High frequency technology system

Abstract

The invention relates to a high-frequency technology system comprising a waveguide, a component and a connector which is designed and arranged in order to establish a connection of the waveguide to the component, the connection comprising a mechanical connection, and the connection established by means of the connector comprising a high-frequency-applicable connection.

Description

TECHNICAL FIELD

[0001] The invention relates to a high-frequency technology system having waveguides, components and connectors, which are designed and arranged to establish a connection of the waveguides to the components, wherein the connection comprises a mechanical connection. BACKGROUND

[0002] According to the prior art, the mechanical connection of the waveguides to the circuit board and / or to further waveguides is carried out by screwing, soldering and / or gluing. In addition, the high-frequency- suitable electrical connection of the individual components to one another, i.e. the electrical connection suitable for the transmission of high-frequency electromagnetic waves, is carried out.

[0003] In the prior art, the waveguides or waveguide components can already be mechanically connected to the circuit board, the carrier or other systems by means of a crimp socket / press-in area / stamp. However, in this case, the focus in the prior art is always on the mechanical aspect of the connection.

[0004] The mechanical connection is usually functionally separated from the electrical connection, since, for example, a screw does not constitute a transition area for the transmission of high-frequency electromagnetic waves. Here, the mechanical connection is usually also remote from the transition area, which constitutes the transition area for the transmission of high-frequency electromagnetic waves.

[0005] The high-frequency- suitable electrical connection requires a high mechanical precision. For example, it is ensured that the waveguides lie flat on the circuit board at all gaps, since otherwise there is a risk of a mismatch in the transition. Establishing the high-frequency- suitable electrical connection is therefore particularly challenging in mass production, since the high-frequency- suitable electrical connection requires narrow tolerances. Establishing the high-frequency- suitable electrical connection is already difficult in single-piece manufacture and, despite precise, flat ground contact surfaces, in many cases a specific torque has to be applied (for example in coaxial connections). This is therefore particularly challenging in mass production, especially in the gigahertz range, in which, in the range of two-digit micrometers, a gap can already determine the functionality of the contact point.

[0006] The soldered and / or glued connection usually has the problem that the waveguides float during soldering and / or gluing and are no longer precisely positioned. Establishing the mechanical connection and the electrical connection of the waveguides to one another or to the circuit board has hitherto been very expensive. SUMMARY

[0007] Against this background, the object on which the invention is based is to improve a high-frequency technology system mentioned at the outset, such that an improved connection between the waveguides and the components is carried out, which can also be reliably used in batches and mass production, among other things.

[0008] The object is achieved by the subject matter having the features of independent claim 1. Advantageous refinements of the invention are the subject matter of the dependent claims.

[0009] According to the application, it is proposed that the connection established by the connector comprises a connection which is suitable for high frequencies.

[0010] The connector is therefore preferably involved in the signal transmission.

[0011] It is preferably proposed that the HF technology aspects are also integrated directly into the connection. A stamping pressed into, for example, plastic is simultaneously involved in the transmission of the signal - in other words: the stamping interacts with the EM waves of the HF system and thereby becomes an HF component.

[0012] The HF technology system is preferably designed in such a way that high-frequency electromagnetic waves, in particular high-frequency electromagnetic waves having a frequency of more than 3 MHz, can be conducted at least locally.

[0013] It is also proposed that the HF technology system has more than one waveguide, more than one component and / or more than one connector. It is particularly conceivable that the connection of the waveguide and the component is established by more than one connector.

[0014] It is also conceivable that the HF technology system comprises an antenna array composed of a plurality of antennas, and the associated feed network and / or distribution network.

[0015] It is preferably proposed that the connector is a component which comprises or is a profile and / or a screw manufactured by shearing and / or laser cutting. The screw can also be a microscrew. The screw can have a thread diameter of between 0.1 mm and 3 mm, preferably between 0.5 mm and 2 mm, in particular between 1 mm and 2 mm.

[0016] In other words, the connector is preferably a stamping. Stamping has a high degree of precision. The connector can be manufactured by reforming, for example bending and / or shearing.

[0017] The component is preferably an HF technology component and / or an electrical component.

