Electronic module and method for manufacturing electronic module

Abstract

The invention provides an electronic module and a method for manufacturing the electronic module. For the average film thickness of the barrier layer, expected barrier properties cannot be obtained sometimes. An electronic component (10) is provided with a component main body (11) and a protective film (16). The protective film (16) is provided with: an organic film (16A) which covers the outer surface of the component main body (11) and which has an organic component as the main component; and a first barrier film (16B) covering the organic film (16A) and having an inorganic component as a main component. The minimum value of the film thickness of the first barrier film (16B) is 15 nm or more, and the maximum value of the film thickness of the first barrier film (16B) is 65 nm or less.

Description

Technical Field

[0001] This invention relates to electronic modules and methods for manufacturing electronic modules. Background Technology

[0002] Patent Document 1 describes a high-barrier film comprising a plastic film, an anchor coating, a first barrier layer, and a second barrier layer. The anchor coating is a resin-based layer laminated onto the plastic film. The barrier layers are laminated onto the anchor coating in the order of first barrier layer, second barrier layer, and first barrier layer again. Both the first and second barrier layers are composed of SiOC.

[0003] Patent Document 1: Japanese Patent No. 6430982

[0004] In the high-barrier film disclosed in Patent Document 1, the film thickness of each barrier layer affects the overall barrier performance of the high-barrier film. However, especially when the film thickness of the barrier layer is small, sometimes the expected barrier performance cannot be obtained for the average film thickness of the barrier layer. Summary of the Invention

[0005] An electronic module for solving the above-mentioned problem includes: a specific component; an organic film covering the outer surface of the specific component, wherein an organic component is the main component; and a first barrier film directly covering the organic film, wherein an inorganic component is the main component, wherein the minimum thickness of the first barrier film is 15 nm or more, and the maximum thickness of the first barrier film is 65 nm or less.

[0006] A method for manufacturing an electronic module to solve the above-mentioned problems includes: a first film-forming step in which an organic film, with an organic component as the main component, is formed on the outer surface of a specific component; and a second film-forming step in which a first barrier film, with an inorganic component as the main component, is formed on the outer surface of the organic film by atomic layer deposition. In the second film-forming step, the first barrier film is formed such that the minimum thickness of the first barrier film is 15 nm or more and the maximum thickness of the first barrier film is 65 nm or less.

[0007] The likelihood of obtaining barrier properties corresponding to the average film thickness of the first barrier layer is increased. Attached Figure Description

[0008] Figure 1 This is a cross-sectional view of the electronic module according to the first embodiment.

[0009] Figure 2 This is a partial cross-sectional view of the electronic module of the first embodiment.

[0010] Figure 3 This is an enlarged cross-sectional view of the protective layer of the electronic module in the first embodiment.

[0011] Figure 4 This is a flowchart illustrating each step of the manufacturing method of the electronic module according to the first embodiment.

[0012] Figure 5 This is a cross-sectional view of the electronic module according to the second embodiment.

[0013] Figure 6 This is a partial cross-sectional view of the electronic module of the second embodiment.

[0014] Figure 7 This is a cross-sectional view of the electronic module in the third embodiment.

[0015] Figure 8 This is a partial cross-sectional view of the electronic module of the third embodiment.

[0016] Figure 9 This is a cross-sectional view of the electronic module according to the fourth embodiment.

[0017] Figure 10 This is a partial cross-sectional view of the electronic module according to the fourth embodiment.

[0018] Figure 11 This is a partial sectional view of the electronic module in the modified example. Detailed Implementation

[0019] Hereinafter, various embodiments of the electronic module will be described with reference to the accompanying drawings. Furthermore, the components are sometimes shown enlarged for ease of understanding. Sometimes the size ratios of the components differ from the actual situation or from those in other drawings. Additionally, as illustrated in the following embodiments, an electronic module refers to a concept that includes passive components that act electrically or magnetically when energized, active components that operate when energized, and assemblies that mount these components on a wiring board.

[0020] <Structure of the First Embodiment>

[0021] An embodiment of the electronic component 10, which is an electronic module, will be described. It should be noted that examples of the electronic component 10 include inductor components, capacitor components, thermistor components, and switching components.

[0022] like Figure 1 As shown, the electronic component 10 includes a component body 11 as a specific part. The component body 11 also has a blank 12 and a pair of external terminals 13. The blank 12 is made of an insulator. For example, the blank 12 is made of a sintered ceramic body.

[0023] The blank 12 is approximately rectangular in shape. Therefore, the blank 12 has six planes as its outer surface. Hereinafter, one of these six planes will be designated as the first plane 12A. Furthermore, the plane adjacent to the first plane 12A and extending in a direction orthogonal to the first plane 12A will be designated as the second plane 12B. Therefore, there are four second planes 12B. The plane opposite to the first plane 12A among the six planes of the blank 12 will be designated as the third plane 12C. Moreover, the portion between each plane on the outer surface of the blank 12 will be designated as the ridge portion 12D. In this embodiment, the ridge portion 12D of the blank 12 is a curved portion protruding outwards from the blank 12. That is, the ridge portion 12D has a so-called R-shaped chamfer.

[0024] Each external terminal 13 is made of a conductive metal. Therefore, each external terminal 13 is a metal component. Each external terminal 13 protrudes from the first plane 12A of the blank 12. Therefore, a portion of the front end of each external terminal 13 is exposed on the outside of the blank 12. Moreover, the base end of each external terminal 13 is connected to an external electrode located on the surface of the blank 12. Each external terminal 13 is connected to internal wiring located within the blank 12 via this external electrode. Furthermore, in Figure 1 The external electrodes on the surface of the blank 12 and the internal terminals within the blank 12 are omitted from the illustration. Each external terminal 13 is disposed at a distance from each other.

[0025] The electronic component 10 includes a sealing material 15. The sealing material 15 is made of a thermosetting synthetic resin. Furthermore, the sealing material 15 is insulating. Specifically, for example, polyimide resins, epoxy resins, acrylic resins, etc., can be used as the material for the sealing material 15.

