Calibration device and calibration method of wafer compression ring lifting mechanism
By designing calibration devices for ring one and ring two, the height and level of the wafer clamping ring lifting mechanism were simultaneously calibrated, solving the problems of inaccurate calibration and equipment interference in the existing technology, improving calibration accuracy and protecting the stage coating.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-03-13
AI Technical Summary
In the existing technology, the height and level calibration of the wafer clamping ring lifting mechanism cannot be performed simultaneously, and the measurement process will damage the anti-oxidation coating of the stage and the wafer clamping ring, resulting in inaccurate calibration and equipment interference.
A calibration device comprising ring one and ring two was designed. Ring two is equipped with a height gauge. The height and level are simultaneously calibrated by synchronously moving ring one and ring two. A Teflon protective layer is used to avoid damage to the stage. Ring two is fitted with ring one with a clearance fit to facilitate movement.
It achieves simultaneous calibration of height and level, avoids damage to the stage coating, improves calibration accuracy, and prevents equipment interference.
Smart Images
Figure CN121666006A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of semiconductor equipment etching technology, and specifically designs a calibration device and calibration method for a wafer clamping ring lifting mechanism. Background Technology
[0002] In metal etching and deep silicon etching processes, the wafer retainer ring (WECR) plays a crucial role in protecting the wafer edges from etching. Specifically, since the wafer edges are uncoated, etching them would cause damage. The WECR effectively moves to the required position to cover the wafer edges, thus protecting them. The actual horizontal and height positions of the lifting mechanism used to lift the WECR must match the expected values. Inconsistencies will cause interference with the robotic arm, leading to WECR fragmentation or system malfunction, necessitating calibration before its practical application.
[0003] In existing technology, the WECR is installed after the lifting mechanism, and the rising position (height of the rise) and falling position (height of the fall) of the lifting mechanism are measured with a ruler. A common level is placed on the wafer retainer ring 4 to observe whether the wafer retainer ring 4 is level. This has the following drawbacks: 1. When measuring height with a ruler, the lower end of the ruler abuts against and contacts the upper surface of the stage (lower electrode), thus damaging the anti-oxidation coating on the upper surface of the stage 5; 2. Height measurement and levelness measurement can only be performed step by step, meaning height calibration and levelness calibration cannot be combined into one simultaneous calibration; 3. The level causes damage to the wafer retainer ring 4 (ceramic ring) during placement. Summary of the Invention
[0004] The purpose of this invention is to provide a calibration device and method for a wafer clamping ring lifting mechanism, capable of simultaneously calibrating both levelness and height. The technical solution adopted is as follows: A calibration device for a wafer clamping ring lifting mechanism, comprising: Ring 1 has the same structure as wafer clamping ring 4; And ring 2, which is set on the upper surface of ring 1, and its outer diameter is smaller than that of ring 1. At least 3 height gauges 3 are fitted on it. The lower end of the height gauge 3 is positioned facing the platform 5; When ring 1 is connected to the output end of wafer pressing ring lifting mechanism 6, the lower end of height gauge 3 abuts against platform 5; During the movement of the wafer pressing ring lifting mechanism 6, the second ring 2 can move up and down along the height gauge 3.
[0005] Preferably, the height gauge 3 is fitted with the ring 2 with a clearance and is an integrally formed structure, which includes a limiting block, an upper section and a lower section connected in sequence; The upper section is provided with scale lines, and the lower section abuts against and is perpendicular to the platform 5.
[0006] Preferably, the lower end of the altimeter 3 is provided with a protective layer.
[0007] Preferably, the outer edge of ring 2 is embedded in the inner edge of ring 1.
[0008] Preferably, the ring 1 is an aluminum ring or an iron ring, and its weight is the same as that of the wafer clamping ring 4.
[0009] Preferably, the second ring 2 is a non-metallic component.
[0010] A calibration method for a wafer clamping ring lifting mechanism includes the following steps: Step 1: Position the wafer clamping ring lifting mechanism 6 at the origin. Step 2: The three wafer clamping ring lifting mechanisms 6 rise synchronously to lift ring 1 upwards; When the travel of the wafer ring lifting mechanism 6 reaches the height value HUP, the wafer ring lifting mechanism 6 stops rising; Step 3: Read the values from the three altimeters 3 and determine whether the three values are the same and whether they are all equal to the altitude value HUP.
[0011] 8. The calibration method for the wafer clamping ring lifting mechanism according to claim 7, characterized in that it further includes the following steps: Step A: Position the wafer clamping ring lifting mechanism 6 at the origin. Step B: The three wafer clamping ring lifting mechanisms 6 descend and rise synchronously; When the travel of the wafer ring lifting mechanism 6 reaches the height value HDOWN, the wafer ring lifting mechanism 6 stops descending; Step C: Read the values from the three altimeters 3 and determine whether the three values are the same and equal to the given height value HHDOWN.
