Electronic device

Abstract

An electronic device is disclosed. The electronic device includes: a display panel including a first non-folding area, a folding area, and a second non-folding area arranged to each other in a first direction; a support plate disposed under the display panel and provided with a plurality of openings defined to pass through the support plate and overlapping the folding area; a lower adhesive layer disposed between the display panel and the support plate and overlapping the opening; a lower film overlapping the opening and disposed on a lower surface of the support plate; and a cover layer disposed on the lower surface of the support plate and covering the lower film. A film opening is defined through the lower film and a cap opening is defined through the cover layer.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2024-0130197, filed on September 25, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] One or more embodiments of this disclosure relate to an electronic device. Background Technology

[0003] Commercial electronic devices that provide images to users (such as smartphones, digital cameras, laptops, navigation units, and / or smart TVs) may include electronic devices for displaying images. The electronic device generates images and provides them to the user through its display screen.

[0004] In recent years, with the rapid advancement of electronic device technology, various types of electronic devices have been developed. For example, suitable electronic devices that can be transformed into curved shapes, are foldable, and / or rollable have been developed and commercialized. These electronic devices are easy to carry and improve user convenience.

[0005] Flexible electronic devices typically include a flexible display panel and a support plate beneath the flexible display panel. Openings are defined through the support plate (e.g., within the support plate) to facilitate the flexibility of the electronic device. The electronic device may include a cover layer to prevent or reduce the entry of foreign objects into these openings. Summary of the Invention

[0006] One or more aspects of embodiments of this disclosure relate to an electronic device having improved strength in a folded region and improved invisibility of an opening defined through a support plate (e.g., within the support plate). For example, the electronic device has improved strength in the folded region, and the shape of the opening defined in the support plate is less noticeable from the outside or outside of the electronic device. For example, the opening in the support plate is not easily seen or detected when the electronic device is viewed from the outside or outside. Additional aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practice of the embodiments given.

[0007] According to one or more embodiments of the present disclosure, an electronic device includes: a display panel including a first non-foldable region, a foldable region, and a second non-foldable region arranged relative to each other in a first direction; a support plate below the display panel (e.g., disposed below the display panel) and having a plurality of openings defined to pass through the support plate and overlap with the foldable region; a lower adhesive layer between the display panel and the support plate (e.g., disposed between the display panel and the support plate) and overlapped with the plurality of openings; a lower film overlapped with the plurality of openings and on a lower surface of the support plate (e.g., disposed on the lower surface of the support plate); and a cover layer on the lower surface of the support plate (e.g., disposed on the lower surface of the support plate) and covering the lower film, wherein the film openings are defined to pass through the lower film, and the cover openings are defined to pass through the cover layer.

[0008] According to one or more embodiments of the present disclosure, an electronic device includes: a display panel including a first non-foldable region, a foldable region, and a second non-foldable region arranged relative to each other in a first direction; a support plate below the display panel (e.g., disposed below the display panel) and including a folded portion superimposed on the foldable region and having a plurality of openings defined through the folded portion; a lower adhesive layer between the display panel and the support plate (e.g., disposed between the display panel and the support plate) and superimposed on the plurality of openings; a cover layer below the support plate (e.g., disposed below the support plate) and superimposed on the plurality of openings; and a lower film between the cover layer and the folded portion (e.g., disposed between the cover layer and the folded portion), wherein, when viewed in a plane (e.g., in a plan view), at least a portion of the lower film is exposed to the outside (e.g., the outside of the electronic device) and is not covered by the cover layer.

[0009] According to this disclosure, below the lower surface of the support plate, the membrane opening is defined to pass through the lower membrane, and the cover opening is defined to pass through the cover layer. Therefore, a vacuum is prevented inside the opening defined to pass through the support plate, and deformation of the lower adhesive layer and cover layer disposed on the upper surface of the support plate is prevented in the area corresponding to the opening. Thus, the pattern preventing or protecting the opening is visible from the outside (exterior) of the electronic device.

[0010] According to this disclosure, at least a portion of the lower film is exposed to the outside and not covered by the cover layer. This prevents the interior of the opening in the support plate from being in a vacuum state and prevents or protects against deformation of the lower adhesive layer and the cover layer. Therefore, it prevents or protects the pattern of the opening from being visible to the outside of the electronic device. Furthermore, even in the folded area, the arrangement of the lower adhesive layer, lower film, and cover layer ensures that the structural integrity of the electronic device is maintained. This design not only enhances the durability of the electronic device but also contributes to a seamless and pleasing appearance. By reducing or preventing deformation and minimizing the visibility of the opening, the electronic device provides a superior user experience that combines both functionality and design. Attached Figure Description

[0011] Figure 1 This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0012] Figure 2 According to one or more embodiments of this disclosure Figure 1 A perspective view of the folded state of the electronic device shown.

[0013] Figure 3 According to one or more embodiments of this disclosure Figure 1 An exploded perspective view of the electronic device shown.

[0014] Figure 4 According to one or more embodiments of this disclosure Figure 3 Block diagram of the electronic device shown.

[0015] Figure 5 According to one or more embodiments of this disclosure Figure 3 The diagram shows a cross-sectional view of the display module.

[0016] Figure 6 According to one or more embodiments of this disclosure Figure 5 The cross-sectional view of the display panel shown.

[0017] Figure 7 According to one or more embodiments of this disclosure Figure 3 The diagram shows a floor plan of the display panel.

[0018] Figure 8 It is based on one or more embodiments of this disclosure and Figure 7 The image shows a cross-sectional view of the electronic panel corresponding to one pixel.

[0019] Figure 9A It is according to one or more embodiments of this disclosure along Figure 7 A sectional view taken from line I-I'.

[0020] Figure 9B This illustrates one or more embodiments according to the present disclosure. Figure 9A A view of the curvature of the curved region.

[0021] Figure 10A According to one or more embodiments of this disclosure Figure 9A A perspective view of the support plate shown.

[0022] Figure 10B According to one or more embodiments of this disclosure Figure 10AAn enlarged plan view of the first region A1 shown.

[0023] Figure 10C According to one or more embodiments of this disclosure Figure 10A The inverted perspective view of the support plate shown.

[0024] Figure 11A and Figure 11B This illustrates one or more embodiments according to the present disclosure. Figure 9A A cross-sectional view of the folding operation of the window module, display module, and support plate.

[0025] Figure 12A This is a plan view of the lower surface of a support plate, a lower film disposed on the lower surface of the support plate, and a cover layer according to one or more embodiments of the present disclosure.

[0026] Figure 12B It is according to one or more embodiments of this disclosure along Figure 12A The sectional view taken from line II-II'.

[0027] Figure 12C This is a cross-sectional view of a support plate, a lower membrane, and a cover layer according to one or more embodiments of the present disclosure.

[0028] Figures 13A to 13C This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0029] Figure 14A and Figure 14B This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0030] Figures 15A to 15C This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0031] Figure 16A and Figure 16B This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0032] Figure 17A and Figure 17B This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0033] Figures 18A to 18C This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure. Detailed Implementation

[0034] The embodiments of this disclosure can be modified and practiced in many alternative forms, and therefore exemplary embodiments will be illustrated and described in more detail in the accompanying drawings. However, it should be understood that it is not intended to limit the disclosure to the specific forms disclosed, but rather to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure.

[0035] In this disclosure, it will be understood that if an element (or region, layer, or portion) is referred to as being "on," "connected to," or "bonded to" another element or layer (e.g., when an element (or region, layer, or portion) is referred to as being "on," "connected to," or "bonded to" another element or layer), then it can be directly on, directly connected to, or directly bonded to said other element or layer, or one or more intervening elements or layers may exist between them. Conversely, "directly on" means that there are no additional layers, films, regions, plates, or similar elements between the specified layer, film, region, plate, or similar element and another portion (i.e., "directly on" means that there are no additional layers, films, regions, plates, or similar elements between the specified layer, film, region, plate, or similar element and another portion). For example, "directly on" means arranging two layers or two components without utilizing additional components such as adhesive components between them. Additionally, if a layer, film, region, and / or plate is referred to as being "below" or "under" another part (e.g., when a layer, film, region, and / or plate is referred to as being "below" or "under" another part), then it can be "directly below" said other part, or one or more intervening layers may exist between them. Furthermore, if an element is referred to as being arranged "on" another element (e.g., when an element is referred to as being arranged "on" another element), then it can be arranged below said other element.

[0036] Throughout this disclosure, the same reference numerals refer to the same elements, and for the sake of brevity, their repeated descriptions may be omitted. In the accompanying drawings, the thickness, scale, and dimensions of components may be exaggerated for the purpose of effectively describing the technical content. As used herein, the terms "and / or" or "or" can include any and all combinations of one or more of the associated listed items.

[0037] It will be understood that while the terms “first” and / or “second” may be used herein to describe one or more suitable elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, a first element discussed herein may be referred to as a second element without departing from the teachings of this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are also intended to include the plural forms. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.”

[0038] For ease of description, spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” and / or “on top” may be used to describe the relationship between one element or feature and another element or feature as shown in the accompanying drawings.

[0039] It will also be understood that if the terms “comprising,” “including,” “having,” and / or variations thereof are used in this disclosure (e.g., when the terms “comprising,” “including,” “having,” and / or variations thereof are used in this disclosure), it indicates the presence of the stated features, quantities, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, quantities, steps, operations, elements, components, and / or groups thereof. Additionally, the terms “comprising,” “including,” “having,” or other similar terms include or support the terms “consisting of” and “substantially consisting of”, indicating the presence of the stated features, quantities, steps, operations, parts, and / or components, while other features, quantities, steps, operations, parts, components, and / or groups thereof are absent or substantially absent.

[0040] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense, unless expressly defined herein.

[0041] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0042] Figure 1 This is a perspective view of an electronic device according to one or more embodiments of the present disclosure. Figure 2 According to one or more embodiments of this disclosure Figure 1 A perspective view of the folded state of the electronic device shown.

[0043] Reference Figure 1 The electronic device ED may have a rectangular shape defined by a short side extending in a first direction DR1 and a long side extending in a second direction DR2 intersecting the first direction DR1. However, the shape of the electronic device ED should not be limited to a rectangular shape; for example, the electronic device ED may have various shapes such as a circular shape or other polygonal shapes. In one or more embodiments, the electronic device ED may be flexible.

[0044] In the following text, a direction substantially orthogonal (e.g., perpendicular) to the plane defined by the first direction DR1 and the second direction DR2 may be referred to as the third direction DR3. In this disclosure, the expression "when viewed in a plane" or "in a plan view" may refer to the state of viewing on the third direction DR3.

