Conductive sheet and method for producing same, and conductive molded article and method for producing same

Abstract

The invention relates to a conductive sheet and a method for manufacturing the same, and a conductive molded article and a method for manufacturing the same. Provided is a conductive sheet having improved degree of freedom in design. A conductive sheet (10) is provided with: a base sheet (11) having an opening (13); a conductive wire (21) affixed to one surface of the base sheet (11) so as to overlap with at least a part of the opening (13); and an electrode member (12) provided on one surface or the other surface of the base sheet (11) so as to cover at least a part of the opening (13), the conductive lead wire (21) being electrically connected to the electrode member (12) at the opening (13).

Description

Technical Field

[0001] This invention relates to conductive sheets, and in particular, to conductive sheets used in vehicle heaters and methods for manufacturing the same. Background Technology

[0002] Previously, it was known to utilize the heat generated by supplying power to conductive wires as a heater. The conductive sheet includes conductive wires fixed on a substrate sheet and electrode components electrically connected to the conductive wires.

[0003] For example, Patent Document 1 describes a thin-film heater that flexibly uses ultrasonic welding to embed conductive wires into a support sheet.

[0004] Patent Document 1: Japanese Patent No. 7121513 Summary of the Invention

[0005] The invention described in Patent Document 1 requires consideration of the effects of heat when electrically connecting the conductive wire to the metal plate, the pressure applied to the conductive wire when fixing it to other molded articles, and the conditions during injection molding, making it difficult to design freely.

[0006] This invention was made to solve the aforementioned technical problems, and its purpose is to provide a conductive sheet that increases the degree of design freedom.

[0007] One aspect of the present invention relates to a conductive sheet comprising: a substrate sheet having an opening; a conductive wire fixed to one side of the substrate sheet such that it overlaps with at least a portion of the opening; and an electrode component disposed on one or the other side of the substrate sheet such that it covers at least a portion of the opening, wherein the conductive wire is electrically connected to the electrode component at the opening.

[0008] When configured in this way, since the substrate sheet has an opening, there is no substrate sheet at the connection point between the conductive wire and the electrode component. Therefore, the conductive wire and the electrode component can be formed on the desired surfaces of both sides of the substrate sheet, increasing design flexibility. Furthermore, since the conductive wire and the electrode component are electrically connected in the opening, i.e., in the area where the substrate sheet is not present, damage to the substrate sheet due to heat during connection can be prevented.

[0009] Preferably, a conductive wire crosses the opening.

[0010] When configured in this way, the end of the conductive wire will not be exposed at the opening. This suppresses positional shift of the conductive wire, enabling a reliable connection between the conductive wire and the electrode component.

[0011] Preferably, the electrode components are disposed on one side of the substrate sheet in a manner that covers the conductive wires.

[0012] Preferably, the substrate sheet has a first region covered by the electrode component at the periphery of the opening and a second region not covered by the electrode component. The conductive wire has an embedded region in the first region that is embedded in one side of the substrate sheet and an exposed region that protrudes from one side of the substrate sheet. The height dimension (t1) of the embedded region of the conductive wire in the first region is the same as or larger than the height dimension (t1') of the embedded region in the second region.

[0013] When configured in this way, the pressure applied to the conductive wires in the first region is dispersed across the substrate due to the increased adhesion between the conductive wires and the substrate, thus the electrode components can suppress the breakage of the conductive wires.

[0014] Preferably, the ratio (t1 / t1') of the height dimension (t1) of the buried area in the first region to the height dimension (t1') of the buried area in the second region is 1.1 or more and 1.8 or less.

[0015] When configured in this way, the adhesion between the conductive wires in the first region and the substrate sheet can be improved, making it less likely for external pressure to be transmitted to the conductive wires. Furthermore, excessive tension on the conductive wires in the first region can be suppressed, increasing the tolerance to external pressure. Therefore, for example, during injection molding, even under strong loads, wire breakage can be prevented by the electrode components.

[0016] Preferably, it further includes an adhesive layer for bonding the electrode component to a first region of the substrate sheet.

[0017] When configured in this way, the pressure applied to the electrode component is dispersed throughout the substrate sheet due to the improved adhesion between the electrode component and the substrate sheet in the first region, thus enabling the electrode component to suppress the breakage of conductive wires.

[0018] Preferably, in the first region, the thickness dimension (t4) of the adhesive layer is larger than the height dimension (t2) of the exposed area of ​​the conductive wire.

[0019] When configured in this way, the conductive wires located in the first region are covered by an adhesive layer, thus the breakage of the conductive wires can be suppressed by the electrode components.

[0020] Preferably, the thickness (t4) of the adhesive layer in the first region is 0.1 mm or more and 0.5 mm or less.

[0021] When configured in this way, the conductive wire located in the first region can be covered by the adhesive layer. Furthermore, when heat or pressure is applied to the conductive sheet, the adhesive layer does not protrude from the first region, thus preventing the adhesion strength between the substrate sheet and the electrode component from weakening.

[0022] Preferably, the height dimension (t1) of the buried area of ​​the conductive wire in the first region is more than 50% and less than 90% of the height dimension (t3) of the conductive wire.

[0023] When configured in this way, since the exposed area of ​​the conductive wire in the first region is reduced, the conductive wire can be prevented from breaking when pressure is applied to the electrode component and the conductive wire from the outside.

[0024] Preferably, the height dimension (t1') of the buried area of ​​the conductive wire in the second region is more than 40% and less than 75% of the height dimension (t3') of the conductive wire.

[0025] When configured in this way, deformation of the substrate sheet caused by stress from the conductive wires can be suppressed.