[0012] Compared with the prior art, the advantages of the present invention are: 1. It will not damage the anti-oxidation coating on the inner bottom surface of the stage.
[0013] 2. No manual step-by-step calibration of level and height is required; level and height can be calibrated simultaneously.
[0014] 3. High calibration accuracy. Attached Figure Description
[0015] Figure 1 This diagram illustrates the relative positions of the wafer clamping ring, the wafer clamping ring lifting mechanism, and the stage in the prior art. Figure 2A diagram showing the state of the wafer retainer ring after replacing it with the calibration device for the wafer retainer ring lifting mechanism; Figure 3 This is a three-dimensional diagram of ring two.
[0016] Among them, 1-Ring 1, 2-Ring 2, 3-Height gauge, 4-Wafer clamping ring, 5-Stage, 6-Wafer clamping ring lifting mechanism, 7-Cover ring. Detailed Implementation
[0017] The calibration device and calibration method of the wafer clamping ring lifting mechanism of the present invention will be described in more detail below with reference to the schematic diagrams, which illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art can modify the present invention described herein while still achieving the advantageous effects of the present invention. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the present invention.
[0018] like Figure 1 As shown, a wafer is placed on the stage 5, and a wafer retainer ring 4 covers the edge of the wafer. A cover ring 7 surrounds the stage 5. The three wafer retainer ring lifting mechanisms 6 move up and down synchronously under the drive of the moving module.
[0019] like Figures 2-3 As shown, a calibration device for a wafer clamping ring lifting mechanism includes: Ring 1, Ring 2, and three height gauges 3.
[0020] Ring 1 has the same structure as wafer clamping ring 4. Ring 1 is an aluminum ring or an iron ring, and its weight is the same as that of wafer clamping ring 4.
[0021] That is, the 1:1 reduction wafer pressing ring 4, the difference between the first ring and the wafer pressing ring 4 lies in the material.
[0022] Ring 2, which is located on the upper surface of Ring 1, has an outer diameter smaller than that of Ring 1, and is equipped with 3 height gauges 3. The outer edge of ring 2 is embedded in the inner edge of ring 1.
[0023] In other embodiments, ring 2 can also be placed directly on the upper surface of ring 1. In this case, the outer diameter of ring 2 is greater than the inner diameter of ring 1.
[0024] The material of Huan 2 is Teflon.
[0025] Among them, the altimeter 3 is positioned with its lower end facing the platform 5.
[0026] like Figure 3 As shown, the upper section of the height gauge 3 is fitted with the hole on the second ring 2 to ensure that the second ring 2 can move up and down along the height gauge 3 while the height gauge 3 remains stationary during the up and down movement of the wafer pressing ring lifting mechanism 6.
[0027] The lower end of the altimeter 3 is equipped with a protective layer to prevent damage to the anti-oxidation coating on the upper surface of the stage 5. The protective layer is made of Teflon material.
[0028] The height gauge 3 is made of aluminum and fits with the ring 2 with a clearance. It is an integrally formed structure and includes a limiting block, an upper section and a lower section connected in sequence.
[0029] The upper section has scale lines, and the lower section is in contact with the platform 5 and perpendicular to the platform 5.
[0030] To facilitate reading, when the wafer pressure ring lifting mechanism 6 is at the origin position, the upper section of the height gauge 3 extends into ring 2 both upwards and downwards.
[0031] The lower end of the section faces the platform 5, which is the lower end of the altimeter 3.
[0032] When ring 1 is connected to the output end of wafer pressing ring lifting mechanism 6, the lower end of height gauge 3 abuts (contacts) with stage 5.
[0033] In particular, to facilitate quick reading of altitude values later, all three altimeters are identical, with their tops aligned.
[0034] The connection method between Ring 1 and the wafer pressing ring lifting mechanism 6, as well as the wafer pressing ring lifting mechanism 6, are both existing technologies.
[0035] A calibration method for a wafer clamping ring lifting mechanism includes the step of simultaneously calibrating the lifting height and levelness: Step 1: Position the wafer clamping ring lifting mechanism 6 at the origin.
[0036] Specifically: The PLC drives the wafer pressure ring lifting mechanism 6 to the origin defined by the PLC.
[0037] Step 2: The three wafer clamping ring lifting mechanisms 6 rise synchronously to lift ring 1 upwards; When the travel of the wafer ring lifting mechanism 6 reaches the height value HUP set by the PLC, the PLC considers that the wafer ring lifting mechanism 6 has reached the rising position, and then the PLC controls the wafer ring lifting mechanism 6 to stop rising.
