Treatment method of cooling medium overflowing surface of target material cooling back plate
By sandblasting and chemically treating the cooling medium flow surface of the target material cooling backplate to form micron-level pits and protrusions, combined with a chemical passivation layer, the problem of reduced heat dissipation performance caused by backplate oxidation is solved, achieving a highly efficient heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-14
- Publication Date
- 2026-03-27
AI Technical Summary
High-purity metal sputtering target backplates are prone to oxidation at high temperatures, leading to reduced heat dissipation performance. Existing technologies struggle to effectively suppress oxidation reactions caused by condensation film.
A combination of sandblasting roughening and chemical treatment is used to treat the flow surface of the cooling medium, forming micron-level pits and protrusions. This, along with a chemical passivation layer, blocks the oxygen dissolution and diffusion channels, inhibiting oxidation reactions.
It significantly reduces oxidation of the cooling medium flow surface, improves the heat dissipation effect of the backplate, and prevents target material cracking and solder layer failure.
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Figure SMS_1
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of target material, in particular to a processing method of a cooling medium flow surface of a target material cooling back plate. BACKGROUND
[0002] Currently, high-purity metal sputtering targets (such as copper, aluminum, titanium, tantalum and their alloys) are key materials for preparing integrated circuit interconnection lines and barrier layers. In high-power density sputtering processes, more than 70% of the ion bombardment kinetic energy is converted into target heat. The target needs to be combined into an integrated assembly with a back plate (Backing Plate) through welding, and the back plate is usually directly or indirectly in contact with cooling water to carry away a large amount of heat generated during sputtering to ensure that the working temperature of the target is within a reasonable range.
[0003] The back plate of the sputtering target is usually made of copper alloy, which is easy to oxidize when in contact with cooling water at high temperature. In addition, the back plate itself is a huge heat sink, and the temperature of its exposed surface in the vacuum chamber is much lower than the chamber environment. The residual water vapor (H2O), oxygen (O2) and other oxygen-containing impurities in the chamber will condense on the cold surface of the back plate to form a continuous water film with a thickness of nanometers. This water film can dissolve oxygen and form an electrochemical corrosion microenvironment on the surface of the back plate, leading to oxidation of the back plate surface and the formation of oxides (such as Fe2O3, Cr2O3, Al2O3). The oxide layer will further inhibit heat dissipation. If not promptly dissipated, it will cause the target to crack, the welding layer to fail, the target-back plate to separate, and the performance of the thin film to deteriorate.
[0004] The prior art mainly uses methods such as improving the vacuum degree, optimizing the baking process, and using a gas trap to reduce the moisture and oxygen content in the chamber, but the cost is high and the effect is limited. Some also use polishing to process the surface of the back plate, but the smooth surface is more prone to form a continuous water film, accelerating uniform oxidation.
[0005] Therefore, there is an urgent need for a new solution that can fundamentally inhibit the oxidation reaction caused by the condensation of water film from the surface state of the back plate material itself. SUMMARY
[0006] In view of the problems in the prior art, the purpose of the present application is to provide a processing method of a cooling medium flow surface of a target material cooling back plate to solve the problem of reduced heat dissipation performance caused by oxidation of the cooling medium flow surface of the cooling back plate.
[0007] To achieve this purpose, the present application adopts the following technical solutions:
[0008] The present application provides a processing method of a cooling medium flow surface of a target material cooling back plate, which comprises:
[0009] The cooling medium flow surface is sequentially subjected to roughening treatment and chemical treatment.
[0010] The processing agent used in the chemical treatment comprises benzotriazole, fruit acid and water.
[0011] The processing method provided by the application significantly reduces the oxidation of the overcurrent surface of the cooling medium and improves the heat dissipation effect of the back plate by coupling the roughening treatment and the chemical treatment.
[0012] As a preferred technical solution of the application, the roughening treatment comprises sand blasting.
[0013] As a preferred technical solution of the application, the end point of the roughening treatment is that the surface roughness Ra is 10-20 μm.
[0014] As a preferred technical solution of the application, the processing agent used in the chemical treatment comprises benzotriazole 10-20 parts, fruit acid 0.1-1 part and water 100-150 parts by weight.
