Vacuum adsorption type finger of wafer carrier and manufacturing method of vacuum adsorption type finger

Abstract

The invention relates to the technical field of wafer transmission equipment, in particular to a vacuum adsorption type finger of a wafer carrier and a manufacturing method of the vacuum adsorption type finger. A plurality of adsorption air holes are formed in the surface of the finger body, an air channel communicated with the adsorption air holes is formed in the finger body, and an air inlet is formed in one end of the air channel; arc-shaped adaptive openings are formed in the two ends of the handle part of the finger body; a connecting module is arranged between the finger body and the mechanical arm body; a vacuum passage is arranged in the connecting module; the handle part of the finger body is clamped into the connecting module, the connecting module is clamped with the arc-shaped adaptive opening and is fixed, the air inlet is communicated with the vacuum passage, and the connecting module comprises a connecting male head and a mounting female seat; convenient mounting is achieved, mounting holes do not need to be machined during manufacturing, the machining difficulty is lowered, and the structural strength of the finger is improved.

Description

Technical Field

[0001] This invention relates to the technical field of wafer transport equipment, and more particularly to a vacuum adsorption type finger for a wafer carrier and its manufacturing method. Background Technology

[0002] In the field of semiconductor wafer transport, vacuum-adhesive ceramic fingers are crucial components for wafer transport. Currently, the mainstream mounting method for ceramic fingers involves drilling holes in the shank and then securing them with screws. Figure 2 As shown.

[0003] However, ceramics are hard and brittle materials, and micro-cracks, chipping, and delamination are easily generated when drilling holes in the shank. In particular, stress concentration occurs at the chamfer of the hole opening, resulting in a high scrap rate. In addition, diamond tools and high-precision CNC equipment are required to ensure hole position accuracy and surface quality, which results in high processing costs and long processing cycles. During installation, multiple screws need to be tightened one by one, which is inefficient. Uneven or excessive torque can cause the ceramic shank to be unbalanced in terms of force, leading to crushing or cracking of the hole wall.

[0004] Therefore, it is necessary to provide a vacuum adsorption type finger for a wafer carrier and a method for manufacturing the same, in order to solve the problems mentioned in the background art. Summary of the Invention

[0005] The purpose of this invention is to provide a vacuum adsorption type finger for a wafer carrier and its manufacturing method, which enables convenient installation, eliminates the need for machining mounting holes during manufacturing, reduces processing difficulty, and improves the structural strength of the finger.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a vacuum adsorption type finger for a wafer carrier, comprising a finger body and a robotic arm body; The surface of the finger body is provided with a number of adsorption pores, and the inside of the finger body is provided with an air passage that communicates with the adsorption pores. One end of the air passage is provided with an air inlet. The handle of the finger body has arc-shaped fitting openings at both ends; A connection module is provided between the finger body and the robotic arm body; The connection module has an internal vacuum passage. The handle of the finger body is inserted into the connecting module, the connecting module is engaged with and fixed to the arc-shaped adapter, and the air inlet is connected to the vacuum passage.

[0007] As a preferred embodiment of the present invention, the connection module includes a male connector and a female mounting socket; The vacuum passage is located at the bottom inside the mounting base; The mounting female is open at one end; One end of the male connector has a card slot, and the handle of the finger body passes through the card slot; The mounting base is connected to the drive end of the robotic arm body; The male connector has buckles at both ends, and the female connector has slots on both sides near the opening, with the buckles engaging with the outside of the slots.

[0008] As a preferred embodiment of the present invention, the mounting base is provided with a limiting fixture that can be removed from the mounting base and opened and closed. The side of the limiting fixture is provided with a limiting groove that clamps the side of the handle of the finger body. The middle side of the limiting groove is connected to a limiting pin, and the limiting pin is adapted to the arc-shaped adapter.

[0009] As a preferred embodiment of the present invention, the inner side of the mounting base is slidably fitted with a base, the bottom of the base is provided with a groove to adapt to the vacuum passage, and a plurality of overlapping ear plates are provided at both ends of the base. A hinge pin is fixedly connected between the upper and lower overlapping ear plates, and the hinge pin passes through one end of the limiting fixture and is hinged to it.

[0010] As a preferred embodiment of the present invention, guide grooves are provided at both ends of the base, and guide strips are fixedly connected to both ends of the inner side of the mounting base, and the guide grooves and guide strips are slidably engaged. The guide bar has a protrusion fixedly connected to the opening end near the mounting base. The protrusion is used to limit the clamping of the limiting fixture and hold the handle of the finger body.