[0026] One aspect of the present invention relates to a method for manufacturing a conductive sheet, comprising the following steps: a step of preparing a substrate sheet having an opening; a step of fixing a conductive wire to one side of the substrate sheet in such a way that it overlaps with at least a portion of the opening; a step of forming an electrode component on one side of the substrate sheet in such a way that it covers at least a portion of the opening and the conductive wire; and a step of electrically connecting the electrode component and the conductive wire at the opening using heat or ultrasound.

[0027] Another aspect of the present invention relates to a method for manufacturing a conductive sheet, comprising the following steps: a step of preparing a substrate sheet having an opening; a step of forming an electrode component on one side or the other side of the substrate sheet such that it covers at least a portion of the opening; a step of fixing a conductive wire to one side of the substrate sheet such that it overlaps with at least a portion of the opening and the electrode component; and a step of electrically connecting the electrode component and the conductive wire at the opening using heat or ultrasound.

[0028] According to this manufacturing method, the conductive wires and electrode components are connected in the opening, i.e., in the area where the substrate sheet is not present. Thus, the conductive wires and electrode components can be formed on desired surfaces on both sides of the substrate sheet. Furthermore, damage to the substrate sheet due to heat generated during the electrical connection of the conductive wires and electrode components can be prevented.

[0029] A method for manufacturing a resin molded article according to one aspect of the present invention includes the following steps: a step of placing a conductive sheet according to one aspect of the present invention on any cavity surface of an injection molding mold, the injection molding mold having a fixed mold and a movable mold, the movable mold forming a cavity between itself and the fixed mold by closing the mold; a step of closing the injection molding mold; a step of fixing the conductive sheet to the surface of the resin molded article while injecting molten resin into the cavity to form a resin molded article; and a step of opening the injection molding mold and removing the resin molded article.

[0030] This manufacturing method enables the production of conductive molded articles with complex shapes through insert molding and in-mold molding. Furthermore, the reduction in manufacturing steps reduces production costs and shortens production time.

[0031] According to the conductive sheet of the present invention, by providing an opening in the substrate sheet portion that overlaps with the connection portion of the conductive wire and the electrode component, it is possible to have the conductive wire and the electrode component on the desired surface of the substrate sheet on both sides, thereby increasing the degree of design freedom. Attached Figure Description

[0032] Figure 1 This is a top view showing a schematic structure of the conductive sheet according to the first embodiment of the present invention.

[0033] Figure 2 From Figure 1 A cross-sectional view observed along line II.

[0034] Figure 3 From Figure 1 A cross-sectional view observed along line III.

[0035] Figure 4 This is a top view showing a schematic structure of the conductive sheet according to the second embodiment of the present invention.

[0036] Figure 5 From Figure 4 A cross-sectional view observed along the V-line.

[0037] Figure 6 From Figure 4 A cross-sectional view observed along line VI.

[0038] Figure 7 This is a top view showing a schematic structure of the conductive sheet according to the third embodiment of the present invention.

[0039] Figure 8 From Figure 7 A cross-sectional view observed along line A'.

[0040] Figure 9 From Figure 7The cross-sectional view observed along line B'.

[0041] Figure 10 (a) ~ Figure 10 (e) is a top view of a partially enlarged view of the opening in another embodiment of the present invention.

[0042] Figure 11 From Figure 10 The cross-sectional view observed along line VII of (e).

[0043] Figure 12 (a) ~ Figure 12 (c) is a cross-sectional view showing a method for manufacturing a conductive molded article according to an embodiment of the present invention.

[0044] Figure 13 of (a) Figure 13 (b) is a cross-sectional view illustrating a method of manufacturing a conductive molded article according to another embodiment of the present invention.

[0045] Figure 14 This is a top view showing a schematic structure of the conductive sheet according to the fourth embodiment of the present invention.

[0046] Figure 15 It is by Figure 14 A magnified view of a portion of area A shown in the diagram.

[0047] Figure 16 (a) is from Figure 15 A cross-sectional view observed along line C'. Figure 16 (b) is from Figure 15 The cross-sectional view observed along line D'. Figure 16 (c) is from Figure 15 A cross-sectional view observed along line E'. Figure 16 (d) is from Figure 15 The cross-sectional view observed along line F'.

[0048] Figure 17 This is a top view showing a schematic structure of the conductive sheet in a modified example of the present invention. Detailed Implementation

[0049] <About conductive sheets>

[0050] (First Implementation)

[0051] Reference Figure 1 The conductive sheet 10 of the first embodiment includes: a substrate sheet 11 having an opening 13; a conductive pattern 20 formed by conductive wires 21 fixed to one side of the substrate sheet 11; and an electrode member 12 formed on one side of the substrate sheet 11 to cover the opening 13.

[0052] The substrate sheet 11 is rectangular in shape when viewed from above, and includes one side 11a and another side 11b. In this embodiment, a conductive wire 21 is embedded in one side 11a, and a patterned layer 15 is provided on the other side 11b.

[0053] The substrate sheet 11 in this embodiment is formed of a thermoplastic resin, such as polycarbonate resin, ethylene resin, polypropylene resin, polyolefin resin, thermoplastic polyester resin, polyamide resin, polyvinyl chloride, ABS resin, etc. The substrate sheet 11 may also contain two or more of these materials. Furthermore, for example, dispersants, antioxidants, compatibilizers, UV stabilizers, anti-blocking agents, anti-static agents, etc., may be appropriately added to the substrate sheet 11.

[0054] From the viewpoint of good formability, the thickness of the substrate sheet 11 is preferably 100 μm or more and 1000 μm or less, more preferably 375 μm or more and 500 μm or less. If it is 100 μm or more, it is easy to embed the conductive wire 21 using ultrasound. If it is 375 μm or more, it is not easily twisted during processing, and its processability is excellent. If it is 500 μm or less, it is easy to perform molding processing. When it is 1000 μm or more, the conductive sheet becomes easy to break, and it may be difficult to mold the resin molded articles described later.

