Cleaning chamber and semiconductor cleaning equipment
By employing a design that incorporates a spray fixture and a spray head that moves within the spray channel in the cleaning chamber, the problem of unstable airflow caused by the rotation of the spray arm is solved, thereby achieving stable airflow within the cleaning chamber and improved wafer cleanliness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2026-03-13
AI Technical Summary
The airflow in the existing cleaning chamber is unstable when the spray arm rotates, causing contaminant particles to be blown onto the wafer surface, resulting in wafer contamination.
A cleaning chamber was designed, in which a spray fixture and a spray head move within the spray channel. The spray head sprays cleaning fluid from the spray holes, reducing airflow disturbance, and the airflow is stabilized through the spray channel and cleaning holes to avoid particulate contamination.
This achieves stable airflow within the cleaning chamber, preventing contaminant particles from being blown up and contaminating the wafer, thus improving the cleaning effect and the cleanliness of the chamber walls.
Smart Images
Figure CN121665952A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a cleaning chamber and semiconductor cleaning equipment. Background Technology
[0002] In the semiconductor device manufacturing process, cleaning is required. For example, after etching a wafer, it needs to be cleaned. The entire wafer cleaning process takes place within the cleaning chamber of a semiconductor cleaning equipment. Cleaning is achieved by spraying different cleaning solutions onto the wafer surface in a specific cleaning sequence. Specifically, after the wafer to be cleaned is transferred into the cleaning chamber, it is placed horizontally on a rotary chuck and clamped and fixed by a clamping shaft mounted on the rotary chuck. This ensures the wafer remains fixed to the rotary chuck throughout the cleaning process, allowing for the necessary fixed-axis rotational movement of the wafer during cleaning. During cleaning, the spray arm rotates above the wafer, and the cleaning solution is sprayed from the spray arm towards the center of the wafer surface. At the same time, the wafer rotates along a fixed axis with the rotating chuck, and the fixed axis rotation of the rotating chuck generates centrifugal force on the cleaning solution, which spreads the cleaning solution evenly from the center of the wafer outward until it completely covers the entire wafer surface. Finally, the solution is thrown off the wafer surface and flows into the cleaning solution recovery device, and then discharged out of the cleaning chamber. In this way, the cleaning solution can clean the entire surface of the wafer.
[0003] In the prior art, the spray arm rotates above the wafer during the process, and the movement of the spray arm disrupts the airflow in the cleaning chamber, causing airflow instability. This, in turn, damages the microenvironment in the cleaning chamber, making it easy to blow contaminant particles from the cleaning chamber onto the wafer surface, thus causing wafer contamination.
[0004] Therefore, existing cleaning chambers have the drawback that contaminant particles inside can be easily blown to the wafer surface and contaminate the wafer. Summary of the Invention
[0005] The purpose of this application is to provide a cleaning chamber and semiconductor cleaning equipment that can solve the problem in related technologies where contaminant particles in the cleaning chamber are easily blown to the wafer surface and contaminate the wafer.
[0006] In a first aspect, embodiments of this application provide a cleaning chamber, comprising:
[0007] chamber body;
[0008] A rotary chuck is disposed within the chamber body and is used to carry the wafer;
[0009] A spray fixing component is disposed within the chamber body and connected to the side wall of the chamber body. The spray fixing component is located above the rotating chuck. The spray fixing component is provided with a spray channel and a spray hole. The spray hole communicates with the spray channel and is opposite to the rotating chuck.
[0010] A spray assembly for spraying cleaning fluid onto the wafer, the spray assembly including a spray head movable along the spray channel and the outlet of the spray head facing the spray orifice.
[0011] Secondly, embodiments of this application also provide a semiconductor cleaning apparatus, including the above-mentioned cleaning chamber and a cleaning fluid supply device, wherein the cleaning fluid supply device is connected to the spray assembly of the cleaning chamber.
