Gas-insulated compact diode valve commutation system

Abstract

The invention provides a gas-insulated compact diode valve converter system, and the system comprises a converter valve which comprises a plurality of diode modules, each diode module comprises a plurality of diode chips and a plurality of radiators, and each diode chip and each radiator are alternately attached to each other, and are used for cooling each diode chip; an insulating layer is arranged between any adjacent diode chip and the radiator and is used for realizing device-level insulation of the converter valve; and an insulating isolation plate is arranged between any two adjacent diode modules, and is used for realizing module-level insulation of the converter valve. The converter valve is accommodated in the insulating gas box, and the insulating gas box is filled with insulating gas and is used for realizing system-level insulation of the converter valve; wherein the insulating gas comprises any one of SF6, dry air, N2 and SF6 mixed gas. Through the current conversion system provided by the invention, the problems of low equipment integration level, low insulation level, poor heat dissipation performance and the like of the current current conversion system are solved.

Description

Technical Field

[0001] This application relates to the field of high voltage direct current transmission technology, and in particular to a gas-insulated compact diode valve converter system. Background Technology

[0002] In traditional high-voltage direct current (HVDC) transmission projects, converter valves are typically installed in specially constructed valve halls. A valve hall is a large, enclosed building structure primarily used to provide the necessary insulation environment, cooling conditions, and mechanical support for the converter valves. Currently, thyristor converter valves are the most widely used in engineering applications, often arranged in a suspended structure within the valve hall. Thyristor converter valves are tall, occupy a large space, have a long construction period, and are costly. To meet the requirements of converter valves for insulation distance, installation space, and operation and maintenance, the valve halls required need a larger footprint and a tall, spacious structure, resulting in a massive amount of civil engineering work and high costs.

[0003] Diode valves are also used as converter elements in flexible DC systems, small-scale industrial rectification applications, and some DC transmission projects. However, in engineering practice, diode valves mostly follow the installation method of thyristor converter valves, requiring them to be placed inside large, sealed valve chambers. This leads to diode valves facing the same problems as thyristor converter valves, such as low equipment integration, large electrical spacing, complex structure, difficult transportation, and high operating energy consumption.

[0004] Furthermore, traditional valve hall installations generally rely on air as the primary insulating medium. However, air has a low heat dissipation coefficient and poor heat transfer efficiency, further limiting the possibility of increasing valve body power density and reducing space. Moreover, air is easily affected by altitude, ambient humidity, dust concentration, and temperature changes, leading to increasingly prominent problems such as low insulation strength, weak environmental adaptability, and poor long-term operational stability. On the other hand, traditional valve hall installations mostly use centralized cooling systems. However, centralized cooling has long heat dissipation paths, high system losses, and large device size. Furthermore, it only provides system-level cooling for the converter system, making it difficult to simultaneously address device-level cooling. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a gas-insulated compact diode valve converter system, which solves the problems of low equipment integration, poor heat dissipation performance, and low insulation level in current converter systems.

[0006] This invention provides a gas-insulated compact diode valve converter system, the technical solution of which is: A gas-insulated compact diode valve commutation system, the system comprising: A converter valve includes multiple diode modules, each diode module including multiple diode chips and multiple heat sinks, and each diode chip and each heat sink are alternately attached to each other for cooling each diode chip; An insulating layer is provided between the diode chips and the heat sink that are arbitrarily adjacent to each other to achieve device-level insulation of the converter valve; and, An insulating isolation plate is provided between any two adjacent diode modules to achieve module-level insulation of the converter valve; An insulating gas box, which houses the converter valve and is filled with insulating gas, is used to achieve system-level insulation of the converter valve. The insulating gas includes any one of SF6, dry air, N2, and a mixture of SF6.

[0007] As one of the preferred solutions, a heat dissipation functional layer is provided between the diode chip and the heat sink, which are located in any adjacent positions; the heat dissipation functional layer includes an overlapping thermal grease layer and a heat spreader.

[0008] As one of the preferred embodiments, the insulating layer comprises a ceramic copper-clad laminate or an insulating pad; and / or, the insulating isolation plate comprises an epoxy glass cloth board.

[0009] As one of the preferred embodiments, the insulating isolation plate includes a plurality of horizontal plates and a plurality of vertical plates arranged in a crisscross pattern, and the plurality of horizontal plates and the plurality of vertical plates abut against the insulating gas box, and together with the insulating gas box, form a plurality of mutually isolated insulating chambers, with each diode module corresponding to one of the insulating chambers.

[0010] As a preferred embodiment, the areas of each of the horizontal and vertical plates that contact the insulating gas box are encapsulated with an epoxy layer.

[0011] As one of the preferred embodiments, each heat sink includes a heat sink main board, a delivery pipe and a heat sink block connected in sequence, wherein the heat sink main board is attached to the diode chip and the heat sink block is offset from the diode chip; In this unit, some of the heat sinks are arranged as a circulation unit, and the heat sink blocks of multiple heat sinks in each circulation unit are arranged at equal angular intervals around the circumference.

[0012] As one preferred embodiment, the switching valve further includes: Two end plates are disposed at opposite ends of each diode module; A disc spring is attached between the end plate and the end of the diode module; At least one pre-tightening device, each of the pre-tightening devices extending parallel to the central axis of the converter valve; the pre-tightening device is subjected to pre-pressure and is fastened to the two end plates.

[0013] As one of the preferred embodiments, the top of the insulating gas box is provided with a vertically extending DC bushing; the side wall of the insulating gas box is connected to a horizontally extending converter valve side bushing. The top of the insulating gas box is also provided with a pillar-type support connecting the insulating gas box and the DC bushing; The side wall of the insulating gas box is also provided with a frame-type support, and the converter valve side sleeve is supported on the frame-type support. The insulating gas box is also equipped with a layered support, which includes multiple layers of horizontal plates spaced apart, and the multiple horizontal plates support the multiple diode chips of the diode module.

[0014] As one preferred embodiment, the insulating gas box is provided with a gas replenishment port for replenishing the insulating gas into the insulating gas box; the interior of the insulating gas box is provided with an adsorption device for adsorbing moisture and impurities entrained in the insulating gas.

[0015] As one of the preferred options, the insulating gas box comprises any one of the following materials: cold-rolled steel plate, aluminum alloy, pressure vessel steel, and stainless steel, and is manufactured by argon arc welding or carbon dioxide gas shielded welding.

