Semiconductor plug-in device

Abstract

A semiconductor plug-in device belongs to the technical field of plug-in machines, and comprises a pair of slide rails, between which a gap for accommodating semiconductor pins is arranged; the pushing device is arranged between the tail ends of the two sliding rails; a rotating shaft is arranged on the bottom edge of the guide plate in parallel, a balancing weight is arranged at the bottom of the rotating shaft, the rotating shaft is perpendicularly arranged below the middle sections of the two sliding rails, the guide plate swings around the rotating shaft, an arc-shaped groove is formed in the face, facing the tail ends of the sliding rails, of the guide plate, and the axis of the arc-shaped groove is perpendicular to the rotating shaft and located between the two sliding rails. The width of the arc-shaped groove is larger than or equal to the interval between the sliding rails. The guide tube is in a vertical state, a through hole is formed in the side wall of the guide tube, and a push plate moving in the vertical direction is arranged in the guide tube and used for pushing the semiconductor entering the guide tube downwards to perform plug-in operation. According to the scheme, posture adjustment is carried out by utilizing the characteristics of the semiconductor of the cylindrical packaging structure, the device structure is simpler, and the error rate during posture adjustment can be reduced.

Description

Technical Field

[0001] This invention belongs to the field of insertion machine technology, and particularly relates to a semiconductor insertion device. Background Technology

[0002] Existing semiconductor device packaging structures typically employ two types: cuboid and cylindrical. For example, transistors include surface-mount transistors designed as cuboids, as well as through-hole transistors designed as cylinders. Similarly, rectifier bridges include not only surface-mount rectifier bridges with cuboid structures, but also through-hole rectifier bridges with cuboid structures, and through-hole rectifier bridges with cylindrical structures. In current through-hole processes, because cuboid packaged semiconductor devices facilitate the differentiation of positive and negative terminals, the insertion process for most semiconductor devices with this structure has been mechanized and automated. Most cylindrical semiconductor packages have positive and negative markings on the top surface of the package, and the corresponding pins are designed to be longer to facilitate quick identification of the insertion position by the operator. However, current equipment for automatic insertion of semiconductors with conical packages not only requires a vision scanning system to determine the semiconductor's orientation, but also a rotary motor to adjust the semiconductor's orientation. This results in a relatively complex overall structure. Furthermore, the error rate of the vision scanning system is high due to factors such as the accuracy and stability of the vision scanning system, the cleanliness of the semiconductor package surface, and the clarity of the positive and negative markings. This affects the smooth operation and efficiency of the insertion process. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a semiconductor insertion device that utilizes the inherent characteristics of a cylindrical semiconductor package for orientation adjustment. The device has a simpler structure and helps reduce the error rate during orientation adjustment.

[0004] In order to achieve the objective of this invention, the following solution is proposed: A semiconductor insertion device, comprising: A pair of parallel slide rails on a horizontal plane are used to transport semiconductors. The slide rails have a spacing between them to accommodate semiconductor pins, and the semiconductors can rotate about their own axes on the slide rails. The feeding device is located between the ends of two slide rails and is used to push semiconductors to the front end of the slide rails. A guide plate has a rotating shaft parallel to its bottom edge. A counterweight is provided at the bottom of the rotating shaft. The rotating shaft is perpendicular to the lower part of the middle section of the two slide rails. The guide plate swings around the rotating shaft. In its natural state, the guide plate is vertical. At this time, the top surface of the guide plate is higher than the lower end of the longest lead of the semiconductor and lower than the lower end of the other leads. The side of the guide plate facing the end of the slide rail has an arc-shaped groove. The axis of the arc-shaped groove is perpendicular to the rotating shaft and is located in the middle of the two slide rails. The width of the arc-shaped groove is greater than or equal to the interval between the slide rails. The guide tube is vertical and has a through hole on its side wall for passing semiconductors discharged from the front end of the slide rail. Inside the guide tube is a push plate that moves vertically to push the semiconductors into the guide tube for insertion.

[0005] The beneficial effects of this invention are as follows: This solution can automatically perform orientation adjustment on semiconductors with cylindrical plastic encapsulation structures, resulting in a simpler overall structure that is stable and reliable, and can effectively reduce the probability of errors during orientation adjustment. Attached Figure Description

[0006] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of the invention.

[0007] Figure 1 A side view of the overall structure of this application is shown.

[0008] Figure 2 A top view of the overall structure of this application is shown.

[0009] Figure 3 It shows Figure 2 A magnified view of a portion of point A in the middle.

[0010] Figure 4 It shows Figure 2 A magnified view of a section at point B in the middle.

