Semiconductor chip production mold

Abstract

The utility model relates to the technical field of semiconductor production equipment, and discloses a semiconductor chip production mold, which comprises a plurality of lower movable molds, an upper movable mold and a middle fixed mold which are matched with each other, and further comprises a rotating plate for driving the plurality of lower movable molds to rotate, a driving motor used for driving the rotating plate to rotate is fixedly installed in the fixing base, a plurality of fixing mold frames used for positioning the lower movable mold are arranged on the upper portion of the rotating plate, second receding openings are formed in the lower portions of the fixing mold frames in a penetrating mode, and a plurality of first receding openings matched with the second receding openings are formed in the rotating plate. A first telescopic device used for pushing the lower movable mold to move upwards is fixedly installed at the bottom in the fixing base, and a fixing frame is fixedly installed on one side of the fixing base. According to the utility model, the semiconductor chip in the lower movable die is taken and placed in the sintering process, so that the waiting time of the semiconductor chip in the sintering process is shortened, and the production efficiency of the semiconductor chip is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically a semiconductor chip manufacturing mold. Background Technology

[0002] In semiconductor power modules, chips need to be sintered onto copper-clad ceramic substrates. During this process, silver paste is placed between the chip and the copper-clad ceramic substrate, and the chip and the copper-clad ceramic substrate are placed in a sintering mold. The chip is sintered onto the copper-clad ceramic substrate by high temperature and a certain pressure. The chip is sintered onto the copper-clad ceramic substrate by a downward-moving heating element.

[0003] A search revealed a patent, CN220892969U, which discloses a semiconductor sintering mold. The mold includes a base with a lower mold base integrally formed thereon at its upper end. A mold groove is formed on the upper surface of the lower mold base, and a movable module is slidably installed within the groove. A chip is disposed on the upper surface of the movable module. A limiting mechanism acting on the movable module is provided on the base. An upper mold base is located above the lower mold base, and a sintering mechanism acting on the chip is provided on the upper mold base. This invention uses the sintering mechanism to sinter the chip onto a copper-clad ceramic substrate. When it is necessary to replace the next batch of chips for sintering, there is no need to open the upper and lower mold bases. Simply release the pressure of the external cylinder extension rod on the movable plate, allowing the pressure head to move away from the chip, and then release the limiting mechanism to pull the movable module out from the side of the lower mold base. This significantly increases the speed of chip replacement, thereby effectively improving work efficiency.

[0004] The aforementioned patents have significant beneficial effects, but in practical application, they still have the following shortcomings:

[0005] The aforementioned comparative documents describe placing the copper-clad ceramic substrate to be sintered within a removable movable template, and then sintering the copper-clad ceramic substrate and chip by moving the movable plate downwards. However, in reality, the sintering process described in the comparative documents involves placing the copper-clad ceramic substrate within the movable template, inserting the movable template into the lower mold base, and then removing the movable template and taking out the copper-clad ceramic substrate after sintering the copper-clad ceramic substrate and chip. This process is quite cumbersome and reduces the efficiency of semiconductor production. Therefore, there is an urgent need in the field to improve semiconductor chip production molds to address the shortcomings of the prior art. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a semiconductor chip manufacturing mold, thereby improving the production efficiency of semiconductor chips.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor chip manufacturing mold, comprising several adapted lower moving molds, upper moving molds, and middle fixed molds, and a rotating plate for driving the lower moving molds to rotate. A fixed base is provided at the lower part of the rotating plate, and a drive motor for driving the rotating plate to rotate is fixedly installed inside the fixed base. Several fixed mold frames for positioning the lower moving molds are provided at the upper part of the rotating plate. A second clearance opening is provided through the lower part of the fixed mold frames. Several first clearance openings adapted to the second clearance openings are provided on the rotating plate. A first telescopic device for pushing the lower moving molds upward is fixedly installed at the bottom of the fixed base. A fixed frame is fixedly installed on one side of the fixed base. A second telescopic device for driving the upper moving mold to move up and down is fixedly installed on the upper part of the fixed frame. A snap-fit ​​groove for installing the material to be sintered is provided on the upper part of the lower moving mold, and an abutment frame adapted to the snap-fit ​​groove is provided inside the middle fixed mold.

[0008] Preferably, the fixed mold frame is provided with several positioning plates, and multiple sides of the fixed mold frame are threadedly connected to an adjusting threaded rod, one end of which is rotatably connected to the side of the positioning plate. The adjusting threaded rod is threadedly connected to a limit nut on its side.