[0045] The electronic device ED may include a folded region FA and multiple non-folded regions NFA1 and NFA2. The non-folded regions NFA1 and NFA2 may include a first non-folded region NFA1 and a second non-folded region NFA2. The folded region FA may be arranged between the first non-folded region NFA1 and the second non-folded region NFA2. The first non-folded region NFA1, the folded region FA, and the second non-folded region NFA2 may be arranged relative to each other in a first direction DR1, for example, in the stated order.

[0046] As an example embodiment, a folded region FA and two non-folded regions NFA1 and NFA2 are shown; however, the number of folded regions FA and the number of non-folded regions NFA1 and NFA2 should not be limited thereto or thereby restricted. For example, in one or more embodiments, the electronic device ED may include more than two non-folded regions and a plurality of folded regions arranged between the non-folded regions.

[0047] The upper surface of the electronic device ED can be referred to as the display surface DS, and the display surface DS can include a plane defined by a first direction DR1 and a second direction DR2. The image IM generated by the electronic device ED can be provided to the user through the display surface DS.

[0048] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image IM, and the non-display area NDA may not display an image. The non-display area NDA may surround (e.g., encircle) the display area DA and may define an edge of the electronic device ED that may have a set color or a predetermined color.

[0049] Reference Figure 2In one or more embodiments, the electronic device ED can be a foldable electronic device ED that can be folded or unfolded. As an example, the folding region FA can be folded with curvature R1 about (e.g., along) a folding axis FX that is substantially parallel to the second direction DR2, thus allowing the electronic device ED to be folded. The folding axis FX can be defined as a major axis that is substantially parallel to the long side of the electronic device ED. In one or more embodiments, when the electronic device ED is folded, the first non-folding region NFA1 and the second non-folding region NFA2 can face each other, and the display surface DS can not be exposed to the outside (exterior of the electronic device ED), i.e., the electronic device ED can be folded inward (inward folding). However, embodiments of this disclosure are not limited to this or thus restricted. For example, in one or more embodiments, the electronic device ED can be folded outward (outward folding) about the folding axis FX, such that the display surface DS can be exposed to the outside. In one or more embodiments, the electronic device ED can be capable of both inward and outward folding.

[0050] Figure 3 According to one or more embodiments of this disclosure Figure 1 An exploded perspective view of the electronic device shown.

[0051] Reference Figure 3 The electronic device ED may include a display device DD, an electronic module EM, a power module PSM, and a housing EDC. In one or more embodiments, the electronic device ED may also include a mechanical structure (e.g., a hinge) to control the folding operation of the display device DD.

[0052] The display device DD can generate images and sense external input. The display device DD may include a window module WM and a display module DM. The window module WM provides the front surface of the electronic device ED. The window module WM can be arranged on the display module DM and can protect the display module DM. The window module WM can transmit light generated by the display module DM to provide light to the user.

[0053] The display module (DM) may include a display panel (DP). For clarity, Figure 3 Only the display panel DP among the components of the display module DM is shown; however, the display module DM may also include multiple components arranged on and below the display panel DP. The detailed stacking structure of the display module DM will be described in more detail later. The display panel DP may include display areas DA corresponding to the electronic device ED (see reference). Figure 1 ) and non-display area NDA (refer to Figure 1 The display area DA and the non-display area NDA.

[0054] The display module DM may include a data driver DDV disposed in the non-display area NDA of the display panel DP. The data driver DDV may be manufactured and disposed as an integrated circuit chip and may be mounted in the non-display area NDA; however, embodiments of this disclosure are not limited thereto. According to one or more embodiments, the data driver DDV may be mounted on a flexible circuit board connected to the display panel DP.

[0055] An electronic module (EM) and a power module (PSM) can be arranged below a display device (DD). In one or more embodiments, the electronic module (EM) and the power module (PSM) can be connected to each other via separate flexible circuit boards. The electronic module (EM) can control the operation of the display device (DD). The power module (PSM) can supply power to the electronic module (EM).

[0056] The housing EDC can accommodate the display device DD, the electronic module EM, and the power module PSM. In one or more embodiments, the housing EDC may include two housings (e.g., a first housing EDC1 and a second housing EDC2) to fold the display device DD. The first housing EDC1 and the second housing EDC2 may both extend in the second direction DR2 and may be arranged relative to each other in the first direction DR1.

[0057] In one or more embodiments, the electronic device ED may further include a hinge structure to connect the first housing EDC1 and the second housing EDC2. The housing EDC may be integrated with the window module WM. The housing EDC may protect the display device DD, the electronic module EM, and the power module PSM.

[0058] Figure 4 According to one or more embodiments of this disclosure Figure 3 Block diagram of the electronic device shown.

[0059] Reference Figure 4 The electronic device ED may include an electronic module EM, a power module PSM, and a display device DD. The electronic module EM may include a control module 10, a wireless communication module 20, an image input module 30, an audio input module 40, an audio output module 50, a memory 60, and an external interface module 70. These constituent modules may be mounted on a circuit board for electrical interconnection, or they may be electrically interconnected via a flexible circuit board. The electronic module EM may be electrically connected to the power module PSM.

[0060] The control module 10 can control the overall operation of the electronic device ED. For example, the control module 10 can activate or deactivate the display device DD in response to user input. The control module 10 can also control other modules (such as the image input module 30, the audio input module 40, and / or the audio output module 50, etc.) in response to user input. The control module 10 may include at least one microprocessor.

[0061] The wireless communication module 20 can use a Bluetooth or Wi-Fi link to send wireless signals to / receive wireless signals from other terminals. In one or more embodiments, the wireless communication module 20 can use a common communication line to send / receive voice signals. The wireless communication module 20 may include a transmitting circuit 22 that modulates the signal to be transmitted and transmits the modulated signal, and a receiving circuit 24 that demodulates the signal applied thereto.

[0062] The image input module 30 can process image signals and convert them into image data that can be displayed on the display device DD. The audio input module 40 can receive external sound signals via a microphone in recording mode or voice recognition mode and convert the external sound signals into electronic voice data. The audio output module 50 can convert sound data provided by the wireless communication module 20 or sound data stored in the memory 60 and output the converted sound data to an external device.

[0063] The external interface module 70 can be used as an interface between the control module 10 and external devices such as external chargers, wired / wireless data ports, card slots (e.g., memory cards and / or SIM / UIM cards) etc.

[0064] A power module (PSM) can supply the power expected or required for the overall operation of an electronic device (ED). In one or more embodiments, the power module (PSM) may include a battery device.

[0065] Figure 5 According to one or more embodiments of this disclosure Figure 3 The image shows a cross-sectional view of the display module.

[0066] Reference Figure 5 The display module DM may include a display panel DP, an input sensing unit ISP disposed on the display panel DP, an anti-reflective layer RPL disposed on the input sensing unit ISP, and a panel protective layer PPL disposed under the display panel DP. In one or more embodiments, the display panel DP may be a flexible display panel. For example, the display panel DP may include a flexible substrate and a plurality of elements disposed on the flexible substrate.

[0067] According to one or more embodiments of this disclosure, the display panel DP can be a light-emitting type (type) display panel; however, the embodiments of this disclosure are not particularly limited thereto. In one or more embodiments, the display panel DP can be an organic light-emitting display panel or an inorganic light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of an inorganic light-emitting display panel may include quantum dots or quantum rods. Hereinafter, organic light-emitting display panels will be described as representative examples of display panel DPs.

[0068] The input sensing unit (ISP) can include multiple sensors to sense external inputs using capacitive methods. When manufacturing the display module (DM), the input sensing unit (ISP) can be directly fabricated on the display panel (DP).

[0069] An anti-reflective layer RPL can be disposed on the input sensing unit ISP. When manufacturing the display module DM, the anti-reflective layer RPL can be formed directly on the input sensing unit ISP. The anti-reflective layer RPL can be defined as an external light reflection prevention film. The anti-reflective layer RPL can reduce the reflectivity of external light incident on the display panel DP from above (e.g., outside) of the display module DM.

[0070] In one or more embodiments, the input sensing unit ISP can be directly disposed on the display panel DP, and the anti-reflective layer RPL can be directly disposed on the input sensing unit ISP. However, the embodiments of this disclosure are not limited to this or thus restricted. For example, in one or more embodiments, the input sensing unit ISP can be attached to the display panel DP by an adhesive layer after being manufactured separately from the display panel DP, and the anti-reflective layer RPL can be attached to the input sensing unit ISP by an adhesive layer after being manufactured separately from the input sensing unit ISP.

[0071] The display panel (DP), input sensing unit (ISP), and anti-reflective layer (RPL) can be defined as an electronic panel (EP).

[0072] A panel protective layer (PPL) can be disposed below the display panel (DP). The panel protective layer (PPL) protects the lower part of the display panel (DP). In one or more embodiments, the panel protective layer (PPL) may comprise a flexible plastic material. For example, the panel protective layer (PPL) may comprise polyethylene terephthalate (PET).

[0073] Figure 6 According to one or more embodiments of this disclosure Figure 5 The cross-sectional view of the display panel shown.

[0074] Figure 6 A cross-section of the display panel DP as viewed in the second direction DR2 is shown as a representative example.

[0075] Reference Figure 6 The display panel DP may include a substrate SUB, a circuit element layer DP-CL disposed on the substrate SUB, a display element layer DP-OLED disposed on the circuit element layer DP-CL, and a thin film encapsulation layer TFE disposed on the display element layer DP-OLED.

[0076] The substrate SUB may include a display area DA and a non-display area NDA surrounding the display area DA. The substrate SUB may include a glass material or a flexible plastic material such as polyimide (PI). The display element layer DP-OLED may be disposed within the display area DA.

[0077] Multiple pixels can be arranged in a circuit element layer DP-CL and a display element layer DP-OLED. Each pixel may include a transistor arranged in the circuit element layer DP-CL and a light-emitting element arranged in the display element layer DP-OLED and connected to the transistor. (See reference...) Figure 8 A more detailed description of the pixel's structure.

[0078] A thin-film encapsulation layer (TFE) can be placed on the DP-CL circuit element layer to cover the DP-OLED display element layer. The TFE can protect the pixels from moisture, oxygen, and foreign matter.

[0079] Figure 7 According to one or more embodiments of this disclosure Figure 3 The diagram shows a floor plan of the display panel.

[0080] Reference Figure 7 The display module DM may include a display panel DP, a scan driver SDV, a data driver DDV, and a transmit driver EDV.

[0081] The display panel DP may include a first region AA1, a second region AA2, and a curved region BA between the first region AA1 and the second region AA2. The curved region BA may extend in a second direction DR2, and the first region AA1, the curved region BA, and the second region AA2 may be arranged relative to each other in the first direction DR1, for example, in the order stated.

[0082] The first region AA1 may include a display region DA and a portion of a non-display region NDA surrounding the display region DA. In one or more embodiments, the non-display region NDA may surround the display region DA (e.g., around the display region DA). The display region DA may be the region in which an image is displayed, and the non-display region NDA may be the region in which no image is displayed. The second region AA2 and the curved region BA may be the regions in which no image is displayed.