[0055] In this embodiment, the opening 13 is, for example, a rectangular shape with rounded corners. The size and shape of the opening 13 are not limited as long as it allows for the unimpeded electrical connection of the conductive wire 21 to the electrode component 12 using heat; it can be rectangular, circular, polygonal, or other shapes. Multiple openings 13 can be formed on the substrate sheet 11, and the electrode component 12 can be electrically connected to an external electrical circuit through the opening 13. Furthermore, the electrode component 12 can also be connected to the outside via a conductive adhesive or the like at locations other than the opening.

[0056] The conductive pattern 20 in this embodiment can be patterned in various ways, such as a Z-shape or a vortex shape. For example, refer to... Figure 1 Examples include arrangements with equal spacing along the short side. That is, the conductive pattern 20 of this embodiment is a meandering shape pattern formed by drawing a single line with a wire. Furthermore, the conductive pattern 20 is formed by a single wire, with its end connected to a conductive component.

[0057] The conductive wire 21 forming the conductive pattern 20 is electrically connected to the electrode component 12 at the opening 13 by heat or ultrasound. As a method of "electrical connection by heat" as mentioned herein, welding, resistance welding, thermoforming via anisotropic conductive resin, etc., can be used, but it is not limited to this method.

[0058] Furthermore, the conductive wire 21 is connected to the electrode component 12 at the opening 13. Since the conductive wire 21 and the electrode component 12 are electrically connected at the opening 13, which is not overlapping with the substrate sheet 11 when viewed from above, it is possible to form two components on either the same side or different sides of the substrate sheet, thereby increasing design flexibility. In addition, the heat generated when connecting the two components does not directly affect the substrate sheet 11, thus preventing damage to the substrate sheet 11 due to heat.

[0059] In this embodiment, the conductive wire 21 crosses the opening 13. "Crossing" here means that the conductive wire is arranged such that it passes through any two points along the periphery of the opening. Since the end of the conductive wire 21 is not exposed in the opening 13, positional displacement of the conductive wire 21 can be suppressed, and the conductive wire 21 can be reliably connected to the electrode component 12 in the opening 13.

[0060] The conductive wire 21 in this embodiment is a metal wire made of an alloy containing copper and silver, covered with a black polyurethane-based material. However, the material of the metal wire and the color of the covering are not limited to these. The metal wire can be made of any material that provides good resistance and other properties and is easy to work with during embedding, such as copper or a copper-containing alloy. The covering can be made of any material that provides good insulation and is easy to work with during embedding, such as a polyamide-imide material. The color of the covering can be any color that is not easily visible when fixed to the substrate 11, or it can be the same as the color of the substrate 11 and the pattern layer 15. As a result, the conductive wire 21 fixed to the substrate 11 becomes less visible.

[0061] The diameter of the conductive wire 21 is, for example, 30 μm or more and 300 μm or less, preferably 50 μm or more and 180 μm or less. If the diameter of the conductive wire 21 is 30 μm or more, good heat dissipation characteristics can be obtained from a resistance point of view. If the diameter of the conductive wire 21 is 50 μm or more, wire breakage due to heat during embedding is less likely to occur. If the diameter of the conductive wire 21 is 300 μm or less, the embedding process of the conductive wire 21 becomes easier, and good flexibility can be obtained when forming the conductive pattern 20. If the diameter of the conductive wire 21 is 180 μm or less, the conductive wire 21 becomes less conspicuous.

[0062] The electrode component 12 is a plate-shaped component with a thickness of, for example, 0.05 mm or more and 1.00 mm or less, preferably 0.10 mm or more and 0.30 mm or less. If the thickness of the electrode component 12 is 0.05 mm or more, good rigidity can be ensured for the connection with the conductive wire 21, making it easy to connect the electrode component 12 to the conductive wire 21. If the thickness of the electrode component 12 is 0.10 mm or more, good rigidity and durability can be obtained during connection. If the thickness of the electrode component 12 is 1.00 mm or less, the shape of the electrode component 12 can be prevented from emerging from the surface of the resin molded article and the electrode component 12 can be prevented from peeling off during the processing and use of the conductive sheet 10. If the thickness of the electrode component 12 is 0.30 mm or less, the impact of the thickness of the electrode component 12 on the overall thickness of the conductive sheet 10 can be reduced, allowing the conductive sheet 10 to be made into a thin film.

[0063] Electrode component 12 is electrically connected to an external electrical circuit using well-known methods such as heat, ultrasound, or conductive adhesive. Alternatively, electrode component 12 can also be connected to the outside through opening 13.

[0064] From the viewpoint of obtaining good heat resistance, electrical resistance, and rigidity, the electrode component 12 can be made of various materials, such as conductive materials including phosphor bronze, aluminum, iron, and copper. Furthermore, from the viewpoint of facilitating electrical connection with conductive wires, the electrode component 12 can also be plated with one or more conductive materials selected from silver, tin, nickel, etc. In this embodiment, the phosphor bronze surface of the electrode component 12 is coated with a nickel-based plating layer and a silver plating layer.

[0065] Reference Figure 2 , 3 In this embodiment, the electrode component 12 is fixed to the substrate sheet 11 via an adhesive layer 14. The adhesive layer 14 can be, for example, a thermosetting resin, a UV-curable resin, or a pressure-sensitive adhesive, but is not limited to these. The adhesive layer 14 suppresses positional displacement of the electrode component 12, thereby enabling reliable connection between the conductive wire 21 of the opening 13 and the electrode component 12. Furthermore, in this embodiment, the conductive sheet 10, through the adhesive layer 14, ensures that the electrode component covering the opening 13 is tightly adhered to the opening 13 of the substrate sheet 11, thereby improving water resistance and dust resistance.

