PCB welding spot anti-falling rubber coating structure

Abstract

The invention discloses a PCB welding spot anti-falling rubber coating structure, which adopts a double-layer high-low pressure injection molding rubber coating structure, and comprises a low-pressure rubber coating for weakening the damage of external vibration to a welding spot and a high-pressure rubber coating for preventing the damage of external impact and extrusion to the welding spot, the low-voltage rubber coating wraps the doubling welding spot, and the high-voltage rubber coating wraps the low-voltage rubber coating and the integral connecting structure, so that a high-stability high-low-voltage rubber coating structure of the doubling welding spot is formed. According to the invention, a double-layer high-low pressure injection molding encapsulation structure is adopted, the problems of PCB welding point falling in a vibration environment, welding point extrusion falling during high pressure injection molding and circuit board damage caused by external force extrusion are effectively prevented, and the circuit connection communication failure rate is effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit manufacturing, in particular to a PCB welding point anti-falling encapsulation structure. BACKGROUND

[0002] Now the PCB external glue block adopts high-pressure injection encapsulation forming, the high-pressure injection shell is hard and not easy to scratch and deform, but when encapsulating, the high-pressure glue will impact the welding point with a certain probability to cause the welding point to impact and break, causing the internal welding point of the later connected module to be separated from the welding position in the vibration environment, resulting in line connection interruption failure. The PCB external glue block adopts low-pressure injection encapsulation forming, and the glue injection will not impact the welding point, but the injection shell forming rate is low, easy to deform, weak in extrusion resistance, and high in defective product rate, so this process is not commonly used.

[0003] The prior art 1 such as "welding point encapsulation device, encapsulation product and encapsulation method" (CN116197083B) adopts a dispensing form for encapsulation, which is a low-pressure dispensing form without encapsulation pressure and does not play a role in fixing and protecting the connection point, but only a waterproof shielding measure, an externally installed metal shell.

[0004] The prior art 2 such as "a semiconductor packaging process" (CN120390370A) preforms a connection point welding block, and uses a metal bonding form to bond the connection welding block, and then performs glue coating.

[0005] The prior art 3 such as "a PCB injection sealing structure" (CN210469885U) preforms a sealing inner shell to close the elements on the circuit board, then increases an outer shell, and then high-pressure injects glue between the inner and outer shells.

[0006] However, the prior art has the following problems: 1) low-pressure dispensing can only shield and waterproof the welding circuit, without fixing and anti-vibration effect; 2) the PCB external protection adopts an assembled metal shell to prevent extrusion and collision, which is complex to install and has many types of parts; 3) a metal inner shell is used to prevent the PCB circuit board from being extruded and damaged by external high-pressure injection, which is complex to fix and is prone to displacement and damage to the circuit board. SUMMARY

[0007] The present application provides a PCB welding point anti-falling encapsulation structure, which adopts a double-layer high-low pressure injection encapsulation structure to effectively prevent the PCB welding point from falling off in a vibration environment, the welding point from being extruded and falling off during high-pressure injection, and the circuit board from being damaged due to external extrusion, thereby effectively reducing the circuit connection communication failure rate.

[0008] Technical solution: The PCB welding point anti-falling encapsulation structure of the application is characterized by adopting a double-layer high-low pressure injection encapsulation structure, which comprises low-pressure encapsulation for weakening the damage of external vibration to the welding point and high-pressure encapsulation for preventing the damage of external impact and extrusion to the welding point.

[0009] The parallel welding point is located on the PCB substrate, and the patch circuit on the PCB of the PCB substrate is welded together with the external lead wire through welding material to form a parallel welding point.

[0010] The low-pressure encapsulation is injected on the parallel welding point by a low-pressure injection molding machine to form a low-pressure encapsulation block to fix and protect the parallel welding point.

[0011] The high-pressure encapsulation is injected into the module shell mold by a high-pressure injection molding machine to form a connection module shape.

[0012] The low-pressure encapsulation and the high-pressure encapsulation are combined to form a high-low pressure binary welding point encapsulation structure of the CAN circuit board.