[0083] When viewed in the second direction DR2, the first region AA1 may include a first non-folded region NFA1, a second non-folded region NFA2, and a folded region FA between the first non-folded region NFA1 and the second non-folded region NFA2.

[0084] The display panel DP may include multiple pixels PX, multiple scan lines SL1 to SLm, multiple data lines DL1 to DLn, multiple emission lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a power line PL, multiple connection lines CNL, and multiple pads (or "soldering pads") PD. Each of m and n is a natural number greater than 1. Pixels PX may be arranged in the display area DA and may be connected to scan lines SL1 to SLm, data lines DL1 to DLn, and emission lines EL1 to ELm.

[0085] The scan driver SDV and transmit driver EDV can be arranged in the non-display area NDA. In one or more embodiments, the scan driver SDV and transmit driver EDV can be arranged in the non-display area NDA and can be adjacent to the opposite sides of the first area AA1 in the second direction DR2, respectively. The data driver DDV can be arranged in the second area AA2. The data driver DDV can be manufactured and disposed as an integrated circuit chip and can be mounted in the second area AA2.

[0086] Scan lines SL1 to SLm can extend in the second direction DR2 and can be connected to the scan driver SDV. Data lines DL1 to DLn can extend in the first direction DR1 and can be connected to the data driver DDV via the bend area BA. Transmit lines EL1 to ELm can extend in the second direction DR2 and can be connected to the transmit driver EDV.

[0087] The power line PL may extend along the first direction DR1 and may be arranged in the non-display area NDA. In one or more embodiments, the power line PL may be arranged between the display area DA and the transmit driver EDV; however, embodiments of this disclosure are not limited thereto or thereby restricted. For example, in one or more embodiments, the power line PL may be arranged between the display area DA and the scan driver SDV.

[0088] The power line PL can extend through the bend BA to the second region AA2. When viewed in a plane (e.g., in a plan view), the power line PL can extend to the lower end of the second region AA2. The power line PL can receive a drive voltage.

[0089] The connecting line CNL can extend along the second direction DR2 and can be arranged relative to each other along the first direction DR1. The connecting line CNL can be connected to the power line PL and the pixel PX. The driving voltage can be applied to the pixel PX via the power line PL and the connecting line CNL connected to the power line PL.

[0090] The first control line CSL1 can be connected to the scan driver SDV and can extend through the curved area BA toward the lower end of the second area AA2. The second control line CSL2 can be connected to the transmit driver EDV and can extend through the curved area BA toward the lower end of the second area AA2. The data driver DDV can be arranged between the first control line CSL1 and the second control line CSL2.

[0091] When viewed in a plane (e.g., in a plan view), the pad PD can be arranged adjacent to the lower end of the second area AA2. The data driver DDV, power line PL, first control line CSL1, and second control line CSL2 can be connected to the corresponding pad PD.

[0092] Data lines DL1 to DLn can be connected to the corresponding pads PD via data driver DDV. As an example, data lines DL1 to DLn can be connected to data driver DDV, and data driver DDV can be connected to the pads PD corresponding to data lines DL1 to DLn.

[0093] In one or more embodiments, a printed circuit board (PCB) may be connected to a pad PD, and a timing controller and a voltage generator may be disposed on the PCB. The timing controller may be manufactured and disposed as an integrated circuit chip and may be mounted on the PCB. The timing controller and the voltage generator may be connected to the pad PD via the PCB.

[0094] The timing controller can control the operation of the scan driver (SDV), data driver (DDV), and transmit driver (EDV). The timing controller can generate scan control signals, data control signals, and transmit control signals in response to control signals applied from the outside. A voltage generator can generate drive voltages.

[0095] The scan control signal can be applied to the scan driver SDV via the first control line CSL1. The transmit control signal can be applied to the transmit driver EDV via the second control line CSL2. The data control signal can be applied to the data driver DDV. The timing controller can receive image signals from the outside, convert the data format of the image signals into a data format suitable for or appropriate for the interface between the timing controller and the data driver DDV, and provide the converted image signals to the data driver DDV.

[0096] The scan driver SDV can generate multiple scan signals in response to scan control signals. These scan signals can be applied to pixels PX via scan lines SL1 to SLm. The scan signals can be applied to pixels PX sequentially.

[0097] The data driver DDV can generate multiple data voltages corresponding to the image signal in response to the data control signal. These data voltages can be applied to pixel PX via data lines DL1 to DLn. The transmit driver EDV can generate multiple transmit signals in response to the transmit control signal. These transmit signals can be applied to pixel PX via transmit lines EL1 to ELm.

[0098] Pixel PX can receive data voltage in response to a scan signal. Pixel PX can emit light with a brightness corresponding to the data voltage in response to a transmit signal, thus enabling image display. The emission time of pixel PX can be controlled or selected by the transmit signal.

[0099] Figure 8 It is based on one or more embodiments of this disclosure and Figure 7 The image shows a cross-sectional view of the electronic panel corresponding to one pixel.

[0100] Reference Figure 8 A pixel (PX) may include a transistor (TR) and a light-emitting element (OLED). The light-emitting element (OLED) may include a first electrode (or anode) (AE), a second electrode (or cathode) (CE), a hole control layer (HCL), an electron control layer (ECL), and a light-emitting layer (EML).

[0101] Transistor TRs and light-emitting elements (OLEDs) can be arranged on a substrate SUB. As an example, in... Figure 8 The image shows a transistor TR; however, a pixel PX may include multiple transistors and at least one capacitor to drive the light-emitting element OLED.

[0102] The display area DA may include a light-emitting area PA corresponding to each pixel PX and a non-light-emitting area NPA surrounding the light-emitting area PA. The light-emitting element OLED may be arranged in the light-emitting area PA.

[0103] The buffer layer (BFL) can be disposed on the substrate (SUB), and the buffer layer (BFL) can be an inorganic layer. Semiconductor patterns can be disposed on the buffer layer (BFL). The semiconductor patterns can include polycrystalline silicon, amorphous silicon, or metal oxide.

[0104] Semiconductor patterns can be doped with N-type (N-class) dopants or P-type (P-class) dopants. Semiconductor patterns can include highly doped regions and lightly doped regions. Highly doped regions can have a higher conductivity (e.g., electrical conductivity) than lightly doped regions and can essentially serve as the source and drain electrodes of a transistor TR. Lightly doped regions can essentially correspond to the active region (or channel) of the transistor TR.

[0105] The source (S), active region (A), and drain (D) of transistor TR can be formed from a semiconductor pattern. A first insulating layer (INS1) can be disposed on the semiconductor pattern. The gate (G) of transistor TR can be disposed on the first insulating layer (INS1). A second insulating layer (INS2) can be disposed on the gate (G). A third insulating layer (INS3) can be disposed on the second insulating layer (INS2).

[0106] The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2 to connect the transistor TR to the light-emitting element OLED. The first connecting electrode CNE1 may be disposed on the third insulating layer INS3 and may be connected to the drain electrode D via a first contact hole CH1 defined to pass through the first insulating layer INS1, the second insulating layer INS2 and the third insulating layer INS3.

[0107] A fourth insulating layer INS4 may be disposed on the first connecting electrode CNE1. A fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4. A second connecting electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 via a second contact hole CH2 defined to pass through the fourth insulating layer INS4 and the fifth insulating layer INS5.

[0108] The sixth insulating layer INS6 can be disposed on the second connection electrode CNE2. The layer from the buffer layer BFL to the sixth insulating layer INS6 can be defined as the circuit element layer DP-CL. Each of the first insulating layers INS1 to the sixth insulating layer INS6 can be an inorganic layer or an organic layer.

[0109] A first electrode AE ​​may be disposed on a sixth insulating layer INS6. The first electrode AE ​​may be connected to a second connection electrode CNE2 via a third contact hole CH3 defined to pass through the sixth insulating layer INS6. A pixel defining layer PDL may be disposed on the first electrode AE ​​and the sixth insulating layer INS6. An opening PX_OP may be defined to pass through the pixel defining layer PDL to expose a portion of the first electrode AE.

[0110] The hole control layer (HCL) can be disposed on the first electrode (AE) and the pixel definition layer (PDL). The hole control layer (HCL) may include a hole transport layer and a hole injection layer.

[0111] The luminescent layer (EML) can be disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the opening (PX_OP). The EML can include organic and / or inorganic materials. The EML can produce light having one of red, green, and blue colors (e.g., selected from red, green, and blue).

[0112] An electron control layer (ECL) can be disposed on the light-emitting layer (EML) and the hole control layer (HCL). The ECL may include an electron transport layer and an electron injection layer. In one or more embodiments, the hole control layer (HCL) and the ECL may both be disposed in a common location within the light-emitting region (PA) and the non-light-emitting region (NPA), for example, to cover both the light-emitting region (PA) and the non-light-emitting region (NPA).

[0113] The second electrode (CE) can be disposed on the electronic control layer (ECL). The second electrode (CE) can be disposed in a common area across the pixel (PX). The layer constituting the light-emitting element (OLED) can be called the display element layer (DP-OLED).

[0114] The thin-film encapsulation layer TFE can be disposed on the second electrode CE to cover the pixel PX. The thin-film encapsulation layer TFE may include a first encapsulation layer EN1 disposed on the second electrode CE, a second encapsulation layer EN2 disposed on the first encapsulation layer EN1, and a third encapsulation layer EN3 disposed on the second encapsulation layer EN2.

[0115] The first encapsulation layer EN1 and the third encapsulation layer EN3 may both include inorganic insulating layers and protect the pixel PX from moisture and oxygen. The second encapsulation layer EN2 may include an organic insulating layer and protect the pixel PX from foreign matter such as dust particles.

[0116] A first voltage can be applied to the first electrode AE ​​via transistor TR, and a second voltage having a voltage level lower than the first voltage can be applied to the second electrode CE. Holes and electrons injected into the light-emitting layer EML can recombine to generate excitons, and the light-emitting element OLED can emit light by excitons returning from the excited state to the ground state.

[0117] The input sensing unit (ISP) can be disposed on the thin-film encapsulation layer (TFE). Alternatively, the input sensing unit (ISP) can be directly fabricated on the upper surface of the TFE thin-film encapsulation layer.

[0118] The substrate layer BS can be disposed on the thin-film encapsulation layer TFE. The substrate layer BS may include an inorganic insulating layer. In one or more embodiments, at least one inorganic insulating layer may be disposed on the thin-film encapsulation layer TFE as the substrate layer BS.

[0119] The input sensing unit (ISP) may include a first conductive pattern CTL1 and a second conductive pattern CTL2 disposed on the first conductive pattern CTL1. The first conductive pattern CTL1 may be disposed on a substrate layer BS. An insulating layer TINS ​​may be disposed on the substrate layer BS to cover the first conductive pattern CTL1. The insulating layer TINS ​​may include an inorganic insulating layer or an organic insulating layer. The second conductive pattern CTL2 may be disposed on the insulating layer TINS.

