Circuit board assembly and manufacturing method thereof

Abstract

A manufacturing method of a circuit board assembly comprises the steps that a first circuit board is provided, the first circuit board comprises a first body and first welding flux arranged on one side of the first body, and an open hole is formed in the first body in a penetrating mode; a second circuit board is provided, the second circuit board comprises a second body and a bonding material arranged on one side of the second body, and the second body is provided with a connecting pad; the first circuit board and the second circuit board are stacked, so that the open holes and the bonding materials are staggered, and the first welding flux and the connecting pads are correspondingly arranged. And negative pressure is formed in the open hole, so that the first body and the second body are connected through the bonding material. And heating the first solder so that the connecting pad and the first body are electrically connected through the first solder. In addition, the invention also provides a circuit board assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board manufacturing, in particular to a circuit board assembly and a manufacturing method thereof. BACKGROUND

[0002] Before high-temperature welding of the circuit board and the circuit board, an adhesive layer needs to be set in advance to enhance the bonding force between the two. However, the pre-set adhesive layer will have a problem of decreased bonding force in the subsequent high-temperature welding process, affecting the welding alignment accuracy. If a high-temperature resistant thermosetting glue and hot melt glue are used, the thermosetting glue or hot melt glue needs to be pre-pressed by a pressing strip, but the pressing strip is easy to cause pressure damage to the circuit board. SUMMARY

[0003] To solve the problems in the background art, the purpose of the present application is to provide a manufacturing method of a circuit board assembly, comprising the steps of: providing a first circuit board, the first circuit board comprising a first body and a first solder provided on one side of the first body, the first body being provided with an opening; providing a second circuit board, the second circuit board comprising a second body and an adhesive provided on one side of the second body, the second body being provided with a connecting pad; stacking the first circuit board and the second circuit board, so that the opening and the adhesive are arranged staggered, and the first solder corresponds to the connecting pad; forming a negative pressure in the opening, so that the first body and the second body are connected by the adhesive; heating the first solder, so that the connecting pad and the first body are electrically connected by the first solder.

[0004] In some possible implementations, the second body is provided with a cavity, the opening corresponds to the cavity, and the cavity is used to deform when the negative pressure is formed in the opening.

[0005] In some possible implementations, the first circuit board further comprises a second solder provided on one side of the first body, and the manufacturing method further comprises the steps of:

[0006] providing an electronic component on the second solder, and heating the second solder, so that the electronic component and the first body are electrically connected by the second solder.

[0007] In some possible implementations, the step of "heating the first solder" is performed simultaneously with the step of "heating the second solder".

[0008] In some possible implementations, the first circuit board further comprises a reinforcing plate provided with a limiting groove and a communication hole, the communication hole communicates with the opening, and the limiting groove corresponds to the adhesive, and the step of "forming a negative pressure in the opening" comprises:

[0009] The connecting hole attracts the second body, allowing the adhesive to fill the limiting groove.

[0010] In some possible implementations, the reinforcing plate is a one-piece molded structure, and the connecting holes are spaced apart on the outside of the limiting groove.

[0011] In some possible implementations, the reinforcing plate includes a first part, a second part, and a third part, wherein the second part and the third part are respectively connected to the first part to form the limiting groove, and the limiting groove is disposed away from the solder.

[0012] A circuit board assembly includes a first circuit board and a second circuit board. The second circuit board is stacked on a portion of the first circuit board. The first circuit board includes a first body and a first solder disposed on one side of the first body. The first body has a through-hole. The second circuit board includes a second body and an adhesive disposed on one side of the second body. The second body has a connecting pad. The opening and the adhesive are offset. The first solder and the connecting pad are correspondingly disposed. The first body and the second body are connected by the adhesive. The connecting pad and the first body are electrically connected by the first solder.

[0013] In some possible implementations, the first circuit board further includes a reinforcing plate disposed between the first body and the second body. The reinforcing plate has a limiting groove and a communicating hole, the communicating hole communicating with the opening, the limiting groove corresponding to the adhesive material, and the adhesive material filling the limiting groove.

