alignment (AA), functional testing, and appearance inspection.

[0003] The image-adjusting (AA) process is a crucial step that determines the imaging quality and assembly precision of the line laser module. Traditional AA processes require first powering on the image sensor to output a real-time image, then using a six-axis precision adjustment platform to fine-tune the lens in the X, Y, and Z translational degrees of freedom and the pitch, yaw, and roll rotational degrees of freedom. This is combined with an image sharpness evaluation algorithm for iterative adjustments until the position with the clearest image is found. Finally, the lens and sensor are fixed together by dispensing adhesive for curing. This process relies on a complex image acquisition and analysis system and is time-consuming.

[0004] Currently, the single-station output efficiency of mainstream AA equipment in the industry is generally only around 100 pcs / H. This inefficient AA process not only severely restricts overall production capacity but also causes products completed in previous processes (such as die bonding and wire bonding) to wait a long time before being put into production, resulting in a backlog of semi-finished products on the production line. Prolonged turnover can easily lead to problems such as chip surface contamination and pad oxidation; if the time limit is exceeded, rework and cleaning are required, significantly increasing process complexity and manufacturing costs. Summary of the Invention

[0005] The purpose of this application is to provide a laser module and its manufacturing method, which can improve the assembly efficiency of the laser module.

[0006] The embodiments of this application are implemented as follows: A first aspect of this application provides a method for fabricating a laser module, comprising: providing a substrate, a light-emitting element, and a lens, wherein the substrate, the light-emitting element, and the lens are all provided with position marks; mounting the light-emitting element onto a first surface of the substrate according to the position marks; the lens includes a lens group and a bracket for fixing the lens group, the lens is mounted on the first surface of the substrate according to the position marks, and the bracket is connected to the edge of the substrate, the bracket occupies a preset length in the beam propagation direction so that the lens group and the light-emitting element have a preset distance; supplying power to the light-emitting element through the substrate; and testing the performance of the laser module.

[0007] As one possible implementation, mounting a light-emitting element onto a first surface of a substrate according to a position mark includes: placing the substrate and the light-emitting element in a mounting device; a first camera of the mounting device identifying the substrate and a first position mark on the substrate; a second camera of the mounting device identifying the light-emitting element and a second position mark on the light-emitting element; the mounting device picking up the light-emitting element and moving it, aligning the first position mark with the second position mark and fixing the substrate and the light-emitting element.

[0008] As one possible implementation, mounting a lens on a first surface of a substrate according to a position mark includes: placing a substrate with the light-emitting element attached and a lens inside a mounting device; a first camera of the mounting device identifying the substrate and a third position mark on the substrate; a second camera of the mounting device identifying the lens and a fourth position mark on the lens; the mounting device grasping the lens and moving it to make the third position mark coincide with the fourth position mark, and using adhesive to bond the substrate and the bracket.

[0009] In one possible implementation, the substrate is a ceramic substrate, and the bonding of the substrate and the support using a fixative includes: applying a fixative to the edge of the substrate; and moving the gripping lens of the mounting equipment toward the substrate so that the lens contacts and presses against the substrate so that the thickness of the fixative is less than 10 micrometers.

[0010] As one possible implementation, when the lens contacts and presses against the substrate, the pressure between the bracket and the substrate is between 150-250g.

[0011] In one possible implementation, two circles are spaced apart on the substrate. The first position is marked by the line connecting the centers of the two circles. The light-emitting element includes multiple light-emitting holes arranged in a row. The second position is marked by the line connecting the centers of the two light-emitting holes.

[0012] As one possible implementation, an identification structure is laid on the substrate. The identification structure is square with two missing corners, and the two missing corners are arranged along the diagonal. The third position is marked as the midpoint of the line connecting the two missing corners, and the fourth position is marked as the center of the circular mirror in the mirror assembly.

[0013] In one possible implementation, the bracket includes a connecting portion connected to the substrate. The connecting portion has different structures at both ends along a first direction and the same structures at both ends along a second direction, thereby determining the mounting direction of the bracket.

