Bonding device and method

Abstract

The invention discloses a bonding device and method, and relates to the technical field of semiconductor packaging equipment.The bonding device comprises a marble base, a workbench assembly, a bonding device and a visual positioning assembly, the workbench assembly is installed at the top of the marble base, and the bonding device is located above the workbench assembly; the visual positioning assemblies are distributed on the two sides of the bonding device and the edge of the workbench assembly, and aims at solving the problems that an existing bonding device is weak in rigidity, the setting requirement of a visual feedback assembly is high, a chip is prone to being polluted in the movement process, and the high-rigidity automatic leveling capacity is lacked. Through optimization of structural layout, separation of visual reference, design of an anti-pollution system and integration of a high-precision leveling mechanism, collaborative improvement of bonding precision, stability and cleanliness is realized, and the device is suitable for high-precision bonding scenes of semiconductor chips, microelectronic elements and the like.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging equipment technology, specifically to a bonding apparatus and method. Background Technology

[0002] Bonding devices are specialized equipment used to achieve atomic, molecular, or mechanical connections between different materials or components. Their core function is to use physical, chemical, or physicochemical methods to form a stable and reliable bonded structure between originally separate components. They are widely used in high-precision manufacturing fields such as semiconductors, microelectronics, optoelectronics, new energy, and medical devices.

[0003] Most existing technologies use cantilever structures, but their overall rigidity is weak, making it difficult to control end-effector jitter and thus affecting placement accuracy. Furthermore, the visual feedback components usually move with the bonding head, requiring extremely high camera speed adjustment, which increases the difficulty of equipment debugging. The tiny particles released during the movement can easily contaminate the chip and reduce bonding quality. Moreover, they rarely have high-rigidity automatic leveling capabilities, which cannot meet the stringent parallelism requirements of high-precision bonding.

[0004] Therefore, we propose a bonding device and method to solve the problems mentioned above. Summary of the Invention

[0005] The purpose of this invention is to provide a bonding device and method that addresses the problems of weak rigidity, high camera calibration requirements, susceptibility to contamination, and lack of high-rigidity automatic leveling capability in existing bonding devices. By optimizing the structural design and functional configuration, the invention improves bonding accuracy, stability, and cleanliness.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a bonding device, comprising a marble base, a workbench assembly, a bonding device, and a vision positioning assembly, wherein the workbench assembly is mounted on the top of the marble base, the bonding device is located above the workbench assembly, and the vision positioning assembly is distributed on both sides of the bonding device and the edge of the workbench assembly. The bonding device includes a bonding mounting base, a linear guide rail, and a bonding head. A drive motor for providing driving force and a grating ruler for real-time position data acquisition are mounted on the top of the bonding mounting base. The linear guide rail is slidably connected to the bonding mounting base and can move along the length of the base. The bonding head is fixed to the linear guide rail via a mounting bracket and moves synchronously with it. The bonding head integrates a voice coil motor for controlling vertical movement, a rotary motor for adjusting angle, and an air-bearing guide shaft for assisting vertical guidance. A suction nozzle for picking up chips is located at the bottom of the bonding head. Above the suction nozzle are sequentially connected a flexible hinge capable of elastic deformation, a piezoelectric actuator for providing leveling driving force, and a guide leaf spring for assisting positioning. A suction connector is located on the side of the bonding head to discharge tiny particles generated during device movement, preventing particle contamination of the chips.

[0007] Preferably, the bottom of the marble base is equipped with a vibration isolator to reduce external vibration interference. The vibration isolator can weaken the impact of external environmental vibration on the bonding process. The workbench assembly and the marble base are fixedly connected to ensure the stability of the workbench assembly when carrying the chip and avoid positional displacement due to loose connection.

[0008] Preferably, the visual positioning component includes three sets of camera-related components, namely camera A component, camera B component and camera C / D component. Camera A component and camera B component are fixed to the edge of the marble base and do not move with the bonding head, so there is no need to frequently adjust the camera parameters, thereby reducing the camera setting requirements. Camera C / D component consists of two independent cameras, namely camera C and camera D, and the two cameras are symmetrically installed on both sides of the bonding head and move synchronously with the bonding head.