[0016] Compared with the prior art, this application has the following advantages: The converter system provided in this application embodiment constitutes a three-level insulation system through an insulating layer, an insulating isolation plate, and an insulating gas box, achieving multi-level electrical protection for diode chips, module units, and the system assembly, significantly reducing insulation distance requirements. By integrating the diode converter valve with the gas box structure, and using high-insulation-strength gas as the primary insulation method, leveraging its advantages of high dielectric strength, strong environmental adaptability, and compact structure, the insulation distance between converter components and between components and the housing can be significantly reduced, enabling a compact arrangement of the rectifier unit structure and significantly reducing the installation volume of the equipment. Simultaneously, by alternately bonding heat sinks to the chips, the cooling structure and converter unit form a modular configuration and an integrated layout. This not only achieves distributed heat exchange within the gas box, enabling precise device-level cooling, but also further improves the miniaturization and modularity of the rectifier structure, reducing reliance on traditional valve hall structures. Attached Figure Description

[0017] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an external view of a gas-insulated compact diode valve converter system provided in one embodiment of this application; Figure 2 This is an assembly diagram of a gas-insulated compact diode valve converter system provided in one embodiment of this application, after removing the right side wall of the insulating gas box; Figure 3 This is a right-side cross-sectional view of a gas-insulated compact diode valve converter system according to an embodiment of this application; Figure 4 This is a front cross-sectional view of a gas-insulated compact diode valve converter system provided in an embodiment of this application; Figure 5 This is a diagram showing the positional relationship between the diode module and the insulating isolation plate according to an embodiment of this application; Figure 6 This is a three-dimensional structural diagram of a single diode module provided in an embodiment of this application; Figure 7 This is a perspective structural diagram of a heat sink provided in an embodiment of this application; Figure 8 This is a structural diagram of the heat sink and diode chip provided in one embodiment of this application; Figure 9 This is a structural diagram of the composition of the heat sink and the diode chip after a heat dissipation functional layer is provided between them according to an embodiment of this application; Figure 10 This is a front view of a single diode module provided in an embodiment of this application; Figure 11 This is a top view of a single diode module provided in an embodiment of this application; Figure 12 This is a top view of the converter valve after wiring is completed, according to an embodiment of this application.

[0019] Explanation of reference numerals in the attached figures: 1. Insulating gas box; 11. Insulating chamber; 2. Diode module; 21. Diode chip; 22. Heat sink; 221. Heat dissipation main board; 222. Delivery pipe; 223. Heat sink block; 23. Disc spring; 24. End plate; 25. Pre-tightening device; 3. Insulating isolation plate; 4. Layered bracket; 5. Column bracket; 6. Frame bracket; 7. Converter valve side bushing; 8. Thermal grease layer; 9. Heat spreader. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] Before providing a detailed description of the gas-insulated compact diode valve commutation system provided by this invention, it is necessary to explain the related technologies as follows: It is evident that as high-voltage direct current (HVDC) transmission systems rapidly develop towards integration, miniaturization, and modularization, the drawbacks of traditional converter valve structures, which rely on large-volume valve halls, in terms of engineering construction and operation and maintenance are becoming increasingly apparent. For example, to meet sufficient electrical clearance and cooling requirements, the valve hall height can reach over 20 meters, resulting in low land utilization, large civil engineering workload, and high investment costs. Diode valve maintenance and replacement operations require entry into high-altitude or confined spaces, leading to poor safety and low efficiency. During system commissioning and troubleshooting, the valve hall, converter, and auxiliary systems also need to be inspected separately, increasing maintenance costs.

[0022] It is evident that, regardless of whether it is a thyristor converter valve or a diode converter valve, when using the traditional air insulation method and centralized cooling structure, the converter valve and its supporting system not only inevitably require a large installation space, a large insulation spacing, a more complex deployment shape, and a huge civil engineering foundation, but also still have technical pain points such as low insulation performance, weak heat dissipation capacity, and low integration, which are not conducive to the modular integration of the equipment and restrict the flexible deployment of the equipment in restricted scenarios such as offshore platforms, mountain sites, and industrial parks.

[0023] Firstly, a typical valve assembly consists of multiple diode chips 21 forming a high-voltage bearing unit. Each diode chip 21 is not individually insulated; the overall insulation relies on the air in the valve chamber. During normal operation, the diode valve must withstand reverse blocking voltages (including DC voltage, pulsating voltage, or their superposition) and surge voltages during switching, such as voltage spikes generated during reverse recovery. Therefore, relying solely on air insulation can easily lead to localized breakdown between the diode chips 21. Using traditional air as the insulating medium results in low dielectric strength and significant influence from pollution levels, humidity, temperature, and altitude variations, making it difficult to guarantee insulation margin in long-term operation. Since reliable device-level insulation between individual diode chips 21 cannot be achieved under current air insulation conditions, measures such as increasing the air gap between devices and adding insulating supports are used to ensure overall safe operation to a certain extent. This not only results in loose device arrangement and a bulky structure but also leaves localized insulation weaknesses during surge voltage events, posing risks such as surface discharge and electric field distortion.

[0024] Secondly, diode valves are subjected to electrical, thermal, and mechanical stresses as well as environmental corrosion during operation, making them prone to partial discharge and aging. However, traditional structures also rely on air clearance for overall insulation, failing to achieve independent insulation isolation between valve groups. This not only blurs the insulation safety boundary during diode valve operation, leading to uneven electric fields and easy propagation of partial discharge, but also, in high-temperature, high-humidity, and polluted environments, insulation degradation often propagates, creating a system-level failure risk. Due to the relatively low strength of air insulation, larger spacing and overall air gaps are necessary to improve the safety margin, further increasing the overall size and installation height of the converter valve.

[0025] Furthermore, centralized cooling structures are ill-suited to the high heat density requirements of diode valves. In a centralized cooling system, a unified main cooling system is needed to remove heat generated by the valve assembly via long-distance circulating water or a large ventilation system. Due to the long cooling path and simple heat transfer chain, it is often difficult to achieve device-level distribution of the cooling medium, resulting in high contact thermal resistance between diode chips 21. Especially when the operating state of the diode chip 21 changes frequently and localized heating is uneven, centralized cooling cannot achieve rapid cooling of individual devices, increasing the risk of localized overheating and widening temperature differences between devices.

[0026] In summary, traditional converter systems based on air insulation and centralized cooling cannot meet the requirements of diode valves in terms of high-voltage blocking, surge suppression, device temperature uniformity, and structural compactness. They not only suffer from weak insulation reliability and insufficient cooling efficiency but also exacerbate problems such as increased system footprint and installation complexity. Therefore, given the increasingly compact construction demands of next-generation converter equipment, there is an urgent need to improve the converter structure and its installation methods to achieve better space utilization, more reliable insulation performance, and more efficient heat dissipation.

[0027] Based on this, the technical solution of the present invention will be described in more detail below with reference to several embodiments and accompanying drawings.

