Power conversion module
By increasing the number of copper layers on one side of the magnetic core assembly and staggering the copper layers, the problem of limited wiring area in the prior art is solved, achieving higher conversion efficiency and less electromagnetic interference.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2020-11-09
- Publication Date
- 2026-03-27
AI Technical Summary
In existing power conversion modules, the number of printed circuit board layers above and below the magnetic core assembly is the same, which limits the wiring area and copper pour area, increases wiring difficulty, increases parasitic losses, and affects conversion efficiency.
The number of copper layers on one side of the magnetic core assembly is greater than that on the other side, providing more wiring area and copper coverage, reducing parasitic resistance and inductance. The positive and negative copper layers are staggered to reduce inductance and loss.
It improves the conversion efficiency of the power conversion module, reduces electromagnetic interference and parasitic losses, and enhances the flexibility of wiring.
Smart Images
Figure CN121751479A_ABST
Abstract
Description
[0001] This application is a divisional application of Chinese Patent Application No. 202011251395.4 entitled "Power Conversion Module", filed on November 9, 2020. Technical Field
[0002] This disclosure relates to a power conversion module, and more particularly to a power conversion module in which the number of copper layers on both sides of a magnetic core assembly is different. Background Technology
[0003] With the rapid development of technologies such as mobile communication and cloud computing, high-power power conversion modules are widely used in electronic products. Furthermore, due to the trend towards higher power and miniaturization in electronic products, improving the conversion efficiency and reducing the size of power conversion modules are primary considerations.
[0004] Current power conversion modules embed the magnetic core assembly within a multi-layer printed circuit board to reduce the module's size. For ease of manufacturing, the number of PCB layers above and below the magnetic core assembly is the same. However, this approach limits the wiring area and copper plating above and below the magnetic core assembly, increasing the complexity of internal PCB routing. Furthermore, the increased wiring length leads to greater parasitic losses and signal interference, ultimately affecting the power conversion module's efficiency.
[0005] Therefore, developing a power conversion module that can improve upon the aforementioned existing technologies is an urgent need at present. Summary of the Invention
[0006] The purpose of this disclosure is to provide a power conversion module in which a magnetic core assembly is housed within a multilayer printed circuit board with multiple copper layers. The number of copper layers on one side of the magnetic core assembly is greater than the number on the other side, thereby utilizing the larger number of copper layers concentrated on one side of the magnetic core assembly to obtain a larger wiring area and copper plating area. This provides sufficient space for wiring to avoid strong electromagnetic interference caused by power loops, increases the flexibility of the copper plating network, and reduces the parasitic resistance and inductance of the multilayer printed circuit board, thereby improving the conversion efficiency of the power conversion module.
[0007] According to the concept of this disclosure, a power conversion module is provided, comprising a multilayer printed circuit board, at least one switching device, at least one magnetic core assembly, and at least one winding via. The multilayer printed circuit board has a first side, a second side, and an inner layer, with the first and second sides facing each other, and the multilayer printed circuit board has multiple copper layers. The switching device is disposed on the first side of the multilayer printed circuit board. The magnetic core assembly is disposed in the inner layer of the multilayer printed circuit board, wherein the magnetic core assembly has at least one hole. One end of the winding via is electrically connected to the switching device, and the other end of the winding via is electrically connected to the second side of the multilayer printed circuit board, and the winding via passes through the hole of the magnetic core assembly, forming a magnetic assembly with the magnetic core assembly. The number of copper layers on the side of the magnetic core assembly closer to the first side of the multilayer printed circuit board is at least two more than the number of copper layers on the other side of the magnetic core assembly. Attached Figure Description
[0008] Figure 1 This is a three-dimensional structural diagram of a power conversion module according to a preferred embodiment of the present disclosure.
[0009] Figure 2 This is an exploded structural diagram of the power conversion module according to a preferred embodiment of the present disclosure.
[0010] Figure 3 This is a side view of a power conversion module according to a preferred embodiment of the present disclosure.
[0011] Figure 4 This is a side view of a power conversion module according to a preferred embodiment of the present disclosure.
[0012] Figure 5 This is a schematic diagram of the second side of the power conversion module according to a preferred embodiment of the present disclosure.
[0013] Figure 6 This is a schematic diagram of the equivalent circuit of the power conversion module disclosed herein.
[0014] Figure 7 This is a side view of a power conversion module according to another preferred embodiment of the present disclosure.
