Wafer ring clamping mechanism and wafer ring manipulator

Abstract

The invention provides a wafer ring clamping mechanism and a wafer ring manipulator, and belongs to the field of wafer clamping, and the wafer ring clamping mechanism specifically comprises a mounting part which is connected with a moving end of the manipulator; the supporting plate is connected with the mounting part, and a supporting table which supports the bottom surface of the wafer ring and is attached to the edge of the wafer ring is formed on one side, far away from the mounting part, of the supporting plate; the clamping jaw is mounted above the supporting plate through a rotating shaft and is matched with the bearing table to clamp the periphery of the wafer ring, and the mounting part comprises a shell; an elastic component; and the driving assembly is fixedly connected with the clamping jaw through the opening and drives the clamping jaw to rotate, under the action of the elastic assembly and the driving assembly, the clamping jaw rotates around the rotating shaft, opening and closing between the clamping jaw and the bearing table are adjusted, clamping of the wafer ring is achieved, and the size of a clamping area of the clamping jaw is a public area of the multi-size wafer ring. According to the processing scheme, the rotating shaft of the clamping jaw is located above the clamping face, the lower space is not occupied, space is released for other butt joint process positions, and the design difficulty of the butt joint station is reduced.

Description

Technical Field

[0001] This application relates to the semiconductor field, and in particular to a wafer ring clamping mechanism and a wafer ring robot. Background Technology

[0002] In advanced packaging, the frame ring clamping and fixing mechanism is typically mounted on a wafer robotic arm. This mechanism holds the frame ring in place, allowing the robotic arm to transfer wafers between different process positions. For example... Figure 7 As shown, in the existing frame ring clamping mechanism, the main jaw is connected to a clamping assembly, which includes a drive assembly 51 and a chuck 52. The drive assembly 51 drives the chuck 52 to loosen or clamp the top surface of the wafer ring. Figure 7 As shown in the solid-line box, the spring and fixed spring structures are located below the grippers, occupying lower space. Furthermore, the rotation axis of the chuck 52 not only does not exceed the clamping surface but also occupies space below the clamping surface (circled in the diagram). This forces other process stations to avoid it while fulfilling their own process functions, increasing the design complexity of each processing mechanism at that station and raising processing costs. In some cases, due to limitations in the processing mechanism's own capabilities, it may be impossible for the processing mechanism to avoid it. In such situations, manual transfer of the wafer ring is required at that process station, which not only reduces wafer ring transfer efficiency but may also contaminate the wafer during transfer, affecting the yield of subsequent processes.

[0003] Furthermore, existing frame ring clamping mechanisms are generally incompatible. If a dedicated 6-inch clamping mechanism is used to handle an 8-inch frame ring, the frame ring will tilt severely. This may not only cause the wafer to fall off the wafer ring and be damaged, but also cause deformation of the wafer mounting ring, which in turn may damage the wafer during subsequent wafer fixation.

[0004] In view of this, it is necessary to improve the existing wafer ring clamping mechanism to solve the above problems. Summary of the Invention

[0005] Therefore, in order to overcome the shortcomings of the prior art, the present invention provides a wafer ring clamping mechanism and a wafer ring robot that are adaptable to multiple sizes of wafer rings and do not require occupying the space under the wafer clamping surface.

[0006] To achieve the above objectives, the present invention provides a wafer ring clamping mechanism that is adaptable to wafer rings of multiple sizes, comprising: a mounting part connected to the moving end of a robotic arm; a support plate connected to the mounting part, and forming a support platform on the side away from the mounting part to support the bottom surface of the wafer ring and fit against the edge of the wafer ring; and a gripper mounted above the support plate via a rotating shaft, which cooperates with the support platform to clamp the periphery of the wafer ring. The mounting part includes: a housing comprising a base plate and a protective cover, the protective cover having an opening on the side near the support plate; an elastic component fixed at one end to the rotating shaft and at the other end to the base plate; and a driving component disposed inside the housing and fixed to the base plate, fixedly connected to the gripper through the opening, driving the gripper to rotate. Under the action of the elastic component and the driving component, the gripper rotates around the rotating shaft above the clamping surface, adjusting the opening and closing between the gripper and the support platform to achieve clamping of the wafer ring. The clamping area of ​​the gripper is a common area for wafer rings of multiple sizes.

[0007] In one embodiment, the drive assembly includes a drive cylinder and a ramming block. The ramming block, under the action of the drive shaft of the drive cylinder, pushes the gripper to clamp the upper surface of the wafer ring, thereby clamping the wafer ring.