[0028] To overcome or at least partially solve the above problems, refer to Figures 1-4 , Figures 1-4 The figures shown are, respectively, an external view, a right-side sectional view, a right-side sectional view, and a front sectional view of the gas-insulated compact diode valve converter system illustrated in this invention. Figure 2 The right side wall of insulating gas box 1 has been omitted to facilitate the demonstration of its internal structure. For example... Figure 1 As shown, the present invention provides a gas-insulated compact diode valve converter system. The system includes: a converter valve comprising multiple diode modules 2, each diode module 2 comprising multiple diode chips 21 and multiple heat sinks 22, wherein each diode chip 21 and each heat sink 22 are alternately attached to each other for cooling each diode chip 21; an insulating layer is provided between any two adjacent diode chips 21 and heat sinks 22 for device-level insulation of the converter valve; and an insulating isolation plate 3 is provided between any two adjacent diode modules 2 for module-level insulation of the converter valve; an insulating gas box 1, which houses the converter valve and is filled with insulating gas for system-level insulation of the converter valve; wherein the insulating gas includes any one of SF6, dry air, N2 and a mixture of SF6.

[0029] Specifically, a converter system typically consists of a converter valve and a valve chamber. In this embodiment, the converter valve in the converter system is a diode valve, and the valve chamber is replaced by an insulating gas box 1, making it suitable for high-voltage direct current transmission projects, flexible direct current systems, and small industrial rectifier applications. The converter valve includes multiple diode modules 2, vertically arranged within the insulating gas box 1. Each diode module 2 consists of two diode groups connected in series, and each group may contain multiple diode chips 21, forming a multi-stage series unit. After the multiple diode modules 2 are electrically connected inside the insulating gas box 1, wires exit from inside the insulating gas box 1 and connect to the valve-side winding output of the converter transformer, forming a complete three-phase six-pulse rectifier circuit.

[0030] For example, the converter valve consists of two sets of six-pulse rectifier circuits composed of twelve vertically arrayed diode modules 2, which are connected in parallel or series to form a twelve-pulse rectifier. The electrical connection between the twelve diode modules 2 adopts a three-phase six-pulse pseudo-bipolar topology, symmetrically arranged according to the positive and negative poles, and together with six rectifier arms, forms two sets of three-phase rectifier circuits. A "U-shaped" layout is adopted to make the current path symmetrical, so that the positive current path is parallel to the negative current path, thus canceling the inductance. The AC side output of one set of three-phase six-pulse rectifier bridges is Y-connected to the secondary side A1B1C1 of the transformer, and the AC side output of the other set of three-phase six-pulse rectifier bridges is D-connected to the secondary side A2B2C2 of the transformer. The AC side output is connected to three single-phase switches through dry bushings, while the DC side output is led out from the vertical bushing on the top of the box.

[0031] like Figure 6 The diagram shows a three-dimensional structure of a single diode module 2. Taking one diode module 2 as an example, during the series connection process, diode chips 21 and heat sinks 22 are alternately overlapped along the axial direction. That is, a heat sink 22 is added between every two adjacent diode chips 21, forming a multi-layered, repetitive "diode chip 21—heat sink 22—diode chip 21—heat sink 22" periodic stacked structure. The assembled diode chips 21 are press-fitted and encapsulated using mechanical pressing, clamping frame fixation, bolt clamping, or upper and lower fixing plates, while ensuring a tight fit between the heat sink 22 and the diode chips 21.

[0032] Because multiple diode chips 21 and multiple heat sinks 22 are axially overlapped to form a stacked structure, electrical isolation between devices is maintained while each diode chip 21 is cooled independently. This arrangement results in the shortest heat dissipation path, uniform temperature rise, and effectively improves the response speed and efficiency of device temperature control under high-power operation conditions, achieving device-level heat dissipation and ensuring module operation safety. Due to timely heat dissipation, pressure bonding packaging can be used, eliminating the need for pre-reserved air creepage distance between chips, further reducing the overall size of the converter valve. It is worth mentioning that the stacked structure of this converter valve not only meets the requirements of heat dissipation, insulation, and mechanical fixation, but also forms a multi-level insulation system with the subsequent module-level insulating isolation plate 3 and gas insulation cavity, constituting the basic structural form of the gas-insulated compact diode converter valve of this application. Furthermore, installing an insulating layer on the bonding interface of adjacent diode chips 21 and heat sinks 22 can further ensure the insulation isolation between the diode chips 21 and heat sinks 22 in each diode module 2, thereby achieving device-level insulation in each module. Therefore, when the diode chip 21 is subjected to reverse blocking voltage and surge voltage, the independent insulation between the chips of the converter valve can physically separate the thermal and electrical paths, thus avoiding chip-level insulation failure and thermal breakdown.

[0033] Furthermore, such as Figure 5 As shown, Figure 5 This diagram shows the positional relationship between diode module 2 and insulating isolation plate 3. Building upon device-level insulation, module-level insulation is achieved by placing insulating isolation plates 3 between multiple diode modules 2 arranged in an array. This provides electrical isolation between modules, significantly reducing thermal resistance, structurally differentiating voltage withstand characteristics, preventing the propagation of local overvoltages across modules, reducing the risk of surface discharge and flashover in the air, preventing cascading expansion, and thus avoiding the spread of system-level breakdown risk, improving the reliability of valve assembly operation. Simultaneously, the insulating isolation plate 3 can achieve the same voltage withstand capability even as a thin plate, forming a bookshelf-style narrow-pitch layout, which helps to achieve a compact layout of the converter valve.

[0034] Furthermore, based on module-level insulation, by filling the insulating gas box 1 with insulating gas, and selecting a medium with an insulation strength much greater than that of air, a closed, high-insulation-strength compact environment is formed, replacing the traditional tall building valve hall. This avoids the large creepage distance required by traditional air insulation structures, and also avoids the insulation performance fluctuations caused by factors such as site humidity, pollution, altitude, and temperature changes that affect traditional air insulation.

[0035] Thus, the converter system in this embodiment constitutes a three-level insulation system through the insulating layer, the insulating isolation plate 3, and the insulating gas box 1, achieving multi-level electrical protection for the diode chip 21, module units, and system assembly, significantly reducing the insulation distance requirements. By integrating the diode converter valve with the gas box structure, and using high-insulation-strength gas as the main insulation method, leveraging its advantages of high dielectric strength, strong environmental adaptability, and good structural compactness, the insulation distance between converter components and between components and the housing can be significantly reduced, enabling a compact arrangement of the rectifier unit structure and significantly reducing the installation volume of the equipment. At the same time, by alternately bonding the chips with the heat sink 22, the cooling structure and the converter unit form a modular configuration and an integrated layout, not only achieving distributed heat exchange within the gas box and realizing precise device-level cooling, but also further improving the miniaturization and modularity of the rectifier structure, reducing reliance on traditional valve hall structures.