[0014] As one possible implementation, before providing the substrate, the light-emitting element, and the lens, the method for preparing the laser module further includes: calculating and obtaining the position deviation range of the lens based on the error range of the laser beam width, and controlling the position deviation range when mounting the lens on the first surface of the substrate according to the position marking.

[0015] A second aspect of this application provides a laser module, which is prepared using the laser module preparation method described above.

[0016] The beneficial effects of the embodiments of this application include: The method for fabricating a laser module according to an embodiment of this application includes: providing a substrate, a light-emitting element, and a lens, wherein position marks are provided on the substrate, the light-emitting element, and the lens; mounting the light-emitting element onto a first surface of the substrate according to the position marks; the lens includes a lens group and a bracket for fixing the lens group, the lens is mounted on the first surface of the substrate according to the position marks, and the bracket is connected to the edge of the substrate, the bracket occupies a preset length in the beam propagation direction, since the bracket is a relatively stable fix, when the bracket is fixed to the substrate, the distance between the light-emitting element and the lens group is a fixed distance, so that the light from the light-emitting element travels a fixed distance to reach the lens group, thereby achieving the best focusing effect. After installation, the light-emitting element is powered by the substrate, and the performance of the laser module is tested. This embodiment of the application uses pre-set position marks to guide the precise positioning of the light-emitting element and the lens, specifically, high-precision position marks are pre-set on the substrate, the light-emitting element, and the lens. During assembly, these marks are identified by a vision system to achieve rapid and precise positioning between the components. The bracket is set with a fixed extension length, so that it automatically ensures that the preset optical path distance is maintained between the lens group and the light-emitting element after installation, without the need for subsequent focus adjustment. This avoids the need for repeated lens position adjustments in traditional AA processes, simplifies the assembly process, reduces time wastage due to fine-tuning and the need for complex image processing and analysis, thereby improving the assembly efficiency of laser modules. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is one of the flowcharts illustrating a method for fabricating a laser module according to an embodiment of this application; Figure 2 This is one of the state diagrams for a method of fabricating a laser module provided in an embodiment of this application; Figure 3 This is the second state diagram of a method for fabricating a laser module according to an embodiment of this application. Figure 4 This is a second flowchart illustrating a method for fabricating a laser module according to an embodiment of this application. Figure 5This is the third flowchart of a method for fabricating a laser module provided in this application embodiment; Figure 6 This is one of the schematic diagrams of the optical path of a laser module provided in the embodiments of this application; Figure 7 This is a second schematic diagram of the optical path of a laser module provided in an embodiment of this application.

[0019] Icons: 110-substrate; 120-light-emitting element; 130-lens; 131-support; 132-lens group. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.

[0021] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] The existing laser module fabrication methods mainly use the AA process to assemble the substrate, light-emitting components, and lens, which requires a long time.

[0024] This application provides a method for preparing a laser module, such as... Figure 1 As shown, it includes: S100: Provides a substrate 110, a light-emitting element 120, and a lens 130, wherein position marks are provided on the substrate 110, the light-emitting element 120, and the lens 130; Specifically, the substrate 110 contains circuitry for the power interface and control terminal of the light-emitting element 120. Position markers are provided on the substrate 110, the light-emitting element 120, and the lens 130. The specific position markers are not limited in this embodiment, but those skilled in the art can set them according to actual conditions.

[0025] The light-emitting element 120 can be a laser diode or other light source. In practical applications, the lens includes a collimating lens and a wave lens arranged along the optical path, such as... Figure 6 As shown in the embodiment of this application, the collimating lens and the wave lens are connected by an ultrasonic hot-melt process as a whole, and are connected before being mounted on the substrate.

[0026] S200: such as Figure 2 As shown, the light-emitting element 120 is mounted on the first surface of the substrate 110 according to the position markings; The light-emitting element 120 is mounted on the first surface of the substrate 110 according to the position marking, and physical and electrical connections are achieved during mounting.

[0027] It is understood that the substrate 110 also has a second surface opposite to the first surface. After the light-emitting element 120 is attached to the first surface of the substrate 110, the light-emitting element 120 is electrically connected to the first surface of the substrate 110, and the power interface control terminal is guided to the second surface of the substrate 110 through the lines in the substrate 110.