[0120] The first conductive pattern CTL1 and the second conductive pattern CTL2 may be superimposed on the non-light-emitting region NPA. In one or more embodiments, the first conductive pattern CTL1 and the second conductive pattern CTL2 may be arranged in the non-light-emitting region NPA between the light-emitting regions PA, and both may have a grid shape.

[0121] The first conductive pattern CTL1 and the second conductive pattern CTL2 can form a sensor for the input sensing unit (ISP). For example, the first conductive pattern CTL1 and the second conductive pattern CTL2, both having a grid shape, can be separated from each other in a set area or a predetermined area to form a sensor. A portion of the second conductive pattern CTL2 can be connected to the first conductive pattern CTL1.

[0122] The anti-reflective layer RPL can be disposed on the second conductive pattern CTL2. The anti-reflective layer RPL may include a black matrix BM and multiple color filters CF. The black matrix BM may be superimposed on the non-emitting region NPA, and the color filters CF may be superimposed on the emitting region PA respectively.

[0123] The black matrix BM can be arranged on the insulating layer TINS ​​to cover the second conductive pattern CTL2. The opening B_OP can be defined to extend through the black matrix BM and overlap with the light-emitting region PA and the opening PX_OP. The black matrix BM can absorb and block light. The width of the opening B_OP can be greater than the width of the opening PX_OP.

[0124] Color filters (CFs) can be arranged on the insulating layer (TINS) and the black matrix (BM). Color filters (CFs) can also be arranged within the opening (B_OP). Planarized insulating layer (PINS) can be arranged on the color filters (CFs). Planarized insulating layer (PINS) provides a flat top surface.

[0125] When external light incident on a display panel (DP) is reflected by the DP (such as a mirror) and then delivered to the user, the user may perceive the external light. To prevent or reduce this, the anti-reflective layer (RPL) can include a color filter (CF) that displays the same color as the light emitted from the pixel (PX). The color filter (CF) can filter external light to have the same color as the light emitted from the pixel (PX). As a result, the external light may not be perceived by the user.

[0126] However, embodiments of this disclosure are not limited to or thus restricted, and the anti-reflective layer RPL may include a polarizing film to reduce the reflectivity of external light. The polarizing film may be attached to the input sensing unit ISP via an adhesive layer after being manufactured separately. The polarizing film may include a retarder and / or a polarizer.

[0127] Figure 9A It is according to one or more embodiments of this disclosure along Figure 7 A sectional view taken from line I-I'. Figure 9B This illustrates one or more embodiments according to the present disclosure. Figure 9A A view of the curvature of the curved region.

[0128] Figure 9A and Figure 9B A portion of the display unit DSP, a portion of the support plate PLT, and a portion of the window module WM are shown as representative examples.

[0129] exist Figure 9A and Figure 9B In the same figure, the same reference numerals / letters indicate Figures 1 to 8 The same components are shown, therefore, for the sake of brevity, detailed descriptions of the same components will not be provided.

[0130] Reference Figure 9A The folding region FA may include a curved region D-CSP, a first reverse curved region D-EX1, a second reverse curved region D-EX2, a first flat region D-PLA1, and a second flat region D-PLA2. The curved region D-CSP may be stacked with the folding axis FX. The first reverse curved region D-EX1 may be arranged between the curved region D-CSP and the first non-folding region NFA1. The second reverse curved region D-EX2 may be arranged between the curved region D-CSP and the second non-folding region NFA2. The first flat region D-PLA1 may be arranged between the first reverse curved region D-EX1 and the curved region D-CSP. The second flat region D-PLA2 may be arranged between the second reverse curved region D-EX2 and the curved region D-CSP. (Refer to...) Figure 11A and Figure 11B The bending region D-CSP, the first reverse bending region D-EX1, the second reverse bending region D-EX2, the first flat region D-PLA1, and the second flat region D-PLA2 are described in more detail.

[0131] The display device DD may include a printed circuit board (PCB), a display unit (DSP), a window module (WM) disposed on the display unit (DSP), a support plate (PLT) disposed below the display unit (DSP), a lower film (PIF), and a cover layer (TPU). The support plate (PLT) can support the display module DM. The window module (WM) may include a window (WIN), a window protective layer (WP), a hard coating layer (HC), a first adhesive layer (AL1), and a second adhesive layer (AL2).

[0132] The display module (DSP) may include an electronic panel (EP), an impact-absorbing layer (ISL), a panel protective layer (PPL), a barrier layer (BRL), and third adhesive layers (AL3), fourth adhesive layers (AL4), fifth adhesive layers (AL5), and sixth adhesive layers (AL6). The impact-absorbing layer (ISL), electronic panel (EP), panel protective layer (PPL), third adhesive layer (AL3), and fourth adhesive layer (AL4) can be defined as the display module (DM). (This is based on previous references.) Figure 5 The construction of the electronic panel EP and the panel protective layer PPL is described, so for the sake of brevity, the descriptions of the same components will not be repeated.

[0133] Shock-absorbing layer (ISL) can be disposed on electronic panel EP. The ISL absorbs external shocks applied to the electronic panel EP from above the display device DD and protects the electronic panel EP. The ISL can be manufactured and disposed in the form of a stretched film.

[0134] In one or more embodiments, the impact-absorbing layer ISL may comprise a flexible plastic material (e.g., a flexible polymer material). The flexible plastic material may be defined as a synthetic resin film. For example, the impact-absorbing layer ISL may comprise a flexible plastic material such as polyimide (PI) or polyethylene terephthalate (PET).

[0135] The window (WIN) can be disposed on the shock-absorbing layer (ISL). The window (WIN) can protect the electronic panel (EP) from external scratches. The window (WIN) can have optically transparent properties. In one or more embodiments, the window (WIN) may comprise a glass material; however, embodiments of this disclosure are not limited thereto or thereby. According to one or more embodiments, the window (WIN) may comprise a synthetic resin film.

[0136] The window WIN can have a single-layer or multi-layer structure. For example, in one or more embodiments, the window WIN may include a plurality of synthetic resin films or glass substrates attached to each other by an adhesive and a synthetic resin film attached to the glass substrate by an adhesive.

[0137] A window protective layer (WP) can be applied to the window (WIN). The WP can comprise flexible plastic materials such as polyimide (PI) or polyethylene terephthalate (PET). A hard coating (HC) can be applied to the WP.

[0138] The printed layer PIT can be disposed on the lower surface of the window protective layer WP. The printed layer PIT can be black; however, the color of the printed layer PIT should not be limited to black. The printed layer PIT can be disposed adjacent to the edge of the window protective layer WP.

[0139] A barrier layer (BRL) can be disposed beneath the panel protective layer (PPL). The barrier layer (BRL) increases resistance to compressive forces caused by external pressure. Therefore, the barrier layer (BRL) can prevent or reduce deformation of the electronic panel (EP). The barrier layer (BRL) can comprise flexible plastic materials (e.g., flexible polymer materials) such as polyimide or polyethylene terephthalate.

[0140] The blocking layer (BRL) can have a color that absorbs light. For example, in one or more embodiments, the blocking layer (BRL) can be black. In these embodiments, components arranged under the blocking layer (BRL) may not be visible to the user when viewed from above the display module (DM).

[0141] The first adhesive layer AL1 can be disposed between the window protective layer WP and the window WIN. The window protective layer WP can be attached to the window WIN through the first adhesive layer AL1. The first adhesive layer AL1 can cover the printed layer PIT.

[0142] The second adhesive layer AL2 can be disposed between the window WIN and the shock-absorbing layer ISL. The window WIN can be attached to the shock-absorbing layer ISL through the second adhesive layer AL2.

[0143] The third adhesive layer AL3 can be disposed between the shock absorbing layer ISL and the electronic panel EP. The shock absorbing layer ISL can be attached to the electronic panel EP through the third adhesive layer AL3.

[0144] The fourth adhesive layer AL4 can be disposed between the electronic panel EP and the panel protective layer PPL. The electronic panel EP can be attached to the panel protective layer PPL through the fourth adhesive layer AL4.

[0145] The fifth adhesive layer AL5 can be disposed between the panel protective layer PPL and the barrier layer BRL. The panel protective layer PPL can be attached to the barrier layer BRL through the fifth adhesive layer AL5.

[0146] The sixth adhesive layer AL6 can be disposed between the barrier layer BRL and the support plate PLT. The support plate PLT can be disposed below the barrier layer BRL, and the sixth adhesive layer AL6 can be disposed between the barrier layer BRL and the support plate PLT. The sixth adhesive layer AL6 can be stacked with the first non-folded region NFA1, the second non-folded region NFA2, and the folded region FA. In the following text, the sixth adhesive layer AL6 can be referred to as the lower adhesive layer AL6.

[0147] If the sixth adhesive layer AL6 is not overlapped with the folded region FA (e.g., when the sixth adhesive layer AL6 is not overlapped with the folded region FA), the strength of the folded region FA may be reduced. Therefore, the impact resistance of the folded region FA may be reduced.

[0148] However, when the sixth adhesive layer AL6 is superimposed on the folded region FA, the strength of the folded region FA can be increased. Therefore, the impact resistance of the folded region FA can be increased. The barrier layer BRL can be attached to the support plate PLT through the sixth adhesive layer AL6. The sixth adhesive layer AL6 can be referred to as the lower adhesive layer AL6.

[0149] The first adhesive layer AL1 to the sixth adhesive layer AL6 may each independently include a pressure-sensitive adhesive (PSA) or a transparent adhesive such as an optically clear adhesive (OCA); however, the type (variety) of adhesives should not be particularly limited.

[0150] The panel protective layer PPL can have a thickness smaller than that of the window protective layer WP, and the barrier layer BRL can have a thickness smaller than that of the panel protective layer PPL. The electronic panel EP can have a thickness smaller than that of the barrier layer BRL and substantially equal to that of the window WIN. The shock absorbing layer ISL can have a thickness smaller than that of the electronic panel EP.

[0151] The first adhesive layer AL1 may have a thickness substantially equal to that of the barrier layer BRL, and each of the second adhesive layer AL2 and the third adhesive layer AL3 may have a thickness substantially equal to that of the panel protective layer PPL. The fourth adhesive layer AL4 may have a thickness substantially equal to that of the fifth adhesive layer AL5.

[0152] The thickness of each of the fourth adhesive layer AL4 and the fifth adhesive layer AL5 can be less than the thickness of the electronic panel EP, but greater than the thickness of the shock absorbing layer ISL. The sixth adhesive layer AL6 can have a thickness smaller than that of the shock absorbing layer ISL. The hard coating HC can have a thickness smaller than that of the sixth adhesive layer AL6.