[0012] In this embodiment, the spray head moves within the spray channel of the spray fixture and sprays from the spray hole. This ensures that the cleaning solution is sprayed onto the wafer surface while preventing particles adsorbed on the spray assembly from falling onto the wafer surface. Furthermore, since the spray head moves within the spray channel, it reduces disturbance to the airflow in the cleaning chamber, making the airflow field in the cleaning chamber more stable. This, in turn, prevents contaminant particles in the cleaning chamber from being blown up and contaminating the wafer. Attached Figure Description
[0013] Figure 1 This is one of the perspective views of the cleaning chamber disclosed in the embodiments of this application (with the exhaust device hidden);
[0014] Figure 2 This is one of the cross-sectional views of the cleaning chamber disclosed in the embodiments of this application (concealing the exhaust device and spray assembly);
[0015] Figure 3 This is one of the perspective views of the cleaning chamber disclosed in the embodiments of this application (concealing the exhaust device, spray assembly, rotary chuck and cleaning fluid recovery device);
[0016] Figure 4 yes Figure 3 Enlarged view of section A;
[0017] Figure 5 yes Figure 4 Enlarged view of section B;
[0018] Figure 6 This is a second perspective view of the cleaning chamber disclosed in the embodiments of this application (concealing the exhaust device, spray assembly, rotary chuck, and cleaning fluid recovery device);
[0019] Figure 7 yes Figure 6 Sectional view of part C;
[0020] Figure 8 This is a schematic diagram of the liquid flow direction in the annular liquid supply tank disclosed in the embodiments of this application;
[0021] Figure 9 This is a schematic diagram of the liquid flow direction in the cleaning hole and the annular liquid supply tank disclosed in the embodiments of this application;
[0022] Figure 10 This is a perspective view of the spray fixture disclosed in the embodiments of this application;
[0023] Figure 11 This is a partial schematic diagram of the spray fixing member disclosed in the embodiments of this application;
[0024] Figure 12 This is a perspective view of the cleaning chamber with the inlet and outlet in the open state as disclosed in the embodiments of this application (concealing the exhaust device, spray assembly, rotary chuck, and cleaning fluid recovery device);
[0025] Figure 13 This is a schematic diagram of a wafer entering a cleaning chamber as disclosed in an embodiment of this application;
[0026] Figure 14 This is a second perspective view of the cleaning chamber disclosed in the embodiments of this application (with the exhaust device hidden);
[0027] Figure 15 This is one of the positional relationship diagrams of the spray assembly and spray channel disclosed in the embodiments of this application;
[0028] Figure 16 This is the second diagram showing the positional relationship between the spray assembly and the spray channel disclosed in the embodiments of this application;
[0029] Figure 17 yes Figure 16 Enlarged view of section D;
[0030] Figure 18 This is a second cross-sectional view of the cleaning chamber disclosed in the embodiments of this application (with the spray assembly hidden);
[0031] Figure 19 This is the third cross-sectional view of the cleaning chamber disclosed in the embodiments of this application (concealing the spray assembly and exhaust device).
[0032] Explanation of reference numerals in the attached figures:
[0033] 100 - Chamber body; 110 - Chamber; 111 - Through hole; 112 - Cleaning hole; 113 - Inlet / outlet;
[0034] 120 - Cavity support; 200 - Rotary chuck; 300 - Wafer; 400 - Air supply device; 500 - Spray fixture;
[0035] 510 - First channel wall; 520 - Second channel wall; 530 - Spray channel; 540 - Spray hole;
[0036] 600 - Liquid supply ring; 610 - Annular liquid supply tank; 620 - Liquid inlet hole; 700 - Spray assembly; 710 - Spray head;
[0037] 720 - Spray arm; 800 - Cleaning fluid recovery device; 810 - Recovery space; 900 - Exhaust device;
[0038] 1000 - Door panel; 1100 - Drive unit; 1200 - Base plate. Detailed Implementation
[0039] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0040] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0041] The cleaning chamber and semiconductor cleaning equipment provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.
[0042] refer to Figures 1-19 The cleaning chamber provided in this application embodiment may include a chamber body 100, a rotating chuck 200, a spray fixing component 500, and a spray assembly 700.
[0043] The rotary chuck 200 can be disposed inside the chamber body 100 and used to support the wafer 300 so as to drive the wafer 300 to perform a fixed-axis rotational motion.
[0044] The spray fixture 500 can be disposed within the chamber body 100 and connected to the side wall of the chamber body 100. The spray fixture 500 can be located above the rotary chuck 200. The spray fixture 500 can be provided with a spray channel 530 and a spray hole 540. The spray hole 540 communicates with the spray channel 530 and is opposite to the rotary chuck 200. The spray assembly 700 can be used to spray cleaning fluid onto the wafer 300. The spray assembly 700 can include a spray head 710, which can move along the spray channel 530, and its outlet can face the spray hole 540. Thus, the cleaning fluid sprayed from the spray head 710 can be sprayed onto the wafer 300 through the spray hole 540.