[0028] S300: such as Figure 3 As shown, the lens 130 includes a lens group 132 and a bracket 131 for fixing the lens group 132. The lens 130 is mounted on the first surface of the substrate 110 according to the position marking, and the bracket 131 is connected to the edge of the substrate 110. The bracket 131 occupies a preset length in the beam propagation direction so that the lens group 132 and the light-emitting element 120 have a preset distance.

[0029] Lens 130 consists of lens group 132 and bracket 131. The bracket 131 is used to fix lens group 132. In step S300, according to the position mark, lens 130 is mounted on the first surface of substrate 110, and bracket 131 is connected to the edge of substrate 110. Bracket 131 occupies a certain preset length in the beam propagation direction. Since bracket 131 is a relatively stable fixation, when it is fixed to substrate 110, the distance between light-emitting element 120 and lens group 132 is a fixed distance. In this way, after the light comes out from light-emitting element 120, it travels a fixed distance to reach lens group 132, thereby achieving the best focusing effect.

[0030] Understandably, the distance of the bracket 131 in the beam propagation direction ensures the distance between the lens group 132 and the light-emitting element 120, thereby achieving focusing.

[0031] It should be noted that before providing the substrate 110, the light-emitting element 120, and the lens 130 in step S100, the specific structure of the laser module needs to be designed. Specifically, optical simulation can be used to determine the specific parameters and relative positional relationships of the substrate 110, the light-emitting element 120, and the lens 130, namely, the size of the substrate 110 and its position markings; the length, light-emitting parameters, and position markings of the light-emitting element 120; and the number and parameters of the lens group 132 in the lens 130, and the distance between it and the light-emitting element 120.

[0032] S400: Power is supplied to the light-emitting element 120 via the substrate 110, and the performance of the laser module is tested. Specifically, the light-emitting element 120 is powered on and illuminated. At this time, the light-emitting element 120 emits a light beam, which is collimated and shaped by the lens 130 before being emitted, forming a light spot at a preset position. The performance of the laser module is obtained through the shape and parameters of the light spot. Because the specific structure of the laser module in this application is designed, the yield rate is relatively high.

[0033] This embodiment uses pre-set position markers to guide the precise positioning of the light-emitting element 120 and the lens 130. Specifically, high-precision position markers are pre-set on the substrate 110, the light-emitting element 120, and the lens 130. During assembly, these markers are identified by a vision system, enabling rapid and precise positioning between components. The bracket 131 is configured with a fixed extension length, automatically ensuring a preset optical path distance between the lens assembly 132 and the light-emitting element 120 after installation, eliminating the need for post-assembly focus adjustment. This avoids the repeated adjustment of the lens 130 position required in traditional AA processes, simplifies the assembly process, reduces time wasted due to fine-tuning and the need for complex image processing and analysis, thereby improving the assembly efficiency of the laser module.

[0034] Furthermore, since it eliminates the need for high-precision six-axis motors for fine adjustments and extensive image analysis calculations, the equipment design can be simplified, reducing hardware costs. Simultaneously, higher production efficiency means fewer machines are needed to produce the same output, further saving on investment costs. The rapid and precise assembly process reduces the time semi-finished products spend on the production line, lowering the risk of contamination or oxidation, and also reducing the need for re-cleaning due to overruns, thus simplifying the production process.

[0035] Optionally, the light-emitting element 120 is mounted on the first surface of the substrate 110 according to the position markings, such as... Figure 4 As shown, it includes: S210: The substrate 110 and the light-emitting element 120 are placed in the mounting equipment; The substrate 110 to be processed and the light-emitting component 120 to be mounted are placed into the working area of ​​the automated mounting equipment to prepare for subsequent visual recognition and mounting.

[0036] S220: The first camera of the mounting equipment identifies the substrate 110 and the first position mark on the substrate 110; The first camera in the device captures an image of the substrate 110 and identifies a first position mark pre-set on the substrate 110 to determine the precise coordinates and orientation of the substrate 110 in space.

[0037] S230: The second camera of the mounting equipment identifies the light-emitting element 120 and the second position mark on the light-emitting element 120; The second camera captures an image of the light-emitting element 120 and identifies the second position mark on it.

