Dry ice cleaning device and method for semiconductor packaging

Abstract

The invention relates to the technical field of semiconductor production equipment, and particularly discloses a dry ice cleaning device and method for semiconductor packaging, which comprises a rack, a conveying mechanism for conveying workpieces is arranged on the rack, and a sealing box is arranged on the rack above the conveying mechanism. Cleaning mechanisms and adsorption mechanisms are arranged on the two sides of a feeding path of the conveying mechanism in the sealing box, the working ends of the multiple cleaning mechanisms are arranged in a staggered mode to form a cleaning system covering all areas of workpieces, the input ends of the cleaning mechanisms are connected with a dry ice machine and an air compressor, and the working ends of the adsorption mechanisms and the working ends of the cleaning mechanisms are arranged at intervals; the input end of the adsorption mechanism is connected with a negative pressure fan; a height adjusting structure is arranged at the operation end of the cleaning mechanism. The problems that in the prior art, a conventional dry ice cleaning device is not perfect in structural design, depends on manual operation during operation and is not integrated with a traditional mature cleaning device in a high-quality structure are solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and more specifically to a dry ice cleaning device for semiconductor packaging. Background Technology

[0002] Semiconductor packaging refers to fixing a chip onto a substrate by soldering. The soldering method involves spot soldering followed by reflow soldering, and the soldering materials are typically tin, indium, and copper. With improvements in manufacturing processes, the gap between the chip and the substrate is now only about 10μm. After soldering, the entire semiconductor package needs to be cleaned to remove impurities. Currently, the commonly used cleaning method is water washing (flux cleaning machine), which involves rinsing the chip surface, the substrate surface, and the gaps between them with water. The problem with this cleaning method is that when the chip was much smaller than the substrate, water washing was sufficient for thorough cleaning, and drying was also possible. However, as chips have become larger (approaching the size of the substrate), water washing becomes increasingly difficult, and moisture can easily remain in the gaps during drying. If this moisture is not completely dried, it can lead to problems such as poor conductivity and board breakage.

[0003] In the pursuit of high efficiency and environmental friendliness in the industrial cleaning field, dry ice cleaning equipment is particularly important. In particular, carbon dioxide snow jet cleaning technology, with its unique technical principles and superior cleaning effects, has brought new cleaning solutions to many industries, including semiconductor manufacturing. Carbon dioxide snow jet cleaning is a form of carbon dioxide cleaning that differs from traditional dry ice particles or blocks. It utilizes high-pressure liquid carbon dioxide, which undergoes multi-stage expansion and release to obtain micron-sized low-temperature carbon dioxide snow (solid carbon dioxide, temperature approximately -78°C) as the cleaning medium. This snow snow is then accelerated and sprayed onto the surface of the object being cleaned using high-pressure gas, thus achieving highly efficient cleaning.

[0004] Despite the numerous advantages of carbon dioxide snow jet cleaning technology, current dry ice cleaning equipment on the market still faces several challenges. Most existing dry ice cleaning devices rely on manual operation, requiring operators to hold the nozzle and manually control the jet direction. This method heavily depends on the operator's skills and experience, is labor-intensive, and has low production efficiency. Furthermore, the limitations of manual operation make it difficult to guarantee the uniformity and consistency of cleaning, failing to meet the quality and efficiency requirements of large-scale industrial production. In addition, existing dry ice cleaning devices have not been well integrated with traditional, mature cleaning equipment structures, resulting in poor versatility and compatibility, increasing equipment investment and operating costs for companies. Therefore, how to integrate and upgrade carbon dioxide snow jet cleaning technology based on the existing structure of cleaning equipment has become one of the most pressing issues to be addressed in the industry. Summary of the Invention

[0005] This invention provides a dry ice cleaning apparatus and method for semiconductor packaging, which helps to solve the problems of the imperfect structural design of conventional dry ice cleaning apparatuses in the prior art, reliance on manual operation, and failure to be well integrated with the structure of traditional mature cleaning equipment.

