Electronic device

Abstract

The invention relates to an electronic device, which comprises a mainboard, a metal shielding cover body, a near field communication (NFC) antenna module and a shielding piece, the metal shielding cover body covers one side of the mainboard and comprises a top surface far away from the mainboard and an accommodating groove recessed in the top surface. The near field communication antenna module is arranged in the accommodating groove, and the near field communication antenna module is in signal connection with the mainboard. The shielding piece is arranged on the top surface and comprises an induction area corresponding to the near field communication antenna module, and the induction area comprises a plurality of penetrating openings and a supporting structure located among the penetrating openings.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device having a near-field communication antenna module. Background Technology

[0002] With the advancement of technology, electronic devices are moving towards thinner and more multifunctional designs. Some electronic devices are capable of non-contact point-to-point data transmission, thus increasing ease of use. How to provide good non-contact point-to-point data transmission performance in electronic devices while considering overall thickness is a research goal in this field. Summary of the Invention

[0003] The purpose of this invention is to provide an electronic device whose near-field communication antenna module can provide good non-contact point-to-point data transmission without affecting the overall thickness.

[0004] An electronic device according to the present invention includes a motherboard, a metal shielding cover, a near-field communication (NFC) antenna module, and a shielding member. The metal shielding cover is disposed on one side of the motherboard and includes a top surface away from the motherboard and a receiving groove recessed in the top surface. The NFC antenna module is disposed within the receiving groove and is signal-connected to the motherboard. The shielding member is disposed on the top surface and includes a sensing area corresponding to the NFC antenna module, wherein the sensing area includes a plurality of through-holes and a support structure located between these through-holes.

[0005] In one embodiment of the present invention, the aforementioned receiving groove gradually expands from the side away from the top surface to the side adjacent to the top surface, and the near-field communication antenna module is lower than the top surface of the metal shield.

[0006] In one embodiment of the present invention, the above-mentioned receiving groove includes a bottom surface and a plurality of inclined surfaces, and there is an angle θ between any of these inclined surfaces and a normal direction of the bottom surface. The height of the metal shield is H, the width of the near-field communication antenna module is W, and arctan[H / (W / 2)]≤θ≤arctan[H / (W / 4)].

[0007] In one embodiment of the present invention, the aforementioned receiving groove includes a bottom surface and a plurality of inclined surfaces, wherein any one of these inclined surfaces has an angle θ with a normal direction of the bottom surface, 10°≤θ≤30°.

[0008] In one embodiment of the present invention, the above-mentioned near-field communication antenna module includes a first coil group and a second coil group located on different planes and whose projections overlap, each of the first coil group and the second coil group including at least one coil turn.

[0009] In one embodiment of the present invention, the above-mentioned near-field communication antenna module is composed of multiple coils located in the same plane.

[0010] In one embodiment of the present invention, the above-mentioned support structure includes a first connecting strip and a second connecting strip that cross the sensing area and intersect each other, and the through-holes are separated by the first connecting strip and the second connecting strip.

[0011] In one embodiment of the present invention, the sensing area is a rectangle, the first connecting strip connects the midpoints of the two long sides of the rectangle, and the second connecting strip connects the midpoints of the two short sides of the rectangle.

[0012] In one embodiment of the present invention, the sensing area is a rectangle, a first connecting strip connects two opposite endpoints of the rectangle, and a second connecting strip connects the other two opposite endpoints of the rectangle.

[0013] In one embodiment of the present invention, the area of ​​the aforementioned through-holes accounts for more than 90% of the area of ​​the sensing area.

[0014] In one embodiment of the present invention, the electronic device further includes a touch display layer and a metal back cover. The touch display layer is disposed on the shielding member. The motherboard is located between the metal back cover and the metal shielding cover.

[0015] Based on the above, the electronic device of the present invention has a recessed receiving groove on the top surface of a metal shielding cover used to cover the motherboard, and the near-field communication antenna module is disposed within the receiving groove. Since the metal shielding cover separates the motherboard from the near-field communication antenna module, it can effectively shield the influence of components on the motherboard on the near-field communication antenna module, thereby improving the performance of the near-field communication antenna module. Furthermore, a shielding element is disposed on the top surface of the metal shielding cover and includes a sensing area corresponding to the near-field communication antenna module. A through-hole in the sensing area allows the radiated signal from the near-field communication antenna module to pass through for non-contact point-to-point data transmission. In addition, the support structure between these through-holes maintains the overall structural strength of the sensing area while allowing the radiated signal to pass through. Attached Figure Description

[0016] Figure 1 This is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.