[0038] S240: The mounting equipment picks up the light-emitting component 120 and moves it, aligning the first position mark with the second position mark and fixing the substrate 110 and the light-emitting component 120.

[0039] The control system calculates the path and attitude adjustment amount that the light-emitting element 120 should move based on the position information obtained by the two cameras, so that the second position mark on the light-emitting element 120 is precisely aligned in space with the first position mark on the substrate 110, and then the light-emitting element 120 is mounted and fixed on the substrate 110.

[0040] The method of fixing the substrate 110 and the light-emitting element 120 is not limited in this embodiment. For example, tin, gold, etc. can be used for fixing and connecting, so as to achieve electrical connection on the basis of physical connection.

[0041] Specifically, the positions of the first and second cameras are not limited. For example, they can be positioned above the substrate 110. The first camera locates the substrate 110 by its shape and then finds the first position marker on the substrate 110. Similarly, the second camera can be positioned on the gripping assembly of the mounting equipment. The gripping assembly captures an image of the light-emitting element 120, locates the light-emitting element 120 by its shape, and then finds the second position marker on the light-emitting element 120.

[0042] By aligning with dual position markers, the mounting offset caused by substrate 110 deformation, light-emitting element 120 dimensional errors, or equipment mechanical errors is significantly reduced, thus improving mounting accuracy. Therefore, this embodiment of the application uses dual cameras to identify the position markers of substrate 110 and light-emitting element 120 respectively, achieving high-precision image-based alignment and mounting.

[0043] As one possible implementation, the lens 130 is mounted on the first surface of the substrate 110 according to a location marker, such as... Figure 5As shown, it includes: S310: The substrate 110 on which the light-emitting element 120 is mounted and the lens 130 are disposed in the mounting equipment; The substrate 110 and the lens 130 to be installed are now placed together in an automated mounting device to prepare for subsequent alignment and assembly.

[0044] S320: The first camera of the mounting equipment identifies the substrate 110 and the third position mark on the substrate 110; The first camera in the device captures an image of the substrate 110 and identifies a preset third position marker on the substrate 110. This marker is used to determine the precise position, angle, and possible deformation information of the substrate 110 in the device coordinate system.

[0045] S330: The second camera recognition lens 130 of the mounting equipment and the fourth position mark on the lens 130; The second camera captures images of lens 130 and identifies the fourth position mark on its body, thereby obtaining the geometric center, orientation, and deviation of lens 130 itself.

[0046] S340: The mounting equipment picks up the lens 130 and moves it to make the third position mark coincide with the fourth position mark, and uses adhesive to bond the substrate 110 and the bracket 131.

[0047] The control system calculates the path that the lens 130 needs to move and rotate based on the position data collected by the two cameras, so that the fourth position mark on the lens 130 is precisely aligned with the third position mark on the substrate 110 in space. Then, the device places the lens 130 in place and applies fixing adhesive through the dispensing mechanism to firmly bond the lens 130 to the substrate 110.

[0048] By using dual cameras to identify dedicated position marks on the substrate 110 and lens 130 respectively, high-precision automatic alignment and adhesive fixation based on images are achieved.

[0049] Optionally, the substrate 110 is a ceramic substrate 110, and the substrate 110 and the support 131 are bonded together using a fixative, including: S331: Apply fixative to the edge of substrate 110; S332: The mounting equipment moves the gripping lens 130 toward the substrate 110, so that the lens 130 contacts and presses against the substrate 110, so that the thickness of the fixing adhesive is less than 10 micrometers.

[0050] After the mounting equipment picks up the lens 130, it moves it vertically downward to contact the substrate 110 and applies controllable pressure to make the adhesive be evenly squeezed and stretched, ultimately forming an ultra-thin adhesive layer with a thickness of less than 10 micrometers. This thickness is ensured by the equipment's pressure control, stroke control, and adhesive quantity preset.

[0051] Compared to the existing technology where the thickness of the fixing adhesive is 100-150 micrometers, the embodiments of this application control the thickness of the fixing adhesive to within 10 micrometers. In this way, the limit of the movement and tilt of the lens 130 along the optical axis is also within 10 micrometers, which significantly reduces the height deviation of the lens 130 caused by uneven adhesive thickness, helps to ensure the focal length consistency of the optical system, and ensures the mounting accuracy of the lens 130.

