Wafer cleaning device and method
By designing two cleaning mechanisms and cavity sealing technology for the wafer cleaning device, the problems of incomplete removal of contaminants and secondary contamination in existing wafer cleaning processes have been solved, achieving efficient and thorough cleaning results and high efficiency.
Patent Information
- Application Number
- CN202511979680.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-25
- Publication Date
- 2026-03-13
AI Technical Summary
Existing wafer cleaning processes are limited and cannot completely remove different types of contaminants. Furthermore, new contaminants are easily introduced after cleaning, resulting in substandard cleanliness and affecting subsequent manufacturing processes and product yield.
Design a wafer cleaning device that employs two cleaning mechanisms: the first cleaning mechanism uses an oscillating spray method in conjunction with the wafer's rotation to achieve large-area uniform coverage and rinsing; the second cleaning mechanism assists cleaning from multiple angles and, combined with a sealed cavity design, prevents external contamination.
It improves cleaning effectiveness, shortens cleaning time, reduces the risk of secondary contamination, and enhances cleaning efficiency and product yield.
Smart Images
Figure CN121665941A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor wafer processing technology, and in particular to a wafer cleaning apparatus and method. Background Technology
[0002] In semiconductor manufacturing processes, cleaning is essential throughout the entire process of chip manufacturing, handling, and packaging. Its main function is to remove various contaminants such as particles, metal ions, and organic matter that remain on the wafer surface during processing. The cleanliness of the wafer surface directly affects the quality of subsequent processes such as photolithography, etching, and thin film deposition, and is a key foundation for influencing chip performance, reliability, and final product yield. Therefore, efficient and reliable cleaning processes are indispensable for ensuring high-quality semiconductor product manufacturing.
[0003] However, existing common wafer cleaning processes and equipment still have several significant drawbacks. First, the cleaning methods are often relatively simple, lacking targeted cleaning techniques for different types of contaminant particles on the wafer surface (such as residues from grinding and polishing, fine dust, and organic matter), resulting in poor cleaning effects and difficulty in completely removing some contaminants. Second, after cleaning, new particulate contaminants are easily introduced into the environment, which can actually expand the scope and degree of wafer contamination. The incomplete removal of existing contaminants and the introduction of new contaminants together lead to substandard wafer cleanliness after cleaning, which in turn significantly increases the risk of defects in subsequent precision manufacturing, ultimately resulting in a substantial increase in product defect rates. Furthermore, existing processes often fail to effectively integrate cleaning efficiency and cleaning effect when addressing these challenges, and the overall efficiency of the cleaning process needs further improvement. Summary of the Invention
[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a wafer cleaning apparatus and method to solve the technical problem of how to improve cleaning effect and cleaning efficiency.
[0005] In a first aspect, this application provides a wafer cleaning apparatus, comprising: A housing having a cavity inside; the cavity is configured to be sealed during wafer cleaning. A worktable is disposed in the cavity and is configured to hold the wafer and drive the wafer to rotate. The first cleaning mechanism includes a first drive mechanism, a swing arm, and a first nozzle assembly; the first drive mechanism is at least partially disposed within the cavity; the swing arm is mounted on the drive end of the first drive mechanism; the first nozzle assembly is mounted on the swing arm; the first drive mechanism is configured to drive the swing arm to swing horizontally above the worktable, thereby causing the first nozzle assembly to swing and spray a first cleaning fluid onto the wafer on the worktable. The second cleaning mechanism includes a mounting base and a second nozzle assembly; the mounting base is disposed in the cavity and arranged on one side of the worktable; the second nozzle assembly is mounted on the mounting base and is configured to spray at least one second cleaning fluid at multiple angles toward the wafers on the worktable.
[0006] In at least some embodiments of this application, The first nozzle assembly includes an angle adjustment component and a first nozzle; the angle adjustment component is mounted on the swing arm; the first nozzle is mounted on the angle adjustment component; the angle adjustment component is configured to adjust the spray angle of the first nozzle.
[0007] In at least some embodiments of this application, The second nozzle assembly includes multiple universal joints and multiple second nozzles; the universal joints are mounted on the mounting base; the second nozzles are mounted one-to-one on the universal joints; At least two of the plurality of second nozzles are configured to spray second cleaning fluids of different proportions or types.
[0008] In at least some embodiments of this application, The workbench has pipes leading to its surface; The pipeline is configured to introduce a third cleaning solution to clean the lower surface of the wafer on the worktable; or, The conduit is configured to allow gas to pass through it to purge the lower surface of the wafer on the worktable.
[0009] In at least some embodiments of this application, The box body has a feeding window and a discharging window on its opposite side walls, respectively; both the feeding window and the discharging window are equipped with a window sealing mechanism; The window sealing mechanism includes a second drive mechanism, an inner window panel, and an outer window panel; the inner window panel and the outer window panel are respectively mounted on the drive end of the second drive mechanism; the second drive mechanism is configured to drive the inner window panel and the outer window panel to move up and down to cover or open the corresponding feed window or discharge window relative to the inner and outer sides of the cavity.
[0010] In at least some embodiments of this application, In the window sealing mechanism corresponding to the feed window, the second driving mechanism includes a first driving component and a second driving component; The first drive assembly is mounted on the housing above the feed window; the outer window panel is mounted on the drive end of the first drive assembly; the first drive assembly is configured to drive the outer window panel to rise and fall to open or cover the outside of the feed window. The second drive assembly is mounted on the housing below the feed window; the inner window panel is mounted on the drive end of the second drive assembly; the second drive assembly is configured to drive the inner window panel to rise and fall to open or cover the inside of the feed window.