[0009] Preferably, the bonding head is provided with a bonding head cover plate for protecting the internal structure and a compression bellows with telescopic characteristics. The compression bellows is sleeved on the outside of the air-bearing guide shaft inside the bonding head, which can not only prevent external dust from entering the air-bearing guide shaft and play a dustproof role, but also buffer the impact when the air-bearing guide shaft moves. The bottom of the bonding head is provided with a Z-axis slide for driving it to slide in the vertical direction and a Z-axis grating ruler for collecting vertical displacement information.

[0010] Preferably, the piezoelectric actuator above the nozzle cooperates with the flexible hinge. The piezoelectric actuator provides driving force, causing the flexible hinge to deform, thereby realizing a high-rigidity automatic leveling function. By adjusting the tilt angle of the nozzle in real time, the parallelism between the nozzle and the chip and the worktable is ensured, meeting the high-precision bonding requirements. The guide leaf spring is set between the piezoelectric actuator and the nozzle to assist in positioning the nozzle, improve the stability during the leveling process, and avoid leveling deviation.

[0011] Preferably, a high-precision rangefinder for detecting surface morphology is installed on the side of the workbench assembly. The high-precision rangefinder can scan the surface of the workbench assembly in real time, capture surface height differences, detect the flatness of the workbench surface, and transmit the detected flatness data to the leveling system to provide feedback data for the leveling system to adjust the parallelism of the suction nozzle.

[0012] Preferably, the bonding mounting base and the linear guide rail adopt a sliding fit, and the linear guide rail can slide stably along the bonding mounting base, driving the bonding head fixed thereto to move horizontally. The grating ruler on the top of the bonding mounting base can collect the displacement information of the linear guide rail in real time, and feed the position data back to the control system, so as to adjust the output of the drive motor through the system.

[0013] Preferably, a suction nozzle is installed at the bottom of the bonding head. The suction nozzle is made of an antistatic material with electrostatic dissipation properties, which can prevent the suction nozzle from adsorbing the chip due to static electricity when it comes into contact with the chip. The suction and discharge connector on the side of the bonding head is connected to an external negative pressure device, forming a continuous negative pressure environment inside the suction and discharge connector and constructing a continuous dust suction channel.

[0014] Preferably, the bottom of the bonding head is provided with a bonding head base for supporting the overall structure of the bonding head. The bonding head base and the mounting bracket that drives the bonding head to move are rigidly connected to suppress the end jitter of the bonding head during movement. In the visual positioning component, camera A and camera B, which are fixed to the edge of the marble base, can completely cover the entire working area of ​​the workbench component and capture the global position information of the workbench and the chip.

[0015] A method of using a bonding device includes the following steps: Step 1: Turn on the main power supply, activate the vibration isolator at the bottom of the marble base to enter the vibration reduction state, and simultaneously start the high-precision rangefinder. The equipment enters the standby calibration state, and the grating ruler and Z-axis grating ruler are started to collect the initial position data in real time and feed it back to the control system.

[0016] Step 2: Input the chip bonding parameters through the control system, scan the surface of the worktable components with a high-precision rangefinder, transmit the flatness data to the leveling system, and use camera components A and B to capture a global image of the worktable to determine the chip placement reference area. Cameras C and D move with the bonding head to the initial pick-up position to complete the positioning calibration.

[0017] Step 3: The voice coil motor drives the Z-axis slide to descend, and the suction nozzle picks up the chip by adsorbing it through negative pressure. The piezoelectric actuator drives the flexible hinge to deform according to the data of the high-precision rangefinder, and adjusts the tilt angle of the suction nozzle in conjunction with the guide leaf spring. The rotary motor fine-tunes the angle of the bonding head to complete the pickup posture calibration.

[0018] Step 4: Connect the exhaust connector to the external negative pressure equipment to build a dust extraction channel. The control system drives the linear guide rail and the Z-axis slide to move the bonding head to the bonding target position according to the preset coordinates. Cameras C and D capture and report the position deviation. The control system adjusts the horizontal displacement and vertical height of the bonding head through the grating ruler and the Z-axis grating ruler.

[0019] Step 5: The voice coil motor outputs a preset pressure, driving the nozzle to press the chip to the target position to complete the bonding. During bonding, the air-bearing guide shaft assists in the guidance, and the compressed bellows buffers and prevents dust. The anti-static nozzle avoids electrostatic interference. After bonding, the voice coil motor drives the nozzle to reset, and the linear guide rail returns to the initial position; the vision positioning component captures a verification image.