[0014] In some possible implementations, the circuit board assembly further includes electronic components, and the first circuit board further includes a second solder disposed on one side of the first body, the electronic components and the first body being electrically connected via the second solder.

[0015] Compared to existing technologies, the circuit board assembly manufacturing method provided in this application achieves a tight fit between the first and second circuit boards by first creating a negative pressure within the opening, while simultaneously using adhesive to connect the first and second circuit boards. Then, by heating the first solder, melting and cooling it, an electrical connection is established between the first and third connecting pads. Finally, the opening is restored to a normal pressure state. This ensures a tight fit between the first and second connecting plates during the heating and melting of the solder, thereby improving the alignment accuracy of the welding. Furthermore, the negative pressure adsorption method eliminates the need for pressure strips to apply pressure to the first and second circuit boards, which is beneficial for protecting both circuit boards. Attached Figure Description

[0016] Figure 1This is a cross-sectional schematic diagram of a double-sided copper-clad substrate provided in an embodiment of this application.

[0017] Figure 2 for Figure 1 The diagram shows a cross-sectional view of a double-sided copper-clad substrate after the first blind via has been installed.

[0018] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the first blind hole after the first conductor is installed.

[0019] Figure 4 for Figure 3 The diagram shows a cross-sectional view of the double-sided copper-clad substrate after etching.

[0020] Figure 5 for Figure 4 The diagram shows cross-sectional views of the first and second line layers after the first and second cover layers are respectively installed.

[0021] Figure 6 for Figure 5 The diagram shows the cross-sections of the first connecting pad and the second connecting pad after the first solder resist ring and the second solder resist ring are respectively installed.

[0022] Figure 7 for Figure 6 The diagram shows a cross-sectional view of the first intermediate body obtained after the first covering layer is reinforced with a reinforcing plate.

[0023] Figure 8 for Figure 7 The diagram shows a cross-section of the reinforcing plate after the connecting holes are installed.

[0024] Figure 9 for Figure 8 The diagram shows a cross-sectional view of the first circuit board obtained after the first solder is applied to the first connecting pad.

[0025] Figure 10 This is a top view of a reinforcing plate provided in one embodiment of this application.

[0026] Figure 11 A top view of a reinforcing plate provided in another embodiment of this application.

[0027] Figure 12 This is a cross-sectional schematic diagram of an adhesive layer provided in an embodiment of this application.

[0028] Figure 13 for Figure 12 The diagram shows a cross-sectional view of the second intermediate obtained after the first single-sided copper-clad laminate and the second single-sided copper-clad laminate are respectively installed on both sides of the adhesive layer.

[0029] Figure 14 for Figure 13The diagram shows a cross-section of the second intermediate body after the second blind hole is installed.

[0030] Figure 15 for Figure 14 The diagram shows a cross-sectional view of the second blind hole after the second conductor is installed.

[0031] Figure 16 For etching Figure 15 The diagram shows a cross-section of the first and second single-sided copper-clad laminates.

[0032] Figure 17 for Figure 16 The diagram shows cross-sectional views of the third and fourth line layers after the third and fourth cover layers are respectively installed.

[0033] Figure 18 for Figure 17 The diagram shows a cross-sectional view of the second circuit board obtained after the adhesive is applied to the third cover layer.

[0034] Figure 19 for Figure 9 The first circuit board shown and Figure 18 The diagram shows a cross-sectional view of the second circuit board before assembly.

[0035] Figure 20 for Figure 9 The first circuit board shown and Figure 18 The diagram shows a cross-sectional view of the circuit board assembly formed after the second circuit board is assembled.