[0013] The low-pressure encapsulation and the high-pressure encapsulation adopt an automatic control system when being injected, and no protection structure is set in advance.

[0014] After the low-pressure encapsulation fixes the parallel welding point, the softness of the low-pressure encapsulation weakens the damage of external vibration to the parallel welding point.

[0015] After the high-pressure encapsulation forms a high-pressure shell, the hardness of the high-pressure encapsulation prevents the deformation of the connection structure and prevents the damage of external impact and extrusion to the welding point.

[0016] The low-pressure encapsulation adopts an assembled soft rubber block to wrap the welding point.

[0017] The parallel welding point is provided with a metal support hollow structure to prevent the high-pressure encapsulation from contacting the welding point.

[0018] Beneficial effects: compared with the prior art, the present application has the following remarkable advantages: the present application adopts double-layer high-low pressure injection molding encapsulation structure, effectively prevents PCB solder joint from falling off in the vibration environment, solder joint from extrusion and falling off during high pressure injection molding, and circuit board from being damaged due to external extrusion, effectively reduces the circuit connection communication failure rate; the structure is simple, and the problems of complex installation and too many parts are avoided. PCB solder joint anti-vibration protection: the low-pressure glue block in the high-low pressure encapsulation structure wraps the solder joint and is soft and anti-vibration, preventing external vibration from being transmitted to the PCB solder joint. PCB solder joint anti-extrusion damage: the low-pressure glue block in the high-low pressure encapsulation structure wraps the solder joint and prevents the solder joint from being extruded and damaged by external high-pressure injection molding glue, and the external high-pressure glue block prevents the overall injection molding module from being extruded and damaged by external extrusion. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a single-layer injection molding encapsulation structure diagram of the prior art PCB solder joint.

[0020] Figure 2 It is a structure diagram of the present application.

[0021] In the figure, 1 is a PCB substrate; 2 is a patch circuit on the PCB; 3 is a wire bonding point; 4 is high-pressure encapsulation; 5 is an external lead; 6 is a module shell mold; and 7 is low-pressure encapsulation. DETAILED DESCRIPTION

[0022] The technical solutions of the present application will be further described below in combination with the drawings and specific embodiments.

[0023] The PCB of the present application is an integrated carrier of a microcircuit. The solder joint is a fixed point for connecting the circuit on the PCB with an external circuit. The encapsulation is a glue block for wrapping the PCB in the injection molding process.

[0024] The PCB solder joint anti-falling encapsulation structure of the present application adopts a double-layer high-low pressure injection molding encapsulation structure, which includes a low-pressure encapsulation 7 for weakening the damage of external vibration to the solder joint and a high-pressure encapsulation 4 for preventing the damage of external impact and extrusion to the solder joint; the low-pressure encapsulation 7 wraps the wire bonding point 3, and the high-pressure encapsulation 4 wraps the low-pressure encapsulation 7 and the overall connection structure, forming a high-stability high-low pressure encapsulation structure of the wire bonding point 3.

[0025] The parallel welding point 3 of the application is located on the PCB substrate 1, and the patch circuit 2 on the PCB of the PCB substrate 1 is welded together with the external lead 5 through welding material to form the parallel welding point 3. The low-pressure encapsulation 7 is injected on the parallel welding point 3 by using a low-pressure injection molding machine to form a low-pressure encapsulation block to fix and protect the parallel welding point 3. The high-pressure encapsulation 4 is injected into the module shell mold 6 by using a high-pressure injection molding machine to form a connection module shape. The low-pressure encapsulation 7 and the high-pressure encapsulation 4 form a high-low voltage dual welding point encapsulation structure of the CAN circuit board. The low-pressure encapsulation 7 and the high-pressure encapsulation 4 are injected by using an automatic control system, and no protection structure is set in advance.

