Back drilling processing method, electronic equipment, multilayer circuit board and storage medium

Abstract

The invention discloses a back-drilling processing method, electronic equipment, a multilayer circuit board and a storage medium, the back-drilling processing method is used for processing a PCB, and the back-drilling processing method comprises the following steps: obtaining a preset back-drilling coordinate of the PCB according to a drilling through hole of the PCB; according to the preset depth of the inner signal layer of the PCB and the inclination angle of the drilled through hole, the back drilling center offset compensation amount of the PCB is obtained; correcting the preset back drilling coordinate according to the back drilling center offset compensation amount to obtain a target back drilling coordinate; and according to the target back drilling coordinate, a back drilling machine is controlled to conduct back drilling machining on the first-drill through hole. According to the method, the back drilling center offset compensation amount of the PCB is determined based on the preset depth of the inner signal layer of the PCB and the inclination angle of the drilled through hole, and the preset back drilling coordinate of the PCB is corrected based on the back drilling center offset compensation amount, so that electromagnetic interference on electronic elements on the PCB is reduced.

Description

Technical Field

[0001] This application belongs to the field of printed circuit board manufacturing technology, and particularly relates to a back-drilling processing method, electronic equipment, multilayer circuit boards and storage media. Background Technology

[0002] With the development of printed circuit boards (PCBs), various multilayer PCBs often require back-drilled holes. Back-drilled holes involve drilling away a portion of the copper from the wall of a through hole to prevent the signals of the inner layer circuits from being shielded.

[0003] Currently, during the drilling process of through holes, the drill bit is prone to tilting due to the sway of the drill bit or the lateral force of the fiberglass cloth entering the hole, resulting in tilted through holes. After back drilling based on the center of the tilted through hole, the length of the residual copper stub in the resulting back drill hole is asymmetrical.

[0004] However, stubs with asymmetrical lengths are prone to impedance abrupt changes, which can cause strong electromagnetic interference to electronic components on the PCB board. Summary of the Invention

[0005] In view of the above, embodiments of this application provide a back-drilling processing method, an electronic device, a multilayer circuit board, and a storage medium to overcome the problems of the prior art.

[0006] In a first aspect, embodiments of this application provide a back-drilling processing method for processing PCB boards, the back-drilling processing method comprising: Based on a through hole in the PCB board, obtain the preset back-drill coordinates of the PCB board; The back-drill center offset compensation amount of the PCB is obtained based on the preset depth of the inner signal layer of the PCB and the tilt angle of the drilled hole. The preset back drill coordinates are corrected based on the back drill center offset compensation amount to obtain the target back drill coordinates; Based on the target back-drilling coordinates, control the back-drilling machine to perform back-drilling processing on the through hole.

[0007] In some optional embodiments, before obtaining the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled hole, the back-drilling processing method further includes: The displacement sensor is controlled to emit a preset light at a preset emission angle to the inner wall of the drilled hole; The first irradiation length of the preset light irradiated by the displacement sensor onto the inner wall is obtained; The tilt angle is calculated based on the installation height of the displacement sensor from the PCB board, the diameter of the drilled hole, the preset emission angle, and the first irradiation length.

[0008] In some optional embodiments, calculating the tilt angle based on the installation height of the displacement sensor to the PCB board, the diameter of the drilled hole, the preset emission angle, and the first irradiation length includes: The irradiation depth of the preset light in the drilled hole is calculated based on the preset emission angle, the installation height, and the first irradiation length. The drilling offset of the through hole is calculated based on the preset emission angle, the irradiation depth, and the aperture. The tilt angle is calculated based on the irradiation depth and the borehole offset.

[0009] In some optional embodiments, calculating the irradiation depth of the preset light within a drilled hole based on the preset emission angle, the installation height, and the first irradiation length includes: Based on the preset emission angle, the installation height, and the first irradiation length, the second irradiation length of the preset light within the drilled hole is calculated; The irradiation depth is calculated based on the preset emission angle and the second irradiation length.

[0010] In some optional embodiments, calculating the drilling offset of the through-hole based on the preset emission angle, the irradiation depth, and the aperture includes: Based on the preset emission angle and the irradiation depth, the projection of the second irradiation length onto the top surface of the PCB board is calculated to obtain the projection length; The borehole offset is calculated based on the borehole diameter and the projected length.

[0011] In some optional embodiments, calculating the second irradiation length of the preset light within the drilled hole based on the preset emission angle, the installation height, and the first irradiation length includes: Based on the preset emission angle and the installation height, calculate the third irradiation length of the preset light outside the drilled hole; The difference between the first irradiation length and the third irradiation length is calculated to obtain the second irradiation length.

[0012] In some optional embodiments, the back drill center offset compensation amount includes a lateral offset compensation amount and a longitudinal offset compensation amount, the preset back drill coordinates include a preset horizontal coordinate and a preset vertical coordinate, and the target back drill coordinates include a target horizontal coordinate and a target vertical coordinate. The step of obtaining the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled hole includes: The lateral offset compensation amount and the longitudinal offset compensation amount are obtained based on the tilt angle and the preset depth; The step of correcting the preset back drill coordinates based on the back drill center offset compensation amount to obtain the target back drill coordinates includes: The preset horizontal coordinate is corrected based on the horizontal offset compensation amount to obtain the target horizontal coordinate; The preset ordinate is corrected based on the longitudinal offset compensation amount to obtain the target ordinate.