[0009] Preferably, the inner sidewall of the middle mold has an installation groove that penetrates one side of the middle mold and is adapted to the abutment frame. The opposite sides of the middle mold have T-shaped limiting rods that penetrate through it. The opposite sides of the abutment frame have limiting holes that are adapted to the limiting rods. An elastic element with elasticity is fixedly installed between the side of the middle mold and the side of the limiting rod.

[0010] Preferably, a support plate is fixedly installed at the telescopic end of the first telescopic device, and two symmetrical plug-in blocks are fixedly installed on the upper part of the support plate, and two plug-in slots adapted to the plug-in blocks are opened at the lower part of the lower moving mold.

[0011] Preferably, a fixing block is fixedly installed on the upper part of the upper moving mold, and a fixing groove adapted to the fixing block is opened at the telescopic end of the second telescopic device. A fixing bolt with one end threadedly connected to the side of the fixing block passes through one side of the second telescopic device.

[0012] Preferably, the height of the positioning plate is adapted to the distance between the middle fixed mold and the fixed mold frame, and the side of the lower moving mold is still in contact with the side of the positioning plate after it rises to the top.

[0013] Preferably, the lower part of the upper moving mold is provided with a pressure head, and the end of the pressure head is provided with a heating element for sintering.

[0014] To address the shortcomings of existing technologies, this utility model provides a semiconductor chip manufacturing mold, overcoming these deficiencies. The beneficial effects of this utility model are as follows:

[0015] 1. In this utility model, by taking and placing semiconductor chips located in the lower moving mold during the sintering process, the waiting time for sintering semiconductor chips is shortened, thereby improving the production efficiency of semiconductor chips.

[0016] 2. In this utility model, the positioning plate is moved by rotating the adjusting threaded rod. Several positioning plates are closely attached to multiple sides of the lower moving mold without needing to be pressed together, which facilitates the installation or replacement of the lower moving mold and can limit the movement of lower moving molds of different sizes.

[0017] 3. In this utility model, the limiting rod is rotated away from the central mold, and the abutment frame is inserted into the mounting groove. When the limiting rod is released, the elastic element's contraction force drives the limiting rod to move. One end of the limiting rod is inserted into the limiting hole, which facilitates the installation or later replacement of the abutment frame.

[0018] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures pointed out in the description, claims, and drawings. Attached Figure Description

[0019] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0020] Figure 1 This is a schematic diagram of the structure of the lower moving mold, the upper moving mold, and the middle fixed mold in this utility model;

[0021] Figure 2 This is a schematic diagram of the overall installation of this utility model;

[0022] Figure 3 This is a schematic cross-sectional view of the present invention.

[0023] Figure 4 for Figure 1 Enlarged structural diagram at point A in the middle;

[0024] Figure 5 for Figure 1 Enlarged structural diagram at point B;

[0025] Figure 6 for Figure 3 Enlarged structural diagram at point C;

[0026] Figure 7 for Figure 3 Enlarged structural diagram at point D.

[0027] In the diagram: 1. Lower moving mold; 2. Upper moving mold; 3. Middle fixed mold; 4. Fixed base; 5. Rotating plate; 6. Drive motor; 7. Fixed mold frame; 8. First clearance opening; 9. Second clearance opening; 10. First telescopic device; 11. Fixed frame; 12. Second telescopic device; 13. Abutment frame; 14. Snap-fit ​​groove; 15. Positioning plate; 16. Adjusting threaded rod; 17. Limit nut; 18. Limit rod; 19. Limit hole; 20. Elastic element; 21. Support plate; 22. Insertion block; 23. Insertion groove; 24. Fixed block; 25. Fixed groove; 26. Fixed bolt; 27. Mounting groove. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figures 1-7 A semiconductor chip manufacturing mold includes several lower moving molds 1, an upper moving mold 2, and a middle fixed mold 3. The lower part of the upper moving mold 2 is provided with a pressure head, and the end of the pressure head is provided with heating elements for sintering. It also includes a rotating plate 5 for driving the several lower moving molds 1 to rotate. The lower part of the rotating plate 5 is provided with a fixed base 4, and a drive motor 6 for driving the rotating plate 5 to rotate is fixedly installed inside the fixed base 4. The upper part of the rotating plate 5 is provided with several fixed mold frames 7 for positioning the lower moving molds 1. A second clearance opening 9 is provided through the lower part of the fixed mold frame 7. The rotating plate 5 is provided with several first clearance openings 8 that are adapted to the second clearance openings 9. A device for... The first telescopic device 10 pushes the lower moving mold 1 upward. A fixed frame 11 is fixedly installed on one side of the fixed base 4. A second telescopic device 12 for driving the upper moving mold 2 to move up and down is fixedly installed on the upper part of the fixed frame 11. A snap-fit ​​groove 14 for installing the material to be sintered is opened on the upper part of the lower moving mold 1. An abutment frame 13 adapted to the snap-fit ​​groove 14 is provided in the middle fixed mold 3. A pressure head is provided at the lower part of the upper moving mold 2. A heating element for sintering is provided at the end of the pressure head. A support plate 21 is fixedly installed at the telescopic end of the first telescopic device 10. Two symmetrical plug-in blocks 22 are fixedly installed on the upper part of the support plate 21. Two plug-in grooves 23 adapted to the plug-in blocks 22 are opened at the lower part of the lower moving mold 1.