[0066] In addition, the adhesive layer 14 in this embodiment is only provided on the part where the substrate sheet 11 exists when viewed from above, but it can also be provided in a way that covers the part where the substrate sheet 11 does not exist, that is, part of the opening 13. The opening of the adhesive layer 14 may not be consistent with the opening 13.

[0067] Reference Figure 2 , 3In this embodiment, the substrate sheet 11 has conductive wires 21 and electrode components 12 on one side, and a graphic layer 15 on the other side. The graphic layer 15 is formed, for example, by printing, and can represent appearance designs, operation icons, etc.

[0068] (Second Implementation)

[0069] Reference Figures 4-6 The conductive sheet 10A according to the second embodiment will be described. Since the basic structure of the conductive sheet 10A is the same as that of the conductive sheet 10 of the first embodiment, the differences will be described. The difference lies in the fact that the conductive sheet 10A of the second embodiment has the conductive wire 21A on the electrode member 12A on the side of the substrate sheet 11A, which is different from the conductive sheet 10 of the first embodiment in that the electrode member 12A is provided on the side of the substrate sheet 11A.

[0070] Reference Figure 5 , 6 In the second embodiment, the conductive wires 21A of the conductive sheet 10A are not exposed at the opening 13A. When configured in this way, it is particularly possible to suppress the conductive wires 21A from peeling off or breaking from the electrode member 12A due to external impacts received on the other side of the substrate sheet 11A.

[0071] It should be noted that the adhesive layer 14A in the second embodiment is only provided on the part where the substrate sheet 11A exists when viewed from above, but it can also be provided in a way that covers the part where the substrate sheet 11A does not exist, that is, part or the entire opening 13A.

[0072] (Third implementation method)

[0073] Reference Figures 7-9 The conductive sheet 10B according to the third embodiment will be described. Since the basic structure of the conductive sheet 10B is the same as that of the conductive sheet 10 in the first embodiment, the differences will be described. The conductive wires 21B and electrode components 12B of the conductive sheet 10B are different in that they are disposed on different surfaces of the substrate sheet 11B.

[0074] Reference Figure 8 , 9 In the third embodiment, the conductive wire 21B and the electrode component 12B of the conductive sheet 10B are not connected except at the opening 13B. This prevents the conductive wire 21B from being broken due to external impacts on a portion of the conductive wire 21B or being partially pressed by the electrode component 12B.

[0075] It should be noted that the adhesive layer 14B in the third embodiment is only provided on the part where the substrate sheet 11B exists when viewed from above, but it can also be provided in a way that covers the part where the substrate sheet 11B does not exist, that is, a part of the opening 13B.

[0076] (Regarding variations)

[0077] Furthermore, refer to Figure 10 The structure of the conductive wire 10 in each of the above embodiments, which crosses or enters the opening 13, will be described. Here, "enters" means that one end of the conductive wire passes through a point on the periphery of the opening and is positioned such that it rests on the opening.

[0078] like Figure 10 As shown in (a), the conductive wires 21 of the conductive sheet 10 in each of the above embodiments pass through the opening 13 in a straight line and are fixed to the substrate sheet 11 in such a way that the opposite sides of the rectangular opening 13 are connected.

[0079] In addition, such as Figure 10 (b) Figure 10 As shown in (c), the conductive wires 21 of the conductive sheet 10 in the above embodiments can also be bent across the opening 13. The conductive wires 21 can also be fixed to the substrate sheet 11 by connecting any one or both sides of the rectangular opening 13.

[0080] In addition, such as Figure 10 As shown in (d), one end of the conductive wire 21 can also be positioned to enter the opening 13, i.e., to remain on the opening. In this case, note that the conductive wire 21 needs to enter at least to a length that allows it to be fixed to the electrode member 12 at the opening 13. In particular, when this is applied in the first embodiment, the possibility of the conductive wire breaking is reduced because the number of times the conductive wire 21 is clamped by the electrode member 12 and the substrate sheet 11 is reduced.

[0081] Furthermore, refer to Figure 10 of (e) Figure 11 Alternatively, multiple conductive wires 21 can cross the opening 13. In other words, in each of the above embodiments, multiple conductive wires 21 can cross the opening 13. It should be noted that, for convenience, two conductive wires are shown in the accompanying drawings, but of course, the number of conductive wires crossing can be three or more. When multiple conductive wires 21 are provided on the opening, they can be patterned either so that they do not touch each other, or they can be patterned so that they touch each other in the opening.

[0082] It should be noted that the conductive wires 21 in the above embodiments are fixed to the substrate sheet 11, but other functional layers such as coating layers may also be provided between the conductive wires 21 and the substrate sheet 11.

[0083] It should be noted that the pattern layer 15 in the above embodiments is disposed on the other side of the substrate sheet 11, but depending on the design of the product in which the conductive sheet 10 is disposed, the pattern layer 15 can be disposed on any side.

[0084] Furthermore, the conductive sheet 10 in each of the above embodiments includes an adhesive layer 14, but it is not mandatory to have an adhesive layer 14. Without providing an adhesive layer 14, the thickness of the conductive sheet can be reduced.

[0085] Furthermore, the conductive sheet 10 of the above embodiments is typically used as a wire heater for vehicles, but its application is not particularly limited. The conductive sheet 10 can also be used, for example, in temperature sensors, strain sensors, antennas, etc.

[0086] <Regarding the manufacturing method of conductive sheets>

[0087] Next, the manufacturing method of the conductive sheet 10 according to the first embodiment will be described. First, a substrate sheet 11 having an opening 13 is prepared. In this process, typically, a rolled substrate sheet that has been pre-stamped to form the opening is prepared.