[0020] Compared with the prior art, the beneficial effects of the present invention are: 1) This invention addresses the core pain point of weak rigidity in traditional cantilever structures through multi-dimensional structural optimization and functional integration. It utilizes a marble base to provide a highly stable load-bearing foundation, coupled with a bottom vibration isolator to reduce external vibration interference. The bonding head base is rigidly connected to the mounting bracket. Simultaneously, the precise coordination of the linear guide rail and grating ruler effectively suppresses end-effector jitter during bonding head movement, elevating the horizontal and vertical positioning accuracy to a higher level. This meets the bonding and mounting requirements of high-precision components such as semiconductor chips, fundamentally reducing the common end-effector jitter problem in cantilever structures. Combined with real-time position feedback from the grating ruler and Z-axis grating ruler, it achieves micron-level positioning accuracy in both horizontal and vertical directions, significantly improving mounting stability. Furthermore, it innovatively separates the visual reference layout, fixing camera components A and B to the edge of the marble base, preventing them from moving with the bonding head. This avoids the stringent requirements of traditional follow-up vision components for rapid camera adjustment. Simultaneously, it forms a binocular positioning system with camera components C / D on both sides of the bonding head, covering the entire working area of ​​the worktable, significantly improving alignment accuracy compared to traditional single-camera solutions.

[0021] 2) This invention solves the industry problem of particulate contamination of chips during movement. A suction connector is provided on the side of the bonding head, connecting to an external negative pressure device to form a continuous dust extraction channel. This allows for the real-time removal of tiny particles generated by moving parts, creating a dual cleanliness guarantee system against contamination and static electricity. The suction nozzle is made of anti-static material to prevent impurity adsorption. The suction connector, connected to the external negative pressure device, forms a continuous dust extraction channel, allowing for the real-time removal of tiny particles generated during movement. Combined with a compressed bellows for dust protection of the air-bearing guide shaft, this ensures the cleanliness of the bonding process and improves the stability of chip bonding quality. An innovative high-rigidity automatic leveling mechanism fills the gap in precise leveling capabilities found in traditional devices. Utilizing the synergistic effect of a piezoelectric actuator and a flexible hinge, the parallelism of the suction nozzle can be adjusted in real time. Combined with feedback data from a high-precision rangefinder on the side of the worktable assembly, a closed loop is formed from detection to feedback and then to leveling. A guide spring assists in positioning, improving leveling stability and ensuring that the parallelism of the component bonding surfaces meets high-precision bonding requirements during the bonding process. This invention is suitable for bonding scenarios sensitive to parallelism, such as microelectronic components. Attached Figure Description

[0022] Figure 1 This is a perspective view of the main structure of a bonding device and method according to the present invention; Figure 2 This is a three-dimensional exploded view of the structure of a bonding device and method according to the present invention. Figure 3 This is a perspective view of the bonding head in a bonding device and method according to the present invention. Figure 4 This is an exploded perspective view of the bonding device in the bonding apparatus and method of the present invention; Figure 5 This is a split perspective view of the workbench assembly in a bonding device and method of the present invention. Figure 6 This is a schematic diagram of the assembly of a marble base and camera A in a bonding device and method according to the present invention. Figure 7 This is a schematic diagram of the assembly of the workbench component and the high-precision rangefinder in a bonding device and method of the present invention. Figure 8 This is a schematic diagram of the bonding device and linear guide rail assembly in a bonding device and method according to the present invention.