[0045] The spray head 710 moves within the spray channel 530 of the spray fixture 500 and sprays from the spray hole 540. This ensures that the cleaning solution is sprayed onto the surface of the wafer 300 and prevents particles adsorbed on the spray assembly 700 from falling onto the surface of the wafer 300. Furthermore, since the spray head 710 moves within the spray channel 530, it reduces disturbance to the airflow in the cleaning chamber, making the airflow field in the cleaning chamber more stable. This, in turn, prevents contaminant particles in the cleaning chamber from being blown up and contaminating the wafer 300.
[0046] It should be noted that the gap between the spray head 710 and the spray hole 540 is small, which can largely avoid disturbing the airflow inside the chamber body 100, and also largely prevent pollutant particles on the spray assembly 700 or outside the chamber body 100 from entering the chamber body 100.
[0047] In an optional embodiment of this application, a plurality of cleaning holes 112 may be provided on the sidewall of the chamber body 100. Each cleaning hole 112 can penetrate the sidewall of the chamber body 100, and each cleaning hole 112 can be distributed circumferentially along the chamber body 100. In this way, cleaning fluid or water and other liquids can flow into the chamber body 100 through the cleaning holes 112 and clean the inner wall of the chamber body 100 to wash away the drug solution or deposits adsorbed on the inner wall of the chamber body 100, thereby preventing contamination particles deposited on the inner wall of the chamber body 100 from falling off and contaminating the wafer 300. Here, the cleaning fluid can be a liquid such as isopropanol.
[0048] In other embodiments, the cleaning hole 112 may not be provided on the side wall of the chamber body 100.
[0049] Optionally, the cleaning hole 112 can be located near the top of the chamber body 100, which can increase the cleaning area and thus improve the cleaning effect.
[0050] In an optional embodiment, an annular liquid supply groove 610 may be provided on the outer side wall of the chamber body 100, and a group of holes may be provided on the side wall of the chamber body 100. The group of holes may include multiple cleaning holes 112, which are connected to the annular liquid supply groove 610. When it is necessary to clean the inside of the chamber body 100, the liquid supply device can be directly connected to the annular liquid supply groove 610 and liquid can be supplied to the annular liquid supply groove 610. After the cleaning liquid or water enters the annular liquid supply groove 610, it flows in the annular liquid supply groove 610 and fills the annular liquid supply groove 610, and then flows into the inside of the chamber body 100 from each cleaning hole 112. In this way, it is not necessary to set up multiple liquid supply pipes to supply liquid to multiple cleaning holes 112 respectively, which helps to simplify the connection structure between the liquid supply device and the chamber body 100.
[0051] In other embodiments, the annular liquid supply groove 610 may not be provided on the side wall of the chamber body 100, and each cleaning hole 112 may be connected to the liquid supply device through multiple liquid supply pipes.
[0052] In one embodiment, the annular liquid supply groove 610 can be a groove formed on the side wall of the chamber body 100. Specifically, the annular liquid supply groove 610 can be recessed towards the interior of the chamber body 100. In this case, the opening of the annular liquid supply groove 610 is set away from the inner wall of the chamber body 100, and liquids such as cleaning fluid or water can enter the annular liquid supply groove 610 through the opening.
[0053] In another embodiment, a liquid supply ring 600 may be provided on the outer side wall of the chamber body 100. The liquid supply ring 600 may be arranged around the chamber body 100 and sealed to the side wall of the chamber body 100. Specifically, the liquid supply ring 600 may be welded to the side wall of the chamber body 100 as an integral structure. An annular liquid supply groove 610 may be provided on the liquid supply ring 600, and the groove opening of the annular liquid supply groove 610 faces the side wall of the chamber body 100. In this case, a liquid inlet hole 620 communicating with the annular liquid supply groove 610 may be provided on the liquid supply ring 600. Optionally, the liquid inlet hole 620 may be located on the side of the liquid supply ring 600 away from the chamber body 100, so as to facilitate the connection of the liquid inlet hole 620 with the liquid supply device.