[0026] The sealing material 15 covers the entire area of ​​the outer surface of the blank 12. Therefore, the sealing material 15 covers not only the first plane 12A, the second plane 12B, and the third plane 12C, but also the ridge portion 12D. Additionally, the sealing material 15 covers a portion of the outer surface of each external terminal 13. Specifically, as... Figure 2 As shown, the sealing material 15 covers the outer surface of each external terminal 13 near the boundary with the first plane 12A of the blank 12. On the other hand, the sealing material 15 does not cover a portion of the front end side of each external terminal 13. Furthermore, in the following, when referred to simply as "covering", it includes not only cases of covering through direct contact, but also cases of covering without direct contact via other components.

[0027] like Figure 2 As shown, electronic component 10 has a protective film 16. Furthermore, Figure 2This is a cross-sectional view of the electronic component 10 near the base of the external terminal 13. Additionally, in Figure 1 In the illustration, the shapes of the sealing material 15 and the protective film 16 near the base of the external terminal 13 are simplified. Figure 2 As shown, the protective film 16 comprises an organic film 16A, a first barrier film 16B, and a second barrier film 16C. That is, the protective film 16 has a three-layer structure. Furthermore, these three layers are stacked sequentially from the sealing material 15 side in the order of organic film 16A, first barrier film 16B, and second barrier film 16C. In addition, in… Figure 1 In the diagram, the three-layer structure of the protective film 16 is omitted, and it is shown as if it were a film consisting of a single layer.

[0028] The organic membrane 16A is made primarily of organic components. Here, organic components refer to molecules with carbon chains as their main backbone. Furthermore, a main component is defined as one that, by weight, constitutes more than 50% of the total composition. Therefore, the organic membrane 16A may also partially contain inorganic components as additives such as stabilizers and dispersants. For example, silicon-containing polyimide or parylene can be used as the material for the organic membrane 16A. In this embodiment, the organic membrane 16A is made of silicon-containing polyimide.

[0029] The organic film 16A covers the entire area of ​​the outer surface of the blank 12 from the outside of the sealing material 15. Therefore, the organic film 16A covers not only the first plane 12A, the second plane 12B, and the third plane 12C, but also the ridge portion 12D. Additionally, the organic film 16A covers a portion of the outer surface of each external terminal 13. Specifically, the organic film 16A covers the boundary BL between the portion of the outer surface of each external terminal 13 covered by the sealing material 15 and the portion not covered by the sealing material 15. In other words, the edge of the organic film 16A is located on the outside relative to the edge of the sealing material 15. On the other hand, the organic film 16A does not cover a portion of the front end side of each external terminal 13.

[0030] The first barrier membrane 16B is primarily composed of inorganic components. Here, inorganic components refer to components that do not have carbon chains. Therefore, the first barrier membrane 16B can also partially contain organic components as additives such as stabilizers and dispersants. Examples of materials for the first barrier membrane 16B include alumina, titanium dioxide, and hafnium oxide. In this embodiment, the first barrier membrane 16B is made of alumina.

[0031] The first barrier film 16B covers the entire area of ​​the outer surface of the blank 12 from the outside of the organic film 16A. Therefore, the first barrier film 16B covers not only the first plane 12A, the second plane 12B, and the third plane 12C, but also the ridge portion 12D. Furthermore, the first barrier film 16B directly covers the organic film 16A. In other words, the first barrier film 16B is in contact with the organic film 16A. Additionally, the first barrier film 16B covers a portion of the outer surface of each external terminal 13. Specifically, the first barrier film 16B covers the boundary BL between the portion of the outer surface of each external terminal 13 covered by the sealing material 15 and the portion not covered by the sealing material 15. On the other hand, the first barrier film 16B does not cover a portion of the front end side of each external terminal 13. Moreover, the edge of the first barrier film 16B coincides with the edge of the organic film 16A. That is, the first barrier film 16B directly covers the entire outer surface S2 of the organic film 16A, but does not extend outward relative to the organic film 16A.

[0032] The material of the second barrier film 16C is different from that of the first barrier film 16B. The material of the second barrier film 16C can be silicon-containing polyimide, parylene, etc. In this embodiment, the material of the second barrier film 16C is parylene.

[0033] The second barrier film 16C covers the entire area of ​​the outer surface of the blank 12 from the outside of the first barrier film 16B. Therefore, the second barrier film 16C covers not only the first plane 12A, the second plane 12B, and the third plane 12C, but also the ridge portion 12D. Furthermore, the second barrier film 16C covers a portion of the outer surface of each external terminal 13. Specifically, the second barrier film 16C covers the boundary BL between the portion of the outer surface of each external terminal 13 covered by the sealing material 15 and the portion not covered by the sealing material 15. On the other hand, the second barrier film 16C does not cover a portion of the front end side of each external terminal 13. Moreover, the edge of the second barrier film 16C coincides with the edge of the first barrier film 16B and the edge of the organic film 16A. That is, the first barrier film 16B directly covers the entire outer surface of the first barrier film 16B, but does not extend outward relative to the first barrier film 16B and the organic film 16A.

[0034] like Figure 3 As shown, the average thickness of the first barrier film 16B is smaller than the average thickness of the organic film 16A and the average thickness of the second barrier film 16C. Furthermore, the average thickness of the first barrier film 16B is 50 nm or less. In this first embodiment, the average thickness of the first barrier film 16B is approximately 40 nm. On the other hand, the average thickness of both the organic film 16A and the second barrier film 16C is 1 μm or more. Furthermore, in... Figure 2 as well as Figure 3The thickness Tb of the first barrier membrane 16B is exaggeratedly illustrated in the figure.

[0035] Furthermore, the film thickness Ta of organic membrane 16A can be measured as follows. First, as... Figure 3 As shown, a cross-section containing the outer surface S1 of the sealing material 15 and the outer surface S2 of the organic film 16A is captured using an electron microscope, and this cross-section is orthogonal to the outer surface S1 of the sealing material 15. Furthermore, an arbitrary location is defined on the surface of the organic film 16A on the side of the sealing material 15. This surface can be considered identical to the outer surface S1 of the sealing material 15. The shortest distance from this arbitrary location to the outer surface S2 of the organic film 16A is defined as the film thickness Ta of the organic film 16A at that arbitrary location. The film thickness Tb of the first barrier film 16B and the film thickness of the second barrier film 16C can also be measured using the same method.