[0088] Next, the conductive wire 21 is fixed to one side of the substrate sheet 11 so as to overlap with at least a portion of the opening 13. In this step, an ultrasonic welding device is used to fix the conductive wire in such a way that it is embedded in the substrate sheet 11. Next, an electrode component 12 is formed on one side of the substrate sheet 11 so as to cover at least a portion of the opening 13 and the conductive wire 21. In this step, the electrode component is prepared and attached to one side of the substrate sheet. At this time, an adhesive layer may also be prepared as needed.

[0089] Finally, at the opening 13, the electrode component 12 is electrically connected to the conductive wire 21 using heat or ultrasound. In this process, various methods are used, such as welding, resistance welding, thermoforming via anisotropic conductive resin, and ultrasonic welding, for example, to perform the connection. This allows the manufacture of a conductive sheet that reliably fixes the conductive wire and electrode component to one side of a substrate sheet.

[0090] According to the manufacturing method of the conductive sheet 10 in the first embodiment, a reliable electrical connection between the conductive component and the conductive wire can be made at the opening. Therefore, since the conductive wire and the conductive component are electrically connected at the opening, i.e., in the area where the substrate sheet is not provided, damage to the substrate sheet due to heat during connection can be prevented.

[0091] (Manufacturing methods for other embodiments)

[0092] Furthermore, manufacturing methods for conductive sheets 10A and 10B in other embodiments will be described. The manufacturing methods for conductive sheets 10A and 10B in other embodiments are basically the same as those for conductive sheet 10, but the points at which conductive wires are provided after the electrode components are placed on the substrate sheet are different.

[0093] like Figure 5 , 6 As shown, according to the manufacturing method of the conductive sheet of this embodiment, conductive wires can also be disposed on the electrode component at the opening. Furthermore, as... Figures 7-9 As shown, conductive wires and electrode components can also be arranged on different surfaces of the substrate. Therefore, since the manufacturing method of this embodiment can form conductive wires and electrode components on desired surfaces of the substrate, it increases design flexibility.

[0094] In the manufacturing methods of the conductive sheets described in the above embodiments, the conductive wires 21 are fixed to the substrate sheet 11 by ultrasonic welding apparatus using ultrasonic embedding processing. However, the method of fixing the conductive wires 21 is not limited to this. The conductive wires 21 can also be fixed to the substrate sheet 11 using heat-resistant adhesives or the like. This eliminates the need for equipment used in ultrasonic embedding processing, thereby reducing equipment costs.

[0095] <About conductive molded products>

[0096] Reference Figure 12 When the surface of the conductive sheet 10 with the pattern layer 15 is designated as the surface side and the surface with the electrode component 12 and the conductive wire 21 is designated as the back side, the conductive molded article 40 has a structure in which a resin molded body 41 is laminated onto the back side of the conductive sheet 10 of the first embodiment. That is, the electrode component 12 and the conductive wire 21 provided on the back side are covered by the resin molded body 41. As a result, the peeling of the electrode component 12 and the conductive wire 21 from the substrate sheet 11 can be suppressed, and the durability, water resistance, and dust resistance of the conductive molded article 40 can be improved.

[0097] The conductive molded article 40 of this embodiment has a resin molded body 41 on the back side of the conductive sheet 10. However, the resin molded body 41 may be provided only on the surface side of the conductive sheet 10 or on both sides.

[0098] Furthermore, the resin molded article 40 of this embodiment includes a conductive sheet 10 and a resin molded body 41. Of course, various layers can be provided according to the desired design and function. For example, an embossed surface layer can be provided on the upper surface of the resin molded body 41, or an adhesive layer can be provided between the conductive sheet 10 and the resin molded body 41.

[0099] <Manufacturing Method of Conductive Molded Articles>

[0100] (First Implementation)

[0101] Next, refer to Figure 12 The manufacturing method of the conductive molded article 40 using the conductive sheet 10 will be described. The manufacturing method of the conductive molded article of this embodiment is characterized by simultaneously performing injection molding and fixing the conductive sheet to the resin molded body.

[0102] Reference Figure 12 (a) First, a conductive sheet 10 is disposed on any cavity surface of an injection molding mold 42, which has a fixed mold 44 and a movable mold 43 that forms a cavity between the fixed mold 44 and the movable mold 43 by mold closing. In this embodiment, the conductive sheet 10 is disposed along the cavity surface of the movable mold 43.

[0103] Next, refer to Figure 12 (b) causes the injection molding mold 42 to close. Mold closing is achieved by moving the movable mold 43. The fixed mold 44 has a resin inlet (not shown) for the inflow of molten resin into the cavity, into which molten resin is injected. Here, a conductive sheet 10 is provided on the cavity surface of the movable mold 43. That is, by injecting molten resin into the cavity, the conductive sheet 10 is fixed to the surface of the resin mold 41 while forming the resin molded body 41.

[0104] Next, refer to Figure 12 (b) Figure 12 (c) The injection molding mold 42 is opened to remove the conductive molded article 40, which has the conductive sheet 10 and the resin molded body 41 fixed on it. The mold opening is performed by moving the movable mold 43.

[0105] The method for manufacturing the conductive molded article 40 according to this embodiment allows for the production of complex shapes of the conductive molded article 40 by simultaneously performing "injection molding" and "fixation of conductive sheets to resin molded bodies" through insert molding and in-mold molding. Furthermore, it can shorten production time.

[0106] (Other implementation methods)

[0107] Next, the manufacturing method of the conductive molded article 40 in other embodiments will be described. The manufacturing method of the conductive molded article in this embodiment is a manufacturing method of bonding a pre-formed conductive sheet 10 and a resin molded body 41.

[0108] Reference Figure 13 (a) A preform 10 is prepared to bend the conductive sheet 10 according to one aspect of the present invention into a desired shape. Simultaneously, a resin molded body 41 having a shape corresponding to the shape of the preform is prepared. Furthermore, the phrase "shape corresponding to the shape of the preform" does not mean that the resin molded body 41 and the preform 10 have the same shape. Specifically, it also includes designs that combine corresponding different shapes.