[0054] In an optional embodiment, at least two annular liquid supply grooves 610 and at least two sets of holes may be provided on the side wall of the chamber body 100. Each annular liquid supply groove 610 and each set of holes may be distributed along the axial direction of the chamber body 100, and each set of holes may be connected to each annular liquid supply groove 610 respectively. In this way, the number and distribution area of cleaning holes 112 in the axial direction of the chamber body 100 can be increased, thereby increasing the axial cleaning area of the inner wall of the chamber body 100 and improving the cleaning effect on the inner wall of the chamber body 100.
[0055] In this embodiment, each hole group may include 40 to 80 cleaning holes 112. The number of cleaning holes 112 in each hole group is not limited and can be set according to actual needs.
[0056] Optionally, the cleaning holes 112 of two adjacent sets of holes are staggered in the circumferential direction of the chamber body 100. This increases the distribution area of the cleaning holes 112 in the circumferential direction of the chamber body 100, thereby increasing the circumferential cleaning area of the inner wall of the chamber body 100 and further improving the cleaning effect on the inner wall of the chamber body 100.
[0057] Of course, the side wall of the chamber body 100 may also be provided with only an annular liquid supply groove 610 and a set of holes.
[0058] Alternatively, the cleaning hole 112 can be inclined downward, and the end of the cleaning hole 112 that penetrates the outer wall of the chamber body 100 is higher than the end of the cleaning hole 112 that penetrates the inner wall of the chamber body 100. This facilitates the flow of cleaning liquid or water into the chamber body 100 and ensures that the cleaning liquid or water flows downward, thereby better rinsing the inner wall of the chamber body 100 and improving the cleaning effect.
[0059] Of course, the cleaning hole 112 can also be set downward without tilting. Specifically, the cleaning hole 112 can penetrate the side wall of the chamber body 100 radially.
[0060] Optionally, the inclination angle of the cleaning hole 112 can be 45° to 60°, that is, the angle between the axis of the cleaning hole 112 and the axis of the chamber body 100 can be 45° to 60°. This facilitates the flow of cleaning liquid or water from the annular supply tank 610 into the cleaning hole 112, and also facilitates the flow of the cleaning liquid or water out of the cleaning hole 112 along the inner wall of the chamber body 100. The inclination angle of the cleaning hole 112 is not limited here and can be set according to actual needs. In this embodiment, the diameter of the cleaning hole 112 can be 1mm to 2mm.
[0061] In one optional embodiment of this application, the spray assembly 700 may further include a spray arm 720, a spray head 710 may be disposed on the spray arm 720, and a through hole 111 may be provided on the side wall of the chamber body 100. The through hole 111 may be located at the end of the spray channel 530 and communicate with the spray channel 530. The spray arm 720 and the spray head 710 may enter and exit the spray channel 530 through the through hole 111, so that the spray assembly 700 may be retractably disposed in the spray channel 530. This simplifies the structure of the spray assembly 700, and when the wafer 300 does not need to be cleaned, the spray assembly 700 can be pulled out of the spray channel 530 and stored, which helps to extend the service life of the spray assembly 700.
[0062] In other embodiments, the spray arm 720 may be fixedly disposed within the spray channel 530.
[0063] In another optional embodiment of this application, the spray assembly 700 may further include a spray arm 720, and a spray head 710 may be disposed on the spray arm 720. The spray arm 720 may be disposed within the spray channel 530, and the spray arm 720 may be a telescopic structure, allowing the spray head 710 to move within the spray channel 530. In this way, the spray arm 720 only needs to partially extend and retract, without requiring overall movement, which helps to reduce disturbance to the airflow within the chamber body 100. Furthermore, the side wall of the chamber body 100 may not need to have a through hole 111 for the spray arm 720 to enter and exit, thereby improving the sealing performance of the chamber body 100. Of course, in other optional embodiments, the side wall of the chamber body 100 may also have a through hole 111 communicating with the spray channel 530, allowing the spray arm 720 to enter and exit the spray channel 530 through the through hole 111. This facilitates the inspection, maintenance, and replacement of the spray arm 720 and the spray head 710.
[0064] In other embodiments, the spray arm 720 may not be a telescopic structure, and the spray arm 720 may move together with the spray head 710, that is, both the spray arm 720 and the spray head 710 may be movably disposed within the spray channel 530.
[0065] Optionally, the spray arm 720 may include a telescopic drive and a bellows. One end of the bellows is connected to the spray head 710, and the other end can be connected to a cleaning fluid supply pipe. One end of the telescopic drive is connected to the side wall of the chamber body 100, and the other end is connected to the spray head 710 to drive the spray head 710 to move. Here, the telescopic drive can be a hydraulic cylinder or a pneumatic cylinder, etc.