[0036] Therefore, this application demonstrates significant technical advantages in terms of improved insulation performance, reduced size, enhanced cooling efficiency, and increased safety margin. It effectively solves the problem of traditional air-insulated and centralized cooling structures failing to achieve device-level and module-level insulation and distributed cooling, greatly improving system installation flexibility and standardization, and reducing engineering construction costs and timelines. This improved converter valve structure and installation method aligns with the future development trend of compact high-voltage transmission equipment and is of significant value in promoting innovation in next-generation high-voltage direct current converter technology.

[0037] In some embodiments, the heat sink 22 may include liquid-cooled metal heat sinks containing a cooling medium. In some embodiments, the heat sink 22 may also be a high-strength heat sink. In some embodiments, the insulating layer may include alumina ceramic sheets, silicon nitride ceramic sheets, coated insulating films, composite silicone insulating sheets, and epoxy insulating coatings, etc. In some embodiments, the insulating isolation plate 3 may include flat insulating isolation plate 3, corrugated insulating isolation plate, composite material sandwich plate, etc.

[0038] As a full illustration of this embodiment, in the gas-insulated oil tank of the adapter diode module 2, the high-insulation-strength gas selected to replace the traditional oil-immersed or air-insulated gas must match the tank structure, sealing design, and heat dissipation requirements. Regarding gas selection, gases with insulation strength far exceeding that of air (air insulation strength ≈ 30kV / cm), strong chemical stability, and environmental friendliness can be chosen. SF6 (sulfur hexafluoride) is preferred, possessing extremely strong arc-extinguishing capabilities and a relative insulation strength 2.5 to 3 times that of air, suitable for high-voltage scenarios. Dry air is also preferred, suitable for medium- and low-voltage (≤6kV) scenarios with high environmental protection requirements. N2 (nitrogen) is also preferred, suitable for medium- and low-voltage scenarios requiring low cost and environmental friendliness. Alternatively, a mixture of SF6 gases (such as SF6 / N2) can be preferred, possessing strong arc-extinguishing capabilities, suitable for scenarios balancing insulation performance and environmental friendliness.

[0039] Therefore, SF6, dry air, N2, or a mixture of SF6 gases are selected as the primary insulating medium. Under rated operating voltage, there is no partial discharge in the gas medium (discharge amount ≤10pC); and no breakdown will occur under 1.2 times the rated impulse voltage. Furthermore, it can operate stably in environments ranging from -30℃ to 60℃, and humidity changes (≤95%RH) do not affect the insulation performance. Under normal maintenance (gas parameters are checked every 2 years), the insulation system life is ≥15 years, with no insulation failure due to gas leakage or moisture.

[0040] Preferably, a gas monitoring unit can be installed on the insulating gas box 1. This unit integrates pressure sensors, humidity sensors, etc., and is equipped with a gas replenishment interface and an adsorption device. The pressure and humidity sensors can transmit the measured pressure and temperature data to the control system in real time and display it locally. When the pressure or temperature exceeds a preset threshold, the gas monitoring unit can trigger an audible and visual alarm and a remote alarm. A gas replenishment port with a check valve is provided on the side wall of the gas box. The gas replenishment port can be connected to a standard gas cylinder or an automatic gas replenishment system, facilitating on-site filling using a standard gas cylinder or an automatic gas replenishment system. The gas box has a built-in dual-function adsorption device, filled with molecular sieves and activated alumina respectively, to remove moisture and condensable / reactive impurities (oil, water, acidic decomposition products, etc.) from the filled insulating gas. The above settings can significantly extend the service life of the insulating gas in the box, reduce the frequency of maintenance, and improve the efficiency of on-site emergency response.

[0041] Preferably, such as Figure 8 and Figure 9 As shown, Figure 8 This is a structural diagram showing the relationship between the heat sink 22 and the diode chip 21. Figure 9 This diagram illustrates the structural composition after a heat dissipation layer is installed between the heat sink 22 and the diode chip 21. Considering the structural characteristics of the diode module 2—"concentrated losses, high heat density, and the need for coordination with the insulation system"—its heat dissipation structure design must break away from the traditional passive heat dissipation mode of the valve chamber and adopt an active, low-resistance, and integrated heat dissipation path. The core objective is to control the diode junction temperature within the rated limit while avoiding negative impacts on the insulation system. In the specific implementation, a heat dissipation layer is installed between any two adjacent diode chips 21 and the heat sink 22; the heat dissipation layer includes an overlapping thermal grease layer 8 and a heat spreader 9.

[0042] Taking an alternating unit as an example, below the diode chip 21 are, in sequence, a thermally conductive silicone grease layer 8, a heat sink 9, and a heatsink 22. The thermally conductive silicone grease layer 8 reduces the contact thermal resistance between the diode chip 21 and the heatsink 22, directly reducing the interface temperature rise. In a multi-chip series structure, the heat sources of each chip are unevenly distributed, and the upper and lower chips have temperature differences due to voltage and thermal resistance. The heat sink 9 has high thermal conductivity, allowing heat to diffuse rapidly from the concentrated heat source area of ​​the diode chip 21 inwards, achieving high-efficiency radial temperature uniform diffusion, balancing the temperature difference between chips, and improving the temperature consistency of the entire device. The heat sink 9 can be made of copper.

[0043] Therefore, applying high thermal conductivity silicone grease and installing a copper heat sink 9 at the thermal interface and between the diode module 2 and the heat sink 22 in device-level heat dissipation can significantly reduce the thermal resistance between device interfaces, improve the in-plane temperature uniformity of the device, reduce the temperature difference between diodes inside the valve group, and achieve stable heat dissipation management at the device level. This reduces the power requirements of the external cooling system, decreases reliance on centralized cooling, promotes the reduction of the overall system package size, improves integration, and further realizes compact diode commutation.

[0044] like Figure 7 As shown, Figure 7 A perspective structural diagram of the heat sink 22 of the present invention is shown. In a further heat dissipation optimization embodiment, each heat sink 22 includes a heat dissipation main board 221, a delivery pipe 222, and a heat sink 223 connected in sequence. The heat dissipation main board 221 is attached to the diode chip 21, and the heat sink 223 is offset from the diode chip 21. In this embodiment, some heat sinks 22 form a circulating unit, and the heat sinks 223 of the multiple heat sinks 22 in each circulating unit are arranged at equal angular intervals around the circumference.