[0023] In the diagram: 101, marble base; 102, vibration isolator; 103, worktable assembly; 104, camera B assembly; 105, high-precision rangefinder; 200, camera A assembly; 300, bonding device; 301, bonding mounting base; 302, drive motor; 303, linear guide; 304, grating ruler; 400, bonding head assembly; 401, bonding head cover; 402, mounting bracket; 403, pull-out connector; 404, voice coil motor; 405, rotary motor; 406, compression bellows; 407, air-bearing guide shaft; 408, Z-axis slide; 409, Z-axis grating ruler assembly; 410, flexible hinge; 411, piezoelectric actuator; 412, guide leaf spring; 413, suction nozzle; 414, bonding head base; 500, camera C / D assembly; 501, camera C; 502, camera D. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] This invention addresses the problems of existing bonding devices, such as weak rigidity, high requirements for camera calibration, susceptibility to contamination, and lack of high-rigidity automatic leveling capability. Traditional bonding devices are mostly cantilever structures, with visual feedback following the movement of the bonding head. They also lack effective anti-contamination design and integrated leveling mechanisms, resulting in insufficient bonding accuracy and stability. This invention was made to solve the problems of the prior art by optimizing the structural layout, separating the visual reference, designing an anti-contamination system and integrating a leveling mechanism, thereby comprehensively improving the performance of the bonding device. Example 1, please refer to Figures 1-8As shown, the present invention provides a technical solution: a bonding device, including a marble base 101, a workbench assembly 103, a bonding device 300, and a vision positioning component. The workbench assembly 103 is mounted on top of the marble base 101, the bonding device 300 is located above the workbench assembly 103, and the vision positioning component is distributed on both sides of the bonding device 300 and the edge of the workbench assembly 103. The bonding device 300 includes a bonding mounting base 301, a linear guide rail 303, and a bonding head 400. A drive motor 302 and a grating ruler 304 are mounted on the top of the bonding mounting base 301, and the linear guide rail 303 is slidably connected to the bonding mounting base 301. The bonding head 400 is fixed to the linear guide rail 303 by the mounting bracket 402. The bonding head 400 integrates a voice coil motor 404, a rotary motor 405 and an air-bearing guide shaft 407. The bottom of the bonding head 400 is provided with a suction nozzle 413. A flexible hinge 410, a piezoelectric actuator 411 and a guide leaf spring 412 are connected in sequence above the suction nozzle 413. The side of the bonding head 400 is provided with a drawer connector 403. A vibration isolator 102 is installed at the bottom of the marble base 101. The visual positioning component includes a camera A component 200, a camera B component 104 and a camera C / D component 500. A high-precision rangefinder 105 is installed on the side of the worktable component 103.

[0026] In some embodiments, such as Figures 1-5 and Figure 8 As shown, the bonding head base 414 is rigidly connected to the mounting bracket 402, the linear guide rail 303 is slidably engaged with the bonding mounting base 301, and the grating ruler 304 provides real-time feedback on the horizontal position information of the bonding head 400; the bonding head 400 is provided with a bonding head cover plate 401 and a compression bellows 406 on its exterior, the compression bellows 406 is sleeved on the exterior of the air-bearing guide shaft 407, and the Z-axis slide plate 408 and the Z-axis grating ruler 409 at the bottom of the bonding head 400 cooperate to precisely control the vertical movement accuracy.

