Semiconductor packaging module and PFC circuit module
By combining a semiconductor package module that integrates a switching transistor, a rectifier circuit, and a first diode with components such as inductors and capacitors, a flexible PFC circuit module is formed. This solves the harmonic problem in power electronic devices, saves space and cost, and improves the flexibility and electrical performance of the circuit.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2026-03-13
AI Technical Summary
In the existing technology, the harmonic problems of power electronic equipment cause serious pollution to the public power grid, and the traditional PFC circuit module packaging method occupies a large space, has high cost, and lacks flexibility.
A semiconductor package module is provided, which integrates a switching transistor, a rectifier circuit, and a first diode together, and combines them with components such as inductors and capacitors to form a flexible PFC circuit module. The switching transistor can be controlled by a suitable controller, saving space and improving the flexibility of the circuit.
This approach saves space and cost on the circuit board while improving the flexibility and electrical performance of the PFC circuit and solving the harmonic problem.
Smart Images
Figure CN121665653A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and in particular to a semiconductor packaging module and a PFC circuit module. Background Technology
[0002] The widespread application of power electronic equipment has led to harmonics in power systems, causing serious pollution to the public power grid. To mitigate the harm of power pollution, PFC (Power Factor Correction) circuits are typically incorporated into power electronic equipment to improve the power factor of AC power supplies and reduce their impact on the public power grid. Therefore, it is necessary to provide a highly flexible packaged module to address the harmonic problem. Summary of the Invention
[0003] This application provides a semiconductor packaging module and a PFC circuit module.
[0004] According to a first aspect of the embodiments of this application, a semiconductor packaging module is provided. The semiconductor packaging module includes:
[0005] substrate;
[0006] The circuit includes a switching transistor, a rectifier circuit, and a first diode; the switching transistor, the rectifier circuit, and the first diode are located on the same side of the substrate; the switching transistor includes a control electrode, a first electrode, and a second electrode; the first electrode is electrically connected to the positive electrode of the first diode; the rectifier circuit includes a first AC input terminal and a second AC input terminal.
[0007] Multiple terminals; the multiple terminals include a first terminal electrically connected to the control electrode of the switching transistor, a second terminal electrically connected to the first AC input terminal, a third terminal electrically connected to the second AC input terminal, and a fourth terminal electrically connected to the negative electrode of the first diode;
[0008] A molding compound encapsulates the substrate, the switching transistor, the rectifier circuit, the first diode, and each of the terminals, with each of the terminals exposed from the side of the molding compound.
[0009] In one embodiment, the encapsulation includes opposing first and second sides; a portion of the plurality of terminals are exposed from the first side, and the remainder of the terminals are exposed from the second side.
[0010] In one embodiment, the rectifier circuit further includes a DC negative output terminal and a DC positive output terminal; the plurality of terminals further include a fifth terminal electrically connected to the second pole, a sixth terminal electrically connected to the DC negative output terminal, a seventh terminal electrically connected to the DC positive output terminal, and an eighth terminal electrically connected to the first pole.
[0011] In one embodiment, the encapsulation includes opposing first and second sides; the first terminal, the second terminal, the third terminal, the fifth terminal, and the sixth terminal are exposed from the first side, and the fourth terminal, the seventh terminal, and the eighth terminal are exposed from the second side.
[0012] In one embodiment, the first terminal and the fifth terminal are located on the same side of the sixth terminal, and the second terminal and the third terminal are located on the other side of the sixth terminal; the distance between the first terminal and the sixth terminal and the terminal adjacent to the sixth terminal among the first terminal and the fifth terminal is a first distance, the distance between the second terminal and the sixth terminal and the terminal adjacent to the sixth terminal among the second terminal and the third terminal is a second distance, the distance between the first terminal and the fifth terminal is a third distance, and the distance between the second terminal and the third terminal is a fourth distance; the first distance, the third distance, and the fourth distance are all less than the second distance.