[0011] In at least some embodiments of this application, An adjustment mechanism is provided on the outer window panel; the adjustment mechanism includes a horizontal adjustment plate; and each end of the horizontal adjustment plate has a mounting block. The mounting block is mounted on the outer window panel via an adjusting member, which is configured to adjust the mounting distance between the mounting block and the outer window panel and / or the alignment with the feed window or the discharge window; the horizontal adjusting plate is mounted on the drive end of the second drive mechanism, and the horizontal adjusting plate is configured to adjust the horizontality of the outer window panel by adjusting its mounting horizontality relative to the drive end of the second drive mechanism.
[0012] In at least some embodiments of this application, An exhaust vent is also provided on the housing at the junction of the feed window and the discharge window with the outer window panel; the exhaust vent is configured to extract air from the feed window or the discharge window after the feed window or the discharge window is covered by the inner window panel and the outer window panel.
[0013] In at least some embodiments of this application, A clamping mechanism is provided on both sides of the outside of the feeding window and the discharging window; The clamping mechanism includes a third drive assembly and a pressure plate. The third drive assembly is mounted on the housing. The pressure plate is mounted on the drive end of the third drive assembly. The third drive assembly is configured to drive the pressure plate to move horizontally to clamp or loosen the outer window panel covering the feed window or the discharge window.
[0014] In at least some embodiments of this application, The feed window has an outwardly extending and inclined guide plate on its lower side.
[0015] In at least some embodiments of this application, The top of the box is equipped with a blower that leads to the cavity; A liftable guide plate is arranged around the worktable in the cavity. A flow divider is provided in the cavity below the flow guide plate; the box below the flow divider has an exhaust vent leading to the external environment.
[0016] In a second aspect, this application provides a wafer cleaning method based on a wafer cleaning apparatus as described in any one of the first aspects, the method comprising: During the process of the worktable clamping and rotating the wafer, the first cleaning mechanism and the second cleaning mechanism are controlled to jointly clean the wafer on the worktable; wherein, during the cleaning process: The first drive mechanism is controlled to drive the swing arm to swing horizontally above the worktable, so as to drive the first nozzle assembly to swing and spray the first cleaning fluid onto the wafer on the worktable. The second nozzle assembly is controlled to spray at least one second cleaning fluid at multiple angles toward the wafer on the worktable.
[0017] In at least some embodiments of this application, The method further includes: The swing speed V1 of the control arm and the rotation speed V2 of the worktable satisfy the following relationship: Wherein, α is the angle at which the swing arm swings from the cleaning edge of the wafer to the center of the worktable; R1 is the radius of the swing arm's rotation center from the center of the worktable; R2 is the radius of the worktable; b is the distance the worktable moves on the same axis per revolution; and d is the lead of the equidistant spiral line originating from the center of the worktable. In at least some embodiments of this application, The above-described one or more embodiments of this application have at least one or more of the following beneficial effects: In implementing the technical solution of this application, two cleaning mechanisms are incorporated to accommodate various cleaning processes. The overall sealed design of the cavity isolates the wafer from the external environment during cleaning, preventing contamination and ensuring effective cleaning. The first cleaning mechanism employs a oscillating spray method, coordinated with the wafer's rotation, to achieve large-area, uniform coverage and rinsing of the wafer surface with the cleaning solution, effectively removing contaminants. The second cleaning mechanism provides auxiliary cleaning from multiple angles, enhancing the treatment of fine structures. The two mechanisms work together to ensure better cleaning results while also shortening the overall cleaning time by optimizing the cleaning process and coverage path, thereby improving cleaning efficiency. Furthermore, the worktable can rotate the wafer at high speed after cleaning, using centrifugal force to quickly remove residual water or cleaning solution from the surface, achieving in-situ drying, further avoiding secondary contamination and shortening the time required for subsequent drying processes.
[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0019] The disclosure of this application will become more readily understood with reference to the accompanying drawings. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the drawings are used to denote similar components, wherein: Figure 1 This is a three-dimensional structural diagram of a wafer cleaning apparatus according to one embodiment of this application. Figure 1 ; Figure 2 This is a three-dimensional structural diagram of the workbench and cleaning mechanism according to one embodiment of this application; Figure 3 This is a bottom-view perspective three-dimensional structural diagram of the workbench and cleaning mechanism according to one embodiment of this application; Figure 4 This is a schematic diagram of the cleaning route of a wafer cleaning apparatus according to one embodiment of this application; Figure 5 This is a three-dimensional structural diagram of a wafer cleaning apparatus according to one embodiment of this application. Figure 2 ; Figure 6 This is a three-dimensional structural diagram of a wafer cleaning apparatus according to one embodiment of this application. Figure 3 ; Figure 7 yes Figure 6 An enlarged schematic diagram of section D in the middle; Figure 8 This is a three-dimensional structural diagram of a wafer cleaning apparatus according to one embodiment of this application. Figure 4 ; Figure 9 This is a simulation diagram of the gas flow trajectory inside the cavity according to one embodiment of this application; Figure 10 This is a three-dimensional structural diagram of a wafer cleaning apparatus according to one embodiment of this application. Figure 5 ; Figure 11 This is a three-dimensional structural diagram of a wafer cleaning apparatus according to one embodiment of this application. Figure 6 ; Figure 12 This is a cross-sectional schematic diagram of a waterproof sleeve assembly according to one embodiment of this application; Figure 13 This is a top view of the workbench and cleaning mechanism according to one embodiment of this application; Figure 14 This is a schematic diagram of the calculated geometric relationship of the cleaning line according to one embodiment of this application; Figure 15 This is a schematic diagram of an ideal cleaning circuit according to one embodiment of this application; Figure 16This is a schematic diagram of the actual cleaning route according to one embodiment of this application.