[0011] As a preferred embodiment of the present invention, the base has a plurality of spring grooves at the open end away from the mounting base, and a spring member is provided in the spring groove, with the other end of the spring member abutting against the inner wall of the mounting base.

[0012] As a preferred embodiment of the present invention, the top of the base is provided with a movable groove, and a pressure plate is hinged in the movable groove. The pressure plate is arranged opposite to the vacuum passage, and the pressure plate is used to press the handle of the finger body to fit against the vacuum passage.

[0013] As a preferred embodiment of the present invention, a limiting seat is fixedly connected to the inner wall of the opening end of the mounting female seat, and the limiting seat is used to restrict the pressure plate from pressing the handle of the finger body.

[0014] As a preferred embodiment of the present invention, the middle side of the tablet is provided with a through opening, the through opening is adapted to the limiting seat, the end of the limiting seat near the opening of the mounting female seat is provided with a chamfer, and the end of the through opening is provided with a bevel.

[0015] The present invention also provides a method for manufacturing a vacuum-adhesive finger of a wafer carrier, for use in a vacuum-adhesive finger of a wafer carrier as described above, comprising the following steps: 99.5% high-purity alumina ceramic powder was selected, and sintering aids and binders were added to prepare granulated powder. The granulated powder is loaded into a custom mold and pressed into a green body including the stem under a pressure of 150~200MPa. The green blanks are placed in a vacuum sintering furnace for sintering; The arc-shaped adapter port, internal air passage, and adsorption pores are machined using CNC machining.

[0016] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: The present invention, by setting a connection module, eliminates the need to drill holes in the shank, and only requires processing an arc-shaped adapter port for stable connection, avoiding the risk of micro-cracks and edge chipping when drilling hard and brittle ceramics, reducing the processing scrap rate, and eliminating the need for diamond drilling tools, thereby improving processing efficiency and reducing processing costs. By adopting a snap-fit ​​installation, the handle of the finger body can be directly pushed into the connecting module to complete the positioning, without the need to tighten the screws one by one, which improves the installation efficiency and avoids the problems of bolt hard contact and uneven torque, thus avoiding the risk of ceramic hole wall crushing and cracking. Attached Figure Description

[0017] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0018] In the attached diagram: Figure 1 This is a schematic diagram of the overall structure of the finger body of the present invention; Figure 2 This is a schematic diagram of the handle mounting hole of the present invention; Figure 3 This is a three-dimensional schematic diagram of the connection module of the present invention; Figure 4 This is a schematic cross-sectional view of the present invention; Figure 5 This is an exploded view of the connection module structure of the present invention; Figure 6 This is a three-dimensional schematic diagram of the internal structure of the mounting female connector of the present invention; Figure 7 This is a three-dimensional schematic diagram of the vacuum passage of the present invention; Figure 8 yes Figure 4 A magnified view of a portion of region A; In the diagram: 1. Finger body; 101. Arc-shaped adapter opening; 102. Adsorption vent; 103. Air inlet; 104. Guide strip; 105. Protrusion; 106. Movable groove; 107. Pressing plate; 108. Through port; 109. Limiting seat; 2. Robotic arm body; 201. Mounting female base; 202. Slot; 203. Limiting fixture; 204. Limiting groove; 205. Limiting pin; 206. Base; 207. Overlapping ear plate; 208. Hinge pin; 209. Guide groove; 3. Connecting module; 301. Vacuum passage; 302. Connecting male connector; 303. Clip. Detailed Implementation

[0019] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0020] Please see Figure 1-8 The present invention provides a technical solution: a vacuum adsorption type finger for a wafer carrier, comprising a finger body 1 and a robotic arm body 2; The surface of the finger body 1 is provided with a plurality of adsorption pores 102, and the inside of the finger body 1 is provided with an air passage that communicates with the plurality of adsorption pores 102. One end of the air passage is provided with an air inlet 103. The handle of the finger body 1 has arc-shaped fitting openings 101 at both ends; A connection module 3 is provided between the finger body 1 and the robotic arm body 2; The connection module 3 has a vacuum passage 301 inside; The handle of the finger body 1 is inserted into the connecting module 3, the connecting module 3 is engaged with and fixed to the arc-shaped adapter port 101, and the air inlet 103 is connected to the vacuum passage 301.