[0006] This invention is implemented as follows: A dry ice cleaning apparatus for semiconductor packaging includes a frame with a conveying mechanism for conveying workpieces. A sealing box is located above the conveying mechanism on the frame. Cleaning and adsorption mechanisms are located on both sides of the feeding path of the conveying mechanism inside the sealing box. The working ends of several cleaning mechanisms are staggered to form a cleaning system covering all areas of the workpiece. The input ends of the cleaning mechanisms are connected to a dry ice machine and an air compressor. The working ends of the adsorption mechanisms are spaced apart from the working ends of the cleaning mechanisms. The input end of the adsorption mechanism is connected to a negative pressure fan. The working ends of the cleaning mechanisms are equipped with a height adjustment structure.

[0007] Based on the above technical solution, the front and rear sides of the sealing box are provided with inlet and outlet openings, and the front and rear ends of the conveying mechanism extend to the outside of the inlet and outlet openings respectively.

[0008] Based on the above technical solution, the conveying mechanism includes a conveying chain movably mounted on the frame, and a number of spaced tooling fixtures are provided on the conveying chain for lateral clamping of workpieces.

[0009] Based on the above technical solution, the cleaning mechanism includes a first cleaning mechanism, which includes a first nozzle. The output end of the first nozzle faces the feeding path, and the input end of the first nozzle is connected to a first feed pipe. The input end of the first feed pipe is connected to the output end of the dry ice machine. The first nozzle is also connected to a first air inlet pipe, and the input end of the first air inlet pipe is connected to the output end of the air compressor. The first feed pipe is connected to the frame through a base and a mounting base. The base is sleeved on the first feed pipe, and vertical scale lines are provided on the surface of the base. The mounting base is clamped to the outer surface of the base and fixedly connected to the frame. The mounting base and the base constitute the height adjustment structure of the first cleaning mechanism.

[0010] Based on the above technical solution, the cleaning mechanism includes a second cleaning mechanism, which includes a second nozzle. The input end of the second nozzle is connected to a second feed pipe and a second air inlet pipe. The output end of the second nozzle is provided with a plurality of vertically distributed spray holes. The inside of the second nozzle is provided with a material equalization chamber communicating with the spray holes. The input end of the material equalization chamber is provided with a throat.

[0011] Based on the above technical solution, the working end of the negative pressure mechanism has an "n" shaped structure, and several negative pressure ports are provided on the inner side wall of the working end. The negative pressure ports on the same negative pressure mechanism form a three-sided surrounding structure on the feeding path.

[0012] Based on the above technical solution, the cleaning mechanism includes a third cleaning mechanism, which includes a mounting plate connected to the frame. The mounting plate is located above the feeding path. A vertical dry ice conveying pipe is movably connected to the mounting plate. A rotary motor is also provided on the mounting plate. The output end of the rotary motor is connected to the dry ice conveying pipe. The top of the dry ice conveying pipe is connected to the output pipe of the dry ice machine through a slip ring. A guide pipe is provided at the bottom of the dry ice conveying pipe. A third nozzle facing the conveying path is provided on the inner side wall of the guide pipe.

[0013] Based on the above technical solution, the output end of the third nozzle is inclined to the surface of the workpiece to be cleaned.

[0014] A dry ice cleaning method for semiconductor packaging, employing the aforementioned dry ice cleaning apparatus for semiconductor packaging, includes the following steps: Feeding: The workpieces are placed one by one into the tooling fixtures on the conveying mechanism by manual labor or external transfer devices. The conveying mechanism then moves the workpieces in a step-by-step manner. Cleaning: The cleaning unit, in conjunction with a dry ice machine and an air compressor, sprays low-temperature carbon dioxide snow onto the surface of the workpiece, achieving cleaning through a combination of low-temperature embrittlement, micro-explosive peeling, and kinetic energy impact. Stain recovery: During the cleaning process, the stains splashed out by the cleaning unit are adsorbed and collected by the negative pressure mechanism while floating. Discharge: The cleaned workpiece is output by the conveyor mechanism and transferred manually or by an external transfer device.