[0015] The reference numerals in the attached figures are explained as follows: 1: Power conversion module 10: Multilayer printed circuit boards 101: Switching device 101a: Positive terminal of the switch 101b: Negative terminal of the switch 102: Capacitor Device 102a: Positive terminal of capacitor 102b: Negative terminal of capacitor 103: Magnetic core assembly 104: Hole 105: Winding via 106: First via 107: Second via 108: Third via 109: Fourth via 11: First Page 12: Second page 13: Solder pads 14: Inner layer PP: Dielectric layer L1~L8: Copper Layer Vin+: Input positive terminal Vin-: Negative input terminal SW: contact Cin: Input capacitance Co: Output capacitor Vin: Input voltage Vo: Output voltage Detailed Implementation
[0016] Some typical embodiments embodying the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can be varied in different implementations without departing from the scope of this disclosure, and the descriptions and illustrations therein are for illustrative purposes only and are not intended to limit this disclosure.
[0017] Figure 1 This is a three-dimensional structural diagram of a power conversion module according to a preferred embodiment of the present disclosure. Figure 2 This is an exploded structural diagram of the power conversion module according to a preferred embodiment of the present disclosure. Figure 3 This is a side view of a power conversion module according to a preferred embodiment of the present disclosure. Figure 4 This is a side view of a power conversion module according to a preferred embodiment of this disclosure. Figures 1 to 4As shown, the power conversion module 1 includes a multilayer printed circuit board 10, at least one switching device 101, at least one capacitor device 102, at least one magnetic core assembly 103, and at least one winding via 105. The multilayer printed circuit board 10 has a first surface 11, a second surface 12, and an inner layer 14, with the first surface 11 and the second surface 12 facing each other, and the multilayer printed circuit board 10 has multiple copper layers L1 to L8. The switching device 101 is disposed on the first surface 11 of the multilayer printed circuit board 10. The magnetic core assembly 103 is disposed in the inner layer 14 of the multilayer printed circuit board 10, wherein the magnetic core assembly 103 has a hole 104. One end of the winding via 105 is electrically connected to the switching device 101, and the other end of the winding via 105 is electrically connected to the second surface 12 of the multilayer printed circuit board 10. The winding via 105 passes through the hole 104 of the magnetic core assembly 103 and forms a magnetic assembly with the magnetic core assembly 103. The winding via 105 is electrically connected to all or part of the copper layers. A capacitor device 102 is disposed on the first surface 11 of the multilayer printed circuit board 10. The capacitor device 102 includes at least one capacitor, which is either an input capacitor or an output capacitor. In some embodiments, the winding via 105 is a straight via or a stepped via. Specifically, the winding via 105 may have a straight structure or a partially bent structure. The number of copper layers on the side of the magnetic core assembly 103 near the first surface 11 of the multilayer printed circuit board 10 is at least two more than the number of copper layers on the other side of the magnetic core assembly 103. In some embodiments, the number of copper layers on the side of the magnetic core assembly 103 near the first surface 11 of the multilayer printed circuit board 10 is at least three more than the number of copper layers on the other side of the magnetic core assembly 103. Figure 3 and Figure 4 For example, the multilayer printed circuit board 10 includes eight copper layers L1 to L8 and eight dielectric layers PP. The dielectric layers PP are disposed between two adjacent copper layers, but the actual number of layers is not limited to this. The magnetic core assembly 103 is disposed between copper layers L7 and L8 in the multilayer printed circuit board 10. Therefore, the number of copper layers L1 to L7 on one side of the magnetic core assembly 103 is greater than the number of copper layers L8 on the other side of the magnetic core assembly 103, and a larger wiring area and copper plating area can be obtained on the copper layers L1 to L7. Thus, by having more copper layers on one side of the magnetic core assembly 103 than on the other side, for example, two more copper layers on one side of the magnetic core assembly 103 than on the other side, a larger wiring area and copper plating area can be obtained by utilizing the more numerous copper layers concentrated on one side of the magnetic core assembly 103. This provides sufficient space for wiring to avoid strong electromagnetic interference caused by power loops, increases the flexibility of copper network, and reduces parasitic resistance and inductance of multilayer printed circuit boards, thereby improving the conversion efficiency of power conversion modules.
[0018] Figure 5This is a schematic diagram of the second side of a power conversion module according to a preferred embodiment of this disclosure. In some embodiments, such as... Figure 5 As shown, the power conversion module 1 also includes a pad 13, which is disposed on the second side 12 of the multilayer printed circuit board 10. The pad 13 is either a copper block pin or the surface copper layer of the multilayer printed circuit board 10, and the pad 13 is fixed on the second side 12. The other end of the winding via 105 is electrically connected to the pad 13.