[0018] The waveguide is preferably designed in such a way that high-frequency electromagnetic waves, in particular high-frequency electromagnetic waves having a frequency of more than 3 MHz, can be transmitted.

[0019] Within the scope of the application, "electrical" preferably comprises the terms "electrical" and / or "electronic".

[0020] It is preferably proposed that the connection comprises an electrical connection.

[0021] The connection which is suitable for high frequencies is preferably a connection which is at least partially suitable for the transmission of high-frequency electromagnetic waves. The connector is therefore preferably designed in such a way that it can conduct high-frequency electromagnetic waves at least in one region and / or produces a geometry in cooperation with the waveguide to be connected which can guide high-frequency electromagnetic waves and / or facilitates the guidance of said high-frequency electromagnetic waves.

[0022] Depending on the arrangement of the connector, the latter can participate in the transmission of high-frequency electromagnetic waves, i.e. can form part of a transmission path or a transmission region or a transmission distance, or can also not participate in the transmission of high-frequency electromagnetic waves. "Suitable for high frequencies" is therefore also to be understood as meaning the case in which the connector is not part of the transmission distance of high-frequency electromagnetic waves.

[0023] It is conceivable here that the connector or the elements and / or the stamping which define the connector are tangential or even cut into the cross-sectional geometry of the waveguide inside at one or more points. It is especially conceivable that the connector continues to guide the contour in the propagation direction at one or more points of the cross-sectional geometry of the waveguide. The region through which the high-frequency electromagnetic waves preferably pass in the transmission from component to component, i.e. from waveguide to component, can be referred to as a transition region.

[0024] The connection is preferably made by means of a connector which is stamped, said connector in particular comprising a pin or a plug directly in the transition region between waveguide and component.

[0025] The connector is preferably an integral part of the transition region.

[0026] The mechanical and high-frequency suitable connection is preferably made by means of the connector in a single step and in a technically simple manner. It is however also conceivable that the quality of the signal transmission (electromagnetic aspect) is focused on in the transition region and that the mechanical requirements for the coupling of the two components are fulfilled by means of solutions known from the prior art in other regions.

[0027] The application has the advantage that the mechanical connection by means of the connector is a proven technology which has already been applied in the mass market.

[0028] The transition region preferably has a very good fit and is extremely stable and fault-tolerant with respect to movements of the waveguide in all directions, in particular in the direction perpendicular to the circuit board. Stable and fault-tolerant are here preferably to be understood as meaning that slight changes in the range of up to a few hundred µm or deviations from the ideal geometric fit and / or positioning do not lead to a functional failure of the transition, in particular not to a functional failure of the signal transmission, from an electromagnetic point of view.

[0029] Preferably, the connection of the two waveguides and / or the connection of the waveguide to the component takes place via one or more connectors, wherein the connectors are arranged near the transition region or form part of the transition region.

[0030] The connectors can at least partially be an integral part of the transition region or can not be an integral part of the transition region. The waveguide walls can lie flat on the component in such a way that the connectors are shielded.

[0031] It is preferably proposed that the component comprises or consists of a waveguide, a circuit board and / or a package and / or is manufactured by an additive manufacturing method.

[0032] The connection of the waveguide to the circuit board and / or to a further waveguide is preferably made. The circuit board can be an integral part of a package comprising an integrated circuit (IC) and a housing.

[0033] The component can for example comprise or consist of a preferably three-dimensional Molded Interconnect Device (MID).

[0034] It is conceivable that the connectors, the waveguides and / or the component have holes. The connectors, the waveguides and / or the component can also have other openings.

[0035] It is also conceivable in particular that in the model of the waveguide and / or the waveguide system an element for the connector is provided with a recess. Such a recess can also be provided in particular on the circuit board and / or the component to be connected. Thereby, for example, the fit accuracy can be improved and / or the mechanical connection quality is advantageous in terms of service life or strength.

[0036] It is preferably proposed that the waveguide and / or the component has a recess, wherein the recess is preferably configured and arranged in such a way that it is possible to introduce at least one region of the connector into the recess.