[0153] The electronic panel EP, shock-absorbing layer ISL, panel protective layer PPL, and third adhesive layer AL3 and fourth adhesive layer AL4 can have the same width. The window protective layer WP and first adhesive layer AL1 can have the same width. The barrier layer BRL and fifth adhesive layer AL5 and sixth adhesive layer AL6 can have the same width.

[0154] The widths of the electronic panel EP, the shock-absorbing layer ISL, the panel protective layer PPL, and the third adhesive layer AL3 and the fourth adhesive layer AL4 can be greater than the widths of the window protective layer WP and the first adhesive layer AL1. The edges of the electronic panel EP, the shock-absorbing layer ISL, the panel protective layer PPL, and the third adhesive layer AL3 and the fourth adhesive layer AL4 can all be arranged outside the edges of the window protective layer WP and the first adhesive layer AL1.

[0155] The width of the window WIN and the second adhesive layer AL2 can be smaller than the width of the window protective layer WP and the first adhesive layer AL1. The width of the second adhesive layer AL2 can be smaller than the width of the window WIN. The edge of the window WIN can be arranged inside the edges of the window protective layer WP and the first adhesive layer AL1. The edge of the second adhesive layer AL2 can be arranged inside the edge of the window WIN.

[0156] The widths of the barrier layer BRL, the fifth adhesive layer AL5, and the sixth adhesive layer AL6 can be smaller than the widths of the window protective layer WP and the first adhesive layer AL1. The edges of the barrier layer BRL, the fifth adhesive layer AL5, and the sixth adhesive layer AL6 can be arranged inside the edges of the window protective layer WP and the first adhesive layer AL1.

[0157] The support plate PLT can be arranged below the display unit DSP and can support the display unit DSP. The support plate PLT can also be arranged below the electronic panel EP and can support the electronic panel EP. The width of the support plate PLT can be substantially the same as the width of the electronic panel EP. The support plate PLT can have higher strength than the display unit DSP.

[0158] The support plate PLT may comprise a non-metallic material. For example, in one or more embodiments, the support plate PLT may comprise a fiber-reinforced composite material. The fiber-reinforced composite material may comprise carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP).

[0159] Because the support plate PLT comprises fiber-reinforced composite material, it can be lightweight. Since the support plate PLT comprises fiber-reinforced composite material, it can have a lighter weight compared to a metal support plate that comprises metallic materials, while maintaining similar modulus and strength.

[0160] Furthermore, because the support plate PLT comprises fiber-reinforced composite material, the shaping process for the support plate PLT can be more easily performed compared to a metal support plate. For example, a support plate PLT comprising fiber-reinforced composite material can be easily processed using laser processing or micro-blasting processes. However, the embodiments of this disclosure are not limited thereto, and according to one or more embodiments, the support plate PLT may comprise a metallic material.

[0161] The support plate PLT may include a first non-folding portion PLT1, a folding portion PLF, and a second non-folding portion PLT2. The first non-folding portion PLT1 may be stacked with a first non-folding region NFA1. The folding portion PLF may be stacked with a folding region FA. The second non-folding portion PLT2 may be stacked with a second non-folding region NFA2.

[0162] The folded portion PLF may include a curved portion CSP, a first reverse curved portion EX1, a second reverse curved portion EX2, a first flat portion PLA1, and a second flat portion PLA2. The curved portion CSP may be stacked with the curved region D-CSP.

[0163] Multiple openings (OPs) can be defined to pass through the bend CSP. The openings (OPs) can be formed as portions passing through the bend CSP in a third direction DR3. When viewed in a second direction DR2, the openings (OPs) can be arranged to be spaced apart and / or separated from each other in the first direction DR1 (e.g., separated or separated). The openings (OPs) can be formed by laser processing or microblasting.

[0164] Since the opening OP is defined to pass through the curved portion CSP overlapping the curved region D-CSP, the flexibility of the curved portion CSP can be increased. As a result, the support plate PLT can be folded relative to the folding region FA.

[0165] The first reverse bending portion EX1 can be stacked with the first reverse bending region D-EX1. The first reverse bending portion EX1 can be arranged between the bending portion CSP and the first non-folded portion PLT1. The second reverse bending portion EX2 can be stacked with the second reverse bending region D-EX2. The second reverse bending portion EX2 can be arranged between the bending portion CSP and the second non-folded portion PLT2.

[0166] The reverse bending groove CGR can be defined in the lower surface of the first reverse bending portion EX1 and the lower surface of the second reverse bending portion EX2. The reverse bending grooves CGR can be spaced apart and / or separated from each other in the first direction DR1 (e.g., separated or separated). The reverse bending groove CGR can extend from the lower surface PLT-L of the support plate PLT toward the upper surface PLT-U of the support plate PLT. For example, in one or more embodiments, the reverse bending groove CGR can extend to a position corresponding to approximately half the thickness of the support plate PLT. (Refer to...) Figure 10C and Figure 11A The first reverse bending portion EX1 and the second reverse bending portion EX2 are described in more detail.

[0167] The first flat portion PLA1 can be stacked with the first flat region D-PLA1. The first flat portion PLA1 can be arranged between the first reverse bending portion EX1 and the bending portion CSP. The second flat portion PLA2 can be stacked with the second flat region D-PLA2. The second flat portion PLA2 can be arranged between the second reverse bending portion EX2 and the bending portion CSP. (Refer to...) Figure 10C and Figure 11A The first flat portion PLA1 and the second flat portion PLA2 are described in more detail.

[0168] The lower film PIF can be disposed on the lower surface PLT-L of the support plate PLT. The lower film PIF can be stacked with the folded portion PLF. The lower film PIF can be stacked with the curved portion CSP. An adhesive layer may not be disposed between the lower film PIF and the support plate PLT. The lower film PIF may not be attached to the lower surface PLT-L of the support plate PLT. The lower film PIF may cover some of the openings OP. In one or more embodiments, the lower film PIF may have a width smaller than the width of the curved portion CSP. However, embodiments of this disclosure are not limited to this or thus, for example, in one or more embodiments, the width of the lower film PIF may be greater than or equal to the width of the curved portion CSP.

[0169] The lower membrane PIF may include polyimide (PI); however, the materials used for the lower membrane PIF should not be limited to or restricted by this.

[0170] Multiple membrane openings (FOPs) can be defined to penetrate the lower membrane PIF. The membrane openings (FOPs) can be spaced apart and / or separated from each other in the first direction DR1 (e.g., separated or separated). When viewed in the second direction DR2, the membrane openings (FOPs) can be formed to penetrate the lower membrane PIF in the third direction DR3.

[0171] The cover TPU can be disposed beneath the support plate PLT. When viewed in the second direction DR2, the opposing sides (e.g., the two opposing ends) of the cover TPU in the first direction DR1 can be disposed on the lower surfaces of the first flat portion PLA1 and the second flat portion PLA2. In one or more embodiments, an adhesive layer adjacent to the opposing sides (e.g., the opposing ends) of the cover TPU can be disposed between the upper surface of the cover TPU and the lower surface PLT-L of the support plate PLT. A portion of the cover TPU can be secured to the lower surfaces of the first flat portion PLA1 and the second flat portion PLA2 by the adhesive layer.

[0172] The TPU cover layer can cover the lower PIF film. In one or more embodiments, an adhesive layer can be disposed between the TPU cover layer and the lower PIF film.

[0173] Multiple cap openings COPs can be defined to penetrate the cover layer TPU. When viewed in the second direction DR2, the cap openings COPs can be formed to penetrate the cover layer TPU in the third direction DR3. When viewed in the second direction DR2, the cap openings COPs can be spaced apart and / or separated from each other in the first direction DR1 (e.g., separated or separated).

[0174] The cap opening (COP) and membrane opening (FOP) can be continuously defined along the third direction DR3. Air from the outside of the support plate PLT can be introduced into the membrane opening (FOP) and cap opening (COP). Because the lower membrane PIF is not attached to the lower surface PLT-L of the support plate PLT, air from the outside can be introduced into the opening (OP) through the membrane opening (FOP) and cap opening (COP). Therefore, it can prevent or reduce the conversion of the interior of the opening (OP) to a vacuum state. This will be described in more detail later.

[0175] In one or more embodiments, the display device DD may further include a digital converter, a shielding layer, and a heat dissipation layer that can be disposed below the support plate PLT.

[0176] Reference Figure 9B In one or more embodiments, the panel protective layer PPL and the fourth adhesive layer AL4 may not be disposed under the curved region BA. The panel protective layer PPL and the fourth adhesive layer AL4 may be disposed in the second region AA2 under the electronic panel EP. The data driver DDV may be disposed in the second region AA2 under the electronic panel EP.

[0177] The printed circuit board (PCB) can be connected to the electronic panel (EP) in the second region AA2. The PCB can be connected to one side of the second region AA2. The bending region BA can be bent, and the second region AA2 can be arranged below the first region AA1. Therefore, the data driver DDV and the PCB can be arranged below the first region AA1.

[0178] Figure 10A According to one or more embodiments of this disclosure Figure 9A A perspective view of the support plate shown. Figure 10B According to one or more embodiments of this disclosure Figure 10A An enlarged plan view of the first region A1 shown. Figure 10C It is Figure 10A The inverted perspective view of the support plate shown.

[0179] exist Figures 10A to 10C In the same figure, the same reference numerals / letters indicate Figures 1 to 8 , Figure 9A and Figure 9B Since these are the same components, detailed descriptions of the same components will not be provided for the sake of brevity.

[0180] Reference Figure 10A and Figure 10B The support plate PLT may include a first non-folding portion PLT1, a folding portion PLF, and a second non-folding portion PLT2. The first non-folding portion PLT1 and the second non-folding portion PLT2 may be parallel to the plane defined by the first direction DR1 and the second direction DR2.

[0181] A folded portion PLF can be arranged between a first non-folded portion PLT1 and a second non-folded portion PLT2. A grid pattern can be defined within the folded portion PLF. For example, an opening OP can be defined to pass through the folded portion PLF. The openings OP can be arranged relative to each other according to a specific rule. In one or more embodiments, the openings OP can be arranged in a grid shape, thus forming a grid pattern within the folded portion PLF.

[0182] The openings OP can be arranged relative to each other in the first direction DR1 and the second direction DR2. In one or more embodiments, when viewed in a plane (e.g., in a plan view), the openings OP that are adjacent to each other in the first direction DR1 can be arranged in an alternating manner.

[0183] The opening OP can extend longer in the second direction DR2 than in the first direction DR1. For example, the opening OP can extend in a direction substantially parallel to the folding axis FX.

[0184] The folded portion PLF may include multiple branches BR and multiple support members SSP. Support members SSP may be arranged between adjacent openings OP along a first direction DR1. Branches BR may be arranged between adjacent openings OP along a second direction DR2. Support members SSP may extend in the second direction DR2, and branches BR may extend in the first direction DR1. Branches BR may connect to adjacent support members SSP in the first direction DR1. Openings OP may be defined by support members SSP and branches BR.