[0019] Figure 6 This is a schematic diagram of the equivalent circuit of the power conversion module disclosed in this invention. Figure 6 As shown, capacitor device 102 includes an input capacitor Cin and an output capacitor Co. The magnetic component is an inductor Lo, wherein the winding via 105 serves as the winding of inductor Lo. Switching device 101 has an upper switch 1010 and a lower switch 1011, which may be, for example, a MOS (Metal Oxide Semiconductor), but are not limited thereto. A contact SW is provided between the upper switch 1010 and the lower switch 1011. Contact SW is electrically connected to inductor Lo and is also electrically connected to one end of winding via 105. One end of input capacitor Cin is electrically connected to upper switch 1010 to form the positive input terminal Vin+, and the other end of input capacitor Cin is electrically connected to lower switch 1011 to form the negative input terminal Vin-. One end of output capacitor Co is electrically connected to inductor Lo, and the other end of output capacitor Co is electrically connected to lower switch 1011. In some embodiments, the inductor Lo, as the magnetic component in the above embodiments, is located on the inner layer 14 of the multilayer printed circuit board 10. The projection of the inductor Lo and the switching device 101 on the first surface 11 at least partially overlaps, and the inductor Lo is electrically connected to the positive output terminal Vo+ of the power conversion module 1, which is located on the second surface 12 of the multilayer printed circuit board 10. It is worth noting that... Figure 6 The diagram only shows a single-phase half-bridge branch. In an actual power conversion module, it may include multiple phases connected in parallel.
[0020] Figure 7 This is a side view of a power conversion module according to another preferred embodiment of the present disclosure. Figure 7 and Figure 4 Components with similar structures and functions are represented by the same designation, and will not be elaborated further here. Figure 7In the illustrated embodiment, the multiple copper layers include multiple positive copper layers and multiple negative copper layers, which are alternately arranged. In some embodiments, the positive copper layers include copper layers L3, L5, and L7, and the negative copper layers include copper layers L2, L4, and L6. The switching device 101 has a positive terminal 101a and a negative terminal 101b, and the capacitor device 102 has a positive terminal 102a and a negative terminal 102b. The capacitor device 102 is disposed on the first surface 11 and adjacent to the switching device 101, and the capacitor device 102 forms a capacitor region. The power conversion module 1 also includes a first via 106, a second via 107, a third via 108, and a fourth via 109. The first via 106 is electrically connected to the positive terminal 101a of the switch, the second via 107 is electrically connected to the negative terminal 101b of the switch, the third via 108 is electrically connected to the positive terminal 102a of the capacitor, and the fourth via 109 is electrically connected to the negative terminal 102b of the capacitor. The first via 106 and the third via 108 are electrically connected to portions of copper layer L1 (i.e., the portions of copper layer L1 electrically connected to the positive terminal 101a of the switch and the positive terminal 102a of the capacitor), copper layers L3, L5, and L7, and a portion of copper layer L8 (i.e., the portion of copper layer L8 electrically connected to the positive input terminal Vin+). The second via 107 and the fourth via 109 are electrically connected to portions of copper layer L1 (i.e., the portions of copper layer L1 electrically connected to the negative terminal 101b of the switch and the negative terminal 102b of the capacitor), copper layers L2, L4, and L6, and a portion of copper layer L8 (i.e., the portion of copper layer L8 electrically connected to the negative input terminal Vin-). The positive and negative copper layers are alternately arranged. The first via 106 and the third via 108 are electrically connected to the positive input terminal Vin+, and the second via 107 and the fourth via 109 are electrically connected to the negative input terminal Vin-. The positive input terminal Vin+ and the negative input terminal Vin- are located on the second surface of the multilayer printed circuit board. Figure 7 The arrows in the diagram represent the direction of the alternating current in this embodiment. The following example illustrates the alternating current loop of this embodiment. Starting from the positive terminal 102a of capacitor device 102, the alternating current flows through the third via 108, through each positive copper layer, and then through the first via 106 into the positive terminal 101a of switch device 101. Starting from the negative terminal 101b of switch device 101, the alternating current flows through the second via 107, through each negative copper layer, and then through the fourth via 109 into the negative terminal 102b of capacitor device 102. The current flowing through adjacent positive and negative copper layers has opposite directions. Figure 7The overlapping portions of the first via 106 and the third via 108 with copper layers L2, L4, and L6 shown only represent the relative positions of the vias and copper layers under this viewing angle, not actual connections. Similarly, the overlapping portions of the second via 107 and the fourth via 109 with copper layers L3, L5, and L7 only represent the relative positions of the vias and copper layers under this viewing angle, not actual connections. By using alternating currents in opposite directions on adjacent copper layers, the alternating magnetic flux between adjacent copper layers cancels each other out, thus reducing the parasitic inductance of the current loop and improving the conversion efficiency of the power conversion module.
[0021] Furthermore, the power conversion module 1 also includes a dielectric layer PP, which is located between any two adjacent copper layers. The projections of adjacent positive and negative copper layers and the capacitor region onto the first surface 11 at least partially overlap, thereby reducing parasitic inductance and parasitic losses in the wiring, and thus improving the conversion efficiency of the power conversion module. In some embodiments, the first via 106, the second via 107, the third via 108, and the fourth via 109 are straight holes or stepped holes.
