Warped wafer correction method

Abstract

The invention discloses a warped wafer correction method, and belongs to the technical field of semiconductors. According to the warped wafer correction device, a first abutting mechanism comprises first suction cup assemblies, the multiple first suction cup assemblies are arranged in an array mode, each first suction cup assembly comprises a first suction cup, the first suction cups are slidably connected to a rack in the first direction and right face a first plate face, and the multiple first suction cups are the same in moving range in the first direction; the first direction is perpendicular to the plate surface of the warped wafer; the second abutting mechanism is installed on the rack and used for abutting against the second plate face of the warped wafer, and the first abutting mechanism and the second abutting mechanism are oppositely arranged on the two sides of the warped wafer and can be close to or away from each other. According to the warped wafer correction method, by adopting the warped wafer correction device, the warped wafer is placed between the first abutting mechanism and the second abutting mechanism, the first abutting mechanism and the second abutting mechanism abut against the first plate face and the second plate face respectively, and therefore warpage of the warped wafer is corrected.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a method for correcting warped wafers. Background Technology

[0002] In advanced packaging, wafers typically need to be ground to ultra-thin thicknesses (e.g., below 20 μm) to achieve high-density integration. These ultra-thin wafers often warp due to mechanical stress and material properties, making them difficult to adsorb and transfer. Depending on the warp direction, the industry generally classifies them into two types: upward warping (often called "smiley face") and downward warping (often called "sad face"). In actual production lines, these two types of warped wafers often alternate, making it difficult for existing transfer equipment to achieve stable and reliable adsorption and transfer.

[0003] Currently, the common practice in the industry for dealing with warped wafers is to directly reject and scrap them. This is because whether the wafer warps upwards or downwards, it creates a gap between the wafer and the adsorption platform, leading to uneven adsorption forces, unstable transfer, and even wafer breakage. This not only reduces production yield but also increases manufacturing costs.

[0004] Therefore, effectively correcting wafer warpage to adapt to subsequent transport and process requirements, especially developing a universal correction solution capable of handling both "smiley face" and "crying face" warpages, has become a pressing technical challenge in this field. Currently, there is no warpage wafer correction method that balances efficiency, applicability, and reliability, and this problem continues to hinder the further development and yield improvement of ultra-thin wafer packaging technology. Summary of the Invention

[0005] The purpose of this application is to solve or at least alleviate some or all of the aforementioned problems. Therefore, the purpose of this application is to provide a method for correcting warped wafers that can correct both smile-shaped and frown-shaped warped wafers, and has strong versatility.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In a first aspect, a method for correcting a warped wafer is provided, comprising using a warped wafer correction device to correct a warped wafer, wherein the warped wafer includes opposing first and second surfaces, and the warped wafer correction device includes:

[0008] substrate;

[0009] An adsorption mechanism includes a first adsorption element and a second adsorption element. The number of first adsorption elements is multiple and the multiple first adsorption elements are arranged in an array on the substrate. Each first adsorption element is movably connected to the substrate in a vertical direction and can adsorb the first plate surface. The first adsorption element can drive the first plate surface to move upward. The second adsorption element is movably connected to the center position of the substrate in a vertical direction and can adsorb the first plate surface. The second adsorption element can drive the first plate surface to move upward.

[0010] A lifting mechanism is movably mounted on the base plate and is capable of supporting the edge of the second plate surface upwards.

[0011] The method for correcting warped wafers includes the following steps:

[0012] S1. Transfer the warped wafer to the underside of the substrate;

[0013] S2. Control the lifting mechanism to move relative to the substrate so that the lifting mechanism supports the edge of the second plate surface upward;

[0014] S3. Determine whether the warped wafer is a crying face warped wafer; if yes, proceed to S4; if no, proceed to S5.

[0015] S4. Control the lifting mechanism to move relative to the substrate so that the lifting mechanism lifts the second plate surface of the warped wafer upward until the first adsorption member straightens the warped wafer.

[0016] S5. Control the lifting mechanism to move relative to the substrate so that the lifting mechanism lifts the second plate surface of the warped wafer upward, the second adsorption member adsorbs the center position of the first plate surface and drives the warped wafer to move upward, and the first adsorption member corrects and flattens the warped wafer.

[0017] In some embodiments, S4 includes:

[0018] S41. Control the lifting mechanism to move relative to the substrate so that the lifting mechanism lifts the second plate surface of the warped wafer upward until the center position of the warped wafer is adsorbed by the first adsorption member.

[0019] S42. Continue to control the lifting mechanism to lift the second plate surface of the warped wafer upwards until all the first adsorption elements are adsorbed onto the first plate surface.

[0020] S43. Control the lifting mechanism to move relative to the substrate so that the lifting mechanism disengages from the warped wafer until the first adsorption member straightens and flattens the warped wafer.