[0013] Secondly, embodiments of this application provide a back-drilling processing apparatus for processing PCB boards, the back-drilling processing apparatus comprising: The first acquisition module is used to acquire the preset back drill coordinates of the PCB board based on a through hole in the PCB board. The second acquisition module is used to acquire the back drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled hole. The correction module is used to correct the preset back drill coordinates according to the back drill center offset compensation amount to obtain the target back drill coordinates. The first control module is used to control the back drilling machine to perform back drilling processing on the through hole according to the target back drilling coordinates.

[0014] Thirdly, embodiments of this application provide an electronic device, including: Memory; One or more processors are coupled to the memory; One or more applications, wherein the one or more applications are stored in the memory and configured to be executed by the one or more processors, and the one or more applications are configured to perform the back-drilling machining method as provided in the first aspect above.

[0015] Fourthly, embodiments of this application provide a multilayer circuit board, which is fabricated from a PCB board based on the back-drilling processing method provided in the first aspect above.

[0016] Fifthly, embodiments of this application provide a computer-readable storage medium storing program code, which can be invoked by a processor to execute the back-drilling machining method provided in the first aspect above.

[0017] Sixthly, embodiments of this application provide a computer program product that, when run on a computer device, causes the computer device to perform the back-drilling machining method as described in the first aspect above.

[0018] The solution provided in this application obtains the preset back-drill coordinates of the PCB board based on a through-hole, and obtains the back-drill center offset compensation amount based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through-hole. The preset back-drill coordinates are then corrected based on the back-drill center offset compensation amount to obtain the target back-drill coordinates. Based on the target back-drill coordinates, the back-drilling machine is controlled to perform back-drilling on the through-hole. This achieves the determination of the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through-hole, and the correction of the preset back-drill coordinates of the PCB board based on the back-drill center offset compensation amount. The corrected target back-drill coordinates coincide with the center of the inner signal pad of the PCB board, which can make the stub length processed based on the target back-drill coordinates symmetrical, which is beneficial to reducing electromagnetic interference to electronic components on the PCB board. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This illustration shows a scenario of a drilled hole in a PCB board provided in an embodiment of this application.

[0021] Figure 2 This illustration shows a scenario diagram of back drilling processing of a PCB board provided in an embodiment of this application.

[0022] Figure 3 This illustration shows a scenario diagram of a PCB board stub provided in an embodiment of this application.

[0023] Figure 4 A schematic flowchart of a back-drilling machining method provided in an embodiment of this application is shown.

[0024] Figure 5 This paper illustrates another schematic flowchart of the back drilling method provided in an embodiment of this application.

[0025] Figure 6 This illustration shows a scenario diagram of back drilling in the back drilling method provided in the embodiments of this application.

[0026] Figure 7 A structural block diagram of a back-drilling processing apparatus provided in an embodiment of this application is shown.

[0027] Figure 8 A functional block diagram of an electronic device provided in an embodiment of this application is shown.

[0028] Figure 9 This application illustrates a computer-readable storage medium for storing or carrying program code that implements the back-drilling machining method provided in this application.

[0029] Figure 10 This application illustrates a computer program product for storing or carrying program code that implements the back drilling machining method provided in the embodiments of this application. Detailed Implementation

[0030] To make the inventive objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0032] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0033] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0034] Furthermore, in the description of this application, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0035] With the development of printed circuit boards (PCBs), various multilayer PCBs often require back-drilled holes. Back-drilled holes involve drilling away a portion of the copper from the wall of a through hole to prevent the signals of the inner layer circuits from being shielded.

[0036] Currently, during the drilling process of through holes, the drill bit is prone to tilting due to the yaw of the drill bit or the lateral force of the fiberglass cloth entering the hole. Consequently, the through holes formed by this single-drilling method are also prone to tilting. Figure 1 As shown. Back-drilling is performed based on the center of an inclined through-hole, as shown. Figure 2 As shown, the length of the residual copper stub formed by the back drill hole is asymmetrical, such as... Figure 3 As shown.

[0037] However, stubs with asymmetrical lengths are prone to impedance abrupt changes, which can lead to strong electromagnetic interference (EMI) on electronic components on the PCB.

[0038] To address the aforementioned issues, the back-drilling processing method, electronic device, multilayer circuit board, and storage medium provided in this application embodiment obtain the preset back-drilling coordinates of the PCB board based on a drilled through-hole, and obtain the back-drilling center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled through-hole. The preset back-drilling coordinates are then corrected based on the back-drilling center offset compensation amount to obtain the target back-drilling coordinates. Based on the target back-drilling coordinates, a back-drilling machine is controlled to perform back-drilling processing on the drilled through-hole. This achieves the determination of the back-drilling center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled through-hole, and the correction of the preset back-drilling coordinates of the PCB board based on the back-drilling center offset compensation amount. The corrected target back-drilling coordinates coincide with the center of the inner signal pad of the PCB board, which can make the stub length processed based on the target back-drilling coordinates symmetrical, which is beneficial to reducing electromagnetic interference to electronic components on the PCB board.

[0039] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0040] The back-drilling processing method provided in this application embodiment can be applied to electronic devices. The electronic devices can process PCB boards based on the back-drilling processing method to obtain multilayer circuit boards.

[0041] Electronic devices can be terminal devices or servers, etc. The type of electronic device is not limited here, and can be set according to actual needs.

[0042] The terminal device can be a mobile terminal device (such as a mobile phone, PDA, tablet PC, laptop, smartwatch, smart bracelet or wearable device, etc.) or a fixed terminal device (desktop computer, smart panel, etc.), etc., without limitation.