[0052] In order to control the thickness of the adhesive to within 10 micrometers, this embodiment of the application presses the lens 130 into contact with the substrate 110. During the pressing process, excess adhesive will be squeezed out, thereby controlling the thickness of the adhesive.

[0053] It is understandable that the adhesive will spread outwards during the pressing process. To facilitate the spread of the adhesive, it is best to choose an adhesive with a high thixotropic coefficient.

[0054] The ceramic substrate 110 has advantages such as high thermal conductivity, low coefficient of thermal expansion, good electrical insulation, and strong dimensional stability. It is not easily deformed by heat, resulting in high flatness. This ensures a relatively uniform thickness of the adhesive during pressing, guaranteeing the mounting accuracy of the bracket 131 on the outer periphery of the substrate 110. Furthermore, the ceramic substrate 110 has high hardness, making it less prone to deformation during pressing.

[0055] As one possible approach, when the lens 130 contacts and presses against the substrate 110, the pressure between the bracket 131 and the substrate 110 is between 150 and 250 g.

[0056] The fixing adhesive has a certain viscosity and flowability. Given the amount of adhesive and the contact area, the greater the pressure, the thinner the adhesive layer. Through experiments or simulations, it can be determined that under a pressure of 150–250 g, the adhesive layer can be stably controlled within 10 micrometers without producing voids or overflow.

[0057] The ceramic substrate 110 has high hardness but is also brittle, while the support 131 is mostly made of metal or engineering plastic. A pressure range of 150–250 g can ensure good contact and adhesive spread without causing the ceramic to crack or the support 131 to deform.

[0058] The pressure is between 150-250g, which is approximately 1.47–2.45 mN of force.

[0059] Optional, such as Figure 2 As shown, two circles are spaced apart on the substrate 110. The first position is marked by the line connecting the centers of the two circles. The light-emitting element 120 includes multiple light-emitting holes arranged in a row. The second position is marked by the line connecting the centers of the two light-emitting holes.

[0060] On the first surface of substrate 110, two separate circular marks are pre-fabricated (e.g., by photolithography, screen printing, or laser marking). These marks have a defined geometric center and are spaced a certain distance from each other. The centers of these two circles are connected by a straight line, which serves as the first position marker for substrate 110. This line contains not only positional information (X / Y coordinates) but also implicit directional information (angle θ), which can be used to correct for rotational deviations of substrate 110.

[0061] The light-emitting element 120 has multiple light-emitting holes for emitting light, which are arranged in a row along a straight line at equal or non-equal intervals. The center points of the leftmost and rightmost holes in the row are selected, and the line connecting these two points is used as the second position marker of the light-emitting element 120. This line also represents the position and orientation of the light-emitting element 120.

[0062] The two circular marks on the substrate 110 and the light-emitting holes at both ends of the light-emitting element 120 are respectively converted into linear reference marks with directional information, and the vision system achieves high-precision alignment of the three key planar degrees of freedom (X, Y, θ) in the six degrees of freedom.

[0063] in, Figure 2 The substrate 110 in the image only shows the portion connected to the light-emitting element 120, which makes the first position mark more clearly visible.

[0064] As an feasible approach, such as Figure 3 As shown, an identification structure is laid on the substrate 110. The identification structure is square with two missing corners, and the two missing corners are arranged along the diagonal. The third position is marked as the midpoint of the line connecting the two missing corners, and the fourth position is marked as the center of the circular mirror in the mirror assembly 132.

[0065] On the first surface of substrate 110, a specially shaped identification structure is formed. The identification structure is generally square, but one corner is cut off at each of its two opposite corners (e.g., the upper left and lower right corners), forming two symmetrical notches. The notches break the fourfold rotational symmetry of the square, giving it a unique orientation. After the vision system identifies the positions of the two notches, it connects the vertices of the two notches to form a diagonal. The midpoint of the diagonal is defined as the third position identifier of substrate 110. This midpoint not only represents the precise coordinates (X, Y) of substrate 110 on the plane, but also implies a unique reference direction because the notches are set along the diagonal.

