Circuit board processing method and device

Abstract

The invention discloses a circuit board processing method and device.The circuit board processing method comprises the steps that a step board is processed through a second processing technology to form a multi-layer circuit board with an outer layer circuit, the step board is a multi-layer board with a step groove, and the second processing technology comprises a solder mask layer printing technology; the solder mask layer printing process comprises the steps that a solder mask layer is printed on the top surface of a stepped groove of the multi-layer board through a first parameter, the solder mask layer is printed on the bottom surface of the stepped groove through a second parameter, and the first parameter comprises a first printing height, a first printing voltage and a first ink temperature; the second parameter comprises a second printing height, a second printing voltage and a second ink temperature, and at least one corresponding parameter in the first parameter and the second parameter is not equal. The solder mask layers on the outer surface of the circuit board and the bottom surface of the stepped groove are printed by adopting different parameters, so that the same or similar printing precision can be formed on the bottom surface and the top surface of the stepped groove, and the product quality is improved.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, specifically to a circuit board processing method and apparatus. Background Technology

[0002] With the increasing demand for electronic products, stepped circuit boards (PCBs) are used to improve product performance, assembly density, and reduce weight and volume. A stepped circuit board is a multilayer circuit board with stepped grooves. During the manufacturing process, a solder resist layer is typically applied to the surface of the stepped circuit board and the bottom wall of the stepped grooves. Currently, the solder resist layer is usually made using screen printing or electrostatic spraying. However, this method of solder resist manufacturing may have the following problems: due to the height difference in the stepped circuit board, solder resist exposure and development may result in quality defects such as oil accumulation, poor exposure, and incomplete development. Summary of the Invention

[0003] In order to overcome the problems existing in the prior art, the main objective of this application is to provide a circuit board processing method and apparatus that can improve product quality.

[0004] To achieve the above objectives, this application specifically adopts the following technical solution:

[0005] This application provides a method for fabricating a circuit board, the method comprising:

[0006] The stepped board is processed using a second processing technology to form a multilayer circuit board with outer layer circuitry, wherein the stepped board is a multilayer board with stepped grooves.

[0007] The second processing technology includes a solder resist printing process, which includes: printing a solder resist layer on the top surface of the stepped groove of the multilayer board using a first parameter, and printing a solder resist layer on the bottom surface of the stepped groove of the multilayer board using a second parameter. The first parameter includes a first printing height, a first printing voltage, and a first ink temperature. The second parameter includes a second printing height, a second printing voltage, and a second ink temperature. At least one of the first parameter and the second parameter is not equal.

[0008] This embodiment uses different parameters to print the solder resist layer on the outer surface of the circuit board and the bottom surface of the stepped groove, so as to ensure that ink splattering does not occur when printing the solder resist layer, thereby improving product quality.

[0009] In some embodiments, when the first printing height is less than the second printing height, the first printing voltage is less than the second printing voltage, and / or the first ink temperature is greater than the second ink temperature;

[0010] When the first printing height is equal to the second printing height, the first printing voltage is equal to the second printing voltage, and the first ink temperature is equal to the second ink temperature.

[0011] In this embodiment, when the first printing height is less than the second printing height, the first printing voltage is less than the second printing voltage, and / or the first ink temperature is greater than the second ink temperature; when the first printing height is equal to the second printing height, the first printing voltage is equal to the second printing voltage, and the first ink temperature is equal to the second ink temperature, so that the same or similar printing accuracy can be formed on both the bottom and top surfaces of the stepped groove, thereby improving product quality.

[0012] In some embodiments, the stepped groove has multiple bottom surfaces. When the first printing height is less than the second printing height, along the depth direction of the stepped groove, the second printing voltage corresponding to the solder resist layer on the bottom surface with a greater distance from the top surface of the stepped groove is higher, and the second ink temperature is lower. This embodiment makes the second ink temperature lower as the depth of the stepped groove increases, thereby adapting the ink temperature to stepped grooves of different depths, ensuring that ink splatter does not occur when printing the solder resist layer, and improving product quality.