[0036] Explanation of main component symbols

[0037] Circuit board assembly 100

[0038] First circuit board 10

[0039] First body 11

[0040] Opening 111

[0041] First insulating layer 112

[0042] First line layer 113

[0043] First connecting pad 113a

[0044] Second connecting pad 113b

[0045] First window 115a

[0046] Second window 115b

[0047] Second line layer 114

[0048] First covering layer 115

[0049] Second covering layer 116

[0050] First Solder 12

[0051] Second solder 13

[0052] Reinforcing plate 14

[0053] Limiting groove 141

[0054] Connecting hole 142

[0055] First weld nub 15

[0056] Second weld nub 16

[0057] First intermediate 17

[0058] Double-sided copper-clad substrate 20

[0059] First copper foil layer 21

[0060] Second copper foil layer 22

[0061] First blind hole 23

[0062] First conductor 24

[0063] Second circuit board 30

[0064] Second Body 31

[0065] Adhesive 32

[0066] Third connecting pad 311

[0067] Adhesive layer 312

[0068] 312a perforation

[0069] Cavity 312b

[0070] Second insulating layer 313

[0071] Third insulating layer 314

[0072] Third line layer 315

[0073] Fourth line layer 316

[0074] Third Covering Layer 317

[0075] Third window 317a

[0076] Fourth Covering Layer 318

[0077] Third weld nub 319

[0078] First single-sided copper-clad laminate 40

[0079] Third copper foil layer 41

[0080] Second single-sided copper clad laminate 50

[0081] Fourth copper foil layer 51

[0082] Second intermediate 60

[0083] Second blind hole 61

[0084] Second conductor 62

[0085] Electronic Components 70

[0086] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0087] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings of specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them.

[0088] Please see Figures 1 to 20 One embodiment of this application provides a method for manufacturing a circuit board assembly 100, including the following steps:

[0089] S1: Please see Figure 9 A first circuit board 10 is provided, the first circuit board 10 including a first body 11, a first solder 12, and a second solder 13. The first solder 12 and the second solder 13 are spaced apart on the same side of the first body 11. The first body 11 is provided with a through hole 111. The through hole 111 is offset from the first solder 12 and the second solder 13.

[0090] In this embodiment, the first body 11 includes a first insulating layer 112, a first circuit layer 113 and a second circuit layer 114 disposed on opposite sides of the first insulating layer 112, a first cover layer 115 disposed on the first circuit layer 113, and a second cover layer 116 disposed on the second circuit layer 114. The first cover layer 115 has a first opening 115a and a second opening 115b, and the first solder 12 and the second solder 13 are spaced apart on one side of the first circuit layer 113. The first solder 12 is exposed in the first opening 115a, and the second solder 13 is exposed in the second opening 115b.

[0091] In this embodiment, the first circuit board 10 further includes a reinforcing plate 14, which is provided with a limiting groove 141 and a plurality of connecting holes 142, the connecting holes 142 connecting to the opening 111. The limiting groove 141 and the opening 111 are staggered.

[0092] Please see Figures 1 to 9 In this embodiment, the manufacturing method of the first circuit board 10 includes the following steps:

[0093] S11: Please refer to Figure 1 A double-sided copper-clad substrate 20 is provided, comprising a first copper foil layer 21, a second copper foil layer 22, and a first insulating layer 112. The first copper foil layer 21 and the second copper foil layer 22 are respectively disposed on opposite sides of the first insulating layer 112. The first insulating layer 112 is made of at least one of polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate dimethyl phthalate (PEN), liquid crystal polymer (LCP), and modified polyimide (MPI). Preferably, the first insulating layer 112 is made of polyimide.

[0094] S12: Please refer to Figure 2 A first blind via 23 is provided on the double-sided copper-clad substrate 20. The first blind via 23 penetrates the second copper foil layer 22 and the first insulating layer 112, with a portion of the first copper foil layer 21 exposed at the bottom of the first blind via 23. The first blind via 23 is formed by laser drilling. In other embodiments of this application, the first blind via 23 can be formed by mechanical drilling or chemical etching.