[0036] Furthermore, the average thickness of the organic film 16A can be measured as follows. Similar to the above, a cross-section containing the outer surface S1 of the sealing material 15 and the outer surface S2 of the organic film 16A is taken using an electron microscope, and this cross-section is orthogonal to the outer surface S1 of the sealing material 15. Next, for the captured electron microscope image, the observation range along the direction of the outer surface S1 of the sealing material 15 is determined. This observation range is set to 10 μm or more. This observation range can be continuously 10 μm or more, or the sum of the ranges at multiple different locations can be 10 μm or more. Moreover, the area of ​​the organic film 16A within the observation range is measured on the electron microscope image using image processing or the like. The value obtained by dividing the calculated area by the length of the observation range is taken as the average thickness of the organic film 16A. The average thickness of the first barrier film 16B and the average thickness of the second barrier film 16C can also be measured using the same method.

[0037] The minimum value of the film thickness Tb of the first barrier film 16B is 15 nm or more. In addition, the maximum value of the film thickness Tb of the first barrier film 16B is 65 nm or less.

[0038] The minimum and maximum values ​​of the film thickness Tb of the first barrier film 16B can be measured as follows. First, an electron microscope is used to photograph a cross-section containing the outer surface S2 of the organic film 16A and the outer surface S3 of the first barrier film 16B, and this cross-section is orthogonal to the outer surface S2 of the organic film 16A. Next, for the photographed electron microscope image, the observation range along the direction of the outer surface S1 of the sealing material 15 is determined. The observation range is set to be 10 μm or more. The minimum value of the film thickness Tb of the first barrier film 16B within this observation range is regarded as the minimum value of the overall film thickness Tb of the first barrier film 16B. Similarly, the maximum value of the film thickness Tb of the first barrier film 16B within the observation range is regarded as the maximum value of the overall film thickness Tb of the first barrier film 16B.

[0039] like Figure 3 As shown, the surface roughness of the outer surface S2 of the organic film 16A is smaller than the surface roughness of the surface covered by and in contact with the organic film 16A. Furthermore, in this first embodiment, the surface covered by and in contact with the organic film 16A is the outer surface S1 of the sealing material 15. Preferably, the surface roughness of the outer surface S2 of the organic film 16A is 50% or less of the surface roughness of the outer surface S1 of the sealing material 15.

[0040] The surface roughness of the outer surface S2 of the organic film 16A can be measured as an arithmetic mean roughness. Specifically, an electron microscope is used to photograph a cross-section containing the outer surface S2 of the organic film 16A, which is orthogonal to the outer surface S1 of the sealing material 15. The arithmetic mean roughness of the outer surface S2 of the organic film 16A, represented by lines in the electron microscope image, can be measured using known calculation methods. Furthermore, the arithmetic mean roughness is sometimes referred to as "Sa (ISO 25178)" or "Ra (JISB0601-2001)". The surface roughness of the outer surface S1 of the sealing material 15 can also be measured in the same way.

[0041] <Manufacturing method of the first embodiment>

[0042] The manufacturing method of the electronic component 10 according to the first embodiment will be described.

[0043] like Figure 4 As shown, the manufacturing method includes a component preparation step S11, a masking step S12, a first film forming step S13, a second film forming step S14, a third film forming step S15, and a mask removal step S16.

[0044] In this manufacturing method, firstly, a component preparation step S11 is performed. In the component preparation step S11, a component body 11 covered by a sealing material 15 is prepared. Therefore, the object processed in this stage has a blank 12 of the component body 11, each external terminal 13, and the sealing material 15.

[0045] Next, a masking process S12 is performed. In the masking process S12, a portion of each external terminal 13 is covered using a masking strip. Specifically, as shown... Figure 2 As shown, a portion of each external terminal 13 from the front end is designated as a shielding area M, and this shielding area M is covered by a shielding tape. As the shielding tape, for example, a tape with a polyimide resin film as a base, on which a heat-resistant silicone adhesive is coated, can be used. Furthermore, in Figure 2 In the image, a virtual map shows the shielding area M in electronic component 10.

[0046] Next, as Figure 4 As shown, the first film-forming process S13 is performed. In the first film-forming process S13, an organic film 16A is formed on the object to be treated by a so-called dip-coating method. Specifically, the component body 11 covered by the object to be treated, i.e., the sealing material 15, is immersed in a coating liquid obtained by dispersing uncured silicone-containing polyimide in a solvent. At this time, only the base ends of each external terminal 13 of the component body 11 are in contact with the coating liquid. Furthermore, the object to be treated is lifted out of the coating liquid. Then, the object to be treated is heated for several hours. The heating temperature at this time is about 100 degrees and below 200 degrees. As a result, the silicone-containing polyimide is cured and the solvent evaporates. As a result, an organic film 16A is formed on the outer surface S1 of the sealing material 15.

[0047] Next, a second film-forming process S14 is performed. In this process, a first barrier film 16B is formed on the object to be processed using an atomic layer deposition (ALD) method. This forms a first barrier film 16B with alumina as the main component on the outer surface S2 of the organic film 16A and a portion of the outer surface of each external terminal 13. Furthermore, as described above, the shielding area M of each external terminal 13 is covered by a shielding strip. Therefore, the first barrier film 16B is not formed on the shielding area M of each external terminal 13. On the other hand, the organic film 16A only covers a portion of the base end side of each external terminal 13. Therefore, in the stage immediately preceding the second film-forming process S14, there are exposed portions of each external terminal 13 between the sealing material 15 and the shielding area M. The first barrier film 16B is also formed on these exposed portions of each external terminal 13.

[0048] Next, the third film-forming process S15 is performed. In the third film-forming process S15, the second barrier film 16C is formed on the object to be processed by a so-called chemical vapor deposition (CVD) method. In this embodiment, the second barrier film 16C is formed by a thermal CVD method that forms a film on the object to be processed through a chemical reaction at high temperature. Thus, a second barrier film 16C with parylene as the main component is formed on the outer surface S3 of the first barrier film 16B. Furthermore, similar to the case of the first barrier film 16B, the second barrier film 16C is not formed on the shielding area M of each external terminal 13.

[0049] Next, a masking removal process S16 is performed. In the masking removal process S16, the masking strips installed in the masking process S12 are removed from each external terminal 13. As a result, the masked area M of each external terminal 13 is directly exposed to the outside, and the electronic component 10 is manufactured. Furthermore, the exposed portions of each external terminal 13 are connected to electrodes on the substrate, for example, by solder.

