Electronic equipment shell, surface processing method and mold

Abstract

The invention provides an electronic equipment shell, a surface processing method and a mold. The electronic equipment shell comprises a base material layer and a light trapping layer formed on the surface of the base material layer; the light trapping layer is provided with randomly distributed light trapping structures, and the light trapping structures are at least one of protrusions or recesses and are configured to enable incident light to be reflected and absorbed multiple times through the geometrical optical effect. According to the electronic equipment shell, the surface processing method and the mold disclosed by the invention, the random light trapping structure of the light trapping layer can enable incident light to be reflected and absorbed for multiple times, so that surface reflected light is effectively reduced, the surface of the shell presents a deeper and more uniform black appearance, and the problem of large visual difference between a traditional blind hole and a penetrating hole is solved; the random distribution of the light trapping structures avoids the problem of high brightness or shadow of regular textures at a specific angle, ensures that the surface of the shell can keep consistent low-reflection texture at different illumination and observation angles, does not need to additionally add black film materials, simplifies the process steps, and reduces the production cost.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of shell manufacturing, and in particular to an electronic device shell, a surface processing method and a mold. BACKGROUND

[0002] Electronic device shells often need to be designed with through holes in certain areas for heat dissipation needs, while in other areas, blind hole textures are used for aesthetic and structural strength considerations. However, the existing plowing and biting flower process can cause significant differences in the surface visual effects of blind holes and through holes, such as problems of blind hole surface gloss being too high, texture not matching the through holes, and the like.

[0003] The existing solutions have many shortcomings, such as the use of a black film substrate for a full through hole structure, which can achieve a deep black appearance effect through the substrate, but increases the process complexity and cost, and the full through hole design reduces the structural reliability, making it difficult to guarantee heat dissipation and waterproof sealing, which has a negative impact on the structural strength and airtightness of the electronic device shell. SUMMARY

[0004] The present disclosure provides an electronic device shell, a surface processing method and a mold to at least solve the above technical problems in the prior art.

[0005] In a first aspect of the present disclosure, an electronic device shell is provided, comprising a substrate layer and a light trapping layer formed on the surface of the substrate layer. The light trapping layer has randomly distributed light trapping structures, which are at least one of protrusions or depressions, configured to form multiple reflections and absorption between the light trapping structures when incident light reaches the light trapping layer through geometric optical effects, to reduce the surface reflectivity of the electronic device shell.

[0006] In an implementable manner, the light trapping structure is a protruding structure formed on the surface of the substrate layer, and a gap is formed between two adjacent protruding structures to allow the incident light to be reflected multiple times in the gap. The substrate layer and / or the surface of the protruding structure is made of a light-absorbing material for absorbing the incident light after multiple reflections.

[0007] In an implementable manner, the light trapping structure is a protruding structure formed on the surface of the substrate layer, and a gap is formed between two adjacent protruding structures to allow the incident light to be reflected multiple times in the gap. The substrate layer and / or the surface of the protruding structure is made of a light-absorbing material for absorbing the incident light after multiple reflections.

[0008] In an embodiment, the light-trapping structures are arranged in a tilted manner relative to the surface of the substrate layer, and the angle θ between the tilted surface of the light-trapping structures and the normal of the surface of the substrate layer satisfies: 0°≤θ≤10°, so as to guide the incident light into the light-trapping structures for multiple reflections.

[0009] In an embodiment, the area coverage ratio ρ of the randomly distributed light-trapping structures on the surface of the light-trapping layer satisfies: 30%≤ρ≤70%, so as to make the incident light fully contact with the light-trapping structures.

[0010] In an embodiment, the height h of the light-trapping structures satisfies: 0.02mm≤h≤0.07mm.

[0011] In an embodiment, the diameter φ of the light-trapping structures satisfies: 0.005mm≤φ≤0.015mm.

[0012] In a second aspect, the present disclosure provides a surface processing method for manufacturing the electronic device housing in the above-mentioned embodiments, the surface processing method comprising: forming a profiled structure on the surface of the mold, the profiled structure having parameters configured to be adjusted through programmed control; injecting plastic material into the mold, so that the plastic material fills the profiled structure to form light-trapping structures on the surface of the molded electronic device housing.