[0013] In some embodiments, the solder resist printing process includes:

[0014] The top and bottom surfaces of the stepped grooves in the multilayer board are roughened.

[0015] The top and bottom surfaces of the stepped grooves of the multilayer board after the roughening treatment are subjected to anti-seepage treatment;

[0016] A solder resist layer is printed on the top and bottom surfaces of the stepped groove of the multilayer board after the aforementioned anti-seepage treatment.

[0017] The top and bottom surfaces of the stepped grooves of the multilayer board on which the solder resist layer has been printed are cured.

[0018] This embodiment improves the bonding strength of the corresponding areas of the circuit board by roughening the outer surface of the multilayer circuit board and the bottom surface of the stepped groove. It also improves the resolution of the printed image by applying an anti-seepage treatment to the outer surface of the multilayer circuit board and the bottom surface of the stepped groove. By printing a solder resist layer on the outer surface of the multilayer circuit board and the bottom surface of the stepped groove, the solder resist layer can be applied to areas that do not need to be soldered, preventing solder from flowing and overflowing and causing short circuits. The curing process allows the solder resist layer to solidify quickly.

[0019] In some embodiments, the first printing height ranges from 1mm to 1.5mm, and the second printing height ranges from 1.5mm to 2mm. In this embodiment, setting the first printing height to 1mm to 1.5mm, combined with appropriate printing temperature and voltage, can improve printing accuracy.

[0020] In some embodiments, the first printing voltage ranges from 5V to 8V, the second printing voltage ranges from 5.5V to 8.5V, and the first ink temperature and the second ink temperature range from 40℃ to 50℃. This embodiment improves the accuracy of printing pressure by using different voltages—5V to 8V for the first printing voltage and 5.5V to 8.5V for the second printing voltage—to print on the surface of the circuit board and the bottom surface of the stepped grooves, ensuring that the ink is printed onto the circuit board with appropriate pressure.

[0021] In some embodiments, the temperature range of the first ink and the second ink is 40°C to 50°C. This embodiment uses different ink temperatures to print the surface of the circuit board and the bottom surface of the stepped grooves, ensuring that ink scattering does not occur when printing the solder resist layer, thus improving product quality.

[0022] In some embodiments, the second processing technology further includes drilling, copper plating, full-board electroplating, outer layer pattern transfer, pattern electroplating, and outer layer etching.

[0023] In some embodiments, prior to processing the stepped plate using the second processing method, the method further includes:

[0024] The substrate is processed using the first processing technology to form the inner core board;

[0025] The inner core board is pressed together using a lamination process to form a multilayer board;

[0026] The multilayer board is processed using a controlled-depth milling process to form a stepped board with stepped grooves.

[0027] The first processing technology includes material cutting, inner layer pattern transfer, and etching.

[0028] In some embodiments, the process of using controlled-depth milling to process the multilayer board specifically includes:

[0029] A controlled-depth milling process is used to process multilayer boards to form stepped grooves with a depth of no more than 2 mm. The printing voltage and ink temperature ranges in this embodiment are adapted to stepped grooves with a depth of no more than 2 mm, improving the printing efficiency of stepped grooves.

[0030] Accordingly, this application also provides a circuit board processing apparatus, the circuit board processing apparatus comprising:

[0031] The second processing mechanism is used to process the stepped board based on the second processing technology to form a multilayer circuit board with outer layer circuits, wherein the stepped board is a multilayer board with stepped grooves.

[0032] The second processing mechanism is used to process the stepped board based on the second processing technology to form a multilayer circuit board with outer layer circuits, wherein the stepped board is a multilayer board with stepped grooves.

[0033] The second processing technology includes a solder resist printing process, which includes: printing a solder resist layer on the top surface of the stepped groove of the multilayer board using a first parameter, and printing a solder resist layer on the bottom surface of the stepped groove of the multilayer board using a second parameter. The first parameter includes a first printing height, a first printing voltage, and a first ink temperature. The second parameter includes a second printing height, a second printing voltage, and a second ink temperature. At least one of the first parameter and the second parameter is not equal.

