Differential and common mode inductor structure
By designing a differential and common-mode inductor structure and employing special magnetic core units and conductor arrangements, the integration of common-mode and differential-mode inductors was achieved, solving the problem of large inductor space occupation and improving the power density of the switching power supply.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-31
- Publication Date
- 2026-03-17
AI Technical Summary
In existing technologies, the use of differential-mode inductors and common-mode inductors occupies a large amount of space, which affects the improvement of power density in switching power supplies.
A differential-mode inductor structure is designed, employing two types of magnetic core units and conductor structures. Through the special arrangement and bending of the first and second conductors, the integration of common-mode and differential-mode inductors is achieved. The first magnetic core unit provides the common-mode inductance, and the second magnetic core unit provides the differential-mode inductance, thereby reducing space occupation.
This achieves high space utilization for differential and common-mode inductors, effectively reducing the size of the inductor structure while maintaining inductor performance.
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Figure CN121687698A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of inductive elements, and more particularly, to a differential common mode inductance structure. BACKGROUND
[0002] Currently, with the increase of switching power supply power and power density, the application of magnetic integration is also more and more widely. In order to filter out the noise of the output signal, it is usually necessary to add differential mode inductance and common mode inductance at the output end, but this needs to occupy a larger space, which is not conducive to the improvement of power density. SUMMARY
[0003] The technical problem to be solved by the present application is to provide a differential common mode inductance structure in view of the above defects of the prior art.
[0004] The technical scheme adopted by the present application to solve the technical problem is: a differential common mode inductance structure is constructed, comprising:
[0005] Two types of magnetic core units, including a first magnetic core unit and a second magnetic core unit;
[0006] The first magnetic core unit is provided with at least one first through hole;
[0007] The second magnetic core unit is provided with at least two second through holes;
[0008] The first conductor passes through the first through hole of the first magnetic core unit and the second through hole of the second magnetic core unit;
[0009] The second conductor is arranged in a spaced manner with the first conductor, the second conductor passes through the same first through hole of the first magnetic core unit together with the first conductor, and the first conductor and the second conductor pass through different second through holes of the second magnetic core unit respectively.
[0010] In some embodiments, the first magnetic core unit and the second magnetic core unit each include at least one;
[0011] The first magnetic core unit and the second magnetic core unit are arranged along the length direction of the first conductor and the second conductor;
[0012] The first conductor and the second conductor pass through the first through hole of the first magnetic core unit and pass through different second through holes of the second magnetic core unit respectively.
[0013] In some embodiments, the part of the first conductor and the second conductor located outside the first magnetic core unit and the second magnetic core unit is bent away from the first magnetic core unit and the second magnetic core unit.
[0014] In some embodiments, the first magnetic core unit is provided with two first through holes, and the second magnetic core unit is provided with four second through holes.
[0015] The first conductor includes a first pin and a second pin, and the second conductor includes a third pin and a fourth pin.
[0016] The first pin and the third pin pass through a first through hole together, and the second pin and the fourth pin pass through another first through hole together.
[0017] The first pin, the second pin, the third pin and the fourth pin pass through different second through holes respectively.
[0018] In some embodiments, the first magnetic core unit and the second magnetic core unit are arranged along a length direction perpendicular to the first conductor and the second conductor, the first conductor includes a first pin and a second pin, and the second conductor includes a third pin and a fourth pin.
[0019] The first pin and the third pin pass through a same first through hole of the first magnetic core unit together, and the second pin and the fourth pin pass through different second through holes of the second magnetic core unit respectively.
[0020] In some embodiments, the differential common-mode inductance structure includes at least two groups of magnetic cores.
[0021] Each group of the magnetic cores includes a first magnetic core unit and a second magnetic core unit; or, each group of the magnetic cores includes only two magnetic core units of the same type.
[0022] The magnetic cores in each group are arranged in a stack along a length direction of the conductor.
[0023] The first pin and the third pin pass through a first through hole of a first magnetic core unit in a layer, and then pass through different second through holes of second magnetic core units in other layers respectively.
[0024] The second pin and the fourth pin pass through different second through holes of a second magnetic core unit in a layer, and then pass through a same first through hole of a first magnetic core unit in other layers.