[0008] In one embodiment, the mounting base further includes: a first detection plate disposed on one side of the front end of the driving cylinder and moving with the drive shaft of the driving cylinder; a first sensor disposed on the base plate for detecting the position of the first detection plate to provide feedback on whether the gripper and the support platform are clamping the wafer ring; and a second sensor disposed on the base plate for detecting the presence of the wafer ring.

[0009] In one embodiment, the mounting portion further includes: The second detection plate is disposed on the other side of the front end of the drive cylinder and moves with the drive shaft of the drive cylinder. The third sensor, triggered by the second detection chip, is used to detect whether the wafer ring is clamped.

[0010] In one embodiment, the end face of the impact block that contacts the gripper is set as a hemispherical surface.

[0011] In one embodiment, the mounting portion further includes an adjusting screw disposed between the drive assembly and the gripper and close to the gripper, for adjusting the maximum opening angle of the gripper relative to the pallet.

[0012] In one embodiment, at least two positioning pins are symmetrically arranged on the support platform along the center line of the mounting base. The positioning pins are used to correct the position of the wafer ring with positioning notches on the support platform.

[0013] In one embodiment, the resilient component includes: The first fixing post secures the support plate and the base plate; The second fixing post is fixed on the rotating shaft; A tension spring is fixedly connected to the support plate and the second fixing post. The tension spring pulls the rotating shaft, causing the gripper to rotate around the rotating shaft to release the wafer ring.

[0014] In one embodiment, the support platform is also provided with several weight-reducing holes.

[0015] A wafer ring manipulator includes: a robotic arm having a degree of freedom of movement; and a wafer ring clamping mechanism disposed at the end of the robotic arm for clamping a wafer ring, wherein the wafer ring clamping mechanism is the wafer ring clamping mechanism described above.

[0016] Compared with existing technologies, the advantages of this invention are as follows: the grippers are mounted above the tray via a rotating shaft, cooperating with the support platform to clamp the periphery of the wafer ring. In this case, the rotating shaft is above the clamping surface, eliminating the need to occupy space below the clamping surface, thus freeing up space for other docking process positions and reducing the design difficulty of the docking stations. Under the action of the elastic and driving components, the grippers rotate around the rotating shaft to adjust the opening and closing between the grippers and the support platform, making it suitable for clamping wafer rings in hoppers with different layer spacings. Furthermore, by setting the clamping area to be a common area for multi-size wafer rings, the entire wafer ring clamping mechanism can adapt to multi-size wafer rings, preventing tilting even when clamping wafer rings of different sizes, reducing costs and saving changeover preparation time. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the wafer ring clamping mechanism in an embodiment of the present invention; Figure 2 This is a schematic diagram of a wafer ring clamping mechanism clamping wafer rings of different sizes in an embodiment of the present invention; Figure 3This is a schematic diagram of the mounting section of the wafer ring clamping mechanism after the protective cover has been removed in an embodiment of the present invention; Figure 4 This is a top view of the mounting portion of the wafer ring clamping mechanism after the protective cover has been removed in an embodiment of the present invention; Figure 5 This is a side view of the mounting portion of the wafer ring clamping mechanism after the protective cover has been removed in an embodiment of the present invention; Figure 6 This is a side view of the wafer ring clamping mechanism and the processing mechanism cooperating in an embodiment of the present invention; Figure 7 This is a side view of the wafer ring clamping mechanism in the background art. Detailed Implementation

[0019] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0020] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] It should be noted that the following description covers various aspects of embodiments within the scope of protection of this invention. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using other structures and / or functionalities besides one or more of the aspects set forth herein.

[0022] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0023] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0024] A wafer ring is an auxiliary tool used in semiconductor manufacturing, primarily for supporting, fixing, and protecting wafers. A wafer ring is typically a ring-shaped structure with an inner diameter that matches the wafer's diameter, allowing it to fit snugly around the wafer's edge to provide fixation and support.

[0025] This application provides a wafer ring manipulator, including a robotic arm and a wafer ring clamping mechanism 100.

[0026] A robotic arm possesses multiple degrees of freedom (DOF). It is responsible for moving the wafer frame between different positions. Robotic arms typically have multiple DDFs (such as 3-axis, 4-axis, or 6-axis) to achieve complex motion trajectories and meet various process requirements. A robotic arm may include drive motors and DDF adjustment mechanisms. The DDF adjustment mechanism is used to achieve multiple DDFs, for example, linear motion along the X, Y, and Z axes.

