Method of manufacturing window, window, and electronic device

Abstract

The invention relates to a method of manufacturing a window, a window, and an electronic device. The method includes: preparing a mother glass substrate including silica (SiO2); forming a first preparation window by applying heat to the mother glass substrate; forming a second preliminary window by providing water onto the first preliminary window; forming a third preparation window by etching the second preparation window; and forming a window by exposing the third preparatory window to an acidic solution. Accordingly, the method of manufacturing a window may exhibit excellent processability, and a window manufactured by the same method may achieve excellent durability.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and all benefits derived therefrom to Korean Patent Application No. 10-2024-0129520, filed on September 25, 2024, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates herein to a method of manufacturing a window (i.e., a method of manufacturing a window) including the steps of providing heat and water, a window manufactured by the method, and an electronic device including the window. Background Technology

[0004] Various display devices are being developed for multimedia devices, such as televisions, mobile phones, tablet computers, and game consoles. These display devices may include a display panel that generates images and videos, and window components that protect the display panel. The window components include anti-glare and anti-reflective layers disposed on a glass substrate to improve display quality, which leads to an increase in the thickness of the device and manufacturing costs. Summary of the Invention

[0005] This disclosure provides a window manufacturing method that exhibits excellent workability.

[0006] This disclosure also provides a window exhibiting excellent durability and an electronic device including the window.

[0007] An embodiment of the present invention provides a method for manufacturing a window, the method comprising: preparing a mother glass substrate comprising silicon dioxide (SiO2); forming a first pre-window by applying heat to the mother glass substrate; forming a second pre-window by providing water to the first pre-window; forming a third pre-window by etching the second pre-window; and forming a window by exposing the third pre-window to an acidic solution.

[0008] In an embodiment, the temperature of the heat can be in the range of approximately 100°C to approximately 200°C.

[0009] In one embodiment, the water can be applied to the first preparatory window by spraying.

[0010] In one embodiment, etching the second pre-window may include providing an etchant.

[0011] In an embodiment, the etchant may include at least one of hydrogen fluoride (HF), ammonium fluoride (NH4F), and ammonium hydrogen fluoride (NH4HF2).

[0012] In the embodiments, the acidic solution may include at least one of hydrochloric acid (HCl), nitric acid (HNO3), and sulfuric acid (H2SO4).

[0013] In this embodiment, the temperature of the acidic solution can be in the range of approximately 40°C to approximately 80°C.

[0014] In an embodiment, the third preparation window may be exposed to the acidic solution for a period of time ranging from about 5 minutes to about 15 minutes.

[0015] In an embodiment, the acidic component may be included in an amount ranging from about 20 wt% to about 80 wt% relative to 100 wt% of the total weight of the acidic solution.

[0016] In one embodiment, forming the window may include immersing the third pre-existing window in the acidic solution.

[0017] In an embodiment, the window may include an upper surface and a lower surface facing the upper surface, and a first concentration of silicon in the portion of the window including the upper surface may be higher than a second concentration of silicon in another portion of the window.

[0018] In an embodiment, the portion of the window including the upper surface may have a thickness ranging from about 20 nm to about 200 nm.

[0019] In an embodiment, the window may have a surface roughness ranging from about 10 nm to about 1000 nm.

[0020] In an embodiment of the present invention, a window (the window being a glass substrate) includes: an upper surface including a protruding portion and a recessed portion; a lower surface facing the upper surface; and silicon dioxide, wherein the upper surface has a surface roughness in the range of about 10 nm to about 1000 nm, a first concentration of silicon in a portion of the window spaced apart from the lower surface and including the upper surface is higher than a second concentration of silicon in another portion of the window, and the portion of the window including the upper surface has a thickness in the range of about 20 nm to about 200 nm.

[0021] In this embodiment, the window may be a single layer.

[0022] In one embodiment, the lower surface may be flat.

[0023] In an embodiment of the present invention, an electronic device includes: a display device having a module region defined within the display device; and an electronic module configured to correspond to the module region, wherein the display device includes a display panel and a window disposed on the display panel, the window being a glass substrate, the window including: an upper surface including a protruding portion and a recessed portion; a lower surface facing the upper surface; and silicon dioxide, the upper surface having a surface roughness in the range of approximately 10 nm to approximately 1000 nm, a first concentration of silicon in a portion of the window spaced apart from the lower surface and including the upper surface being higher than a second concentration of silicon in another portion of the window, and the portion of the window including the upper surface having a thickness in the range of approximately 20 nm to approximately 200 nm.

[0024] In one embodiment, the upper surface may be spaced apart from the display panel, and the lower surface is between the upper surface and the display panel.

[0025] In this embodiment, the window may be a single layer.

[0026] In one embodiment, the lower surface of the window may be flat. Attached Figure Description

[0027] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0028] Figure 1 This is a perspective view showing an electronic device according to an embodiment;

[0029] Figure 2 This is an exploded perspective view showing an electronic device according to an embodiment;

[0030] Figure 3 It shows along Figure 2 A cross-sectional view of the portion intercepted by line I-I';

[0031] Figure 4A It is shown Figure 3 Enlarged cross-sectional view of region XX';

[0032] Figure 4B This is a cross-sectional view of a window according to an embodiment;

[0033] Figure 4C This is a cross-sectional view of a window according to an embodiment;

[0034] Figure 5 This is a cross-sectional view showing a portion of an electronic device according to an embodiment;

[0035] Figure 6A This is a perspective view showing an electronic device according to an embodiment;

[0036] Figure 6B This is a perspective view showing an electronic device according to an embodiment;

[0037] Figure 6C This is a plan view illustrating an electronic device according to an embodiment;

[0038] Figure 6D This is a perspective view showing an electronic device according to an embodiment;

[0039] Figure 7 This is an exploded perspective view showing an electronic device according to an embodiment;

[0040] Figure 8 This is a flowchart illustrating a window manufacturing method according to an embodiment;

[0041] Figure 9 This is a schematic view illustrating the window manufacturing steps according to an embodiment;

[0042] Figure 10 This is a schematic view illustrating the window manufacturing steps according to an embodiment;

[0043] Figure 11 This is a schematic view illustrating the window manufacturing steps according to an embodiment;

[0044] Figure 12 This is a schematic view illustrating the window manufacturing steps according to an embodiment;

[0045] Figure 13 It is a graph showing the transmittance of the window according to the wavelength;

[0046] Figure 14 This is a block diagram of an electronic device according to an embodiment; and

[0047] Figure 15 Schematic diagrams of electronic devices according to various embodiments are shown. Detailed Implementation

[0048] The inventive concept can be implemented in various modifications and has various forms, and specific embodiments are shown in the accompanying drawings and described in detail in the text. However, it should be understood that the inventive concept is not intended to be limited to the specific forms disclosed, but rather is intended to cover all modifications, equivalents, and substitutions falling within the spirit and scope of the inventive concept.

[0049] In this specification, it will be understood that when an element (or region, layer, or portion, etc.) is referred to as being "on" another element, "connected to" or "coupled to" another element, the element (or region, layer, or portion, etc.) may be directly disposed on / directly connected to / directly coupled to the other element, or an intermediary element may be disposed between the element and the other element.

[0050] The same reference numerals or symbols always refer to the same elements. In some respects, the thickness, scale, and dimensions of elements are exaggerated in the drawings for the purpose of effectively describing the technical content. The term "and / or" includes all combinations of one or more of the associated listed elements.

[0051] Although the terms first, second, etc., may be used to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. For example, without departing from the scope of the inventive concept, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Unless the context clearly indicates otherwise, the singular form also includes the plural form.

[0052] In some respects, for descriptive purposes, terms such as “below,” “under,” “above,” and “above” may be used to describe the relationship between one element and another shown in the accompanying drawings. It will be understood that these terms are relative and are based on the orientation depicted in the accompanying drawings.

[0053] Taking into account the measurements discussed and the errors associated with the measurement of a particular quantity, the terms “approximately” or “approximately” as used herein include the stated value and a suitable range of deviations from the particular value as determined by one of ordinary skill in the art. For example, the terms “approximately” or “approximately” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0054] As used herein, the term "substantially" means approximately or actually. The term "substantially equal" means approximately or actually equal. The term "substantially perpendicular" means approximately or actually perpendicular. The term "substantially parallel" means approximately or actually parallel.

[0055] It will be understood that, when used in this specification, the terms “comprising” or “including” indicate the presence of the stated features, integrals, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, or combinations thereof.

[0056] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. In some respects, unless expressly defined herein, terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and not as having an idealized or overly formalized meaning.

[0057] In the following description, an embodiment of a window and an electronic device including the window according to the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view showing an electronic device according to an embodiment. Figure 2 This is an exploded perspective view of an electronic device according to an embodiment.

[0058] Figure 1 The electronic device EA shown in the embodiments can be activated in response to an electrical signal. For example, the electronic device EA can be a personal computer (e.g., a laptop computer), a personal digital terminal, a game console, a portable electronic device, a television, a monitor, an outdoor billboard, a car navigation unit, or a wearable device, but the embodiments of this disclosure are not limited thereto. Figure 1 In the example, the electronic device EA is shown as a smartphone.

[0059] An electronic device EA may include a display surface ES defined by a first directional axis DR1 and a second directional axis DR2 intersecting the first directional axis DR1. The electronic device EA may provide an image IM to a user through the display surface ES. The electronic device EA may display the image IM in the direction of a third directional axis DR3 on the display surface ES, which is parallel to each of the first directional axis DR1 and the second directional axis DR2. The image IM may include not only moving images but also still images.