[0013] In one embodiment, the widths of the second terminal, the third terminal, the fifth terminal, and the sixth terminal are respectively greater than the width of the first terminal, and respectively less than the widths of the fourth terminal, the seventh terminal, and the eighth terminal.
[0014] In one embodiment, the fifth terminal is adjacent to the sixth terminal, and the second terminal is adjacent to the third terminal.
[0015] In one embodiment, the eighth terminal is located between the fourth terminal and the seventh terminal.
[0016] In one embodiment, the encapsulation further includes opposing third and fourth sides, wherein among the terminals exposed from the first side, the first terminal is closest to the third side, and the fifth terminal is adjacent to the first terminal; and among the terminals exposed from the second side, the fourth terminal is closest to the third side.
[0017] In one embodiment, the semiconductor packaging module further includes a second diode, the anode of which is electrically connected to the second electrode, and the cathode of which is electrically connected to the first electrode; and / or, the switching transistor is an insulated gate bipolar transistor.
[0018] According to a second aspect of the embodiments of this application, a PFC circuit module is provided. The PFC circuit module includes a sampling resistor, a capacitor, an inductor, and the aforementioned semiconductor packaging module; the rectifier circuit further includes a DC negative output terminal and a DC positive output terminal; the sampling resistor is connected between the DC negative output terminal of the rectifier circuit and the second terminal of the switching transistor; the capacitor is connected between the second terminal of the switching transistor and the negative terminal of the first diode; the inductor is connected between the first terminal of the switching transistor and the DC positive output terminal of the rectifier circuit.
[0019] The semiconductor packaging module provided in this application integrates a switching transistor, a rectifier circuit, and a first diode. This semiconductor packaging module can be used in conjunction with other components to build circuits, offering high application flexibility. When the semiconductor packaging module is used with other components on a circuit board, its position can be flexibly arranged, helping to save space on the circuit board. The semiconductor module can be used with inductors, capacitors, and other components to build PFC circuits to solve harmonic problems in power systems. Compared to using separate switching transistors, rectifier circuits, and first diodes to build PFC circuits on the circuit board, this saves space and reduces costs. Since the control electrode of the switching transistor is electrically connected to the first terminal, a suitable controller can be selected and connected to the first terminal to control the switching transistor, improving the flexibility of the circuits built using the semiconductor packaging module. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of a semiconductor packaging module provided in an exemplary embodiment of this application;
[0021] Figure 2 This is a circuit diagram of a semiconductor packaging module provided in an exemplary embodiment of this application;
[0022] Figure 3 This is a schematic diagram of the structure of the substrate of a semiconductor packaging module provided in an exemplary embodiment of this application;
[0023] Figure 4 This is a circuit diagram of a PFC circuit module provided in an exemplary embodiment of this application. Specific Implementation
[0024] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0025] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."
[0026] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0027] This application provides a semiconductor packaging module. For example... Figure 1 and Figure 2 As shown, the semiconductor packaging module includes a substrate 10, a switching transistor 20, a rectifier circuit 30, a first diode 40, multiple terminals 50, and a plastic encapsulation body 60.
[0028] The switching transistor 20, the rectifier circuit 30, and the first diode 40 are located on the same side of the substrate 10. The switching transistor 20 includes a control electrode 21, a first electrode 22, and a second electrode 23. The first electrode 22 is electrically connected to the positive electrode of the first diode 40. The rectifier circuit 30 includes a first AC input terminal 31 and a second AC input terminal 32. The plurality of terminals 50 include a first terminal 51 electrically connected to the control electrode 21 of the switching transistor 20, a second terminal 52 electrically connected to the first AC input terminal 31, a third terminal 53 electrically connected to the second AC input terminal 32, and a fourth terminal 54 electrically connected to the negative electrode of the first diode 40. The molding compound 60 encapsulates the substrate 10, the switching transistor 20, the rectifier circuit 30, the first diode 40, and each of the terminals 50. The molding compound 60 includes multiple sides, and each of the terminals 50 is exposed from the side of the molding compound 60.