[0011] Figure 5 A cross-sectional view of the guide tube of this application is shown.

[0012] Figure 6 The diagram shows the internal structure of the guide tube and the installation structure of the guide rod and guide plate of this application.

[0013] The markings in the diagram are: slide rail-1, top plate-11, pusher device-2, guide plate-3, arc groove-301, V-groove-302, rotating shaft-31, counterweight-32, arc protrusion-33, guide tube-4, through hole-401, push plate-41, guide rod-5, elastic element-51. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments.

[0015] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0016] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, and are only for the convenience of describing the invention and simplifying the description. The terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "parallel," "vertical," etc., do not mean that the components are required to be absolutely parallel or perpendicular, but can be slightly tilted.

[0017] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection, an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0018] like Figure 1 , Figure 2 and Figure 5 , Figure 6 As shown, a semiconductor insertion device includes: a slide rail 1, a pusher device 2, a guide plate 3, and a guide tube 4.

[0019] A pair of parallel slide rails 1 on a horizontal plane are used to transport semiconductors. The slide rails 1 have a spacing to accommodate semiconductor leads, and the semiconductor can rotate about its own axis on the slide rails 1. Therefore, the spacing between the slide rails 1 must be less than the outer diameter of the cylindrical plastic package of the semiconductor, and greater than the maximum spacing between the leads plus twice the outer diameter of the leads. Specifically, when the slide rail 1 is a smooth rod structure, the top surface of the slide rail 1 supports the bottom surface of the semiconductor plastic package. During feeding, the edge of the bottom surface of the cylindrical plastic package of the semiconductor is supported by the top surface of the slide rail 1, and all the leads of the semiconductor pass downwards between the two slide rails 1.

[0020] As a preferred option, the slide rail 1 is a channel steel structure, and the two slide rails 1 are arranged opposite each other on the slotted side to prevent the semiconductor from falling upwards.

[0021] The pushing device 2 is located between the ends of the two slide rails 1 and is used to push the semiconductor to the front end of the slide rail 1. The pushing device 2 is a cylinder, hydraulic cylinder or linear motor. The semiconductor is moved by the telescopic spindle. Preferably, an arc plate that fits against the outer wall of the semiconductor can be provided at the end of the spindle to increase the contact area between the two. During the actual pushing process, the arc surface of the arc plate contacts the outer wall of the cylindrical plastic encapsulation of the semiconductor.

[0022] A rotating shaft 31 is provided parallel to the bottom edge of the guide plate 3. A counterweight 32 is provided at the bottom of the rotating shaft 31. The rotating shaft 31 is perpendicular to the middle section of the two slide rails 1. Therefore, the length direction of the guide plate 3 is also perpendicular to the two slide rails 1. The guide plate 3 is oscillating around the rotating shaft 31. The resistance when the rotating shaft 31 oscillates is greater than the resistance when the guide plate 3 pushes the semiconductor to rotate through the longest pin. In the natural state, under the action of the counterweight 32, the guide plate 3 is in a vertical state. At this time, the top surface of the guide plate 3 is higher than the bottom of the longest pin of the semiconductor and lower than the bottom of the other pins. The side of the guide plate 3 facing the end of the slide rail 1 has an arc groove 301. The axis of the arc groove 301 is perpendicular to the rotating shaft 31 and is located in the middle of the two slide rails 1. The width of the arc groove 301 is greater than or equal to the interval between the slide rails 1 to ensure that the longest pin can be blocked and guided.

[0023] Preferably, the counterweight 32 is bolted to the rotating shaft 31 for easy replacement, thereby adjusting the rotational resistance of the rotating shaft 31.

[0024] The guide tube 4 is in a vertical position, and its side wall has a through hole 401 for passing semiconductors discharged from the front end of the slide rail 1. Inside the guide tube 4 is a push plate 41 that moves in a vertical direction for pushing the semiconductors into the guide tube 4 downward for insertion. The push plate 41 is driven by a cylinder, hydraulic cylinder or linear motor.

[0025] During operation, the semiconductor is transported to the ends of the two slide rails 1 through a feed tube or vibrating feeder. The bottom surface of the semiconductor's cylindrical plastic encapsulation is supported on the top surface of the slide rails 1 on both sides. Then, the pusher device 2 pushes the semiconductor to move towards the front end of the slide rail 1. The position of the longest pin of the semiconductor is not limited when it enters the slide rail 1 and moves on the slide rail 1.