[0025] In some embodiments, a folding part is arranged at a bending position of the first conductor and the second conductor away from ends of the first pin, the second pin, the third pin and the fourth pin, and the folding part is bent away from the first magnetic core unit and the second magnetic core unit.
[0026] In some embodiments, the second magnetic core unit includes at least two second magnets, and each second magnet is provided with a second through hole.
[0027] In some embodiments, the differential common mode inductance structure further comprises an insulating base for isolating the main board from the first magnetic core unit and the second magnetic core unit.
[0028] In some embodiments, the inner wall surface of the first through hole is provided with a boss between the first conductor and the second conductor.
[0029] The differential common mode inductance structure of the present application has the following advantages: after the first conductor and the second conductor pass through, the first magnetic core unit can provide common mode inductance, and the second magnetic core unit can provide differential mode inductance, realizing a differential common mode inductance integration scheme, which has high space utilization and effectively achieves the effect of reducing the volume. BRIEF DESCRIPTION OF DRAWINGS
[0030] The present application will be further described below with reference to the drawings and embodiments, wherein:
[0031] Figure 1 is a schematic diagram of the differential common mode inductance structure in the first embodiment of the present application;
[0032] Figure 2 is Figure 1 is a schematic diagram of the differential common mode inductance structure in the first embodiment of the present application;
[0033] Figure 3 is a schematic diagram of the differential common mode inductance structure in the second embodiment of the present application;
[0034] Figure 4 is a schematic diagram of the differential common mode inductance structure in the second embodiment of the present application; Figure 3
[0035] Figure 5 is a schematic diagram of the differential common mode inductance structure in the second embodiment of the present application; Figure 3
[0036] Figure 6 is a schematic diagram of the differential common mode inductance structure in the second embodiment of the present application; Figure 3
[0037] Figure 7 is a schematic diagram of the differential common mode inductance structure in the second embodiment of the present application; Figure 3
[0038] Figure 8 is a schematic diagram of the differential common mode inductance structure in the second embodiment of the present application; Figure 3
[0039] Figure 9 Figure 3 The first and second core units of the intermediate differential common-mode inductor structure are both exploded schematic diagrams of two alternating stacked core units.
[0040] Figure 10 This is an exploded structural diagram of the first magnetic core unit and the second magnetic core unit of the differential common-mode inductor structure in the third embodiment of the present invention, when they are arranged side by side.
[0041] Figure 11 yes Figure 10 A schematic diagram of a neutral differential common mode inductor structure where both the first and second magnetic core units are two units and are staggered 180° vertically in the circumferential direction.
[0042] Figure 12 This is a schematic diagram of other embodiments where a first magnet is assembled into a first magnetic core unit and a second magnet is assembled into a second magnetic core unit;
[0043] Figure 13 This is a three-dimensional schematic diagram of another embodiment where the first conductor and the second conductor have folded portions, and the differential and common mode inductor structure has an insulating base. Detailed Implementation
[0044] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0045] like Figure 1 , Figure 2 As shown, the differential common-mode inductor structure in a preferred embodiment of the present invention includes two types of magnetic core units, a first conductor 3, and a second conductor 4. The magnetic core units include a first magnetic core unit 1 and a second magnetic core unit 2. The first magnetic core unit 1 has a first through hole 11; the second magnetic core unit 2 has two second through holes 21; the first conductor 3 passes through one first through hole 11 of the first magnetic core unit 1 and one second through hole 21 of the second magnetic core unit 2; the second conductor 4 is spaced apart from the first conductor 3, and the second conductor 4 and the first conductor 3 both pass through the same first through hole 11 of the first magnetic core unit 1, and the first conductor 3 and the second conductor 4 respectively pass through different second through holes 21 of the second magnetic core unit 2.
[0046] After the first conductor 3 and the second conductor 4 pass through the first magnetic core unit 1 and the second magnetic core unit 2 respectively, the first magnetic core unit 1 can provide a common-mode inductor and the second magnetic core unit 2 can provide a differential-mode inductor, realizing a differential-common-mode inductor integrated scheme. This scheme has high space utilization and effectively achieves the effect of reducing volume.