[0027] During operation, after the equipment is started, a system self-test is first performed to confirm that the vibration isolator 102 at the bottom of the marble base 101 is in normal working condition, eliminating interference from external environmental vibrations on subsequent bonding operations. Simultaneously, it is ensured that the worktable assembly 103 is securely connected to the marble base 101 without loosening or shifting. The parameters of the vision positioning assembly are calibrated, adjusting the focal length, exposure, and other parameters of camera assembly A 200, camera assembly B 104 (fixed to the edge of the marble base 101), and camera assembly C / D 500 (installed on both sides of the bonding head 400) to ensure clear images from each camera, providing an accurate image basis for subsequent positioning. The status of each component of the bonding device 300 is checked, confirming the status of the drive motor 302, voice coil motor 404, and rotary motor 400. 5. Power supply is normal, linear guide 303 slides smoothly with bonding mounting base 301, air path of air flotation guide shaft 407 is unobstructed, suction nozzle 413 is undamaged and has good anti-static performance, and extraction connector 403 is reliably connected to external negative pressure equipment. The component to be bonded (such as a chip or substrate) is placed on worktable assembly 103. The vision positioning assembly starts working. Camera A assembly 200 and camera B assembly 104 capture a full-area image of the worktable, capturing the global position coordinates of the component. Camera C / D assembly 500 moves initially above the component with bonding head 400, capturing local details of the component and obtaining subtle posture information. The control system receives and fuses the positioning data from the three cameras, calculating the precise position of the component to be picked up and the motion parameters that the bonding head 400 needs to adjust. Simultaneously, the high-precision rangefinder 105 on the side of the workbench assembly 103 detects the flatness of the workbench surface in real time and transmits the data to the leveling system to provide a basis for the subsequent leveling of the suction nozzle 413. The drive motor 302 drives the linear guide rail 303 to slide along the bonding mounting base 301, causing the bonding head 400 to move horizontally to directly above the component to be picked up. During this process, the grating ruler 304 provides real-time feedback on the horizontal position information of the bonding head 400. The control system fine-tunes the output of the drive motor 302 based on the feedback data to ensure precise alignment of the bonding head 400. The voice coil motor 404 starts, driving the Z-axis slide 408 at the bottom of the bonding head 400 to descend vertically along the air-bearing guide shaft 407. The Z-axis grating ruler 409 monitors the vertical displacement in real time and controls the bonding head 400. The nozzle 413 smoothly approaches the component until it contacts the component and generates negative pressure to adsorb it. During this process, the compressed bellows 406 extends and retracts synchronously with the Z-axis slide 408, preventing dust from entering the air-bearing guide shaft 407. The bonding head cover 401 protects the internal components from interference by debris. Based on the worktable flatness data fed back by the high-precision rangefinder 105, the leveling system sends a leveling command to the piezoelectric actuator 411. The piezoelectric actuator 411 drives the flexible hinge 410 to undergo precise deformation through voltage changes, adjusting the tilt angle of the nozzle 413 so that the adsorbed component remains parallel to the worktable surface. The guide leaf spring 412 assists in stabilizing the leveling process and avoids vibration affecting the parallelism accuracy. After leveling is completed, the drive motor 302 drives the linear guide 303 again.The bonding head 400 and the adsorbed component are moved horizontally to the target bonding position. A linear encoder 304 continuously provides positional feedback to ensure precise alignment. Then, a voice coil motor 404 drives the bonding head 400 to descend vertically, pressing the component into the target position to complete the bonding. A rotary motor 405 can fine-tune the component angle as needed to ensure accurate bonding posture. During bonding, the extraction connector 403 on the side of the bonding head 400 continuously extracts and filters out tiny particles generated by moving parts and packaging debris detached from the component through an external negative pressure device, preventing particle contamination of the component and affecting bonding quality. After a single bonding operation, the voice coil motor 404 drives the bonding head 400 to rise vertically to reset, and the drive motor 302 moves the bonding head 400 horizontally to the initial position. The suction nozzle 413 releases the negative pressure, preparing for the next component pickup.

[0028] In some embodiments, such as Figures 1-2 , Figure 4 and Figures 6-7 As shown, camera A component 200 and camera B component 104 are fixed to the edge of marble base 101, and the shooting range covers the entire working area of ​​workbench component 103. Camera C / D component 500 is symmetrically installed on both sides of bonding head 400. High-precision rangefinder 105 on the side of workbench component 103 detects the flatness of the workbench surface in real time and provides feedback data for the leveling system. Suction nozzle 413 is made of anti-static material, and suction connector 403 is connected to external negative pressure equipment.

[0029] In use, after the components to be bonded (such as chips and substrates) are placed on the worktable assembly 103, camera assembly A 200 and camera assembly B 104 simultaneously start shooting. Camera A captures a full-area image from one side of the worktable, while camera B supplements the image from the other side. The two cameras combine to capture the overall position, placement angle, and worktable reference mark position of the component. The global coordinates of the component (including X-axis, Y-axis position, and rotation angle) are calculated through image algorithms, and the data is transmitted to the central control system in real time. During the component pickup stage, when the nozzle 413 comes into contact with the component, the anti-static material of the nozzle 413 effectively releases the static electricity generated by friction between the nozzle 413 and the component, preventing the static electricity from attracting dust and small particles from the air. To prevent particles from adhering to the component surface or entering the component gaps, and to ensure that the components are not contaminated by impurities during the pick-up and transfer process, the extraction connector 403 on the side of the bonding head 400 is always connected to the external negative pressure equipment throughout the entire process from the start of the movement of the bonding head 400 to the completion of the bonding. The negative pressure equipment continuously provides negative pressure suction, so that a stable negative pressure environment is formed inside the bonding head 400 and around the nozzle 413. The tiny debris generated by the friction of the components when the bonding head 400 moves, as well as impurity particles that may fall off during the component packaging process, are sucked into the extraction channel in a timely manner. After being intercepted by the external filtration system, they are discharged, preventing particles from spreading to the workbench area to contaminate the components or affect the bonding accuracy, and ensuring the cleanliness of the bonding environment throughout the process.