[0027] A wafer ring gripping mechanism 100 is located at the end of the robotic arm for gripping or releasing wafer rings. During gripping, the mechanism employs a combination of force control and position control, providing feedback on the gripping status via indicator lights. Sensor signals from the wafer ring gripping mechanism (such as force sensors and position sensors) are transmitted to the robotic arm's control system via electrical circuitry, enabling real-time monitoring and feedback. Figure 1 As shown, the wafer ring clamping mechanism has an interface 20 on the protective cover 16. The robotic arm is installed via this interface 20 using bolts, flanges, or other fixing methods. Interface 20 is a standardized interface, ensuring reliable and universal connection.

[0028] This application also provides a multi-axis motion platform, including a motion platform body and a wafer ring clamping mechanism. The motion platform body and the wafer ring clamping mechanism are connected by a mechanical structure. The wafer ring clamping mechanism is installed at the end of the motion platform body and is fixed by bolts, flanges, or other methods. The motion platform body and the wafer ring clamping mechanism are connected by electrical wiring to transmit control signals. The motion platform's control system can control the actions of the wafer ring clamping mechanism, such as clamping and releasing. The motion platform body moves to a designated position according to a detection program, and the wafer ring clamping mechanism clamps or releases the wafer ring at the appropriate position.

[0029] The motion platform body has multiple degrees of freedom. A multi-axis motion platform can possess multiple degrees of freedom (such as linear motion along the X, Y, and Z axes and rotational motion along the T axis), enabling precise positioning and attitude adjustment of the wafer in space. The motion platform body employs a high-precision drive system, precision guide rails, and a high-resolution feedback system, achieving micron-level or even higher positioning accuracy. The drive system can be a linear motor. The precision guide rails can be air-bearing guide rails. The feedback system can be a linear encoder.

[0030] The wafer ring clamping mechanism is located at the end of the motion platform body and is used to clamp the wafer ring.

[0031] In one embodiment, the wafer ring clamping mechanism can be applied not only to advanced packaging but also to the clamping and fixing of products with similar structures.

[0032] like Figure 2 As shown, the wafer ring clamping mechanism provided in this embodiment can simultaneously accommodate wafer rings of multiple sizes. For example, wafer ring 17 is a 6-inch wafer ring, and wafer ring 18 is an 8-inch wafer ring. Wafer rings of different sizes can accommodate wafers of corresponding sizes. Figure 3 As shown, the wafer ring clamping mechanism 100 includes a mounting part, a tray 9, and a clamp 8.

[0033] The tray 9 is connected to the mounting part, and the side away from the mounting part forms a support platform that supports the bottom surface of the wafer ring and fits against the edge of the wafer ring.

[0034] The gripper 8 is mounted above the tray 9 via the pivot 7 and works with the support platform to clamp the periphery of the wafer ring.

[0035] The mounting section connects to the moving end of the robotic arm. The mounting section includes a housing, elastic components, and drive components. It also includes other components that are electrically in communication with the robotic arm, thereby enabling control of the wafer ring's gripping or release.

[0036] The housing protects the standard components, wires, and air pipes within the mechanism. The housing includes a base plate 19 and a protective cover 16. The protective cover 16 has an opening on the side near the support plate 9.

[0037] One end of the elastic component is fixed to the rotating shaft 7, and the other end is fixed to the base plate 19. The elastic component can consist of only the tension spring 5, or it can consist of a tension spring and a spring fixing post.

[0038] The drive assembly is located inside the housing and fixed to the base plate 19. It is fixedly connected to the gripper 8 through an opening and drives the gripper 8 to rotate. The drive assembly can be a drive cylinder 1.

[0039] Under the action of the elastic component and the drive component, the gripper rotates around the pivot above the clamping surface, adjusting the opening and closing between the gripper and the support stage to achieve clamping of the wafer ring.

[0040] In one embodiment, the clamping area of ​​the gripper 8 is the common area of ​​the multi-size wafer rings. For example... Figure 1 As shown, the gripper 8 includes two legs 81. The legs 81 are used to achieve multi-point clamping of the wafer ring. Figure 1 In this design, the legs 81 provide long-distance clamping to the two clamping positions on the wafer ring, thereby making the entire mechanism more stable in clamping the wafer ring. In some embodiments, the gripper 8 may also include multiple legs 81 to further achieve multi-point clamping of the wafer ring. In one embodiment, the legs 81 may be located at the two ends of a common area of ​​multi-sized wafer rings, thereby ensuring stable clamping of the wafer ring within a limited space. Figure 5 As shown, the gripper 8 is mounted above the tray 9, completely freeing up the space below the tray 9. The support leg 81 extends from the gripper body 82 towards the edge of the tray 9.