[0095] S13: Please see Figure 3 A first conductive element 24 is formed by electroplating within the first blind via 23, and the first conductive element 24 electrically connects the first copper foil layer 21 and the second copper foil layer 22. In other embodiments of this application, the first conductive element 24 can be formed by chemical deposition.

[0096] S14: Please see Figure 4The first copper foil layer 21 is etched to form the first circuit layer 113, and the second copper foil layer 22 is etched to form the second circuit layer 114. The first conductor 24 electrically connects the first circuit layer 113 and the second circuit layer 114. The first circuit layer 113 includes a first connection pad 113a and a second connection pad 113b.

[0097] S15: Please see Figure 5 A first cover layer 115 is disposed on the first circuit layer 113, and a second cover layer 116 is disposed on the second circuit layer 114. The first cover layer 115 has a first opening 115a and a second opening 115b. The first connecting pad 113a is exposed through the first opening 115a. The second connecting pad 113b is exposed through the second opening 115b. The first cover layer 115 and the second cover layer 116 are made of one of polyimide, polyester, or epoxy resin.

[0098] S16: Please see Figure 6 A first solder resist ring 15 is provided at the edge of the first window 115a, and a second solder resist ring 16 is provided at the edge of the second window 115b. The first solder resist ring 15 and the second solder resist ring 16 are solder resist inks. Solder resist inks have good heat resistance, insulation, and chemical corrosion resistance, and can effectively prevent solder overflow during subsequent soldering processes.

[0099] S17: Please see Figure 7 The reinforcing plate 14 is disposed on the first covering layer 115, and the reinforcing plate 14 is disposed at intervals with the first window 115a and the second window 115b to obtain the first intermediate body 17.

[0100] S18: Please see Figure 8 The opening 111 is provided in the first intermediate body 17, and the connecting hole 142 is provided in the reinforcing plate 14. The connecting hole 142 is opposite to the opening 111. There are multiple connecting holes 142, and the limiting groove 141 is spaced apart from the multiple connecting holes 142.

[0101] Please see Figure 10 In this embodiment, the reinforcing plate 14 is an integrally formed structure, the limiting groove 141 is located at the center of the reinforcing plate 14, and a plurality of connecting holes 142 are spaced apart around the outside of the limiting groove 141. Please refer to Figure 11In other embodiments of this application, the reinforcing plate 14 includes a first portion 14a, a second portion 14b, and a third portion 14c. The second portion 14b and the third portion 14c are respectively connected to the first portion 14a to form a semi-enclosed structure of the limiting groove 141. The opening direction of the limiting groove 141 is opposite to the first window 115a. The first portion 14a, the second portion 14b, and the third portion 14c are all provided with the communicating hole 142.

[0102] S19: Please see Figure 9 The first solder 12 is disposed in the first opening 115a, and the first connecting pad 113a is connected to the first solder 12. The second solder 13 is disposed in the second opening 115b, and the second connecting pad 113b is connected to the second solder 13, thereby obtaining the first circuit board 10. The first solder 12 and the second solder 13 are solder paste, copper paste, etc.

[0103] S2: Please see Figure 18 A second circuit board 30 is provided, the second circuit board 30 including a second body 31 and an adhesive 32 disposed on one side of the second body 31, the second body 31 being provided with a third connecting pad 311. The adhesive 32 and the third connecting pad 311 are disposed at intervals.

[0104] In this embodiment, the second body 31 includes an adhesive layer 312, a second insulating layer 313 and a third insulating layer 314 disposed on opposite sides of the adhesive layer 312, a third circuit layer 315 disposed on the side of the second insulating layer 313 away from the adhesive layer 312, a fourth circuit layer 316 disposed on the side of the third insulating layer 314 away from the adhesive layer 312, a third cover layer 317 disposed on the side of the third circuit layer 315 away from the second insulating layer 313, and a fourth cover layer 318 disposed on the side of the fourth circuit layer 316 away from the third insulating layer 314. The third cover layer 317 has a third opening 317a, through which the third connecting pad 311 is exposed. A third solder resist ring 319 is provided at the edge of the third opening 317a.