[0029] The semiconductor packaging module provided in this application encapsulates the switching transistor 20, the rectifier circuit 30, and the first diode 40 together. The semiconductor packaging module can be used with other components to build circuits, and its application is highly flexible. When the semiconductor packaging module is used with other components to build circuits on a circuit board, the position of the semiconductor packaging module can be flexibly placed, which helps to save space occupied by the circuit on the circuit board. The semiconductor module can be used with inductors, capacitors, and other components to build PFC circuits to solve the harmonic problems of the power system. Compared with the solution of building PFC circuits on the circuit board using independent switching transistors, rectifier circuits, and first diodes, it can save space occupied by the PFC circuit on the circuit board, which helps to save costs. Since the control electrode 21 of the switching transistor 20 is electrically connected to the first terminal, a suitable controller can be selected to connect to the first terminal to control the switching transistor 20 according to the application scenario of the semiconductor packaging module, which helps to improve the flexibility of the circuit built by the semiconductor packaging module.
[0030] In one embodiment, such as Figure 1 and Figure 3 As shown, the substrate 10 includes an insulating substrate 11 and a conductive film layer located on one side of the insulating substrate 11. The conductive film layer is a patterned film layer including multiple conductive blocks: a first conductive block 91, a second conductive block 92, a third conductive block 93, a fourth conductive block 94, a fifth conductive block 95, a sixth conductive block 96, a seventh conductive block 97, and an eighth conductive block 98. The switching transistor 20, the rectifier circuit 30, and the first diode 40 are located on the side of the conductive film layer away from the insulating substrate 11. Each terminal 50 is a part of a conductive block.
[0031] In one embodiment, the substrate 10 is a DBC (Directed Bonding Copper) substrate, comprising a ceramic substrate and two copper film layers located on opposite sides of the ceramic substrate. The switching transistor 20, the rectifier circuit 30, and the first diode 40 are mounted on one of the copper film layers, which is the aforementioned conductive film layer.
[0032] In one embodiment, such as Figure 1 and Figure 2As shown, the rectifier circuit 30 further includes a DC negative output terminal 33 and a DC positive output terminal 34; the plurality of terminals 50 further includes a fifth terminal 55 electrically connected to the second pole 23 of the switching transistor 20, a sixth terminal 56 electrically connected to the DC negative output terminal 33, a seventh terminal 57 electrically connected to the DC positive output terminal 34, and an eighth terminal 58 electrically connected to the first pole 22. When the semiconductor package module is used in the PFC circuit, a sampling resistor is connected between the fifth terminal 55 and the sixth terminal 56, an inductor is connected between the seventh terminal 57 and the eighth terminal 58, and a capacitor is connected between the fifth terminal 55 and the fourth terminal 54. That is, the sampling resistor, capacitor, and inductor are not packaged in the semiconductor package module, resulting in a smaller size of the semiconductor package module.
[0033] In one embodiment, such as Figure 1 As shown, the molding compound 60 includes a first side 61 and a second side 62 facing each other. A portion of the plurality of terminals 50 protrude from the first side 61, while the remaining terminals 50 protrude from the second side 62. This arrangement, with the terminals distributed on both sides of the molding compound 60, allows for more even stress distribution on the opposite sides of the semiconductor packaging module during soldering with other structures, such as circuit boards. This helps prevent warping or deformation of the power semiconductor packaging module.
[0034] In one embodiment, the switching transistor 20 is an insulated-gate bipolar transistor (IGBT), with the first electrode 22 as the collector and the second electrode 23 as the emitter. IGBTs have good voltage withstand capability and low on-resistance, which is beneficial for improving the performance of the PFC circuit within the semiconductor package. In other embodiments, the switching transistor 20 may be a MOSFET, with one of the first electrode 22 and the second electrode 23 serving as the source and the other as the drain.