[0034] This embodiment uses different parameters to print the solder resist layer on the outer surface of the circuit board and the bottom surface of the stepped groove, so as to ensure that ink splattering does not occur when printing the solder resist layer, thereby improving product quality.

[0035] In some embodiments, the second processing mechanism includes:

[0036] The roughening unit is used to roughen the top and bottom surfaces of the stepped grooves in the multilayer board.

[0037] The seepage prevention unit is used to perform seepage prevention treatment on the top and bottom surfaces of the stepped groove of the multilayer board after the roughening treatment.

[0038] A printing unit is used to print a solder resist layer on the top and bottom surfaces of the stepped grooves of the multilayer board after the anti-seepage treatment.

[0039] A curing unit is used to cure the top and bottom surfaces of the stepped grooves of the multilayer board on which the solder resist layer has been printed.

[0040] This embodiment improves the bonding strength of the corresponding areas of the circuit board by roughening the outer surface of the multilayer circuit board and the bottom surface of the stepped groove. It also improves the resolution of the printed image by applying an anti-seepage treatment to the outer surface of the multilayer circuit board and the bottom surface of the stepped groove. By printing a solder resist layer on the outer surface of the multilayer circuit board and the bottom surface of the stepped groove, the solder resist layer can be applied to areas that do not need to be soldered, preventing solder from flowing and overflowing and causing short circuits. The curing process allows the solder resist layer to solidify quickly.

[0041] The circuit board processing method of this application includes: processing the stepped board using a second processing technology to form a multilayer circuit board with outer layer circuitry, wherein the stepped board is a multilayer board with stepped grooves, and the second processing technology includes a solder resist printing process, which includes: printing a solder resist layer on the top surface of the stepped groove of the multilayer board using a first parameter, and printing a solder resist layer on the bottom surface of the stepped groove using a second parameter, wherein the first parameter includes a first printing height, a first printing voltage, and a first ink temperature, and the second parameter includes a second printing height, a second printing voltage, and a second ink temperature, and at least one of the first and second parameters is not equal. Compared with the prior art, this application uses a first parameter to print solder resist on the outer surface of the multilayer circuit board and uses a second parameter to print a solder resist layer on the bottom surface of the stepped groove of the stepped board, and at least one of the first and second parameters is not equal, so that the same or similar printing accuracy can be formed on both the bottom and top surfaces of the stepped groove, thereby improving product quality. Attached Figure Description

[0042] Figure 1 A flowchart illustrating a circuit board fabrication method provided in an embodiment of this application.

[0043] Figure 2 A flowchart illustrating the specific steps of the solder mask printing process provided in this application embodiment.

[0044] Figure 3 A block diagram of a circuit board processing apparatus provided in an embodiment of this application.

[0045] Figure 4 This is a schematic diagram illustrating the relationship between the depth of the stepped groove and the ink temperature, provided in an embodiment of this application.

[0046] Figure 5 A cross-sectional view of the stepped plate provided in an embodiment of this application.

[0047] Figure 6 A cross-sectional view of another stepped plate provided in an embodiment of this application.

[0048] Attached image labels:

[0049] 100. Circuit board; 101. Stepped groove; 101a. Bottom surface of the first groove; 101b. Bottom surface of the second groove; 101c. Bottom surface of the third groove. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0051] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0052] In the description of this specification, it should be understood that the directional terms such as "upper" and "lower" used in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should also be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0053] In related technologies, there are three main methods for manufacturing stepped circuit boards. The first method involves forming inner core boards through processes such as material cutting, inner layer pattern transfer, and etching; then laminating the inner core boards to form a multilayer board; then controlling the depth of the multilayer board to form a multilayer board with stepped grooves; then drilling, copper plating, full-board electroplating, outer layer pattern transfer, pattern electroplating, outer layer etching, and coating with solder mask are performed on the multilayer board with stepped grooves to form a multilayer circuit board with outer layer circuitry; finally, the multilayer circuit board undergoes surface treatment, molding, and final inspection to obtain the finished product. However, the first method may have the following defects in the solder resist manufacturing process: when manufacturing the solder resist layer by screen printing or electrostatic spraying, due to the height difference of the stepped plate, the exposure energy can only meet the needs of the upper surface of the stepped plate (the top plane of the stepped groove), while the energy is insufficient for the bottom surface of the stepped groove. The edges of the exposed pattern may become blurred, resulting in poor exposure. Furthermore, solder resist exposure and development may also result in quality defects such as oil accumulation and incomplete development. Even if the upper surface of the stepped plate and the bottom surface of the stepped groove are exposed separately, and the energy is increased when exposing the pattern on the bottom surface of the stepped groove, the problem of blurred exposed patterns will still occur because the parallelism of the light will deteriorate as the distance between the light source and the exposed surface increases. The second method involves creating a window in the inner layer plate (coating the solder resist layer in a localized area of ​​the groove bottom), embedding a Teflon sheet inside the window, and removing the Teflon sheet after pressing and molding to form the stepped groove. The third method involves using non-adhesive PP sheets and creating openings at the corresponding stepped platforms on these sheets (with a solder resist layer applied to a localized area at the bottom of the inner layer). The outer layer is then opened during the pressing process to form the stepped groove. However, both the second and third methods share a drawback: during the second pressing, insufficient adhesion between the ink at the bottom of the groove and the substrate of the inner layer (bottom substrate) can lead to ink blistering or even peeling, failing to meet quality requirements.

[0054] In the following description, it should be noted that a circuit board refers to a structure used for interconnecting chips or circuit devices, including but not limited to PCB boards and ceramic circuit boards.

[0055] Reference Figure 1 As shown in the figure, an embodiment of this application discloses a circuit board processing method, which includes the following steps:

[0056] S11. The substrate is processed using the first processing technology to form the inner core board.

[0057] Specifically, the first processing technology includes material cutting, inner layer pattern transfer, and etching. Material cutting refers to the process of cutting large, standardized boards produced by the manufacturer into sizes that conform to the actual usage dimensions according to the dimensions of the drawings used; inner layer pattern transfer refers to transferring the shape of the pattern circuitry to the printed circuit board; and etching is a technique for removing unwanted material from the surface of the substrate.

[0058] S12. The inner core board is pressed together using a pressing process to form a multilayer board.

[0059] Specifically, multiple inner core boards are stacked in a layered manner, and then pressed together to form a multilayer board. The pressing process refers to stacking the patterned inner core boards in a certain order, and then bonding them together under specific conditions, such as a high-temperature and high-pressure environment.

[0060] S13. The multilayer board is processed using controlled depth milling technology to form a stepped board with stepped grooves.

[0061] Specifically, after the inner core boards are laminated to form a multilayer board, the multilayer board undergoes controlled-depth milling to create a stepped board with stepped grooves. Controlled-depth milling is a process that uses a milling cutter to mill stepped grooves of a certain depth into the circuit board without milling through it. The stepped groove can be a stepped groove with a single bottom surface; for example, a stepped groove can have only one step structure, as shown in the reference section. Figure 5 As shown, in Figure 5 In the circuit board 100, a stepped groove 101 is formed, and the stepped groove 101 has only one bottom surface. The stepped groove can also be a stepped groove with multiple bottom surfaces; for example, the stepped groove can have a structure with multiple steps, see reference [reference needed]. Figure 6 As shown, in Figure 6 In the circuit board 100, a stepped groove 101 is provided. The stepped groove has multiple bottom surfaces, namely a first bottom surface 101a, a second bottom surface 101b, and a third bottom surface 101c.

[0062] In this embodiment, a controlled-depth milling process can be used to process the multilayer board to form a stepped groove of a certain depth. In some embodiments, the depth of the stepped groove is no greater than 2mm. For example, the depth of the stepped groove can be 2mm, 1.8mm, 1.5mm, 1mm, 0.5mm, etc.