[0030] In some embodiments, such as Figures 2-5 As shown, the piezoelectric actuator 411 inside the bonding head 400 cooperates with the flexible hinge 410, the guide leaf spring 412 assists in positioning, the suction nozzle 413 is connected to the piezoelectric actuator 411 through the flexible hinge 410, and the suction and discharge connector 403 on the side of the bonding head 400 is connected to the internal air passage to ensure that tiny particles can be discharged quickly.

[0031] During use, the piezoelectric actuator 411 adjusts the angle of the flexible hinge 410 in real time based on the flatness data fed back by the high-precision rangefinder 105, thereby correcting the parallelism of the suction nozzle 413. The guide leaf spring 412 enhances the stability of the leveling process, meeting the stringent parallelism requirements of high-precision bonding. Tiny particles generated during the movement of the bonding head 400 are quickly sucked into the equipment and discharged through the internal air passage by the extraction connector 403, avoiding particle contamination of the chip and ensuring bonding quality.

[0032] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bonding device, characterized in that: The device includes a marble base (101), a workbench assembly (103), a bonding device (300), and a vision positioning assembly. The workbench assembly (103) is mounted on top of the marble base (101), the bonding device (300) is located above the workbench assembly (103), and the vision positioning assembly is distributed on both sides of the bonding device (300) and the edge of the workbench assembly (103). The bonding device (300) includes a bonding mounting base (301), a linear guide rail (303), and a bonding head (400). A drive motor (302) for providing driving force and a grating ruler (304) for real-time position data acquisition are mounted on the top of the bonding mounting base (301). The linear guide rail (303) is slidably connected to the bonding mounting base (301) and can move along the length of the bonding mounting base (301). The bonding head (400) is fixed to the linear guide rail (303) via a mounting bracket (402) and moves synchronously with the linear guide rail (303). The bonding head (400) integrates a control mechanism. The bonding head (400) includes a voice coil motor (404) for vertical movement, a rotary motor (405) for angle adjustment, and an air-bearing guide shaft (407) for vertical guidance. The bottom of the bonding head (400) is provided with a suction nozzle (413) for picking up the chip. Above the suction nozzle (413) are connected in sequence a flexible hinge (410) that can undergo elastic deformation, a piezoelectric actuator (411) for providing leveling driving force, and a guide leaf spring (412) for auxiliary positioning. The side of the bonding head (400) is provided with a drain connector (403) for discharging tiny particles generated during the movement of the equipment to prevent particle contamination of the chip.

2. The bonding apparatus according to claim 1, characterized in that: The bottom of the marble base (101) is equipped with a vibration isolator (102) to reduce external vibration interference. The vibration isolator (102) can weaken the influence of external environmental vibration on the bonding process. The workbench assembly (103) and the marble base (101) are fixedly connected to ensure the stability of the workbench assembly (103) when carrying the chip and avoid positional displacement due to loose connection.

3. The bonding apparatus according to claim 1, characterized in that: The visual positioning component includes three sets of camera-related components, namely camera A component (200), camera B component (104) and camera C / D component (500). Camera A component (200) and camera B component (104) are fixed to the edge of the marble base (101) and do not move with the bonding head (400), so there is no need to frequently adjust the camera parameters, thereby reducing the camera calibration requirements. Camera C / D component (500) consists of two independent cameras, namely camera C (501) and camera D (502), and the two cameras are symmetrically installed on both sides of the bonding head (400) and move synchronously with the bonding head (400).

4. A bonding device according to claim 3, characterized in that: The bonding head (400) is provided with a bonding head cover plate (401) for protecting the internal structure and a compression bellows (406) with telescopic characteristics. The compression bellows (406) is sleeved on the outside of the air-bearing guide shaft (407) inside the bonding head (400). It can block external dust from entering the air-bearing guide shaft (407) and play a dustproof role. It can also buffer the impact when the air-bearing guide shaft (407) moves. The bottom of the bonding head (400) is provided with a Z-axis slide plate (408) for driving it to slide in the vertical direction and a Z-axis grating ruler (409) for collecting vertical displacement information.

5. A bonding apparatus according to claim 1, characterized in that: The piezoelectric actuator (411) above the nozzle (413) cooperates with the flexible hinge (410). The piezoelectric actuator (411) provides driving force, causing the flexible hinge (410) to deform, thereby realizing a high-rigidity automatic leveling function. By adjusting the tilt angle of the nozzle (413) in real time, the parallelism between the nozzle (413) and the chip and the worktable is ensured, meeting the high-precision bonding requirements. The guide leaf spring (412) is set between the piezoelectric actuator (411) and the nozzle (413) to assist in positioning the nozzle (413), improve the stability during the leveling process, and avoid leveling deviation.