[0026] When the semiconductor moves to guide plate 3, all pins except the longest pin can pass smoothly over guide plate 3. The lower end of the longest pin will abut against the arc groove 301. At this time, the longest pin may be facing the front end, rear end, or sides of slide rail 1. However, because the width of arc groove 301 is greater than or equal to the interval between slide rails 1, the longest pin will inevitably abut against arc groove 301 regardless of its orientation. After the longest pin abuts against arc groove 301, the semiconductor will continue to move towards the front end of slide rail 1 under the action of pusher device 2. During the movement, arc groove 301 can be used to restrict the longest pin. The semiconductor can be adjusted by cooperating with the longest pin. The adjustment process can be divided into the following three types according to the orientation of the longest pin when it contacts arc groove 301: The first orientation adjustment process: When the longest pin contacts the arc groove 301, if the longest pin is facing the front end of the slide rail 1, then under the guidance of the arc groove 301, the longest pin will move towards the end of the arc groove 301 until the longest pin is facing the side of the slide rail 1. This can also be understood as the line connecting the longest pin and the semiconductor axis being perpendicular to the slide rail 1. After this, as the semiconductor continues to move, the longest pin will move from the end of the slide groove 301 towards the middle of the two slide rails 1 until the longest pin finally moves to the middle position of the two slide rails 1. During the above process, when the longest pin moves, the semiconductor also rotates around its own axis at the same time. When the longest pin finally moves to the middle position of the two slide rails 1, the longest pin will face the rear end of the slide rail 1, thus completing the orientation adjustment of the semiconductor. The second orientation adjustment process: When the longest pin contacts the arc groove 301, if the longest pin faces the side of the slide rail 1, the longest pin will be at the end of the arc groove 301. As the semiconductor continues to move, the longest pin will move towards the middle position of the two slide rails 1 until the longest pin moves to the middle position of the two slide rails 1. When the longest pin moves, the semiconductor also rotates around its own axis at the same time, so that the longest pin will face the rear end of the slide rail 1. This completes the orientation adjustment of the semiconductor. The third orientation adjustment process: When the longest pin contacts the arc groove 301, if the longest pin is facing the rear end of the slide rail 1, the longest pin will also automatically move towards the middle of the two slide rails 1 under the guidance of the arc groove 301, and drive the semiconductor to rotate around its own axis, so that the longest pin is facing the rear end of the slide rail 1, thus completing the orientation adjustment of the semiconductor.

[0027] Each semiconductor can only be used in one of the three orientation adjustment processes mentioned above. After the orientation adjustment is completed, when the pusher device 2 continues to push the semiconductor to the front end of the slide rail 1, the longest pin will push the guide plate 3 to swing around the rotating shaft 31, so that the guide plate 3 will avoid the longest pin. During the avoidance process, the longest pin will always be at the midpoint of the arc groove 301, that is, the middle position of the two slide rails 1, and enter the guide tube 4 through the through hole 401 in this posture. After the semiconductor enters the guide tube, it can be pushed out from the bottom of the guide tube 4 under the action of the pusher plate 41 and perform the insertion operation. In a specific embodiment, the longest pin can be designed as the positive electrode of the semiconductor, and the pins adjacent or opposite to it can be designed as the negative electrode.

[0028] This solution can automatically perform orientation adjustment on semiconductors with cylindrical plastic encapsulation structures simply by using the longest pin to interact with the guide plate 3 and by setting the structure and installation method of the guide plate 3. Compared with insertion devices that rely on vision systems and rotary motors for orientation adjustment, this solution has a simpler overall structure and is more stable and reliable.

[0029] Preferred, such as Figure 2As shown, slide rail 1 has a smooth rod structure, and a top plate 11 is provided above the mounting position of guide plate 3 to limit the upper position of the semiconductor and prevent the semiconductor from moving upward when the longest lead contacts guide plate 3. As a further preferred embodiment, a side baffle is provided on the outer side of slide rail 1 to limit the position of the cylindrical encapsulated body, so that the semiconductor is always in the middle position between the two slide rails 1, so as to ensure that the semiconductor can rotate smoothly under the action of guide plate 3.

[0030] Preferably, the radius of the arc groove 301 is equal to the distance between the outer surface of the pin and the axis of the semiconductor cylindrical molded body, so that when the outer surface of the longest pin contacts the arc groove 301, the axis of the cylindrical molded body is coaxial with the axis of the arc groove 301, so as to further improve the smoothness of the longest pin sliding on the arc groove 301 and reduce the resistance when the cylindrical molded body rotates.