[0035] In one embodiment, such as Figure 1 and Figure 2 As shown, the rectifier circuit 30 is a bridge rectifier circuit, including four diodes: diode 301, diode 302, diode 303 and diode 304. The positive terminals of diode 301 and 302 are connected to the DC negative output terminal 33, respectively; the negative terminals of diode 301 and 303 are connected to the first AC input terminal 31, respectively; the negative terminals of diode 302 and 304 are connected to the second AC input terminal 32, respectively; and the negative terminals of diode 304 and 303 are connected to the DC positive output terminal 34, respectively.
[0036] In one embodiment, such as Figure 1 and Figure 2As shown, the semiconductor packaging module further includes a second diode 70. The anode of the second diode 70 is electrically connected to the second terminal 23 of the switching transistor 20, and the cathode of the second diode 70 is electrically connected to the first terminal 22 of the switching transistor 20. By providing the second diode 70, when the semiconductor packaging module is used in a PFC circuit, the energy in the inductor of the PFC circuit can be released through the second diode 70 when the switching transistor is turned off, protecting other components in the PFC circuit from damage.
[0037] In one embodiment, such as Figure 1 and Figure 3 As shown, the molding compound 60 includes a first side 61 and a second side 62 facing each other. The first terminal 51, the second terminal 52, the third terminal 53, the fifth terminal 55, and the sixth terminal 56 are exposed from the first side 61, and the fourth terminal 54, the seventh terminal 57, and the eighth terminal 58 are exposed from the second side 62. When the semiconductor package module is used in a PFC circuit, the voltages of the first terminal 51, the second terminal 52, the third terminal 53, the fifth terminal 55, and the sixth terminal 56 are relatively low, while the voltages of the fourth terminal 54, the seventh terminal 57, and the eighth terminal 58 are relatively high. Placing the terminals with higher voltages and the terminals with lower voltages on opposite sides of the molding compound 60 allows for a larger electrical clearance between the terminals with higher voltages, which helps improve the electrical performance of the semiconductor package module.
[0038] In one embodiment, such as Figure 1 and Figure 3 As shown, the first terminal 51 and the fifth terminal 55 are located on the same side of the sixth terminal 56, and the second terminal 52 and the third terminal 53 are located on the other side of the sixth terminal 56. The distance between the terminal adjacent to the sixth terminal 56 in the first terminal 51 and the fifth terminal 55 is a first distance; the distance between the terminal adjacent to the sixth terminal 56 in the second terminal 52 and the third terminal 53 is a second distance; the distance between the first terminal 51 and the fifth terminal 55 is a third distance; and the distance between the second terminal 52 and the third terminal 53 is a fourth distance. The first distance, the third distance, and the fourth distance are all less than the second distance. When the semiconductor package module is used in a PFC circuit, the voltage difference between the sixth terminal 56 and the second terminal 52 and the third terminal 53 is greater than the voltage difference between the second terminal 52 and the third terminal 53, and also greater than the voltage difference between the sixth terminal 56 and the fifth terminal 55 and the first terminal 51. This arrangement ensures sufficient electrical clearance between adjacent pins. Figure 1 and Figure 3In the embodiment shown, the fifth terminal 55 is adjacent to the sixth terminal 56, and the second terminal 52 is adjacent to the sixth terminal 56. Therefore, the distance between the sixth terminal 56 and the second terminal 52 is greater than the distance between the first terminal 51 and the fifth terminal 55 and the distance between the second terminal 52 and the sixth terminal 56.
[0039] In one embodiment, such as Figure 1 and Figure 3 As shown, the widths of the second terminal 52, the third terminal 53, the fifth terminal 55, and the sixth terminal 56 are respectively greater than the width of the first terminal 51, and respectively less than the widths of the fourth terminal 54, the seventh terminal 57, and the eighth terminal 58. When the semiconductor packaged module is used in a PFC circuit, the current flowing through the second terminal 52, the third terminal 53, the fifth terminal 55, and the sixth terminal 56 is greater than the current flowing through the first terminal 51. Setting the widths of the second terminal 52, the third terminal 53, the fifth terminal 55, and the sixth terminal 56 to be greater than the width of the first terminal 51 ensures that the current-carrying capacity of each terminal exposed from the first side of the encapsulation 60 meets the requirements. The current flowing through the fourth terminal 54, the seventh terminal 57, and the eighth terminal 58 is also greater than the current flowing through the second terminal 52, the third terminal 53, the fifth terminal 55, and the sixth terminal 56. Setting the widths of the fourth terminal 54, the seventh terminal 57, and the eighth terminal 58 to be larger ensures that the current-carrying capacity of these terminals meets the requirements.