[0041] For example, when the wafer ring clamping mechanism is compatible with both 6-inch and 8-inch wafer rings, the clamping position of jaw 8 is located in the common area of ​​the 6 / 8-inch frame ring, thus ensuring compatibility with the clamping function of the 6 / 8-inch frame ring. When other sizes of wafer rings are present, the clamping area of ​​jaw 8 is the common area of ​​the other sizes of wafer rings.

[0042] like Figure 6 As shown, the 6-inch wafer ring 17 is held by the wafer ring clamping mechanism 100 and then transported to the processing station (located directly above the docking stage 200). It can be seen from the figure that the gap between the docking stage 200 and the wafer ring clamping mechanism 100 is small, and there is no gap under either the support plate 9 or the base plate 19. Figure 7 The redundant space for the rotation of structures such as the rotating shaft within the square frame, once the docking process table 200 is designed in advance or the factory has purchased the docking process table 200 beforehand, then... Figure 7 The existing wafer ring clamping mechanism is limited by the rotation angle of the rotating shaft, making it unable to clamp the wafer. This necessitates switching from mechanical to manual transfer, reducing wafer ring transfer efficiency and potentially contaminating the wafer during transport, impacting the yield of subsequent processes. In contrast, the clamps and rotating shaft of this application are all located above the clamping surface, eliminating the need to occupy space below the clamping surface. This frees up space for the docking process stage 200, reduces the design complexity of the docking station, and eliminates the need for additional adjustments to the docking process stage 200.

[0043] In the aforementioned structure, the grippers are mounted above the support plate via a rotating shaft, cooperating with the support platform to clamp the periphery of the wafer ring. With the rotating shaft above the clamping surface, no additional space is required below the clamping surface, freeing up space for other docking process positions and reducing the design complexity of these positions. Under the action of the elastic and drive components, the grippers rotate around the rotating shaft to adjust the opening and closing between the grippers and the support platform, making it suitable for clamping wafer rings in hoppers with different layer pitches. Furthermore, by designing the clamping area as a common area for multi-sized wafer rings, the entire wafer ring clamping mechanism can accommodate wafer rings of various sizes without tilting, reducing costs and saving changeover preparation time.

[0044] In one embodiment, the drive assembly includes a drive cylinder 1 and a ramming block 13.

[0045] Under the action of the drive shaft of the drive cylinder 1, the impact block 13 pushes the gripper 8 so that the gripper clamps the upper surface of the wafer ring 17, thereby clamping the wafer ring 17.

[0046] The drive shaft of the drive cylinder 1 is a piston rod. The impact block 13 is fixed to the end of the piston rod away from the main body of the drive cylinder 1. When the support platform 9 is not holding the wafer ring 17, the piston rod of the drive cylinder 1 is in a retracted state, and the impact block 13 is not in contact with the gripper 8. At this time, the gripper is lifted upward by the elastic force of the tension spring 5 in the elastic component, so that the gripper 8 rotates relative to the support plate 9 about the pivot 7, thereby forming a space between the gripper 8 and the support platform 9 for the wafer ring 17 to be placed. When the wafer ring 17 is placed in the support platform, the piston rod of the drive cylinder 1 extends, and the impact block 13 fixed to the end of the piston rod extends towards the wafer ring, and then applies a pushing force to the gripper 8. The gripper 8 rotates around the pivot 7, and the tension spring 5 is also stretched by the pivot 7. The gripper 8 is pressed down to the upper surface of the wafer ring 17, thus achieving the gripping of the wafer ring 17.

[0047] like Figure 3 and Figure 4 As shown, in one embodiment, the mounting base further includes a first detection piece 4, a first sensor 3, and a second sensor 11.

[0048] The first detection plate 4 is set on one side of the front end of the drive cylinder and moves with the drive shaft of the drive cylinder.

[0049] The first sensor 3 is mounted on the base plate and is used to detect the position of the first detection piece to provide feedback on whether the grippers and support stage are holding the wafer ring.

[0050] The second sensor 11 is mounted on the base plate and is used to detect the presence of the wafer ring 17.