[0045] Specifically, the heat sink 221 is attached to the chip and directly contacts the high-heat-generating area of ​​the chip, rapidly transferring the junction temperature generated by the diode chip 21 to the cooling medium within the heat sink 221, achieving rapid heat dissipation. The cooling medium flows between the heat sink 221, the delivery pipe 222, and the heat sink 223, and may include water coolant, oil coolant, or fluorine coolant. The delivery pipe 222 extends outward from the edge of the heat sink 221 to connect with the heat sink 223, allowing the heat absorbed by the heat sink 221 to be transferred radially to the heat sink 223 for enhanced heat dissipation. The heat sink 223 is staggered from the diode chip 21 and exposed to the insulating gas environment of the insulating gas chamber 1, enhancing gas convection heat transfer.

[0046] The heat sink 223 can be designed as fins, a block, a column-shaped form, or a combination thereof. The shape of the heat sink 223 can be designed as a strip, an arc surface, a fin, or a geometric polygon.

[0047] Please see Figures 10-12 ,, Figure 10 and Figure 11 The front view and top view of a single diode module 2 are shown respectively; Figure 12 A top view of the converter valve, consisting of twelve diode modules 2, is shown after wiring is completed. Then, several heat sinks 22 form a circulation unit, in which the center points of each heat sink 223 are maintained at equal angular intervals in the circumferential direction, with an angular interval of 360° / n (where n is the number of heat sinks 223 in the circulation unit). For example, four heat sinks 22 form a circulation unit, with the heat sink main plates 221 of the four heat sinks 22 respectively attached to two upper and lower diode chips 21. The four heat sink main plates 221 are arranged axially from top to bottom, and the heat sinks 223 connected to the heat sink main plates 221 through the delivery pipe 222 are also arranged from top to bottom. However, during the arrangement, the angular distribution of the four heat sinks 223 is 0°, 90°, 180°, and 270°. Of course, the number of heat sinks 22 in a circulation unit can be more or less, for example, three heat sinks 223 are distributed at equal intervals of 120°, six heat sinks 223 are distributed at equal intervals of 60°, etc. This embodiment does not impose a specific limitation. Therefore, the multiple heat sinks 223 within a single circulation unit are staggered axially.

[0048] It is understandable that for two adjacent circulation units, the last heat sink 223 in the previous circulation unit and the first heat sink 223 in the next circulation unit are also offset in the axial direction.

[0049] In some embodiments, all heat sinks 22 are arranged as a unit, with equal angular intervals from the first diode chip 21 to the last diode chip 21, and the connecting lines of all heat sinks 223 form a continuous spiral. In some embodiments, the distribution angles between multiple heat sinks 223 may also be different.

[0050] Therefore, the heat sink 22's heat dissipation main board 221 is attached to the diode chip 21, and the heat sink 223 is evenly distributed circumferentially within the gas-insulating ring. The heat released by each diode chip 21 is rapidly dissipated. The heat sink 223 surrounds the chip in all directions, reducing the temperature difference within the group and improving voltage balancing capability and operational stability. Simultaneously, it achieves higher device integration density, promotes modular integration, and makes the valve body structure more compact. This enables rapid, efficient, and uniform device-level thermal management, meeting the reliability requirements of high-voltage diode series structures. Based on the above embodiments, and considering the heat generation of the diode valve, a design combining natural cooling and an aluminum heatsink 22 can be implemented. The heatsink 22 is made of extruded aluminum profile, and the heat dissipation mainboard 221 is polygonal in shape. The heat sink 223 is fan-shaped, with the arc surface of the fan facing outwards towards the insulating gas environment. The delivery pipe 222 extends arc-shaped from one side of the heat sink 221 to connect to the side plane of the fan shape. Therefore, the heat sink 22 can increase the effective flow surface area and achieve a reliable connection between the heat sink 221 and the heat sink 223, improving heat dissipation efficiency and modular packaging performance, and reducing installation space requirements and operation and maintenance costs.

[0051] For example, the fan-shaped structure formed by the combination of several fins in the heat sink 223 enhances convective heat transfer with the insulating gas. The fin height is 30-50mm, and the spacing is 8-10mm, which can balance heat dissipation area and airflow. The thickness of the heat sink 221 is ≥5mm to reduce thermal resistance, and the total heat dissipation area is ≥0.5m². During installation, the heat sink 22 is installed vertically so that the fins are aligned with the direction of gravity, with a ventilation space of ≥100mm at the bottom and a distance of ≥150mm between the top and the outer casing to form a natural convection channel.

[0052] As an extension of this embodiment, if subsequent designs increase heat generation, a forced air cooling and integrated radiator 22 system can still be added. The fan system employs axial flow fans installed on the side or top of the radiator 22, with the air velocity controlled at 5-8 m / s. This velocity can be adjusted via feedback from a wind pressure sensor. Dust filters (mesh size ≥ 80 mesh) are installed at the air inlet and cleaned regularly (cycle ≤ 3 months). The forced air cooling system features dual-fan redundancy (one in use, one on standby), automatically switching in case of fan failure, maintaining an airflow retention rate ≥ 80%.

[0053] In conjunction with the above embodiments, the heat dissipation functional layer can be provided simultaneously with the insulating layer, that is, a thermally conductive silicone grease layer 8, a heat spreader 9, and an insulating layer are provided between the diode chip 21 and the heat sink 22. In some embodiments, materials with both thermal conductivity and insulation properties can be selected to achieve device-level insulation while having high thermal conductivity, further reducing the size and allowing the converter valve to maintain a compact layout under high power density conditions.

[0054] Thus, this embodiment is based on heat dissipation optimization. By optimizing the thermal resistance path, temperature uniformity, and redundancy design, the junction temperature can be ensured to be controllable. At the same time, in coordination with the insulation system, the dual goals of "efficient heat dissipation + reliable insulation" are ultimately achieved, ensuring the long-term stable operation of the valve assembly.

[0055] Preferably, this embodiment is used to illustrate the insulation optimization design. The insulating layer includes a ceramic copper-clad laminate or an insulating pad; and / or, the insulating isolation plate 3 includes an epoxy glass cloth plate. As mentioned above, an insulating layer is provided between the diode chip 21 and the heat sink 22 to achieve device-level insulation of the converter valve. This application uses a ceramic copper-clad laminate (DBC) or an insulating pad, such as an Al2O3 ceramic sheet. The Al2O3 ceramic sheet has a thickness of 0.3-1mm, a dielectric breakdown field strength ≥20kV / mm, and low thermal resistance with the diode chip 21, which is beneficial to reducing the junction temperature increment. At the same time, it is designed in conjunction with the heat sink 22, so that no additional insulating gap is needed on the heat dissipation surface, maximizing the contact area between the chip and the heat dissipation surface. After multiple diode modules 2 are connected in series / parallel, epoxy glass cloth plates are provided between the modules to achieve inter-group insulation, shorten the module spacing, reduce the installation space, and realize the compact and modular structure deployment of the diode converter valve. The thickness of the epoxy glass cloth board can be designed according to the voltage level, ≥5mm for 10kV level, and the creepage distance is calculated according to the "pulse voltage gradient".