[0015] As a preferred technical solution of the application, the fruit acid comprises one or a combination of at least two of malic acid, citric acid, glycolic acid or lactic acid.
[0016] As a preferred technical solution of the application, the operation temperature of the chemical treatment is 40-80 ℃.
[0017] As a preferred technical solution of the application, the time of the chemical treatment is 30-60 min.
[0018] As a preferred technical solution of the application, the chemical treatment is assisted by ultrasonic.
[0019] As a preferred technical solution of the application, the power of the ultrasonic is 50-100 W.
[0020] As a preferred technical solution of the application, the frequency of the ultrasonic is 20-25 kHz.
[0021] Compared with the prior art, the application has the following beneficial effects:
[0022] The application controls the average surface roughness Ra of the back plate to be between 10-20 μm by sand blasting the outer surface of the back plate in contact with the vacuum environment, and forms uniformly distributed micron-level pits and protrusions. The surface promotes the existence of condensed water in the form of discontinuous ultra-micro droplets instead of a continuous water film, thereby physically blocking the dissolution and diffusion channels of oxygen, and cooperating with the passivation layer formed in the chemical treatment (which has extremely low chemical activity and can further inhibit the occurrence of oxidation reaction), which can further reduce the oxidation and realize the efficient heat dissipation of the back plate.
[0023] The application will be further described in detail below. However, the following examples are only simple examples of the application and do not represent or limit the protection scope of the application, and the protection scope of the application is subject to the claims. DETAILED DESCRIPTION
[0024] In order to better illustrate the application and facilitate the understanding of the technical solutions of the application, the typical but non-limiting embodiments of the application are as follows:
[0025] At present, the cooling back plate is mostly used in the process of improving the vacuum degree, optimizing the baking process, using the gas trap and the like to reduce the moisture and oxygen content in the chamber, so as to reduce the oxidation of the flow surface. However, the above-mentioned methods do not fundamentally solve the problem and have limited effect. Based on this, the application can significantly reduce the oxidation of the flow surface by treating the flow surface of the cooling medium and the coupling effect of roughening treatment and chemical treatment, thereby improving the heat dissipation effect, as follows:
[0026] The embodiment provides a treatment method for a cooling medium flow surface of a target material cooling back plate, and the treatment method comprises the following steps:
[0027] The cooling medium flow surface is sequentially subjected to roughening treatment and chemical treatment.
[0028] The treatment agent used in the chemical treatment comprises benzotriazole, fruit acid and water.
[0029] In the application, the material of the target material cooling back plate can be selected from copper material (copper or copper alloy), aluminum material (aluminum or aluminum alloy) and stainless steel and the like commonly used as back plates in the field.
[0030] The roughening treatment comprises sand blasting.
[0031] In the application, sand blasting refers to using compressed air as power to form a high-speed jet beam to high-speed spray the spray material (copper ore sand, quartz sand, corundum sand, iron sand and sea sand) to the surface of the workpiece to be treated.
[0032] The roughening treatment has an end point of a surface roughness Ra of 10-20 μm, for example, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm and the like, but is not limited to the listed values, and other values not listed in the range also meet the requirements.
[0033] The treatment agent used in the chemical treatment comprises benzotriazole 10-20 parts, fruit acid 0.1-1 part and water 100-150 parts by weight.
[0034] In the present application, the benzene propyl triazole in the treating agent used in the chemical treatment is 10-20 parts by weight, for example, it can be 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts or 20 parts, etc., but not limited to the listed values, other values not listed in this range are also required.
[0035] In the present application, the fruit acid in the treating agent used in the chemical treatment is 0.1-1 parts by weight, for example, it can be 0.1 parts, 0.19 parts, 0.28 parts, 0.37 parts, 0.46 parts, 0.55 parts, 0.64 parts, 0.73 parts, 0.82 parts, 0.91 parts or 1 parts, etc., but not limited to the listed values, other values not listed in this range are also required.
[0036] In the present application, the water in the treating agent used in the chemical treatment is 100-150 parts by weight, for example, it can be 100 parts, 105 parts, 110 parts, 115 parts, 120 parts, 125 parts, 130 parts, 135 parts, 140 parts, 145 parts or 150 parts, etc., but not limited to the listed values, other values not listed in this range are also required.