[0063] S14. The stepped board is processed using the second processing technology to form a multilayer circuit board with outer layer circuitry.

[0064] Specifically, the second processing technology is used to manufacture the outer layer circuitry of a multilayer board, and may include at least one or a combination of multiple processes such as drilling, copper plating, full-board electroplating, outer layer pattern transfer, pattern electroplating, outer layer etching, and solder mask printing. Drilling refers to the process of creating holes (or grooves) on an exposed printed circuit board; copper plating refers to depositing a thin layer of copper on the entire printed circuit board (especially the hole walls) to allow for subsequent in-hole electroplating, enabling the copper inside the hole to conduct and achieve interlayer conductivity; full-board electroplating refers to electroplating the entire printed circuit board; outer layer pattern transfer refers to printing the circuit pattern onto the circuit board using photosensitive dry film and photography methods; pattern electroplating refers to electroplating only the required pattern areas; outer layer etching refers to removing unwanted material from the surface of the stepped board; and solder mask printing refers to forming a solder mask layer on the circuit board through printing. The solder mask layer is a non-wiring layer of the circuit board, where solder resist is applied to areas that do not require soldering to prevent solder flow and overflow, which could cause short circuits.

[0065] Reference Figure 2 As shown, the solder mask printing process specifically includes the following steps:

[0066] S101. Roughen the top and bottom surfaces of the stepped grooves in the multilayer board.

[0067] Specifically, roughening treatment refers to the process of forming a unique uneven shape and organic film on the surface of the circuit board to improve the adhesion strength. This can be achieved using an ultra-low etching method. In some embodiments, the surface of the circuit board and the bottom surfaces of each stepped groove can be roughened to a roughness Ra of 0.1 μm to 0.6 μm, thereby increasing the adhesion between the ink and the copper surface. Specifically, the roughness Ra of the surface of the circuit board and the bottom surfaces of each stepped groove can be 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, etc., preferably 0.2 μm to 0.5 μm.

[0068] S102. The top and bottom surfaces of the stepped grooves of the roughened multilayer board are treated to prevent seepage.

[0069] Specifically, the anti-seepage treatment refers to coating the outer surface of the circuit board and the bottom surface of the stepped grooves with a layer of organic film to prevent ink from spreading, improve the resolution of the printed image, and enhance the adhesion between the ink and the copper layer, thereby improving reliability. In this embodiment, the anti-seepage treatment can be applied to the surface of the circuit board and the bottom surfaces of each stepped groove to improve the resolution of the printed image.

[0070] S103. Print a solder resist layer on the top and bottom surfaces of the stepped groove of the multilayer board after it has been treated for waterproofing.

[0071] Specifically, in the solder resist printing process, a first parameter can be used to print a solder resist layer on the outer surface of a multilayer circuit board, and a second parameter can be used to print a solder resist layer on the bottom surface of a stepped groove. The first parameter includes a first printing height, a first printing voltage, and a first ink temperature, and the second parameter includes a second printing height, a second printing voltage, and a second ink temperature. At least one of the first and second parameters is not equal to the corresponding parameter. For example, the first printing height is not equal to the second printing height, or the first printing voltage is not equal to the second printing voltage, or the first ink temperature is not equal to the second ink temperature.

[0072] In this embodiment, when the first printing height is less than the second printing height, the first printing voltage is less than the second printing voltage, and the first ink temperature is greater than the second ink temperature. Furthermore, as the depth of the stepped groove increases, the second printing voltage increases, and the second ink temperature decreases. (Refer to...) Figure 4 As shown, when the depth of the stepped groove is 0.5 mm, the ink temperature is approximately 47°C; when the depth of the stepped groove is 0.9 mm, the ink temperature is approximately 44°C; and when the depth of the stepped groove is 1.8 mm, the ink temperature is approximately 40°C. Of course, in other embodiments, when the first printing height is less than the second printing height, the first printing voltage may be less than the second printing voltage, or the first ink temperature may be greater than the second ink temperature.