[0020] Explanation of reference numerals in the attached figures: 1. Enclosure; 10. Cavity; 101. Base plate; 102. Sleeve; 103. Fixing seat; 104. First seal; 105. Second seal; 112. Maintenance door; 113. Sealing buckle; 114. Proximity switch; 115. Observation window; 2. Workbench; 21. Pipeline; 22. Third drive mechanism; 23. Support platform; 24. Water baffle; 25. Rotary disc; 3. First cleaning mechanism; 31. First drive mechanism; 311. Fourth drive assembly; 312. Transmission module; 313. First waterproof sleeve assembly; 32. Swing arm; 33. First nozzle assembly; 331. Angle adjustment assembly; 3311. Adjustment plate; 3312. Rotating plate; 332. First nozzle; 34. Cable tray; 4. Second cleaning mechanism; 41. Mounting base; 42. Second nozzle assembly; 421. Universal joint; 422. Second nozzle; 5. Adjustment mechanism; 51. Horizontal adjustment plate; 52. Mounting block; 53. Adjustment component; 531. First adjustment component; 532. Second adjustment component; 54. Fastener; 6. Exhaust vent; 7. Pressing mechanism; 71. Third drive assembly; 711. Drive component; 72. Pressure plate; 73. Guide rod assembly; 8. Drain plate; 9. Wafer; 11. Drain plate; 111. Third waterproof sleeve assembly; 12. Diverter plate; 13. Feed window; 14. Discharge window; 15. Window sealing mechanism; 151. Second drive mechanism; 1511. First drive assembly; 1512. Second drive assembly; 152. Inner window panel; 153. Outer window panel; 154. Second waterproof sleeve assembly; 16. Limiting block; 17. Threading block; 18. Blowing device; 19. Exhaust vent; 20. Static eliminator. Detailed Implementation
[0021] Some embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application.
[0022] See appendix Figure 1 and Figure 2 In one or more embodiments, a wafer cleaning apparatus of this application includes: The housing 1 has a cavity 10 inside; the cavity 10 is configured to be sealed during the cleaning process of the wafer 9; The worktable 2 is disposed in the cavity 10 and is configured to hold the wafer 9 and drive the wafer 9 to rotate. The first cleaning mechanism 3 includes a first drive mechanism 31, a swing arm 32, and a first nozzle assembly 33; the first drive mechanism 31 is at least partially disposed within the cavity 10; the swing arm 32 is mounted on the drive end of the first drive mechanism 31; the first nozzle assembly 33 is mounted on the swing arm 32; the first drive mechanism 31 is configured to drive the swing arm 32 to swing horizontally above the worktable 2, so as to drive the first nozzle assembly 33 to swing and spray the first cleaning fluid onto the wafer 9 on the worktable 2. The second cleaning mechanism 4 includes a mounting base 41 and a second nozzle assembly 42; the mounting base 41 is disposed in the cavity 10 and arranged on one side of the worktable 2; the second nozzle assembly 42 is mounted on the mounting base 41 and is configured to spray at least one second cleaning fluid at multiple angles toward the wafer 9 on the worktable 2.
[0023] Based on the above embodiments, an optional working process of the wafer cleaning apparatus in this embodiment is as follows: the wafer 9 is transported to the worktable 2 in the cavity 10 by a handling mechanism such as a robotic arm, and the cavity 10 is closed and kept in a sealed state; the worktable 2 drives the wafer 9 to rotate, and the first cleaning mechanism 3 and the second cleaning mechanism 4 are opened simultaneously or sequentially to clean the wafer 9; during the cleaning process, the first drive mechanism 31 drives the swing arm 32 to swing horizontally, so that the first nozzle assembly 33 on the swing arm 32 sprays the first cleaning liquid onto the wafer 9 in a swinging manner; the second nozzle assembly 42 can spray at least one second cleaning liquid onto the wafer 9 in multiple directions, i.e., multiple angles; after cleaning is completed, the first cleaning mechanism 3 and the second cleaning mechanism 4 stop working, the worktable 2 can drive the wafer 9 to continue to rotate, and the water stains on the wafer 9 are spun dry. After spun dry, the cavity 10 can be opened and the wafer 9 can be taken out by the handling mechanism.
[0024] It should be understood that this application does not impose specific limitations on the types and ratios of the first and second cleaning solutions. The types or ratios of the first and second cleaning solutions can be the same or different. In the second cleaning mechanism 4, one type of second cleaning solution or multiple types of second cleaning solutions can be sprayed, and adjustments can be made accordingly based on cleaning requirements.
[0025] In the embodiments of this application, two cleaning mechanisms are provided to accommodate various cleaning processes. The overall sealed design of the cavity 10 isolates the external environment during cleaning, preventing contamination of the wafer 9 and ensuring effective cleaning. The first cleaning mechanism 3 employs a oscillating spray method, coordinating with the rotation of the wafer 9, to achieve large-area, uniform coverage and rinsing of the cleaning fluid on the surface of the wafer 9, effectively removing contaminants. The second cleaning mechanism 4 provides auxiliary cleaning of the wafer 9 from multiple angles, enhancing the treatment of fine structures. The two mechanisms work together to ensure better cleaning results while also shortening the overall cleaning time by optimizing the cleaning process and coverage path, thereby improving cleaning efficiency. Furthermore, the worktable 2 can drive the wafer 9 to rotate at high speed after cleaning, using centrifugal force to quickly remove residual water stains or cleaning fluid from the surface, achieving in-situ drying, further avoiding secondary contamination and shortening the time required for subsequent drying processes.
[0026] In one embodiment, the first nozzle assembly 33 includes an angle adjustment assembly 331 and a first nozzle 332; the angle adjustment assembly 331 is mounted on the swing arm 32; the first nozzle 332 is mounted on the angle adjustment assembly 331; the angle adjustment assembly 331 is configured to adjust the spray angle of the first nozzle 332. That is, while the first nozzle 332 swings with the swing arm 32, the angle towards the wafer 9 can be adjusted by the angle adjustment assembly 331, thereby changing the landing position of the cleaning fluid on the wafer 9.