[0022] In some embodiments, a portion of the copper layer L8 is electrically connected to the positive output terminal of the power conversion module 1, and a portion of the copper layer L8 is electrically connected to the negative output terminal of the power conversion module 1.
[0023] In another embodiment, when the positive copper layer on one side of the magnetic core assembly 103 is one layer and the negative copper layer is also only one layer, the number of copper layers on one side of the magnetic core assembly 103 is two more than the number of copper layers on the other side of the magnetic core assembly 103.
[0024] It should be noted that, Figure 4 The side view shown focuses on illustrating the position and connection relationships between the copper layer, the magnetic core assembly, and the corresponding winding vias. Figure 7 The side view shown focuses on illustrating the electrical connections between the positive and negative copper layers and the switching and capacitor devices. However, in reality... Figure 4 and Figure 7 The structure shown can be implemented in different power conversion modules or in the same power conversion module.
[0025] In summary, this disclosure provides a power conversion module that utilizes a larger copper layer concentration on one side of the core assembly compared to the other side to achieve a larger wiring area and copper plating area. This provides sufficient space for wiring to avoid strong electromagnetic interference caused by power loops, increases the flexibility of the copper plating network, and reduces parasitic resistance and inductance of multilayer printed circuit boards, thereby improving the conversion efficiency of the power conversion module. This disclosure also provides a power conversion module in which multiple staggered positive and negative copper layers are electrically connected to corresponding switch positive and negative terminals, capacitor positive and negative terminals, and multiple vias. The projections of adjacent positive and negative copper layers and the capacitor area on the first surface at least partially overlap, thereby reducing parasitic inductance and parasitic losses in the wiring, and further improving the conversion efficiency of the power conversion module.
[0026] It should be noted that the above are merely preferred embodiments for illustrating this disclosure, and this disclosure is not limited to the described embodiments. The scope of this disclosure is determined by the appended claims. Furthermore, this disclosure can be modified in many ways by those skilled in the art, without departing from the protection scope of the appended claims.
Claims
1. A power conversion module, comprising: A multilayer printed circuit board, wherein the multilayer printed circuit board has a first side, a second side and an inner layer, the first side and the second side are opposite to each other, and the multilayer printed circuit board has a plurality of copper layers. At least one switching device is disposed on the first surface of the multilayer printed circuit board; At least one magnetic component includes a winding and a magnetic core, the winding passing through the magnetic core to form the magnetic component, the magnetic component being disposed in the inner layer of the multilayer printed circuit board; in, The number of copper layers used for circuit wiring on one side of the magnetic component is at least two more than the number of copper layers used for circuit wiring on the other side of the magnetic component, and the number of copper layers used for circuit wiring on the other side of the magnetic component is at least one. The plurality of copper layers include a plurality of positive copper layers and a plurality of negative copper layers, wherein the plurality of positive copper layers are electrically connected to each other, and the plurality of negative copper layers are electrically connected to each other.
2. The power conversion module as claimed in claim 1 further includes a capacitor device disposed on the first side of the multilayer printed circuit board, wherein the capacitor device includes at least one capacitor, which is an input capacitor or an output capacitor.
3. The power conversion module as described in claim 1, wherein, The plurality of positive copper layers and the plurality of negative copper layers are arranged alternately, and the current flowing through adjacent positive copper layers and negative copper layers is in the opposite direction.
4. The power conversion module as described in claim 1, wherein, The magnetic core includes a via through which the winding passes. Both the winding and the via are vertical structures or both include bent structures.
5. The power conversion module as described in claim 1, wherein, One end of the winding is electrically connected to the switching device.
6. The power conversion module as claimed in claim 5 further includes a connecting member disposed on the second side of the printed circuit board, and the other end of the winding is electrically connected to the connecting member.
7. The power conversion module as described in claim 5, wherein, The switching device includes at least one upper switch and at least one lower switch electrically connected, with a contact between the upper switch and the lower switch, and the contact of the upper switch and the lower switch being electrically connected to one end of the winding.
8. The power conversion module as described in claim 1, wherein, The magnetic component forms an inductor.
9. The power conversion module of claim 2, further comprising at least one first via, at least one second via, at least one third via, and at least one fourth via, wherein the first via is electrically connected to a positive terminal of the switching device, the second via is electrically connected to a negative terminal of the switching device, the third via is electrically connected to a positive terminal of the capacitor device, and the fourth via is electrically connected to a negative terminal of the capacitor device. The plurality of positive copper layers are electrically connected to the first via and the third via, and the plurality of negative copper layers are electrically connected to the second via and the fourth via.