[0015] Compared with the prior art, the present invention has at least the following advantages: 1. The dry ice cleaning device disclosed in this invention has a high degree of automation. The workpiece is automatically transported through the conveying mechanism, and the cleaning mechanism and adsorption mechanism automatically complete the cleaning and stain recovery work. There is no need for manual operation of the nozzle, which greatly reduces labor intensity, improves production efficiency, and can meet the needs of large-scale industrial production.

[0016] 2. The dry ice cleaning device disclosed in this invention has excellent cleaning effect. Several cleaning mechanisms are staggered to form a cleaning system covering all areas of the workpiece, and different cleaning mechanisms have different structural characteristics, enabling comprehensive and thorough cleaning of the workpiece from multiple angles and directions. This effectively removes various impurities from the workpiece surface and avoids cleaning dead zones. Simultaneously, the low-temperature embrittlement, micro-explosion peeling, and kinetic energy impact mechanism of low-temperature carbon dioxide snow can efficiently remove stubborn stains, improving cleaning quality. Furthermore, the unique structural design of the negative pressure mechanism can quickly and effectively adsorb stains splashed during the cleaning process, preventing stain diffusion and ensuring a clean cleaning environment. It also avoids secondary contamination of the workpiece by stains, further improving the cleaning effect.

[0017] 3. The dry ice cleaning device disclosed in this invention has strong adaptability. The working end of the cleaning mechanism is equipped with a height adjustment structure, which can flexibly adjust the height of the cleaning mechanism according to the size and shape of different workpieces. This allows the device to adapt to the cleaning of semiconductor packaging workpieces of various specifications, improving the versatility and compatibility of the equipment and reducing the equipment investment cost for enterprises.

[0018] 4. The dry ice cleaning device disclosed in this invention is environmentally friendly and pollution-free. It uses low-temperature carbon dioxide snow as the cleaning medium, which directly sublimates into gas during the cleaning process, leaving no residue and causing no pollution to the environment. Furthermore, the entire cleaning process is carried out within a sealed enclosure, reducing the diffusion of carbon dioxide snow and further minimizing the environmental impact, thus meeting the environmental protection requirements of modern industry. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of a dry ice cleaning device for semiconductor packaging. Figure 2 for Figure 1 A cross-sectional view; Figure 3 for Figure 1 Longitudinal sectional view; Figure 4 for Figure 3 A magnified view of part A in the image; Figure 5 for Figure 2 A schematic diagram of the structure of the first cleaning unit in China; Figure 6 for Figure 2 A schematic diagram of the structure of the second cleaning unit; Figure 7 for Figure 6 Longitudinal sectional view; Figure 8 for Figure 2 Schematic diagram of the adsorption tube structure; Figure 9 This is a schematic diagram of the third cleaning unit; Figure 10 for Figure 9 Side view.

[0021] The diagram is labeled as follows: 100, frame; 110, sealing box; 200, conveying mechanism; 220, guardrail; 210, tooling fixture; 300, dry ice machine; 400, negative pressure fan; 500, first cleaning mechanism; 510, first nozzle; 520, first feed pipe; 530, first air inlet pipe; 540, base; 550, mounting base; 600, second cleaning mechanism; 610, second nozzle; 611, spray hole; 612, material equalization chamber; 613, throat; 620, second feed pipe; 621, feed channel; 630, second air inlet pipe; 631, air inlet channel; 700, adsorption mechanism; 710, negative pressure port; 800, third cleaning mechanism; 810, mounting plate; 820, dry ice conveying pipe; 830, rotary motor; 840, guide pipe; 850, third nozzle; a, workpiece. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0023] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0026] Example 1: Combination Figures 1 to 8This embodiment discloses a dry ice cleaning apparatus and method for semiconductor packaging, addressing the problems of inadequate structural design, reliance on manual operation, and lack of seamless integration with traditional, mature cleaning equipment in existing technologies. The apparatus and method of this invention enable efficient and automated cleaning of semiconductor packages, improving cleaning quality and production efficiency while reducing production costs.

[0027] The dry ice cleaning device in this embodiment includes a frame 100, which is assembled from aluminum alloy profiles and panels, and has an overall box-like structure. The frame 100 serves as the supporting structure for the entire device, providing a stable installation foundation for other components.