[0030] Specifically, when it is necessary to sinter the chip onto the copper-clad ceramic substrate, the copper-clad ceramic substrate is snapped into the snap-fit ​​groove 14 on the lower moving mold 1, and the chip is bonded to the copper-clad ceramic substrate with silver paste. The drive motor 6 is turned on, and the output end of the drive motor 6 drives the rotating plate 5 to rotate. The rotating plate 5 drives the fixed mold frame 7 and the lower moving mold 1 to rotate intermittently. When the lower moving mold 1 rotates to below the upper moving mold 2, the first telescopic device 10 is activated. The telescopic end of the first telescopic device 10 drives the support plate 21 to move upward. The support plate 21 drives the insertion block 22 to move upward. The insertion block 22 is inserted into the insertion groove 23 at the lower part of the lower moving mold 1, pushing the lower moving mold 1 to move upward. The upper side of the lower moving mold 1 abuts the frame 1. 3. Press tightly, activate the second telescopic device 12. The telescopic end of the second telescopic device 12 drives the upper moving mold 2 to move down. The lower part of the upper moving mold 2 is provided with a pressure head. The end of the pressure head is provided with a heating element for sintering. The chip is sintered on the copper-clad ceramic substrate. Then the upper moving mold 2 moves up and the lower moving mold 1 moves down. The rotating plate 5 rotates again and rotates in sequence. When the chip on the copper-clad ceramic substrate is sintered, the copper-clad ceramic substrate that has been sintered on the lower moving mold 1 is taken out and the copper-clad ceramic substrate to be sintered is placed again. By taking out and placing the semiconductor chip located in the lower moving mold 1 during the sintering process, the waiting time in the semiconductor chip sintering process is shortened and the production efficiency of semiconductor chips is improved.

[0031] As a technical optimization of this utility model, the fixed mold frame 7 is provided with several positioning plates 15. Multiple sides of the fixed mold frame 7 are threaded and connected to an adjusting threaded rod 16, one end of which is rotatably connected to the side of the positioning plate 15. The side of the adjusting threaded rod 16 is threadedly connected to a limit nut 17. The height of the positioning plate 15 is adapted to the distance between the middle fixed mold 3 and the fixed mold frame 7. After the lower moving mold 1 rises to the top, its side is still in contact with the side of the positioning plate 15.

[0032] Specifically, the lower moving mold 1 is placed inside the fixed mold frame 7. The positioning plate 15 is moved by rotating the adjusting threaded rod 16. Several positioning plates 15 are closely attached to multiple sides of the lower moving mold 1 without needing to be pressed. The locking limit nut 17 limits the positioning plate 15, which facilitates the installation or later replacement of the lower moving mold 1. It can also limit the lower moving mold 1 of different sizes. When the first telescopic device 10 drives the lower moving mold 1 to move upward, the positioning plate 15 still limits the lower moving mold 1.

[0033] As a technical optimization of this utility model, the inner side wall of the central mold 3 is provided with an installation groove 27 that penetrates one side of the central mold 3 and is adapted to the abutment frame 13. The opposite sides of the central mold 3 are provided with T-shaped limiting rods 18. The opposite sides of the abutment frame 13 are provided with limiting holes 19 that are adapted to the limiting rods 18. An elastic member 20 with elasticity is fixedly installed between the side of the central mold 3 and the side of the limiting rod 18.

[0034] Specifically, when sintering copper-clad ceramic substrates of different sizes, an abutment frame 13 of the appropriate size is installed. The limiting rod 18 is rotated away from the central mold 3, and the elastic element 20 is stretched, inserting the abutment frame 13 into the mounting groove 27. At this time, the limiting hole 19 is matched with the end of the limiting rod 18. The limiting rod 18 is released, and the contraction force of the elastic element 20 drives the limiting rod 18 to move. One end of the limiting rod 18 is inserted into the limiting hole 19. The elastic element 20 is specifically a spring, which facilitates the installation or later replacement of the abutment frame 13.