[0021] In some embodiments, the adsorption mechanism further includes:

[0022] A locking component is provided in a one-to-one correspondence with the first adsorption element. The locking component includes a latch and a latch suction plate that can attract each other. The latch is fixedly disposed on the base plate and the latch suction plate is fixedly connected to the first adsorption element.

[0023] An elastic element is provided in a one-to-one correspondence with the first adsorption element. The upper end of the elastic element is connected to the buckle, and the lower end is connected to the first adsorption element. When the elastic element is compressed to a set degree, the buckle suction plate can be adsorbed by the buckle. The buckle is an electromagnetic buckle, and the suction plate is an electromagnetic buckle suction plate.

[0024] In S42, the current of each electromagnetic latch is gradually increased.

[0025] In some embodiments, S5 includes:

[0026] S51. Control the lifting mechanism to move relative to the substrate so that the lifting mechanism lifts the second surface of the warped wafer upward;

[0027] S52. After part of the first adsorption element adsorbs the first plate surface, continue to control the lifting mechanism to lift the second plate surface of the warped wafer upward;

[0028] S53. After the second adsorption element adsorbs the center position of the first plate surface, the second adsorption element is controlled to drive the warped wafer until the warped wafer is straightened and flattened. At this time, all the first adsorption elements are adsorbed on the first plate surface.

[0029] In some embodiments, the adsorption mechanism further includes:

[0030] A locking component is provided in a one-to-one correspondence with the first adsorption element. The locking component includes a latch and a latch suction plate that can attract each other. The latch is fixedly disposed on the base plate and the latch suction plate is fixedly connected to the first adsorption element.

[0031] An elastic element is provided in a one-to-one correspondence with the first adsorption element. The upper end of the elastic element is connected to the buckle, and the lower end is connected to the first adsorption element. When the elastic element is compressed to a set degree, the buckle suction plate can be adsorbed by the buckle.

[0032] The latch is an electromagnetic latch, and the latch suction plate is an electromagnetic latch suction plate;

[0033] In S52, the current of each electromagnetic latch is gradually increased.

[0034] In some embodiments, the adsorption mechanism further includes a first driving member disposed on the substrate, and a second adsorption member disposed at the output end of the first driving member. The first driving member is capable of driving the second adsorption member to move up and down in a vertical direction. In S53, controlling the second adsorption member to drive the warped wafer to move upward includes:

[0035] The first driving component drives the second adsorption component to rise vertically.

[0036] In some embodiments, the warped wafer correction device further includes a movable arm connected to the substrate and capable of moving the substrate;

[0037] S2 includes:

[0038] S21. The substrate is moved down by the moving arm so that the lifting mechanism is close to the warped wafer;

[0039] S22. The lifting mechanism moves relative to the substrate so that the lifting mechanism supports the edge of the second plate surface upward;

[0040] S23. The substrate is moved upward by the moving arm.

[0041] In some embodiments, the substrate is leveled before step S1.

[0042] In some embodiments, the warped wafer correction device further includes a moving arm and a leveling mechanism, the leveling mechanism being connected between the moving arm and the substrate, and the substrate being leveled by the leveling mechanism.

[0043] In some embodiments, in S1, the warped wafer is transferred below the substrate by a robotic arm.

[0044] The beneficial effects of this application are as follows:

[0045] The warped wafer correction method provided in this application uses a warped wafer correction device to correct the warped wafer. After the lifting mechanism supports the edge of the second plate and determines the warped type of the wafer, for a crying face-shaped warped wafer, the lifting mechanism is controlled to move relative to the substrate so that the lifting mechanism lifts the second plate of the warped wafer upward until the first adsorption member corrects the warped wafer flat. For a smiling face-shaped warped wafer, the lifting mechanism is controlled to move relative to the substrate so that the lifting mechanism lifts the second plate of the warped wafer upward. The second adsorption member adsorbs the center of the first plate and moves the warped wafer upward, and the first adsorption member corrects the warped wafer flat. Thus, it can correct both crying face-shaped and smiling face-shaped warped wafers. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this application and these drawings without creative effort.

[0047] Figure 1 This is a first-view structural schematic diagram of the warped wafer correction device provided in Embodiment 1 of this application.

[0048] Figure 2 This is a schematic diagram of the warped wafer correction device provided in Embodiment 1 of this application from a second perspective.

[0049] Figure 3 This is a schematic diagram of the structure of the warped wafer correction device provided in Embodiment 1 of this application after removing the warped wafer from a third-view perspective;

[0050] Figure 4 This is a schematic diagram of the locking component provided in Embodiment 1 of this application;

[0051] Figure 5 This is a schematic flowchart of the warped wafer correction method provided in Embodiment 2 of this application;

[0052] Figure 6 This is a flowchart illustrating step S4 in Embodiment 2 of this application;

[0053] Figure 7 This is a flowchart of S5 in Embodiment 2 of this application.