[0060] The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 shown herein are relative concepts and can therefore be changed to other directions. In some respects, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be referred to as the first direction DR1, the second direction DR2, and the third direction DR3, and may be indicated by the same reference numerals or symbols.

[0061] In this specification, the first direction axis DR1 is perpendicular to the second direction axis DR2, and the third direction axis DR3 can be the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the electronic device EA can be a direction parallel to the third direction axis DR3. The same reference numerals or symbols can be used for the thickness direction of the electronic device EA and the third direction axis DR3. The front surface (or upper surface) and the rear surface (or lower surface) can be opposite each other on the third direction axis DR3, and the normal direction of each of the front surface (or upper surface) and the rear surface (or lower surface) can be parallel to the third direction axis DR3. The front surface (or upper surface) is referred to as the surface adjacent to the display surface ES, and the rear surface (or lower surface) is referred to as the surface spaced apart from the display surface ES. In some aspects, the rear surface (or lower surface) is referred to as the second display surface RS, which will be described later (see Figure 6A Adjacent surfaces. The upper side is referred to as the direction closer to the display surface ES, and the lower side is referred to as the direction farther away from the display surface ES.

[0062] In this specification, a cross section is referred to as a surface parallel to the thickness direction DR3, and a plane is referred to as a surface perpendicular to the thickness direction DR3. A plane is referred to as a surface parallel to the plane defined by the first directional axis DR1 and the second directional axis DR2.

[0063] In this specification, the term "substantially the same" includes cases where the physical values ​​are identical and cases where the differences fall within the process tolerance range.

[0064] An electronic device (EA) can detect external inputs applied from the outside. External inputs can include various types of inputs applied from outside the electronic device (EA). For example, external inputs can include not only the touch of a part of a user's body (such as a user's hand), but also external inputs applied while approaching or adjacent to the electronic device (EA) at a predetermined distance (e.g., hovering). In some aspects, external inputs can take various forms (such as force, pressure, temperature, or light).

[0065] The display surface ES may include a display area DA, a non-display area NDA, and a sub-area MH. The display area DA can be activated in response to an electrical signal. The display area DA may be an area in which an image IM can be displayed and various types of external inputs can be detected.

[0066] The display area DA may include a flat surface defined by a first direction axis DR1 and a second direction axis DR2. The display area DA may also include a curved surface that bends from at least one side of the flat surface defined by the first direction axis DR1 and the second direction axis DR2. Figure 1The electronic device EA shown illustrates a display area DA comprising two curved surfaces that bend from both sides of a flat surface defined by a first directional axis DR1 and a second directional axis DR2. However, this is presented as an example, and the shape of the display area DA is not limited thereto. For example, the display area DA may include a flat surface defined by the first directional axis DR1 and the second directional axis DR2, and may also include at least two curved surfaces, for example, four curved surfaces that bend from the four side surfaces of the flat surface defined by the first directional axis DR1 and the second directional axis DR2.

[0067] The electronic device EA according to an embodiment can be flexible. The term "flexible" means bendable and can include fully foldable structures as well as structures that can be bent to the nanometer level. For example, the electronic device EA can be a rigid device. Conversely, the electronic device EA can be a foldable device.

[0068] The non-display area NDA can have a predetermined color. The non-display area NDA can be adjacent to the display area DA. The non-display area NDA can surround the display area DA. Therefore, the planar shape of the display area DA can be substantially defined by the non-display area NDA. However, this is presented as an example. The non-display area NDA can be set to be adjacent to one side of the display area DA or can be omitted. The display area DA can be provided with various planar shapes and is not limited to any one embodiment.

[0069] Sub-region MH can detect external objects via display surface ES, or provide sound signals, such as speech, to the outside via display surface ES. Optical signals, such as visible light or infrared light, can be moved to sub-region MH. Sub-region MH can be located within display area DA. However, this is shown as an example, and the arrangement of sub-region MH is not limited to any one embodiment. For example, sub-region MH can be surrounded not only by non-display area NDA, but also by both display area DA and non-display area NDA. Figure 1 The other figures in this paper show a subregion MH, but subregion MH can also be provided as multiple.

[0070] Various electronic modules (ELM) can be configured (see...) Figure 2 ) so as to correspond to the sub-region MH. For example, the electronic module ELM (see Figure 2 The device may include at least one of a camera, a speaker, a light detection sensor, and a thermal detection sensor. The electronic device EA may include an electronic module ELM (see [link to electronic module]). Figure 2 The Electronic Module (ELM) captures external images by using visible light that passes through the sub-region MH, or determines whether an external object is approaching by using infrared light. (See Electronic Module ELM). Figure 2 It may also include multiple elements and is not limited to any one embodiment.

[0071] refer to Figure 2 The electronic device EA may include a display device DD and an electronic module ELM. The display device DD may include a display module DM and a window member WD disposed on the display module DM. In some aspects, the electronic device EA may also include a housing HAU and a protective layer PL. In the display device DD, a module area DM-MH may be defined, and the electronic module ELM may also be disposed to correspond to the module area DM-MH.

[0072] exist Figure 1 and Figure 2 In the illustrated electronic device EA, a housing HAU can be disposed below the display module DM. The housing HAU may comprise a material with relatively high rigidity. For example, the housing HAU may comprise multiple frames and / or multiple plates made of glass, plastic, or metal. The display module DM can be housed within the housing HAU. The housing HAU provides a predetermined housing space. The display module DM can be housed within the housing space and protected from external impacts.

[0073] A protective layer PL can be applied to the window member WD. The protective layer PL can be a functional layer that protects one surface (e.g., the top surface) of the window member WD. For example, the protective layer PL may include polyethylene terephthalate (PET). The protective layer PL may include anti-fingerprint coating agents, antistatic agents, or hard coating agents, etc.

[0074] The display module DM can be activated in response to an electrical signal. The display module DM can be activated to display the electronic device EA in the display area DA (see [link]). Figure 1 The image IM is displayed in (see) Figure 1 The active area DM-AA, the peripheral area DM-NAA, and the module area DM-MH can be confined within the display module DM.

[0075] The active region DM-AA can be activated in response to an electrical signal. A pixel PX can be disposed within the active region DM-AA. The pixel PX may include a transistor TR, which will be described later (see [link to transistor]). Figure 5 ) and light-emitting elements (ED) (see Figure 5 The peripheral region DM-NAA can be positioned adjacent to at least one side of the active region DM-AA. Circuits or lines for driving the active region DM-AA can be provided in the peripheral region DM-NAA.

[0076] Module area DM-MH can be with Figure 1The sub-region MH shown corresponds to this. Optical signals, such as visible light or infrared light, can be moved to the module region DM-MH. The module region DM-MH can be located within the active region DM-AA. Conversely, the module region DM-MH can be surrounded not only by the peripheral region DM-NAA, but also by both the active region DM-AA and the peripheral region DM-NAA. The location of the module region DM-MH is not limited to any particular embodiment.

[0077] An electronic module (ELM) can be an electronic component that outputs or receives optical signals. For example, an ELM may include a camera module and / or a proximity sensor. The camera module can capture external images via the module area DM-MH.

[0078] Although not shown, the display device DD may also include an optical layer disposed between the display module DM and the window member WD. The optical layer can be formed on the display module DM using a continuous process. The optical layer may include a polarizer or a color filter layer. For example, the optical layer may include at least one of a phase retarder, a polarizer, a polarizing film, and a polarizing filter. Optionally, the optical layer may include a plurality of color filters arranged in a predetermined arrangement. For example, the color filters may be arranged considering the emission color of the pixel PX. In some aspects, the optical layer may also include a black matrix adjacent to the color filters.

[0079] The window component WD may include a transmissive region TA and a bezel region BZA. The transmissive region TA may overlap at least a portion of the active region DM-AA of the display module DM. The transmissive region TA may be an optically transparent region. Image IM (see...) Figure 1 It can be provided to the user through the transmission area TA.

[0080] The border region BZA can be a region with relatively lower light transmittance than the transmission region TA. The border region BZA can define the shape of the transmission region TA. The border region BZA can be adjacent to and surround the transmission region TA.

[0081] The border region BZA may have a predetermined color. The border region BZA may cover the peripheral region DM-NAA of the display module DM and prevent the peripheral region DM-NAA from being seen from the outside. However, embodiments of the inventive concept are not limited to those shown in the accompanying drawings. The border region BZA may be configured to be adjacent to one side of the transmissive region TA, or at least a portion of the border region BZA may be omitted.

[0082] Although not shown, an adhesive layer may be disposed beneath the window member WD. Components disposed beneath the window member WD (e.g., display module DM) may be bonded to the window member WD via the adhesive layer. For example, the adhesive layer may include pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), or optically clear resin (OCR).

[0083] Figure 3 It shows along Figure 2 A cross-sectional view of the portion intercepted by line I-I'. Specifically, Figure 3 This is a cross-sectional view showing the window component WD according to an embodiment. Reference Figure 3 The window component WD may include a window GL. The window GL may be optically transparent. The display is shown on the display module DM (see...). Figure 2 The image IM in ) (see Figure 1 It can pass through the window GL and be seen by the user.