[0035] As a technical optimization of this utility model, a fixing block 24 is fixedly installed on the upper part of the upper moving mold 2, and a fixing groove 25 adapted to the fixing block 24 is opened at the telescopic end of the second telescopic device 12. A fixing bolt 26 with one end threadedly connected to the side of the fixing block 24 passes through one side of the second telescopic device 12.

[0036] Specifically, when installing the upper moving mold 2, the fixing block 24 on the upper moving mold 2 is inserted into the fixing groove 25, and one end of the fixing bolt 26 passes through the side of the second telescopic device 12. One end of the fixing bolt 26 is threaded to the side of the fixing block 24, which facilitates the installation or later replacement of the upper moving mold 2.

[0037] All of the electrical products mentioned above can be purchased from the market. They are mature technologies and have been fully disclosed, so they will not be repeated in the instruction manual. All of the electrical products mentioned above are equipped with power cords, and they are electrically connected to the external main controller and 220V phase voltage (or 380V line voltage) through the power cords. The main controller can be a conventional known device such as a computer that plays a control role.

[0038] Finally, it should be noted that in the description of this utility model, the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip production mold characterized by comprising: The utility model relates to a sintering device, including a plurality of lower movable mould (1), upper movable mould (2) and middle fixed mould (3) of adaptation, still include the rotary plate (5) for driving a plurality of lower movable mould (1) to carry out rotation, rotary plate (5) lower part is equipped with fixed seat (4), fixed seat (4) inside fixed mounting is used for driving rotary plate (5) rotation drive motor (6), rotary plate (5) upper part is equipped with a plurality of fixed mould frame (7) for positioning lower movable mould (1), fixed mould frame (7) lower part is opened through second let -place mouth (9), rotary plate (5) is opened a plurality of with second let -place mouth (9) adaptation first let -place mouth (8), fixed seat (4) inner bottom fixed mounting is used for promoting lower movable mould (1) and moves up first telescopic device (10), fixed seat (4) one side fixed mounting has fixed frame (11), fixed frame (11) upper part fixed mounting is used for driving upper movable mould (2) up and down movement second telescopic device (12), lower movable mould (1) upper part is opened through the joint groove (14) for installing the material to be sintered, middle fixed mould (3) is equipped with with joint groove (14) adaptation abutment frame (13).

2. A semiconductor chip production mold according to claim 1, wherein Fixed mould frame (7) inside is equipped with a plurality of locating plate (15), and the plurality of side surfaces of fixed mould frame (7) are all penetrated and are threadedly connected with the adjusting screw rod (16) one end rotationally connected with the side surface of locating plate (15), and the side surface of adjusting screw rod (16) is threadedly connected with the limiting nut (17).

3. The semiconductor chip production mold according to claim 1, wherein The inner side wall of middle fixed mould (3) is provided with an installation groove (27) penetrating through one side of middle fixed mould (3) and matched with the abutment frame (13), and the opposite side surfaces of middle fixed mould (3) are penetrated through the limiting rods (18) with a T-shaped cross section, the opposite side surfaces of the abutment frame (13) are provided with limiting holes (19) matched with the limiting rods (18), and the elastic members (20) with elasticity are fixedly installed between the side surface of middle fixed mould (3) and the side surface of the limiting rod (18).

4. The semiconductor chip production mold according to claim 1, wherein The telescopic end of the first telescopic device (10) is fixedly installed with a supporting plate (21), the upper part of the supporting plate (21) is fixedly installed with two symmetrical plug-in blocks (22), and the lower part of the lower movable mould (1) is provided with two plug-in grooves (23) matched with the plug-in blocks (22).

5. The semiconductor chip production mold according to claim 1, wherein The upper part of the upper movable mould (2) is fixedly installed with a fixed block (24), the telescopic end of the second telescopic device (12) is provided with a fixed groove (25) matched with the fixed block (24), and the side surface of the second telescopic device (12) is penetrated through a fixed bolt (26) threadedly connected with the side surface of the fixed block (24).

6. The semiconductor chip production mold according to claim 2, wherein The height of the locating plate (15) is matched with the spacing between the middle fixed mould (3) and the fixed mould frame (7), and the side surface of the lower movable mould (1) still adheres to the side surface of the locating plate (15) after rising to the top end.

7. The semiconductor chip production mold according to claim 1, wherein The lower part of the upper movable mould (2) is provided with a pressure head, and the end of the pressure head is provided with a heating element for sintering.

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