[0031] Preferred, such as Figure 3 As shown, an arc-shaped protrusion 33 is provided at the lower end of the midpoint of the arc-shaped groove 301. A V-shaped groove 302 is provided above the arc-shaped protrusion 33 on the guide plate 3. When the longest pin contacts the arc-shaped groove 301, if the longest pin is facing the front of the slide rail 1, the arc-shaped protrusion 33 can actively guide the longest pin away from the midpoint of the arc-shaped groove 301, so that the longest pin can move smoothly to the end of the arc-shaped groove 301 to prevent the semiconductor from being stuck. Because the arc-shaped protrusion 33 is provided, the longest pin will not be in the midpoint of the arc-shaped groove 301 temporarily after the orientation adjustment is completed. Only when the longest pin pushes the guide plate 3 to swing will the lower end of the longest pin gradually separate from the bottom of the arc-shaped groove 301. At the same time, the longest pin will also separate from the arc-shaped protrusion 33. After separation, the longest pin can automatically move to the midpoint of the arc-shaped groove 301 under the guidance of the V-shaped groove 302, so that when the longest pin separates from the guide plate 3, the longest pin faces the rear of the slide rail 1 to achieve the purpose of orientation adjustment. As a further preferred embodiment, the width of the upper end of the V-groove 302 is greater than the width of the arc-shaped protrusion 33, so that the longest pin can smoothly enter the V-groove 302.

[0032] Preferred, such as Figure 2 , Figure 4 and Figure 6As shown, at least two guide rods 5 parallel to the slide rails 1 are provided below the front section of the two slide rails 1. There is a gap between adjacent guide rods 5 for the pins to pass through, and one of the gaps is used for the longest pin to pass through. The end of the guide rod 5 extends into the through hole 401. When the longest pin is separated from the guide plate 3, the pin opposite to or adjacent to the longest pin has been inserted into the gap between adjacent guide rods 5. Through the above design, the attitude of the semiconductor after orientation adjustment can be effectively guaranteed, so that the semiconductor can enter the guide tube 4 with the attitude during orientation adjustment. The semiconductor pins of the cylindrical plastic package structure are usually available in two specifications: 2, 3 and 4. When the semiconductor has 2 pins, or 4 pins arranged in a square structure, the pin opposite to the longest pin will enter the gap between the guide rods 5 first. This gap is located in the middle of the two slide rails 1, and only one gap is needed because the longest pin and its opposite pin are on the same straight line along the length of the slide rail 1. When there are three pins arranged in an isosceles triangle, four guide rods 5 are provided, with three intervals. The middle interval is located between two slide rails 1 and is used to pass through the longest pin. The other two guide rods are used to pass through the pins adjacent to the longest pin. Preferably, the guide rods 5 are detachably mounted to the bottom surface of the through hole 401 with screws to facilitate adjustment of their position and number according to actual needs.

[0033] Preferred, such as Figure 4 , Figure 6 As shown, the top surface of the front end of the guide rod 5 has a sloping structure. The guide rod 5 is provided with an elastic element 51. The extension and retraction direction of the elastic element 51 is consistent with the length direction of the slide rail 1. When the elastic element 51 is in its natural state, the sloping surface of the front end of the guide rod 5 is located inside the guide tube 4. When the semiconductor enters the guide tube 4, its longest pin is located between the two guide rods 5. The above structural design can ensure that the posture during the adjustment is maintained during the pressing process, and the longest pin still faces the rear end of the slide rail 1, thereby ensuring the accuracy of the insertion position. In addition, after the semiconductor enters the guide tube 4, it will be supported and limited by the sloping structure to prevent the semiconductor from falling automatically. During insertion, the push plate 41 pushes the semiconductor down. During the descent, the lower edge of the cylindrical plastic encapsulation of the semiconductor will push the guide rod 5 to the rear end through the sloping structure, so that the semiconductor can be pushed down smoothly. The elastic element 51 will adapt to the position change of the guide rod 5 through elastic deformation. After the push plate 41 rises, the guide rod 5 will automatically move forward under the action of the elastic element 51, so that the sloping structure re-enters the guide tube 4. In a specific embodiment, the elastic element 51 can be designed as a cylindrical spring structure, with one end fixedly installed on the outer wall of the guide tube 4 and the other end connected to the lower end of the guide rod 5, and the length direction of the elastic element 51 is parallel to the guide rod 5. As another option, such as... Figure 4As shown, a strip-shaped hole is provided on the guide rod 5, and at least two screws are used to pass through the strip-shaped hole to connect the guide rod 5 to the guide tube 4. The elastic element 51 is designed as a cylindrical spring and is set in the strip-shaped hole, with the elastic element positioned between the front end of the guide rod 5 and the screw.