[0021] Specifically, by directly inserting the handle of the finger body 1 into the connection module 3, the connection module 3 engages and fixes the finger body 1 through the arc-shaped adapter port 101; at this time, the vacuum passage 301 of the connection module 3 automatically connects with the air inlet 103 of the finger body 1, so that the vacuum source inside the robotic arm body 2 is transmitted to several adsorption pores 102 through the vacuum passage 301 of the connection module 3 and the internal air passage of the finger body 1, thereby realizing wafer adsorption and transmission. In this embodiment, by setting the connection module 3, there is no need to drill holes in the shank. Only the arc-shaped adapter port 101 needs to be machined to achieve a stable connection. This avoids the risk of micro-cracks and edge chipping when drilling hard and brittle ceramics, reduces the processing scrap rate, and eliminates the need for diamond drilling tools, thereby improving processing efficiency and reducing processing costs. Furthermore, an arc-shaped adapter port 101 is provided, which ensures uniform distribution of contact stress and eliminates stress concentration points. Furthermore, by adopting a snap-fit ​​installation, the handle of the finger body 1 can be directly pushed into the connecting module 3 to complete the positioning, without the need to tighten the screws one by one, which improves the installation efficiency and avoids the problems of bolt hard contact and uneven torque, thus avoiding the risk of ceramic hole wall crushing and cracking. Preferably, the end flange of the robotic arm body 2 is provided with a mounting position for the connection module 3 and has a built-in vacuum interface, which enables quick docking with the vacuum passage 301 of the connection module 3. Preferably, an O-ring is provided at the junction of the air inlet 103 and the vacuum passage 301 to further prevent leakage.

[0022] Based on the above embodiments, the connection module 3 includes a male connector 302 and a female mounting socket 201; Vacuum passage 301 is located at the bottom of the mounting base 201; The female connector 201 is open at one end; One end of the male connector 302 is provided with a card slot, and the handle of the finger body 1 passes through the card slot; Mounting female connector 201 is connected to the drive end of the robotic arm body 2; The male connector 302 is provided with buckles 303 at both ends, and the female connector 201 is provided with slots 202 on both sides near the opening, and the buckles 303 are engaged with the outside of the slots 202.

[0023] Specifically, by passing the handle of the finger body 1 through the snap-fit ​​port of the male connector 302 and then inserting it into the mounting female connector 201, the snap-fit ​​structure in the mounting female connector 201 automatically snaps into the arc-shaped adapter port 101 of the handle, achieving precise positioning; then the male connector 302 is snapped into the mounting female connector 201, and the elastic buckles 303 at both ends slide into the slots 202 along the side of the mounting female connector 201 and lock in place; at the same time, the air inlet 103 of the finger body 1 is sealed with the vacuum passage 301 in the mounting female connector 201. In this embodiment, quick snap-fit ​​is achieved by setting the buckle 303 and the slot 202, without the need for tools, which improves the efficiency of installation and maintenance. Preferably, the overall size of the male connector 302 is smaller than that of the female connector 201, and its mating end extends outward with a stepped end cap, the size of which matches the opening of the female connector 201, and the stepped surface fits against the opening end face of the female connector 201. Several symmetrical insertion plates are extended from the other end of the stepped end cap and inserted into the inner wall of the mounting base 201 to enhance the overall rigidity and vibration resistance, while also further preventing particles from entering the interior, resulting in good sealing.

[0024] Based on the above embodiments, a limiting fixture 203 is provided inside the mounting base 201, which can be removed from the mounting base 201 and opened and closed. A limiting groove 204 is provided on the side of the limiting fixture 203 to clamp the side of the handle of the finger body 1. A limiting pin 205 is fixedly connected through the middle side of the limiting groove 204 and is adapted to the arc-shaped adapter port 101.