[0028] A conveying mechanism 200 is provided on the frame 100 for conveying workpiece a. The conveying mechanism 200 is responsible for conveying the semiconductor packaged workpiece a to be cleaned according to a certain rhythm and direction, realizing automated continuous cleaning. A sealing box 110 is located above the conveying mechanism 200 on the frame 100. The sealing box 110 provides a relatively enclosed space for the cleaning process, which helps reduce the diffusion of carbon dioxide snow during cleaning, improves the cleaning effect, and also protects the surrounding environment from pollution. The sealing box 110 has inlet and outlet openings on both the front and rear sides, and the front and rear ends of the conveying mechanism 200 extend to the outside of the inlet and outlet openings respectively. This design allows workpiece a to smoothly enter the sealing box 110 for cleaning and then exit from the sealing box 110 after cleaning, realizing continuous conveying of workpiece a and automation of the cleaning process.

[0029] Combination Figure 2 As shown, cleaning and adsorption mechanisms 700 are located on both sides of the feeding path of the conveying mechanism 200 inside the sealing box 110. The cleaning mechanism is one of the core components of this device, responsible for spraying -78℃ low-temperature carbon dioxide snow onto the surface of workpiece a to clean it. The working ends of several cleaning mechanisms are staggered to form a cleaning system covering all areas of workpiece a, ensuring that all parts of workpiece a are thoroughly cleaned and avoiding cleaning dead spots. The input end of the cleaning mechanism is connected to a dry ice machine 300 and an air compressor. The dry ice machine 300 is used to generate low-temperature carbon dioxide snow, and the air compressor provides high-pressure gas power for the spraying of carbon dioxide snow. The working end of the adsorption mechanism 700 is spaced apart from the working end of the cleaning mechanism, and the input end of the adsorption mechanism 700 is connected to a negative pressure fan 400. The function of the adsorption mechanism 700 is to adsorb and collect the splashed dirt in a floating state during the cleaning process, preventing the dirt from re-contaminating workpiece a or spreading into the surrounding environment. The dry ice machine 300, air compressor and negative pressure fan 400 are integrated inside the frame 100.

[0030] In addition, the working end of the cleaning mechanism is equipped with a height adjustment structure, which can flexibly adjust the height of the cleaning mechanism according to the size and shape of different workpieces to ensure the best cleaning effect.

[0031] Furthermore, such as Figure 3 As shown, the conveying mechanism 200 includes a conveyor chain movably mounted on the frame 100. The top of the conveyor chain is horizontal, and several spaced-apart tooling fixtures 210 are arranged on the conveyor chain, such as... Figure 4 As shown, each fixture 210 consists of four clamping wheels, two on the front and two on the back. The outer circumference of each clamping wheel has a clamping groove adapted to the workpiece a. The surface of the clamping wheels is made of an elastic material, allowing for elastic expansion and contraction, facilitating stable clamping of the workpiece a. The clamping wheels work together to clamp the workpiece a from the side. In this embodiment, the workpiece a is a packaging substrate, and after clamping, the workpiece a is in a vertical position. It should be noted that in actual operation, the fixture 210 can be changed and adjusted according to the specifications and type of the workpiece a. The conveyor chain circulates under the drive of the drive device (stepper motor), thereby moving the fixture 210 and the workpiece a together. The side-clamping method of the fixture 210 ensures the stability of the workpiece a during transport, preventing it from shaking or shifting during cleaning, which would affect the cleaning effect. Simultaneously, the spaced fixtures 210 can be reasonably spaced according to production needs to accommodate workpieces a of different sizes and shapes, improving the versatility of the equipment. To prevent workpiece a from accidentally tipping over during the cleaning process, the frame 100 is also equipped with guardrails 220 on the left and right sides of workpiece a.

[0032] The cleaning mechanism in this embodiment includes a first cleaning mechanism 500 and a second cleaning mechanism 600 distributed along the front and back of the feeding path.