[0037] The fruit acid includes one or a combination of at least two of malic acid, citric acid, glycolic acid or lactic acid.
[0038] In the present application, the combination of fruit acid can be selected as a combination of malic acid and citric acid, a combination of citric acid and glycolic acid, a combination of glycolic acid and lactic acid, etc.
[0039] The operation temperature of the chemical treatment is 40-80℃, for example, it can be 40℃, 44℃, 48℃, 52℃, 56℃, 60℃, 64℃, 68℃, 72℃, 76℃ or 80℃, etc., but not limited to the listed values, other values not listed in this range are also required.
[0040] The time of the chemical treatment is 30-60min, for example, it can be 30min, 33min, 36min, 39min, 42min, 45min, 48min, 51min, 54min, 57min or 60min, etc., but not limited to the listed values, other values not listed in this range are also required.
[0041] In the present application, the chemical treatment is assisted by ultrasound.
[0042] The power of the ultrasound is 50-100W, for example, it can be 50W, 55W, 60W, 65W, 70W, 75W, 80W, 85W, 90W, 95W or 100W, etc., but not limited to the listed values, other values not listed in this range are also required.
[0043] The frequency of the ultrasonic is 20-25 kHz, for example, 20 kHz, 20.5 kHz, 21 kHz, 21.5 kHz, 22 kHz, 22.5 kHz, 23 kHz, 23.5 kHz, 24 kHz, 24.5 kHz or 25 kHz, etc., but is not limited to the listed values, and other unlisted values in the range are also acceptable.
[0044] II. In order to illustrate the oxidation prevention effect achieved by the treatment method of the cooling medium flow surface of the target cooling back plate, the following examples are provided for illustration, as follows:
[0045] Example 1
[0046] The treatment method of the cooling medium flow surface of the target cooling back plate is provided, as follows:
[0047] The cooling medium flow surface is sequentially subjected to roughening treatment and chemical treatment;
[0048] The roughening treatment is sandblasting, and the endpoint of the roughening treatment is a surface roughness Ra of 15 μm;
[0049] The treatment agent used in the chemical treatment includes, by weight, 15 parts of benzotriazole, 0.5 parts of fruit acid and 120 parts of water; the fruit acid is malic acid; the operation temperature of the chemical treatment is 60°C; the time of the chemical treatment is 40 min; the chemical treatment is assisted by ultrasonic; the power of the ultrasonic is 60 W; and the frequency of the ultrasonic is 22 kHz.
[0050] Example 2
[0051] The treatment method of the cooling medium flow surface of the target cooling back plate is provided, as follows:
[0052] The cooling medium flow surface is sequentially subjected to roughening treatment and chemical treatment;
[0053] The roughening treatment is sandblasting, and the endpoint of the roughening treatment is a surface roughness Ra of 15 μm;
[0054] The treatment agent used in the chemical treatment includes, by weight, 15 parts of benzotriazole, 0.8 parts of fruit acid and 130 parts of water; the fruit acid is citric acid; the operation temperature of the chemical treatment is 50°C; the time of the chemical treatment is 50 min; the chemical treatment is assisted by ultrasonic; the power of the ultrasonic is 80 W; and the frequency of the ultrasonic is 23 kHz.
[0055] Example 3
[0056] The embodiment provides a processing method of a cooling medium flow surface of a target material cooling back plate, and specifically as follows.
[0057] The cooling medium flow surface is sequentially subjected to roughening treatment and chemical treatment.
[0058] The roughening treatment is sand blasting, and the endpoint of the roughening treatment is that the surface roughness Ra is 10 micrometers.
[0059] The processing agent used in the chemical treatment comprises 10 parts of benzotriazole, 1 part of fruit acid and 150 parts of water in terms of weight; the fruit acid is lactic acid; the operation temperature of the chemical treatment is 80 DEG C; the time of the chemical treatment is 30 minutes; the chemical treatment is assisted by ultrasonic; the power of the ultrasonic is 50 W; and the frequency of the ultrasonic is 25 kHz.
[0060] Embodiment 4
[0061] The embodiment provides a processing method of a cooling medium flow surface of a target material cooling back plate, and specifically as follows.
[0062] The cooling medium flow surface is sequentially subjected to roughening treatment and chemical treatment.