[0037] It is preferably proposed that at least one element of the connector contacts and / or intersects and / or is part of the cross-sectional geometry of the wire cross-section of the waveguide with at least one contour thereof.

[0038] It is preferably proposed that at least one element of the at least one connection is embodied as a flat plate element similar to a blade and has a thickness of less than 1 mm, preferably less than 600 µm and in particular less than or equal to 500 µm.

[0039] It is preferably proposed that at least one element of the at least one waveguide and / or the at least one connector has a chamfer and / or preferably a gradual change in shape in the region of the connection.

[0040] It is preferably proposed that at least one element of the at least one connector comes into contact with electromagnetic waves which are guided by the waveguide, the connector being placed in the surroundings of the waveguide.

[0041] It is preferably proposed that at least one element of the at least one connection protrudes into the waveguide and / or into the material forming the waveguide system, especially measured perpendicular to the circuit board plane, over a length of less than 10 mm, preferably less than 5 mm and especially less than 1 mm.

[0042] It is preferably proposed that the at least one connector contributes to the impedance matching in the transition region.

[0043] It is preferably proposed that at least one element of the connector engages into, protrudes into the body of the waveguide system, here not necessarily into the waveguide cross section, but only into the plastic body from which the waveguide or the waveguide system is made, and / or at least one element of the connector engages with the body of the waveguide system in a toothed manner with one another.

[0044] It is preferably proposed that the connection is composed of at least one and preferably a plurality of elements and that the elements preferably imitate and / or simulate the waveguide channel of the waveguide to which they are directed with their contour in the direction of propagation of the electromagnetic waves, i.e. tangentially to the waveguide channel, measured perpendicular to the circuit board plane.

[0045] It is preferably proposed that the contour of the wall of the waveguide (Bewandung) which guides the longitudinal current in the direction of propagation is formed in the direction of propagation by one or a plurality of connectors or elements of the connector, and / or serves as such at at least one location of the waveguide cross section.

[0046] It is preferably proposed that the fit of the waveguide on the component, or the fit of the waveguide system on the circuit board, is not ideally oriented, but has an offset, wherein the offset is less than 1 mm, preferably less than 500 µm in the circuit board plane, and likewise less than 1 mm, preferably less than 500 µm in the direction perpendicular to the circuit board.

[0047] It is preferably proposed that there is a gap, especially an air gap, in the region of the connection.

[0048] It is preferably proposed that a widening of the waveguide cross section is provided in the region of the transition, especially in order to reduce the requirements on the fit accuracy in such a way that the initial waveguide cross section area is not limited by the widening of the waveguide cross section if an offset occurs in the circuit board plane.

[0049] The waveguide cross section is preferably dependent on the frequency. It is conceivable that the higher the intended frequency, the smaller the dimensions.

[0050] For the range from 60 GHz to 110 GHz, the waveguide preferably has a wide side of approximately 2.5 mm to 3.1 mm and a narrow side of 1.27 mm to 1.55 mm. However, this should not be considered limiting. The invention also includes waveguides with other dimensions and / or other frequency ranges.

[0051] It is conceivable that the connector includes a mating contact, a press-in area, and / or barbs.

[0052] The connector can preferably be connected to the waveguide via a hole in the waveguide and barbs and / or press-in areas of the connector, in such a way that the barbs and / or press-in areas engage with the hole in the waveguide.

[0053] At least one element of the waveguide and / or at least one connector may be beveled in shape in the region of connection, and / or have a preferred gradual shape change. This shape change can be used not only for mechanical fit and mounting but also for impedance and / or high-frequency signal matching.

[0054] It is conceivable that the connector components engage with the waveguide, or gradually transition into each other via teeth. Here, the waveguide model preferably already has corresponding gaps to improve mechanical strength and avoid unnecessary twisting during clamping, and / or to facilitate fitting accuracy during installation, especially in large quantities during mass production.

[0055] The connector can preferably be directly mounted and / or pre-installed in the waveguide.

[0056] The system can also be industrialized and / or automated very well thanks to its small, compact components. For example, it can be assembled using standard assembly machines.