[0066] In an optional embodiment, the cleaning chamber may include at least two spray assemblies 700, each spray assembly 700 being axially distributed along the spray channel 530, and the spray head 710 of each spray assembly 700 being movable within the spray channel 530. This allows each spray assembly 700 to operate simultaneously, thereby improving spray efficiency and spray uniformity, and helping to shorten the cleaning time of the wafer 300.
[0067] Of course, the cleaning chamber may also consist of only one spray assembly 700.
[0068] In some embodiments, the cleaning chamber may include two spray assemblies 700.
[0069] In one embodiment, two through holes 111 are provided on the side wall of the chamber body 100. The two through holes 111 can be located at both ends of the spray channel 530 and are connected to the spray channel 530. The two spray components 700 can enter and exit the spray channel 530 through the two through holes 111 respectively, so that the two spray components 700 enter and exit from both ends of the spray channel 530. In this way, the uniformity and efficiency of spraying the wafer 300 can be improved.
[0070] In another embodiment, the through hole 111 may not be provided on the side wall of the chamber body 100. Both spray assemblies 700 can be disposed within the spray channel 530, and the spray arms 720 of both spray assemblies 700 are telescopic structures. The extension and retraction of the two spray arms 720 can drive the two spray heads 710 to move closer or further apart. This can improve the uniformity and efficiency of spraying the wafer 300.
[0071] In an optional embodiment of this application, the spray fixture 500 may include a first channel wall 510 and a second channel wall 520. The second channel wall 520 may be located on the side of the first channel wall 510 away from the rotary chuck 200. The first channel wall 510 and the second channel wall 520 are connected to form a spray channel 530, and the spray hole 540 may be provided at a position of the first channel wall 510 away from the second channel wall 520 so that the cleaning fluid can be sprayed onto the wafer 300.
[0072] Furthermore, along the direction from the first channel wall 510 to the second channel wall 520, the width of the second channel wall 520 gradually decreases to form a guide surface on the outer wall surface of the second channel wall 520. In this way, the outer wall surface of the second channel wall 520 can guide the air blown in by the air supply device 400 described below, thereby reducing the probability of airflow forming turbulence at the spray fixture 500.
[0073] In other embodiments, the width of the second channel wall 520 remains unchanged along the direction from the first channel wall 510 to the second channel wall 520, and the width of the second channel wall 520 may be consistent with the width of the first channel wall 510.
[0074] In an optional embodiment, the outer wall surface of the second channel wall 520 can be an arc-shaped surface, and the arc-shaped surface protrudes away from the first channel wall 510. In this way, the degree of interference of the spray fixture 500 on the airflow can be reduced, so as to further reduce the probability of the airflow forming turbulence at the spray fixture 500.
[0075] Of course, the outer wall surface of the second channel wall 520 does not have to be an arc-shaped surface. Specifically, the outer wall surface of the second channel wall 520 can be a triangular structure.
[0076] In an optional embodiment, the spray hole 540 can be a strip-shaped hole, and the perpendicular bisector of the spray hole 540 can coincide with the axis of the rotating chuck 200. Furthermore, the length of the spray hole 540 can be greater than or equal to the diameter of the rotating chuck 200. It should be noted that the perpendicular bisector of the spray hole 540 specifically refers to the perpendicular bisector of the axis of the spray hole 540, and this perpendicular bisector can extend vertically. This increases the spray area and improves the uniformity of the spray, preventing any uncleaned areas from appearing on the upper surface of the wafer 300, thereby improving the cleaning effect on the wafer 300.
[0077] In other embodiments, the vertical line of the spray hole 540 may not coincide with the axis of the rotary chuck 200, and the length of the spray hole 540 may be less than the diameter of the rotary chuck 200.
[0078] Optionally, the length of the spray hole 540 can be 300mm to 350mm, the diameter of the wafer 300 can be 300mm, and the width of the spray hole 540 can be 8mm to 10mm. It should be noted that the length and width of the spray hole 540 are not limited here, and can be set according to actual needs.
[0079] In an optional embodiment of this application, the cleaning chamber may further include an air supply device 400 and a cleaning fluid recovery device 800. The air supply device 400 may be disposed above the spray fixture 500 and used to supply air into the interior of the chamber body 100. The cleaning fluid recovery device 800 may be disposed below the spray fixture 500 and may have a recovery space 810. The rotary chuck 200 may be located in the recovery space 810 to facilitate the recovery of the cleaning fluid sprayed onto the wafer 300.