[0054] Figure label:

[0055] 100. Warped wafer; 101. First facet; 102. Second facet;

[0056] 1. Substrate;

[0057] 2. Adsorption mechanism; 21. First adsorption element; 22. Second adsorption element; 23. Locking assembly; 231. Lock; 232. Lock suction plate; 24. Elastic element; 25. First driving element;

[0058] 3. Lifting mechanism; 31. Lifting component; 32. Second drive component; 33. Third drive component; 34. Protective pad; 35. Guide rail; 36. Connecting component;

[0059] 4. Moving arm;

[0060] 5. Leveling mechanism; 51. Adjusting bolt; 52. Stud; 53. Locking nut. Detailed Implementation

[0061] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0062] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0063] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0064] Wafer warping is categorized into two types: "crying face" warping and "smiley face" warping. In a crying face warping wafer, the edges bend downwards, while in a smiley face warping wafer, the edges bend upwards. Current equipment often employs a downward pressure method, first fixing the bottom of the warped wafer, then applying downward pressure to deform the edges of the smiley face warped wafer. However, when applying downward pressure to a crying face warped wafer, the edges are subjected to excessive force and are prone to breakage.

[0065] The following is in conjunction with the appendix Figures 1 to 7 The technical solution of the present invention will be further illustrated through multiple embodiments.

[0066] Example 1

[0067] Figure 1 The diagram shows a first-view structural schematic of the warped wafer correction device provided in this embodiment. Figure 2 The diagram shows a second-view structural schematic of the warped wafer correction device provided in this embodiment. Figure 3This diagram illustrates the structure of the warped wafer correction device provided in this embodiment after removing the warped wafer 100 from a third-view perspective. Figures 1 to 3 As shown, the warped wafer correction device provided in this embodiment can correct a warped wafer 100. The warped wafer 100 includes a first plate surface 101 and a second plate surface 102 facing each other. The warped wafer correction device includes a substrate 1, an adsorption mechanism 2, and a support mechanism 3. The adsorption mechanism 2 includes a first adsorption member 21 and a second adsorption member 22. There are multiple first adsorption members 21 arranged in an array on the substrate 1. Each first adsorption member 21 is movably connected to the substrate 1 in the vertical direction and can adsorb the first plate surface 101. The first adsorption member 21 can drive the first plate surface 101 to move upward. The second adsorption member 22 is movably connected to the center position of the substrate 1 in the vertical direction and can adsorb the first plate surface 101. The second adsorption member 22 can drive the first plate surface 101 to move upward. The support mechanism 3 is movably mounted on the substrate 1 and can support the edge position of the second plate surface 102 upward.

[0068] It is understood that the first plate surface 101 and the second plate surface 102 of the warped wafer 100 are arranged opposite to each other. The first adsorption member 21 and the second adsorption member 22 can press against the first plate surface 101, and the lifting mechanism 3 can support the second plate surface 102 upward and press against the second plate surface 102. That is, the adsorption mechanism 2 and the lifting mechanism 3 can press against the warped wafer 100 from both sides of the plate surface of the warped wafer 100 at the same time to avoid the edge of the warped wafer 100 being subjected to excessive stress and breaking. Thus, the warped wafer correction device can simultaneously adapt to both crying face warped wafers and smiling face warped wafers.

[0069] The warped wafer correction device provided in this embodiment has multiple first adsorption members 21 arranged in an array on the substrate 1. Each first adsorption member 21 is movably connected to the substrate 1 in the vertical direction and can adsorb the first plate surface 101. The first adsorption member 21 can drive the first plate surface 101 to move upward. The second adsorption member 22 is movably connected to the center position of the substrate 1 in the vertical direction and can adsorb the first plate surface 101. The second adsorption member 22 can drive the first plate surface 101 to move upward. The lifting mechanism 3 is movably installed on the substrate 1 and can support the edge position of the second plate surface 102 upward.

[0070] When correcting the tear-face warped wafer, the lifting mechanism 3 supports the edge of the second plate surface 102 upwards, so that the first adsorption member 21 located in the middle of the substrate 1 adsorbs the first plate surface 101 and applies pressure to the first plate surface 101. Then, the remaining first adsorption members 21 gradually come into contact with the first plate surface 101 and apply pressure to the first plate surface 101. Finally, the lifting mechanism 3 applies pressure to the edge of the second plate surface 102. Since the first adsorption member 21 and the lifting mechanism 3 apply pressure to the first plate surface 101 and the second plate surface 102 of the tear-face warped wafer at the same time, the edge of the tear-face warped wafer can be prevented from being subjected to excessive pressure and breaking.