[0084] Window GL is a single-layer glass substrate, and the glass substrate may include silicon dioxide (SiO2). Window GL, as a single-layer glass substrate, can have anti-glare and anti-reflective properties. Components with anti-glare and anti-reflective properties may not be provided on window GL. Window GL has a single-layer structure but can perform multiple functions (i.e., including anti-glare and anti-reflective functions). Therefore, window GL according to the embodiment can exhibit excellent optical properties (i.e., anti-glare and anti-reflective properties) and excellent durability, and electronic device EA including window GL (see...) Figure 2 It can achieve excellent reliability and excellent display quality.

[0085] In some aspects, the window component WD may also include a printed layer BM disposed on the lower surface GL_DF of the window GL. The window GL may include a lower surface GL_DF and an upper surface GL_UF facing the lower surface GL_DF. The lower surface GL_DF and the upper surface GL_UF of the window GL may have an integral shape. The lower surface GL_DF of the window GL may be integrated with the display module DM (see...). Figure 2 The upper surface GL_UF of window GL can be adjacent to the display module DM (see...). Figure 2 The window GL is spaced apart, with its lower surface GL_DF between the upper surface GL_UF and the display module DM. The upper surface GL_UF of the window GL may be adjacent to the display module DM (see [link to display module DM]). Figure 5 The display panel DP in ) (see Figure 5 The windows are separated by a gap, with the lower surface GL_DF of window GL located between the upper surface GL_UF and the display panel DP. The upper surface GL_UF of window GL can be the surface of window GL.

[0086] The printed layer BM can be set in the edge area of ​​the window GL. The printed layer BM can cover the outer area DM-NAA (see...). Figure 2 And it blocks the outer area DM-NAA (see Figure 2 (Seen from the outside.) The border area BZA may be a portion provided by the printed layer BM. The printed layer BM may be an ink-printed layer. In some aspects, the printed layer BM may be a layer formed by providing pigments or dyes. For example, the printed layer BM may be a layer formed by providing black pigments or black dyes.

[0087] Figure 4A It is shown Figure 3 Enlarged cross-sectional view of region XX'. Figure 4A It may be a cross-sectional view of window GL according to an embodiment.

[0088] refer to Figure 4A The lower surface GL_DF of window GL can be flat. The upper surface GL_UF of window GL can be non-flat. The upper surface GL_UF of window GL can include a protruding portion CX and a recessed portion CV. The protruding portion CX and the recessed portion CV can have a single, integral shape.

[0089] The protruding portion CX can be oriented in the thickness direction DR3 towards the display surface ES (see...). Figure 1 The protruding portion CX can be an upwardly projecting portion, and in this case, the term "upwardly" can mean a direction parallel to the direction extending along the third directional axis DR3. The recessed portion CV can be a portion extending away from the display surface ES in the thickness direction DR3 (see [reference]). Figure 1 The recessed portion CV can be a downwardly recessed portion, and in this case, the term "downward" can mean the direction opposite to the direction in which the third directional axis DR3 extends.

[0090] The protruding portion CX and the recessed portion CV can each be formed in multiple forms. Multiple protruding portions CX and multiple recessed portions CV can be formed in the transmission region TA (see...). Figure 3 The arrangement is repeated in the diagram. On a plane, the areas of the multiple protruding portions CX and the multiple recessed portions CV can be related to the transmission region TA (see...). Figure 3 The areas of the multiple protruding portions CX and the multiple recessed portions CV can be substantially the same. Alternatively, on a plane, the areas of the multiple protruding portions CX and the multiple recessed portions CV can also be smaller than the area of ​​the transmission region TA (see...). Figure 3 The area of ​​the border region BZA. In some aspects, multiple protruding portions CX and / or multiple recessed portions CV can also be set in the border region BZA (see Figure 3 )middle. Figure 4AThe illustration shows an alternating arrangement of protruding portions CX and recessed portions CV, but embodiments of this disclosure are not limited thereto. For example, a flat portion may also be provided between the protruding portions CX and the recessed portions CV.

[0091] The multiple protruding portions CX and the multiple recessed portions CV can each have a non-uniform shape. The multiple protruding portions CX can have different heights. In this case, the term "height" refers to the length from a predetermined first plane to the highest point of the protruding portion CX, i.e., the length parallel to the thickness direction DR3. The multiple recessed portions CV can have different depths. In this case, the term "depth" refers to the length from a predetermined second plane to the lowest point of the recessed portion CV, i.e., the length parallel to the thickness direction DR3.

[0092] The window GL, comprising a protruding portion CX and a recessed portion CV, can have a surface roughness (Ra) ranging from approximately 10 nm to approximately 1000 nm. In this specification, the surface roughness is measured using atomic force microscopy (AFM). For example, the window GL can have a surface roughness ranging from approximately 25 nm to approximately 800 nm. Windows with a surface roughness less than approximately 10 nm may fail to reduce regular reflections, and windows with a surface roughness greater than approximately 1000 nm exhibit degraded durability. Conversely, because the window GL according to the embodiment has a surface roughness ranging from approximately 10 nm to approximately 1000 nm, the window GL can exhibit excellent anti-glare properties due to the reduction of regular reflections while achieving excellent durability.

[0093] A window GL according to an embodiment is formed by a window manufacturing method according to an embodiment, which is described later, and the window manufacturing method according to an embodiment may include the steps of providing heat; providing water; and performing etching. A window GL formed by the window manufacturing method according to an embodiment including the steps described herein may have a surface roughness in the range of about 10 nm to about 1000 nm. A window GL formed by the window manufacturing method according to an embodiment including the steps of providing heat and water may have a nanometer-scale surface roughness.

[0094] Window GL is a single-layer glass substrate, and the glass substrate may include SiO2. Window GL may include a portion PT1 (hereinafter, portion PT1) and another portion PT2. In window GL, the other portion PT2 may be a portion other than portion PT1. Portion PT1 and the other portion PT2 have a difference in silicon concentration and may be separated in the thickness direction DR3. In window GL, portion PT1 may be formed on the other portion PT2. Portion PT1 may include the upper surface GL_UF of window GL. In a plane, the area of ​​portion PT1 may be smaller than the area of ​​the upper surface GL_UF of window GL or substantially the same as the area of ​​the upper surface GL_UF of window GL. For example, in a plane, the area of ​​portion PT1 may be smaller than the transmission region TA (see...). Figure 3 The area of ​​the region or the transmission region TA (see Figure 3 The areas are basically the same.

[0095] A portion of PT1 may be spaced apart from the lower surface GL_DF of window GL. Another portion of PT2 may include the lower surface GL_DF of window GL. The first concentration of silicon in portion PT1 may be higher than the second concentration of silicon in the other portion of PT2. The portion of PT1 with a relatively high silicon concentration may exhibit low refractive index characteristics. The portion of PT1 with a relatively high silicon concentration may be a silicon-rich portion. The first silicon concentration may refer to the concentration of silicon in portion PT1 relative to the total content of portion PT1. The second silicon concentration may refer to the concentration of silicon in the other portion of PT2 relative to the total content of the other portion of PT2.

[0096] The window GL is formed by performing a manufacturing process (i.e., the window manufacturing method according to the embodiment) on a mother glass substrate, and the mother glass substrate may include sodium oxide (Na2O), potassium oxide (K2O), lithium oxide (Li2O), magnesium oxide (MgO), calcium oxide (CaO), or silicon dioxide (SiO2), etc. The mother glass substrate refers to a glass substrate in a state prior to performing the manufacturing process. In an example of performing the window manufacturing method according to the embodiment described later, the metal cations of each of Na2O, K2O, Li2O, MgO, and CaO (i.e., Na+, K2O, Li2O, MgO, and CaO) are extracted (released) from the mother glass substrate. + K + Li + Mg 2+ and Ca 2+ Furthermore, part PT1 may have a relatively small amount of cations compared to another part PT2. Therefore, the first concentration of silicon in part PT1 may be higher than the second concentration of silicon in another part PT2. For example, the first concentration of silicon in part PT1 may be approximately 90% to approximately 95%, or approximately 99% or greater.

[0097] The upper surface GL_UF of window GL can be the surface on which light is incident from the outside. Because the silicon concentration in the portion PT1 including the upper surface GL_UF is relatively high, the portion PT1 has a low refractive index, and therefore window GL can exhibit excellent anti-reflective properties. The portion PT1 with relatively high silicon concentration can have a thickness T1 in the range of approximately 20 nm to approximately 200 nm. The thickness T1 of the portion PT1 can indicate the depth measured from the upper surface GL_UF as a starting point. For example, the portion PT1 can have a thickness T1 of approximately 100 μm. A window including a portion with a thickness of less than approximately 20 nm does not exhibit anti-reflective properties, and a window including a portion with a thickness greater than approximately 200 nm has reduced durability. Conversely, window GL including a portion PT1 in which silicon has a relatively high concentration and a thickness T1 in the range of approximately 20 nm to approximately 200 nm can exhibit excellent anti-reflective properties and durability.

[0098] Figure 4B and Figure 4C This is a cross-sectional view of a window according to an embodiment. Specifically, Figure 4B and Figure 4C This is a cross-sectional view showing region XX' according to another embodiment. In the following, regarding... Figure 4B and Figure 4C The description will no longer be explained or referenced. Figures 1 to 4A The content described is repetitive, and the following description will focus primarily on the differences.

[0099] and Figure 4A Compared to the window GL of region XX' shown, Figure 4B The difference between window GL-a in region XX'-a shown and window GL is that the lower surface GL_DFa is not flat. (Reference) Figure 4B The lower surface GL_DFa of window GL-a may include a sub-protrusion CX-a and a sub-recessed portion CV-a. The sub-protrusion CX-a and the sub-recessed portion CV-a may have a single, integral shape.