[0105] In this embodiment, the adhesive layer 312 has a through hole 312a, and the second insulating layer 313 and the third insulating layer 314 cover the opposite ends of the through hole 312a, thereby forming a cavity 312b. The cavity 312b is used to improve the bending performance of the second circuit board 30.

[0106] In this embodiment, the manufacturing method of the second circuit board 30 specifically includes the following steps:

[0107] S21: Please seeFigure 12 An adhesive layer 312 is provided, wherein the adhesive layer 312 is provided with the perforation 312a. The adhesive layer 312 is made of materials including epoxy resin, phenolic resin, polyurethane, and silicone resin.

[0108] S22: Please see Figure 13 A first single-sided copper-clad laminate 40 and a second single-sided copper-clad laminate 50 are respectively disposed on opposite sides of the adhesive layer 312 to obtain a second intermediate body 60. The first single-sided copper-clad laminate 40 includes a second insulating layer 313 and a third copper foil layer 41 disposed on the second insulating layer 313. The second insulating layer 313 is located between the third copper foil layer 41 and the adhesive layer 312. The second insulating layer 313 covers one opening end of the perforation 312a. The second single-sided copper-clad laminate 50 includes a third insulating layer 314 and a fourth copper foil layer 51 disposed on the third insulating layer 314. The third insulating layer 314 is located between the fourth copper foil layer 51 and the adhesive layer 312. The third insulating layer 314 covers the other opening end of the perforation 312a. That is, the second insulating layer 313 and the third insulating layer 314 respectively cover the two opening ends of the perforation 312a, thereby forming the cavity 312b. The second insulating layer 313 and the third insulating layer 314 are made of the same material as the first insulating layer 112.

[0109] S23: Please see Figure 14 A second blind hole 61 is provided in the second intermediate body 60. The second blind hole 61 penetrates the second single-sided copper-clad laminate 50, the adhesive layer 312, and the second insulating layer 313, with a portion of the third copper foil layer 41 exposed at the bottom of the second blind hole 61. The second blind hole 61 is offset from the cavity 312b. The second blind hole 61 is formed by laser drilling. In other embodiments of this application, the second blind hole 61 can be formed by mechanical drilling or chemical etching.

[0110] S24: Please see Figure 15 A second conductive body 62 is formed by electroplating the second blind hole 61, and the second conductive body 62 is electrically connected to the third copper foil layer 41 and the fourth copper foil layer 51.

[0111] S25: Please see Figure 16 The third copper foil layer 41 is etched to form the third circuit layer 315, and the fourth copper foil layer 51 is etched to form the fourth circuit layer 316. The third circuit layer 315 includes the third connection pad 311.

[0112] S26: Please see Figure 17A third cover layer 317 is provided on the third circuit layer 315, and the third cover layer 317 is provided with a third opening 317a, through which the third connecting pad 311 is exposed. Simultaneously, a fourth cover layer 318 is provided on the fourth circuit layer 316.

[0113] S27: Please see Figure 18 The third solder resist ring 319 is provided around the periphery of the third connecting pad 311, and the adhesive 32 is provided on the third cover layer 317 to obtain the second circuit board 30.

[0114] S3: Please see Figure 19 The first circuit board 10 and the second circuit board 30 are partially stacked, wherein the opening 111 is staggered from the adhesive 32, the adhesive 32 is provided corresponding to the limiting groove 141, and the first solder 12 is provided corresponding to the third connecting pad 311.

[0115] In this embodiment, step S3 further includes:

[0116] S31: An electronic component 70 is disposed on the second solder 13. The electronic component 70 includes one of a chip, an inductor, a capacitor, a battery, and a resistor.