[0066] Lens group 132 typically includes one or more circular optical lenses. The vision system identifies the outer contour of the mirror surface through image processing (such as edge detection and circle fitting) and calculates its geometric center. This center point is the fourth position marker of lens 130, representing the projection position of the optical axis of lens 130 on the plane.

[0067] This application embodiment employs a square recognition structure with diagonal notches, using the midpoint of the line connecting the notches as the third position marker, and the geometric center of the circular mirror surface of lens 130 as the fourth position marker, thus constructing a high-precision, directionally clear, and non-marking visual alignment system. It effectively solves the two major problems of positional offset and directional confusion during lens 130 installation, significantly improving the assembly accuracy of the laser module.

[0068] Specifically, such as Figure 3 As shown, the identification structure can be formed of white oil, so that the white oil serves as both an identification structure and a protection for the components on the substrate 110.

[0069] Optionally, the bracket 131 includes a connecting portion connected to the substrate 110. The two ends of the connecting portion have different structures along the first direction and the two ends have the same structure along the second direction, so as to determine the mounting direction of the bracket 131.

[0070] The bracket 131 is a structural component used to support or fix the lens assembly 132. Its bottom has a connecting portion for attaching or bonding with the substrate 110. The connecting portion has different geometric shapes at its left and right ends in the first direction, while having the same geometric shape at its left and right ends in the second direction. This asymmetrical arrangement breaks the mirror symmetry of the connecting portion. Since the structure is asymmetrical only in the first direction and symmetrical in the second direction, the entire bracket 131 has a unique correct installation orientation to match the polarity of the lens assembly 132, thus utilizing the asymmetry of the physical structure to achieve error-proof installation.

[0071] As one feasible approach, before providing the substrate 110, the light-emitting element 120, and the lens 130, the method for fabricating the laser module further includes: S010: As Figure 6 and Figure 7 As shown, the position deviation range of the lens 130 is calculated based on the error range of the laser beam width, and the position deviation range is controlled when the lens 130 is mounted on the first surface of the substrate 110 according to the position mark.

[0072] like Figure 6 As shown, when lens group 132 is at its optimal focal position, the light emitted by the light-emitting element 120, after passing through the collimating lens of lens group 132, is collimated into a parallel beam at a fixed divergence angle. This parallel beam is then shaped into a linear beam by the wavy mirror of lens group 132, and the optimal focal point of this beam falls precisely on the screen at a fixed position. At this point, the beam spot is at its finest and most optimal state. However, in actual production, due to various issues, it is difficult to ensure that lens 130 falls precisely at the focal position. Figure 7As shown, when there is a difference between the lens group 132 and the focal point, the width of the beam spot will become wider. By using the allowable range of beam width given by the user, the range of vertical deviation of the lens 130 can be deduced. When the lens 130 is mounted on the first surface of the substrate 110 according to the position marking, the position deviation range is controlled to make the laser module meet the user's requirements.

[0073] For example, when the installation accuracy is calculated to be ±40 micrometers based on the allowable range of the wire harness width provided by the user, the above installation can be performed using a mounting device with an accuracy within ±25um.

[0074] exist Figure 6 and Figure 7 In this paper, the lens group 132 is described using a collimating lens and a wave mirror as examples, but this is not a limitation on the lens group 132. Those skilled in the art can set the specific structure of the lens group 132 according to the actual situation.

[0075] To further verify the beneficial effects of the laser module provided in the embodiments of this application, a comparison is made between the existing technology and the preparation method of this application. Specifically, the advantages and disadvantages of the two processes are compared based on a monthly production capacity of 500k and a 5-day, 8-hour work schedule, as shown in the table below: Table 1: Comparison of Existing Technology and the Production Capacity and Investment of this Application

[0076] As shown in Table 1, the UPH (Uptime Per Hour) in the prior art is around 100pcs, while the UPH of this application can reach around 1000-1500pcs, reducing equipment and manpower investment. Furthermore, the increased UPH means that semi-finished products before HM (High-End Manufacturing) are processed without excessive accumulation, significantly reducing transit time and shortening the production cycle. In contrast, the prior art only achieves 100pcs / H / unit, and the high cost of the equipment makes it difficult to invest in a large number of units. Therefore, in the prior art, semi-finished products accumulate for a long time before AA (Advanced Processing) before being put into production. Prolonged storage of semi-finished products leads to various problems, such as particulate contamination, oxidation, and moisture. The laser module prepared using the method of this application achieves a yield of 99%, while the yield of the prior art is generally around 97%.