[0100] The protruding portion CX-a can be oriented in the thickness direction DR3 towards the display surface ES (see...). Figure 1 The protruding portion CX-a can be an upwardly projecting portion, and in this case, the term "upwardly" can mean a direction parallel to the direction extending along the third directional axis DR3. The recessed portion CV-a can be a portion that protrudes away from the display surface ES in the thickness direction DR3 (see [reference]). Figure 1 The recessed portion CV-a can be a downwardly recessed portion, and in this case, the term "downward" can mean the direction opposite to the direction in which the third directional axis DR3 extends.

[0101] The protruding sub-portion CX-a and the recessed sub-portion CV-a can each be formed in multiple forms. Multiple protruding sub-portions CX-a and multiple recessed sub-portions CV-a can be formed in the transmission region TA (see [link to original text]). Figure 3 Repeatedly set in the border area BZA. In some aspects, multiple sub-protrusions CX-a and / or multiple sub-recesses CV-a can also be set in the border area BZA (see Figure 3 )middle.

[0102] The multiple protruding sub-portions CX-a and the multiple recessed sub-portions CV-a may each have non-uniform shapes. The multiple protruding sub-portions CX-a may have different heights. In this case, the term "height" refers to the length from the predetermined third plane to the highest point of the protruding sub-portion CX-a, i.e., the length parallel to the thickness direction DR3. The multiple recessed sub-portions CV-a may have different depths. In this case, the term "depth" refers to the length from the predetermined second plane to the lowest point of the recessed sub-portion CV-a, i.e., the length parallel to the thickness direction DR3.

[0103] In window GL-a, the lower surface GL_DFa and the upper surface GL_UF may not have symmetrical shapes. The protruding portion CX of the upper surface GL_UF and the sub-protruding portion CX-a of the lower surface GL_DFa may not have symmetrical shapes. The recessed portion CV of the upper surface GL_UF and the sub-recessed portion CV-a of the lower surface GL_DFa may not have symmetrical shapes.

[0104] and Figure 4A Compared to the window GL of region XX' shown, Figure 4C The window GL-b in region XX'-b shown differs from window GL in that its upper surface GL_UFb includes a flat portion CP. (Reference) Figure 4C The upper surface GL_UFb of window GL-b may include a protruding portion CX, a recessed portion CV, and a flat portion CP. The flat portion CP is flat and may be substantially parallel to the lower surface GL_DF. The protruding portion CX, the recessed portion CV, and the flat portion CP may have an integral shape. The protruding portion CX and the recessed portion CV are formed in one region of the upper surface GL_UFb, and other regions of the upper surface GL_UFb besides this one region may be flat portions CP. The flat portion CP may be disposed on both sides of the one region in which the protruding portion CX and the recessed portion CV are formed. For example, on a plane, the flat portion CP may be disposed to surround the one region in which the protruding portion CX and the recessed portion CV are formed. However, this is presented by way of example, and the embodiments of this disclosure are not limited thereto.

[0105] Figure 5This is a cross-sectional view showing a portion of an electronic device according to an embodiment. Specifically, Figure 5 It shows along Figure 2 A cross-sectional view of the portion intercepted by line I-I'. Figure 5 It can be a detailed cross-sectional view of the active region DM-AA of the display module DM.

[0106] refer to Figure 5 The display module DM may include a display panel DP and an input sensing unit TP disposed on the display panel DP. The display panel DP may be configured to substantially generate an image. The input sensing unit TP may be disposed on the display panel DP. The input sensing unit TP may be directly disposed on the encapsulation layer TFE. Optionally, an adhesive component may also be disposed between the input sensing unit TP and the display panel DP.

[0107] In this specification, when an element is referred to as being directly set / provided / formed on another element, there is no intermediary element between the element and the other element. That is, the phrase "an element is directly set / provided / formed on" another element means that the element is in contact with the other element.

[0108] The input sensing unit TP can detect external input, convert the detected external input into a predetermined input signal, and provide the input signal to the display panel DP. For example, the input sensing unit TP can be a touch sensing unit that detects touch. The input sensing unit TP can recognize direct touch by the user, indirect touch by the user, direct touch by an object, or indirect touch by an object, etc.

[0109] The input sensing unit TP can detect at least one of the position and intensity (pressure) of a touch applied from the outside. In embodiments, the input sensing unit TP can have various structures or be composed of various materials, but is not limited to any one embodiment. For example, the input sensing unit TP can detect external input capacitively. The display panel DP can receive the input signal from the input sensing unit TP and generate an image corresponding to the input signal.

[0110] The display panel DP may include a substrate BS, a circuit layer DP-CL, a display element layer DP-EL, and a package layer TFE stacked sequentially. In addition to or as an alternative to the example shown, additional components may be further disposed between two adjacent layers of the substrate BS, circuit layer DP-CL, display element layer DP-EL, and package layer TFE.

[0111] The substrate BS can provide a substrate surface on which the circuit layer DP-CL is disposed. The substrate BS can be a flexible substrate that is bendable, foldable, or rollable. The substrate BS can be a glass substrate, a metal substrate, or a polymer substrate, etc. However, the embodiments of this disclosure are not limited thereto, and the substrate BS can include inorganic layers, organic layers, or composite material layers.

[0112] The substrate BS may comprise a single layer or multiple layers. For example, the substrate BS may comprise a first synthetic resin layer, multiple or single-layer inorganic layers, and / or a second synthetic resin layer disposed on multiple or single-layer inorganic layers. The first and second synthetic resin layers may each comprise a polyimide resin. In some aspects, the first and second synthetic resin layers may each comprise at least one selected from acrylic resins, methacrylic resins, polyisoprene resins, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. In this specification, resins with the prefix "~~" are considered to include functional groups with the prefix "~~".

[0113] The display panel DP may include transistors (TR) and light-emitting elements (ED). The transistors (TR) and light-emitting elements (ED) may be disposed on the substrate (BS). Figure 5 A transistor TR is shown, but the display panel DP may substantially include at least one capacitor and multiple transistors for driving the light-emitting element ED.

[0114] The circuit layer DP-CL may include insulating layers, semiconductor patterns, conductive patterns, or signal lines. For example, the circuit layer DP-CL may include switching transistors or driving transistors for driving the light-emitting elements ED of the display element layer DP-EL.

[0115] The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connection electrode CNE, a buffer layer BFL, and multiple insulating layers INS1 to INS6. The multiple insulating layers INS1 to INS6 may include a first insulating layer INS1 to a sixth insulating layer INS6. However, Figure 5 The stacked structure of the circuit layer DP-CL shown is presented as an example, and the stacked structure of the circuit layer DP-CL can be changed according to the configuration of the display panel DP and the process used for the circuit layer DP-CL, or other configurations or processes supported by this disclosure.

[0116] A shielding electrode BML can be disposed on the substrate BS. The shielding electrode BML can overlap with the transistor TR. The shielding electrode BML can block light incident on the transistor TR from below the display panel DP to protect the transistor TR. The shielding electrode BML can include a conductive material. In an example where a voltage is applied to the shielding electrode BML, a threshold voltage of the transistor TR disposed on the shielding electrode BML can be maintained. However, embodiments of this disclosure are not limited thereto, and the shielding electrode BML can be a floating electrode. The shielding electrode BML can also be omitted.

[0117] A buffer layer BFL can be disposed on a substrate BS and cover a shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL can improve the adhesion between the substrate BS and the semiconductor or conductive pattern disposed on the buffer layer BFL.

[0118] A transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, channel C1, and drain D1 of the transistor TR may be formed from a semiconductor pattern. The semiconductor pattern of the transistor TR may include polycrystalline silicon, amorphous silicon, or metal oxide. However, any material with semiconductor properties can be used without limitation, and the embodiment is not limited to any one of them.

[0119] A semiconductor pattern can include multiple regions divided according to conductivity levels. Regions in the semiconductor pattern that are doped with dopants or where metal oxides are reduced can have high conductivity and can essentially serve as the source and drain electrodes of a transistor TR. The high-conductivity regions of the semiconductor pattern can correspond to the source S1 and drain D1 of the transistor TR. Regions in the semiconductor pattern that are undoped, lightly doped, or have low conductivity due to unreduced metal oxides can correspond to the channel C1 (or active region) of the transistor TR.

[0120] A first insulating layer INS1 may cover the semiconductor pattern of transistor TR and is disposed on buffer layer BFL. The gate G1 of transistor TR may be disposed on the first insulating layer INS1. Planarly, gate G1 may overlap with the channel C1 of transistor TR. Gate G1 may be used as a mask during the doping process of the semiconductor pattern of transistor TR.

[0121] The second insulating layer INS2 can cover the gate G1 and is disposed on the first insulating layer INS1. The third insulating layer INS3 can be disposed on the second insulating layer INS2.

[0122] The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 that electrically connects the transistor TR and the light-emitting element ED. However, the configuration of the connection electrode CNE that electrically connects the transistor TR to the light-emitting element ED is not limited thereto. Either the first connection electrode CNE1 and the second connection electrode CNE2 may be omitted, or additional connection electrodes may be included.

[0123] The first connecting electrode CNE1 can be disposed on the third insulating layer INS3. The first connecting electrode CNE1 can be connected to the drain electrode D1 via a first contact hole CH1 passing through the first insulating layer INS1 to the third insulating layer INS3. The fourth insulating layer INS4 can cover the first connecting electrode CNE1 and is disposed on the third insulating layer INS3. The fifth insulating layer INS5 can be disposed on the fourth insulating layer INS4.