[0057] Waveguides can preferably be temporarily connected to connectors via holes in the connectors. Two waveguides can be mechanically and particularly temporarily connected via holes in the connectors.

[0058] Preferably, the connector is made of or constructed of steel, stainless steel, aluminum, brass, plate, copper, iron, and / or precious metals, and / or is metallized or non-metallized, and / or at least partially conductive or non-conductive. The connector may also be made of or constructed of non-conductive materials.

[0059] Preferably, the waveguide includes a dielectric waveguide, a hollow conductor, an antenna or antenna array, or is composed of the same, and / or has a non-radiative gap.

[0060] Preferably, the waveguide comprises or is made of plastic, and / or is manufactured at least in part by injection molding, additive manufacturing methods and / or by milling, and / or is metallized or not metallized.

[0061] The waveguide and / or the connector can also be embodied without metallization. Thereby, the high-frequency technology system can be used for dielectric conductors.

[0062] It is preferably proposed that between the connector and the waveguide and / or the component at least locally an electrically conductive elastomer film, preferably an anisotropic one, is arranged.

[0063] The electrically conductive elastomer film preferably has a thickness of between 80 pm and 120 pm, in particular 100 pm.

[0064] It is preferably proposed that the connector is soldered and / or bonded with the component or is not soldered and / or bonded with the component.

[0065] It is conceivable that the connector is connected with the waveguide by a plug connection.

[0066] It is preferably proposed that the connector is designed in such a way that a heat transfer between the waveguide and the component is possible.

[0067] The invention also relates to the use of a connector in a high-frequency technology system according to the invention. It is conceivable that the connector comprises or is a profile manufactured by shearing. The profile can also additionally or alternatively comprise or be a profile manufactured by pressing.

[0068] The invention also relates to a method for connecting a waveguide and a component with a connector for manufacturing a high-frequency technology system according to the invention.

[0069] Preferably, the waveguide and / or the component are connected with the connector by a plug contact and / or by a press-in region.

[0070] It is also conceivable to automate the method.

[0071] It is pointed out here that the terms "one" and "a" do not necessarily refer to exactly one element of the elements, even if this is an implementation variant, but can also mean a plurality of elements. Likewise, the use of the plural also includes the presence of the elements referred to in singular and vice versa. Furthermore, all features of the invention described herein can be claimed arbitrarily in combination with one another or individually. BRIEF DESCRIPTION OF DRAWINGS

[0072] Further advantages, features and effects of the invention result from the description of preferred embodiments hereinafter with reference to the drawings, in which the same or similar components are denoted by the same reference signs. Shown here is:

[0073] Figure 1 A perspective view of a first embodiment of a high-frequency technology system according to the invention is shown.

[0074] Figure 2Fig. 1 shows a perspective view of a first embodiment of a high-frequency technology system according to the application.

[0075] Figure 3 Fig. 2 shows a top view of a first embodiment of a high-frequency technology system according to the application.

[0076] Figure 4 Fig. 3 shows a perspective view of a second embodiment of a high-frequency technology system according to the application.

[0077] Figure 5 Fig. 4 shows a top view of a second embodiment of a high-frequency technology system according to the application.

[0078] Figure 6 Fig. 5 shows a perspective view of a second embodiment of a high-frequency technology system according to the application.

[0079] Figure 7 Fig. 6 shows a perspective view of a third embodiment of a high-frequency technology system according to the application.

[0080] Figure 8 Fig. 7 shows a side view of a third embodiment of a high-frequency technology system according to the application.

[0081] Figure 9 Fig. 8 shows a top view of a third embodiment of a high-frequency technology system according to the application. DETAILED DESCRIPTION

[0082] In Figure 1 Fig. 9, two stamped connectors 10 are shown, which connect a waveguide 20 with a circuit board 30. The waveguide 20 is shown in the figures semi-transparently.

[0083] The connectors 10 each have two pins 11, by means of which the connectors 10 are plugged into the circuit board 30. The pins 11 can be soldered in the circuit board 30, or are merely plugged, pressed into the circuit board 30, and / or connected to the circuit board 30 by crimping.