[0047] For example Figure 1 , 2As shown, in the first embodiment, each of the first magnetic core unit 1 and the second magnetic core unit 2 includes one unit, which are arranged along the length of the first conductor 3 and the second conductor 4. The first magnetic core unit 1 has a first through hole 11, and the second magnetic core unit 2 has two second through holes 21, allowing the second conductor 4 and the first conductor 3 to pass through the same first through hole 11 of the first magnetic core unit 1, and the first conductor 3 and the second conductor 4 to pass through different second through holes 21 of the second magnetic core unit 2.
[0048] Based on this, in the differential common mode inductor structure, at least one of the first magnetic core unit 1 and the second magnetic core unit 2 has a quantity greater than one, that is, there is one or more first magnetic core units 1 and one or more second magnetic core units 2. The corresponding number of first magnetic core units 1 and second magnetic core units 2 are arranged along the length direction of the first conductor 3 and the second conductor 4, and the order is not limited. The first conductor 3 and the second conductor 4 pass through the first through hole 11 of the first magnetic core unit 1 and pass through different second through holes 21 of the second magnetic core unit 2 respectively.
[0049] Furthermore, the portions of the first conductor 3 and the second conductor 4 located outside the first magnetic core unit 1 and the second magnetic core unit 2 are bent away from the first magnetic core unit 1 and the second magnetic core unit 2, allowing both ends of the first conductor 3 and both ends of the second conductor 4 to be connected to the same motherboard. In other embodiments, the portions of the first conductor 3 and the second conductor 4 located outside the first magnetic core unit 1 and the second magnetic core unit 2 may extend in other directions, or the first conductor 3 and the second conductor 4 may also be straight structures without bending.
[0050] like Figure 3 , Figure 4 As shown, in the second embodiment, each of the first magnetic core unit 1 and the second magnetic core unit 2 is provided and stacked. The first magnetic core unit 1 is provided with two first through holes 11 and the second magnetic core unit 2 is provided with four second through holes 21.
[0051] Furthermore, the first conductor 3 includes a first pin 31 and a second pin 32, and the second conductor 4 includes a third pin 41 and a fourth pin 42.
[0052] The first pin 31 and the third pin 41 both pass through a first through hole 11, and the second pin 32 and the fourth pin 42 both pass through another first through hole 11; the first pin 31, the second pin 32, the third pin 41, and the fourth pin 42 each pass through a different second through hole 21.
[0053] When the current directions in the first conductor 3 and the second conductor 4 are the same, the common-mode current generated in the first magnetic core unit 1 is as follows: Figure 5 As shown in the magnetic flux direction, the common-mode current is generated in the second magnetic core unit 2 as follows: Figure 6The direction of the magnetic flux is shown.
[0054] When the currents in the first conductor 3 and the second conductor 4 are in opposite directions, the differential mode current generated in the first magnetic core unit 1 is as follows: Figure 7 The magnetic flux path shown indicates that the flux must pass through air, resulting in high magnetic reluctance and therefore low differential-mode inductance. The differential-mode current is generated in the second magnetic core unit 2 as follows: Figure 7 The magnetic flux direction shown forms a closed loop with low magnetic reluctance, resulting in a large differential-mode inductance.
[0055] Combination Figure 9 As shown in this embodiment, the first magnetic core unit 1 and the second magnetic core unit 2 may each include two or more, which are stacked alternately on top of each other, and the first conductor 3 and the second conductor 4 are correspondingly and repeatedly passed through the first magnetic core unit 1 and the second magnetic core unit 2.
[0056] like Figure 10 As shown, in the third embodiment, the first magnetic core unit 1 and the second magnetic core unit 2 are arranged along the length direction perpendicular to the first conductor 3 and the second conductor 4. The first conductor 3 includes a first pin 31 and a second pin 32, and the second conductor 4 includes a third pin 41 and a fourth pin 42. The first pin 31 and the third pin 41 pass through the same first through hole 11 of the first magnetic core unit 1, and the second pin 32 and the fourth pin 42 pass through different second through holes 21 of the second magnetic core unit 2.
[0057] In this embodiment, instead of stacking the first magnetic core unit 1 and the second magnetic core unit 2 in one direction as in the first embodiment, the first conductor 3 and the second conductor 4 are distributed on two segments in different directions along the bend, so that the first magnetic core unit 1 and the second magnetic core unit 2 are side by side and form differential mode and common mode inductors after being energized.