[0124] The second connecting electrode CNE2 can be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 via a second contact hole CH2 passing through the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 can cover the second connecting electrode CNE2 and is disposed on the fifth insulating layer INS5.

[0125] The first insulating layer INS1 through the sixth insulating layer INS6 may each comprise an inorganic layer or an organic layer. For example, the inorganic layer may comprise at least one of alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may also comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins.

[0126] The display element layer DP-EL may include a pixel defining film (PDL) and a light-emitting element (ED). The ED may include a first electrode AE, a second electrode CE disposed on the first electrode AE, and a light-emitting layer (EML) disposed between the first electrode AE ​​and the second electrode CE. In some aspects, the ED may also include a hole control layer (HCL) and an electronic control layer (TCL). The hole control layer (HCL) may be disposed between the first electrode AE ​​and the light-emitting layer (EML). The electronic control layer (TCL) may be disposed between the light-emitting layer (EML) and the second electrode CE.

[0127] Light-emitting elements (EDs) can emit light. For example, EDs can include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, or quantum rods. For example, EDs can include micro light-emitting diodes (LEDs) or nano LEDs.

[0128] The first electrode AE ​​can be disposed on the sixth insulating layer INS6. The first electrode AE ​​can be connected to the second connecting electrode CNE2 via the third contact hole CH3 passing through the sixth insulating layer INS6. The first electrode AE ​​can be electrically connected to the drain D1 of the transistor TR via the first connecting electrode CNE1 and the second connecting electrode CNE2.

[0129] The first electrode AE ​​can be formed of a metallic material, a metallic alloy, or a conductive compound. The first electrode AE ​​can be an anode or a cathode. However, embodiments of this disclosure are not limited thereto. In some aspects, the first electrode AE ​​can be a pixel electrode. The first electrode AE ​​can be a transmissive electrode, a semi-transmissive reflective electrode, or a reflective electrode. The first electrode AE ​​can include: at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; a compound selected from two or more of these materials; a mixture selected from two or more of these materials; or oxides thereof.

[0130] When the first electrode AE ​​is a transmission electrode, the first electrode AE ​​may comprise a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. In examples where the first electrode AE ​​is a semi-transparent or reflective electrode, the first electrode AE ​​may comprise Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or compounds or mixtures thereof (e.g., mixtures of Ag and Mg), or materials having a multilayer structure such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Optionally, the first electrode AE ​​may have a multilayer structure comprising a reflective or semi-transparent reflective film formed of the materials described herein, and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not limited thereto. Embodiments of this disclosure are not limited thereto, and the first electrode AE ​​may include the metallic materials described herein, combinations of two or more metallic materials selected therefrom, or oxides of the metallic materials described herein, etc.

[0131] A pixel-defining film (PDL) can be disposed on a sixth insulating layer (INS6). A light-emitting opening (PX_OP) exposing a portion of the first electrode (AE) can be defined in the pixel-defining film (PDL). The portion of the first electrode (AE) exposed by the light-emitting opening (PX_OP) can be defined as the light-emitting region (LA).

[0132] The active region DM-AA of the display module DM may include a light-emitting region LA and a light-blocking region NLA. The area where the pixel limiting film PDL is located may correspond to the light-blocking region NLA. The light-blocking region NLA may surround the light-emitting region LA within the active region DM-AA.

[0133] A hole control layer (HCL) can be disposed on the first electrode (AE) and the pixel defining film (PDL). The hole control layer (HCL) can be provided as a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). In addition to or as an alternative to the illustrated example, the hole control layer (HCL) can also be disposed in the region corresponding to the light-emitting opening (PX_OP). The hole control layer (HCL) can include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer (HCL) can include typical hole injection materials and / or typical hole transport materials.

[0134] The luminescent layer (EML) can be disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the luminescent opening (PX_OP). Optionally, the EML can also be provided as a common layer. The EML can include organic and / or inorganic luminescent materials. The EML can emit light of one of the colors red, green, and blue. For example, the EML can emit blue light.

[0135] An electron control layer (TCL) can be disposed on the light-emitting layer (EML). The TCL can be provided as a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). In addition to or as an alternative to the illustrated example, the TCL can also be disposed in the region corresponding to the light-emitting opening (PX_OP). The TCL can include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The TCL can include typical electron injection materials and / or typical electron transport materials.

[0136] The second electrode CE can be disposed on the electronic control layer TCL. The second electrode CE can be provided as a common layer overlapping the light-emitting region LA and the light-blocking region NLA. The second electrode CE can be a common electrode. The second electrode CE can be a cathode or an anode, but embodiments of this disclosure are not limited thereto. In an example where the first electrode AE ​​is an anode, the second electrode CE can be a cathode, and when the first electrode AE ​​is a cathode, the second electrode CE can be an anode.

[0137] The second electrode CE can be a transmission electrode, a semi-transmissive reflective electrode, or a reflective electrode. In an example where the second electrode CE is a transmission electrode, the second electrode CE can include a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).

[0138] When the second electrode CE is a semi-transparent reflective electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, Yb, W, or compounds or mixtures thereof (e.g., AgMg, AgYb, or MgYb), or materials having a multilayer structure such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Optionally, the second electrode CE may have a multilayer structure, including a reflective or semi-transparent reflective film formed of the materials described herein, and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). For example, the second electrode CE may include metallic materials described herein, combinations of two or more metallic materials selected therefrom, or oxides of metallic materials described herein.

[0139] The encapsulation layer TFE can be disposed on the display element layer DP-EL. The encapsulation layer TFE can be disposed on the second electrode CE and cover the light-emitting element ED. The encapsulation layer TFE can protect the display element layer DP-EL from moisture, oxygen and / or foreign substances (such as dust particles, for example). The encapsulation layer TFE can include multiple thin films.

[0140] The encapsulation layer TFE may include at least one inorganic film. For example, the encapsulation layer TFE may include an inorganic film disposed on the second electrode CE and an organic film disposed between the inorganic films. The inorganic film can protect the light-emitting element ED from moisture / oxygen, and the organic film can protect the light-emitting element ED from foreign substances (such as dust particles, for example).

[0141] The input sensing unit TP can be disposed on the display panel DP. For example, the input sensing unit TP can be directly disposed on the encapsulation layer TFE of the display panel DP. Optionally, an adhesive layer can also be disposed between the input sensing unit TP and the display panel DP.

[0142] The input sensing unit TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing unit TP may include at least one conductive layer disposed on the sensing insulating layers. The input sensing unit TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0143] A first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the encapsulation layer TFE. Optionally, the first sensing insulating layer IL1 may be omitted, and in this case, the first conductive layer CDL1 may be in contact with the encapsulation layer TFE.

[0144] A first conductive layer CDL1 may be disposed on a first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. A second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0145] A second conductive layer CDL2 may be disposed on a second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. The plurality of second conductive patterns may be connected to a plurality of first conductive patterns respectively via contact holes formed in the second sensing insulating layer IL2.

[0146] The plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 can each be configured to correspond to the light-blocking region NLA. The plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 can each be a grid pattern.

[0147] The third sensing insulating layer IL3 can be disposed on the second sensing insulating layer IL2 and cover the second conductive layer CDL2. The second sensing insulating layer IL2 and the third sensing insulating layer IL3 can each include an inorganic insulating layer or an organic insulating layer.

[0148] The first conductive layer CDL1 and the second conductive layer CDL2 can each have a monolayer structure or a multilayer structure in which the layers are stacked along the third direction DR3. The monolayer conductive layers CDL1 and CDL2 can each include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer can include a transparent conductive oxide (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO)). In some aspects, the transparent conductive layer can include a conductive polymer (such as poly(ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene).

[0149] The conductive layers CDL1 and CDL2, which have a multilayer structure, may include metal layers. For example, the metal layers may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti). The conductive layers CDL1 and CDL2, which have a multilayer structure, may include at least one metal layer and at least one transparent conductive layer.

[0150] Figures 6A to 6D and Figure 7 This is a view illustrating an electronic device EA-a according to another embodiment of the concept of the present invention. Figure 6A This is a perspective view showing an electronic device according to an embodiment. Figure 6B This is a perspective view showing an electronic device according to an embodiment. Figure 6C This is a plan view illustrating an electronic device according to an embodiment. Figure 6D This is a perspective view showing an electronic device according to an embodiment. Figure 7 This is an exploded perspective view showing an electronic device according to an embodiment. In the following, regarding... Figures 6A to 6D and Figure 7 The description will no longer be explained or referenced. Figures 1 to 5 The content described is repetitive, and the following description will focus primarily on the differences.

[0151] Figures 6A to 6D and Figure 7 The electronic device EA-a shown in each of the figures can be a foldable device relative to at least one of the folding axes FX1 and FX2. Figure 6A This is a perspective view showing the electronic device EA-a in its unfolded state.

[0152] Electronic device EA-a may include a first display surface FS and a second display surface RS. The first display surface FS may include a first display area F-DA, a first non-display area F-NDA, and a sub-area MH-a. The second display surface RS may be defined as a surface opposite to at least a portion of the first display surface FS. That is, the second display surface RS may be defined as a portion of the rear surface of electronic device EA-a.