[0043] The server can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or any of the following: cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), big data or artificial intelligence platforms, etc. There are no restrictions here.

[0044] Please see Figure 4 This document illustrates a flowchart of a back-drilling machining method according to an embodiment of this application. In a specific embodiment, the back-drilling machining method can be applied to electronic devices. The following will use an electronic device as an example to illustrate this method. Figure 4 The process shown is described in detail. The back drilling machining method may include the following steps 101 to 104.

[0045] Step 101: Obtain the preset back drill coordinates of the PCB board based on the through hole of the PCB board.

[0046] In this embodiment of the application, when a user needs to perform back drilling on a PCB board, he / she can send a processing instruction to an electronic device. After receiving the processing instruction, the electronic device can obtain the preset back drilling coordinates of the PCB board based on a through hole in the PCB board.

[0047] Among them, the processing command can be used to instruct the back drilling machine to perform back drilling processing on the PCB board, and the preset back drilling coordinates can be the center coordinates of a drilled through hole. The preset back drilling coordinates can be used to characterize the theoretical alignment coordinates of the PCB board back drilling processing.

[0048] In some implementations, when a user needs to perform back drilling on a PCB board, they can send a processing command to an electronic device. After receiving the processing command, the electronic device can send a first acquisition command to a displacement sensor. After receiving the first acquisition command, the displacement sensor can acquire an image of the top surface of the PCB board, obtain a top surface image, and acquire the center pixel coordinates of a drilled hole image in the top surface image. The sensor then sends the center pixel coordinates to the electronic device. After receiving the center pixel coordinates returned by the displacement sensor, the electronic device determines the center pixel coordinates as the preset back drilling coordinates of the PCB board.

[0049] The displacement sensor can be communicatively connected to an electronic device and interact with it for data exchange. The first acquisition command can be used to instruct the displacement sensor to acquire images of the PCB board.

[0050] The displacement sensor can be any of the following: gas laser displacement sensor, solid-state laser displacement sensor, liquid laser displacement sensor, semiconductor laser displacement sensor, or fiber laser displacement sensor; no specific limitation is made here.

[0051] A PCB board may include a top surface and a bottom surface. The top surface of the PCB board can be the drilling surface for back drilling, and the bottom surface of the PCB board can be the drilling exit surface. Either the top surface or the bottom surface of the PCB board can be used as the back drilling surface.

[0052] In some implementations, the electronic device can detect user operations, and when it is determined from the detected user operations that the user has input an instruction to perform back drilling on the PCB board, the processing instruction is received.

[0053] For example, when a user needs to perform back drilling on a PCB board, they can perform a touch operation on the operation panel of the electronic device. The electronic device responds to the user's touch operation, generates a corresponding touch signal, and analyzes the touch signal. When it is determined that the touch signal is a preset signal used to characterize the back drilling of the PCB board, it is determined that the processing instruction has been received.

[0054] In some implementations, the electronic device may be equipped with a voice recognition module. When a user needs to perform back drilling on a PCB board, the user can send voice information within the voice acquisition range of the voice recognition module. The voice recognition module collects the voice information sent by the user and performs voice recognition on the collected voice information to obtain the recognition result. When it is determined that the recognition result contains keywords used to indicate back drilling on the PCB board, such as "back drilling", it is determined that the processing instruction has been received.

[0055] As an example, if the user's voice message is: "Perform back drilling on the PCB board", and the voice recognition result contains the keyword "back drilling", then it is confirmed that the processing instruction has been received.

[0056] In some implementations, when a user needs to perform back-drilling on a PCB board, they can send a processing instruction to a client. After receiving the processing instruction, the client can forward the instruction to an electronic device via the network, and the electronic device receives the processing instruction forwarded by the client.

[0057] The client can connect to electronic devices via a network and interact with them via the network.

[0058] The client can be any of the following: a mobile client (e.g., a mobile phone client, a PDA client, a Tablet PC client, a laptop client, a smartwatch client, a smart bracelet client, or a wearable client) or a fixed client (e.g., a desktop computer client, a smart panel client). The type of client is not limited here, and it can be set according to actual needs.

[0059] The network can be any of the following: ZigBee network, Bluetooth (BT) network, Wireless Fidelity (Wi-Fi) network, Thread network, Long Range Radio (LoRa) network, Low-Power Wide-Area Network (LPWAN), Infrared network, Narrow Band Internet of Things (NB-IoT), Controller Area Network (CAN), Digital Living Network Alliance (DLNA) network, Wide Area Network (WAN), Local Area Network (LAN), Metropolitan Area Network (MAN), or Wireless Personal Area Network (WPAN). The type of network is not limited here; it can be configured according to actual needs.

[0060] Step 102: Based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled hole, obtain the back drill center offset compensation amount of the PCB board.

[0061] In this embodiment of the application, after the electronic device obtains the preset back-drill coordinates of the PCB board based on a through hole, it can obtain the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through hole.

[0062] The inner signal layer can be a pre-set circuit layer on the PCB board for placing inner signal pads, and the preset depth of the inner signal layer is the back-drilling depth of the PCB board.

[0063] The tilt angle of a drilled hole can be used to characterize the degree of tilt of a drilled hole. The tilt angle of a drilled hole can be caused by the sway of a drill bit or the lateral force of the fiberglass cloth entering the hole, resulting in the offset angle formed by the drilling direction of the drill bit in the direction perpendicular to the top surface of the PCB board.

[0064] The electronic device can calculate the product of the tangent of the tilt angle and the preset depth to obtain the back drill center offset compensation amount.