[0185] Reference Figure 10C The folded portion PLF may include a curved portion CSP, a first reverse curved portion EX1, a second reverse curved portion EX2, a first flat portion PLA1, and a second flat portion PLA2. The curved portion CSP may correspond to the area through which the opening OP is defined.

[0186] The first reverse bending portion EX1 can be arranged between the first non-folded portion PLT1 and the bending portion CSP. The second reverse bending portion EX2 can be arranged between the second non-folded portion PLT2 and the bending portion CSP.

[0187] The reverse bending groove CGR can be defined in the lower surface of the first reverse bending portion EX1 and the lower surface of the second reverse bending portion EX2. The reverse bending groove CGR can be arranged relative to each other in the first direction DR1 and can extend in the second direction DR2. Because the reverse bending groove CGR is defined, if the folding portion PLF is folded (e.g., when the folding portion PLF is folded), the first reverse bending portion EX1 and the second reverse bending portion EX2 can be easily bent. (Refer to...) Figure 11A and Figure 11B A more detailed description of the reverse bending groove CGR.

[0188] The first flat portion PLA1 may be arranged between the first reverse curved portion EX1 and the curved portion CSP. When viewed in a plane (e.g., in a plan view), the first flat portion PLA1 may have a quadrilateral shape parallel to the plane defined by the short side extending in the first direction DR1 and the long side extending in the second direction DR2; however, embodiments of the present disclosure are not limited to this or thus restricted.

[0189] The second flat portion PLA2 may be arranged between the second reverse curved portion EX2 and the curved portion CSP. When viewed in a plane (e.g., in a plan view), the second flat portion PLA2 may have a quadrilateral shape parallel to the plane defined by the short side extending in the first direction DR1 and the long side extending in the second direction DR2; however, embodiments of the present disclosure are not limited to this or thus restricted.

[0190] The second flat portion PLA2 may be arranged between the second reverse curved portion EX2 and the curved portion CSP. When viewed in a plane (e.g., in a plan view), the second flat portion PLA2 may be parallel to the plane defined by the short side extending in the first direction DR1 and the long side extending in the second direction DR2; however, embodiments of this disclosure are not limited thereto or thereby restricted.

[0191] Figure 11A and Figure 11B This illustrates one or more embodiments according to the present disclosure. Figure 9A A cross-sectional view of the folding operation of the window module, display module, and support plate.

[0192] As an example, Figure 11A and Figure 11B This is a cross-sectional view viewed from the second direction, DR2.

[0193] For ease of explanation, Figure 11A and Figure 11B In the diagram, each of the window module WM and the display module DM is schematically shown as a single layer, and details are omitted. Figure 9A The fifth adhesive layer AL5, the barrier layer BRL, and the sixth adhesive layer AL6.

[0194] exist Figure 11A and Figure 11B In the figures, the same reference numerals / letters indicate references. Figures 1 to 8 , Figure 9A , Figure 9B and Figures 10A to 10C The same components are described, therefore, for the sake of brevity, detailed descriptions of the same components will not be provided.

[0195] Reference Figure 10A , Figure 10C , Figure 11A and Figure 11B If the folding region FA is folded about the folding axis FX (e.g., when the folding region FA is folded about the folding axis FX), then the support plate PLT, display module DM, and window module WM can be folded. The folding region FA can be bent, therefore, the support plate PLT, display module DM, and window module WM can be folded. The first non-folding region NFA1 and the second non-folding region NFA2 can rotate about the folding axis FX and can face each other. The folding region FA can be bent in a curved shape when folded. In one or more embodiments, when the folding region FA is bent in a curved shape, the display module DM, support plate PLT, and window module WM can be partially bent in a curved shape.

[0196] When the folding region FA is bent in a curved shape, the portion of the folding region FA that overlaps with the folding axis FX can have curvature. If the display device DD is folded (e.g., when the display device DD is folded), the curved region D-CSP can be bent to have curvature. Since the opening OP is defined to pass through the curved portion CSP, the curved portion CSP can be easily bent.

[0197] The first reverse bending region D-EX1 and the second reverse bending region D-EX2 can be bent. The first reverse bending region D-EX1 can be bent from the first unfolded region NFA1 and can extend to the first flat region D-PLA1 and the bent region D-CSP. The second reverse bending region D-EX2 can be bent from the second unfolded region NFA2 and can extend to the second flat region D-PLA2 and the bent region D-CSP. Both the first reverse bending region D-EX1 and the second reverse bending region D-EX2 can be bent in the opposite direction to the bending direction of the bent region D-CSP.

[0198] Since both the first reverse bending region D-EX1 and the second reverse bending region D-EX2 bend in the opposite direction to the bending direction of the bending region D-CSP, the first reverse bending portion EX1 and the second reverse bending portion EX2, which are superimposed on the first reverse bending region D-EX1 and the second reverse bending region D-EX2 respectively, can be bent in the opposite direction to the bending direction of the bending portion CSP. Since the reverse bending groove CGR is confined within the lower surfaces of the first reverse bending portion EX1 and the second reverse bending portion EX2, the first reverse bending portion EX1 and the second reverse bending portion EX2, which are superimposed on the first reverse bending region D-EX1 and the second reverse bending region D-EX2 respectively, can be easily bent.

[0199] Figure 12A This is a plan view of the lower surface of a support plate, a lower film disposed on the lower surface of the support plate, and a cover layer according to one or more embodiments of the present disclosure. Figure 12B It is along Figure 12A The sectional view taken from line II-II'. Figure 12C This is a cross-sectional view of a support plate, a lower membrane, and a cover layer according to one or more embodiments of the present disclosure.

[0200] For example, Figure 12C It is according to one or more embodiments along Figure 12A The sectional view taken from line II-II'.

[0201] Lower membrane PIF in Figure 12A The middle part is represented by a dashed line. For example, the lower membrane PIF in... Figure 12A The shape in the middle is represented by a shaded shape.

[0202] exist Figures 12A to 12C In this drawing, the same reference numerals / letters indicate the same elements described with reference to the above drawings; therefore, for the sake of brevity, detailed descriptions of the same elements will not be provided.

[0203] Reference Figure 12A and Figure 12B The lower membrane PIF may have a rectangular shape defined by a short side extending in a first direction DR1 and a long side extending in a second direction DR2 intersecting the first direction DR1. However, the shape of the lower membrane PIF should not be limited to a rectangular shape.

[0204] The lower film PIF can be disposed on the lower surface of the curved portion CSP. The adhesive layer may not be disposed between the lower film PIF and the curved portion CSP. The lower film PIF may not be attached to the lower surface of the curved portion CSP.

[0205] In one or more embodiments, if viewed in a plane (e.g., in a plan view), the width of the lower membrane PIF in the first direction DR1 may be smaller than the width of the curved portion CSP in the first direction DR1. When viewed in a plane, the lower membrane PIF may cover some of the openings OP. Among the openings OP, the openings OP adjacent to the first flat portion PLA1 and the second flat portion PLA2 may not overlap with the lower membrane PIF.

[0206] However, the embodiments disclosed herein are not limited thereto or thereby restricted, such as Figure 12C As shown, the width of the lower membrane PIFa in the first direction DR1 can be substantially the same as the width of the curved portion CSP in the first direction DR1.

[0207] The membrane opening FOP can be defined as extending through the lower membrane PIF. When viewed in a plane (e.g., in a planar view), in Figure 12A In the diagram, membrane openings FOPs arranged in the h-th column from the left can be defined as adjacent to the left edge of the lower membrane PIF near the second unfolded portion PLT2. Membrane openings FOPs arranged in the (h+1)-th column can be defined as adjacent to the right edge of the lower membrane PIF near the first unfolded portion PLT1. "h" is a positive integer. Columns can correspond to (e.g., parallel to) the second direction DR2.

[0208] The membrane openings FOPs arranged relative to each other in column h may be spaced apart and / or separated from each other in the second direction DR2 (e.g., separated or separated). The membrane openings FOPs arranged relative to each other in column h+1 may be spaced apart and / or separated from each other in the second direction DR2 (e.g., separated or separated). The membrane openings FOPs arranged relative to each other in column h may be spaced apart and / or separated from the membrane openings FOPs arranged relative to each other in column h+1 in the first direction DR1 (e.g., separated or separated).

[0209] The cover layer TPU can be disposed on the lower surface of the folded portion PLF. The cover layer TPU can be stacked with the curved portion CSP, the first flat portion PLA1, and the second flat portion PLA2. The cover layer TPU can be disposed on the lower surface of the first flat portion PLA1 and the second flat portion PLA2.

[0210] The TPU cover layer can cover the lower film PIF. In one or more embodiments, an adhesive layer can be disposed between the TPU cover layer and the lower film PIF. The TPU cover layer can be attached to the lower film PIF via the adhesive layer. The lower film PIF can be disposed on the lower surface of the curved portion CSP via the TPU cover layer.

[0211] The cap opening COP can be defined to extend through the cover layer TPU. The arrangement of the cap opening COPs can correspond to the arrangement of the membrane opening FOPs. Each of the cap opening COPs can be stacked with a corresponding membrane opening FOP. The cap opening COPs and membrane opening FOPs can be continuously defined along the third direction DR3.

[0212] Reference Figure 9A and Figure 12B If the display module DM, the barrier layer BRL, and the support plate PLT are bonded to each other (e.g., when the display module DM, barrier layer BRL, and support plate PLT are bonded to each other), the process may be performed under vacuum. If the cover layer TPU is disposed directly on the lower surface of the curved portion CSP, the sixth adhesive layer AL6 may cover the opening OP from the top. The cover layer TPU may cover the opening OP from the bottom. As a result, the interior of the opening OP may be evacuated. When the bonding process is completed, the display module DM, barrier layer BRL, and support plate PLT may be under atmospheric pressure.

[0213] In this situation, portions of the sixth adhesive layer AL6 disposed on the upper surface of the support plate PLT and portions of the cover layer TPU disposed on the lower surface of the support plate PLT may be drawn into the opening OP due to atmospheric pressure. As a result, the cover layer TPU and the sixth adhesive layer AL6 may deform to correspond to the pattern of the opening OP. Therefore, the pattern of the opening OP may become visible to the user from the outside of the display device DD.

[0214] However, according to this disclosure, the lower film PIF can be disposed between the cover layer TPU and the curved portion CSP. Because the lower film PIF is not attached to the lower surface of the curved portion CSP, a gap can exist between the lower film PIF and the curved portion CSP. Therefore, air from the outside of the display device DD can flow into the opening OP through the cover opening COP and the film opening FOP, and the interior of the opening OP can be filled with air at the same pressure as atmospheric pressure. Therefore, deformation of the cover layer TPU and the sixth adhesive layer AL6 can be prevented or reduced, and as a result, the pattern of the opening OP can be prevented from becoming visible to the user from the outside of the display device DD.