[0117] S4: Please see Figure 20 A negative pressure is formed in the opening 111, so that the first circuit board 10 is tightly attached to the second circuit board 30. At the same time, the adhesive 32 is squeezed and filled into the limiting groove 141 of the reinforcing plate 14 to reduce the risk of the adhesive 32 overflowing and improve the stability of the electrical connection between the first circuit board 10 and the second circuit board 30.

[0118] In this embodiment, the process of forming a negative pressure in the opening 111 in step S4 is as follows: First, a section of the connecting hole 142 of the reinforcing plate 14 is brought into contact with the fourth covering layer 318. Then, a vacuum is drawn in the opening 111 connected to the connecting hole 142, so that the opening 111 changes from a normal pressure state to a negative pressure state. At the same time, atmospheric pressure pushes the portion of the second circuit board 30 corresponding to the opening 111 to adhere to the first circuit board 10, causing deformation in a portion of the area between the portion of the first circuit board 10 corresponding to the opening 111 and the portion of the first circuit board 10 offset from the opening 111. This allows the partially stacked first circuit board 10 and second circuit board 30 to fit together better, reducing the problem of incomplete fitting caused by unevenness of their contact surfaces. In addition, since the second body 31 has a cavity 312b, the cavity 312b can buffer the suction force between the first circuit board 10 and the second circuit board 30, reducing the internal stress in the deformation area.

[0119] S5: Please see Figure 20 The first solder 12 is heated until it melts and then cooled, achieving an electrical connection between the first connecting pad 113a and the third connecting pad 311. Then, the opening 111 is restored to its normal pressure state to obtain the circuit board assembly 100. The first solder 12 is heated using a reflow soldering process.

[0120] In this embodiment, step S5 further includes:

[0121] S51: The second solder 13 is heated, melted, and then cooled to achieve an electrical connection between the electronic component 70 and the second connecting pad 113b. Heating of the first solder 12 and heating of the second solder 13 are performed simultaneously.

[0122] Compared with the prior art, the manufacturing method of the circuit board assembly 100 provided in this application has the following advantages:

[0123] (i) By first creating a negative pressure within the opening 111, the first circuit board 10 and the second circuit board 30 are tightly bonded together. Simultaneously, the adhesive 32 connects the first circuit board 10 and the second circuit board 30. Then, by heating the first solder 12, the first connecting pad 113a and the third connecting pad 311 are electrically connected after melting and cooling. Finally, the opening 111 is restored to a normal pressure state, which ensures the tight bonding between the first connecting plate and the second connecting plate during the heating and melting of the solder, thereby improving the alignment accuracy of the welding. Moreover, the negative pressure adsorption method eliminates the need to apply pressure strips to the first circuit board 10 and the second circuit board 30, which is beneficial for protecting the first circuit board 10 and the second circuit board 30.

[0124] (ii) By providing a cavity 312b in the first circuit board 10, the first circuit board 10 has better bending performance. After a negative pressure is formed in the opening 111, the first circuit board 10 deforms to achieve a tighter fit with the second circuit board 30, which is suitable for the connection between the first circuit board 10 and the second circuit board 30 that are uneven or have a height difference.

[0125] (iii) By placing the adhesive 32 in the limiting groove 141 of the reinforcing plate 14, it is not only beneficial to increase the contact area between the adhesive 32 and the reinforcing plate 14 and improve the bonding force, but also to limit the adhesive 32 within the reinforcing plate 14, reducing the risk of the adhesive 32 overflowing to the first connecting pad 113a and the third connecting pad 311.

[0126] Please see Figure 18 , Figure 19 and Figure 20An embodiment of this application also provides a circuit board assembly 100, including a first circuit board 10 and a second circuit board 30. The second circuit board 30 is stacked on a portion of the first circuit board 10. The first circuit board 10 includes a first body 11 and a first solder 12 disposed on one side of the first body 11. The first body 11 has a through-hole 111. The second circuit board 30 includes a second body 31 and an adhesive 32 disposed on one side of the second body 31. The second body 31 has a third connecting pad 311. The opening 111 and the adhesive 32 are offset. The first solder 12 and the third connecting pad 311 are correspondingly disposed. The first body 11 and the second body 31 are connected by the adhesive 32. The third connecting pad 311 and the first body 11 are electrically connected by the first solder 12.