[0065] In one application scenario, the preset depth of the inner signal layer can be d, and the tilt angle of a drilled hole can be θ1.

[0066] The back drill center offset compensation amount can be calculated according to Formula 1 based on the preset depth d and the tangent value tanθ1 of the tilt angle θ1. .

[0067] Formula 1 is: =d×tanθ1.

[0068] In some implementations, the back drill center offset compensation amount may include lateral offset compensation amount and longitudinal offset compensation amount. The electronic device can obtain the lateral offset compensation amount and longitudinal offset compensation amount according to the tilt angle and preset depth.

[0069] The electronic device can determine the first projection component of the tangent of the tilt angle on the horizontal axis and the second projection component on the vertical axis, and calculate the product of the first projection component and a preset depth to obtain the lateral offset compensation amount, and calculate the product of the second projection component and the preset depth to obtain the longitudinal offset compensation amount. Based on the projections of the tilt angle on the horizontal and vertical axes, the lateral and longitudinal offset compensation amounts of the PCB board are calculated, improving the accuracy of the lateral and longitudinal offset compensation amounts.

[0070] We can take any two coordinates corresponding to the inclination angle of a drilled hole, and calculate the corresponding tangent value based on the horizontal coordinate of any two coordinates to obtain the first projection component. We can also calculate the corresponding tangent value based on the vertical coordinate of any two coordinates to obtain the second projection component.

[0071] In one application scenario, the back drill center offset compensation amount This can include lateral offset compensation. x and longitudinal offset compensation The first projection component of the tangent of the tilt angle θ1 onto the horizontal axis can be tanθ. 1x The second projection component of the tangent of the tilt angle θ1 onto the vertical axis can be tanθ. 1y .

[0072] Based on the first projection component tanθ 1xAnd the preset depth d, calculate the lateral offset compensation amount according to Formula 2. x.

[0073] Formula 2 is: x=d×tanθ 1x .

[0074] Based on the second projection component tanθ 1y And the preset depth d, calculate the longitudinal offset compensation amount according to Formula 3. y.

[0075] Formula 3 is: y=d×tanθ 1y .

[0076] Wherein, the first projection component tanθ 1x The second projection component tanθ 1y The tangent of the tilt angle θ1, tanθ1, satisfies Formula 4.

[0077] Formula 4 is: (tanθ) 1x ) 2 +(tanθ 1y ) 2 =(tanθ1) 2 .

[0078] Step 103: Correct the preset back drill coordinates according to the back drill center offset compensation amount to obtain the target back drill coordinates.

[0079] In this embodiment, after the electronic device obtains the back drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of a drilled hole, it can correct the preset back drill coordinates based on the back drill center offset compensation amount to obtain the target back drill coordinates.

[0080] Among them, the electronic equipment can calculate the sum of the back drill center offset compensation amount and the coordinate components of the preset back drill coordinates to obtain the target back drill coordinates.

[0081] In one application scenario, the preset back drill coordinates can be (x1, y1), the target back drill coordinates can be (x2, y2), and the back drill center offset compensation amount can be... Preset back drill coordinates (x1, y1), target back drill coordinates (x2, y2), and back drill center offset compensation amount. This satisfies both Formula 5 and Formula 6.

[0082] Formula 5 is: x2 = x1 + .

[0083] Formula 6 is: y2 = y1 + .

[0084] In some implementations, the back drill center offset compensation amount may include a lateral offset compensation amount and a longitudinal offset compensation amount, the preset back drill coordinates may include a preset horizontal coordinate and a preset vertical coordinate, and the target back drill coordinates may include a target horizontal coordinate and a target vertical coordinate.

[0085] The electronic device can correct the preset horizontal coordinate based on the lateral offset compensation to obtain the target horizontal coordinate, and correct the preset vertical coordinate based on the vertical offset compensation to obtain the target vertical coordinate. By correcting the preset back-drilling coordinates based on both the lateral and vertical offset compensations, the target back-drilling coordinates are obtained, thus improving the accuracy of the target back-drilling coordinates.

[0086] In one application scenario, the preset horizontal coordinate can be x1, the preset vertical coordinate can be y1, the target horizontal coordinate can be x2, the target vertical coordinate can be y2, and the lateral offset compensation amount can be... x, the longitudinal offset compensation amount can be y.

[0087] Preset x1 horizontal coordinate, horizontal offset compensation amount x and the target x2 can satisfy Formula 7.

[0088] Formula 7 is: x2 = x1 + x.

[0089] Preset vertical coordinate y1, vertical offset compensation amount The values ​​of y and the target ordinate y2 satisfy Formula 8.

[0090] Formula 8 is: y2 = y1 + y.

[0091] Step 104: Based on the target back-drill coordinates, control the back-drilling machine to perform back-drilling on a through hole.

[0092] In this embodiment, the electronic device corrects the preset back-drill coordinates based on the back-drill center offset compensation amount. After obtaining the target back-drill coordinates, it can control the back-drilling machine to perform back-drilling on a through hole based on the target back-drill coordinates. This achieves the determination of the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer and the tilt angle of the through hole. The preset back-drill coordinates of the PCB board are corrected based on the back-drill center offset compensation amount. The corrected target back-drill coordinates coincide with the center of the inner signal pad of the PCB board, which makes the stub length processed based on the target back-drill coordinates symmetrical, which helps to reduce electromagnetic interference to electronic components on the PCB board.