[0017] Figure 2A yes Figure 1 A schematic diagram of the first side of the near-field communication antenna module.

[0018] Figure 2B yes Figure 1 A schematic diagram of the second side of the near-field communication antenna module.

[0019] Figure 3 This is a schematic diagram of the first side of a near-field communication antenna module according to another embodiment of the present invention.

[0020] Figure 4 yes Figure 1 A schematic diagram of the shielding component.

[0021] Figure 5 This is a schematic diagram of a shielding component according to another embodiment of the present invention.

[0022] The attached figures are labeled as follows:

[0023] θ: included angle

[0024] D: Normal direction

[0025] F1, F2: Pin connections

[0026] H: Height

[0027] L, L1, L2: Length

[0028] W, W1, W2: Width

[0029] 100: Electronic devices

[0030] 110: Motherboard

[0031] 120: Metal shielding enclosure

[0032] 122: Top surface

[0033] 124: Receptacle

[0034] 126: Bottom

[0035] 128: Bevel

[0036] 130, 130a: Near-field communication antenna modules

[0037] 131: Insulation layer

[0038] 132: First Page

[0039] 133: Second Page

[0040] 134: First coil group

[0041] 135: Second coil group

[0042] 136: Coil

[0043] 140, 140a: Shielding components

[0044] 141: Sensing Area

[0045] 142: Penetration

[0046] 143: Supporting Structure

[0047] 144: First connecting strip

[0048] 145: Second connecting strip

[0049] 150: Touch display layer

[0050] 155: Cover plate

[0051] 160: Metal back cover

[0052] 170: Ferrite magnetic sheet Detailed Implementation

[0053] Figure 1 This is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. Please refer to... Figure 1 In this embodiment, the electronic device 100 may be, for example, a tablet computer or a mobile phone, but the type of electronic device 100 is not limited thereto. The electronic device 100 includes a motherboard 110, a metal shielding cover 120, a near field communication (NFC) antenna module 130, and a shielding component 140.

[0054] A metal shielding cover 120 is installed on one side of the mainboard 110. It should be noted that... Figure 1 For illustration only, and the components on the motherboard 110 are not shown, the metal shield 120 actually has an internal space, and the components on the motherboard 110 are located in the internal space of the metal shield 120, which can provide electromagnetic protection. Figure 1 This is a simplified illustration of the positional relationship between the metal shielding cover 120 and the mainboard 110.

[0055] The metal shielding enclosure 120 includes a top surface 122 away from the motherboard 110 and a receiving groove 124 recessed in the top surface 122. The near-field communication antenna module 130 is disposed within the receiving groove 124 of the metal shielding enclosure 120. In this embodiment, the operating frequency band of the near-field communication antenna module 130 is, for example, 13.56MHz, but is not limited thereto.

[0056] In this embodiment, the electronic device 100 has a recessed receiving groove 124 on the top surface 122 of the metal shielding cover 120 used to cover the motherboard 110. The near-field communication antenna module 130 is disposed in the receiving groove 124. Since the metal shielding cover 120 separates the motherboard 110 from the near-field communication antenna module 130, the metal shielding cover 120 can effectively shield the components on the motherboard 110 from the influence of the near-field communication antenna module 130, thereby improving the performance of the near-field communication antenna module 130.

[0057] Furthermore, in this embodiment, the near-field communication antenna module 130 is lower than the top surface 122 of the metal shield 120. Therefore, the near-field communication antenna module 130 does not additionally increase the thickness of the electronic device 100. In addition, since the top surface 122 of the metal shield 120 is higher than the near-field communication antenna module 130, this design can effectively eliminate the influence of eddy currents on magnetic flux, thereby improving the performance of the near-field communication antenna module 130.