[0027] The angle adjustment assembly 331 includes an adjustment plate 3311 and a rotating plate 3312. The adjustment plate 3311 is installed at one end of the swing arm 32 near the worktable 2. The rotating plate 3312 is rotatably installed on the adjustment plate 3311. The first nozzle 332 is installed on the rotating plate 3312. The rotating plate 3312 can be installed on the adjustment plate 3311 by adjusting the bolts or other adjusting components. The angle of the rotating plate 3312 can be adjusted by adjusting the rotation angle of the bolts, thereby changing the spray angle of the first nozzle 332 on the rotating plate 3312.
[0028] Among them, the first nozzle 332 is a megason nozzle. The megason nozzle can spray megason waves and cleaning fluid onto the rotating wafer 9 surface during the cleaning process. It has the characteristic of high-frequency vibration, which can achieve a high degree of cleaning effect to remove fine particles from the wafer 9 surface.
[0029] In one possible implementation, the first nozzle assembly 33 further includes a nitrogen nozzle, which can be mounted together with the first nozzle 332 on the rotating plate 3312; the nitrogen nozzle can also swing with the swing arm 32 to quickly dry the wafer 9 after the wafer 9 is cleaned, further accelerating the drying speed and improving the overall work efficiency.
[0030] In one possible implementation, refer to Figure 2 A cable tray 34 is also provided at the connection point between the swing arm 32 and the drive end of the first drive mechanism 31; the hose or connecting wire connecting the first nozzle 332 or the nitrogen spray pipe can be guided and fixedly installed through the cable tray 34, which can help to organize and protect the safety of the device.
[0031] In one embodiment, the first drive mechanism 31 includes a fourth drive component 311, a transmission module 312, and a rotating shaft. The transmission module 312 is mounted on the drive end of the fourth drive component 311. The rotating shaft is mounted on the transmission module 312 and can rotate with the transmission module 312. The fourth drive component 311 can drive the transmission module 312 to rotate, thereby driving the rotating shaft to rotate. One end of the swing arm 32 is mounted on the rotating shaft, so that the rotation of the rotating shaft can drive the swing arm 32 to rotate.
[0032] The fourth drive component 311 can be a sliding table lifting module, which is installed on the base plate 101 under the housing 1 in the horizontal direction; the transmission module 312 can be a synchronous wheel drive rotation module, which drives the synchronous wheel drive rotation module to reciprocate in the horizontal direction, thereby driving the rotating shaft connected to the transmission module 312 to rotate back and forth, so that the swing arm 32 swings.
[0033] The rotating shaft is installed in the first waterproof sleeve assembly 313, which improves the waterproof sealing of the drive structure, realizes the internal motion sealing, ensures the normal operation of the drive structure, and can improve the connection sealing with the outside of the cavity 10, reducing the possibility of contaminants being brought in from the outside during the cleaning process.
[0034] In one embodiment, the second nozzle assembly 42 includes a plurality of universal joints 421 and a plurality of second nozzles 422; the universal joints 421 are mounted on the mounting base 41; the second nozzles 422 are mounted one-to-one on the universal joints 421; the universal joints 421 can also be called floating joints, used to connect nozzles or pipelines, and can flexibly adjust the spray angle of the nozzles, thereby adjusting the spray landing point of the cleaning fluid; at the same time, the spray landing point can also be changed by adjusting the spray pressure in the connecting pipeline. At least two of the multiple second nozzles 422 are configured to spray second cleaning solutions of different formulations or types. That is, the second nozzle assembly 42 has multiple cleaning solution outlets, allowing for different cleaning solution formulations to be applied to different processes, achieving the purpose of softening and cleaning various types of contaminant particles. Preferably, at least one second nozzle 422 can spray ultrapure water, while multiple second nozzles 422 can spray chemical solutions, achieving process compatibility of multiple chemical solutions and one ultrapure water outlet, thereby improving the cleaning effect.
[0035] In one embodiment, reference Figure 1 and Figure 2The workbench 2 has a pipe 21 leading to its surface; the pipe 21 is configured to introduce a third cleaning fluid to clean the lower surface of the wafer 9 on the workbench 2; or, the pipe 21 is configured to introduce gas to purge the lower surface of the wafer 9 on the workbench 2. That is, the workbench 2 has multiple outlets of the pipe 21 on the surface of the workbench 2 that receives the wafer 9. The pipe 21 can be one or multiple. If it is one, it can be a two-in-one pipe to realize the gas-liquid conversion: when the wafer 9 starts cleaning, the pipe 21 is opened and the cleaning fluid is introduced to rinse and wet the back side of the wafer 9; when the wafer 9 starts spin drying, the pipe 21 is opened and nitrogen gas is introduced to purge the back side of the wafer 9, accelerating the spin drying process of the wafer 9.
[0036] In one possible implementation, refer to Figures 1-3 The workbench 2 includes a third drive mechanism 22, a support platform 23, a baffle plate 24, and a rotating disk 25. The third drive mechanism 22 is mounted on the housing 1 and its drive end is connected to the rotating disk 25, used to drive the rotating disk 25 to rotate, thereby causing the wafer 9 on the rotating disk 25 to rotate. The support platform 23 is mounted on the base plate 101 inside the cavity 10 and is arranged around the third drive mechanism 22. The baffle plate 24 is mounted on the support platform 23 and is located below the rotating disk 25. The support platform 23 is used to support the baffle plate 24. The support platform 23 and the baffle plate 24 together can prevent liquid from flowing to the third drive mechanism 22, playing a protective sealing role. Furthermore, a sealing ring is also provided between the support platform 23 and the baffle plate 24 to improve the sealing degree.