[0033] Combination Figure 5As shown, the first cleaning mechanism 500 includes a first nozzle 510, the output end of which faces the feeding path to ensure accurate spraying of low-temperature carbon dioxide snow onto the surface of workpiece a. The input end of the first nozzle 510 is connected to a first feed pipe 520, which is connected to the output end of a dry ice machine 300 for conveying low-temperature carbon dioxide snow. The first nozzle 510 is also connected to a first air inlet pipe 530, the input end of which is connected to the output end of an air compressor to provide high-pressure gas for the spraying of carbon dioxide snow. The first feed pipe 520 is connected to the frame 100 via a base 540 and a mounting base 550. The base 540 is fitted onto the first feed pipe 520, and vertically oriented scale lines are provided on its surface. The mounting base 550 is clamped to the outer surface of the base 540 and fixedly connected to the frame 100. Mounting base 550 and base 540 constitute the height adjustment structure of the first cleaning mechanism 500. By adjusting the position of base 540 on mounting base 550 and taking accurate readings according to the scale lines, the height of the first nozzle 510 can be easily adjusted to meet the cleaning needs of different workpieces a.

[0034] Combination Figure 6 and Figure 7 As shown, the second cleaning mechanism 600 includes a second nozzle 610. The input end of the second nozzle 610 is connected to a second feed pipe 620 and a second air inlet pipe 630, which are used to transport carbon dioxide snow and high-pressure gas, respectively. The output end of the second nozzle 610 is provided with several vertically distributed spray holes 611. This multi-hole design can expand the spray range of carbon dioxide snow and improve cleaning efficiency. Inside the second nozzle 610, there is a material distribution chamber 612 communicating with the spray holes 611. The function of the material distribution chamber 612 is to evenly distribute the carbon dioxide snow entering the nozzle into each spray hole 611, ensuring a uniform flow rate of the sprayed carbon dioxide snow. The input end of the material distribution chamber 612 is provided with a throat 613. The design of the throat 613 allows the carbon dioxide snow to generate an acceleration effect when entering the material distribution chamber 612, further increasing the spray speed and impact force of the carbon dioxide snow and enhancing the cleaning effect. The second feed pipe 620 has a feed channel 621 for conveying dry ice, and the second air inlet pipe 630 has an air inlet channel 631 for conveying high-pressure gas. After the high-pressure gas and dry ice are mixed at the end of the feed channel 621, they enter the uniform material chamber 612 through the throat 613 and are then output through the spray hole 611 to clean the corresponding area on the workpiece a in a longitudinal linear arrangement.

[0035] Combination Figure 2 and Figure 8The working end of the negative pressure mechanism is an "n"-shaped tube, with several strip-shaped through-hole negative pressure ports 710 on its inner wall. The negative pressure ports 710 on the same negative pressure mechanism form a three-sided surrounding structure along the feeding path. This structural design can increase the range of negative pressure adsorption, quickly adsorbing and concentrating the stains splashed from the surface of workpiece a in a floating state, improving stain recovery efficiency and preventing stain diffusion.

[0036] Example 2: Based on Example 1, combined with Figure 9 and Figure 10 As shown, it also includes a third cleaning mechanism 800, which is located behind the second cleaning mechanism 600. The third cleaning mechanism 800 includes a mounting plate 810 connected to the frame 100. The mounting plate 810 is located above the feeding path and provides a mounting base for other components. A vertical dry ice delivery pipe 820 is movably connected to the mounting plate 810, and the dry ice delivery pipe 820 can rotate at a certain angle on the mounting plate 810. A rotary motor 830 is also provided on the mounting plate 810. The output end of the rotary motor 830 is connected to the dry ice delivery pipe 820 for transmission. Driven by the rotary motor 830, the dry ice delivery pipe 820 can be rotated. The top of the dry ice delivery pipe 820 is connected to the output pipe of the dry ice machine 300 through an air slip ring. The design of the air slip ring ensures that the dry ice delivery pipe 820 can continuously and stably receive carbon dioxide snow from the dry ice machine 300 during rotation. The bottom of the dry ice delivery pipe 820 is provided with a guide pipe 840, and the inner side wall of the guide pipe 840 is provided with a third nozzle 850 facing the delivery path. The output end of the third nozzle 850 is inclined to the surface of the workpiece a to be cleaned. This inclined design allows the sprayed carbon dioxide snow to impact the surface of the workpiece a at a certain angle, producing a better cleaning effect, especially effective in removing some stubborn stains.