[0093] Among them, the electronic device can send a first control command carrying the target back drilling coordinates to the back drilling machine via the network. After receiving the first control command, the back drilling machine can perform back drilling processing on a drilled hole according to the target back drilling coordinates.

[0094] The first control command can be used to control the back drilling machine to perform back drilling on a through hole according to the target back drilling coordinates. The back drilling machine can be connected to electronic equipment via a network and interact with the electronic equipment via the network.

[0095] The solution provided in this application obtains the preset back-drill coordinates of the PCB board based on a through-hole, and obtains the back-drill center offset compensation amount based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through-hole. The preset back-drill coordinates are then corrected based on the back-drill center offset compensation amount to obtain the target back-drill coordinates. Based on the target back-drill coordinates, the back-drilling machine is controlled to perform back-drilling on the through-hole. This achieves the determination of the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through-hole, and the correction of the preset back-drill coordinates of the PCB board based on the back-drill center offset compensation amount. The corrected target back-drill coordinates coincide with the center of the inner signal pad of the PCB board, which can make the stub length processed based on the target back-drill coordinates symmetrical, which is beneficial to reducing electromagnetic interference to electronic components on the PCB board.

[0096] Please see Figure 5 This document illustrates a flowchart of a back-drilling machining method according to another embodiment of this application. In a specific embodiment, the back-drilling machining method can be applied to electronic devices. The following will use an electronic device as an example to illustrate this method. Figure 5 The process shown is described in detail. The back drilling machining method may include the following steps 201 to 207.

[0097] Step 201: Obtain the preset back drill coordinates of the PCB board based on the through hole of the PCB board.

[0098] In this embodiment, step 201 can refer to the content of the corresponding steps in the previous embodiments, and will not be repeated here.

[0099] Step 202: Control the displacement sensor to emit a preset light at a preset emission angle to the inner wall of a drilled hole.

[0100] In this embodiment, after the electronic device obtains the preset back-drill coordinates of the PCB board based on a drilled hole, it can send a second control command to the displacement sensor. After receiving the second control command, the displacement sensor emits a preset light at a preset emission angle to the inner wall of the drilled hole, receives the reflected light reflected from the inside, calculates the first irradiation length of the preset light from the displacement sensor to the inner wall based on the optical path difference between the preset light and the reflected light, and sends the first irradiation length of the preset light from the displacement sensor to the inner wall to the electronic device.

[0101] The preset emission angle can be the installation angle of the displacement sensor, which can be used to characterize the angle between the displacement sensor and the perpendicular direction of a drilled hole.

[0102] The installation angle can be calculated based on the optical path difference between the preset light and the reflected light, or it can be measured based on the attitude sensor installed on the displacement sensor, etc., and there is no limitation here.

[0103] As an example, the installation angle can be any angle within the range of 0° to 80°, and there is no limitation here.

[0104] Step 203: Obtain the first irradiation length of the preset light irradiated by the displacement sensor onto the inner wall.

[0105] In this embodiment, the electronic device controls the displacement sensor to emit a preset light at a preset emission angle to the inner wall of a drilled hole, so that the displacement sensor can calculate and return the first irradiation length of the preset light from the displacement sensor to the inner wall based on the optical path difference between the preset light and the reflected light, and then receive the first irradiation length of the preset light from the displacement sensor to the inner wall returned by the displacement sensor.

[0106] Step 204: Calculate the tilt angle based on the installation height of the displacement sensor to the PCB board, the diameter of the through hole, the preset emission angle, and the first irradiation length.

[0107] In this embodiment, after the electronic device obtains the first irradiation length of the preset light irradiated by the displacement sensor to the inner wall, it can calculate the tilt angle based on the installation height of the displacement sensor to the PCB board, the diameter of a drilled hole, the preset emission angle, and the first irradiation length. Based on the preset light emitted by the displacement sensor, the tilt angle of a drilled hole is detected, which improves the accuracy of tilt angle detection.

[0108] The electronic device can calculate the irradiation depth of a preset light within a drilled hole based on a preset emission angle, installation height, and first irradiation length. It can also calculate the drilling offset of the drilled hole based on the preset emission angle, irradiation depth, and hole diameter, and finally calculate the tilt angle based on the irradiation depth and drilling offset. Calculating the tilt angle of a drilled hole based on the preset irradiation depth and drilling offset improves the accuracy of the tilt angle calculation.

[0109] The electronic device can calculate the second irradiation length of the preset light in a drilled hole based on the preset emission angle, installation height, and first irradiation length, and calculate the irradiation depth of the preset light in a drilled hole based on the preset emission angle and second irradiation length.

[0110] The electronic device can calculate the third irradiation length of the preset light outside a drilled hole based on the preset emission angle and installation height, and calculate the difference between the first irradiation length and the third irradiation length to obtain the second irradiation length.

[0111] The electronic device can calculate the projection of the second irradiation length on the top surface of the PCB board based on the preset emission angle and irradiation depth, obtain the projection length, and calculate the drilling offset based on the hole diameter and the projection length.

[0112] In one application scenario, such as Figure 6 As shown, the installation height of the displacement sensor from the PCB board can be H, the diameter of the drilled hole can be R, the preset emission angle can be θ2, and the preset first illumination length of the light from the displacement sensor to the inner wall of the drilled hole can be L1.

[0113] Based on the installation height H and the preset emission angle θ2, the third irradiation length L3 of the preset light outside the drilled hole can be calculated according to Formula 9.

[0114] Formula 9 is: L3 = H ÷ cosθ2.

[0115] The second irradiation length L2 can be calculated according to Formula 10 based on the first irradiation length L1 and the third irradiation length L3.