[0056] The insulation optimization design of this embodiment can stably withstand electrical, thermal, mechanical stress and environmental erosion throughout the full voltage range (rated + transient), the full temperature range (-40℃-150℃), and the entire life cycle (≥20 years), and the partial discharge and aging rate are within a controllable range, ultimately achieving a match with the diode valve group in terms of "same lifespan, high reliability, and low maintenance".

[0057] In another preferred design, the insulating isolation plate 3 includes multiple horizontal and vertical plates arranged in a crisscross pattern. These plates abut against the insulating gas box 1, forming multiple mutually isolated insulating chambers 11. Each diode module 2 is located one-to-one within each insulating chamber 11. In this embodiment, the horizontal plates extend horizontally, and the vertical plates extend vertically, all vertically arranged. The horizontal and vertical plates abut against each other to form a grid, with the periphery of the grid abutting against the inner wall of the insulating gas box 1, ultimately forming multiple sealed insulating chambers 11 inside the gas box. Each insulating chamber 11 contains only one diode module 2, thus ensuring independent voltage isolation for each module, significantly improving system-level insulation margin, while also ensuring module assembly positioning accuracy and safe operation reliability under high-voltage conditions. By replacing the wide air gaps between modules with a thinner insulating isolation plate 3, space is significantly saved, the gas box volume is reduced, and installation and transportation are more convenient.

[0058] For example, with Figure 1 and Figure 2 Taking the placement direction of the insulating gas box 1 as an example, twelve diode modules 2 are arranged in three rows and four columns inside the insulating gas box 1. Each row and two columns correspond to the two valve arms of one phase group. Two horizontal plates and three vertical plates are correspondingly arranged. The two horizontal plates are placed between the rows of three diode modules 2, and the three vertical plates are placed between the columns of four diode modules 2. Then, the top, bottom, and left and right sides of the two horizontal plates abut against the inner wall of the gas box, and the top, bottom, front and rear sides of the three vertical plates abut against the inner wall of the gas box.

[0059] Preferably, an epoxy layer is potted in the area where each horizontal and vertical plate contacts the insulating gas box 1. In this embodiment, positioning grooves can be provided where the horizontal and vertical plates are assembled to the inner wall of the gas box. The horizontal and vertical plates are inserted into the positioning grooves, and epoxy filler is vacuum-filled at the contact gaps. A solid encapsulation layer is formed by heat curing or room temperature curing. This constructs an integrated structure of sealing, insulation, and stable support, reducing air gaps in the insulation structure (which are prone to corona discharge), achieving long-term sealing reliability of the boundary of the insulating chamber 11 between modules, reducing partial discharge, and realizing high power density packaging and modular assembly of high-voltage rectifier devices.

[0060] In another technical solution, the converter valve further includes: two end plates 24 disposed at opposite ends of each diode module 2; a disc spring 23 tightly attached between the end plates 24 and the ends of the diode modules 2; at least one pre-tightening device 25, each pre-tightening device 25 extending parallel to the central axis of the converter valve; the pre-tightening device 25 is subjected to pre-pressure and fastened to the two end plates 24.

[0061] In this embodiment, end plates 24, disc springs 23, and pre-tightening devices 25 are designed to achieve axial clamping, deformation compensation, and reliable contact for the overall structure of the diode module 2. Two end plates 24 are located at the upper and lower ends of the entire stacked structure of the diode module 2, respectively, and can bear pre-tightening force, operating load, and thermal stress. Guide positioning holes can be machined on the surface of the end plates 24 for the insertion and fixation of the pre-tightening devices 25. The disc springs 23 are tightly attached between the end plates 24 and the ends of the diode module 2, providing axial flexible displacement compensation capability and adaptively compensating for differences in thermal expansion of the modules to always provide stable contact pressure. Two disc springs 23 can be provided, located between the two end plates 24 and the upper and lower ends of the diode module 2, respectively. In other embodiments, one disc spring 23 can be provided between the upper end plate 24 and the upper end of the diode module 2, eliminating the need for one at the lower end. The number of pre-tightening devices 25 can be at least one, arranged parallel to the central axis of the diode module 2, with multiple pre-tightening devices 25 distributed circumferentially at equal intervals. In this embodiment, the pre-tightening device 25 can be a pre-tightening screw, a pre-tightening rod, or a compression spring, etc., with both ends fastened to the end plate 24.

[0062] Therefore, when the pre-tightening device 25 applies a pressure of 50-100N and fixes it to the end plate 24, it simultaneously compresses the disc spring 23 to ensure good contact between the chip and the heat sink 22. This automatically compensates for the interface loosening problem of the diode module 2 during thermal cycling, load changes, and long-term aging, keeping the heat dissipation bonding interface of the diode chip 21 under stable pressure, reducing thermal contact resistance, and ensuring consistency in the mechanical, thermal, and electrical properties of the module contact parts, significantly improving the lifespan consistency and operational reliability of the converter valve module. Since this application replaces the traditional valve hall and uses an independent, enclosed insulating gas box 1 as the basic platform, it supports standardized and modular manufacturing processes. The equipment is easy to assemble after transportation, and only simple wiring is required for on-site commissioning. Therefore, it is particularly suitable for converter station installation, transportation and loading scenarios, and can well adapt to vibration, transportation impact, and safe hoisting vibration.

[0063] In another embodiment, regarding the design of the insulating gas box 1, to meet the size restrictions for road transportation, the width is controlled at 4.5 meters and the height does not exceed 4.9 meters. Meanwhile, the spacing between the diode modules 2 meets different insulation requirements depending on the voltage level. Through optimized heat dissipation, structural strength, and safety protection design, the operational reliability and thermal stability of the converter device under high voltage and high current conditions are ensured.

[0064] Specifically, different types of support structures are set on the outside of the insulating gas box 1 to achieve integrated mechanical bearing, electrical interface layout, and transportation assembly. Among them, the top of the insulating gas box 1 is provided with a vertically extending DC bushing; the side wall of the insulating gas box 1 is connected to a horizontally extending converter valve side bushing 7; the top of the insulating gas box 1 is also provided with a pillar-type bracket 5 connecting the insulating gas box 1 and the DC bushing; the side wall of the insulating gas box 1 is also provided with a frame-type bracket 6, on which the converter valve side bushing 7 is supported; the interior of the insulating gas box 1 is also provided with a layered bracket 4, which includes multiple layers of horizontal plates spaced apart, and the multiple horizontal plates support multiple diode chips 21 of the diode module 2.