[0040] In one embodiment, such as Figure 1 and Figure 3 As shown, the distance between two adjacent terminals of the fourth terminal 54, the seventh terminal 57 and the eighth terminal 58 is basically the same. Figure 1 and Figure 3 In the illustrated embodiment, the eighth terminal 58 is located between the fourth terminal 54 and the seventh terminal 57, and the distance between the eighth terminal 58 and the fourth terminal 54 is substantially the same as the distance between the eighth terminal 58 and the seventh terminal 57. This arrangement allows for a larger distance between adjacent terminals, which is more conducive to meeting the electrical clearance requirements between adjacent terminals.
[0041] In one embodiment, such as Figure 1 and Figure 3As shown, the first terminal 51 and the fifth terminal 55 are located on the same side of the sixth terminal 56, the second terminal 52 and the third terminal 53 are located on the other side of the sixth terminal 56, and the fifth terminal 55 is located between the first terminal 51 and the sixth terminal 56. When the semiconductor package module is used in a PFC circuit, a sampling resistor is connected between the fifth terminal 55 and the sixth terminal 56, and an AC current is connected between the second terminal 52 and the third terminal 53. This positional relationship allows the two terminals connected to the sampling resistor to be adjacent, and the two terminals connected to the AC current to be adjacent, thereby reducing the length of the connection line between the semiconductor package module and the sampling resistor and the AC current, and facilitating the connection between the semiconductor package module and the sampling resistor and the AC current.
[0042] In one embodiment, such as Figure 1 and Figure 3 As shown, the eighth terminal 58 is located between the fourth terminal 54 and the seventh terminal 57. When the semiconductor package module is used in a PFC circuit, an inductor is connected between the eighth terminal 58 and the seventh terminal 57. The above-mentioned positional relationship makes the two terminals connected to the inductor adjacent, which can reduce the length of the connection line between the semiconductor package module and the inductor and facilitate the connection between the semiconductor package module and the inductor.
[0043] In one embodiment, such as Figure 1 and Figure 3 As shown, the molding compound 60 also includes a third side 63 and a fourth side 64 facing each other. The third side 63 and the fourth side 64 are respectively connected to the first side 61 and the second side 62. Among the terminals 50 exposed from the first side 61, the distance between the first terminal 51 and the third side 63 is the smallest, and the fifth terminal 55 is adjacent to the first terminal 51. Among the terminals 50 exposed from the second side 62, the distance between the fourth terminal 54 and the third side 63 is the smallest. When the semiconductor package module is used in a PFC circuit, a capacitor is connected between the fifth terminal 55 and the fourth terminal 54. The above-mentioned positional relationship makes the distance between the two terminals connected to the capacitor smaller, which can reduce the length of the connection line between the semiconductor package module and the capacitor, and facilitate the connection between the semiconductor package module and the capacitor.
[0044] In one embodiment, such as Figure 1 and Figure 3As shown, a portion of the first conductive block 91 is the first terminal 51, a portion of the second conductive block 92 is the eighth terminal 58, a portion of the third conductive block 93 is the fourth terminal 54, a portion of the fourth conductive block 94 is the seventh terminal 57, a portion of the fifth conductive block 95 is the third terminal 53, a portion of the sixth conductive block 96 is the second terminal 52, a portion of the seventh conductive block 97 is the sixth terminal 56, and a portion of the eighth conductive block 98 is the fifth terminal 55.