[0127] In this embodiment, the first circuit board 10 further includes a reinforcing plate 14, which is disposed between the first body 11 and the second body 31. The reinforcing plate 14 is provided with a limiting groove 141 and a connecting hole 142. The connecting hole 142 connects to the opening 111. The limiting groove 141 is provided corresponding to the adhesive 32, and the adhesive 32 is filled into the limiting groove 141.

[0128] In this embodiment, the circuit board assembly 100 further includes an electronic component 70, and the first circuit board 10 further includes a second solder 13, which is disposed on one side of the first body 11. The electronic component 70 and the first body 11 are electrically connected through the second solder 13.

[0129] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of the present invention and are not intended to limit the present invention. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that, Including the following steps: A first circuit board is provided, the first circuit board including a first body and a first solder disposed on one side of the first body, the first body having an opening through it; A second circuit board is provided, the second circuit board including a second body and an adhesive disposed on one side of the second body, the second body being provided with a connecting pad; The first circuit board and the second circuit board are stacked such that the opening is staggered from the adhesive, and the first solder is correspondingly positioned to the connecting pad. A negative pressure is formed within the opening, allowing the first body and the second body to be connected by the adhesive. The first solder is heated so that the connecting pad and the first body are electrically connected through the first solder.

2. The manufacturing method as described in claim 1, characterized in that, The second body has a cavity, and the opening is provided corresponding to the cavity. The cavity is used to deform when a negative pressure is formed in the opening.

3. The manufacturing method as described in claim 1, characterized in that, The first circuit board further includes a second solder, which is disposed on one side of the first body. The manufacturing method further includes the step of: Electronic components are disposed on the second solder, and the second solder is heated so that the electronic components and the first body are electrically connected through the second solder.

4. The manufacturing method as described in claim 3, characterized in that, The steps "heating the first solder" and "heating the second solder" are performed simultaneously.

5. The manufacturing method as described in claim 1, characterized in that, The first circuit board further includes a reinforcing plate, which has a limiting groove and a connecting hole. The connecting hole connects to the opening, and the limiting groove is provided corresponding to the adhesive. The step of "forming a negative pressure in the opening" includes: The connecting hole attracts the second body, allowing the adhesive to fill the limiting groove.

6. The manufacturing method as described in claim 5, characterized in that, The reinforcing plate is an integrally formed structure, and the connecting holes are spaced apart on the outside of the limiting groove.

7. The manufacturing method as described in claim 5, characterized in that, The reinforcing plate includes a first part, a second part, and a third part. The second part and the third part are respectively connected to the first part to form the limiting groove, and the limiting groove is disposed away from the solder.

8. A circuit board assembly, characterized in that, include: First circuit board; A second circuit board is stacked on a portion of the first circuit board; The first circuit board includes a first body and a first solder disposed on one side of the first body. The first body has a through hole. The second circuit board includes a second body and an adhesive disposed on one side of the second body. The second body has a connecting pad. The opening and the adhesive are offset. The first solder and the connecting pad are correspondingly disposed. The first body and the second body are connected by the adhesive. The connecting pad and the first body are electrically connected by the first solder.

9. The circuit board assembly as claimed in claim 8, characterized in that, The first circuit board further includes a reinforcing plate, which is disposed between the first body and the second body. The reinforcing plate has a limiting groove and a connecting hole, the connecting hole connecting to the opening, and the limiting groove corresponding to the adhesive material, which is filled into the limiting groove.

10. The circuit board assembly as claimed in claim 8, characterized in that, The circuit board assembly further includes electronic components, and the first circuit board further includes a second solder, which is disposed on one side of the first body, and the electronic components and the first body are electrically connected through the second solder.

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