[0116] The formula for the tens digit is: L2 = L1 - L3 = L1 - H ÷ cosθ2.

[0117] The preset irradiation depth h of the light in a drilled hole can be calculated according to Formula 11, based on the preset emission angle θ2 and the second irradiation length L2.

[0118] Formula 11 is: h = L2 × cosθ2 = (L1 - H ÷ cosθ2) × cosθ2.

[0119] Based on the preset emission angle θ2 and irradiation depth h, the projection length R1 of the second irradiation length L2 on the top surface of the PCB board can be calculated according to Formula Twelve.

[0120] Formula 12 is: R1=tanθ2×h=tanθ2×(L1-H÷cosθ2)×cosθ2=(L1-H÷cosθ2)×sinθ2.

[0121] The drilling offset R2 of a through hole can be calculated according to Formula Thirteen based on the hole diameter R and the projected length R1.

[0122] Formula 3 is: R2=R-R1=R-(L1-H÷cosθ2)×sinθ2.

[0123] The tilt angle θ1 can be calculated according to Formula 14 based on the irradiation depth h and the borehole offset R2.

[0124] Formula fourteen is: θ1=arctan(R2÷h)=arctan((R-(L1-H÷cosθ2)×sinθ2)÷((L1-H÷cosθ2)×cosθ2)).

[0125] Step 205: Based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled hole, obtain the back drill center offset compensation amount of the PCB board.

[0126] Step 206: Correct the preset back drill coordinates according to the back drill center offset compensation amount to obtain the target back drill coordinates.

[0127] Step 207: Based on the target back-drill coordinates, control the back-drilling machine to perform back-drilling on a through hole.

[0128] In this embodiment, steps 205, 206, and 207 can be found in the corresponding steps of the aforementioned embodiments, and will not be repeated here.

[0129] The solution provided in this embodiment obtains the preset back-drill coordinates of the PCB board based on a drilled hole, controls a displacement sensor to emit preset light at a preset emission angle to the inner wall of the drilled hole, and obtains the first illumination length of the preset light from the displacement sensor to the inner wall. Based on the installation height of the displacement sensor to the PCB board, the diameter of the drilled hole, the preset emission angle, and the first illumination length, the tilt angle is calculated. Based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled hole, the back-drill center offset compensation amount of the PCB board is obtained. The preset back-drill center offset compensation amount is then used to adjust the preset back-drill center offset. The back-drill coordinates are corrected to obtain the target back-drill coordinates. Based on the target back-drill coordinates, the back-drilling machine is controlled to perform back-drilling on a through hole. This achieves the preset depth of the inner signal layer of the PCB board and the tilt angle of the through hole, determines the back-drill center offset compensation amount of the PCB board, and corrects the preset back-drill coordinates of the PCB board based on the back-drill center offset compensation amount. The corrected target back-drill coordinates coincide with the center of the inner signal pad of the PCB board, which can make the stub length processed based on the target back-drill coordinates symmetrical, which helps to reduce electromagnetic interference to electronic components on the PCB board.

[0130] Furthermore, based on the preset light emitted by the displacement sensor, the tilt angle of a drilled hole is detected, which improves the accuracy of tilt angle detection.

[0131] Please see Figure 7 This illustration shows a back-drilling apparatus 300 provided in one embodiment of this application. The back-drilling apparatus 300 can be applied to electronic devices. The following will use an electronic device as an example to illustrate... Figure 7 The back drilling processing device 300 shown will be described in detail. The back drilling processing device 300 may include a first acquisition module 301, a second acquisition module 302, a correction module 303, and a first control module 304.

[0132] The first acquisition module 301 can be used to acquire the preset back-drill coordinates of the PCB board based on a through hole in the PCB board; the second acquisition module 302 can be used to acquire the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through hole; the correction module 303 can be used to correct the preset back-drill coordinates based on the back-drill center offset compensation amount to obtain the target back-drill coordinates; the first control module 304 can be used to control the back-drilling machine to perform back-drilling processing on the through hole based on the target back-drill coordinates.

[0133] In some embodiments, the back drilling processing device 300 may also include a second control module, a third acquisition module, and a calculation module.

[0134] The second control module can be used to control the displacement sensor to emit preset light to the inner wall of a drilled hole at a preset emission angle before the second acquisition module 302 acquires the back drill center offset compensation amount of the PCB board according to the preset depth of the inner signal layer of the PCB board and the tilt angle of a drilled hole; the third acquisition module can be used to acquire the first irradiation length of the preset light irradiated by the displacement sensor to the inner wall; the calculation module can be used to calculate the tilt angle according to the installation height of the displacement sensor to the PCB board, the diameter of the drilled hole, the preset emission angle and the first irradiation length.

[0135] In some implementations, the computing module may include a first computing unit, a second computing unit, and a third computing unit.

[0136] The first calculation unit can be used to calculate the irradiation depth of a preset light in a drilled hole based on the preset emission angle, installation height, and first irradiation length; the second calculation unit can be used to calculate the drilling offset of a drilled hole based on the preset emission angle, irradiation depth, and hole diameter; the third calculation unit can be used to calculate the tilt angle based on the irradiation depth and drilling offset.

[0137] In some implementations, the first computing unit may include a first computing subunit and a second computing subunit.

[0138] The first calculation subunit can be used to calculate the second irradiation length of the preset light in a drilled hole based on the preset emission angle, installation height and first irradiation length; the second calculation subunit can be used to calculate the irradiation depth based on the preset emission angle and second irradiation length.