[0050] <Effects of the First Implementation>

[0051] The electronic component 10 according to the first embodiment has the following effects.

[0052] (1-1) For the first barrier film 16B, a barrier performance corresponding to its average film thickness is expected. However, in the first barrier film 16B, there are sometimes extremely thin regions compared to the average film thickness. In this case, the barrier performance is low in the regions where the film thickness Tb is thin, and therefore, the first barrier film 16B as a whole sometimes fails to achieve the barrier performance expected according to the average film thickness. In particular, this phenomenon is significant when the average film thickness of the first barrier film 16B is small.

[0053] Regarding this, in the first embodiment described above, the minimum value of the film thickness Tb of the first barrier film 16B is 15 nm or more, and the maximum value of the film thickness Tb of the first barrier film 16B is 65 nm or less. That is, the first barrier film 16B is a thin film with a film thickness Tb of 65 nm or less, and at least 15 nm or more is ensured as the film thickness Tb. Therefore, the possibility of obtaining barrier properties corresponding to its average film thickness as the barrier property of the first barrier film 16B is increased.

[0054] Furthermore, generally speaking, the larger the film thickness Tb, the better the barrier properties of the first barrier film 16B. However, if the film thickness Tb is close to 65 nm, the rate of improvement in barrier properties decreases and reaches its peak. Moreover, if the film thickness Tb exceeds 65 nm, the barrier properties of the first barrier film 16B actually decrease. Therefore, in the first embodiment described above, the film thickness of the first barrier film 16B is within a preferred range that allows for high barrier properties.

[0055] (1-2) In the first embodiment, the organic film 16A and the first barrier film 16B cover the ridge portion 12D of the blank 12. The ridge portion 12D is the portion corresponding to the so-called corner of the blank 12. By covering the ridge portion 12D of the blank 12 with the organic film 16A, the corner of the blank 12 becomes a shape that is chamfered to a certain extent by the organic film 16A. By having the first barrier film 16B on the organic film 16A, the portion of the first barrier film 16B covering the ridge portion 12D is prevented from becoming extremely thin, and the film thickness Tb becomes extremely small.

[0056] (1-3) In the first embodiment, a sealing material 15 made of synthetic resin is provided between the component body 11 and the organic film 16A. This sealing material 15 also prevents moisture and the like from seeping into the component body 11.

[0057] (1-4) In the first embodiment, there is a boundary BL between the portion of the outer surface of each external terminal 13 covered by the sealing material 15 and the portion not covered by the sealing material 15. At this boundary BL, the possibility of moisture or the like penetrating through the interface between the outer surface of the external terminal 13 and the sealing material 15 cannot be ruled out. In the first embodiment, the organic film 16A and the first barrier film 16B cover this boundary BL, thus preventing moisture or the like from penetrating through this boundary BL.

[0058] (1-5) In the first embodiment, the average thickness of the first barrier film 16B is 50 nm or less, and is smaller than the average thickness of the organic film 16A. In other words, the first barrier film 16B is a very thin film. Therefore, it is possible to suppress the situation where the overall size of the electronic component 10 increases due to the presence of the first barrier film 16B.

[0059] (1-6) In the first embodiment, a second barrier film 16C is further provided, covering the outer surface S3 of the first barrier film 16B. As a result, an interface is formed within the protective film 16 between the first barrier film 16B and the second barrier film 16C. If such an interface exists, even if moisture or the like permeates into the second barrier film 16C, the moisture or the like spreads at the interface and does not easily permeate further into the first barrier film 16B. That is, in addition to the barrier properties of the second barrier film 16C itself, the improved barrier properties resulting from the interface between the two barrier films can also be expected.

[0060] (1-7) In the first embodiment, the surface roughness of the outer surface S2 of the organic film 16A is smaller than the surface roughness of the outer surface S1 of the sealing material 15. That is, the organic film 16A further flattens the surface irregularities of the sealing material 15. Moreover, if the first barrier film 16B is formed on the flat outer surface S2 of the organic film 16A, the deviation of the film thickness Tb at each part of the first barrier film 16B can be suppressed.

[0061] (1-8) In the first embodiment, atomic layer deposition is used as the film-forming method in the second film-forming step S14. Atomic layer deposition can produce a dense and thin film with a uniform film thickness. That is, it is particularly preferred as the film-forming method for the first barrier film 16B.

[0062] (1-9) In the first embodiment, chemical vapor deposition (CVD) is used as the film-forming method in the third film-forming step S15. CVD readily produces films that are thicker than atomic layer deposition (ALD). Therefore, it is particularly preferred as a film-forming method for obtaining a thick second barrier film 16C with high barrier properties.

[0063] <Structure of the Second Embodiment>

[0064] An embodiment of the packaging component 20, which serves as an electronic module, will be described. Furthermore, for structures shared with the first embodiment in the second embodiment, the same reference numerals are sometimes used, and descriptions are sometimes omitted or simplified.

[0065] like Figure 5 As shown, the encapsulation component 20 includes a wiring substrate 21 as a specific component, a solder resist 22 as a sealing material, and a resin molded body 23.

[0066] The wiring substrate 21 also includes a substrate body 21A and a plurality of wirings 21B. The substrate body 21A is plate-shaped. The substrate body 21A is made of insulating synthetic resin such as phenolic resin or epoxy resin. Each wiring 21B is located on the first main surface S5 of the substrate body 21A. Each wiring 21B is made of conductive metal. Therefore, the wiring 21B is a metal component. Although not shown in the figure, the wiring substrate 21 has a plurality of wirings inside the substrate body 21A and on the second main surface S6 on the side opposite to where the wirings 21B are located. The aforementioned wirings 21B are connected to the wirings on the second main surface S6 via wirings inside the substrate body 21A. Furthermore, the wiring substrate 21 is sometimes referred to as a printed circuit board, etc.

[0067] The solder resist 22 is made of insulating synthetic resin. The solder resist 22 covers the first main surface S5 of the substrate body 21A and a portion of the wiring 21B. Specifically, the solder resist 22 covers the entire area of ​​the first main surface S5 of the substrate body 21A where the wiring 21B does not exist. Additionally, as... Figure 6 As shown, solder resist 22 covers a portion of the outer surface of the wiring 21B, including the outer edge of the wiring 21B, at the end of the wiring 21B. Therefore, the wiring 21B has a portion that is not covered by solder resist 22.