[0215] Figures 13A to 13C This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0216] For example, Figure 13A This is a plan view showing the lower surface of a support plate PLT according to one or more embodiments. Figure 13B It is shown that along one or more embodiments Figure 13A A cross-sectional view of the support plate PLT, the lower membrane PIFb, and the cover layer TPU, taken from line III-III'. Figure 13C It is shown that according to one or more embodiments Figure 13B The cross-sectional view of the folded state of the support plate PLT, the lower film PIFb, and the cover layer TPU shown.

[0217] Lower membrane PIFb in Figure 13A The area is represented by a dotted / dashed line. For example, the lower membrane PIFb... Figure 13A The shape in the middle is represented by a shaded shape.

[0218] exist Figures 13A to 13C In this drawing, the same reference numerals / letters indicate the same elements described with reference to the above drawings; therefore, for the sake of brevity, detailed descriptions of the same elements will not be provided.

[0219] Reference Figure 13A and Figure 13B If viewed in a plane (e.g., in a planar view), the lower membrane PIFb can have a rectangular frame shape. The groove GR can be defined between membrane openings FOPs arranged relative to each other in column h and membrane openings FOPs arranged relative to each other in column h+1. The groove GR can have a quadrilateral shape.

[0220] When viewed in a plane (in a planar view), some of the openings OP can overlap with the grooves GR. Some of the openings OP can be exposed to the outside through the grooves GR without being covered by the lower membrane PIFb.

[0221] The TPU capping layer can cover the underlying PIFb film. The TPU capping layer can cover the groove GR. The TPU capping layer can be stacked with the groove GR.

[0222] Reference Figure 13B and Figure 13C The support plate PLT can be folded about the folding axis FX. The lower film PIFb and the cover layer TPU arranged on the lower surface of the support plate PLT can be folded about the folding axis FX. The groove GR can be stacked with the folding axis FX.

[0223] When the cover TPU is folded, the portion of the cover TPU that overlaps with the groove GR can be arranged in the groove GR. A portion of the cover TPU that overlaps with the folding axis FX can also be arranged in the groove GR. The height of the lower surface of the cover TPU can be increased, and the lower surface of the cover TPU is opposite to the upper surface of the cover TPU that is opposite to the lower surface of the support plate PLT (e.g., facing the lower surface of the support plate PLT).

[0224] Therefore, if the support plate PLT is folded (e.g., when the support plate PLT is folded), the space occupied by the cover layer TPU can be reduced. Therefore, if the display device DD (refer to...) Figure 3) housed in the housing EDC (refer to Figure 3 And is folded (e.g., when the display device DD (refer to) Figure 3 ) housed in the housing EDC (refer to Figure 3 (When it is folded), then the cover layer TPU and the electronic module EM (refer to) Figure 3 They can operate independently of each other, including the TPU overlay and the PSM power module (see reference). Figure 3 They can operate without interfering with each other, thus improving electronic devices (ED) (see reference). Figure 3 ) folding reliability.

[0225] Figure 14A and Figure 14B This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0226] Figure 14A This is a plan view showing the lower surface of a support plate PLT according to one or more embodiments. Figure 14B It is shown that along one or more embodiments Figure 14A A cross-sectional view of the support plate PLT, the lower membrane PIFc, and the cover layer TPUa, taken from line IV-IV'.

[0227] Lower membrane PIFc in Figure 14A The middle part is represented by a dashed line. For example, the lower membrane PIFc in... Figure 14A The shape in the middle is represented by a shaded shape.

[0228] exist Figure 14A and Figure 14B In this drawing, the same reference numerals / letters indicate the same elements described with reference to the above drawings; therefore, for the sake of brevity, detailed descriptions of the same elements will not be provided.

[0229] Reference Figure 14A and Figure 14B In one or more embodiments, the opposing sides (e.g., opposite ends) of the lower membrane PIFc in the second direction DR2 can be exposed to the outside without being covered by the covering layer TPUa. When the opposing sides of the lower membrane PIFc are exposed to the outside without being covered by the covering layer TPUa, the membrane opening (refer to...) Figure 12A FOP) and cap opening (see Figure 12A The COP (Coherence to Proof) may not be limited to extending through the lower membrane PIFc and the cover layer TPUa. For example, when the opposite ends of the lower membrane PIFc are exposed to the outside and not covered by the cover layer TPUa, membrane openings may not be required for the lower membrane PIFc and the cover layer TPUa (see [reference]). Figure 12A FOP) and cap opening (see Figure 12A (COP).

[0230] The lower membrane PIFc may include multiple strips SB. When viewed in a plane (e.g., in a planar view), the strips SB may extend in a second direction DR2 and may be arranged relative to each other in a first direction DR1. Strips SB that are adjacent to each other in the first direction DR1 may be spaced apart and / or separated (e.g., separated or separated) by a selected distance. As an example, Figure 14A and Figure 14B Five SBs are shown; however, the number of SBs should not be limited to this.

[0231] The adhesive layer may not be placed between the strip SB and the bend CSP. The adhesive layer may be placed between the strip SB and the cover layer TPUa. Because the strip SB is not attached to the lower surface of the bend CSP, a gap may exist between the strip SB and the bend CSP.

[0232] When the opposing sides (e.g., opposing ends) of strips SB in the second direction DR2 are exposed to the outside, air can flow into the space between the cover layer TPUa and strips SB. Air can flow into the opening OP through the bend CSP and strips SB. As a result, a vacuum can be prevented inside the opening OP, and the cover layer TPUa and the sixth adhesive layer AL6 (refer to...) can be prevented from being evacuated. Figure 9A This deformation prevents the pattern of the opening OP from being visible to the user from the outside of the display device DD.

[0233] Figures 15A to 15C This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0234] Figure 15A This is a plan view showing the lower surface of a support plate PLT according to one or more embodiments. Figure 15B It is shown that along one or more embodiments Figure 15A A cross-sectional view of the support plate PLT, the lower membrane PIFd, and the cover layer TPUa, taken along line V-V'. Figure 15C It is shown that according to one or more embodiments Figure 15B The cross-sectional view of the folded state of the support plate PLT, the lower membrane PIFd, and the cover layer TPUa shown.

[0235] Lower membrane PIFd Figure 15A The region is represented by a dotted / dashed line. For example, the lower membrane PIFd in... Figure 15A The shape in the middle is represented by a shaded shape.

[0236] exist Figures 15A to 15C In this drawing, the same reference numerals / letters indicate the same elements described with reference to the above drawings; therefore, for the sake of brevity, detailed descriptions of the same elements will not be provided.

[0237] Reference Figures 15A to 15C The opposing sides (e.g., opposite ends) of the lower membrane PIFd in the second direction DR2 can be exposed to the outside without being covered by the covering layer TPUa. As a result, air can flow into the space between the covering layer TPUa and the lower membrane PIFd. Because the lower membrane PIFd is not attached to the lower surface of the bend CSP, a gap can exist between the lower membrane PIFd and the bend CSP. Air can flow into the opening OP through the gap between the bend CSP and the lower membrane PIFd.

[0238] Multiple slits SLT can be defined in the lower membrane PIFd. The slits SLT can be defined in the lower surface of the lower membrane PIFd, which is opposite to the upper surface of the lower membrane PIFd that is opposite to the lower surface of the curved portion CSP (e.g., facing the lower surface of the curved portion CSP).

[0239] When viewed in a plane (e.g., in a planar view), the slits SLT can be arranged relative to each other in a first direction DR1 and can extend in a second direction DR2. When viewed in the second direction DR2, the slits SLT can extend from the lower surface of the lower membrane PIFd in a third direction DR3. The slits SLT can be cut in half to a depth corresponding to approximately half the thickness of the lower membrane PIFd.

[0240] Reference Figure 15B and Figure 15C If the support plate PLT is folded about the folding axis FX (e.g., when the support plate PLT is folded about the folding axis FX), the lower film PIFd and the cover layer TPUa arranged on the lower surface of the support plate PLT can be folded.

[0241] When the lower membrane PIFd is folded, the width of the slit SLT in the lower membrane PIFd can be increased. The width of the slit SLT when the lower membrane PIFd is in the folded state can be greater than the width of the slit SLT when the lower membrane PIFd is in the unfolded state. Due to the slit SLT confined within the lower membrane PIFd, the lower membrane PIFd can be easily folded.

[0242] Figure 16A and Figure 16B This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0243] Figure 16A This is a plan view showing the lower surface of a support plate PLT according to one or more embodiments. Figure 16B It is shown that along one or more embodiments Figure 16A The cross-sectional view of the support plate PLT, the lower film PIF, and the cover layer TPUb, taken by line VI-VI' shown.

[0244] For example, the edge of the lower membrane PIF is at Figure 16A The area surrounded by dots / dashed lines is represented in the middle, and the lower membrane PIF is in Figure 16A The shape in the middle is represented by a shaded shape.

[0245] exist Figure 16A and Figure 16B In this drawing, the same reference numerals / letters indicate the same elements described with reference to the above drawings; therefore, for the sake of brevity, detailed descriptions of the same elements will not be provided.

[0246] Reference Figure 16A and Figure 16B When viewed in a plane (e.g., in a planar view), the cover layer TPUb can have a rectangular frame shape. The cover layer TPUb can be stacked with the edge of the underlying film PIF.

[0247] The cap opening COPa, defined to pass through the cover layer TPUb, can have a shape corresponding to a portion of a quadrilateral shape. The cap opening COPa can be stacked with the lower film PIF. A portion of the lower film PIF can be exposed through the cap opening COPa without being covered by the cover layer TPUb.

[0248] The cap opening (COPa) can be stacked with the membrane opening (FOP). Both the cap opening (COPa) and the membrane opening (FOP) can be continuously defined along the third direction DR3. When viewed in a plane (e.g., in a plan view), the cap opening (COPa) can have a larger dimension than the membrane opening (FOP). The membrane opening (FOP) can be exposed to the outside through the cap opening (COPa) without being covered by the covering layer (TPUb). The membrane opening (FOP) can also be not stacked with the covering layer (TPUb).

[0249] Air from the outside of the support plate PLT can flow into the opening OP through the cover opening COPa and the membrane opening FOP. Therefore, the inside of the opening OP does not need to be in a vacuum state.

[0250] Figure 17A and Figure 17B This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0251] Figure 17A This is a plan view showing the lower surface of a support plate PLT according to one or more embodiments. Figure 17B It is shown that along one or more embodiments Figure 17A A cross-sectional view of the support plate PLT, the lower membrane PIFe, and the cover layer TPUc, taken from line VII-VII'.

[0252] exist Figure 17A and Figure 17BIn this drawing, the same reference numerals / letters indicate the same elements described with reference to the above drawings; therefore, for the sake of brevity, detailed descriptions of the same elements will not be provided.