[0139] In some implementations, the second computing unit may include a third computing subunit and a fourth computing subunit.

[0140] The third calculation subunit can be used to calculate the projection of the second irradiation length on the top surface of the PCB board based on the preset emission angle and irradiation depth, and obtain the projection length; the fourth calculation subunit can be used to calculate the drilling offset based on the hole diameter and the projection length.

[0141] In some implementations, the first computational subunit may be a first computational secondary subunit and a second computational secondary subunit.

[0142] The first calculation subunit can be used to calculate the third irradiation length of the preset light outside a drilled hole based on the preset emission angle and installation height; the second calculation subunit can be used to calculate the difference between the first irradiation length and the third irradiation length to obtain the second irradiation length.

[0143] In some implementations, the back drill center offset compensation amount may include a lateral offset compensation amount and a longitudinal offset compensation amount; the preset back drill coordinates may include a preset horizontal coordinate and a preset vertical coordinate; the target back drill coordinates may include a target horizontal coordinate and a target vertical coordinate; the second acquisition module 302 may include an acquisition unit.

[0144] The acquisition unit can be used to acquire the lateral offset compensation amount and the longitudinal offset compensation amount based on the tilt angle and preset depth.

[0145] In some implementations, the correction module 303 may include a first correction unit and a second correction unit.

[0146] The first correction unit can be used to correct the preset horizontal coordinate based on the horizontal offset compensation amount to obtain the target horizontal coordinate; the second correction unit can be used to correct the preset vertical coordinate based on the vertical offset compensation amount to obtain the target vertical coordinate.

[0147] The solution provided in this embodiment obtains the preset back-drill coordinates of the PCB board based on a through-hole, and obtains the back-drill center offset compensation amount based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through-hole. The preset back-drill coordinates are then corrected based on the back-drill center offset compensation amount to obtain the target back-drill coordinates. Based on the target back-drill coordinates, the back-drilling machine is controlled to perform back-drilling on the through-hole. This achieves the determination of the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through-hole, and the correction of the preset back-drill coordinates of the PCB board based on the back-drill center offset compensation amount. The corrected target back-drill coordinates coincide with the center of the inner signal pad of the PCB board, which makes the stub length processed based on the target back-drill coordinates symmetrical, which helps to reduce electromagnetic interference to electronic components on the PCB board.

[0148] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For device embodiments, since they are basically similar to method embodiments, the description is relatively simple; relevant parts can be referred to in the descriptions of the method embodiments. Any processing method described in the method embodiments can be implemented in the device embodiments through corresponding processing modules, and will not be elaborated upon further in the device embodiments.

[0149] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The integrated modules described above can be implemented in hardware or as software functional modules.

[0150] Please see Figure 8 The diagram illustrates a functional block diagram of an electronic device 500 provided in one embodiment of the present application. The electronic device 500 may include one or more of the following components: a memory 501, a processor 502, and one or more application programs. One or more application programs may be stored in the memory 501 and configured to be executed by one or more processors 502. One or more application programs are configured to perform the methods described in the foregoing method embodiments.

[0151] The memory 501 may include random access memory (RAM) or read-only memory. The memory 501 may be used to store instructions, programs, code, code sets, or instruction sets. The memory 501 may include a program storage area and a data storage area. The program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (e.g., obtaining preset back-drill coordinates, obtaining back-drill center offset compensation, correcting preset back-drill coordinates, obtaining target back-drill coordinates, controlling the back-drilling machine, performing back-drilling processing, controlling a displacement sensor, emitting preset light, obtaining a first irradiation length, calculating an inclination angle, calculating irradiation depth, calculating borehole offset, calculating a second irradiation length, calculating projection, obtaining projection length, calculating a third irradiation length, obtaining lateral offset compensation, obtaining longitudinal offset compensation, correcting preset horizontal coordinates, obtaining target horizontal coordinates, correcting preset vertical coordinates, and obtaining target vertical coordinates, etc.), and instructions for implementing the various method embodiments described below. The data storage area can also store data created by the electronic device 500 during use (such as PCB board, through hole, preset back drill coordinates, inner signal layer, preset depth, tilt angle, back drill center offset compensation, target back drill coordinates, back drill machine, displacement sensor, preset emission angle, preset light, inner wall, first irradiation length, installation height, hole diameter, irradiation depth, drilling offset, second irradiation length, top surface, projection, projection length, third irradiation length, lateral offset compensation, longitudinal offset compensation, preset horizontal coordinate, preset vertical coordinate, target horizontal coordinate, and target vertical coordinate).

[0152] Processor 502 may include one or more processing cores. Processor 502 connects to various parts within the electronic device 500 using various interfaces and lines, and performs various functions and processes data of the electronic device 500 by running or executing instructions, programs, code sets, or instruction sets stored in memory 501, and by calling data stored in memory 501. Optionally, processor 502 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). Processor 502 may integrate one or a combination of several of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), and modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the displayed content; and the modem handles wireless communication. It is understood that the modem may also not be integrated into processor 502 and may be implemented separately using a communication chip.

[0153] Please refer to Figure 9 This diagram illustrates a structural block diagram of a computer-readable storage medium 600 provided in an embodiment of this application. The computer-readable storage medium 600 stores program code 601, which can be called by a processor to execute the methods described in the above method embodiments.