[0068] like Figure 5As shown, the resin molded body 23 is located on the second main surface S6 of the substrate body 21A. Although not shown in the figure, the resin molded body 23 is composed of various components mounted on the second main surface S6 of the substrate body 21A and an insulating synthetic resin covering these components. The resin molded body 23 is generally cuboid in shape. The various components of the resin molded body 23 are connected to the wiring 21B on the first main surface S5 via wiring on the second main surface S6 and wiring inside the substrate body 21A.

[0069] like Figure 5 As shown, the encapsulation component 20 includes a protective film 16. The protective film 16 covers the outer surface of the resin molded body 23. Furthermore, the protective film 16 covers a portion of the outer surface of the wiring 21B in the wiring substrate 21, and the outer surface of the solder resist 22. More specifically, the protective film 16 covers the boundary BL between the portion of the outer surface of the wiring 21B covered by the solder resist 22 and the portion not covered by the solder resist 22. On the other hand, the protective film 16 does not cover a portion of the outer surface of the wiring 21B. Moreover, the portion of the wiring 21B not covered by the protective film 16 functions as a terminal for electrically connecting other electronic components, substrates, etc.

[0070] like Figure 6 As shown, the protective film 16 comprises, sequentially from the object side covered by the protective film 16, an organic film 16A, a first barrier film 16B, and a second barrier film 16C. The thickness relationship and surface roughness relationship of each of these protective films 16 are the same as those in the first embodiment.

[0071] <Effects of the Second Implementation>

[0072] The packaging component 20 according to the second embodiment has the following effects in addition to the same effects as (1-1), (1-5) to (1-9) of the first embodiment.

[0073] (2-1) In the second embodiment, there is a boundary BL between the portion of the outer surface of the wiring 21B covered by the solder resist 22 and the portion not covered by the solder resist 22. At this boundary BL, the possibility of moisture or the like penetrating through the interface between the outer surface of the wiring 21B and the solder resist 22 cannot be ruled out. In the second embodiment, the protective film 16 covers this boundary BL, thus preventing moisture or the like from penetrating through this boundary BL.

[0074] <Structure of the Third Embodiment>

[0075] An embodiment of the mounting substrate 30, which serves as an electronic module, will be described. Here, "mounting substrate" refers to any substrate on which electronic components, chips, etc., are mounted. Furthermore, structures shared with the first embodiment in the third embodiment are sometimes omitted or simplified in description due to the same reference numerals.

[0076] like Figure 7 As shown, the mounting substrate 30 includes a wiring substrate 31 as a specific component, a solder resist 32 as a sealing material, an electronic component 33, and a bonding material 35.

[0077] The wiring substrate 31 also includes a substrate body 31A and multiple wirings 31B. The substrate body 31A is plate-shaped. The substrate body 31A is made of insulating synthetic resins such as phenolic resin and epoxy resin, or silicon. Each wiring 31B is located on the main surface S7 of the substrate body 31A. Each wiring 31B is made of conductive metal. Therefore, the wiring 31B is a metal component.

[0078] The solder resist 32 is made of insulating synthetic resin. The solder resist 32 covers the main surface S7 of the substrate body 31A and a portion of the wiring 31B. Specifically, the solder resist 32 covers the entire area of ​​the main surface S7 of the substrate body 31A where the wiring 31B does not exist. Additionally, as... Figure 8 As shown, solder resist 32 covers a portion of the outer surface of the wiring 31B, including the outer edge of the wiring 31B, at the end of the wiring 31B. Therefore, the wiring 31B has a portion not covered by solder resist 32. The portion of the wiring 31B not covered by solder resist 32 functions as a terminal for electrically connecting electronic components 33, etc.

[0079] like Figure 7 As shown, electronic component 33 is mounted on wiring substrate 31. Specifically, bonding material 35 bonds the external terminals of electronic component 33 to the terminal portions of wiring 31B that are not covered by solder resist 32. Furthermore, in Figure 7 The external terminals of the electronic component 33 are omitted from the illustration. The bonding material 35 is a conductive adhesive or solder. The electronic component 33 is separated from the solder resist 32 on the wiring substrate 31. Therefore, a small gap is generated between the electronic component 33 and the solder resist 32. Furthermore, the electronic component 33 here may have an independent protective film 16, like the electronic component 10 in the first embodiment, or it may not have a protective film 16.

[0080] like Figure 7As shown, the mounting substrate 30 includes a protective film 16. The protective film 16 covers the outer surface of the electronic component 33. More specifically, the protective film 16 covers the entire area of ​​the outer surface of the electronic component 33 where the bonding material 35 is not present. Additionally, the protective film 16 covers the entire area of ​​the outer surface of the wiring 31B where neither the solder resist 32 nor the bonding material 35 is present. The protective film 16 covers the entire area of ​​the outer surface of the solder resist 32. As a result, the protective film 16 covers the boundary BL between the portion of the outer surface of the wiring 31B covered by the solder resist 32 and the portion not covered by the solder resist 32. Furthermore, the protective film 16 covers the entire area of ​​the side surface of the bonding material 35. Thus, the protective film 16 covers the entire exposed area of ​​the wiring 31B of the wiring substrate 31, the surface of the solder resist 32 on the electronic component 33 side, the electronic component 33, and the outer surface of the bonding material 35.

[0081] like Figure 8 As shown, the protective film 16 comprises, sequentially from the object side covered by the protective film 16, an organic film 16A, a first barrier film 16B, and a second barrier film 16C. The thickness relationship and surface roughness relationship of each of these protective films 16 are the same as those in the first embodiment.

[0082] <Effects of the Third Implementation>

[0083] According to the mounting substrate 30 of the third embodiment, in addition to the same effects as those of (1-1), (1-5) to (1-9) of the first embodiment, the following effects are achieved.

[0084] (3-1) In the third embodiment, there is a boundary BL between the portion of the outer surface of the wiring 31B covered by the solder resist 32 and the portion not covered by the solder resist 32. At this boundary BL, the possibility of moisture or the like penetrating through the interface between the outer surface of the wiring 31B and the solder resist 32 cannot be ruled out. In the third embodiment, the protective film 16 covers this boundary BL, thus preventing moisture or the like from penetrating through this boundary BL.