[0058] Furthermore, such as Figure 11 As shown, the differential common-mode inductor structure includes two sets of magnetic cores, each set of magnetic cores including a first magnetic core unit 1 and a second magnetic core unit 2; the first magnetic core unit 1 and the second magnetic core unit 2 of each set of magnetic cores are stacked.
[0059] The first pin 31 and the third pin 41 pass through the first through hole 11 of the first magnetic core unit 1 and through different second through holes 21 of the other second magnetic core units 2; the second pin 32 and the fourth pin 42 pass through different second through holes 21 of the second magnetic core unit 2 and through the same first through hole 11 of the other first magnetic core units 1.
[0060] In addition, when the differential common mode inductor structure includes multiple sets of magnetic cores stacked together, the positions of the first magnetic core unit 1 and the second magnetic core unit 2 of the upper and lower layers of magnetic cores can be the same or interchanged. The first pin 31, the third pin 41, the second pin 32, and the fourth pin 42 pass through the first through hole 11 and the second through hole 21 at the corresponding positions according to the arrangement order and position of the first magnetic core unit 1 and the second magnetic core unit 2 of the different layers of magnetic cores.
[0061] Or such as Figure 12 As shown, each group of magnetic cores includes only two magnetic core units of the same type, and includes at least one group of magnetic cores consisting only of two first magnetic core units 1. The first pin 31 and the third pin 41 pass through the first through hole 11 of one of the first magnetic core units 1, and the second pin 32 and the fourth pin 42 pass through the first through hole 11 of the other first magnetic core unit 1. The first pin 31, the third pin 41, the second pin 32, and the fourth pin 42 pass through the first through hole 11 and the second through hole 21 at the corresponding positions according to the arrangement order and position of the first magnetic core units 1 and the second magnetic core units 2 of different layers of magnetic cores.
[0062] When the differential common-mode inductor structure includes two or more sets of magnetic cores arranged side by side, the stacking is repeated in the manner described above.
[0063] The first magnetic core unit 1 may also have one or more first through holes 11, and the second magnetic core unit 2 may also have two or more second through holes 21 for the first conductor 3 and the second conductor 4 to pass through.
[0064] Furthermore, such as Figure 12 As shown, in some other embodiments, a first magnet 12 with a first through hole 11 can be spliced together to form a first magnetic core unit 1 with two or more first through holes 11.
[0065] Combination Figure 2 , 4 As shown in figures 9 and 12, in the above embodiments, in order to separate the first conductor 3 and the second conductor 4 within the first through hole 11, a boss 13 is provided on the inner wall surface of the first through hole 11, located between the first conductor 3 and the second conductor 4. The common-mode inductor itself also contains a differential-mode inductance component; the function of the boss 13 is to increase the differential-mode component of the common-mode inductor. The principle can be referred to... Figure 7 When the air gap in the differential mode circuit of the common mode inductor core decreases, the differential mode inductance increases accordingly.
[0066] For example Figure 12As shown, the second magnetic core unit 2 includes two or more second magnets 22, and each second magnet 22 has a second through hole 21. The second magnetic core unit 2 can be formed by splicing together second magnets 22 with one second through hole 21 to form a second magnetic core unit 2 with two or more second through holes 21. This spliced structure of the second magnetic core unit 2 can be applied to various embodiments including the three embodiments described above.
[0067] like Figure 13 As shown, when the first conductor 3 and the second conductor 4 are bent into two pin structures with different directions, a folded portion A is provided on the first conductor 3 and the second conductor 4 at the bending position away from the ends of the first pin, the second pin, the third pin, and the fourth pin. The folded portion A bends away from the first magnetic core unit 1 and the second magnetic core unit 2, which can reduce the height dimension and improve the heat dissipation capacity. It can be understood that the folded portion A can be applied to various embodiments of differential and common mode inductor structures.
[0068] In some embodiments, the differential-common mode inductor structure may further include an insulating base 5. The insulating base 5 is located at the bottom and is used to isolate the motherboard and the first magnetic core unit 1 and the second magnetic core unit 2. The insulating base 5 is disposed at the ends where the first conductor 3 and the second conductor 4 are connected to the motherboard, serving to isolate and insulate them from the motherboard, thus meeting the insulation requirements. It is understood that the insulating base 5 can be applied to various embodiments of differential-common mode inductor structures, and an insulating layer can also be attached or coated on the motherboard, in which case the insulating base 5 can be omitted.