[0080] Furthermore, the cross-sectional shapes of the air outlet of the air supply device 400, the inner wall of the chamber body 100, the rotary chuck 200, and the cleaning fluid recovery device 800 can be consistent. Here, the cross-sectional shapes of the air outlet of the air supply device 400, the inner wall of the chamber body 100, the rotary chuck 200, and the cleaning fluid recovery device 800 can all be circular. This can ensure the airflow stability within the chamber body 100 as much as possible, reducing the probability of turbulence formation, and further preventing contamination particles within the chamber body 100 from falling onto the wafer 300 and contaminating the wafer 300.
[0081] In other embodiments, the shapes of the air outlet of the air supply device 400, the inner wall of the chamber body 100, the rotary chuck 200, and the cleaning fluid recovery device 800 may also be different. For example, the cross-sectional shape of the air outlet of the air supply device 400 may be circular, the cross-sectional shape of the inner wall of the chamber body 100 may be square, and the cross-sectional shape of the cleaning fluid recovery device 800 may be square.
[0082] Optionally, the air supply device 400 can be installed at the top of the chamber body 100. This allows the air supplied by the air supply device 400 to act on any part of the inner wall of the chamber body 100 after the chamber body 100 has undergone self-cleaning, facilitating rapid drying of the chamber body 100. A cleaning fluid recovery device 800 is installed inside the chamber body 100 to facilitate the recovery of the cleaning fluid.
[0083] In an optional embodiment, the air supply device 400 may include an air supply component and an air supply plate. The air supply plate may be disposed on the side of the air supply component near the rotary chuck 200, and the air supply plate may be sealed to the chamber body 100. The air supply plate may be provided with multiple air holes, each air hole forming the air outlet of the air supply device 400. Each air hole may penetrate the air supply plate vertically, thus ensuring that the air can flow vertically downwards to avoid turbulence and reduce air disturbance. Optionally, the air supply component may be a fan or blower, etc.
[0084] Here, the shape of the cross-section of the air supply plate can be consistent with the inner wall of the chamber body 100.
[0085] In an optional embodiment, the chamber body 100 may include a cavity 110 and a cavity support 120. The cavity support 120 is disposed below the cavity 110 and is used to support the cavity 110. Here, the cavity support 120 and the cavity 110 can be an integral structure. Furthermore, the cleaning chamber may also include a base plate 1200. The air supply device 400, the cavity 110, the cavity support 120, and the base plate 1200 are connected to form a sealed space.
[0086] The cleaning chamber may also include an exhaust device 900, which may be located below the cleaning fluid recovery device 800 and may communicate with the inner cavity of the chamber body 100 so that the gas inside the chamber body 100 can be discharged through the exhaust device 900. Here, an exhaust port may be provided on the base plate 1200, and the exhaust device 900 may communicate with the exhaust port.
[0087] In an optional embodiment, the side wall of the chamber body 100 may be provided with an inlet / outlet 113, a door plate 1000 for closing the inlet / outlet 113, and a drive device 1100 for driving the door plate 1000 to open or close. The wafer 300 can enter and exit the chamber body 100 through the inlet / outlet 113. The drive device 1100 can be used to drive the door plate 1000 to rise, fall, or rotate, so that the inlet / outlet 113 opens or closes. Here, the inlet / outlet 113 is located on the side of the rotary chuck 200 to facilitate the placement of the wafer 300 on the rotary chuck 200.
[0088] Optionally, the drive device 1100 may include a drive motor and a lead screw mechanism. The drive motor may be connected to the lead screw of the lead screw mechanism and used to drive the lead screw to rotate. Here, the lead screw may be rotatably connected to the outer wall of the chamber body 100, and the lead screw may be vertically arranged. The nut of the lead screw mechanism may be connected to the door panel 1000. When the drive motor drives the lead screw to rotate, the nut may be raised or lowered to drive the door panel 1000 to be raised or lowered, thereby realizing the opening and closing of the inlet and outlet 113.
[0089] Of course, the drive device 1100 may also include only a drive motor, the output shaft of which is connected to the door panel 1000, and the door panel 1000 can be rotatably connected to the outer wall of the chamber body 100. The drive motor can drive the door panel 1000 to rotate, so as to realize the opening and closing of the inlet and outlet 113.