[0153] The first display area F-DA can be activated in response to an electrical signal. The first display area F-DA can be an area where an image IM can be displayed and various types of external input can be detected. A first non-display area F-NDA can be adjacent to the first display area F-DA. The transmittance of the first non-display area F-NDA can be less than that of the first display area F-DA. The first non-display area F-NDA can have a predetermined color. The first non-display area F-NDA can surround the first display area F-DA. Therefore, the planar shape of the first display area F-DA can be substantially defined by the first non-display area F-NDA. However, this is presented as an example, and the first non-display area F-NDA can be set to be adjacent to one side of the first display area F-DA, or it can be omitted.

[0154] Sub-region MH-a can detect external objects via display surfaces FS and RS, or provide sound signals, such as speech, to the outside via display surfaces FS and RS. Optical signals, such as visible light or infrared light, can be moved to sub-region MH-a.

[0155] Various electronic modules (ELM) can be configured (see...) Figure 7 ) so as to correspond to the sub-region MH-a. For example, the electronic module ELM (see Figure 7 The electronic device EA-a may include at least one of a camera, a speaker, a light detection sensor, and a thermal detection sensor. The electronic device EA-a may include an electronic module ELM (see...). Figure 7 The electronic module ELM captures external images by using visible light that passes through the sub-region MH-a or by using infrared light to determine if an external object is approaching.

[0156] Sub-region MH-a may be located within the first display area F-DA. However, this is presented as an example, and the arrangement of sub-region MH-a is not limited to any one embodiment. For example, sub-region MH-a may be surrounded not only by the first non-display area F-NDA, but also by both the first display area F-DA and the first non-display area F-NDA. Figure 6A The other figures in this paper show a subregion MH-a, but subregion MH-a may also be provided as multiple.

[0157] Electronic device EA-a may include at least one folded region FA and a plurality of non-folded regions NFA1 and NFA2 extending from the folded region FA. For example, the first non-folded region NFA1, the folded region FA, and the second non-folded region NFA2 may be defined along a second direction DR2. Electronic device EA-a may include the first non-folded region NFA1 and the second non-folded region NFA2 spaced apart from each other in the second direction DR2, with the folded region FA between the first non-folded region NFA1 and the second non-folded region NFA2. For example, the first non-folded region NFA1 may be located on one side of the folded region FA along the second direction DR2, and the second non-folded region NFA2 may be located on the other side of the folded region FA along the second direction DR2.

[0158] Figure 6A The accompanying drawings illustrate an electronic device EA-a including a folded region FA according to an embodiment, but the embodiments disclosed herein are not limited thereto. Multiple folded regions may be defined in the electronic device EA-a. For example, the electronic device according to an embodiment may include two or more folded regions and may include three or more non-folded regions with folded regions disposed between the non-folded regions.

[0159] Figure 6B It is shown Figure 6A A perspective view of the folding operation of the electronic device EA-a shown. Figure 6C It is shown Figure 6A The diagram shows the folded state of the electronic device EA-a. Figure 6D It is shown Figure 6A A perspective view of the folding operation of the electronic device EA-a shown.

[0160] refer to Figure 6B The electronic device EA-a can be folded relative to a first folding axis FX1 extending in a first direction DR1. In the folded state of the electronic device EA-a, the folding region FA can have a predetermined curvature and radius of curvature. The electronic device EA-a can be folded relative to the first folding axis FX1 and changed to an inward folded state, such that the first non-folded region NFA1 and the second non-folded region NFA2 face each other and the first display surface FS is not exposed to the outside.

[0161] Figure 6C This could be a plan view showing the folded state of the electronic device EA-a. (Reference) Figure 6CIn the inward-folded state of the electronic device EA-a, the user can view the second display surface RS. In this case, the second display surface RS may include a second display area R-DA for displaying images. The second display area R-DA can be activated in response to an electrical signal. The second display area R-DA can be an area in which images can be displayed and various types of external inputs can be detected.

[0162] In some aspects, the second display surface RS may include a second non-display area R-NDA. The second non-display area R-NDA may be adjacent to the second display area R-DA. The light transmittance of the second non-display area R-NDA may be less than that of the second display area R-DA. The second non-display area R-NDA may have a predetermined color. The second non-display area R-NDA may surround the second display area R-DA. Although not shown, the electronic device EA-a may also include a sub-region in the second display surface RS in which an electronic module comprising various components is disposed, and is not limited to any particular embodiment.

[0163] refer to Figure 6D The electronic device EA-a can be folded relative to a second folding axis FX2 extending in the first direction DR1. The electronic device EA-a can be folded relative to the second folding axis FX2 and changed to an outward folded state, such that the first display surface FS is exposed to the outside. The electronic device EA-a according to the embodiment can be configured to repeatedly perform inward folding or outward folding operations from an unfolded operation and vice versa, but the embodiments of this disclosure are not limited thereto.

[0164] Figures 6A to 6D An example of an electronic device EA-a folded relative to a folding axis (first folding axis FX1 or second folding axis FX2) is shown, but in the electronic device according to embodiments, the number of folding axes and the number of non-folded areas corresponding to the number of folding axes are not particularly limited thereto. For example, the electronic device EA-a may be folded relative to multiple folding axes such that corresponding portions of the first display surface FS and the second display surface RS face each other. In some aspects, the first folding axis FX1 and the second folding axis FX2 are shown parallel to the long side of the electronic device EA-a, but embodiments of this disclosure are not limited thereto. The first folding axis FX1 and the second folding axis FX2 may be parallel to the short side of the electronic device EA-a.

[0165] In electronic devices such as EA-a Figure 6CIn the folded state shown, the first non-folded region NFA1 and the second non-folded region NFA2 can be defined as portions having display surfaces FS and RS parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2, and the folded region FA can be defined as the region between the first non-folded region NFA1 and the second non-folded region NFA2. The folded region FA may have a curved portion that is bent to have a predetermined curvature in the folded state.

[0166] Figure 7 yes Figure 6A An exploded perspective view of the electronic device EA-a shown. (Reference) Figure 7 Electronic device EA-a may include display device DD-a and electronic module ELM. Electronic device EA-a may also include housing HAU and protective layer PL. Display device DD-a may include display module DM-a and window member WD disposed on display module DM-a. Window member WD may be relative to folding axes FX1 and FX2 (see...). Figure 6B and Figure 6D )fold.

[0167] The display module DM-a may include a foldable display unit FP-D and non-foldable display units NFP1-D and NFP2-D. The foldable display unit FP-D may be connected to the folding area FA (see...). Figure 6A The corresponding parts, and the non-folding display parts NFP1-D and NFP2-D can be the non-folding areas NFA1 and NFA2 (see...). Figure 6A The corresponding part.

[0168] The folding display unit FP-D can be connected to FX1 and FX2 relative to the folding axis (see... Figure 6B and Figure 6D The folded portion corresponds to the non-folding display units NFP1-D and NFP2-D. The non-folding display units NFP1-D and NFP2-D may include a first non-folding display unit NFP1-D and a second non-folding display unit NFP2-D. The first non-folding display unit NFP1-D and the second non-folding display unit NFP2-D may be spaced apart from each other in the second direction DR2, and the folding display unit FP-D is located between the first non-folding display unit NFP1-D and the second non-folding display unit NFP2-D. The first non-folding display unit NFP1-D may be located adjacent to the first non-folding region NFA1 (see...). Figure 6A The part corresponding to the second non-folding display section NFP2-D can be the part corresponding to the second non-folding area NFA2 (see...). Figure 6A The corresponding part.

[0169] Although not shown, the electronic device EA-a may also include a lower module disposed below the display module DM-a. For example, the lower module may include a support layer, a padding layer, or a shielding layer. The support layer may be a thin-film metal substrate. The padding layer may include an elastomer such as sponge, foam, or urethane resin. The shielding layer may be an electromagnetic wave shielding layer or a heat dissipation layer. However, this is presented as an example, and the components included in the lower module may vary depending on the size, shape, or operating characteristics of the electronic device EA-a.

[0170] The window according to the embodiment can be formed by the window manufacturing method according to the embodiment. Figure 8 This is a flowchart illustrating a window manufacturing method according to an embodiment. Figures 9 to 12 This is a schematic view illustrating the window manufacturing steps according to an embodiment. In the following, regarding... Figures 8 to 12 The description will no longer be explained or referenced. Figures 1 to 7 The content described is repetitive, and the following description will focus primarily on the differences.

[0171] In the description of window manufacturing methods and processes herein, operations may be performed in a different order than those shown and / or described, or in a different order or at different times. Specific operations may be omitted, one or more operations may be repeated, or additional operations may be added. Descriptions of elements as "can be set" and "can be formed," etc., include methods, processes, and techniques for setting and forming, etc., based on the examples described herein.

[0172] refer to Figure 8 The window manufacturing method according to an embodiment includes the following steps: preparing a mother glass substrate (S100); forming a first pre-existing window by providing heat (S200); forming a second pre-existing window by providing water (S300); forming a third pre-existing window by performing etching (S400); and forming the window by providing an acidic solution (S500). The first pre-existing window P1-GL (see...) Figure 10 It can be made from a mother glass substrate GA (see Figure 9 ) is formed, and the second preparatory window P2-GL (see Figure 11 This can be achieved by the first preparatory window P1-GL (see...) Figure 10 Formation of the third preparatory window P3-GL (see...) Figure 12 This can be achieved by the second preparatory window P2-GL (see...). Figure 11 ) are formed, and windows GL, GL-a, and GL-b (see Figures 4A to 4C Each can be generated by the third preparatory window P3-GL (see...) Figure 12 )form.