[0037] Specifically, the outlets of the pipes 21 are evenly distributed at various points on the rotating disk 25 to achieve comprehensive cleaning and purging of the back side of the wafer 9.
[0038] Based on the above implementation methods, refer to Figures 1-4 Another optional operating process of the wafer cleaning apparatus of this application is to achieve three-way cleaning of the wafer 9 on the worktable 2. Specifically, the main cleaning path A: the megaphonic nozzle on the swing arm 32 is driven by the first cleaning mechanism 3 to swing and clean the wafer 9. The cleaning fluid carries out fine particles through megaphonic vibration, completing the cleaning of fine contaminant particles on the front side of the wafer; the auxiliary cleaning path B: can be connected to the second nozzle 422 through multiple branches to achieve multi-angle spraying and cleaning of the wafer 9 with different types or proportions of cleaning fluid, completing the softening and cleaning of various contaminant particles on the front side of the wafer; the back cleaning path C: cleaning fluid is introduced into the upper surface of the rotating disk 25 through the pipe 21 to achieve cleaning of the back side of the wafer. This application achieves comprehensive and rapid cleaning of the wafer 9 through the three-way design. Furthermore, during the drying process, the nitrogen spray pipe of the main cleaning path A and the pipe 21 of the back cleaning path C can work together to purge the wafer with nitrogen, which, in conjunction with the rotation of the rotating disk 25, achieves rapid and comprehensive cleaning of water stains on the surface of the wafer 9.
[0039] In one embodiment, reference Figure 1 and Figure 5 The box body 1 has a feeding window 13 and a discharging window 14 respectively on its two opposite side walls; both the feeding window 13 and the discharging window 14 have a window sealing mechanism 15. The window sealing mechanism 15 includes a second drive mechanism 151, an inner window plate 152, and an outer window plate 153. The inner window plate 152 and the outer window plate 153 are respectively mounted on the drive end of the second drive mechanism 151. The second drive mechanism 151 is configured to drive the inner window plate 152 and the outer window plate 153 to move up and down to cover or open the corresponding feed window 13 or discharge window 14 relative to the inner and outer sides of the cavity 10. The liftable window plate achieves sealing of the wafer transfer window during use, ensuring the airtightness of the cavity 10 during use, thereby preventing external environment from contaminating the wafer.
[0040] In one possible implementation, in the window sealing mechanism 15 corresponding to the feed window 13, the second drive mechanism 151 includes a first drive assembly 1511 and a second drive assembly 1512; the first drive assembly 1511 is mounted on the housing 1 above the feed window 13; the outer window panel 153 is mounted on the drive end of the first drive assembly 1511; the first drive assembly 1511 is configured to drive the outer window panel 153 to rise and fall to open or cover the outside of the feed window 13; the second drive assembly 1512 is mounted on the housing 1 below the feed window 13; the inner window panel 152 is mounted on the drive end of the second drive assembly 1512; the second drive assembly 1512 is configured to drive the inner window panel 152 to rise and fall to open or cover the inside of the feed window 13. Since the wafer may carry water from other devices before entering the cleaning device, in this embodiment, the inner window plate 152 and the outer window plate 153 corresponding to the feed window 13 are driven by independent drive components, and the first drive component 1511 of the outer window plate 153 is set above the feed window 13 to prevent water stains from flowing down the wafer before entering the cleaning device from affecting the normal operation of the drive mechanism.
[0041] Specifically, in the window sealing mechanism 15 corresponding to the discharge window 14, the second drive mechanism 151 can use the same drive module, and the drive module is located below the discharge window 14. By installing guide components, such as guide rods, the inner window panel 152 and the outer window panel 153 can be raised and lowered simultaneously, that is, the discharge window 14 can be opened or covered at the same time.
[0042] The driving sources in the first driving component 1511, the second driving component 1512, and the corresponding driving components used in the discharge window 14 can all be cylinders or servo modules, which can be connected to the window plate with the corresponding guide rod device to realize the driving lifting function.
[0043] The portion of the drive connecting rod or guide rod used to connect the inner window panel 152 and the drive source in the cavity 10 is installed in the second waterproof sleeve assembly 154, and the connection is also sealed. The second waterproof sleeve assembly 154 can improve the waterproof sealing of the drive structure, realize the internal movement sealing, ensure the normal operation of the drive structure, and improve the connection sealing with the outside of the cavity 10, reducing the possibility of contaminants being brought in from the outside during the cleaning process.
[0044] In one possible implementation, an exhaust vent 6 is also provided on the housing 1 at the junction of the inlet window 13 and the outlet window 14 with the outer window panel 153. The exhaust vent 6 is configured to extract air from the inlet window 13 or the outlet window 14 after it is covered by the inner window panel 152 and the outer window panel 153. The exhaust vent 6 can achieve air extraction and sealing at the junction of the inner and outer door panels of the two side windows, preventing external contaminants from entering the cavity and reducing the risk of wafer contamination.
[0045] In one possible implementation, the feed window 13 has an outwardly extending and inclined guide plate 8 on its lower side, which can draw water from the wafer to the drainage chamber of other modules before it enters the cleaning device.
[0046] In one possible implementation, limit blocks 16 are provided on both sides of the box 1 of the feed window 13 and the discharge window 14. The limit blocks 16 are used to restrict the corresponding inner window plate 152 from rising too far.
[0047] In one possible implementation, refer to Figure 1 , Figures 5-7 An adjustment mechanism 5 is provided on the outer window panel 153; the adjustment mechanism 5 includes a horizontal adjustment plate 51; the horizontal adjustment plate 51 has mounting blocks 52 at both ends; Mounting block 52 is mounted on outer window panel 153 via adjusting member 53, which is configured to adjust the mounting distance between mounting block 52 and outer window panel 153 and / or the alignment with feed window 13 or discharge window 14; horizontal adjusting plate 51 is mounted on the drive end of second drive mechanism 151, which is configured to adjust the horizontality of outer window panel 153 by adjusting its mounting horizontality relative to the drive end of second drive mechanism 151.