[0071] When correcting a smiley face warped wafer, the lifting mechanism 3 supports the edge of the second plate 102 upwards. The first adsorption member 21 located at the edge of the substrate 1 first adsorbs the first plate 101 and applies pressure to the first plate 101. Then the second adsorption member 22 adsorbs the first plate 101 and moves upwards until all the first adsorption members 21 are adsorbed onto the first plate 101 and apply pressure to the first plate 101. Since the first adsorption member 21 and the lifting mechanism 3 apply pressure to the first plate 101 and the second plate 102 of the smiley face warped wafer at the same time, the edge of the smiley face warped wafer can be prevented from being subjected to excessive pressure and breaking. Thus, the warped wafer correction device can correct both smiley face warped wafers and sad face warped wafers.

[0072] It should be noted that the warped wafer 100 corrected by the warped wafer correction device in this embodiment can be not only a wafer, chip, packaging substrate or packaging substrate, but also any plate-shaped component that may have smiling face warping or crying face warping, such as metal plate or circuit board, and can be corrected by the warped wafer correction device provided in this embodiment.

[0073] It should be noted that in this embodiment, the first adsorption element 21 and the second adsorption element 22 can be suction cups. One end of the first adsorption element 21 and the second adsorption element 22 are connected to a vacuum pump (not shown in the figure) through an air pipe. The vacuum pump can evacuate the contact position between the first adsorption element 21 and the first plate surface 101 of the warped wafer 100, so that the first adsorption element 21 can adsorb the first plate surface 101 of the warped wafer 100. The vacuum pump can evacuate the contact position between the second adsorption element 22 and the first plate surface 101 of the warped wafer 100, so that the second adsorption element 22 can adsorb the first plate surface 101 of the warped wafer 100.

[0074] Figure 4 A schematic diagram of the locking component 23 provided in this embodiment is shown. Figure 2 and Figure 4As shown, the adsorption mechanism 2 also includes a locking component 23 and an elastic element 24. The locking component 23 is arranged in a one-to-one correspondence with the first adsorption element 21. The locking component 23 includes a latch 231 and a latch suction plate 232 that can attract each other. The latch 231 is fixedly disposed on the base plate 1, and the latch suction plate 232 is fixedly connected to the first adsorption element 21. The elastic element 24 is arranged in a one-to-one correspondence with the first adsorption element 21. The upper end of the elastic element 24 is connected to the latch 231, and the lower end is connected to the first adsorption element 21. The elastic element 24 is compressed. When the set degree is reached, the latching suction plate 232 can be attracted by the latch 231, so that when the first adsorption member 21 successively adsorbs the first plate surface 101 of the warped wafer 100, when all the elastic members 24 can be compressed to the same set degree, the latch 231 and the latching suction plate 232 can attract each other, so that all the first adsorption members 21 can form an adsorption plane, ensuring that the pressure applied to each position of the first plate surface 101 is equal, so that the first plate surface 101 is subjected to uniform force and the warped wafer 100 is not easy to break.

[0075] In some embodiments, the latch 231 is an electromagnetic latch, and the latch suction plate 232 is an electromagnetic latch suction plate. When a specific distance is reached between the electromagnetic latch and the electromagnetic latch suction plate, the electromagnetic latch and the electromagnetic latch suction plate can attract each other, thereby adjusting the current of the electromagnetic latch to adjust the specific distance at which the electromagnetic latch and the electromagnetic latch suction plate attract each other. This allows for the appropriate adjustment of the specific attraction distance between the electromagnetic latch and the electromagnetic latch suction plate for different specifications of warped wafers 100.

[0076] like Figures 2 to 3 As shown, the adsorption mechanism 2 also includes a first driving member 25, which is disposed on the substrate 1. The second adsorption member 22 is disposed at the output end of the first driving member 25. The first driving member 25 can drive the second adsorption member 22 to move up and down in the vertical direction. Thus, when correcting the smiley face warped wafer, the first adsorption member 21 at the edge of the substrate 1 first adsorbs the first plate surface 101 and applies pressure to the first plate surface 101. The first driving member 25 can drive the second adsorption member 22 to move downward and adsorb the first plate surface 101 of the warped wafer 100, and then move upward until all the first adsorption members 21 are adsorbed onto the first plate surface 101 and apply pressure to the first plate surface 101. This makes the edge of the smiley face warped wafer first subjected to pressure, and the middle position subjected to pressure, thus preventing the edge of the smiley face warped wafer from being subjected to excessive pressure and breaking. It should be noted that the specific type of the first driving component 25 is not limited here. It can be a linear motor, a linear module or a cylinder. Any driving component whose output end can be connected to the first adsorption component 21 and drive the first adsorption component 21 to move up and down in the vertical direction is within the protection scope of this application, and will not be described in detail here.