[0034] Preferred, such as Figure 5 , Figure 6 As shown, when the lower edge of the cylindrical plastic package of the semiconductor contacts the inclined structure, the longest pin or all pins protrude from the lower end of the guide tube 4. During insertion, the bottom surface of the guide tube 4 abuts against the circuit board to ensure that the pins are aligned with the sockets on the circuit board in advance during insertion.

[0035] Preferably, when the insertion is completed, the side of the push plate 41 abuts against the front end of the guide rod 5 to prevent the push plate 41 from moving below the guide rod 5 and affecting the smooth rise of the push plate 41. In addition, this state makes the rear end of the guide rod 5 move closer to the guide plate 3, which is more conducive to the semiconductor pins behind entering the gap between the guide rods 5.

[0036] The above description is merely a preferred embodiment of the present invention and is not intended to be the only or limiting of the invention. Those skilled in the art should understand that various changes or equivalent substitutions made to the present invention without departing from its scope are all within the protection scope of the present invention.

Claims

1. A semiconductor insertion device, characterized in that, include: A pair of parallel slide rails (1) on a horizontal plane are used to transport semiconductors. The slide rails (1) have a spacing between them to accommodate semiconductor pins, and the semiconductors can rotate about their own axes on the slide rails (1). The pusher device (2) is located between the ends of the two slide rails (1) and is used to push semiconductors to the front end of the slide rails (1); A guide plate (3) has a rotating shaft (31) parallel to its bottom edge. A counterweight (32) is provided at the bottom of the rotating shaft (31). The rotating shaft (31) is perpendicular to the middle section of the two slide rails (1). The guide plate (3) swings around the rotating shaft (31). In its natural state, the guide plate (3) is vertical. At this time, the top surface of the guide plate (3) is higher than the bottom of the longest pin of the semiconductor and lower than the bottom of the other pins. The side of the guide plate (3) facing the end of the slide rail (1) has an arc groove (301). The axis of the arc groove (301) is perpendicular to the rotating shaft (31) and is located in the middle of the two slide rails (1). The width of the arc groove (301) is greater than or equal to the interval between the slide rails (1). The guide tube (4) is in a vertical position and has a through hole (401) on its side wall for passing semiconductors discharged from the front end of the slide rail (1). Inside the guide tube (4) is a push plate (41) that moves vertically to push the semiconductors into the guide tube (4) for insertion.

2. The semiconductor insertion device according to claim 1, characterized in that, The slide rail (1) is a smooth rod structure, and a top plate (11) is provided above the corresponding guide plate (3) installation position.

3. A semiconductor insertion device according to claim 1, characterized in that, The radius of the arc groove (301) is equal to the distance between the outer side of the pin and the axis of the semiconductor cylindrical molding compound.

4. A semiconductor insertion device according to claim 1, characterized in that, The lower end of the arc groove (301) is provided with an arc protrusion (33), and the guide plate (3) is provided with a V-shaped groove (302) above the arc protrusion (33).

5. A semiconductor insertion device according to claim 1, characterized in that, At least two guide rods (5) parallel to the slide rails (1) are provided below the front section of the two slide rails (1). There is a gap between the adjacent guide rods (5) for the pin to pass through, and one of the gaps is for the longest pin to pass through. The end of the guide rod (5) extends into the through hole (401). When the longest pin is separated from the guide plate (3), the pin opposite to or adjacent to the longest pin has been inserted into the gap between the adjacent guide rods (5).

6. A semiconductor insertion device according to claim 5, characterized in that, The top surface of the front end of the guide rod (5) has a sloping structure. The guide rod (5) is provided with an elastic element (51). The extension and retraction direction of the elastic element (51) is consistent with the length direction of the slide rail (1). When the elastic element (51) is in its natural state, the sloping surface of the front end of the guide rod (5) is located inside the guide tube (4). When the semiconductor enters the guide tube (4), its longest pin is located between the two guide rods (5).

7. A semiconductor insertion device according to claim 6, characterized in that, When the lower edge of the cylindrical plastic package of the semiconductor contacts the inclined structure, the longest pin or all pins protrude from the lower end of the guide tube (4), and the bottom surface of the guide tube (4) abuts against the circuit board during insertion.

8. A semiconductor insertion device according to claim 6 or 7, characterized in that, When the plug is completed, the side of the push plate (41) abuts against the front end of the guide rod (5).

9. A semiconductor insertion device according to claim 1, characterized in that, The counterweight (32) is bolted to the rotating shaft (31).

Images