[0025] Specifically, when the limiting fixture 203 moves out of the mounting female 201, it can unfold outward, thereby placing the handle of the finger body 1 between the two fixtures and inserting it into the mounting female 201. The limiting fixture 203 retracts into the mounting female 201 and, under its limiting action, simultaneously merges inward, so that the limiting groove 204 fits against the side of the handle, and the limiting pin 205 is embedded in the arc-shaped adapter 101 to complete the wrap-around clamping. Finally, the connecting male 302 is covered to complete the locking and fixing. In this embodiment, a removable and unfoldable limiting fixture 203 is provided to prevent blind insertion of the finger body 1 into the mounting base 201, which would cause scratching of the ceramic handle, making installation convenient and quick. Furthermore, a limiting fixture 203 with a wrap-around clamping mechanism is provided, and the limiting groove 204 fits the contour of the handle. The limiting pin 205 makes contact with the curved surface of the arc-shaped adapter 101 to avoid local stress concentration, further reduce the risk of cracking of the ceramic handle, and limit the multi-directional freedom of the finger body 1 to further improve the positioning accuracy. Preferably, a pair of limiting fixtures 203 are provided and arranged symmetrically, and are made of lightweight wear-resistant alloy; the limiting groove 204 is opened on the inner side of the limiting fixture 203, and its outline fits the cross section of the finger handle; the limiting pin 205 is cylindrical, and its diameter matches the groove of the arc-shaped adapter 101, and is fixed in the middle of the limiting fixture 203 by interference fit.

[0026] Based on the above embodiment, a base 206 is slidably fitted on the inner side of the mounting base 201. The bottom of the base 206 is provided with a groove to adapt to the vacuum passage 301. Several overlapping ear plates 207 are extended from both ends of the base 206. A hinge pin 208 is fixedly connected between the upper and lower overlapping ear plates 207. The hinge pin 208 passes through one end of the limiting tooling clamp 203 and is hinged to it.

[0027] Specifically, the base 206 slides outward along the vacuum passage 301, causing the limiting fixture 203 to move out of the opening of the mounting base 201. The limiting fixture 203 is no longer restricted and unfolds around the hinge pin 208. At this time, the operator places one end of the handle of the finger body 1 against the base 206 and between the two fixtures, aligning it with the limiting groove 204. Then, the operator pushes the finger body 1 and the base 206 to slide into the mounting base 201. At this time, the fixture is limited and merges inward around the hinge pin 208, so that the limiting groove 204 fits the handle and the limiting pin 205 is embedded in the arc-shaped adapter 101, completing the wrapping and clamping. In this embodiment, by setting the base 206, no manual visual alignment is required during installation. The handle only needs to be pressed against the base 206 and moved to slide through the base 206, so that the limiting fixture 203 automatically merges through the limiting, completing the engagement of the arc-shaped adapter 101 and the limiting pin 205, reducing the operation threshold and improving the clamping efficiency. Preferably, a torsion spring is provided on the outside of the hinge pin 208 to provide preload to the limiting fixture 203, so that the limiting fixture 203 unfolds outward synchronously when it is no longer restricted, which facilitates the installation of the finger body 1.

[0028] Based on the above embodiment, guide grooves 209 are provided at both ends of the base 206, and guide bars 104 are fixedly connected to both ends of the inner side of the mounting base 201. The guide grooves 209 and guide bars 104 are slidably engaged. The guide bar 104 is fixedly connected to the open end near the mounting base 201 with a protrusion 105. The protrusion 105 is used to limit the merging of the limiting fixture 203 and clamp the handle of the finger body 1.

[0029] Specifically, the base 206 slides outward along the guide bar 104 of the mounting base 201 via the guide groove 209. The limiting fixture 203 always slides in contact with the protrusion 105. Under the action of the torsion spring, it gradually unfolds outward until the base 206 is limited by the protrusion 105 and cannot be dislodged. When the handle of the finger body 1 is pushed to reset the base 206, the limiting fixture 203 is gradually closed inward by the protrusion, thus achieving wrapping and clamping. In this embodiment, a protrusion 105 is provided to prevent the base 206 from displacing and coming off the mounting base 201, and further limits the opening and closing of the limiting fixture 203, thereby improving the structural utilization rate and practicality. Furthermore, by setting the limiting fixture 203 to slide in contact with the protrusion 105, stable opening and closing is achieved in conjunction with the force of the torsion spring. Preferably, the guide groove 209 is a rectangular through groove at both ends of the base 206. The groove opening is chamfered to facilitate assembly, and the groove wall is polished to further reduce sliding friction. The guide strip 104 is made of stainless steel and is integrally formed with the protrusion 105. The surface is coated with a solid lubricating film to improve smoothness.

[0030] Based on the above embodiments, the base 206 has several spring grooves at the open end away from the mounting base 201, and spring members are provided in the spring grooves, with the other end of the spring members abutting against the inner wall of the mounting base 201.