[0077] like Figure 2As shown, the lifting mechanism 3 includes a lifting member 31, a second driving member 32, and a third driving member 33. The lifting member 31 is disposed at the output end of the second driving member 32, and the second driving member 32 can drive the lifting member 31 to move up and down. The third driving member 33 is disposed on the substrate 1, and the second driving member 32 is disposed at the output end of the third driving member 33. The third driving member 33 can drive the second driving member 32 to move horizontally, so that the lifting member 31 moves closer to or further away from the substrate 1 in the horizontal direction, thereby enabling the third driving member 33 to... The drive member 31 moves horizontally away from the substrate 1 to leave space for gripping the warped wafer 100. Then, the second drive member 32 drives the drive member 31 to descend, moving it to the side below the warped wafer 100. Next, the third drive member 33 drives the drive member 31 horizontally towards the substrate 1, moving it directly below the warped wafer 100. Finally, the second drive member 32 drives the drive member 31 to rise, lifting the edge of the second surface 102 of the warped wafer 100. It should be noted that the specific types of the second drive member 32 and the third drive member 33 are not limited here; they can be linear motors, linear modules, or cylinders. Any drive member capable of driving the drive member 31 to rise and fall, and any drive member capable of moving the drive member 31 horizontally towards or away from the substrate 1, is within the scope of protection of this application.

[0078] Continue as Figure 2 As shown, a protective pad 34 is provided on the upper surface of the support member 31, thereby reducing the friction between the support member 31 and the second plate surface 102 of the warped wafer 100 and preventing wear on the second plate surface 102.

[0079] Continue as Figure 2 As shown, the lifting mechanism 3 also includes a guide rail 35 and a connector 36; the guide rail 35 is arranged horizontally on the base plate 1. The connector 36 is slidably disposed on the guide rail 35, and the second driving member 32 is disposed on the connector 36, thereby guiding the lifting member 31 to move horizontally.

[0080] like Figure 1 As shown, the warped wafer correction device also includes a movable arm 4, which is connected to the substrate 1 and can move the substrate 1. This allows the movable arm 4 to move the adsorption mechanism 2 and the lifting mechanism 3 to the position of the warped wafer 100 to adsorb the first surface 101 of the warped wafer 100, thereby achieving automated loading of the warped wafer 100. It should be noted that the movable arm 4 can be a linear module, a robotic arm, or an intelligent robot, or any other component capable of moving in any direction in space; further details will not be provided here.

[0081] like Figure 1 and Figure 2As shown, the warped wafer correction device also includes a leveling mechanism 5. The leveling mechanism 5 includes an adjusting bolt 51, a stud 52, and a locking nut 53. The stud 52 is arranged vertically and one end is fixedly connected to the substrate 1. The other end face is provided with a threaded hole. The moving arm 4 is provided with a through hole corresponding to the threaded hole. The adjusting bolt 51 passes through the through hole and the locking nut 53 and is threadedly engaged with the threaded hole. At least three leveling mechanisms 5 are arranged circumferentially around the center position of the substrate 1, so that by turning the adjusting bolt 51, the depth of its insertion into the threaded hole of the stud 52 can be adjusted, thereby adjusting the tilt angle of the end face relative to the moving arm 4, thereby leveling the substrate 1 and making the substrate 1 parallel to the warped wafer 100 to be corrected.

[0082] Example 2

[0083] Figure 5 A flowchart illustrating the warped wafer correction method provided in this embodiment is shown. Figure 5 As shown, the warped wafer correction method provided in this embodiment uses the warped wafer correction device of Example 1 to correct the warped wafer 100. The correction method includes the following steps:

[0084] S1. Transfer the warped wafer 100 to the underside of the substrate 1.

[0085] S2. Control the lifting mechanism 3 to move relative to the base plate 1 so that the lifting mechanism 3 supports the edge of the second plate 102 upward.

[0086] S3. Determine if warped wafer 100 is a crying face warped wafer; if yes, proceed to S4; if no, proceed to S5.

[0087] S4. Control the lifting mechanism 3 to move relative to the substrate 1 so that the lifting mechanism 3 lifts the second plate surface 102 of the warped wafer 100 upward until the first adsorption member 21 straightens the warped wafer 100.

[0088] S5. Control the lifting mechanism 3 to move relative to the substrate 1 so that the lifting mechanism 3 lifts the second plate surface 102 of the warped wafer 100 upward, the second adsorption member 22 adsorbs the center position of the first plate surface 101 and drives the warped wafer 100 to move upward, and the first adsorption member 21 corrects and flattens the warped wafer 100.

[0089] The warped wafer correction method provided in this embodiment uses a warped wafer correction device to correct the warped wafer 100. After the lifting mechanism 3 supports the edge of the second plate surface 102 and determines the warping type of the warped wafer 100, for a crying face warped wafer, the lifting mechanism 3 is controlled to move relative to the substrate 1 so that the lifting mechanism 3 lifts the second plate surface 102 of the warped wafer 100 upward until the first adsorption member 21 corrects the warped wafer 100 flat. For a smiling face warped wafer, the lifting mechanism 3 is controlled to move relative to the substrate 1 so that the lifting mechanism 3 lifts the second plate surface 102 of the warped wafer 100 upward. The second adsorption member 22 adsorbs the center position of the first plate surface 101 and moves the warped wafer 100 upward. The first adsorption member 21 corrects the warped wafer 100 flat, thus correcting both crying face warped wafers and smiling face warped wafers.