[0085] (3-2) In the third embodiment, the portion of the outer surface of the electronic component 33 opposite to the solder resist 32, and the portion of the outer surface of the solder resist 32 opposite to the electronic component 33, are also covered by the protective film 16. Furthermore, the side surfaces of the bonding material 35 are also covered by the protective film 16. As a result, the wiring substrate 31, the solder resist 32, the electronic component 33, and the bonding material 35 are all covered by a continuous protective film 16. By covering the entire structure with such a continuous protective film 16, high barrier properties can be achieved.

[0086] <Structure of the Fourth Embodiment>

[0087] An embodiment of the crystal oscillator 40 as an electronic module will be described. Furthermore, structures shared with the first embodiment in the fourth embodiment are sometimes omitted or simplified in description due to the same reference numerals.

[0088] like Figure 9 As shown, the crystal oscillator 40 includes a ceramic substrate 41 as a first component, a crystal element 42, a metal cap 43 as a second component, and an adhesive 45. These ceramic substrate 41, crystal element 42, metal cap 43, and adhesive 45 constitute the oscillator body 40A as a specific component.

[0089] The ceramic substrate 41 also includes a substrate body 41A and a plurality of wirings 41B. The substrate body 21A is plate-shaped. The substrate body 21A is made of ceramic, specifically silicon. Each wiring 41B is located on a first main surface S8 of the substrate body 21A. Each wiring 41B is made of a conductive metal. Although not shown in the figure, the ceramic substrate 41 has a plurality of wirings inside the substrate body 41A and on a second main surface S9 on the side opposite to where the wirings 41B are located. The aforementioned wirings 41B are connected to the wirings on the second main surface S9 via wirings inside the substrate body 41A.

[0090] The crystal element 42 is a device that emits a signal of a predetermined frequency by utilizing the piezoelectric effect of a crystal. In addition, sometimes peripheral circuits for supplying power to the crystal element 42 are mounted on the substrate body 41A of the ceramic substrate 41.

[0091] One example of the material used for the metal cover 43 is stainless steel or aluminum alloy. The metal cover 43 is a box-shaped structure with one side closed. In other words, the metal cover 43 is a box-shaped structure with a bottom. The opening of the metal cover 43 faces the ceramic substrate 41. The metal cover 43 surrounds the crystal element 42 from the outside.

[0092] like Figure 10 As shown, the opening edge 43A of the metal cover 43 is bonded to the second main surface S9 of the substrate body 41A. Specifically, adhesive 45 bonds the opening edge 43A of the metal cover 43 to the second main surface S9 of the substrate body 41A. Adhesive 45 covers the entire area of ​​the opening edge 43A of the metal cover 43. The adhesive 45 is made of synthetic resin.

[0093] like Figure 9 As shown, the crystal oscillator 40 includes a protective film 16. The protective film 16 covers the entire area of ​​the substrate body 41A that is not surrounded by the metal cover 43. Furthermore, the protective film 16 does not cover a portion of the wiring 41B. The portion of the wiring 41B not covered by the protective film 16 functions as a terminal for electrical connection to the substrate, etc.

[0094] Furthermore, the protective film 16 covers the entire area of ​​the outer surface of the metal cover 43. Also, the protective film 16 covers the side of the adhesive 45 opposite to the space S defined by the metal cover 43. Therefore, the protective film 16 covers the boundary BL between the portion of the metal cover 43 covered by the adhesive 45 (i.e., the opening edge 43A) and the portion not covered by the adhesive 45. Additionally, the protective film 16 covers the boundary BL between the portion of the second main surface S9 of the ceramic substrate 41 covered by the adhesive 45 and the portion not covered by the adhesive 45. Thus, the protective film 16 covers not only a portion of the outer surface of the wiring 41B, but also the entire area of ​​the ceramic substrate 41, the metal cover 43, and the side of the adhesive 45 opposite to the space S.

[0095] like Figure 10 As shown, the protective film 16 comprises, sequentially from the object side of the laminated protective film 16, an organic film 16A, a first barrier film 16B, and a second barrier film 16C. The thickness relationship and surface roughness relationship of each of these protective films 16 are the same as those in the first embodiment.

[0096] <Effects of the Fourth Implementation>

[0097] The crystal oscillator 40 according to the fourth embodiment has the following effects in addition to the same effects as (1-1), (1-5) to (1-9) of the first embodiment.

[0098] (4-1) In the fourth embodiment, there exists a boundary BL between the portion of the outer surface of the metal cover 43 covered by the adhesive 45 (i.e., the opening edge 43A) and the portion not covered by the adhesive 45. At this boundary BL, the possibility of moisture or the like penetrating through the interface between the outer surface of the metal cover 43 and the adhesive 45 cannot be ruled out. In the fourth embodiment, the protective film 16 covers this boundary BL, thus preventing moisture or the like from penetrating through this boundary BL. Similarly, the protective film 16 covers the boundary BL between the portion of the second main surface S9 of the ceramic substrate 41 covered by the adhesive 45 and the portion not covered by the adhesive 45. Therefore, moisture or the like is prevented from penetrating through this boundary BL in the ceramic substrate 41.

[0099] <Example of Change>

[0100] The above-described embodiments and the following modifications can be implemented in combination with each other within a technically compatible scope.

[0101] The electronic module using the protective film 16 is not limited to the cases illustrated in the first to fourth embodiments. The technology of the protective film 16 described above can be applied to various structures such as passive components, active components, substrates, mounting substrates that combine them, and assemblies that integrate multiple mounting substrates.

[0102] In the first embodiment, the material and shape of the blank 12 are merely examples. For instance, the blank 12 may be cylindrical or have other shapes. Furthermore, depending on the shape of the blank 12, it may not have a defined ridge 12D. Even with a blank 12 that does not have such a ridge 12D, the protective film 16 technique described in the above embodiment can still be applied. Furthermore, in the first embodiment, the shape and number of the external terminals 13 can be appropriately changed.

[0103] In the protective film 16 of the first embodiment, the edges of the organic film 16A, the first barrier film 16B, and the second barrier film 16C may not be the same. For example, a portion of the first barrier film 16B may extend outward relative to the organic film 16A, and the edge of the first barrier film 16B may be located inward relative to the edge of the organic film 16A. The same applies to the other films. With the edges of each film staggered in this way, masking and mask removal can be performed according to the film-forming process of each film.