[0026] After the low-pressure encapsulation 7 fixes the parallel welding point 3, the softness of the low-pressure encapsulation 7 weakens the damage of external vibration to the parallel welding point 3. After the high-pressure encapsulation 4 forms a high-pressure shell, the hardness of the high-pressure encapsulation 4 prevents the deformation of the connection structure and prevents the damage of external impact and extrusion to the welding point.

[0027] The low-pressure encapsulation 7 of the application can be a soft rubber block encapsulating the welding point. The parallel welding point 3 can be provided with a metal support hollow structure to prevent the high-pressure encapsulation 4 from contacting the welding point.

[0028] The application adopts a double-layer high-low voltage injection encapsulation structure to effectively prevent the problems of PCB welding point falling off in a vibrating environment, welding point extrusion and falling off during high-pressure injection, and circuit board damage caused by external extrusion, effectively reducing the communication failure rate of the circuit connection; the structure is simple, avoiding the problems of complex installation and too many parts. PCB welding point vibration resistance protection: the low-pressure encapsulation block in the high-low voltage encapsulation structure is soft and resistant to vibration, preventing external vibration from being transmitted to the PCB welding point. PCB welding point extrusion damage prevention: the low-pressure encapsulation block in the high-low voltage encapsulation structure can prevent the extrusion damage of the external high-pressure injection encapsulation to the welding point, and the external high-pressure encapsulation can prevent the extrusion damage of the external extrusion to the whole injection module.

Claims

1. A PCB solder joint anti-detachment coating structure, characterized in that: The double-layer high and low pressure injection molding encapsulation structure is adopted, including low pressure encapsulation (7) for weakening the damage of external vibration to the weld point and high pressure encapsulation (4) for preventing damage to the weld point from external impact and squeezing; the low pressure encapsulation (7) wraps the parallel weld point (3), and the high pressure encapsulation (4) wraps the low pressure encapsulation (7) and the overall connection structure, forming a high-stability high and low pressure encapsulation structure for the parallel weld point (3).

2. The PCB solder joint anti-detachment coating structure according to claim 1, characterized in that: The parallel solder joint (3) is located on the PCB substrate (1). The surface mount circuit (2) on the PCB substrate (1) is soldered together with the external wire (5) by soldering material to form the parallel solder joint (3).

3. The PCB solder joint anti-detachment coating structure according to claim 2, characterized in that: A low-pressure injection molding machine is used to inject the low-pressure overmolding (7) onto the parallel solder joint (3) to form a low-pressure rubber block to fix and protect the parallel solder joint (3).

4. The PCB solder joint anti-detachment coating structure according to claim 3, characterized in that: A high-pressure injection molding machine is used to fill the module shell mold (6) with the high-pressure overmolding (4) to form the shape of the connecting module.

5. The PCB solder joint anti-detachment coating structure according to claim 4, characterized in that: The combination of low-pressure encapsulation (7) and high-pressure encapsulation (4) forms a high-low voltage binary solder joint encapsulation structure for the CAN circuit board.

6. The PCB solder joint anti-detachment coating structure according to claim 5, characterized in that: The low-pressure overmolding (7) and high-pressure overmolding (4) are injection molded using an automated control system, without the need for pre-setting a protective structure.

7. The PCB solder joint anti-detachment coating structure according to claim 5, characterized in that: After the low-pressure coating (7) fixes the parallel solder joint (3), the softness of the low-pressure coating (7) reduces the damage of external vibration to the parallel solder joint (3).

8. The PCB solder joint anti-detachment coating structure according to claim 5, characterized in that: After the high-pressure coating (4) forms a high-pressure shell, the hardness of the high-pressure coating (4) prevents the connection structure from deforming and prevents external impacts and squeezing from damaging the weld points.

9. The PCB solder joint anti-detachment coating structure according to claim 1, characterized in that: The low-pressure rubber coating (7) uses assembled soft rubber blocks to wrap the welding points.

10. The PCB solder joint anti-detachment coating structure according to claim 1, characterized in that: The parallel welding point (3) is provided with a metal support and hollow structure to prevent the high-pressure coating (4) from contacting the welding point.

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