6. A bonding apparatus according to claim 2, characterized in that: The workbench assembly (103) is equipped with a high-precision rangefinder (105) for detecting surface morphology. The high-precision rangefinder (105) can scan the surface of the workbench assembly (103) in real time, capture surface height differences, detect the flatness of the workbench surface, and transmit the detected flatness data to the leveling system to provide feedback data for the leveling system to adjust the parallelism of the suction nozzle (413).

7. A bonding apparatus according to claim 1, characterized in that: The bonding mounting base (301) and the linear guide rail (303) are in a sliding fit. The linear guide rail (303) can slide stably along the bonding mounting base (301) and drive the bonding head (400) fixed thereto to move horizontally. The grating ruler (304) on the top of the bonding mounting base (301) can collect the displacement information of the linear guide rail (303) in real time and feed the position data back to the control system. The control system is connected to the drive motor (302) and adjusts the output of the drive motor (302) through the system.

8. A bonding apparatus according to claim 6, characterized in that: The bottom of the bonding head (400) is equipped with a suction nozzle (413). The suction nozzle (413) is made of an antistatic material with static dissipation properties, which can prevent the suction nozzle (413) from being attracted by static electricity when it comes into contact with the chip. The suction and discharge connector (403) on the side of the bonding head (400) is connected to an external negative pressure device, forming a continuous negative pressure environment inside the suction and discharge connector (403) to construct a continuous dust suction channel.

9. A bonding apparatus according to claim 8, characterized in that: The bottom of the bonding head (400) is provided with a bonding head base (414) for supporting the overall structure of the bonding head (400). The bonding head base (414) and the mounting bracket (402) that drives the bonding head (400) to move are rigidly connected to suppress the end jitter of the bonding head (400) during the movement. In the visual positioning component, the camera A component (200) and camera B component (104) fixed to the edge of the marble base (101) can completely cover the entire working area of ​​the workbench component (103) and capture the global position information of the workbench and the chip.

10. A method of using a bonding device, characterized in that: The bonding apparatus of claim 9 is used, comprising the following steps: S1: Start the main power supply, activate the vibration isolator (102) at the bottom of the marble base (101) to enter the vibration reduction state, and simultaneously start the high-precision rangefinder (105). The equipment enters the standby calibration state, and the grating ruler (304) and Z-axis grating ruler (409) are started to collect the initial position data in real time and feed it back to the control system. S2: By inputting chip bonding parameters through the control system, the high-precision rangefinder (105) scans the surface of the worktable assembly (103) and transmits the flatness data to the leveling system. Camera assembly A (200) and camera assembly B (104) capture global images of the worktable to determine the chip placement reference area. Cameras C (501) and D (502) move with the bonding head (400) to the initial pick-up position to complete the positioning calibration. S3: The voice coil motor (404) drives the Z-axis slide (408) to descend, and the suction nozzle (413) picks up the chip by negative pressure adsorption. The piezoelectric actuator (411) drives the flexible hinge (410) to deform according to the data of the high-precision rangefinder (105), and adjusts the tilt angle of the suction nozzle (413) in conjunction with the guide leaf spring (412). The rotary motor (405) finely adjusts the angle of the bonding head (400) to complete the picking posture calibration. S4: The exhaust connector (403) connects to the external negative pressure equipment to form a dust collection channel. The control system drives the linear guide (303) and the Z-axis slide (408) to work together according to the preset coordinates, thereby driving the bonding head (400) to the bonding target position. Cameras C (501) and D (502) capture feedback of position deviation. The control system adjusts the horizontal displacement and vertical height of the bonding head (400) through the grating ruler (304) and the Z-axis grating ruler (409). S5: The voice coil motor (404) outputs a preset pressure to drive the nozzle (413) to press the chip to the target position to complete the bonding. During bonding, the air-bearing guide shaft (407) assists in the guidance, and the compressed bellows (406) buffers and prevents dust. The anti-static nozzle (413) avoids electrostatic interference. After bonding, the voice coil motor (404) drives the nozzle (413) to reset, and the linear guide rail (303) returns to the initial position. The visual positioning component captures the verification image.

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