[0173] Figure 9This is a view illustrating the step of applying heat to the mother glass substrate GA. The mother glass substrate GA is a glass substrate prior to the manufacturing process and may include SiO2. The mother glass substrate GA may also include Na2O, K2O, Li2O, MgO, or CaO, etc. The mother glass substrate GA can be used without limitation, as long as the glass substrate is able to form the desired windows GL, GL-a, and GL-b while including SiO2 (see [link to documentation]). Figures 4A to 4C That's all.

[0174] refer to Figure 9 The mother glass substrate GA can be placed on a hot plate HP. Heat from the hot plate HP can be applied to the mother glass substrate GA. However, this is presented as an example, and the method of applying heat to the mother glass substrate GA is not limited to this.

[0175] In the step of applying heat to the mother glass substrate GA, the heat can have a temperature in the range of about 100°C to about 200°C. In examples where heat is applied to the mother glass substrate at a temperature less than about 100°C, a window with the desired level of surface roughness (i.e., about 10 nm to about 1000 nm) is not formed. In examples where heat is applied to the mother glass substrate at a temperature greater than about 200°C, the mother glass substrate is damaged due to thermal shock. Conversely, the window manufacturing method according to the embodiment may include the step of applying heat to the mother glass substrate GA, wherein the heat has a temperature in the range of about 100°C to about 200°C, thereby exhibiting excellent processability and supporting the formation of a window GL having a surface roughness in the range of about 10 nm to about 1000 nm.

[0176] In an example where the heat applied to the mother glass substrate GA is at a temperature of approximately 100°C, a window GL with a surface roughness of approximately 800 nm can be formed. Alternatively, when the heat applied to the mother glass substrate GA is at a temperature of approximately 200°C, a window GL with a surface roughness of approximately 25 nm can be formed.

[0177] Heat is applied to the mother glass substrate GA, allowing it to form Figure 10 The first preparatory window P1-GL is shown in the diagram. (Reference) Figure 10 Water WT can be supplied to the first preparation window P1-GL. Water WT can be supplied from the supply device SR, and can be supplied to the first preparation window P1-GL by a spraying method. Water WT can be supplied as ultrapure water for semiconductor manufacturing.

[0178] Water WT can be supplied to the first preparation window P1-GL, enabling the formation of... Figure 11 The second preparatory window P2-GL is shown in the figure. Figure 11The steps for etching the second preparatory window P2-GL are shown, and the etchant ET can be provided onto the second preparatory window P2-GL. The etchant ET can be provided from the providing device SR. Figure 10 and Figure 11 Water WT and etchant ET are shown being supplied from the same supplying device SR, but this is presented as an example. Water WT and etchant ET can be supplied from different supplying devices. The etchant ET may include at least one of hydrogen fluoride (HF), ammonium fluoride (NH4F), and ammonium hydrogen fluoride (NH4HF2).

[0179] By providing heat and water (WT) (see) Figure 10 Microcracks may exist on the upper surface of the second pre-formed window P2-GL. In an example where etchant ET is provided into the microcracks, such as... Figure 4A As shown, a protruding portion CX can be formed (see...) Figures 4A to 4C ) and the recessed portion CV (see Figures 4A to 4C In examples where the steps of providing heat and water are not performed, microcracks are absent in the upper surface, and therefore protrusions and recesses are not easily formed. Consequently, it is difficult to form windows with nanoscale surface roughness. Conversely, by providing heat and water WT at least on the mother glass substrate GA according to one or more embodiments of this disclosure, the window manufacturing method supports the formation of windows GL, GL-a, and GL-b with surface roughness ranging from about 10 nm to about 1000 nm (see...). Figures 4A to 4C Windows GL, GL-a, and GL-b manufactured by the window manufacturing method according to the embodiment (see...) Figures 4A to 4C It can exhibit excellent anti-glare properties.

[0180] The etchant ET is applied to the second preparatory window P2-GL, and then a process can be formed. Figure 12 The third preparatory window P3-GL is shown in the figure. Figure 12 The steps of providing an acidic solution ACS to the third preparatory window P3-GL can be illustrated. The acidic solution ACS is provided to a predetermined container BT, and the third preparatory window P3-GL can be immersed in the acidic solution ACS. The metal cation CT can be extracted from the third preparatory window P3-GL in the immersed state. The metal cation CT may include Na. + K + Li + Mg 2+ and Ca 2+ At least one of them. Na + K + Li + Mg 2+ and Ca 2+ It can originate from, including, the mother glass substrate GA (see...) Figure 9 The PT1 contains Na2O, K2O, Li2O, MgO, and CaO. As the metal cation CT is released, some PT1 (see...) Figures 4A to 4C The first concentration of silicon in PT2 can become higher than that in another part (see PT2). Figures 4A to 4C The second concentration of silicon in ) . In windows GL, GL-a, and GL-b formed by removing the metal cation CT from the third preparatory window P3-GL (see Figures 4A to 4C In this context, the upper surfaces GL_UF and GL_UFb are included (see...). Figures 4A to 4C Part of PT1 (see) Figures 4A to 4C The first concentration of silicon in PT2 can be higher than that in another part (see PT2). Figures 4A to 4C The second concentration of silicon in PT1. Therefore, a portion of PT1 (see Figures 4A to 4C ) exhibits low refractive index properties, and according to embodiments, includes a portion of PT1 (see Figures 4A to 4C GL windows can exhibit excellent anti-reflective properties.

[0181] An acidic solution ACS can be provided, wherein the temperature of the acidic solution ACS is in the range of approximately 40°C to approximately 80°C. In examples where an acidic solution with a temperature less than approximately 40°C is provided, the metal cations are not sufficiently extracted and therefore do not form the desired portion (i.e., the portion in which silicon has a relatively high concentration). In examples where an acidic solution with a temperature greater than approximately 80°C is provided, the metal cations are excessively extracted, which leads to a deterioration in the durability of the glass substrate. Conversely, the window manufacturing method according to the embodiments may include the step of providing an acidic solution ACS, wherein the temperature of the acidic solution ACS is in the range of approximately 40°C to approximately 80°C, thereby exhibiting excellent processability.

[0182] An acidic solution ACS can be provided for a period ranging from approximately 5 minutes to approximately 15 minutes. That is, the method may include exposing the third preparatory window P3-GL to the acidic solution ACS (i.e., immersing the third preparatory window P3-GL in the acidic solution ACS) for a period ranging from approximately 5 minutes to approximately 15 minutes. In examples where the third preparatory window P3-GL is exposed to the acidic solution (i.e., immersed in the acidic solution) for less than approximately 5 minutes, the desorption of metal cations is insufficient, and therefore a desired portion (i.e., a portion where silicon has a relatively high concentration) is not formed. In examples where the third preparatory window P3-GL is exposed to the acidic solution (i.e., immersed in the acidic solution) for more than approximately 15 minutes, the glass substrate has reduced transmittance. In examples where the third preparatory window P3-GL is exposed to the acidic solution (i.e., immersed in the acidic solution) for more than approximately 15 minutes, the third preparatory window P3-GL is exposed to the acidic solution for an extended period, and therefore the glass substrate has reduced transmittance due to the desorption of material from the interior (i.e., the deeper portion) of the glass substrate. Conversely, the window manufacturing method according to the embodiments may include the step of exposing a third preparatory window P3-GL to an acidic solution ACS for a period of time ranging from about 5 minutes to about 15 minutes, thereby exhibiting excellent processability.

[0183] The acidic solution ACS may include at least one of hydrochloric acid (HCl), nitric acid (HNO3), and sulfuric acid (H2SO4). The acidic component may be included in an amount ranging from about 20 wt% to about 80 wt% relative to 100 wt% of the total weight of the acidic solution ACS. The acidic solution ACS includes a solvent and a solute dissolved in the solvent, and the solute may be acidic solid particles. The solid particles may include at least one of hydrochloric acid, nitric acid, and sulfuric acid as the acidic component. The acidic solution ACS is prepared by dissolving the solid particles as the acidic component in a solvent (e.g., water), and when the solid particles are included in an amount greater than about 80 wt%, the solid particles are not dissolved in the solvent. In examples where the acidic component is included in an amount less than about 20 wt%, the desorption of metal cations is insufficient, and therefore a desired portion (i.e., a portion in which silicon has a relatively high concentration) is not formed. Instead, the window manufacturing method according to the embodiments may include the step of providing an acidic solution ACS comprising an acidic component satisfying the weight range described herein, thereby exhibiting excellent processability.

[0184] A typical window includes a glass substrate and multiple optical components disposed on the glass substrate. The multiple optical components include an anti-glare layer and an anti-reflective layer. The anti-glare layer is formed by performing a physical / chemical treatment on the surface of the glass substrate (or the pre-prepared anti-glare layer) to create protrusions and recesses therein, and the anti-reflective layer is formed by coating the glass substrate (or the pre-prepared anti-glare layer) with a multilayer thin film. Alternatively, a window including a glass substrate and optical components is formed by laminating an anti-glare layer / anti-reflective layer formed from the pre-prepared anti-glare layer / prepared anti-reflective layer onto the glass substrate.