[0073] In another embodiment, when the first printing height is equal to the second printing height, the first printing voltage is equal to the second printing voltage, and the first ink temperature is equal to the second ink temperature.

[0074] In this embodiment, the first printing height ranges from 1mm to 1.5mm, and the second printing height ranges from 1.5mm to 2mm. When the printing height is 1mm to 1.5mm, the printing accuracy can be improved by combining it with the corresponding printing temperature and printing voltage.

[0075] In this embodiment, the first printing voltage ranges from 4V to 10V, the second printing voltage ranges from 4.5V to 11V, and the first ink temperature and the second ink temperature range from 30℃ to 60℃. Specifically, the first printing voltage can be 4V, 5V, 6V, 7V, 8V, 9V, 10V, etc., the second printing voltage can be 4.5V, 5V, 6V, 7V, 8V, 9V, 10V, 11V, etc., and the first ink temperature and the second ink temperature can be 30℃, 35℃, 40℃, 45℃, 50℃, 55℃, 60℃, etc. For example, when the first printing height is less than the second printing height, the printing voltage of the printing device can be adjusted to 5V, the ink temperature can be adjusted to 50℃, and then a solder resist layer can be printed on the outer surface of the multilayer circuit board. Then, the printing voltage can be adjusted to 5.5V, the ink temperature can be adjusted to 45℃, and then a solder resist layer can be printed on the bottom surface of the stepped groove of the multilayer circuit board.

[0076] In some embodiments, if the stepped groove has multiple bottom surfaces, then along the depth direction of the stepped groove, the solder resist layer corresponding to the bottom surface of the groove with a greater distance from the surface of the circuit board has a higher printing voltage and a lower printing ink temperature. (Refer to...) Figure 6 As shown, exemplarily, the printing voltage of the solder resist layer on the bottom surface 101c of the third slot is greater than the printing voltage of the solder resist layer on the upper surface of the circuit board, and the printing ink temperature of the solder resist layer on the bottom surface 101c of the third slot is less than the printing ink temperature of the solder resist layer on the upper surface of the circuit board; the printing voltage of the solder resist layer on the bottom surface 101b of the second slot is greater than the printing voltage of the solder resist layer on the bottom surface 101c of the third slot, and the printing ink temperature of the solder resist layer on the bottom surface 101b of the second slot is less than the printing ink temperature of the solder resist layer on the bottom surface 101c of the third slot; the printing voltage of the solder resist layer on the bottom surface 101a of the first slot is greater than the printing voltage of the solder resist layer on the bottom surface 101b of the second slot, and the printing ink temperature of the solder resist layer on the bottom surface 101a of the first slot is less than the printing ink temperature of the solder resist layer on the bottom surface 101b of the second slot.

[0077] S104. Curing the top and bottom surfaces of the stepped grooves of the multilayer board with the printed solder resist layer.

[0078] Specifically, curing refers to the initial curing of ink to achieve its reliability. The curing method can be at least one of UV light curing and heat curing.

[0079] S15. After surface treatment and molding, the multilayer circuit board undergoes final inspection to obtain the finished product.

[0080] The surface treatment of circuit boards includes hot air leveling, organic coating, electroless nickel / immersion gold plating, immersion silver, immersion tin, etc.

[0081] Specifically, after the stepped board is processed into a multi-layer circuit board through the second processing technology, the multi-layer circuit board is then surface treated, shaped, and finally inspected to obtain the finished product.

[0082] In some embodiments, after the printing device acquires the printing data, the first and second printouts can be set to be printed continuously in a queue printing mode in the device software during the actual printing process, resulting in high printing efficiency.