[0065] Specifically, please refer to [the relevant document] again. Figure 12 The DC and AC output lines of diode module 2 are led out of insulating gas box 1 through corresponding bushings. The DC output line is led out from inside insulating gas box 1 and passes through the DC bushing at the top, connecting to a DC transmission line or DC load system to output rectified DC power. The AC output line uses a dry bushing to be led out horizontally from the same side of insulating gas box 1 and passes through the converter transformer valve side bushing 7 on the side wall, connecting to the converter transformer through the converter transformer valve side bushing 7 to input the transformed AC power to diode module 2. Correspondingly, three DC bushings are provided, extending vertically and spaced horizontally; the neutral point bushing is located in the middle, leading out a grounding wire; the positive and negative bushings are located on either side of the neutral point bushing, respectively leading out positive and negative terminals. Six converter valve side bushings 7 are provided, extending horizontally on the same side wall of the insulating gas box 1, and arranged in two rows at intervals in the vertical direction. Each row has the same number of converter valve side bushings 7, which are aligned one by one. In this embodiment, the three DC bushings are horizontally spaced on the same straight line, leading out the DC power from the twelve-pulse converter circuit. The two rows of three converter valve side bushings 7 correspond to two sets of three-phase six-pulse bridges, and the converter valve side bushings 7 in the same row lead out one set of three-phase three-phase lines. The two rows of converter valve side bushings 7 are arranged on the same side of the insulating gas box 1 and extend horizontally. The converter valve side bushings 7 in the same row are at the same height, and the upper and lower converter valve side bushings 7 in the two rows are vertically aligned, maximizing the use of external space in the insulating gas box 1.

[0066] Firstly, an insulating bracket is used for fixation, and additional support points can be added. The top-outlet uses a pillar-type insulating bracket, which is vertically fixed to the inner wall of the top of the tank or below the outlet bushing. A slot is opened at the top, and the upper end of diode module 2 passes through the slot and is fixed with insulating bolts to ensure verticality. The pillar-type insulating bracket prevents the high-voltage bushing from directly bearing the entire bending moment from the tank body, enhancing the reliability of the insulation interface, reducing the risk of airtight leakage, and preventing the bushing from loosening, shaking, or degrading during long-term operation.

[0067] The converter valve side bushing 7 with the side interface structure is fixed by a frame bracket 6. The frame bracket 6 is set below the converter valve side bushing 7 for support and to bear the weight, stress and on-site installation error of the converter valve side bushing 7, so as to improve the shock resistance stability of the external insulation and greatly improve the reliability of the converter valve under conditions such as transportation, lifting, vibration and short-circuit electromagnetic force impact.

[0068] More preferably, the frame-type support 6 can surround the converter valve side bushing 7 to form an insulating channel to enhance the creepage distance.

[0069] The internal support structure adopts a layered bracket 4, which is fixed to the inner wall of the side wall of the insulating gas box 1. Multiple horizontal plates are spaced apart from top to bottom. One horizontal plate extends horizontally from the side wall of the insulating gas box 1 toward the diode module 2 and is fixed to a diode chip 21 of the diode module 2. This achieves a stepped internal structure fixation and provides uniform support in the mounting stacking direction of the chip and heat sink 22.

[0070] Thus, by configuring the pillar-type support 5, the frame-type support 6, and the layered support 4 inside and outside the insulating gas box 1 respectively, the stable positioning of the internal module of the converter valve, the enhanced bearing capacity of the high-voltage lead-out interface, and the mechanical decoupling of the lateral connection structure are achieved, significantly reducing the risks of mechanical deformation, voltage stress concentration, and insulation degradation during operation, thereby realizing the highly reliable deployment of the compact gas-insulated diode converter system.

[0071] This embodiment may also include monitoring elements installed inside the insulating gas box 1. These monitoring elements may include temperature sensors, speed sensors, and pressure sensors, used to monitor signals such as temperature, wind speed, and pressure within the insulating gas box 1, and transmit these signals to the external converter station via corresponding auxiliary lines. After completing the wiring of the AC and DC side outgoing lines, the auxiliary lines are designed to run away from the main leads during the wiring process inside the insulating gas box 1, preferentially following the inner wall edge or corners of the insulating gas box 1. After the auxiliary lines are led out from the monitoring elements (such as the temperature sensor at the bottom of the insulating gas box 1 and the speed sensor at the top of the insulating gas box 1), they are concentrated and passed through an insulating protective tube (such as a polytetrafluoroethylene tube), and then led to the terminal box outside the insulating gas box 1.

[0072] Thus, this application can ensure that the insulation distance between leads of different voltage levels and between leads and grounding components (such as the wall of the insulating gas box 1) meets the design standards through reasonable wiring, avoiding partial discharge or short circuit. Lead length is reduced to lower impedance loss, while redundant bending is avoided (to prevent corona or mechanical wear). At the same time, AC side outgoing lines, DC side outgoing lines, and auxiliary lines do not obstruct the insulating isolation plate 3 and heat sink 22 inside the insulating gas box 1.

[0073] In another embodiment, the insulating gas box 1 for the heat dissipation adaptation of diode module 2 is structurally designed around three core aspects: load-bearing requirements, environmental load, and heat dissipation compatibility. This ensures no deformation or cracking under static pressure, dynamic impact, and temperature cycling, while maintaining the heat dissipation path and insulation performance. The main body of the box is made of materials selected according to the operating conditions, prioritizing both strength and thermal conductivity. For example, Q235 cold-rolled steel plate or 5052 aluminum alloy is used in low- and medium-pressure scenarios, with the wall thickness determined based on pressure calculations; Q345R pressure vessel steel or 304 stainless steel is used in high-pressure scenarios. Thick-walled pipe joints are used at the heat dissipation interface, with an annular reinforcing plate added at the joint root, and the joint is fully welded to the box body. When the interface connects to external pipelines, metal flexible hoses or rubber shock-absorbing pads are installed to absorb vibration displacement and prevent interface stress overload. After structural positioning is completed, argon arc welding or carbon dioxide gas shielded welding (for carbon steel) should be used preferentially. Welds must undergo 100% non-destructive testing to ensure they are free of defects such as porosity and cracks, preventing even minor leaks that could lead to gas loss. For outdoor applications, the enclosure can be electrostatically powder-coated or hot-dip galvanized to prevent corrosion-induced strength degradation. An insulation layer can be added if necessary. The sealing surfaces should use aging-resistant rubber, combined with precision-machined flanges, to minimize internal gas leakage.

[0074] This application achieves long-term sealing stability and resistance to mechanical shock in the housing under high pressure gas environment by using materials with high structural strength, excellent airtightness and good electric field uniformity (including cold-rolled steel plate, aluminum alloy, pressure vessel steel and stainless steel) in the insulating gas box 1, and forming a dense weld structure by argon arc welding or carbon dioxide gas shielded welding. This significantly improves the service life, safety margin and modular integration capability of the converter valve module.