[0048] Specifically, the leveling plate 51 is mounted on the drive end of the second drive mechanism 151 by fasteners 54, for example... Figure 7 As shown, the top ends of the two guide rods are connected to the horizontal adjustment plate 51 by fasteners 54 respectively. During installation, the installation is symmetrical. If the outer window panel 153 is tilted relative to the horizontal plane, the horizontal adjustment plate 51 can be kept horizontal by adjusting the relative tightness or connection length of the fasteners 54 on both sides, thereby keeping the outer window panel 153 horizontal.
[0049] Specifically, the mounting blocks 52 at both ends of the horizontal adjusting plate 51 are mounted on the mounting base of the outer window panel 153 via the first adjusting member 531. The first adjusting member 531 on both sides can adjust the distance between the center of the outer window panel 153 and the center of the horizontal adjusting plate 51 in the length direction by adjusting the length or tightness, thereby ensuring whether the outer window panel 153 is aligned with the feed window 13 or the discharge window 14 in the length direction. The second adjusting member 532 is fixedly installed in the direction perpendicular to the outer window panel 153. At the same time, by adjusting the length or tightness of the second adjusting member 532 (i.e., adjusting the installation distance between the mounting block 52 and the outer window panel 153), the tilt of the outer window panel 153 on the left and right sides in the installation direction of the second adjusting member 532 can be adjusted, thereby ensuring whether the outer window panel 153 can be pressed tightly when covering the corresponding window, and ensuring that the outer window panel 153 fits the corresponding window when closed.
[0050] In one possible implementation, clamping mechanisms 7 are respectively provided on the outer sides of the feed window 13 and the discharge window 14; the clamping mechanism 7 includes a third drive assembly 71 and a pressure plate 72, the third drive assembly 71 is mounted on the housing 1; the pressure plate 72 is mounted on the drive end of the third drive assembly 71; the third drive assembly 71 is configured to drive the pressure plate 72 to move in the horizontal direction to clamp or loosen the outer window plate 153 covering the feed window 13 or the discharge window 14.
[0051] Specifically, the third drive assembly 71 can drive the pressure plate 72 to press the outer window panel 153, thereby improving the sealing performance of the outer window panel 153. The third drive assembly 71 includes a drive component 711 and guide rod assemblies 73 symmetrically arranged on both sides of the drive component 711. The guide rod assemblies 73 can ensure that the drive component 711 remains in the same direction when driving the pressure plate 72, thereby improving the stability of pressing the outer window panel 153. The drive component 711 can be a miniature cylinder.
[0052] In one possible implementation, refer to Figure 6 The top of the housing 1 is also equipped with a wiring block 17, which is used for the wiring and sealing of the electrical circuit of the entire cleaning device to improve the sealing performance of the device.
[0053] In one embodiment, reference Figure 8 The top of the housing 1 is provided with a blower 18 leading to the cavity 10; a liftable guide plate 11 is provided around the workbench 2 inside the cavity 10; a diverter plate 12 is provided in the cavity 10 below the guide plate 11; and an exhaust port 19 leading to the external environment is provided on the housing 1 below the diverter plate 12.
[0054] Specifically, the blower 18 blows air into the cavity, the guide plate 11 and the diverter 12 guide the airflow, and the gas is discharged from the exhaust port 19. For example, refer to the reference Figure 9 Simulation results demonstrate that the airflow from the top is guided downwards by the guide plate 11, creating fine vortices on its inner and outer sides, preventing interference between the airflows. The diverter plate 12 separates the working airflow from the contaminated airflow that needs to be discharged. The exhaust port 19 at the bottom allows the contaminated airflow at the bottom to be quickly expelled from the cavity, significantly reducing the risk of removed contaminants being carried back to the wafer surface by the reduced airflow turbulence. The combined use of the guide plate 11 and diverter plate 12 not only prevents turbulent gas from carrying removed contaminants back to the top of the wafer, ensuring the cleanliness of the wafer process, but also prevents contaminated liquid from splashing out in all directions during wafer cleaning and spin-drying, thus contaminating the surrounding environment. The guide plate 11 isolates this, completely blocking water vapor during the wafer cleaning process and preventing splashing. Furthermore, because the guide plate 11 is positioned around the workbench 2 and tilted downwards on both sides, all contaminated liquid is guided to the bottom drain port, preventing secondary splashing and contamination to the top of the wafer.
[0055] The guide plate 11 can be raised and lowered by a drive mechanism, and the drive end of the drive mechanism uses a third waterproof sleeve assembly 111 at the cavity 10 and the connection to ensure sealing.
[0056] In one possible implementation, an antistatic air knife 20 is also provided inside the cavity 10. The antistatic air knife 20 is arranged near the air inlet of the blowing device 18 to prevent static electricity and improve the safety of the device.
[0057] In one embodiment, reference Figure 10 The housing 1 is also equipped with a maintenance door 112. The maintenance door 112 is equipped with sealing buckles 113 on both sides, which are used to lock and seal the maintenance door 112 when it is closed.
[0058] In one possible implementation, a proximity switch 114 is also provided on the housing 1 on one side of the maintenance door 112 to prevent any mechanism inside the device from starting when the door is detected to be open.
[0059] In one possible implementation, refer to Figure 10 and Figure 11 The housing 1 is also equipped with an observation window 115 for observing the internal working conditions of the device. The housing 1 can also be divided into an upper housing and a lower housing, and each of the upper housing and the lower housing can be equipped with an observation window 115.
[0060] In the above embodiments, sealing elements are provided at the joints of each housing and at the joints between the door and the housing to ensure the sealing of the cavity 10. In this application, the sealing element can be a sealing ring or other structural design with sealing effect.