[0058] In addition, a ferrite sheet 170 is attached below the near-field communication antenna module 130. The ferrite sheet 170 is disposed in the receiving groove 124, which does not affect the thickness of the electronic device 100.

[0059] Depend on Figure 1 As can be seen, the receiving groove 124 of the metal shielding cover 120 extends from the side away from the top surface 122 to the side adjacent to the top surface 122. Figure 1 The accommodating slot 124 gradually expands from the bottom to the top (from bottom to top). Specifically, the accommodating slot 124 includes a bottom surface 126 and a plurality of inclined surfaces 128, which are inclined toward the shielding member 140. The accommodating slot 124, which expands further toward the top surface 122, can prevent the metal shielding cover 120 from blocking the radiation of the near-field communication antenna module 130, and can further improve the coverage of the radiation signal of the near-field communication antenna module 130.

[0060] In a preferred embodiment, any one of these inclined planes 128 forms an angle θ with a normal direction D of the bottom surface 126, the height of the metal shield 120 is H, and the width of the near-field communication antenna module 130 is W, where arctan[H / (W / 2)]≤θ≤arctan[H / (W / 4)]. Experiments have shown that when the angle θ is within this range, the near-field communication antenna module 130 can have better radiated power. In a preferred embodiment, the angle θ is within this range, 10°≤θ≤30°. Of course, the range of the angle θ is not limited to the above.

[0061] Figure 2A yes Figure 1 A schematic diagram of the first side of the near-field communication antenna module. Figure 2B yes Figure 1 A schematic diagram of the second side of the near-field communication antenna module. Please refer to [link / reference]. Figure 1 , Figure 2A and Figure 2B In this embodiment, the near-field communication antenna module 130 includes a first coil group 134 and a second coil group 135 located on different planes and whose projections overlap. Each of the first coil group 134 and the second coil group 135 includes at least one coil 136.

[0062] Specifically, in this embodiment, the near-field communication antenna module 130 includes an insulating layer 131, and the insulating layer 131 includes a first surface 132 on opposite sides. Figure 2A ) and a second side 133 ( Figure 2B The first coil group 134 is located on the first surface 132, and the second coil group 135 is located on the second surface 133. In this embodiment, the first coil group 134 includes two coils 136, and the second coil group 135 includes two coils 136. Of course, the number and position of the coils 136 are not limited thereto.

[0063] In this embodiment, the length L1 of the first coil group 134 is 37 cm and the width W1 is 18 cm, the same as the dimensions of the second coil group 135. The values ​​of length L1 and width W1 are not limited thereto. Furthermore, in this embodiment, the near-field communication antenna module 130 connects via pins F1 and F2 (… Figure 2B The signal is connected to the mainboard 110. Of course, the form of the near-field communication antenna module 130 is not limited to this.

[0064] Figure 3 This is a schematic diagram of the first side of a near-field communication antenna module according to another embodiment of the present invention. Please refer to... Figure 3 , Figure 3 The near-field communication antenna module 130a and Figure 1 The main difference between the near-field communication antenna module 130 and the previous one is that, in this embodiment, the near-field communication antenna module 130a is composed of multiple coils 136 located on the same plane. Specifically, the near-field communication antenna module 130a only has a first coil group 134 on the first surface 132, and no coils 136 on the second surface 133. The first coil group 134 is exemplified by including four coils 136, but this is not a limitation.

[0065] Figure 4 yes Figure 1 A schematic diagram of the shielding component. Please refer to [the diagram]. Figure 1 and Figure 4 In this embodiment, the shielding member 140 is disposed on the top surface 122 of the metal shielding cover 120 and may be made of metal. The shielding member 140 includes a sensing area 141 corresponding to the near-field communication antenna module 130. The length L2 of the sensing area 141 is about 47 cm and the width W2 is about 28 cm, but it is not limited thereto.

[0066] The sensing area 141 includes a plurality of through-holes 142 and a support structure 143 located between these through-holes 142. These through-holes 142 of the sensing area 141 allow radiated signals from the near-field communication antenna module 130 to pass through for contactless point-to-point data transmission.

[0067] Depend on Figure 4As can be seen, the area of ​​these through-holes 142 accounts for more than 90% of the area of ​​the sensing area 141, and has a high perforation rate, thus improving the reading distance at which the electronic device 100 can sense external devices (e.g., cards, not shown).