[0075] In summary, this application breaks through the structural limitations of traditional converter systems and proposes a compact solution that directly integrates the diode module 2 inside the insulating gas box 1, which has the following advantages: 1. The traditional independent valve chamber is eliminated, and multiple high-voltage diode groups are directly integrated into the insulating gas box 1 through modular design to build a compact rectification system. This structure makes full use of the box as a platform to support the converter valve, and achieves integrated design in terms of insulation, electrical connection and heat dissipation path, which greatly simplifies the system architecture and improves the overall integration and engineering deployment efficiency.

[0076] 3. By using device-level insulation and high-strength insulating gas insulation, the uniformity of voltage distribution between devices is improved, and voltage spikes and surges are suppressed. Module-level insulation ensures the insulation safety boundary during diode valve operation, further guaranteeing electric field uniformity, preventing partial discharge propagation, and avoiding system-level failure risks.

[0077] 4. Outgoing line system and bushing connection method based on three-phase six-pulse pseudo-bipolar topology. A Y / D secondary-side combination is used to achieve six-pulse DC rectification. The AC side is connected to an independent dry bushing, while the DC side is led out from the top of the tank through a vertical bushing. This outgoing line method has a compact structure, short path, and low magnetic field interference, which is beneficial to improving the system's EMC performance and energy efficiency indicators.

[0078] 5. Fuel tank size constraints and module layout optimization based on transportation regulations. The structural design fully considers the width and height restrictions for domestic highway transportation, controlling the equipment's external dimensions (≤4.5m width, ≤4.9m height) to achieve overall transportation and immediate on-site installation and use. Simultaneously, through optimization of the internal space layout of the insulating enclosure, it supports the multi-column suspension arrangement of diode module 2, while also taking into account electrical insulation and safety clearance requirements.

[0079] Based on the above advantages, this invention is applicable to various application scenarios and has good versatility and scalability, including but not limited to: 1. Uncontrolled rectifier systems: such as electroplating, electrolysis, motor drive, battery charging, etc., have a simple structure and are suitable for cost-sensitive applications; 2. DC transmission projects: Compatible with LCC-HVDC systems, embedded in rectifier bridges for high-voltage rectification output; 3. Electronic protection auxiliary system: Serves as a clamping diode or freewheeling channel to assist in the stable operation of the main converter; 4. Industrial power supply systems: such as welding machines, electric arc furnaces, electrolytic aluminum and other high power density applications, to meet the requirements of instantaneous high current surges; 5. Distributed energy systems: photovoltaic and wind power off-grid DC power supply systems, micro DC experimental platforms, etc.

[0080] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0081] It should also be noted that, in this document, the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor should they be construed as indicating or implying relative importance. Moreover, the term "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device.

Claims

1. A gas-insulated compact diode valve converter system, characterized in that The system comprises: a converter valve comprising a plurality of diode modules, each of the diode modules comprising a plurality of diode chips and a plurality of heat sinks, and each of the diode chips and each of the heat sinks being alternately attached to each other for cooling each of the diode chips; an insulating layer being arranged between any two adjacent diode chips and heat sinks for realizing device-level insulation of the converter valve; and an insulating isolation plate being arranged between any two adjacent diode modules for realizing module-level insulation of the converter valve; an insulating gas tank containing the converter valve and filled with insulating gas for realizing system-level insulation of the converter valve; wherein the insulating gas comprises any one of SF6, dry air, N2 and SF6 mixed gas.

2. A gas insulated compact diode valve converter system according to claim 1, characterized in that A heat dissipation functional layer is arranged between any two adjacent diode chips and heat sinks; the heat dissipation functional layer comprises a heat-conducting silicone grease layer and a heat spreader which are overlapped.

3. A gas insulated compact diode valve converter system according to claim 1, characterized in that The insulating layer comprises a ceramic copper-clad plate or an insulating gasket; and / or, the insulating isolation plate comprises an epoxy glass cloth plate.

4. A gas insulated compact diode valve converter system according to claim 1, characterized in that The insulating isolation plate comprises a plurality of horizontal plates and a plurality of vertical plates which are arranged in a crisscross manner, and the plurality of horizontal plates and the plurality of vertical plates abut on the insulating gas tank and together form a plurality of insulating chambers which are mutually isolated, each of the diode modules being located in each of the insulating chambers.

5. A gas insulated compact diode valve converter system according to claim 4, characterized in that An epoxy layer is filled in the area where each of the horizontal plates and each of the vertical plates contacts the insulating gas tank.

6. A gas insulated compact diode valve converter system according to claim 1, characterized in that Each of the heat sinks comprises a heat dissipation main plate, a conveying pipe and a heat dissipation block which are sequentially communicated, the heat dissipation main plate being attached to the diode chip, and the heat dissipation block being staggered with the diode chip; wherein part of the heat sinks serve as a circulation unit, and the heat dissipation blocks of the plurality of heat sinks in each of the circulation units are arranged at equal angles in the circumferential direction.

7. A gas insulated compact diode valve converter system according to claim 1, characterized in that The converter valve further comprises: two end plates arranged at opposite ends of each of the diode modules; a disc spring being tightly arranged between the end plate and the end of the diode module; at least one pre-tightening device, each of the pre-tightening devices extending parallel to the central axis of the converter valve; the pre-tightening device being applied with a pre-pressure and being fastened on the two end plates.

8. A gas insulated compact diode valve converter system according to claim 1, characterized in that A vertical direct-current sleeve is arranged on the top of the insulating gas tank; a horizontal converter valve side sleeve is communicated with the side wall of the insulating gas tank; a support column type bracket is further arranged on the top of the insulating gas tank and connected to the insulating gas tank and the direct-current sleeve; a frame type bracket is further arranged on the side wall of the insulating gas tank, and the converter valve side sleeve is supported on the frame type bracket; a layered bracket is further arranged in the insulating gas tank, and the layered bracket comprises a plurality of horizontal plates which are arranged in layers and spaced apart, and the plurality of horizontal plates support the plurality of diode chips of the diode modules.

9. A gas insulated compact diode valve converter system according to claim 1, characterized in that A gas supplementing interface is arranged on the insulating gas tank for supplementing the insulating gas in the insulating gas tank; and an adsorption device is arranged in the insulating gas tank for adsorbing water and impurities entrained in the insulating gas.

10. A gas insulated compact diode valve converter system according to any one of claims 1-9, characterized in that The insulating gas tank is made of any one of cold-rolled steel plate, aluminum alloy, pressure vessel steel and stainless steel by argon arc welding or carbon dioxide gas shielded welding.

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