[0090] Alternatively, the drive unit 1100 can be a telescopic cylinder, such as a pneumatic cylinder or a hydraulic cylinder. The telescopic end of the telescopic cylinder can be connected to the door panel 1000 to drive the door panel 1000 to rise and fall.
[0091] Alternatively, two drive devices 1100 can be provided on the side wall of the chamber body 100. The two drive devices 1100 can be located on both sides of the inlet and outlet 113 and are connected to the door panel 1000. The two drive devices 1100 can simultaneously drive the door panel 1000 to lift or rotate. In this way, the door panel 1000 can be balanced by force, which is beneficial to improving the service life of the door panel 1000.
[0092] When wafer 300 needs to be picked up or put down, the two drive devices 1100 can drive the door plate 1000 to rise to open the inlet and outlet 113. At this time, the wafer 300 can enter the chamber body 100 or be moved out of the chamber body 100 through the inlet and outlet 113.
[0093] In this embodiment of the application, before the cleaning process is carried out in the cleaning chamber, firstly, the drive device 1100 drives the door plate 1000 to rise, opening the inlet and outlet 113. The wafer 300 enters the chamber body 100 through the inlet and outlet 113 and is placed on the rotary chuck 200. The wafer 300 is clamped and fixed by the clamping and fixing shaft on the rotary chuck 200, so that the wafer 300 can rotate together with the rotary chuck 200. Then, the drive device 1100 drives the door plate 1000 to fall, closing the inlet and outlet 113, so that a relatively sealed space is formed inside the chamber body 100.
[0094] Then, the two spray components 700 can enter the spray channel 530 through the through holes 111 at both ends of the spray channel 530 respectively, and the spray heads 710 of the two spray components 700 spray cleaning fluid. As the spray head 710 moves horizontally along the spray channel 530, the cleaning fluid is sprayed onto the upper surface of the wafer 300 through the spray hole 540 to clean the wafer 300.
[0095] Furthermore, during the spraying process, the air supply device 400 continuously blows air downwards to ensure that the cleaning fluid can be accurately sprayed onto the wafer 300 and to prevent the cleaning fluid from being sprayed onto the inner wall of the chamber body 100. This ensures the cleanliness of the microenvironment inside the chamber body 100 and reduces the probability of the cleaning fluid adhering to the inner wall of the chamber body 100 and forming contaminant particles.
[0096] During the cleaning process, the cleaning solution used may evaporate or splash. For example, the cleaning solution may be hydrochloric acid, nitric acid, sulfuric acid, or other chemicals, which may leave residues or accumulate on the inner wall of the chamber body 100, forming contaminant particles. Therefore, to prevent contaminant particles from falling onto the wafer 300 and causing contamination during the cleaning process, the inner wall of the chamber body 100 needs to be cleaned regularly. Specifically, cleaning solution or water is injected into the annular supply tank 610 through the inlet port 620. The cleaning solution or water flows within the annular supply tank 610 and fills it, then flows into the interior of the chamber body 100 through the cleaning port 112 and flows downwards along the inner wall of the chamber body 100 to clean the inner wall of the chamber body 100. After cleaning, the air supply device 400 can continuously supply air downwards to dry the inner wall of the chamber body 100, keeping the internal microenvironment of the chamber body 100 clean.
[0097] Based on the cleaning chamber provided in the embodiments of this application, the embodiments of this application also provide a semiconductor cleaning device. The semiconductor cleaning device may include the cleaning chamber and cleaning liquid supply device described in any of the above embodiments. The cleaning liquid supply device may be connected to the spray assembly 700 of the cleaning chamber to supply cleaning liquid to the spray assembly 700.
[0098] It should be noted that the specific structure of the cleaning fluid supply device is not limited here; it only needs to be able to supply cleaning fluid to the spray assembly 700.
[0099] The beneficial effects achieved by the semiconductor cleaning equipment provided in this application embodiment are consistent with the beneficial effects achieved by the cleaning chamber provided in this application embodiment, so they will not be repeated here.