[0084] The connectors 10 likewise each have an arc 12, by means of which the two pins 11 are connected. The connectors can also be single contacts.

[0085] The region of the pins 11 in the waveguide 20 has a protrusion 13, by means of which the waveguide 20 is connected to the connector 10, for example by clamping.

[0086] In Figure 2 Fig. 10, the pins 11 of the connectors 10 also have a protrusion 13 in the region of the plugging through the circuit board.

[0087] In Figure 3 The configuration of the arc 12 can be seen in Fig. 11.

[0088] In Figure 4 two stamped connectors 10 are shown which connect a waveguide 20 with a circuit board 30.

[0089] Figure 4 The connectors 10 in The two legs 11 of the respective connector 10 are connected by means of two arc-shaped sections with tabs 15. These two arc-shaped sections with tabs 15 are arranged in or at the waveguide 20.

[0090] Figure 4 In A barb 14 or a press-in contact is arranged at the leg 11 of the connector 10 in

[0091] Figure 5 In Figure 4 a top view of the embodiment in Figure 6 a side view of the embodiment in Figure 4 is shown.

[0092] In Figure 7 a stamped, pressed connector 10 is shown which connects a waveguide 20 with a circuit board 30.

[0093] Figure 7 The connector 10 in The four legs 11 of the connector 10 are connected with one another via a bottom structure 16, wherein the bottom structure 16 is arranged below the circuit board 20. The legs 11 each have a chamfer 17.

[0094] Figure 8 In Figure 7 a side view of the embodiment in Figure 9 a top view of the embodiment in Figure 7 is shown.

Claims

1. A high-frequency technology system comprising a waveguide, components, and a connector, the connector being configured and arranged to establish a connection between the waveguide and the components, wherein the connection includes a mechanical connection, characterized in that, The connection established through the connector includes a high-frequency applicable connection.

2. The high-frequency technology system according to claim 1, characterized in that, The connector is a component that includes or is manufactured by shearing and / or laser cutting of contours and / or screws.

3. The high-frequency technology system according to claim 1 or 2, characterized in that, The connection includes an electrical connection.

4. The high-frequency technology system according to any one of the preceding claims, characterized in that, The components include or are composed of waveguides, circuit boards and / or packages, and / or are manufactured by additive manufacturing methods.

5. The high-frequency technology system according to any one of the preceding claims, characterized in that, The connector, the waveguide, and / or the component have holes.

6. The high-frequency technology system according to any one of the preceding claims, characterized in that, The connector includes a mating contact, a press-in area, and / or barbs.

7. The high-frequency technology system according to any one of the preceding claims, characterized in that, The connector is made of or constructed of steel, stainless steel, aluminum, brass, plate, copper, iron and / or precious metals, and / or is metallized or unmetallized, and / or at least partially conductive or non-conductive.

8. The high-frequency technology system according to any one of the preceding claims, characterized in that, The waveguide includes a dielectric waveguide, a hollow conductor, an antenna and / or an antenna array, or is composed of the latter, and / or has a non-radiating slit.

9. The high-frequency technology system according to any one of the preceding claims, characterized in that, The waveguide comprises or is made of plastic, and / or is manufactured at least in part by injection molding, additive manufacturing methods and / or by milling, and / or is metallized or not metallized.

10. The high-frequency technology system according to any one of the preceding claims, characterized in that, A preferably anisotropic conductive elastomer film is provided at least partially between the connector and the waveguide and / or the component.

11. The high-frequency technology system according to any one of the preceding claims, characterized in that, The connector may be welded and / or bonded to the component, or may not be welded and / or bonded to the component.

12. The high-frequency technology system according to any one of the preceding claims, characterized in that, The connector is connected to the waveguide via a plug-in connection.

13. The high-frequency technology system according to any one of the preceding claims, characterized in that, The connector is configured to enable heat transfer between the waveguide and the component.

14. The use of the connector in a high-frequency technology system according to any one of the preceding claims.

15. A method for connecting waveguides and components using connectors to manufacture a high-frequency technology system according to any one of claims 1 to 13.

16. The method of claim 15, wherein the waveguide and / or the component is connected to the connector via a plug-in contact.

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