[0045] In one embodiment, such as Figure 1 As shown, the switching transistor 20 is mounted on the second conductive block 92. The first electrode of the switching transistor 20 faces the second conductive block 92 and is electrically connected to it. The second electrode 23 of the switching transistor 20 is electrically connected to the eighth conductive block 98 via a lead 80. The gate 21 of the switching transistor 20 is electrically connected to the first conductive block 91 via a lead 80. The first diode 40 is mounted on the third conductive block 93. The cathode of the first diode 40 faces the third conductive block 93 and is electrically connected to it. The anode of the first diode 40 is electrically connected to the second conductive block 92 via a bonding wire 80, thereby connecting the first electrode of the switching transistor 20 to the second conductive block 92. The second diode 70 is mounted on the second conductive block 92. The cathode of the second diode 70 faces the second conductive block 92 and is electrically connected to it. The anode of the second diode 70 is electrically connected to the second electrode 23 of the switching transistor 20 via a lead 80. In the rectifier circuit 30, diode 301 is mounted on the sixth conductive block 96, diode 302 is mounted on the fifth conductive block 95, and diodes 303 and 304 are mounted on the fourth conductive block 94. The cathode of diode 301 faces the sixth conductive block 96 and is electrically connected to it, while the anode of diode 301 is electrically connected to the seventh conductive block 97 via lead 80. The cathode of diode 302 faces the fifth conductive block 95 and is electrically connected to it, while the anode of diode 302 is electrically connected to the anode of diode 301 via lead 80. The cathode of diode 303 faces the fourth conductive block 94 and... The diode 303 is electrically connected to the fourth conductive block 94, and the positive terminal of the diode 303 is electrically connected to the sixth conductive block 96 through the lead 80; the negative terminal of the diode 304 faces the fourth conductive block 94 and is electrically connected to the fourth conductive block 94, and the positive terminal of the diode 304 is electrically connected to the fifth conductive block 95 through the lead 80; a part of the seventh conductive block 97 is the first AC input terminal of the rectifier circuit 30, a part of the fifth conductive block 95 is the second AC input terminal of the rectifier circuit 30, a part of the seventh conductive block 97 is the DC negative output terminal of the rectifier circuit 30, and a part of the fourth conductive block 94 is the DC positive output terminal of the rectifier circuit 30.
[0046] In one embodiment, such as Figure 1As shown, the switching transistor 20 includes two second electrodes 23, which are electrically connected to the eighth conductive block 98 via leads 80.
[0047] This application also provides a PFC circuit module, including the semiconductor packaging module, sampling resistor, capacitor and inductor described in any of the above embodiments. Figure 4 This is the circuit diagram of the PFC circuit module. (For example...) Figure 4 As shown, AC power (AC) is connected between the first AC input terminal 31 and the second AC input terminal 32 of the rectifier circuit 30; a sampling resistor R is connected between the DC negative output terminal 33 of the rectifier circuit 30 and the second terminal 23 of the switching transistor 20; a capacitor is connected between the second terminal 23 of the switching transistor 20 and the negative terminal of the first diode 40; and an inductor L is connected between the first terminal 22 of the switching transistor 20 and the DC positive output terminal 34 of the rectifier circuit 30. This is achieved by using the semiconductor packaging module provided in the embodiments of this application. Figure 4 In the PFC circuit shown, AC power is connected between the second terminal 52 and the third terminal 53, a sampling resistor R is connected between the sixth terminal 56 and the fifth terminal 55, a capacitor C is connected between the fifth terminal 55 and the fourth terminal 54, and an inductor L is connected between the eighth terminal 58 and the seventh terminal 57. Figure 4 The PFC circuit shown.
[0048] Figure 4 The working principle of the PFC circuit module shown is as follows: The controller collects the current flowing through the sampling resistor R, and controls the on and off time of the switching transistor according to the waveform of the current through the sampling resistor, so that the waveform of the input current is as consistent as possible with the waveform of the input voltage, thereby improving the power factor.
[0049] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.
[0050] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.