[0051] When cylinder 1 retracts, gripper 8 rotates in the opposite direction of clamping under the pull of tension spring 5 until adjusting screw 12 contacts support plate 9, at which point gripper 8 stops rotating and is in its maximum open state. However, cylinder 1 continues to retract, and when cylinder 1 retracts to its limit position, the first detection plate 4 triggers the first sensor 3. When the frame ring disengages from the mechanism, the second sensor reports no plate information. This indicates that the opening action of the mechanism has been completed and there is no frame ring.

[0052] In one embodiment, the mounting section further includes a second detection piece 15 and a third sensor 14.

[0053] The second detection plate 15 is set on the other side of the front end of the drive cylinder and moves with the drive shaft of the drive cylinder.

[0054] The third sensor 14, triggered by the second detection chip, is used to detect whether the wafer ring is clamped.

[0055] When cylinder 1 extends, the impact block 13 and the second detection plate 15, fixed on the cylinder guide rod, also move forward, pushing the gripper 8 to rotate around the rotating shaft 7 until the frame ring is pressed against the support plate 9. At this point, the gripper 8 stops rotating, and the frame ring is in a clamped state. The second sensor 11 detects the presence of the frame ring, and simultaneously, the second detection plate 15 moves to the position that triggers the third sensor 14. This indicates that the frame ring is present in the mechanism and the clamping action of the frame ring has been completed; otherwise, an alarm will be triggered indicating an abnormality.

[0056] The first sensor 3, the second sensor 11, and the third sensor 14 can be the same sensor or different sensors. The first sensor 3, the second sensor 11, and the third sensor 14 can be infrared sensors or other types of light sensors, such as visible light sensors, fiber optic sensors, photoelectric sensors, etc.

[0057] The first detection plate 4 and the second detection plate 15 are symmetrically arranged on both sides of the front end of the cylinder 1. The first detection plate 4 and the second detection plate 15 can be used to block the sensing areas of the first sensor 3, the second sensor 11, and the third sensor 14.

[0058] The above structure can sense whether the wafer ring has been successfully grasped or released, thereby avoiding false operations.

[0059] In one embodiment, such as Figure 4 As shown, the end face of the impact block 13 that contacts the gripper is set as a hemispherical surface. When the impact block 13 applies a pushing force to the gripper 8, it can effectively reduce the pressure exerted on the gripper 8, thereby preventing the gripper 8 from deforming.

[0060] In one embodiment, such as Figure 3As shown, the mounting part also includes an adjusting screw 12.

[0061] The adjusting screw 12 is located between the drive assembly and the gripper 8, and close to the gripper 8. By adjusting the height of the adjusting screw 12, the contact direction between the gripper 8 and its top can be adjusted, thereby adjusting the maximum opening angle of the gripper 8 relative to the pallet.

[0062] In one embodiment, such as Figure 4 As shown, at least two locating pins are symmetrically arranged on the support platform along the center line of the mounting base. The locating pins are used to correct the position of the wafer ring with locating notches on the support platform.

[0063] The frame ring is typically placed in a cassette with a relatively large gap, resulting in some offset and rotation within the cassette. When the wafer ring clamping mechanism removes the wafer ring 17 from the cassette, the wafer ring 17 contacts the tray and then adheres to the support platform 9. Positioning notches 171 and 172 on the wafer ring 17 respectively engage a positioning pin 10, thus positioning the wafer ring 17. At this point, both the wafer ring 17 and the support platform 9 are symmetrical along the centerline of the mounting base. Positioning notch 171 is located at the V-groove of the 6 / 8-inch frame ring, and positioning notch 172 is located at the straight edge of the frame ring and tangent to the straight edge. When the wafer ring clamping mechanism extends into the cassette to retrieve the wafer, the two positioning pins 10 horizontally correct the frame ring while preventing rotation. The positioning pin 10 works in conjunction with the positioning notches 171 and 172 to effectively position the wafer ring 17. The edge of the wafer ring 17 fits against the edge of the support platform 9, and the support platform 9 supports the wafer ring 17.

[0064] In addition, the notches on the wafer ring can also indicate the orientation of the wafer, helping automated equipment to keep the wafer orientation consistent during processing and avoid alignment errors.

[0065] In one embodiment, the elastic component includes a first fixing post 2, a second fixing post 6, and a tension spring 5.

[0066] The first fixing post 2 fixes the support plate 9 and the base plate 19.

[0067] The second fixed column 6 is fixed on the rotating shaft 7.