[0109] Reference Figure 13 (b) A resin molded article 41 is fixed to at least one side of the preform 10, including its surface and back side. In this embodiment, the resin molded article 41 is fixed to the back side of the preform 10. This forms the conductive molded article 40.

[0110] According to the manufacturing method in this embodiment, since injection molding is not performed, the production of molds and fixtures is easier compared to the manufacturing method of the conductive molded article 40 according to Embodiment 1, and the cost of molds and fixtures can be reduced. Furthermore, since there are fewer restrictions on molds and fixtures, the production of large products becomes easier.

[0111] Alternatively, when the resin molded article 41 is fixed to the preform 10, an adhesive layer may be provided between the preform 10 and the resin molded article 41.

[0112] <Fourth Implementation Method>

[0113] Next, refer to Figures 14-16 The conductive sheet 10C according to the fourth embodiment will be described.

[0114] (Regarding structure)

[0115] Reference Figure 14 The substrate sheet 11C according to the fourth embodiment has a first region X1 and a second region X2. The conductive wire 21C has an embedded region and an exposed region. The basic structure of the conductive sheet 10C is the same as that of the conductive sheet 10 according to the first embodiment, but it has features at the points formed by embedding the conductive wire in the substrate sheet.

[0116] In the fourth embodiment, the surface of the substrate sheet 11C is divided into a first region X1, which is covered by the electrode component 12C around the periphery of the opening 13C, and a second region X2, which is not covered by the electrode component 12C. That is, the "first region" is the region covered by the electrode component 12C around the periphery of the opening, and the "second region" is the region on the surface of the substrate sheet 11 that is not covered by the electrode component 12C.

[0117] Reference Figure 15 The electrode component 12C is larger than the opening 13C and is arranged to cover the opening 13C. Preferably, the electrode component 12C is fixed to the substrate sheet 11C with a width dimension of at least 0.5 mm from the periphery of the opening 13C. In other words, in this embodiment, it is preferable that the electrode component 12C is fixed to the substrate sheet 11C, and the first region X1 is formed to surround the periphery of the opening 13C with a width dimension of 0.5 mm or more. This ensures sufficient area for fixing the electrode component 12C to the opening 13C. On the other hand, from an aesthetic design point of view, it is preferable that the first region X1 has a width dimension of 5.0 mm or less from the periphery of the opening 13C.

[0118] In the fourth embodiment, the conductive wire 21C is embedded ultrasonically while applying pressure and tension to the substrate sheet 11C. Specifically, an ultrasonic welding device (not shown) melts one side of the substrate sheet 11C with ultrasound to release the conductive wire 21C, and embeds the conductive wire 21C while applying pressure to one side of the substrate sheet 11C.

[0119] The conductive wire 21C according to the fourth embodiment has an embedded region in a first region, which is embedded in one side of the substrate sheet 11C, and an exposed region, which protrudes from one side of the substrate sheet 11C. Here, "embedded region" means the region where the conductive wire is embedded in the substrate sheet. Furthermore, "exposed region" means the region where the conductive wire protrudes from the substrate sheet.

[0120] (Regarding size)

[0121] Next, in particular, refer to Figure 15 , Figure 16 (c) Figure 16 (d) will describe the dimensions of the conductive sheet involved in this embodiment.

[0122] In the fourth embodiment, the height dimension t1 of the embedded region in the first region X1 of the conductive wire 21C is the same as or greater than the height dimension t1' of the embedded region in the second region X2. The "height dimension of the embedded region" referred to here is the height dimension from the reference plane to the lower end of the embedded conductive wire, with one side of the substrate sheet as the reference plane. Since the conductive wire 21C is embedded deeper in the first region X1 than in the second region X2, the adhesion between the conductive wire 21C in the first region X1 and the substrate sheet 11C is improved, and the pressure applied to the conductive wire 21C is dispersed across the substrate sheet 11C. Therefore, the electrode component 12C can suppress the breakage of the conductive wire 21C.

[0123] The ratio (t1 / t1') of the height dimension t1 of the embedded area of ​​the conductive wire in the first region X1 to the height dimension t1' of the embedded area of ​​the conductive wire in the second region X2 is preferably 1.0 or more and 1.8 or less, more preferably 1.1 or more and 1.8 or less, and even more preferably 1.1 or more and 1.5 or less. If t1 / t1' is 1.0 or more, the adhesion between the conductive wire 21C and the substrate sheet 11C in the first region X1 is improved, thereby suppressing the breakage of the conductive wire 21C. Furthermore, if t1 / t1' is 1.1 or more, the adhesion between the electrode component 12 and the substrate sheet 11C is improved, thereby suppressing the peeling of the electrode component. In addition, if t1 / t1' is 1.8 or less, since the embedding depth of the wire changes slowly from the second region X2 to the first region X1, excessive tension on the wire can be prevented, thus suppressing the breakage of the conductive wire. If t1 / t1' is less than 1.5, a conductive sheet with excellent formability can be obtained.

[0124] The height dimension t1 of the embedded area of ​​the conductive wire in the first region is preferably 50% to 90% of the height dimension t3 of the conductive wire in the first region, more preferably 60% to 80%. The cross-sectional shape of the conductive wire 21C changes slightly due to the pressure and heat during embedding. In this invention, the height dimension of the conductive wire means the maximum dimension in the height direction when viewed in cross-section after embedding. In the first region X1, if the ratio (t1 / t3) of the height dimension of the embedded area of ​​the conductive wire to the height dimension of the conductive wire is 50% or more, the exposed area of ​​the conductive wire 21C in the first region X1 becomes smaller, and when pressure is applied to the electrode component 12C and the conductive wire 21C from the outside, the electrode component 12C can suppress the breakage of the conductive wire 21C. Furthermore, if t1 / t3 is 60% or higher, the height difference between the surface of the substrate 11C and the conductive wire 21C becomes smaller, thereby improving the adhesion between the electrode component 12C and the substrate 11C and suppressing electrode component peeling. In addition, if t1 / t3 is 90% or lower, the process of embedding the conductive wire 21C into the substrate 11C can be easily performed. If t1 / t3 is 80% or lower, the yield rate can be improved, increasing productivity.