[0083] In this embodiment, when fabricating the solder resist layer on a stepped circuit board using 3D printing, the solder resist layers on the upper surface (top surface of the stepped groove) and the bottom surface of the stepped groove are printed in two stages. During the first printing, the upper surface (top surface of the stepped groove) is used as the vertical reference plane to set the printing height, and an appropriate printing voltage and ink processing temperature are employed. During the second printing, the bottom surface of the stepped groove is used as the vertical reference plane to set the printing height, making the second printing height greater than the first. At this time, the printing voltage needs to be increased, while the ink processing temperature can be reduced. For example, the printing voltage can be increased by approximately 0.5V from the original 5V to 8V, and the ink temperature can be reduced by 5℃ to 8℃ from the original 47℃ to 50℃. The aforementioned printing voltage and ink temperature ranges are suitable for stepped boards with groove depths within 0 to 2mm, ensuring that ink scattering does not occur during solder resist layer printing, thus improving product quality.

[0084] When using 3D printing technology to create a solder resist layer on a multilayer board, the printing equipment only needs to be aligned once and then printed multiple times to complete the solder resist process. No exposure and development are required, the processing flow is simple, the product yield is high, and mass production can be achieved.

[0085] Accordingly, embodiments of this application also disclose a circuit board processing apparatus, which can process circuit boards using the circuit board processing methods of the above embodiments. (Refer to...) Figure 3 As shown, the circuit board processing apparatus includes a first processing mechanism 100, a pressing mechanism 200, a grooving mechanism 300, and a second processing mechanism 400. The first processing mechanism 100 is used to process the substrate based on a first processing technology to form an inner core board; the pressing mechanism 200 is used to press the inner core board based on a pressing process to form a multilayer board; the grooving mechanism 300 is used to process the multilayer board based on a controlled-depth milling process to form a stepped board with stepped grooves; and the second processing mechanism 400 is used to process the stepped board based on a second processing technology to form a multilayer circuit board with outer circuitry.

[0086] Specifically, the second processing unit includes a roughening unit, an anti-seepage unit, a printing unit, and a curing unit. The roughening unit is used to roughen the top and bottom surfaces of the stepped groove of the multilayer board. The anti-seepage unit is used to prevent seepage on the top and bottom surfaces of the stepped groove of the multilayer board after roughening. The printing unit is used to print a solder resist layer on the top and bottom surfaces of the stepped groove of the multilayer board after anti-seepage treatment. The curing unit is used to cure the top and bottom surfaces of the stepped groove of the multilayer board with the printed solder resist layer.

[0087] Specifically, when printing the solder resist layer, a first parameter can be used to print the solder resist layer on the top surface of the stepped groove in the multilayer board, and a second parameter can be used to print the solder resist layer on the bottom surface of the stepped groove. The first parameter includes a first printing height, a first printing voltage, and a first ink temperature, and the second parameter includes a second printing height, a second printing voltage, and a second ink temperature. When the first printing height is less than the second printing height, the first printing voltage is less than the second printing voltage, and / or the first ink temperature is greater than the second ink temperature; when the first printing height is equal to the second printing height, the first printing voltage is equal to the second printing voltage, and the first ink temperature is equal to the second ink temperature.

[0088] In this embodiment, the first printing voltage ranges from 5V to 8V, the second printing voltage ranges from 5.5V to 8.5V, and the first ink temperature and the second ink temperature range from 40℃ to 50℃. For example, when the first printing height is less than the second printing height, the printing voltage of the printing device can be adjusted to 5V, the ink temperature to 50℃, and then a solder resist layer can be printed on the outer surface of the multilayer circuit board. Afterwards, the printing voltage is adjusted to 5.5V, the ink temperature is adjusted to 45℃, and then a solder resist layer is printed on the bottom surface of the stepped groove of the multilayer circuit board.

[0089] When using 3D printing technology to create a solder resist layer on a multilayer board, the printing equipment only needs to be aligned once and then printed multiple times to complete the solder resist process. No exposure and development are required, the processing flow is simple, the product yield is high, and mass production can be achieved.

[0090] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for processing a circuit board, characterized in that, include: The stepped board is processed using a second processing technology to form a multilayer circuit board with outer layer circuitry, wherein the stepped board is a multilayer board with stepped grooves. The second processing technology includes a solder resist printing process, which includes: printing a solder resist layer on the top surface of the stepped groove of the multilayer board using a first parameter, and printing a solder resist layer on the bottom surface of the stepped groove of the multilayer board using a second parameter. The first parameter includes a first printing height, a first printing voltage, and a first ink temperature. The second parameter includes a second printing height, a second printing voltage, and a second ink temperature. At least one of the first parameter and the second parameter is not equal.