[0051] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A semiconductor packaging module, characterized in that, The semiconductor packaging module includes: substrate; The circuit includes a switching transistor, a rectifier circuit, and a first diode; the switching transistor, the rectifier circuit, and the first diode are located on the same side of the substrate; the switching transistor includes a control electrode, a first electrode, and a second electrode; the first electrode is electrically connected to the positive electrode of the first diode; the rectifier circuit includes a first AC input terminal and a second AC input terminal. Multiple terminals; the multiple terminals include a first terminal electrically connected to the control electrode of the switching transistor, a second terminal electrically connected to the first AC input terminal, a third terminal electrically connected to the second AC input terminal, and a fourth terminal electrically connected to the negative electrode of the first diode; A molding compound encapsulates the substrate, the switching transistor, the rectifier circuit, the first diode, and each of the terminals, with each of the terminals exposed from the side of the molding compound.
2. The semiconductor packaging module according to claim 1, characterized in that, The encapsulation includes a first side and a second side opposite to each other; some of the plurality of terminals are exposed from the first side, and the remaining terminals are exposed from the second side.
3. The semiconductor packaging module according to claim 1, characterized in that, The rectifier circuit further includes a DC negative output terminal and a DC positive output terminal; the plurality of terminals further include a fifth terminal electrically connected to the second pole, a sixth terminal electrically connected to the DC negative output terminal, a seventh terminal electrically connected to the DC positive output terminal, and an eighth terminal electrically connected to the first pole.
4. The semiconductor packaging module according to claim 3, characterized in that, The encapsulated body includes a first side and a second side opposite to each other; the first terminal, the second terminal, the third terminal, the fifth terminal and the sixth terminal are exposed from the first side, and the fourth terminal, the seventh terminal and the eighth terminal are exposed from the second side.
5. The semiconductor packaging module according to claim 4, characterized in that, The first terminal and the fifth terminal are located on the same side of the sixth terminal, and the second terminal and the third terminal are located on the other side of the sixth terminal; the distance between the first terminal and the sixth terminal and the terminal adjacent to the sixth terminal among the first terminal and the fifth terminal is the first distance, the distance between the second terminal and the sixth terminal and the terminal adjacent to the sixth terminal among the second terminal and the third terminal is the second distance, the distance between the first terminal and the fifth terminal is the third distance, and the distance between the second terminal and the third terminal is the fourth distance; the first distance, the third distance, and the fourth distance are all less than the second distance.
6. The semiconductor packaging module according to claim 4, characterized in that, The widths of the second terminal, the third terminal, the fifth terminal, and the sixth terminal are respectively greater than the width of the first terminal, and respectively less than the widths of the fourth terminal, the seventh terminal, and the eighth terminal.
7. The semiconductor packaging module according to claim 4, characterized in that, The fifth terminal is adjacent to the sixth terminal, and the second terminal is adjacent to the third terminal.
8. The semiconductor packaging module according to claim 4, characterized in that, The eighth terminal is located between the fourth terminal and the seventh terminal.
9. The semiconductor packaging module according to claim 4, characterized in that, The encapsulation body also includes a third side and a fourth side opposite to each other. Among the terminals exposed from the first side, the first terminal is the closest to the third side, and the fifth terminal is adjacent to the first terminal. Among the terminals exposed from the second side, the fourth terminal is the closest to the third side.
10. The semiconductor packaging module according to claim 1, characterized in that, The semiconductor packaging module further includes a second diode, the positive terminal of which is electrically connected to the second electrode, and the negative terminal of which is electrically connected to the first electrode; and / or, the switching transistor is an insulated gate bipolar transistor.
11. A PFC circuit module, characterized in that, The PFC circuit module includes a sampling resistor, a capacitor, an inductor, and a semiconductor packaging module as described in any one of claims 1 to 10; the rectifier circuit further includes a DC negative output terminal and a DC positive output terminal; the sampling resistor is connected between the DC negative output terminal of the rectifier circuit and the second terminal of the switching transistor; the capacitor is connected between the second terminal of the switching transistor and the negative terminal of the first diode; the inductor is connected between the first terminal of the switching transistor and the DC positive output terminal of the rectifier circuit.