[0068] The tension spring 5 is fixedly connected to the support plate 9 and the second fixed post 6. The tension spring 5 pulls the rotating shaft 7, causing the gripper 8 to rotate around the rotating shaft 7 to release the wafer ring 17.

[0069] In the above structure, the fixed column can guide the movement of the tension spring, ensuring that the tension spring moves in a predetermined direction during the extension and contraction process, thereby better absorbing and buffering vibrations, ensuring that the entire device remains stable during operation, and avoiding damage to the wafer on the wafer ring.

[0070] In one embodiment, the support platform 9 is also provided with several weight-reducing holes. In order to improve the overall stability of the clamping device, the weight of the support platform 9 can be further controlled by opening several weight-reducing holes 42, thereby effectively reducing the load-bearing pressure of the mounting part and achieving the purpose of improving the overall stability of the clamping device.

[0071] In one embodiment, a weight-reducing groove is formed on the upper surface of the cylinder 1. The design of the weight-reducing groove effectively reduces the weight of the mounting part, thereby reducing the load-bearing pressure on the connection mounting part of the robot (not shown).

[0072] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

Claims

1. A wafer ring clamping mechanism, adaptable to wafer rings of multiple sizes, characterized in that, include: Mounting section, connecting the moving end of the robotic arm; A tray, connected to the mounting part, and forming a support platform on the side away from the mounting part to support the bottom surface of the wafer ring and fit against the edge of the wafer ring; The grippers, mounted above the tray via a pivot, cooperate with the support platform to clamp the periphery of the wafer ring. The mounting part includes: The housing includes a base plate and a protective cover, wherein the protective cover has an opening on the side near the support plate; The elastic component is fixed at one end to the rotating shaft and at the other end to the base plate; The drive assembly, disposed inside the housing and fixed to the base plate, is fixedly connected to the gripper through the opening and drives the gripper to rotate. Under the action of the elastic component and the driving component, the gripper rotates around the pivot above the clamping surface, adjusting the opening and closing between the gripper and the support platform to clamp the wafer ring. The elastic component includes: The first fixing post secures the support plate and the base plate; The second fixing post is fixed on the rotating shaft; A tension spring is fixedly connected to the support plate and the second fixing post. The tension spring pulls the rotating shaft, causing the gripper to rotate around the rotating shaft to release the wafer ring. The clamping area of ​​the gripper is the common area of ​​the multi-size wafer rings.

2. The wafer ring clamping mechanism according to claim 1, characterized in that, The drive assembly includes a drive cylinder and a ramming block. The impact block, under the action of the drive shaft of the drive cylinder, pushes the gripper to clamp the upper surface of the wafer ring, thereby clamping the wafer ring.

3. The wafer ring clamping mechanism according to claim 2, characterized in that, The mounting base also includes: The first detection plate is disposed on one side of the front end of the driving cylinder and moves with the driving shaft of the driving cylinder. A first sensor, mounted on the base plate, is used to detect the position of the first detection piece to provide feedback on whether the gripper and the support stage are holding the wafer ring. The second sensor, mounted on the base plate, is used to detect the presence of the wafer ring.

4. The wafer ring clamping mechanism according to claim 2, characterized in that, The mounting section further includes: The second detection plate is disposed on the other side of the front end of the drive cylinder and moves with the drive shaft of the drive cylinder. The third sensor, triggered by the second detection chip, is used to detect whether the wafer ring is clamped.

5. The wafer ring clamping mechanism according to claim 1, characterized in that, The end face of the impact block that contacts the gripper is set as a hemispherical surface.

6. The wafer ring clamping mechanism according to claim 1, characterized in that, The mounting section further includes: An adjusting screw, located between the drive assembly and the gripper and close to the gripper, is used to adjust the maximum opening angle of the gripper relative to the pallet.

7. The wafer ring clamping mechanism according to claim 1, characterized in that, At least two locating pins are symmetrically arranged on the support platform along the center line of the mounting base. The positioning pin is used to correct the position of the wafer ring with the positioning notch on the support platform.

8. The wafer ring clamping mechanism according to claim 1, characterized in that, The support platform is also provided with several weight-reducing holes.

9. A wafer ring robotic arm, characterized in that, include: A robotic arm has degrees of freedom of movement; A wafer ring clamping mechanism, located at the end of the robotic arm, is used to clamp the wafer ring. The wafer ring clamping mechanism is the wafer ring clamping mechanism according to any one of claims 1 to 8.

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