2. The circuit board processing method according to claim 1, characterized in that, When the first printing height is less than the second printing height, the first printing voltage is less than the second printing voltage, and / or the first ink temperature is greater than the second ink temperature; When the first printing height is equal to the second printing height, the first printing voltage is equal to the second printing voltage, and the first ink temperature is equal to the second ink temperature.

3. The circuit board processing method according to claim 2, characterized in that, The stepped groove has multiple bottom surfaces. When the first printing height is less than the second printing height, along the depth direction of the stepped groove, the second printing voltage corresponding to the solder resist layer of the bottom surface that is farther away from the top surface of the stepped groove is greater and the second ink temperature is lower.

4. The circuit board processing method according to claim 1, characterized in that, The solder resist layer printing process includes: The top and bottom surfaces of the stepped grooves in the multilayer board are roughened. The top and bottom surfaces of the stepped grooves of the multilayer board after the roughening treatment are subjected to anti-seepage treatment; A solder resist layer is printed on the top and bottom surfaces of the stepped groove of the multilayer board after the aforementioned anti-seepage treatment. The top and bottom surfaces of the stepped grooves of the multilayer board on which the solder resist layer has been printed are cured.

5. The circuit board processing method according to claim 1, characterized in that, The first printing height ranges from 1mm to 1.5mm, and the second printing height ranges from 1.5mm to 2mm.

6. The circuit board processing method according to claim 1, characterized in that, The first printing voltage ranges from 5V to 8V, the second printing voltage ranges from 5.5V to 8.5V, and the first ink temperature and the second ink temperature range from 40℃ to 50℃.

7. The circuit board processing method according to claim 1, characterized in that, The second processing technology also includes drilling, copper plating, full-board electroplating, outer layer pattern transfer, pattern electroplating, and outer layer etching.

8. The circuit board processing method according to any one of claims 1 to 7, characterized in that, Before processing the stepped plate using the second processing method, the method further includes: The substrate is processed using the first processing technology to form the inner core board; The inner core board is pressed together using a lamination process to form a multilayer board; The multilayer board is processed using a controlled-depth milling process to form a stepped board with stepped grooves. The first processing technology includes material cutting, inner layer pattern transfer, and inner layer etching.

9. The circuit board processing method according to claim 8, characterized in that, The process of using controlled-depth milling to process the multilayer board specifically involves: Multilayer boards are machined using controlled-depth milling technology to form stepped grooves with a depth of no more than 2 mm.

10. A circuit board processing apparatus, characterized in that, include: The second processing mechanism is used to process the stepped board based on the second processing technology to form a multilayer circuit board with outer layer circuits, wherein the stepped board is a multilayer board with stepped grooves. The second processing technology includes a solder resist printing process, which includes: printing a solder resist layer on the top surface of the stepped groove of the multilayer board using a first parameter, and printing a solder resist layer on the bottom surface of the stepped groove of the multilayer board using a second parameter. The first parameter includes a first printing height, a first printing voltage, and a first ink temperature. The second parameter includes a second printing height, a second printing voltage, and a second ink temperature. At least one of the first parameter and the second parameter is not equal.

11. The circuit board processing apparatus according to claim 10, characterized in that, The second processing mechanism includes: The roughening unit is used to roughen the top and bottom surfaces of the stepped grooves in the multilayer board. The seepage prevention unit is used to perform seepage prevention treatment on the top and bottom surfaces of the stepped groove of the multilayer board after the roughening treatment. A printing unit is used to print a solder resist layer on the top and bottom surfaces of the stepped grooves of the multilayer board after the anti-seepage treatment. A curing unit is used to cure the top and bottom surfaces of the stepped grooves of the multilayer board on which the solder resist layer has been printed.

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