[0038] During the rising process of the wafer clamping ring lifting mechanism 6, the lower section of the height gauge 3 continuously rises and the lower end of the height gauge 3 is always in contact with the stage 5.
[0039] Step 3: Observe the changes in the position of the scale lines to read the values of the three altimeters 3, and determine whether the three values are the same and whether they are all equal to the altitude value HUP.
[0040] The steps of PLC driving the wafer pressing ring lifting mechanism 6 to rise and fall, and PLC controlling the wafer pressing ring lifting mechanism 6 to stop, are all existing technologies.
[0041] A method for calibrating a wafer clamping ring lifting mechanism further includes the step of simultaneously calibrating the descent height and levelness: Step A: Position the wafer clamping ring lifting mechanism 6 at the origin. Specifically: The PLC drives the wafer pressure ring lifting mechanism 6 to the origin defined by the PLC.
[0042] Step B: The three wafer clamping ring lifting mechanisms 6 descend and rise synchronously; When the travel of the wafer ring lifting mechanism 6 reaches the height value HDOWN set by the PLC, the wafer ring lifting mechanism 6 stops descending.
[0043] During the descent of the wafer clamping ring lifting mechanism 6, the lower end of the height gauge 3 remains in contact with the stage 5.
[0044] Step C: Observe the changes in the position of the scale lines to read the values of the three altimeters 3, and determine whether the three values are the same and whether they are all equal to the altitude value HHDOWN.
[0045] In addition, in step B, the judgment condition can be: inserting a feeler gauge with a thickness of 1mm between ring 1 and cover ring 7. If the feeler gauge with a thickness of 1mm can be inserted, the wafer pressing ring lifting mechanism 6 stops descending.
[0046] In this embodiment, the origin in steps 1 and 3, the height value HUP in step 3, and the height value HDOWN in step B are all retained. Figure 1 The values used during calibration (origin, ascent altitude, descent altitude).
[0047] The above are merely preferred embodiments of the present invention and do not constitute any limitation on the present invention. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and content disclosed in the present invention without departing from the scope of the present invention shall be deemed to have remained within the protection scope of the present invention.
Claims
1. A calibration device for a wafer clamping ring lifting mechanism, characterized in that, include: Ring 1 (1) has the same structure as the wafer clamping ring (4); And ring two (2), which is set on the upper surface of ring one (1), its outer diameter is smaller than the outer diameter of ring one (1), and at least three height gauges (3) are fitted on it. The lower end of the height gauge (3) is positioned facing the platform (5); When ring 1 (1) is connected to the output end of the wafer pressing ring lifting mechanism (6), the lower end of the height gauge (3) abuts against the platform (5); During the movement of the wafer pressing ring lifting mechanism (6), the second ring (2) can move up and down along the height gauge (3).
2. The calibration device for the wafer clamping ring lifting mechanism according to claim 1, characterized in that, The height gauge (3) is fitted with the ring (2) with a clearance. It is an integrally formed structure, which includes a limiting block, an upper section and a lower section connected in sequence. The upper section is provided with scale lines, and the lower section abuts against and is perpendicular to the platform (5).
3. The calibration device for the wafer clamping ring lifting mechanism according to claim 1, characterized in that, The lower end of the altimeter (3) is provided with a protective layer.
4. The calibration device for the wafer clamping ring lifting mechanism according to claim 1, characterized in that, The outer edge of ring two (2) is embedded in the inner edge of ring one (1).
5. The calibration device for the wafer clamping ring lifting mechanism according to claim 1, characterized in that, The ring (1) is an aluminum ring or an iron ring, and its weight is the same as that of the wafer clamping ring (4).
6. The calibration device for the wafer clamping ring lifting mechanism according to claim 1, characterized in that, The second ring (2) is a non-metallic component.
7. A calibration method for a wafer clamping ring lifting mechanism, characterized in that, Includes the following steps: Step 1: Place the wafer clamping ring lifting mechanism (6) at the origin; Step 2: The three wafer pressing ring lifting mechanisms (6) rise synchronously to lift ring 1 (1) upwards; When the travel of the wafer ring lifting mechanism (6) reaches the height value HUP, the wafer ring lifting mechanism (6) stops rising; Step 3: Read the values of the three altimeters (3) and determine whether the three values are the same and whether they are all equal to the height value HUP.
8. The calibration method for the wafer clamping ring lifting mechanism according to claim 7, characterized in that, Further steps include: Step A: Position the wafer clamping ring lifting mechanism (6) at the origin; Step B: The three wafer clamping ring lifting mechanisms (6) descend and rise synchronously; When the travel of the wafer ring lifting mechanism (6) reaches the height value HDOWN, the wafer ring lifting mechanism (6) stops descending; Step C: Read the values of the three altimeters (3) and determine whether the three values are the same and equal to the height value HHDOWN.