[0090] Figure 6 A flowchart of S4 is shown. (For example...) Figure 6 As shown, S4 includes:

[0091] S41. Control the lifting mechanism 3 to move relative to the substrate 1 so that the lifting mechanism 3 lifts the second plate surface 102 of the warped wafer 100 upward until the center position of the warped wafer 100 is adsorbed by the first adsorption member 21.

[0092] S42. Continue to control the lifting mechanism 3 to lift the second plate surface 102 of the warped wafer 100 upwards until all the first adsorption elements 21 adsorb the first plate surface 101.

[0093] S43. Control the lifting mechanism 3 to move relative to the substrate 1 so that the lifting mechanism 3 is disengaged from the warped wafer 100 until the first adsorption member 21 corrects and flattens the warped wafer 100.

[0094] In the warped wafer correction method provided in this embodiment, in S4, the lifting mechanism 3 is controlled to move relative to the substrate 1 so that the lifting mechanism 3 lifts the second plate surface 102 of the warped wafer 100 upwards until the center position of the warped wafer 100 is attracted by the first adsorption member 21. When correcting the tear-face shaped warped wafer, the center position of the tear-face shaped warped wafer can be made to bear the pressure first. The lifting mechanism 3 is then controlled to lift the second plate surface 102 of the warped wafer 100 upwards until all the first adsorption members 21 are attracted. The first plate surface 101 allows the remaining first adsorption members 21 to gradually contact the first plate surface 101 and apply pressure to the first plate surface 101. Since the first adsorption members 21 and the lifting mechanism 3 apply pressure to the first plate surface 101 and the second plate surface 102 of the tear-face warped wafer at the same time, it can prevent the edge of the tear-face warped wafer from being subjected to excessive pressure and breaking. Then the lifting mechanism 3 moves relative to the substrate 1 so that the lifting mechanism 3 is detached from the warped wafer 100 until the first adsorption members 21 straighten the warped wafer 100. Specifically, the first driving member 25 of the warped wafer correction device drives the second adsorption member 22 to rise vertically. When correcting the tear-face-shaped warped wafer, the first driving member 25 can drive the second adsorption member 22 to move downward and adsorb the first plate surface 101 of the warped wafer 100, and then move upward until all the first adsorption members 21 are adsorbed onto the first plate surface 101 and apply pressure to the first plate surface 101. This causes the edge of the tear-face-shaped warped wafer to be subjected to pressure first, and the middle position to be subjected to pressure again, thus preventing the edge of the tear-face-shaped warped wafer from being subjected to excessive pressure and breaking.

[0095] In some embodiments, when the warped wafer correction method uses electromagnetic latches and electromagnetic latch suction plates to correct a tear-face-shaped warped wafer, i.e., S42, the lifting mechanism 3 continues to control the second plate surface 102 of the warped wafer 100 to lift upwards until all the first suction members 21 are adsorbed onto the first plate surface 101. During this process, the current of each electromagnetic latch can be controlled to gradually increase, thereby increasing the adsorption force between the electromagnetic latches and the electromagnetic latch suction plates, thereby gradually increasing the correction force on the warped wafer 100 to correct the warped wafer 100.

[0096] Figure 7 A flowchart of S5 is shown. (For example...) Figure 5 As shown, S5 includes:

[0097] S51. Control the lifting mechanism 3 to move relative to the substrate 1 so that the lifting mechanism 3 lifts the second plate surface 102 of the warped wafer 100 upward.

[0098] S52. After part of the first adsorption member 21 adsorbs the first plate surface 101, the lifting mechanism 3 continues to lift the second plate surface 102 of the warped wafer 100 upward.

[0099] S53. After the second adsorption element 22 adsorbs the center position of the first plate surface 101, the second adsorption element 22 is controlled to move the warped wafer 100 upward until the warped wafer 100 is straightened and flattened. At this time, all the first adsorption elements 21 adsorb the first plate surface 101.

[0100] In the warped wafer correction method provided in this embodiment, in S5, the lifting mechanism 3 is controlled to move relative to the substrate 1 so that the lifting mechanism 3 lifts the second plate surface 102 of the warped wafer 100 upward. When correcting the smiley face warped wafer, the edge of the first plate surface 101 of the warped wafer 100 is first attracted by the first adsorption member 21, and then the lifting mechanism 3 continues to lift the second plate surface 102 of the warped wafer 100 upward. When the second adsorption member 22 is attracted to the center of the first plate surface 101, the second adsorption member 22 drives the warped wafer 100 to move upward until the warped wafer 100 is corrected and flattened, thereby avoiding the breakage of the smiley face warped wafer.