[0061] In the above embodiments, the first waterproof sleeve assembly 313, the second waterproof sleeve assembly 154, and the third waterproof sleeve assembly 111 can all adopt the same sleeve structure. Specifically, refer to... Figure 12 The waterproof sleeve assembly includes a sleeve 102 and a fixing seat 103. The fixing seat 103 is installed on the base plate 101 inside the cavity 10, and the sleeve 102 is fitted onto the fixing seat 103. A first sealing element 104 is disposed between the fixing seat 103 and the base plate 101 to ensure the lower end is sealed. A second sealing element 105 is disposed at the connection between the sleeve 102 and the drive end of each device to ensure the drive end is sealed. During use, the drive rod or guide rod of each drive assembly passes through the bottom of the base plate 101 and enters the sleeve 102 to connect with each device inside the cavity 1 to ensure sealing. The first sealing element 104 and the second sealing element 105 can be sealing rings.
[0062] Based on the above implementation method, by setting the inner and outer window plates of the feed windows 13 and discharge windows 14 on both sides of the cavity 1 and by using negative pressure for air extraction, external contaminant particles are blocked outside the cleaning cavity during wafer handling, thereby ensuring that the contamination inside the cavity is almost zero; sealing elements are set at the joints of each box, frame and door to ensure the sealing of the overall frame structure; the waterproof sleeve assembly achieves the sealing of the internal moving mechanism of the frame; the wire block 17 achieves the wiring sealing of the electrical circuit of the device; the multiple sealing forms give the cleaning device of this application good sealing performance, while also being compatible with the convenience of maintenance and the visibility during operation.
[0063] Furthermore, embodiments of this application provide a wafer cleaning method, based on the aforementioned wafer cleaning apparatus, the method comprising: During the process of the worktable 2 clamping the wafer and rotating it, the first cleaning mechanism 3 and the second cleaning mechanism 4 are controlled to jointly clean the wafer on the worktable 2; wherein, during the cleaning process: The first drive mechanism 31 drives the swing arm 32 to swing horizontally above the worktable 2, so as to drive the first nozzle assembly 33 to swing and spray the first cleaning fluid onto the wafer on the worktable 2. The second nozzle assembly 42 is controlled to spray at least one second cleaning fluid at multiple angles toward the wafer on the worktable 2.
[0064] In this embodiment, by controlling two cleaning mechanisms to simultaneously clean the rotating wafer, the wafer cleaning effect and efficiency are effectively improved. For details on the design and principle of each mechanism and structure, please refer to the specific implementation of the above-mentioned device. Repeated descriptions will not be repeated.
[0065] In one embodiment, reference Figure 13 and Figure 14 To further improve the cleaning effect, the cleaning method of this application also includes: The swing speed V1 of the control arm 32 and the rotation speed V2 of the worktable 2 satisfy the following relationship: Where α is the angle at which the swing arm 32 swings from the cleaning edge of the wafer to the center of the worktable 2; R1 is the radius of the rotation center of the swing arm 32 from the center of the worktable 2; R2 is the radius of the worktable 2; b is the distance the worktable 2 moves on the same axis for each revolution; and d is the lead of the equidistant spiral line starting from the center of the worktable 2.
[0066] Specifically, the center of the swing arm 32 is configured to be R1 from the radius of the rotating plate, the cleaning radius of the rotating plate is R2, the distance from the origin (the center of the wafer) to the helix is r, the worktable 2 moves a distance b on the same axis per revolution (which can be understood as the pitch of the equidistant helix), and the angle α from the cleaning edge of the wafer (the tangent from the center of the swing arm to the edge of the wafer) to the center of the wafer is α; Figure 15 As shown, the ideal and optimal wafer cleaning trajectory is an equidistant spiral: The cleaning path of the swing arm 32 is as follows Length of equidistant spiral line in wafer cleaning trajectory The arc length of the cleaning path of the swing arm 32 Therefore, the relationship between the swing speed V1 of the swing arm 32 and the wafer rotation speed V2 is as follows: By setting the swing speed of the swing arm 32 and the rotation speed of the wafer on the worktable 2 according to the above speed relationship, the following can be obtained: Figure 16 As can be seen from the cleaning route, the cleaning route fully covers the wafer surface, enabling comprehensive cleaning of the wafer surface.
[0067] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.
[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0070] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A wafer cleaning apparatus, characterized in that, include: The housing (1) has a cavity (10) inside; the cavity (10) is configured to be sealed during the wafer cleaning process; A worktable (2) is disposed in the cavity (10) and the worktable (2) is configured to hold the wafer and drive the wafer to rotate. The first cleaning mechanism (3) includes a first drive mechanism (31), a swing arm (32), and a first nozzle assembly (33); the first drive mechanism (31) is at least partially disposed within the cavity (10); the swing arm (32) is mounted on the drive end of the first drive mechanism (31); the first nozzle assembly (33) is mounted on the swing arm (32); the first drive mechanism (31) is configured to drive the swing arm (32) to swing horizontally above the worktable (2) to drive the first nozzle assembly (33) to swing and spray the first cleaning fluid onto the wafer on the worktable (2); The second cleaning mechanism (4) includes a mounting base (41) and a second nozzle assembly (42); the mounting base (41) is disposed in the cavity (10) and arranged on one side of the worktable (2); the second nozzle assembly (42) is mounted on the mounting base (41) and is configured to spray at least one second cleaning liquid onto the wafer on the worktable (2) at multiple angles.
2. The wafer cleaning apparatus according to claim 1, characterized in that, The first nozzle assembly (33) includes an angle adjustment assembly (331) and a first nozzle (332); the angle adjustment assembly (331) is mounted on the swing arm (32); the first nozzle (332) is mounted on the angle adjustment assembly (331); the angle adjustment assembly (331) is configured to adjust the spray angle of the first nozzle (332).