[0104] • In the first embodiment, the edge of the sealing material 15 may also coincide with the edge of the protective film 16. In the case where a portion of each external terminal 13 is shielded during the manufacturing process, as in the first embodiment, the edge of the sealing material 15 coincides with the edge of the protective film 16 as long as the sealing material 15 is formed to the shielded portion.

[0105] • In the first embodiment, the sealing material 15 may be omitted. In this case, the protective film 16 directly covers the blank 12 of the component body 11. In addition, in this variation, it is preferable that the surface roughness of the outer surface S2 of the organic film 16A is smaller than the surface roughness of the outer surface of the blank 12, which is the surface covered by the organic film 16A of the protective film 16 and the surface in contact with the organic film 16A.

[0106] The material of the organic membrane 16A is not limited to the material exemplified in the above embodiments, as long as an organic component is used as the main component, and can be appropriately changed. The material can be appropriately selected corresponding to the barrier properties required as the organic membrane 16A.

[0107] • The surface roughness of the outer surface S2 of the organic film 16A can also be the same as, or greater than, the surface roughness of the surface covered by the organic film 16A.

[0108] The material of the first barrier film 16B is not limited to the material exemplified in the above embodiments, as long as an inorganic component is used as the main component, and can be appropriately changed. The material can also be appropriately selected in accordance with the barrier properties required for the first barrier film 16B. However, from the viewpoint of ensuring insulation against the external terminal 13, insulating components are preferred among the inorganic components.

[0109] The material of the second barrier membrane 16C is not limited. However, regarding barrier properties against components different from those blocked by the first barrier membrane 16B, it is preferable that the material of the second barrier membrane 16C is different from that of the first barrier membrane 16B. However, even if the material of the second barrier membrane 16C is the same as that of the first barrier membrane 16B, an interface is still formed between the two barrier membranes. Therefore, even with the same material, a structure having both the first barrier membrane 16B and the second barrier membrane 16C may result in improved barrier properties.

[0110] • The second barrier membrane 16C can also be omitted. Alternatively, the barrier properties achievable by the organic membrane 16A and the first barrier membrane 16B can be considered, and the presence or absence of the second barrier membrane 16C can be chosen.

[0111] The protective film 16 may also have other barrier layers on the outside of the second barrier film 16C. For example, the first barrier film 16B and the second barrier film 16C on its outer side may be configured as a set of multilayer barrier layers. Multiple sets of such multilayer barrier layers may also be sequentially provided from the organic film 16A side. Specifically, as... Figure 11 As shown, the protective film 16 may also have an organic film 16A, a first barrier film 16B, a second barrier film 16C, a first barrier film 116B, and a second barrier film 116C sequentially stacked from the sealing material 15 side. Furthermore, in Figure 11 In this example, a five-layer protective film 16 is described as a variation of the first embodiment, but the protective film 16 can also be modified in other embodiments in the same way.

[0112] In addition to the first barrier film 16B, other barrier films made of the same material as the first barrier film 16B may also exist. Furthermore, other barrier films made of the same material as the first barrier film 16B may directly cover the first barrier film 16B. In this case, the inner portion at the interface between the first barrier film 16B and other barrier films is "the first barrier film 16B that directly covers the organic film 16A". Additionally, barrier films of a different type than the first barrier film 16B and the second barrier film 16C may also exist.

[0113] The average thickness of the first barrier film 16B is not limited to 50 nm or less as illustrated in the first embodiment. Furthermore, the minimum value of the film thickness Tb of the first barrier film 16B is 15 nm or more, and the maximum value of the film thickness Tb of the first barrier film 16B is 65 nm or less. Therefore, the average thickness of the first barrier film 16B can be between 15 nm and 65 nm.

[0114] • The average thickness of the first barrier membrane 16B may not necessarily be smaller than the average thickness of the organic membrane 16A and the average thickness of the second barrier membrane 16C. In other words, the average thickness of the organic membrane 16A and the average thickness of the second barrier membrane 16C may also be smaller than the average thickness of the first barrier membrane 16B.

[0115] The measurement methods for the average film thickness, film thickness, minimum and maximum film thickness, and surface roughness of each film in the first embodiment are merely illustrative. As long as a standardized measurement method exists, determined by various organizations or industry, that method can be used. Alternatively, measurement methods conventionally used according to the specifications of the device can also be employed.

[0116] The manufacturing method of the electronic module, particularly the film-forming method of the protective film 16, is not limited to the manufacturing method illustrated in the above embodiments. For example, in each of the first film-forming step S13 to the third film-forming step S15, a method other than that illustrated in the above embodiments may be used to form the film. In addition, two or more steps selected from the first film-forming step S13 to the third film-forming step S15 may be the same film-forming method.

[0117] Furthermore, the masking process S12 can be omitted. In this case, for example, a portion of the protective film 16 covering each external terminal 13 can be removed by etching, thereby exposing a portion of the outer surface of the external terminal 13.

[0118] The structure of the packaging component 20 in the second embodiment is an example and can be appropriately modified. For example, multiple resin molded bodies 23 may exist on the same wiring substrate 21.

[0119] In the second embodiment, the solder resist 22, which serves as a sealing material, may be omitted. In this case, the protective film 16 directly covers the first main surface S5 of the substrate body 21A. Furthermore, in this modified embodiment, it is preferable that the surface roughness of the outer surface S2 of the organic film 16A is smaller than the surface roughness of the first main surface S5 of the substrate body 21A, which is the surface covered by the organic film 16A of the protective film 16 and the surface in contact with the organic film 16A.

[0120] The structure of the mounting substrate 30 in the third embodiment is an example and can be appropriately modified. For example, multiple electronic components 33 may be mounted on the same wiring substrate 31. Furthermore, electronic components 33 may be mounted not only on the main surface S7 of the wiring substrate 31, but also on the main surface opposite to the main surface S7. In addition, the packaging component 20 of the second embodiment may be mounted instead of the electronic component 33, or on the basis of the electronic component 33.

[0121] In the third embodiment, the electronic component 33 may also be sealed from the outside with synthetic resin. In this case, for the electronic component 33 covered by the protective film 16, there may be synthetic resin on the outside, or there may be a protective film 16 to cover the synthetic resin sealing the electronic component 33.