[0101] In some embodiments, when the warped wafer correction method uses electromagnetic latches and electromagnetic latch suction plates to correct smiley face-shaped warped wafers, i.e., S52, the lifting mechanism 3 continues to control the second plate surface 102 of the warped wafer 100 to lift upwards until all the first suction members 21 are adsorbed onto the first plate surface 101. During this process, the current of each electromagnetic latch can be controlled to gradually increase, thereby increasing the adsorption force between the electromagnetic latches and the electromagnetic latch suction plates, thereby gradually increasing the correction force on the warped wafer 100 to correct the warped wafer 100.

[0102] In some embodiments, when the warped wafer correction method uses an electromagnetic latch and an electromagnetic latch suction plate to correct a smiley face-shaped warped wafer, i.e., S53, during the process of controlling the second adsorption member 22 to move the warped wafer 100 upward, the first driving member 25 drives the second adsorption member 22 to rise in the vertical direction, so that the first adsorption member 21 is completely adsorbed onto the first plate surface 101 and applies a pressure to the first plate surface 101, so that the edge of the smiley face-shaped warped wafer is first subjected to the pressure, and the middle position is subjected to the pressure, thus preventing the edge of the smiley face-shaped warped wafer from being subjected to excessive pressure and breaking.

[0103] In some embodiments, S2 includes:

[0104] S21. The substrate 1 is moved down by the moving arm 4 so that the lifting mechanism 3 is close to the warped wafer 100.

[0105] S22, the lifting mechanism 3 moves relative to the substrate 1 so that the lifting mechanism 3 supports the edge of the second plate surface 102 upward.

[0106] S23, The substrate 1 is moved upward by the moving arm 4.

[0107] When the correction device corrects the warped wafer 100, it is necessary to correct the stacked components. In the warped wafer correction method provided in this embodiment, in S2, the moving arm 4 drives the substrate 1 to move down, so that the lifting mechanism 3 can approach the warped wafer 100. The lifting mechanism 3 moves relative to the substrate 1, so that the lifting mechanism 3 can support the edge of the second plate surface 102 upward. After the moving arm 4 drives the substrate 1 to move up, the warped wafer 100 to be corrected by the lifting mechanism 3 can be kept away from the uncorrected warped wafer 100, so as to prevent accidental contact with other stacked warped wafers 100 during the correction of the warped wafer 100, which would cause the warped wafer 100 to break.

[0108] The warped wafer correction method provided in this embodiment involves leveling the substrate 1 before step S1 to ensure that the substrate 1 of the correction device is substantially parallel to the plane of the warped wafer 100. This prevents the substrate 1 from tilting and applying excessive pressure to the warped wafer 100 during correction, which could lead to the warped wafer 100 breaking.

[0109] Specifically, the substrate 1 is leveled by the leveling mechanism 5 of the warped wafer correction device, and the leveling mechanism 5 is connected between the moving arm 4 and the substrate 1.

[0110] The warped wafer correction method provided in this embodiment, in S1, uses a robotic arm to transfer the warped wafer 100 to the underside of the substrate 1, thereby realizing the automated feeding of the warped wafer 100.

[0111] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for correcting warped wafers, characterized in that, A warped wafer (100) is corrected using a warped wafer correction device, the warped wafer (100) comprising a first plate surface (101) and a second plate surface (102) opposite to each other, the warped wafer correction device comprising: substrate(1); The adsorption mechanism (2) includes a first adsorption element (21) and a second adsorption element (22). There are multiple first adsorption elements (21), and the multiple first adsorption elements (21) are arranged in an array on the substrate (1). Each first adsorption element (21) is movably connected to the substrate (1) in the vertical direction and can adsorb the first plate surface (101). The first adsorption element (21) can drive the first plate surface (101) to move upward. The second adsorption element (22) is movably connected to the center position of the substrate (1) in the vertical direction and can adsorb the first plate surface (101). The second adsorption element (22) can drive the first plate surface (101) to move upward. The lifting mechanism (3) is movably mounted on the substrate (1) and is able to support the edge of the second plate surface (102) upwards; The method for correcting warped wafers includes the following steps: S1. The warped wafer (100) is transferred to the underside of the substrate (1); S2. Control the lifting mechanism (3) to move relative to the base plate (1) so that the lifting mechanism (3) supports the edge of the second plate surface (102) upward; S3. Determine whether the warped wafer (100) is a crying face warped wafer; if yes, proceed to S4; if no, proceed to S5. S4. Control the lifting mechanism (3) to move relative to the substrate (1) so that the lifting mechanism (3) lifts the second plate surface (102) of the warped wafer (100) upward until the first adsorption member (21) straightens the warped wafer (100). S5. Control the lifting mechanism (3) to move relative to the substrate (1) so that the lifting mechanism (3) lifts the second plate surface (102) of the warped wafer (100) upward, the second adsorption member (22) adsorbs the center position of the first plate surface (101) and drives the warped wafer (100) to move upward, and the first adsorption member (31) straightens the warped wafer (100).