[0068] In this embodiment, the support structure 143 includes a first connecting strip 144 and a second connecting strip 145 that span the sensing area 141 and intersect each other. In this embodiment, the sensing area 141 is rectangular, the first connecting strip 144 connects the midpoints of the two long sides of the rectangle, and the second connecting strip 145 connects the midpoints of the two short sides of the rectangle. These through-holes 142 are separated by the first connecting strip 144 and the second connecting strip 145. Each of these through-holes 142 is rectangular, and the whole structure forms a matrix similar to 2x2. Of course, the configuration of these through-holes 142 is not limited to this.

[0069] In this embodiment, the shielding member 140 has through-holes 142 stamped into a metal plate. The arrangement of these through-holes 142 is, for example, a parallel arrangement of long-angle holes. Of course, in other embodiments, the arrangement of these through-holes 142 can also be a 30-degree houndstooth pattern, a 45-degree houndstooth pattern, a 90-degree parallel arrangement, a long-round houndstooth pattern, a long-round houndstooth pattern, a corner houndstooth pattern, a corner houndstooth pattern, a hexagonal 60-degree houndstooth pattern, or a long-angle houndstooth pattern. The arrangement of these through-holes 142 is not limited to the above.

[0070] Furthermore, the support structure 143 between these through-holes 142 maintains the overall structural strength of the sensing area 141 of the shield 140, helping to improve the horizontal flatness (waviness) of the shield 140 without affecting the stylus user experience. Without compromising the sensing performance of the near-field communication antenna module 130, the magnetic lines of force of the near-field communication antenna module 130 within the device's internal space can smoothly connect with nearby external devices (such as cards) to transmit electromagnetic signals via near-field coupling. Therefore, the near-field communication antenna module 130 achieves high reading distance and wide coverage, with a reading distance of over 15 millimeters between the electronic device 100 and external devices, meeting the field strength specifications of the NFC Forum.

[0071] Figure 5 This is a schematic diagram of a shielding member according to another embodiment of the present invention. Please refer to... Figure 5 , Figure 5 Shielding component 140a and Figure 4 The main difference of the shielding element 140 is that, in this embodiment, the first connecting strip 144 connects two opposite ends of the rectangle, and the second connecting strip 145 connects the other two opposite ends of the rectangle. Each of these through-holes 142 is triangular. Of course, the shape of the through-holes 142 and the form of the support structure 143 are not limited thereto.

[0072] Please return Figure 1 In this embodiment, the electronic device 100 further includes a touch display layer 150, a cover plate 155, and a metal back cover 160. The motherboard 110 is located between the metal back cover 160 and the metal shielding cover 120. The touch display layer 150 is disposed on the side of the shielding member 140 opposite to the metal shielding cover 120, and is well supported at the position corresponding to the sensing area 141 by the provision of the support structure 143, providing the user with a smooth stylus usage experience. The cover plate 155 is disposed on the touch display layer 150. The touch display layer 150, the shielding member 140, and the cover plate 155 together form a touch display.

[0073] In other words, the electronic device 100 in this embodiment can perform non-contact point-to-point data transmission through the front side of the electronic device 100 by opening a through-hole 142 on the original shield 140 inside the touch display corresponding to the near-field communication antenna module 130, without increasing the thickness of the electronic device 100.

[0074] Through experiments, if... Figure 1 For the electronic device 100, the radiated power measured at multiple locations 1550 mm and 5 mm away from the cover plate 155 on the front side of the cover plate 155 is approximately between 6.7 mW and 9.9 mW, which is greater than the minimum radiated power of 4.68 mW in the specification, and thus shows good performance.

[0075] If we take Figure 3 Regarding the near-field communication antenna module 130 (with four coils 136 on the first surface 132), the radiated power measured at multiple locations 1550 mm and 5 mm away from the cover plate 155 on the front side of the cover plate is approximately between 5.9 mW and 8.6 mW, all of which are greater than the minimum radiated power of 4.68 mW in the specification, thus demonstrating good performance.