[0077] This application also provides a laser module, which is fabricated using the laser module fabrication method described above. Since the structure and beneficial effects of the laser module have been described in detail in the foregoing embodiments, they will not be repeated here.

[0078] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0079] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A method for fabricating a laser module, characterized in that, include: A substrate, a light-emitting element, and a lens are provided, wherein position marks are provided on the substrate, the light-emitting element, and the lens; The light-emitting element is attached to the first surface of the substrate according to the location marking; The lens includes a lens assembly and a bracket for fixing the lens assembly. The lens is mounted on the first surface of the substrate according to the position marking, and the bracket is connected to the edge of the substrate. The bracket occupies a preset length in the beam propagation direction so that the lens assembly and the light-emitting element have a preset distance. The performance of the laser module is tested by powering the light-emitting element through the substrate.

2. The method for preparing a laser module according to claim 1, characterized in that, The step of attaching the light-emitting element to the first surface of the substrate according to the position mark includes: The substrate and the light-emitting element are disposed in the mounting equipment; The first camera of the mounting equipment identifies the substrate and the first position mark on the substrate; The second camera of the mounting equipment identifies the light-emitting element and the second position mark on the light-emitting element; The mounting equipment picks up and moves the light-emitting component, aligns the first position mark with the second position mark, and fixes the substrate and the light-emitting component.

3. The method for preparing a laser module according to claim 2, characterized in that, The step of mounting the lens onto the first surface of the substrate according to the position mark includes: The substrate with the light-emitting element mounted thereon and the lens are placed inside the mounting equipment; The first camera of the mounting equipment identifies the substrate and a third position mark on the substrate; The second camera of the mounting equipment identifies the lens and the fourth position mark on the lens; The mounting equipment picks up the lens and moves it to make the third position mark coincide with the fourth position mark, and uses adhesive to bond the substrate and the bracket.

4. The method for preparing a laser module according to claim 3, characterized in that, The substrate is a ceramic substrate, and the substrate and the support are bonded together using a fixative adhesive, including: A fixing adhesive is applied to the edge of the substrate; The mounting device moves its gripping lens toward the substrate, causing the lens to contact and press against the substrate, so that the thickness of the adhesive is less than 10 micrometers.

5. The method for preparing a laser module according to claim 4, characterized in that, When the lens contacts and presses against the substrate, the pressure between the bracket and the substrate is between 150-250g.

6. The method for preparing a laser module according to claim 2, characterized in that, Two circles are spaced apart on the substrate. The first position is marked by the line connecting the centers of the two circles. The light-emitting element includes multiple light-emitting holes arranged in a row. The second position is marked by the line connecting the centers of the two light-emitting holes.

7. The method for preparing a laser module according to claim 3, characterized in that, An identification structure is laid on the substrate. The identification structure is square with two missing corners, and the two missing corners are arranged along the diagonal. The third position is marked as the midpoint of the line connecting the two missing corners, and the fourth position is marked as the center of the circular mirror in the mirror assembly.

8. The method for preparing a laser module according to claim 2, characterized in that, The bracket includes a connecting portion connected to the substrate. The two ends of the connecting portion have different structures along a first direction and the two ends have the same structure along a second direction, so as to determine the installation direction of the bracket.

9. The method for preparing a laser module according to claim 1, characterized in that, Before providing the substrate, the light-emitting element, and the lens, the method further includes: The position deviation range of the lens is calculated based on the error range of the laser beam width, and the position deviation range is controlled when the lens is mounted on the first surface of the substrate according to the position mark.

10. A laser module, characterized in that, It is prepared using the laser module preparation method according to any one of claims 1 to 9.

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