[0063] The roughening treatment is sand blasting, and the endpoint of the roughening treatment is that the surface roughness Ra is 20 micrometers.
[0064] The processing agent used in the chemical treatment comprises 20 parts of benzotriazole, 0.1 part of fruit acid and 100 parts of water in terms of weight; the fruit acid is glycolic acid; the operation temperature of the chemical treatment is 40 DEG C; the time of the chemical treatment is 60 minutes; the chemical treatment is assisted by ultrasonic; the power of the ultrasonic is 100 W; and the frequency of the ultrasonic is 20 kHz.
[0065] Embodiment 5
[0066] The difference from the embodiment 1 is that the endpoint of the roughening treatment is that the surface roughness Ra is 5 micrometers.
[0067] Embodiment 6
[0068] The difference from the embodiment 1 is that the endpoint of the roughening treatment is that the surface roughness Ra is 30 micrometers.
[0069] Comparative example 1
[0070] The difference from the embodiment 1 is that the chemical treatment is not performed.
[0071] Comparative example 2
[0072] The difference from the embodiment 1 is that the roughening treatment is not performed.
[0073] Comparative example 3
[0074] The difference from Example 1 is that the treating agent used in the chemical treatment does not contain benzenepropanetricarbazole.
[0075] Comparative Example 4
[0076] The difference from Example 1 is that the treating agent used in the chemical treatment does not contain citric acid.
[0077] Comparative Example 5
[0078] The difference from Example 1 is that the benzenepropanetricarbazole in the treating agent is replaced by an equal amount of gelatin.
[0079] Comparative Example 6
[0080] The difference from Example 1 is that the citric acid in the treating agent is replaced by an equal amount of benzoic acid.
[0081] The backplanes obtained in the above examples and comparative examples are subjected to oxidation resistance test, specifically, after assembling the backplane and the base, cooling water is passed therethrough, and the oxidation layer thickness is measured by eddy current thickness gauge after 7 days of operation, and the results are shown in Table 1.
[0082] Table 1
[0083]
[0084] As can be seen from Table 1, the treatment method provided by the present application significantly reduces the oxidation of the cooling medium overcurrent surface through the coupling of roughening treatment and chemical treatment, and improves the heat dissipation effect of the backplane.
[0085] The above describes the preferred embodiments of the present application in detail, but the present application is not limited to the specific details in the above embodiments, and various simple modifications can be made to the technical solutions of the present application within the technical concept of the present application, and these simple modifications all belong to the protection scope of the present application.
[0086] In addition, it should be noted that each specific technical feature described in the above specific embodiments can be combined in any appropriate manner without contradiction, and in order to avoid unnecessary repetition, the present application will not further describe various possible combinations.
[0087] In addition, various different embodiments of the present application can also be combined in any manner, as long as it does not deviate from the technical concept of the present application, and it should be considered as disclosed by the present application.
Claims
1. A method for treating the cooling medium flow surface of a target material cooling backplate, characterized in that, The processing method comprises: carrying out roughening treatment and chemical treatment on the cooling medium overcurrent surface in sequence; the processing agent used in the chemical treatment comprises benzotriazole, fruit acid and water.
2. The treatment method of claim 1, wherein, the roughening treatment comprises sand blasting.
3. The treatment method of claim 1, wherein, the end point of the roughening treatment is that the surface roughness Ra is 10-20 μm.
4. The treatment method of claim 1, wherein, the processing agent used in the chemical treatment comprises, by weight, 10-20 parts of benzotriazole, 0.1-1 part of fruit acid and 100-150 parts of water.
5. The treatment method of claim 1, wherein the fruit acid comprises one or a combination of at least two of malic acid, citric acid, glycolic acid or lactic acid.
6. The treatment method of claim 1, wherein, the operation temperature of the chemical treatment is 40-80 ℃.
7. The treatment method of claim 1, wherein the time of the chemical treatment is 30-60 min.
8. The treatment method of claim 1, wherein, ultrasound is used in the chemical treatment.
9. The treatment method of claim 8, wherein, the power of the ultrasound is 50-100 W.
10. The treatment method of claim 8, wherein, the frequency of the ultrasound is 20-25 kHz.