[0031] In this embodiment, a spring is provided to provide thrust, which helps the base 206 move out of the mounting base 201 without the need for manual dragging, thus improving the ease of installation and removal. Preferably, the spring grooves are symmetrically arranged along the width of the base 206 to improve the uniformity of the force on the base 206. The groove depth is greater than the spring compression length, and the groove walls are smoothed to avoid wear when the spring extends or retracts.

[0032] Based on the above embodiment, the top of the base 206 is provided with a movable groove 106, and a pressure plate 107 is hinged in the movable groove 106. The pressure plate 107 is arranged opposite to the vacuum passage 301, and the pressure plate 107 is used to press the handle of the finger body 1 to fit against the vacuum passage 301.

[0033] In this embodiment, the pressure plate 107 is set to further apply pressure to the finger body 1, so that the handle fits and seals with the vacuum passage 301, thereby reducing the vacuum leakage rate. Preferably, the free end of the tablet 107 is provided with a silicone cushioning pad to prevent scratching the ceramic handle.

[0034] Based on the above embodiments, a limiting seat 109 is fixedly connected to the inner wall of the opening end of the mounting female seat 201. The limiting seat 109 is used to restrict the pressing plate 107 from pressing the handle of the finger body 1.

[0035] Specifically, when the base 206 is retracted into the mounting base 201, the free end of the pressing tablet 107 is restricted by the limiting seat 109 until the pressing tablet 107 is completely pressed onto the finger body 1. In this embodiment, by retracting the base 206, the limiting fixture 203 clamps both sides of the finger body 1, and the pressure plate 107 presses the top of the finger body 1. The two actions are completed simultaneously, without the need for step-by-step operation, which improves installation efficiency and simplifies operation. Preferably, the limiting seat 109 is integrally formed from a wear-resistant material and is fixed to the inner wall of the opening end of the mounting female seat 201 by screws.

[0036] Based on the above embodiments, a through opening 108 is provided through the middle side of the tablet 107. The through opening 108 is adapted to the limiting seat 109. The end of the limiting seat 109 near the opening of the mounting female seat 201 is set with a chamfer, and the end of the through opening 108 is set with a bevel.

[0037] Specifically, when the base 206 moves out of the mounting female 201, the through 108 of the pressure plate 107 moves to the position of the limiting seat 109. At this time, the limiting seat 109 can pass through the through 108, so that the pressure plate 107 can be turned outward to the maximum angle, exposing sufficient space for the handle to be picked up and put away. When the base 206 is reset, the pressure plate 107 moves with the base 206. When the inclined surface of the through 108 slides against the chamfer of the limiting seat 109, the limiting seat 109 forces the pressure plate 107 down again until the pressure plate 107 presses the finger body 1 tightly. In this embodiment, the through-hole 108 of the pressing plate 107 is adapted to the limiting seat 109, so that when the base 206 is moved out, the pressing plate 107 can be turned outward at an angle, thereby avoiding the pressing plate 107 from interfering with the handling part for picking and putting, which is highly practical. Preferably, the inner wall of the through-hole 108 is coated with a DLC wear-resistant coating to further improve wear resistance and service life.

[0038] This embodiment also provides a method for manufacturing a vacuum-adhesive finger for a wafer carrier, used for a vacuum-adhesive finger for a wafer carrier as described above, comprising the following steps: 99.5% high-purity alumina ceramic powder was selected, and sintering aids and binders were added to prepare granulated powder. The granulated powder is loaded into a custom mold and pressed into a green body including the stem under a pressure of 150~200MPa. The green blanks are placed in a vacuum sintering furnace for sintering; The arc-shaped adapter port 101, internal air passage and adsorption air hole 102 are machined by CNC.

[0039] In this embodiment, the manufacturing process forms a closed loop from material proportioning, high-pressure molding, vacuum sintering to CNC precision machining, with no redundant steps. Compared with the traditional shank drilling design, it further improves production efficiency and is suitable for the large-scale needs of wafer transmission production lines. Furthermore, by simultaneously precision machining the arc-shaped adapter port 101 with the internal air passage and adsorption pore 102, no secondary position adjustment is required, and it can be directly and precisely connected with the vacuum passage 301, reducing debugging costs.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection, the internal communication between two components, or the interaction between two components. Those skilled in the art can understand the meaning of the above terms in this application according to the specific circumstances.