[0125] The height dimension t1' of the embedded area of ​​the conductive wire in the second region is preferably 40% or more and 75% or less of the height dimension t3' of the conductive wire in the second region, more preferably 40% or more and 65% or less, and even more preferably 50% or more and 65% or less. Since the conductive wire 21C in the second region X2 is patterned on one side of the substrate sheet, when the conductive wire 21C is excessively embedded in the second region X2, the stress applied to the conductive wire 21C on the substrate sheet increases, making it easier for warping or other deformations to occur in the substrate sheet. In the second region X2, if the ratio (t1' / t3') of the height dimension of the embedded area of ​​the conductive wire to the height dimension of the conductive wire is 75% or less, deformation of the substrate sheet 11C can be suppressed by the stress of the conductive wire 21C. If t1' / t3' is 65% or less, a conductive sheet with excellent appearance design and formability can be obtained. Furthermore, if t1' / t3' is 40% or more, the conductive wire 21C can be prevented from peeling off from the substrate sheet 11C. If t1' / t3' is 50% or more, a conductive sheet with excellent formability can be obtained.

[0126] Preferably, in the fourth embodiment, the adhesive layer 14C is disposed in at least the first region X1 of the substrate sheet 11C, covering the exposed area of ​​the conductive wire. That is, preferably, the "thickness dimension t4 of the adhesive layer in the first region" is larger than the "height dimension t2 of the exposed area of ​​the conductive wire in the first region". The "height dimension of the exposed area" referred to here is the height dimension from one side of the substrate sheet as a reference surface to the upper end of the conductive wire not embedded in the substrate sheet. In this way, by interfacing the adhesive layer 14C between the conductive wire 21C located in the first region X1 and the electrode component 12C, for example, during insert molding, when pressure is applied to the electrode component 12C and the conductive wire 21C from the outside, the electrode component 12C can suppress the breakage of the conductive wire 21C.

[0127] Furthermore, the thickness t4 of the adhesive layer in the first region X1 is preferably 0.1 mm or more and 0.5 mm or less. If t4 is 0.1 mm or more, good adhesive strength can be obtained. Furthermore, by setting t4 to 0.1 mm or more, the exposed area of ​​the conductive wire can be covered by the adhesive layer 14, and the adhesive layer 14 can function as a "buffer" between the conductive wire and the electrode component. If t4 is 0.5 mm or less, it is possible to suppress the adhesive layer from protruding from the first region X1 due to heat or pressure during insert molding, and the thickness of the adhesive layer in the first region X1 becomes thinner.

[0128] Furthermore, the opening 13C is intended to be provided at least in the opening of the substrate sheet 11C. In particular, when the adhesive layer 14C is provided in sheet form, an opening for fixing the electrode component 12C to the conductive wire 21C is also required in the adhesive layer 14C. In this case, the opening of the adhesive layer 14C may not coincide with the opening 13.

[0129] Furthermore, maintaining a constant embedment depth of the conductive wire is difficult. Therefore, in this invention, dimensions t1, t2, t3, and t4 in the first region X1 were measured at a position 3 mm from the point where the conductive wire 21C coincides with the end of the opening. Additionally, dimensions t1', t2', and t3' in the second region X2 were measured at a position 5 mm from the point where the conductive wire 21C coincides with the end of the electrode component 12C.

[0130] In addition, if a different functional layer is provided on the substrate sheet and conductive wires are embedded in the functional layer at each measurement location, the reference surface for each dimension is the functional layer, not the substrate sheet.

[0131] The electrode component 12C is only required to electrically connect the conductive wire 21C to the opening 13C; its size and shape are not particularly limited. The shape of the electrode component 12C can be various, such as rectangular or polygonal. Furthermore, preferably, at least the portion of the electrode component 12C in contact with the conductive wire 21C is chamfered (a chamfer where the sides are cut when the electrode component is polygonal, or the circumference is cut into an arc shape when the electrode component is circular). This reduces the pressure exerted on the conductive wire 21C from the edge of the electrode component 12C, thus suppressing wire breakage.

[0132] (Modified example)

[0133] Reference Figure 17 A further variation of the conductive sheet according to one aspect of the present invention will be described. The conductive pattern 20D is formed asymmetrically from left to right by two conductive wires 21D. The electrode component 12D is provided such that one component covers a plurality of openings 13D. Furthermore, the electrode component 12E is provided such that it covers a portion of the opening 13E. Thus, the shape of the openings 13D and 13E is not limited to rectangles, and 12D and 12E only need to cover at least a portion of one or more openings.

[0134] (Example 1)

[0135] Using a Ruhlamat WCE150 ultrasonic welding device for wiring, conductive wires (copper wires, 0.11 mm diameter, 0.01 mm sheath, total diameter 0.12 mm) were embedded into a substrate sheet (Covestro polycarbonate sheet Makrofol UV503, 500 μm thick) with a 5 mm diameter opening, forming... Figure 14 The conductive pattern is as shown. The electrode component (copper plate, 15mm x 15mm, 0.3mm thickness) is aligned with the surface of the substrate where the conductive wires are embedded, so that the center of the electrode component coincides with the center of the opening. The conductive wires are then connected to the electrode component at the opening of the substrate by soldering.

[0136] (Examples 2-12, Comparative Examples 1-5)

[0137] Except for the depth of wire embedding, the conductive sheet is made in the same manner as in Example 1 above.