3. The wafer cleaning apparatus according to claim 1, characterized in that, The second nozzle assembly (42) includes a plurality of universal joints (421) and a plurality of second nozzles (422); the universal joints (421) are mounted on the mounting base (41); the second nozzles (422) are mounted one-to-one on the universal joints (421); At least two of the plurality of second nozzles (422) are configured to spray second cleaning fluids of different proportions or types.
4. The wafer cleaning apparatus according to claim 1, characterized in that, The workbench (2) has a pipe (21) leading to its surface. The conduit (21) is configured to introduce a third cleaning fluid to clean the lower surface of the wafer on the workbench (2); or, The conduit (21) is configured to allow gas to pass through it to purge the lower surface of the wafer on the worktable (2).
5. The wafer cleaning apparatus according to claim 1, characterized in that, The box (1) has a feeding window (13) and a discharging window (14) on opposite side walls; both the feeding window (13) and the discharging window (14) have a window sealing mechanism (15). The window sealing mechanism (15) includes a second drive mechanism (151), an inner window plate (152), and an outer window plate (153); the inner window plate (152) and the outer window plate (153) are respectively mounted on the drive end of the second drive mechanism (151); the second drive mechanism (151) is configured to drive the inner window plate (152) and the outer window plate (153) to move up and down to cover or open the corresponding feed window (13) or discharge window (14) relative to the inner and outer sides of the cavity (10).
6. The wafer cleaning apparatus according to claim 5, characterized in that, In the window sealing mechanism (15) corresponding to the feed window (13), the second drive mechanism (151) includes a first drive component (1511) and a second drive component (1512). The first drive assembly (1511) is mounted on the housing (1) above the feed window (13); the outer window panel (153) is mounted on the drive end of the first drive assembly (1511); the first drive assembly (1511) is configured to drive the outer window panel (153) to rise and fall to open or cover the outside of the feed window (13); The second drive assembly (1512) is mounted on the housing (1) below the feed window (13); the inner window panel (152) is mounted on the drive end of the second drive assembly (1512); the second drive assembly (1512) is configured to drive the inner window panel (152) to rise and fall to open or cover the inside of the feed window (13).
7. The wafer cleaning apparatus according to claim 5, characterized in that, An adjustment mechanism (5) is provided on the outer window panel (153); the adjustment mechanism (5) includes a horizontal adjustment plate (51); and mounting blocks (52) are respectively provided at both ends of the horizontal adjustment plate (51). The mounting block (52) is mounted on the outer window panel (153) by means of an adjusting member (53), the adjusting member (53) being configured to adjust the mounting distance between the mounting block (52) and the outer window panel (153) and / or the alignment with the feed window (13) or the discharge window (14); the horizontal adjusting plate (51) is mounted on the driving end of the second driving mechanism (151), the horizontal adjusting plate (51) being configured to adjust the horizontality of the outer window panel (153) by adjusting its mounting horizontality relative to the driving end of the second driving mechanism (151).
8. The wafer cleaning apparatus according to claim 5, characterized in that, An exhaust vent (6) is also provided on the housing (1) at the junction of the feed window (13) and the discharge window (14) with the outer window panel (153); the exhaust vent (6) is configured to extract air from the feed window (13) or the discharge window (14) after the feed window (13) or the discharge window (14) is covered by the inner window panel (152) and the outer window panel (153).
9. The wafer cleaning apparatus according to claim 5, characterized in that, A clamping mechanism (7) is provided on the outer sides of the feed window (13) and the discharge window (14). The clamping mechanism (7) includes a third drive assembly (71) and a pressure plate (72). The third drive assembly (71) is mounted on the housing (1). The pressure plate (72) is mounted on the drive end of the third drive assembly (71). The third drive assembly (71) is configured to drive the pressure plate (72) to move horizontally to clamp or loosen the outer window panel (153) covering the feed window (13) or the discharge window (14).
10. The wafer cleaning apparatus according to any one of claims 5-9, characterized in that, The feed window (13) has an outwardly extending and inclined guide plate (8) on its lower side.
11. The wafer cleaning apparatus according to claim 1, characterized in that, The top of the box (1) is provided with a blower (19) leading to the cavity (10). Inside the cavity (10), a liftable guide plate (11) is arranged around the worktable (2) in a circumferential direction. A flow divider (12) is provided in the cavity (10) below the flow divider (11); the box (1) below the flow divider (12) has an exhaust vent (19) leading to the external environment.
12. A wafer cleaning method, characterized in that, Based on the wafer cleaning apparatus as described in any one of claims 1-11, the method comprises: During the process of the worktable (2) clamping the wafer and rotating it, the first cleaning mechanism (3) and the second cleaning mechanism (4) are controlled to jointly clean the wafer on the worktable (2); wherein, during the cleaning process: The first drive mechanism (31) is controlled to drive the swing arm (32) to swing horizontally above the worktable (2), so as to drive the first nozzle assembly (33) to swing and spray the first cleaning fluid onto the wafer on the worktable (2); Control the second nozzle assembly (42) to spray at least one second cleaning fluid at multiple angles toward the wafer on the worktable (2).
13. The wafer cleaning method according to claim 12, characterized in that, The method further includes: The swing speed V1 of the swing arm (32) and the rotation speed V2 of the worktable (2) satisfy the following relationship: Wherein, α is the angle at which the swing arm (32) swings from the cleaning edge of the wafer to the center of the worktable (2); R1 is the radius of the center of rotation of the swing arm (32) from the center of the worktable (2); R2 is the radius of the worktable (2); b is the distance the worktable (2) moves on the same axis for each revolution; and d is the lead of the equidistant spiral line starting from the center of the worktable (2).