2. The method for correcting warped wafers according to claim 1, characterized in that, S4 includes: S41. Control the lifting mechanism (3) to move relative to the substrate (1) so that the lifting mechanism (3) lifts the second plate surface (102) of the warped wafer (100) upward until the center of the warped wafer (100) is adsorbed by the first adsorption member (31). S42. Continue to control the lifting mechanism (3) to lift the second plate surface (102) of the warped wafer (100) upward until all the first adsorption members (21) are adsorbed on the first plate surface (101). S43. Control the lifting mechanism (3) to move relative to the substrate (1) so that the lifting mechanism (3) disengages from the warped wafer (100) until the first adsorption member (21) straightens the warped wafer (100).

3. The method for correcting warped wafers according to claim 2, characterized in that, The adsorption mechanism (2) further includes: The locking component (23) is provided in a one-to-one correspondence with the first adsorption component (21). The locking component (23) includes a buckle (231) and a buckle suction plate (232) that can be attracted to each other. The buckle (231) is fixedly disposed on the substrate (1), and the buckle suction plate (232) is fixedly connected to the first adsorption component (21). The elastic element (24) is provided in a one-to-one correspondence with the first adsorption element (21). The upper end of the elastic element (24) is connected to the latch (231), and the lower end is connected to the first adsorption element (21). When the elastic element (24) is compressed to a set degree, the latch suction plate (232) can be adsorbed by the latch (231). The latch (231) is an electromagnetic latch, and the latch suction plate (232) is an electromagnetic latch suction plate; In S42, the current of each electromagnetic latch is gradually increased.

4. The method for correcting warped wafers according to claim 1, characterized in that, S5 includes: S51. Control the lifting mechanism (3) to move relative to the substrate (1) so that the lifting mechanism (3) lifts the second plate surface (102) of the warped wafer (100) upward; S52. After a portion of the first adsorption element (21) adsorbs the first plate surface (101), the lifting mechanism (3) is controlled to continue to lift the second plate surface (102) of the warped wafer (100) upwards. S53. When the second adsorption element (22) adsorbs the center position of the first plate surface (101), the second adsorption element (22) is controlled to drive the warped wafer (100) until the warped wafer (100) is straightened and flattened. At this time, all the first adsorption elements (21) adsorb the first plate surface (101).

5. The method for correcting warped wafers according to claim 4, characterized in that, The adsorption mechanism (2) further includes: The locking component (23) is provided in a one-to-one correspondence with the first adsorption component (21). The locking component (23) includes a buckle (231) and a buckle suction plate (232) that can be attracted to each other. The buckle (231) is fixedly disposed on the substrate (1), and the buckle suction plate (232) is fixedly connected to the first adsorption component (21). The elastic element (24) is provided in a one-to-one correspondence with the first adsorption element (21). The upper end of the elastic element (24) is connected to the latch (231), and the lower end is connected to the first adsorption element (21). When the elastic element (24) is compressed to a set degree, the latch suction plate (232) can be adsorbed by the latch (231). The latch (231) is an electromagnetic latch, and the latch suction plate (232) is an electromagnetic latch suction plate; In S52, the current of each electromagnetic latch is gradually increased.

6. The method for correcting warped wafers according to claim 4, characterized in that, The adsorption mechanism (2) further includes a first driving member (25), which is disposed on the substrate (1). The second adsorption member (22) is disposed at the output end of the first driving member (25). The first driving member (25) can drive the second adsorption member (22) to move up and down in the vertical direction. In S53, controlling the second adsorption member (22) to move the warped wafer (100) upward includes: The first driving member (25) drives the second adsorption member (22) to rise in the vertical direction.

7. The method for correcting warped wafers according to claim 1, characterized in that, The warped wafer correction device further includes a movable arm (4), which is connected to the substrate (1) and can drive the substrate (1) to move; S2 includes: S21. The substrate (1) is moved down by the moving arm (4) so ​​that the lifting mechanism (3) is close to the warped wafer (100). S22, the lifting mechanism (3) moves relative to the base plate (1) so that the lifting mechanism (3) supports the edge of the second plate surface (102) upward; S23. The substrate (1) is moved upward by the moving arm (4).

8. The method for correcting warped wafers according to claim 1, characterized in that, Before step S1, the substrate (1) is leveled.

9. The method for correcting warped wafers according to claim 8, characterized in that, The warped wafer correction device also includes a moving arm (4) and a leveling mechanism (5). The leveling mechanism (5) is connected between the moving arm (4) and the substrate (1) and the substrate (1) is leveled by the leveling mechanism (5).

10. The method for correcting warped wafers according to any one of claims 1-9, characterized in that, In S1, the warped wafer (100) is transferred to the underside of the substrate (1) by a robotic arm.

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