[0253] Reference Figure 17A The lower membrane PIFe can extend along the second direction DR2 to opposite sides (e.g., opposite ends) of the curved portion CSP that are opposite each other along the second direction DR2. When viewed in a plane (e.g., in a plan view), the lower membrane PIFe can have a quadrilateral shape. The lower membrane PIFe can overlap with the edges of the curved portion CSP that are opposite each other along the second direction DR2.

[0254] The cover layer TPUc can be disposed on the lower membrane PIFe. The cover layer TPUc can include multiple sub-cover layers TPU1 and TPU2. The sub-cover layers TPU1 and TPU2 can extend in a second direction DR2. The sub-cover layers TPU1 and TPU2 can be spaced apart and / or separated from each other in a first direction DR1 (e.g., separated or separated).

[0255] Sub-covering layer TPU1, which is superimposed on the right edge of the lower membrane PIFe, can be referred to as the first sub-covering layer TPU1. The right edge of the lower membrane PIFe is adjacent to the first flat portion PLA1. Sub-covering layer TPU2, which is superimposed on the left edge of the lower membrane PIFe, can be referred to as the second sub-covering layer TPU2. The left edge of the lower membrane PIFe is adjacent to the second flat portion PLA2.

[0256] When viewed in a plane (e.g., in a plan view), a portion of the lower membrane PIFe can be exposed to the outside without being covered by the first sub-covering layer TPU1 and the second sub-covering layer TPU2. Opposite sides (e.g., opposite ends) of the lower membrane PIFe in the second direction DR2 can be exposed to the outside without being covered by the first sub-covering layer TPU1 and the second sub-covering layer TPU2.

[0257] Because the lower membrane PIFe is exposed to the outside and not covered by the first sub-covering layer TPU1 and the second sub-covering layer TPU2, air from the outside of the support plate PLT can flow into the space between the first sub-covering layer TPU1 and the second sub-covering layer TPU2. Air from the outside can also flow into the opening OP through the space between the lower membrane PIFe and the curved section CSP. Therefore, the interior of the opening OP does not need to be in a vacuum state.

[0258] Figures 18A to 18C This is a view showing the lower membrane and the cover layer according to one or more embodiments of the present disclosure.

[0259] Figure 18AThis is a plan view showing the lower surface of a support plate PLT according to one or more embodiments. Figure 18B It is shown that along one or more embodiments Figure 18A A cross-sectional view of the support plate PLT, the lower membrane PIFf, and the cover layer TPUd, taken along line VIII-VIII'. Figure 18C It is shown that along one or more embodiments Figure 18A A cross-sectional view of the support plate PLT, the lower membrane PIFf, and the cover layer TPUd, taken from line IX-IX'.

[0260] exist Figures 18A to 18C In this drawing, the same reference numerals / letters indicate the same elements described with reference to the above drawings; therefore, for the sake of brevity, detailed descriptions of the same elements will not be provided.

[0261] Reference Figure 18A and Figure 18B The lower membrane PIFf may include a main body portion BD and a plurality of dummy portions DMP extending from the main body portion BD in a first direction DR1. The main body portion BD may be stacked with a curved portion CSP. The main body portion BD may not be stacked with a first flat portion PLA1 and a second flat portion PLA2. The main body portion BD may have a rectangular shape.

[0262] The dummy parts DMP can extend from opposite sides of the main body BD in the first direction DR1. One of the dummy parts DMP can be arranged on the left side of the main body BD. The other dummy part DMP can be arranged on the right side of the main body BD. The dummy parts DMP can be spaced apart and / or separated from each other in the second direction DR2 (e.g., separated or separated). The dummy parts DMP can be arranged alternately. The dummy parts DMP can be stacked with the curved part CSP and the first flat part PLA1 and the second flat part PLA2.

[0263] The cover layer TPUd can cover the lower membrane PIFf. The cover layer TPUd can cover the main body BD. The main body BD can be surrounded by the cover layer TPUd and the curved portion CSP.

[0264] Reference Figure 18A and Figure 18C The cover layer TPUd can cover the lower surface of the dummy part DMP. On the two sides of each dummy part DMP that are opposite each other in the first direction DR1, the side of each dummy part DMP that is separated from and / or separated (e.g., separated or detached) from the main part BD can be exposed to the outside (the outside of the electronic device) without being covered by the cover layer TPUd.

[0265] Because one side of the dummy part DMP is exposed to the outside and not covered by the covering layer TPUd, air from the outside of the support plate PLT can flow into the space between the lower membrane PIFf and the curved part CSP. Air from the outside can also flow into the opening OP. Therefore, the interior of the opening OP does not need to be in a vacuum state.

[0266] In this disclosure, the terms “exposed to the outside” or “exposed to the outside of the electronic device” can mean “having fluid communication with the surrounding environment, allowing air to flow in and out freely.”

[0267] In the context of this application, unless otherwise defined, the term “use” and its variations may be considered synonymous with the term “utilize” and its variations, respectively.

[0268] As used herein, the terms “substantially,” “about,” “approximately,” or similar terms are used as approximate terms rather than terms of degree and are intended to take into account the inherent biases in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. As used herein, “about” or “approximately” includes the stated value and means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “about” or “approximately” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0269] The light-emitting elements, display modules, display devices, electronic devices / equipment, window manufacturing equipment, or any other related devices / equipment or components according to embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of the device can be formed on an integrated circuit (IC) chip or on separate IC chips. Furthermore, various components of the device can be implemented on flexible printed circuit films, tape-on-a-chip (TCP), printed circuit boards (PCBs), or formed on a substrate. Additionally, various components of the device can be processes or threads running on one or more processors in one or more computing devices, executing computer program instructions, and interacting with other system components to perform the various functions described herein. The computer program instructions are stored in memory, which can be implemented in a computing device using standard memory devices, such as random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media, such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that, without departing from the scope of the embodiments of this disclosure, the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices.

[0270] While one or more embodiments of this disclosure have been described, it is understood that this disclosure should not be limited to these embodiments, but rather that one or more suitable changes and modifications can be made by those skilled in the art as described in the spirit and scope of this disclosure. Therefore, the subject matter disclosed should not be limited to any single embodiment described herein, and the scope of this disclosure should be determined by the appended claims and their equivalents.

Claims

1. An electronic device, the electronic device comprising: The display panel includes a first non-foldable area, a foldable area, and a second non-foldable area arranged relative to each other in a first direction. A support plate is located below the display panel and includes a plurality of openings defined to pass through the support plate and overlap with the folding area; A lower adhesive layer is disposed between the display panel and the support plate, and overlaps with the plurality of openings; The lower membrane is stacked with the plurality of openings and is located on the lower surface of the support plate; as well as A covering layer is placed on the lower surface of the support plate and covers the lower film. The membrane opening is defined to pass through the lower membrane, and the cover opening is defined to pass through the cover layer.

2. The electronic device according to claim 1, wherein, The support plate includes a curved portion that overlaps with the folded area, and the plurality of openings in the curved portion are arranged relative to each other in the first direction and in a second direction intersecting the first direction.

3. The electronic device according to claim 2, wherein, The cover opening and the membrane opening are continuously defined along a third direction intersecting the plane defined by the first direction and the second direction.

4. The electronic device according to claim 3, wherein, The width of the lower membrane in the first direction is smaller than the width of the curved portion in the first direction.

5. The electronic device according to claim 3, wherein, The width of the lower membrane in the first direction is equal to the width of the curved portion in the first direction.

6. The electronic device according to claim 3, wherein, There are multiple membrane openings and cap openings, the membrane openings are arranged to be adjacent to the opposite sides of the lower membrane in the first direction in a plan view, and the arrangement pattern of the cap openings corresponds to the arrangement pattern of the membrane openings.

7. The electronic device according to claim 6, wherein, The lower membrane has a rectangular frame shape, and the covering layer is stacked with a groove defined between the membrane openings.

8. The electronic device according to claim 1, wherein, The cover opening has a larger dimension than the membrane opening in the plan view, the lower membrane is exposed through the cover opening in the plan view without being covered by the cover layer, and the membrane opening does not overlap with the cover layer when in the plan view.

9. An electronic device, the electronic device comprising: The display panel includes a first non-foldable area, a foldable area, and a second non-foldable area arranged relative to each other in a first direction. A support plate is located below the display panel and includes a fold portion that overlaps with the folding area and includes a plurality of openings defined through the fold portion; A lower adhesive layer is disposed between the display panel and the support plate, and overlaps with the plurality of openings; A covering layer is located beneath the support plate and overlaps with the plurality of openings; as well as The lower film is located between the cover layer and the fold. In the plan view, at least a portion of the lower membrane is exposed to the outside of the electronic device and is not covered by the cover layer.

10. The electronic device according to claim 9, wherein, The lower membrane is exposed to the outside of the electronic device on opposite sides in a second direction intersecting the first direction, without being covered by the covering layer.

11. The electronic device according to claim 10, wherein, The lower membrane comprises a plurality of strips extending in the second direction and arranged relative to each other in the first direction.

12. The electronic device according to claim 10, wherein, Multiple slits are defined in the lower surface of the lower membrane opposite to the upper surface of the lower membrane, the upper surface of the lower membrane facing the support plate. The slits are arranged relative to each other in the first direction and extend in the second direction, and When viewed from the second direction, the slit extends from the lower surface of the lower membrane to half the thickness of the lower membrane.

13. The electronic device according to claim 12, wherein, The folding portion is folded or unfolded about a folding axis parallel to the second direction, and when the folding portion is folded, the width of each of the slits in the first direction is greater than the width of each of the slits in the first direction when the folding portion is unfolded.

14. The electronic device according to claim 10, wherein, The covering layer includes a plurality of sub-covering layers arranged relative to each other in the first direction and extending in the second direction.

15. The electronic device according to claim 14, wherein, In the plan view, the sub-covering layer is stacked on the opposite sides of the lower film that are opposite to each other in the first direction.

16. The electronic device according to claim 9, wherein, The lower membrane includes: The main body extends in a second direction intersecting the first direction; and The dummy part extends from the main body part in the first direction.

17. The electronic device according to claim 16, wherein, The side of the dummy part that is separated from the main body in the first direction in the plan view is exposed to the outside of the electronic device without being covered by the covering layer.

18. The electronic device according to claim 17, wherein, There are multiple dummy parts, and the dummy parts are respectively arranged on opposite sides of the main body in the first direction.

19. The electronic device according to claim 9, wherein, The fold includes: A curved portion that defines the plurality of openings; A plurality of reverse bends are located on opposite sides of the bends in the first direction, and include a plurality of reverse bend grooves defined within the reverse bends; and Multiple flat portions are located between the curved portions and the multiple reverse curved portions.

20. The electronic device according to claim 19, wherein, The width of the curved portion in the first direction is greater than the width of the lower film in the first direction.

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