[0069] The splicing method of the first magnetic core unit 1 and the second magnetic core unit 2 is not limited to the method in the above embodiment. It can be extended to the first magnetic core unit 1 with multiple first through holes 11 and the second magnetic core unit 2 with multiple second through holes 21 as needed, so that the first magnetic core unit 1 and the second magnetic core unit 2 are spliced laterally, stacked vertically, or combined.
[0070] Understandably, the above-mentioned technical features can be used in any combination without restriction.
[0071] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. A differential common mode inductance structure, characterized by, The application relates to a differential common-mode inductance structure. The differential common-mode inductance structure comprises two types of magnetic core units, including a first magnetic core unit and a second magnetic core unit. The first magnetic core unit is provided with at least one first through hole. The second magnetic core unit is provided with at least two second through holes. A first conductor passes through the first through hole of the first magnetic core unit and the second through hole of the second magnetic core unit. A second conductor is arranged in a spaced manner with the first conductor, and the second conductor passes through the same first through hole of the first magnetic core unit together with the first conductor, and the first conductor and the second conductor pass through different second through holes of the second magnetic core unit respectively.
2. The differential common mode inductance structure of claim 1, wherein, The first magnetic core unit and the second magnetic core unit each comprise at least one. The first magnetic core unit and the second magnetic core unit are arranged along the length direction of the first conductor and the second conductor. The first conductor and the second conductor pass through the first through hole of the first magnetic core unit and pass through different second through holes of the second magnetic core unit respectively.
3. The differential common mode inductance structure of claim 2, wherein, The part of the first conductor and the second conductor located outside the first magnetic core unit and the second magnetic core unit is bent in a direction away from the first magnetic core unit and the second magnetic core unit.
4. The differential common mode inductance structure of claim 2, wherein, The first magnetic core unit is provided with two first through holes, and the second magnetic core unit is provided with four second through holes. The first conductor comprises a first pin and a second pin, and the second conductor comprises a third pin and a fourth pin. The first pin and the third pin pass through a same first through hole together, and the second pin and the fourth pin pass through another first through hole together. The first pin, the second pin, the third pin and the fourth pin pass through different second through holes respectively.
5. The differential common mode inductance structure of claim 1, wherein, The first magnetic core unit and the second magnetic core unit are arranged along a direction perpendicular to the length direction of the first conductor and the second conductor, the first conductor comprises a first pin and a second pin, and the second conductor comprises a third pin and a fourth pin. The first pin and the third pin pass through a same first through hole of the first magnetic core unit together, and the second pin and the fourth pin pass through different second through holes of the second magnetic core unit respectively.
6. The differential common mode inductance structure of claim 5, wherein, The differential common-mode inductance structure comprises at least two groups of magnetic cores. Each group of the magnetic cores comprises one first magnetic core unit and one second magnetic core unit, or each group of the magnetic cores comprises only two magnetic core units of the same type. The magnetic cores in each group are arranged in a stacked manner along the length direction of the conductor. The first pin and the third pin pass through first through holes of the first magnetic core units in one layer and pass through different second through holes of the second magnetic core units in other layers respectively. The second pin and the fourth pin pass through different second through holes of the second magnetic core units in one layer and pass through a same first through hole of the first magnetic core units in other layers respectively.
7. The differential common mode inductance structure according to any one of claims 4 to 6, characterized in that, The bending position of the first conductor and the second conductor away from the ends of the first pin, the second pin, the third pin and the fourth pin is provided with a folding part, and the folding part is bent in a direction away from the first magnetic core unit and the second magnetic core unit.
8. The differential common mode inductance structure of any of claims 1, wherein, The second magnetic core unit comprises at least two second magnets, and each second magnet is provided with one second through hole.
9. The differential common mode inductance structure of any one of claims 1 to 6, wherein, The differential common-mode inductance structure further comprises an insulating base for isolating a mainboard from the first magnetic core unit and the second magnetic core unit.
10. The differential common mode inductance structure of any one of claims 1 to 6, wherein, The inner wall surface of the first through hole is provided with a boss between the first conductor and the second conductor. The inner wall surface of the first through hole is provided with a boss between the first conductor and the second conductor.