[0185] Physical / chemical treatments include sandblasting / etching, but it is difficult to form an anti-glare layer with nanoscale surface roughness and / or uniform quality simply by performing physical / chemical treatments. In some respects, physical treatments reduce the strength of the glass substrate. During multilayer thin-film coating processes, multiple coating processes are performed on the glass substrate, and these multiple coating processes include vacuum deposition, sputtering, and / or wet-coating post-curing processes. In this case, depending on the process conditions, the physical properties of the glass substrate (such as the strength of the glass substrate) deteriorate. Furthermore, changes in appearance (such as warping) occur due to the differences in properties between the layers formed by the coating process and the glass substrate. The process of forming multiple optical components increases manufacturing costs.

[0186] Conversely, in the window manufacturing method according to the embodiments, the steps of applying heat to the mother glass substrate, providing water, and providing an etchant, as performed, ensure anti-glare properties. Subsequently, the step of providing an acidic solution, as performed, ensures anti-reflective properties. Therefore, the window manufacturing method according to one or more embodiments of this disclosure supports the manufacture of single-pane windows with excellent durability. Thus, single-pane windows manufactured by the window manufacturing method according to the embodiments can exhibit excellent durability while possessing anti-glare and anti-reflective properties. In some aspects, the window manufacturing method according to the embodiments does not include the step of forming additional optical components, and therefore can reduce manufacturing costs.

[0187] Figure 13 This is a graph showing the transmittance of the window according to wavelength. Specifically, Figure 13 This is a graph showing the transmittance evaluated according to wavelength in the windows of the example and comparison examples. Figure 13 This is a graph showing the measurement results obtained using a CM-3600d spectrophotometer (manufactured by Konica Minolta). The wavelengths are in the range of approximately 360 nm to approximately 720 nm, that is, in the visible light wavelength range. Figure 13 A window, based on the example and comparative example, is shown, formed by performing the steps of providing heat, providing water, and providing etchant in the same manner, and then changing whether an acidic solution is provided or changing the time of providing the acidic solution.

[0188] exist Figure 13 In the diagram, CX1 indicates a comparative example window where no acidic solution is provided. Windows indicated by EX1 to EX3 and CX2 to CX4 are provided with an acidic solution, and the acidic solution is provided at a temperature of approximately 60°C. EX1 to EX3 respectively indicate examples where an acidic solution is provided for approximately 5 minutes, approximately 10 minutes, and approximately 15 minutes. That is, the examples indicated by EX1 to EX3 are formed by a manufacturing method that satisfies the requirement of providing an acidic solution for a duration according to the embodiment (i.e., a time period ranging from approximately 5 minutes to approximately 15 minutes). CX2 to CX4 respectively indicate comparative examples where an acidic solution is provided for approximately 20 minutes, approximately 25 minutes, and approximately 30 minutes.

[0189] refer to Figure 13 As can be seen, comparative example CX1 exhibits a maximum transmittance of approximately 92%. Compared to comparative example CX1, examples EX1 to EX3 show relatively high transmittance. It can be seen that comparative examples CX2 to CX4 exhibit low transmittance in the wavelength range of approximately 420 nm to approximately 540 nm, close to the transmittance of comparative example CX1. Comparative examples CX2 to CX4 have reduced transmittance because the acidic solution is provided for more than approximately 15 minutes. As described herein, the windows of the examples indicated by EX1 to EX3 are formed by a manufacturing method that satisfies the time required to provide the acidic solution according to the embodiments. Therefore, it can be seen that the windows formed by the window manufacturing method that satisfies the time required to provide the acidic solution according to the embodiments exhibit excellent transmittance.

[0190] Figure 14 This is a block diagram of an electronic device according to an embodiment. (Reference) Figure 14 According to an embodiment, the electronic device EA may include a display module DM, a processor PR, a memory MR, and a power module PM.

[0191] The processor PR may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0192] The memory MR can store the data information required for the operation of the processor PR or the display module DM. When the processor PR executes the application stored in the memory MR, image data signals and / or input control signals are sent to the display module DM, and the display module DM can process the received signals and output image information through the display screen.

[0193] The power module PM may include a power module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power module to generate the power required for the operation of the electronic device EA.

[0194] At least one of the components of the electronic device EA described above may be included in the display device according to the above embodiments. Additionally, some modules that are functionally included in a single module may be included in the display device, while other modules may be provided separately from the display device. For example, the display device may include a display module DM, and the processor PR, memory MR, and power module PM may be provided as other devices within the electronic device EA, rather than within the display device.

[0195] Figure 15 Schematic diagrams of electronic devices according to various embodiments are shown. Reference Figure 15 The various electronic devices to which the display device according to the embodiments is applied may include: electronic devices for displaying images (such as smartphones EA_1a, tablet PCs EA_1b, laptops EA_1c, televisions (TVs) EA_1d, and desktop monitors EA_1e); wearable electronic devices including display modules (such as smart glasses EA_2a, head-mounted displays EA_2b, and smartwatches EA_2c); and vehicle electronic devices including display modules EA_3 (such as central information displays (CIDs) and interior mirror displays disposed on the instrument panel, central dashboard, or dashboard of a vehicle).

[0196] The electronic device according to an embodiment may include a display device and an electronic module. The display device may include a display panel and a window disposed on the display panel. The window may be a single-layer glass substrate, and the window includes an upper surface having protruding portions and recessed portions and having a surface roughness in the range of about 10 nm to about 1000 nm. In the window, a first concentration of silicon in the portion of the window including the upper surface may be higher than a second concentration of silicon in another portion of the window (i.e., a portion different from the portion including the upper surface). The portion of the window including the upper surface may have a thickness in the range of about 20 nm to about 200 nm. Therefore, the window according to the embodiment can exhibit excellent durability while ensuring anti-glare and anti-reflective properties.

[0197] The window according to the embodiments can be formed by the window manufacturing method according to the embodiments. The window manufacturing method according to the embodiments may include the steps of: providing heat; providing water; providing an etchant; and providing an acidic solution. A window having a surface roughness in the range of about 10 nm to about 1000 nm can be formed by the steps of providing heat, providing water, and providing an etchant. A window comprising a portion in which silicon has a relatively high concentration can be formed by the step of providing an acidic solution. Therefore, the window manufactured by the window manufacturing method according to the embodiments is a single-pane glass and can also exhibit excellent anti-glare properties, excellent anti-reflective properties, and excellent durability.

[0198] The window manufacturing method according to the embodiment includes the steps of providing heat and water to the mother glass substrate, and thus can exhibit excellent workability.

[0199] The window and electronic device including the window according to the embodiment include a single layer of glass, the single layer of glass including a portion having a high concentration of silicon, and the window can meet a predetermined surface roughness range, thereby exhibiting excellent durability.

[0200] Although embodiments of the inventive concept have been described, it is understood that the inventive concept should not be limited to the exemplary embodiments, but that various changes and modifications can be made by those skilled in the art within the spirit and scope of the inventive concept as claimed in the appended claims.

[0201] Therefore, the technical scope of this invention is not limited to what is described in the detailed description of the specification, but should be determined by the claims.

Claims

1. A method of manufacturing a window, wherein, The method comprises: preparing a mother glass substrate comprising silicon dioxide; forming a first preliminary window by applying heat to the mother glass substrate; forming a second preliminary window by providing water onto the first preliminary window; forming a third preliminary window by etching the second preliminary window; and forming a window by exposing the third preliminary window to an acidic solution.

2. The method of claim 1, wherein, The temperature of the heat is in a range from 100°C to 200°C.

3. The method of claim 1, wherein, The water is provided onto the first preliminary window by a spraying method.

4. The method of claim 1, wherein, The etching the second preliminary window comprises providing an etchant, and wherein the etchant comprises at least one of hydrogen fluoride, ammonium fluoride, and ammonium bifluoride.

5. The method of claim 1, wherein, The acidic solution comprises at least one of hydrochloric acid, nitric acid, and sulfuric acid.

6. The method of claim 1, wherein, The temperature of the acidic solution is in a range from 40°C to 80°C, and wherein the third preliminary window is exposed to the acidic solution for a period of time in a range from 5 minutes to 15 minutes.

7. The method of claim 1, wherein, An acidic component is included in an amount in a range from 20wt% to 80wt% relative to a total weight of 100wt% of the acidic solution.

8. The method of claim 1, wherein, The forming the window comprises immersing the third preliminary window into the acidic solution.

9. The method of claim 1, wherein: the window comprises an upper surface and a lower surface facing the upper surface, and a first concentration of silicon in a portion of the window comprising the upper surface is higher than a second concentration of silicon in another portion of the window, and wherein the portion of the window comprising the upper surface has a thickness in a range from 20nm to 200nm.

10. The method of claim 1, wherein, The window has a surface roughness in a range from 10nm to 1000nm.

11. A window, said window being a glass substrate, wherein, The window comprises: an upper surface comprising a convex portion and a concave portion; a lower surface facing the upper surface; and silicon dioxide, wherein: the upper surface has a surface roughness in a range from 10nm to 1000nm, a first concentration of silicon in a portion of the window spaced apart from the lower surface and comprising the upper surface is higher than a second concentration of silicon in another portion of the window, and the portion of the window comprising the upper surface has a thickness in a range from 20nm to 200nm.

12. The window of claim 11, wherein, The window is a single layer.

13. The window of claim 11, wherein, The lower surface is flat.

14. An electronic device, comprising: The electronic device comprises: a display apparatus having a module region defined in the display apparatus, and an electronic module disposed to correspond to the module region, wherein: the display apparatus comprises a display panel and a window disposed on the display panel, the window is the window according to any one of claims 11 to 13.

15. The electronic device of claim 14, wherein, The upper surface is spaced apart from the display panel, and the lower surface is between the upper surface and the display panel.

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