[0037] It should be noted that the distribution of the negative pressure mechanism can be flexibly designed according to the actual situation.

[0038] Example 3: This example discloses a dry ice cleaning method for semiconductor packaging, using the aforementioned dry ice cleaning apparatus for semiconductor packaging. The steps include: Feeding: Workpieces a are placed one by one onto the tooling fixture 210 on the conveying mechanism 200 using manual labor or an external transfer device. The conveying mechanism 200 then moves the workpieces a in a step-by-step manner. This step-by-step conveying method ensures that workpieces a have sufficient dwell time during the conveying process, allowing the cleaning mechanism to thoroughly clean them.

[0039] Cleaning: The cleaning mechanism, in conjunction with a dry ice machine 300 and an air compressor, sprays low-temperature carbon dioxide snow onto the surface of workpiece a, achieving cleaning through a combination of low-temperature embrittlement, micro-explosive peeling, and kinetic energy impact. During the cleaning process, cleaning mechanisms at different locations clean workpiece a from different angles and directions according to its structural characteristics, ensuring that all parts of workpiece a are thoroughly cleaned.

[0040] Stain Recovery: During the cleaning process, stains splashed out by the cleaning unit are adsorbed and collected by the negative pressure mechanism while floating. The negative pressure mechanism uses the negative pressure generated by the negative pressure fan 400 to quickly adsorb the stains to the negative pressure port 710, and then collects them through pipelines into a special recovery device, avoiding secondary pollution of the environment and workpiece a by the stains.

[0041] Material output: After cleaning, workpiece a is output by conveyor mechanism 200 and transferred manually or by an external transfer device. After cleaning, workpiece a can enter the next production process, ensuring the continuity and efficiency of the semiconductor packaging production process.

[0042] It should be noted that carbon dioxide snow jet cleaning is a different form of carbon dioxide cleaning from traditional dry ice particles or blocks. It utilizes high-pressure liquid carbon dioxide, which undergoes multi-stage expansion and release to obtain micron-sized low-temperature carbon dioxide snow (solid carbon dioxide, temperature approximately -78°C) as the cleaning medium. This snow is then accelerated and sprayed onto the surface of the object being cleaned using high-pressure gas, thereby achieving highly efficient cleaning.

[0043] The core of carbon dioxide snow jet cleaning lies in the triple physical effects of solid carbon dioxide (-78.5℃). Specifically: Low-temperature embrittlement: When dry ice particles are driven by compressed air and impact the surface of dirt at extremely high speeds (up to 200 m / s), the ultra-low temperature of -78°C causes the dirt to freeze and embrittle rapidly. The originally sticky oil, resin, carbon deposits and other substances change their physical form in a very short time, becoming fragile and brittle, and their adhesion to the surface of the object decreases significantly.

[0044] Micro-explosion peeling: Upon contact with an object's surface, carbon dioxide snow particles rapidly sublimate, transforming directly from a solid to a gaseous state, instantly expanding in volume approximately 800 times. This rapid expansion generates a powerful impact force, like countless tiny explosions, forcefully peeling brittle dirt from the object's surface. Simultaneously, the kinetic energy of the high-speed jet of carbon dioxide snow continuously impacts stubborn stains, further breaking them down and removing them for deep cleaning.

[0045] Kinetic impact: The high-speed jet of carbon dioxide snow has its own kinetic energy, which continuously impacts stubborn stains, further breaking them down and removing the dirt for deep cleaning.

[0046] Through the above specific embodiments, the dry ice cleaning apparatus and method for semiconductor packaging of the present invention can achieve efficient and automated cleaning of semiconductor packaging workpiece a, improve cleaning quality and production efficiency, reduce production costs, and has good application prospects and market value.