[0076] Furthermore, since the electronic device 100 does not sense through the rear, the rear casing of the electronic device 100 does not need to have openings to allow antenna radiation energy to pass through. The material of the rear casing of the electronic device 100 can be selected according to design requirements such as aesthetics; for example, it can be made of a single piece of metal to enhance the texture and provide more flexibility in appearance design.

[0077] In summary, the electronic device of the present invention has a recessed receiving groove on the top surface of a metal shielding housing used to cover the motherboard, and the near-field communication antenna module is disposed within the receiving groove. Since the metal shielding housing separates the motherboard from the near-field communication antenna module, it effectively shields the near-field communication antenna module from the influence of components on the motherboard, thereby improving the performance of the near-field communication antenna module. Furthermore, the receiving groove of the metal shielding housing expands towards the top surface to avoid the metal shielding housing blocking the radiation of the near-field communication antenna module, further improving the coverage of the radiation signal of the near-field communication antenna module. Additionally, a shielding element is disposed on the top surface of the metal shielding housing and includes a sensing area corresponding to the near-field communication antenna module. These through-holes in the sensing area allow the radiation signal of the near-field communication antenna module to pass through for non-contact point-to-point data transmission. Furthermore, the support structure between these through-holes maintains the overall structural strength of the sensing area of ​​the shielding element, providing good support for the touch display layer. Furthermore, since the near-field communication antenna module is located in the accommodating slot and is lower than the top surface of the metal shield, it can reduce the thickness that affects electronic devices and eliminate the influence of eddy currents on magnetic flux.

Claims

1. An electronic device, characterized in that, include: One motherboard; A metal shielding cover is provided on one side of the motherboard, and includes a top surface away from the motherboard and a receiving groove recessed in the top surface; A near-field communication antenna module is disposed in the receiving slot, and the near-field communication antenna module is signal-connected to the main board. as well as A shielding element is disposed on the top surface and includes a sensing area corresponding to the near-field communication antenna module, wherein the sensing area includes a plurality of through-holes and a support structure located between the plurality of through-holes.

2. The electronic device as claimed in claim 1, characterized in that, The receiving slot gradually expands from the side away from the top surface to the side adjacent to the top surface, and the near-field communication antenna module is lower than the top surface of the metal shield.

3. The electronic device as claimed in claim 2, characterized in that, The receiving slot includes a bottom surface and multiple inclined surfaces. Each of the multiple inclined surfaces has an angle θ with a normal direction of the bottom surface. The height of the metal shield is H, and the width of the near-field communication antenna module is W. arctan[H / (W / 2)]≤θ≤arctan[H / (W / 4)].

4. The electronic device as claimed in claim 2, characterized in that, The receiving groove includes a bottom surface and multiple inclined surfaces, and each of the multiple inclined surfaces has an angle θ with a normal direction of the bottom surface, where 10°≤θ≤30°.

5. The electronic device as claimed in claim 1, characterized in that, The near-field communication antenna module includes a first coil group and a second coil group located on different planes and whose projections overlap, each of the first coil group and the second coil group including at least one coil turn.

6. The electronic device as claimed in claim 1, characterized in that, This near-field communication antenna module consists of multiple coils located in the same plane.

7. The electronic device as claimed in claim 1, characterized in that, The support structure includes a first connecting strip and a second connecting strip that cross the sensing area and are intersected with each other, and the plurality of through-holes are separated by the first connecting strip and the second connecting strip.

8. The electronic device as claimed in claim 7, characterized in that, The sensing area is a rectangle, the first connecting strip connects the midpoints of the two long sides of the rectangle, and the second connecting strip connects the midpoints of the two short sides of the rectangle.

9. The electronic device as claimed in claim 7, characterized in that, The sensing area is rectangular, the first connecting strip connects two opposite endpoints of the rectangle, and the second connecting strip connects the other two opposite endpoints of the rectangle.

10. The electronic device as claimed in claim 1, characterized in that, The area of ​​the plurality of through-holes accounts for more than 90% of the area of ​​the sensing area.

11. The electronic device as claimed in claim 1, characterized in that, Also includes: A touch display layer is disposed on the shielding component; as well as A metal back cover, with the motherboard located between the metal back cover and the metal shielding cover.

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