[0154] The computer-readable storage medium 600 may be an electronic memory such as flash memory, EEPROM (Electrically Erasable Programmable Read-Only Memory), EPROM, hard disk, or ROM. Optionally, the computer-readable storage medium 600 includes a non-transitory computer-readable storage medium. The computer-readable storage medium 600 has storage space for program code 601 that performs any of the method steps described above. This program code can be read from or written to one or more computer program products. The program code 601 may be compressed, for example, in a suitable form.

[0155] Please refer to Figure 10This diagram illustrates a structural block diagram of a computer program product 700 provided in an embodiment of this application. The computer program product 700 includes a computer program / instructions 701, which is stored in a computer-readable storage medium of a computer device. When the computer program product 700 runs on the computer device, the processor of the computer device reads the computer program / instructions 701 from the computer-readable storage medium, and executes the computer program / instructions 701, causing the computer device to perform the methods described in the above method embodiments.

[0156] The solution provided in this embodiment obtains the preset back-drill coordinates of the PCB board based on a through-hole, and obtains the back-drill center offset compensation amount based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through-hole. The preset back-drill coordinates are then corrected based on the back-drill center offset compensation amount to obtain the target back-drill coordinates. Based on the target back-drill coordinates, the back-drilling machine is controlled to perform back-drilling on the through-hole. This achieves the determination of the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the through-hole, and the correction of the preset back-drill coordinates of the PCB board based on the back-drill center offset compensation amount. The corrected target back-drill coordinates coincide with the center of the inner signal pad of the PCB board, which makes the stub length processed based on the target back-drill coordinates symmetrical, which helps to reduce electromagnetic interference to electronic components on the PCB board.

[0157] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A back-drilling machining method for processing PCB boards, characterized in that, The back drilling method includes: Based on a through hole in the PCB board, obtain the preset back-drill coordinates of the PCB board; The back-drill center offset compensation amount of the PCB is obtained based on the preset depth of the inner signal layer of the PCB and the tilt angle of the drilled hole. The preset back drill coordinates are corrected based on the back drill center offset compensation amount to obtain the target back drill coordinates; Based on the target back-drilling coordinates, control the back-drilling machine to perform back-drilling processing on the through hole.

2. The back-drilling machining method according to claim 1, characterized in that, Before obtaining the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled hole, the back-drilling processing method further includes: The displacement sensor is controlled to emit a preset light at a preset emission angle to the inner wall of the drilled hole; The first irradiation length of the preset light irradiated by the displacement sensor onto the inner wall is obtained; The tilt angle is calculated based on the installation height of the displacement sensor from the PCB board, the diameter of the drilled hole, the preset emission angle, and the first irradiation length.

3. The back-drilling machining method according to claim 2, characterized in that, The step of calculating the tilt angle based on the installation height of the displacement sensor to the PCB board, the diameter of the drilled hole, the preset emission angle, and the first irradiation length includes: The irradiation depth of the preset light in the drilled hole is calculated based on the preset emission angle, the installation height, and the first irradiation length. The drilling offset of the through hole is calculated based on the preset emission angle, the irradiation depth, and the aperture. The tilt angle is calculated based on the irradiation depth and the borehole offset.

4. The back-drilling machining method according to claim 3, characterized in that, The step of calculating the irradiation depth of the preset light within a drilled hole based on the preset emission angle, the installation height, and the first irradiation length includes: Based on the preset emission angle, the installation height, and the first irradiation length, the second irradiation length of the preset light within the drilled hole is calculated; The irradiation depth is calculated based on the preset emission angle and the second irradiation length.

5. The back drilling method according to claim 4, characterized in that, The step of calculating the drilling offset of the through hole based on the preset emission angle, the irradiation depth, and the aperture includes: Based on the preset emission angle and the irradiation depth, the projection of the second irradiation length onto the top surface of the PCB board is calculated to obtain the projection length; The borehole offset is calculated based on the borehole diameter and the projected length.

6. The back drilling method according to claim 4, characterized in that, The step of calculating the second irradiation length of the preset light within the drilled hole based on the preset emission angle, the installation height, and the first irradiation length includes: Based on the preset emission angle and the installation height, calculate the third irradiation length of the preset light outside the drilled hole; The difference between the first irradiation length and the third irradiation length is calculated to obtain the second irradiation length.

7. The back-drilling method according to any one of claims 1 to 6, characterized in that, The back drill center offset compensation amount includes lateral offset compensation amount and longitudinal offset compensation amount; the preset back drill coordinates include preset horizontal coordinates and preset vertical coordinates; and the target back drill coordinates include target horizontal coordinates and target vertical coordinates. The step of obtaining the back-drill center offset compensation amount of the PCB board based on the preset depth of the inner signal layer of the PCB board and the tilt angle of the drilled hole includes: The lateral offset compensation amount and the longitudinal offset compensation amount are obtained based on the tilt angle and the preset depth; The step of correcting the preset back drill coordinates based on the back drill center offset compensation amount to obtain the target back drill coordinates includes: The preset horizontal coordinate is corrected based on the horizontal offset compensation amount to obtain the target horizontal coordinate; The preset ordinate is corrected based on the longitudinal offset compensation amount to obtain the target ordinate.

8. An electronic device, characterized in that, include: Memory; One or more processors are coupled to the memory; One or more applications, wherein the one or more applications are stored in the memory and configured to be executed by the one or more processors, the one or more applications being configured to perform the back-drilling machining method as described in any one of claims 1 to 7.

9. A multilayer circuit board, characterized in that, The multilayer circuit board is manufactured by back-drilling the PCB board according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium contains program code that can be called by a processor to execute the back-drilling machining method as described in any one of claims 1 to 7.

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