[0138] (Conductivity evaluation after injection molding)

[0139] On the opposite side of the electrode component with the fabricated conductive sheet, a conductive molded article is fabricated by injection molding by stacking resin molded bodies (polycarbonate resin) with a thickness of 2 mm. The electrode component is connected to an external electrode, and conductivity is confirmed. Table 1 shows the wire embedding depth and conductivity evaluation results after injection molding for the examples and comparative examples. In Table 1, ○ indicates that conductivity was confirmed, and × indicates that conductivity was not confirmed.

[0140] [Table 1]

[0141] As shown in Table 1, conductivity was not confirmed in the injection-molded articles of the conductive sheets of Comparative Examples 1-5, while conductivity was confirmed in the injection-molded articles of the conductive sheets of Examples 1-12.

[0142] In Examples 1-12, the t1 / t1' ratio of the conductive sheet is 1.1 or higher and 1.8 or lower. By setting t1 / t1' to 1.1 or higher, the adhesion between the conductive wire in the first region and the substrate sheet can be improved, making it less likely for stress during injection molding to be transmitted to the conductive wire. Furthermore, by setting t1 / t1' to 1.8 or lower, excessive tension on the conductive wire in the first region can be suppressed, increasing the tolerance to external pressure. Thus, by embedding the conductive wire deeper in the first region than in the second region, breakage of the conductive wire due to injection molding can be prevented.

[0143] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments described herein, and various embodiments may be combined. Various modifications and alterations can be made to the present invention within the scope of the claims and the scope of the matters described in the section on how to implement the invention.

[0144] Explanation of reference numerals in the attached figures

[0145] 10: Conductive sheet; 11: Substrate sheet; 12: Electrode component; 13: Opening; 14: Adhesive layer; 15: Graphic layer; 20: Conductive pattern; 21: Conductive wire; 40: Conductive molded article; 41: Resin molded body; 42: Injection molding mold; 43: Movable mold; 44: Fixed mold; X1: First region; X2: Second region; t1: Height dimension of the embedded area in the first region; t2: Height dimension of the exposed area in the first region; t3: Height dimension of the conductive wire in the first region; t4: Thickness dimension of the adhesive layer in the first region; t1': Height dimension of the embedded area of ​​the conductive wire in the second region X2; t3': Height dimension of the conductive wire in the second region X2.

Claims

1. A conductive sheet, comprising: The substrate sheet has an opening; A conductive wire is fixed to one side of the substrate sheet in such a way that it overlaps with at least a portion of the opening; and Electrode components are disposed on one or the other side of the substrate sheet in a manner that covers at least a portion of the opening. The conductive wire is electrically connected to the electrode component at the opening.

2. The conductive sheet according to claim 1, wherein, The conductive wire passes through the opening.

3. The conductive sheet according to claim 2, wherein, The electrode component is disposed on one side of the substrate sheet in a manner that covers the conductive wire.

4. The conductive sheet according to claim 3, wherein, The substrate sheet has a first region and a second region. The first region is covered by the electrode component at the periphery of the opening, while the second region is not covered by the electrode component. The conductive wire has an embedded region and an exposed region, the embedded region being embedded in one side of the substrate sheet in the first region, and the exposed region being exposed from one side of the substrate sheet. The height dimension of the buried area in the first region is the same as or larger than the height dimension of the buried area in the second region.

5. The conductive sheet according to claim 4, wherein, The ratio (t1 / t1') of the height dimension (t1) of the buried area in the first region to the height dimension (t1') of the buried area in the second region is greater than 1.1 and less than 1.

8.

6. The conductive sheet according to claim 4, wherein, The conductive sheet also includes an adhesive layer that bonds the electrode component to a first region of the substrate sheet.

7. The conductive sheet according to claim 6, wherein, In the first region, the thickness dimension (t4) of the adhesive layer is larger than the height dimension (t2) of the exposed area of ​​the conductive wire.

8. The conductive sheet according to claim 7, wherein, The thickness (t4) of the adhesive layer is 0.1 mm or more and 0.5 mm or less.

9. The conductive sheet according to claim 4, wherein, The height dimension (t1) of the buried area of ​​the conductive wire in the first region is more than 50% and less than 90% of the height dimension (t3) of the conductive wire.

10. The conductive sheet according to claim 4, wherein, The height dimension (t1') of the buried area of ​​the conductive wire in the second region is more than 40% and less than 75% of the height dimension (t3') of the conductive wire.

11. A method for manufacturing a conductive sheet, comprising the following steps: Prepare a substrate sheet with an opening; The conductive wire is fixed to one side of the substrate sheet in such a way that it overlaps with at least a portion of the opening; An electrode component is formed on one side of the substrate sheet in such a way that it covers at least a portion of the opening and the conductive wire; as well as At the opening, the electrode component is electrically connected to the conductive wire using heat.

12. A conductive molded article, comprising: The conductive sheet according to claim 1; and A resin molded body is laminated on the surface or back of the conductive sheet.

13. A method for manufacturing a conductive sheet, comprising the following steps: Prepare a substrate sheet with an opening; An electrode component is formed on one or the other side of the substrate sheet in a manner that covers at least a portion of the opening; The conductive wire is fixed to one side of the substrate sheet in a manner that overlaps with at least a portion of the opening and the electrode components; and At the opening, the electrode component is electrically connected to the conductive wire using heat.

14. A method for manufacturing a conductive molded article, comprising: The conductive sheet of claim 1 is disposed on any cavity surface of an injection molding mold, the injection molding mold having a fixed mold and a movable mold, the movable mold forming a cavity between itself and the fixed mold by closing the mold; Close the injection molding mold; While injecting molten resin into the cavity to form the resin molded body, the conductive sheet is fixed to the surface of the resin molded body; and Open the injection molding mold and remove the resin molded body.

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