[0122] • In the third embodiment, the solder resist 32, which is a sealing material, may be omitted. In this case, the protective film 16 directly covers the main surface S7 of the substrate body 31A. In addition, in this variation, it is preferable that the surface roughness of the outer surface S2 of the organic film 16A is smaller than the surface roughness of the main surface S7 of the substrate body 31A, which is the surface covered by the organic film 16A of the protective film 16 and the surface in contact with the organic film 16A.

[0123] Regarding the fourth embodiment, if the metal cover 43 is bonded to the ceramic substrate 41, the above-mentioned technology regarding the protective film 16 can also be applied to components different from the crystal oscillator 40.

[0124] • The portion covered by the protective film 16 can be appropriately varied depending on the embodiment. For example, in the first embodiment, the protective film 16 may only cover the outer surface of the blank 12, or only the outer surface of the external terminal 13. Furthermore, it is preferable that the boundary portions of different components are covered by the protective film 16, as shown by the boundary BL in each embodiment.

[0125] <Postscript>

[0126] This document records the technical concepts that can be grasped based on the above-described implementation methods and variations.

[0127] [1] An electronic module comprising: a specific component; an organic film covering the outer surface of the specific component, wherein an organic component is a main component; and a first barrier film covering the organic film, wherein an inorganic component is a main component, wherein the minimum thickness of the first barrier film is 15 nm or more, and the maximum thickness of the first barrier film is 65 nm or less.

[0128] [2] According to the electronic module described in [1], the specific component has a first plane, a second plane that is adjacent to the first plane and extends in a direction that intersects the first plane as part of the outer surface, and the organic film and the first barrier film cover the ridge portion between the first plane and the second plane.

[0129] [3] According to the electronic module described in [1] or [2], there is a sealing material made of synthetic resin between the specific component and the organic membrane.

[0130] [4] According to the electronic module described in [3], the specific component has a metal component, the sealing material covers a portion of the outer surface of the metal component, and the organic film and the first barrier film cover the boundary between the portion of the metal component covered by the sealing material and the portion not covered by the sealing material.

[0131] [5] According to any one of the electronic modules described in [1] to [4], wherein the average thickness of the first barrier film is less than 50 nm and is smaller than the average thickness of the organic film.

[0132] [6] According to any one of [1] to [5], the electronic module further comprises a second barrier film covering the outer surface of the first barrier film.

[0133] [7] According to any one of [1] to [6], the surface roughness of the outer surface of the organic film is smaller than the surface roughness of the surface covered by the organic film and the surface in contact with the organic film.

[0134] [8] According to any one of [1] to [5], the specific component further comprises a first component and a second component bonded to the first component via an adhesive, wherein the organic film and the first barrier film cover the first component, the second component, and the adhesive.

[0135] [9] A method for manufacturing an electronic module, comprising: a first film-forming step, wherein an organic film, in which an organic component is the main component, is formed on the outer surface of a specific component; and a second film-forming step, wherein a first barrier film, in which an inorganic component is the main component, is formed on the outer surface of the organic film by atomic layer deposition, wherein the first barrier film is formed in the second film-forming step such that the minimum thickness of the first barrier film is 15 nm or more and the maximum thickness of the first barrier film is 65 nm or less.

[0136]

[10] According to the manufacturing method of the electronic module described in [9], there is also a third film forming step, in which a second barrier film with parylene as the main component is formed on the outer surface of the first barrier film by chemical vapor deposition.

[0137] Explanation of reference numerals in the attached figures

[0138] 11…Component body; 16…Protective film; 16A…Organic film; 16B…First barrier film; 16C…Second barrier film; 21…Wired board; 31…Wired board; 40…Oscillator body.

Claims

1. An electronic module, wherein, have: Specific components; An organic membrane, covering the outer surface of the aforementioned specific components, uses organic components as the main component; and The first barrier membrane directly covers the aforementioned organic membrane, using inorganic components as the main component. The minimum thickness of the first barrier film is 15 nm or more, and the maximum thickness of the first barrier film is 65 nm or less.

2. The electronic module according to claim 1, wherein, The aforementioned specific component has a first plane and a second plane that is adjacent to the first plane and extends in a direction intersecting the first plane as part of the aforementioned outer surface. The aforementioned organic film and the aforementioned first barrier film cover the ridge portion between the aforementioned first plane and the aforementioned second plane.

3. The electronic module according to claim 1 or 2, wherein, A sealing material with synthetic resin as the main component is provided between the aforementioned specific component and the aforementioned organic membrane.

4. The electronic module according to claim 3, wherein, The aforementioned specific components have metal parts. The aforementioned sealing material covers a portion of the outer surface of the aforementioned metal component. The aforementioned organic film and the aforementioned first barrier film cover the boundary between the portion of the aforementioned metal component covered by the aforementioned sealing material and the portion not covered by the aforementioned sealing material.

5. The electronic module according to any one of claims 1 to 4, wherein, The average thickness of the first barrier film is less than 50 nm and is smaller than the average thickness of the organic film.

6. The electronic module according to any one of claims 1 to 5, wherein, It also has a second barrier film covering the outer surface of the first barrier film.

7. The electronic module according to any one of claims 1 to 6, wherein, The surface roughness of the outer surface of the organic film is smaller than the surface roughness of the surface covered by the organic film and the surface in contact with the organic film.

8. The electronic module according to any one of claims 1 to 5, wherein, The aforementioned specific component also includes a first component and a second component joined to the first component via an adhesive. The aforementioned organic film and the aforementioned first barrier film cover the aforementioned first component, the aforementioned second component, and the aforementioned adhesive.

9. A method for manufacturing an electronic module, wherein, have: The first film-forming process involves forming an organic film, with organic components as the main components, on the outer surface of a specific component. as well as In the second film-forming process, an inorganic component-based first barrier film is formed on the outer surface of the aforementioned organic film using an atomic layer deposition method. In the second film-forming process described above, the first barrier film is formed such that the minimum thickness of the first barrier film is 15 nm or more and the maximum thickness of the first barrier film is 65 nm or less.

10. The method for manufacturing an electronic module according to claim 9, wherein, It also has a third film-forming process, in which a second barrier film with parylene as the main component is formed on the outer surface of the first barrier film by chemical vapor deposition.

Images