[0047] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A dry ice cleaning apparatus for semiconductor packaging, characterized in that, The system includes a frame with a conveying mechanism for transporting workpieces. Above the conveying mechanism, a sealing box is located on the frame. Inside the sealing box, on both sides of the feeding path of the conveying mechanism, are cleaning and adsorption mechanisms. The working ends of several cleaning mechanisms are staggered to form a cleaning system covering all areas of the workpiece. The input ends of the cleaning mechanisms are connected to a dry ice machine and an air compressor. The working ends of the adsorption mechanisms are spaced apart from the working ends of the cleaning mechanisms, and the input end of the adsorption mechanisms is connected to a negative pressure fan. The working ends of the cleaning mechanisms are equipped with a height adjustment structure.

2. The dry ice cleaning apparatus for semiconductor packaging according to claim 1, characterized in that, The sealing box has inlet and outlet openings on both the front and rear sides, and the front and rear ends of the conveying mechanism extend to the outside of the inlet and outlet openings respectively.

3. The dry ice cleaning apparatus for semiconductor packaging according to claim 1, characterized in that, The conveying mechanism includes a conveyor chain movably mounted on a frame, and a number of spaced tooling fixtures are provided on the conveyor chain for lateral clamping of workpieces.

4. The dry ice cleaning apparatus for semiconductor packaging according to claim 1, characterized in that, The cleaning mechanism includes a first cleaning mechanism, which includes a first nozzle. The output end of the first nozzle faces the feeding path. The input end of the first nozzle is connected to a first feed pipe, which is connected to the output end of the dry ice machine. The first nozzle is also connected to a first air inlet pipe, which is connected to the output end of an air compressor. The first feed pipe is connected to the frame via a base and a mounting base. The base is fitted onto the first feed pipe, and vertical graduation lines are provided on the surface of the base. The mounting base is clamped to the outer surface of the base and fixed to the frame. The mounting base and the base constitute the height adjustment structure of the first cleaning mechanism.

5. A dry ice cleaning apparatus for semiconductor packaging according to claim 1 or 4, characterized in that, The cleaning mechanism includes a second cleaning mechanism, which includes a second nozzle. The input end of the second nozzle is connected to a second feed pipe and a second air inlet pipe. The output end of the second nozzle is provided with a plurality of vertically distributed spray holes. The interior of the second nozzle is provided with a material equalization chamber communicating with the spray holes. The input end of the material equalization chamber is provided with a throat.

6. The dry ice cleaning apparatus for semiconductor packaging according to claim 1, characterized in that, The working end of the negative pressure mechanism has an "n" shaped structure, and several negative pressure ports are provided on the inner wall of the working end. The negative pressure ports on the same negative pressure mechanism form a three-sided surrounding structure on the feeding path.

7. A dry ice cleaning apparatus for semiconductor packaging according to claim 1, 4, or 5, characterized in that, The cleaning mechanism includes a third cleaning mechanism, which includes a mounting plate connected to the frame. The mounting plate is located above the feeding path. A vertical dry ice conveying pipe is movably connected to the mounting plate. A rotary motor is also provided on the mounting plate. The output end of the rotary motor is connected to the dry ice conveying pipe. The top of the dry ice conveying pipe is connected to the output pipe of the dry ice machine through a slip ring. A guide pipe is provided at the bottom of the dry ice conveying pipe. A third nozzle facing the conveying path is provided on the inner side wall of the guide pipe.

8. A dry ice cleaning apparatus for semiconductor packaging according to claim 7, characterized in that, The output end of the third nozzle is inclined to the surface of the workpiece to be cleaned.

9. A dry ice cleaning method for semiconductor packaging, characterized in that, The dry ice cleaning apparatus for semiconductor packaging according to any one of claims 1-8 includes the following steps: Feeding: The workpieces are placed one by one into the tooling fixtures on the conveying mechanism by manual labor or external transfer devices. The conveying mechanism then moves the workpieces in a step-by-step manner. Cleaning: The cleaning unit, in conjunction with a dry ice machine and an air compressor, sprays low-temperature carbon dioxide snow onto the surface of the workpiece, achieving cleaning through a combination of low-temperature embrittlement, micro-explosive peeling, and kinetic energy impact. Stain recovery: During the cleaning process, the stains splashed out by the cleaning unit are adsorbed and collected by the negative pressure mechanism while floating. Discharge: The cleaned workpiece is output by the conveyor mechanism and transferred manually or by an external transfer device.

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