[0041] The above provides a detailed description of a vacuum adsorption type finger for a wafer carrier and its manufacturing method, as provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A vacuum-adhesive finger for a wafer carrier, characterized in that, It includes a finger body (1) and a robotic arm body (2); The surface of the finger body (1) is provided with a plurality of adsorption pores (102), and the inside of the finger body (1) is provided with an air passage that communicates with the plurality of adsorption pores (102), and one end of the air passage is provided with an air inlet (103). The finger body (1) has arc-shaped adapter openings (101) at both ends of the handle. A connection module (3) is provided between the finger body (1) and the robotic arm body (2); The connection module (3) has a vacuum passage (301) inside. The handle of the finger body (1) is inserted into the connecting module (3), the connecting module (3) is engaged with the arc-shaped adapter (101) and fixed, and the air inlet (103) is connected to the vacuum passage (301).

2. The vacuum adsorption type finger for a wafer carrier according to claim 1, characterized in that, The connection module (3) includes a male connector (302) and a female mounting socket (201); The vacuum passage (301) is located at the bottom inside of the mounting base (201); The mounting female (201) has an opening at one end; One end of the male connector (302) is provided with a card slot, and the handle of the finger body (1) passes through the card slot; The mounting base (201) is connected to the drive end of the robotic arm body (2); The male connector (302) is provided with buckles (303) at both ends, and the female mounting base (201) is provided with slots (202) on both sides near the opening, and the buckles (303) are engaged with the outside of the slots (202).

3. The vacuum adsorption type finger for a wafer carrier according to claim 2, characterized in that, The mounting base (201) is provided with a limiting fixture (203) that can be removed from the mounting base (201) and opened and closed. The side of the limiting fixture (203) is provided with a limiting groove (204) that clamps the side of the handle of the finger body (1). The middle side of the limiting groove (204) is connected to a limiting pin (205), and the limiting pin (205) is adapted to the arc-shaped adapter (101).

4. The vacuum adsorption type finger for a wafer carrier according to claim 3, characterized in that, The mounting base (201) is slidably fitted with a base (206) on its inner side. The bottom of the base (206) is provided with a groove to accommodate the vacuum passage (301). Several overlapping ear plates (207) are extended from both ends of the base (206). A hinge pin (208) is fixedly connected between the upper and lower overlapping ear plates (207). The hinge pin (208) passes through one end of the limiting fixture (203) and is hinged to it.

5. The vacuum adsorption type finger for a wafer carrier according to claim 4, characterized in that, The base (206) has guide grooves (209) at both ends, and guide strips (104) are fixedly connected to the inner ends of the mounting base (201). The guide grooves (209) and guide strips (104) are slidably engaged. The guide bar (104) is fixedly connected to the open end of the mounting base (201) with a protrusion (105), which is used to limit the limiting fixture (203) to merge and clamp the handle of the finger body (1).

6. The vacuum adsorption type finger for a wafer carrier according to claim 4, characterized in that, The base (206) has several spring grooves at the open end away from the mounting base (201), and spring members are provided in the spring grooves. The other end of the spring members abuts against the inner wall of the mounting base (201).

7. The vacuum adsorption type finger for a wafer carrier according to claim 4, characterized in that, The base (206) has a movable groove (106) on its top. A pressure plate (107) is hinged in the movable groove (106). The pressure plate (107) is arranged opposite to the vacuum passage (301). The pressure plate (107) is used to press the handle of the finger body (1) to fit against the vacuum passage (301).

8. The vacuum adsorption type finger for a wafer carrier according to claim 7, characterized in that, The inner wall of the opening end of the mounting female (201) is fixedly connected to a limiting seat (109), which is used to limit the pressure plate (107) from pressing the handle of the finger body (1).

9. A vacuum adsorption type finger for a wafer carrier according to claim 8, characterized in that, The middle side of the tablet (107) is provided with a through opening (108), which is adapted to the limiting seat (109). The end of the limiting seat (109) near the opening of the mounting female seat (201) is set with a chamfer, and the end of the through opening (108) is set with a bevel.

10. A method for manufacturing a vacuum-adhesive finger of a wafer carrier, used for a vacuum-adhesive finger of a wafer carrier as described in any one of claims 1 to 9, characterized in that, Includes the following steps: 99.5% high-purity alumina ceramic powder was selected, and sintering aids and binders were added to prepare granulated powder. The granulated powder is loaded into a custom mold and pressed into a green body including the stem under a pressure of 150~200MPa. The green blanks are placed in a vacuum sintering furnace for sintering; The arc-shaped adapter port (101), internal air passage and adsorption pore (102) are machined by CNC.

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