[0100] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. A cleaning chamber, characterized in that, include: Chamber body(100); A rotary chuck (200) is disposed within the chamber body (100) and is used to carry a wafer (300); A spray fixing component (500) is disposed inside the chamber body (100) and connected to the side wall of the chamber body (100). The spray fixing component (500) is located above the rotating chuck (200). The spray fixing component (500) is provided with a spray channel (530) and a spray hole (540). The spray hole (540) communicates with the spray channel (530) and is opposite to the rotating chuck (200). A spray assembly (700) for spraying cleaning fluid onto the wafer (300), the spray assembly (700) including a spray head (710) movable along the spray channel (530), and the outlet of the spray head (710) facing the spray hole (540).
2. The cleaning chamber according to claim 1, characterized in that, The sidewall of the chamber body (100) is provided with a plurality of cleaning holes (112), each of the cleaning holes (112) penetrating the sidewall of the chamber body (100) and the cleaning holes (112) being distributed along the circumference of the chamber body (100).
3. The cleaning chamber according to claim 2, characterized in that, An annular liquid supply groove (610) is provided on the outer side wall of the chamber body (100), and a group of holes is provided on the side wall of the chamber body (100). The group of holes includes a plurality of cleaning holes (112), and the cleaning holes (112) are connected to the annular liquid supply groove (610).
4. The cleaning chamber according to claim 3, characterized in that, At least two annular liquid supply grooves (610) and at least two sets of holes are provided on the outer side wall of the chamber body (100). Each annular liquid supply groove (610) and each set of holes are distributed along the axial direction of the chamber body (100), and each set of holes is connected to each annular liquid supply groove (610).
5. The cleaning chamber according to claim 2, characterized in that, The cleaning hole (112) is inclined downward, and one end of the cleaning hole (112) that penetrates the outer wall of the chamber body (100) is higher than the other end of the cleaning hole (112) that penetrates the inner wall of the chamber body (100).
6. The cleaning chamber according to claim 1, characterized in that, The spray assembly (700) further includes a spray arm (720), and the spray head (710) is disposed on the spray arm (720); A through hole (111) is provided on the side wall of the chamber body (100). The through hole (111) is located at the end of the spray channel (530) and communicates with the spray channel (530). The spray arm (720) and the spray head (710) can enter and exit the spray channel (530) through the through hole (111).
7. The cleaning chamber according to claim 1, characterized in that, The spray assembly (700) further includes a spray arm (720), the spray head (710) is disposed on the spray arm (720), the spray arm (720) is disposed within the spray channel (530), and the spray arm (720) is a telescopic structure so that the spray head (710) can move within the spray channel (530).
8. The cleaning chamber according to claim 1, characterized in that, The cleaning chamber includes at least two spray assemblies (700), each spray assembly (700) is axially distributed along the spray channel (530), and the spray head (710) of each spray assembly (700) can move within the spray channel (530).
9. The cleaning chamber according to claim 1, characterized in that, The spray fixture (500) includes a first channel wall (510) and a second channel wall (520). The second channel wall (520) is located on the side of the first channel wall (510) away from the rotating chuck (200). The first channel wall (510) and the second channel wall (520) are connected to form the spray channel (530), and the spray hole (540) is located on the first channel wall (510) away from the second channel wall (520). Along the direction from the first channel wall (510) to the second channel wall (520), the width of the second channel wall (520) gradually decreases to form a guide surface on the outer wall surface of the second channel wall (520).
10. The cleaning chamber according to claim 9, characterized in that, The outer wall surface of the second channel wall (520) is an arc-shaped surface, and the arc-shaped surface protrudes away from the first channel wall (510).
11. The cleaning chamber according to claim 1, characterized in that, The spray hole (540) is a strip-shaped hole, the vertical line of the spray hole (540) coincides with the axis of the rotating chuck (200), and the length of the spray hole (540) is greater than or equal to the diameter of the rotating chuck (200).
12. The cleaning chamber according to claim 1, characterized in that, The cleaning chamber further includes: An air supply device (400) is disposed above the spray fixture (500) and is used to supply air to the interior of the chamber body (100); A cleaning fluid recovery device (800) is provided below the spray fixture (500), and the cleaning fluid recovery device (800) is provided with a recovery space (810), and the rotary chuck (200) is located in the recovery space (810). The air outlet of the air supply device (400), the inner wall of the chamber body (100), the rotating chuck (200), and the cleaning fluid recovery device (800) have the same cross-sectional shape.
13. A semiconductor cleaning device, characterized in that, Includes the cleaning chamber and cleaning fluid supply device as described in any one of claims 1-12, wherein the cleaning fluid supply device is connected to the spray assembly (700) of the cleaning chamber.