[0013] In a third aspect, the present disclosure provides a mold for implementing the surface processing method of the electronic device housing in the above-mentioned embodiments, the cavity surface of the mold being provided with a profiled structure corresponding to the light-trapping structure.

[0014] In a fourth aspect, the present disclosure provides a surface processing method for manufacturing the electronic device housing in the above-mentioned embodiments, the surface processing method comprising: etching light-trapping structures on the surface of the electronic device housing, the parameters of the light-trapping structures being configured to be adjusted through programmed control.

[0015] The random light-trapping structure of the light-trapping layer in the electronic device housing disclosed herein allows incident light to be reflected and absorbed multiple times, effectively reducing surface reflection and giving the housing surface a deeper, more uniform black appearance. This solves the problem of significant visual differences between traditional blind holes and through holes. The random distribution of the light-trapping structure avoids the problem of high brightness or shadows at specific angles caused by regular textures, ensuring that the housing surface maintains a consistent low-reflection texture under different lighting and viewing angles. This eliminates the need for additional black film or other materials, simplifying the process and reducing production costs, while also avoiding the negative impact of full-through holes on structural strength. The light-trapping layer is formed on the surface of the substrate layer, minimizing its impact on the structural integrity of the substrate itself, and maintaining the original structural strength and functionality of the housing, such as heat dissipation and waterproof sealing. Furthermore, the electronic device housing disclosed herein has a wide range of applications, suitable for housings of various electronic devices such as laptops, smartphones, and tablets, and is particularly suitable for parts where aesthetics and structural strength must be balanced.

[0016] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0017] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which: In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0018] Figure 1 A schematic diagram of a structure of an electronic device housing according to an exemplary embodiment of the present disclosure is shown; Figure 2 A schematic diagram of another structure of an electronic device housing according to an exemplary embodiment of the present disclosure is shown; Figure 3 A schematic diagram of the structure of a mold used in this disclosure for manufacturing electronic device housings is shown; Figure 4 A schematic diagram of the molding process of the mold used in this disclosure for manufacturing electronic device housings is shown; Figure 5 A schematic diagram of a process for manufacturing an electronic device housing according to the present disclosure is shown; Figure 6 A schematic diagram of another process for manufacturing an electronic device housing is shown in this disclosure.

[0019] The labels in the diagram are as follows: 1. Substrate layer; 2. Light trapping layer; 21. Light trapping structure; 3. Programmable laser etching equipment; 4. Incident light beam; 5. Mold; 51. Contouring structure. Detailed Implementation

[0020] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0021] Reference Figure 1 and Figure 2 As shown, an electronic device housing according to an embodiment of the present disclosure is illustrated. The electronic device housing includes a substrate layer 1 and a light-trapping layer 2 formed on the surface of the substrate layer 1. The light-trapping layer 2 has randomly distributed light-trapping structures 21. The light-trapping structures 21 are at least one of protrusions or depressions, and are configured to cause multiple reflections and absorptions between the light-trapping structures 21 when the incident light 4 reaches the light-trapping layer 2 through geometric optical effects, so as to reduce the surface reflectivity of the electronic device housing.

[0022] In this embodiment, the substrate layer 1 is made of plastic material, specifically including but not limited to polycarbonate (PC), acrylonitrile-butadiene-styrene terpolymer (ABS), or a mixture of PC and ABS. The light-trapping layer 2 is integrally formed with the substrate layer 1, or the light-trapping layer 2 can be formed on the surface of the substrate layer 1 through subsequent processing. When the light-trapping layer 2 and the substrate layer 1 are integrally formed, the light-trapping structure 21 can be formed by mold texture transfer; when the light-trapping layer 2 is processed later, the light-trapping structure 21 can be processed on the surface of the substrate layer 1 by etching (including laser etching) or other processes. Specifically, the light-trapping structure 21 includes multiple randomly distributed micropores, pits, or protrusions. The size, depth, distribution density, and angle of these structures can be non-uniform to ensure that incident light 4 incident at different angles can produce effective multiple reflections and absorption. The random distribution characteristic of the light-trapping structure 21 refers to its irregular arrangement in terms of spatial position, size, and angle. This avoids the enhanced light reflection or interference phenomena in specific directions caused by regular structures, ensuring that the shell surface exhibits a uniform low-reflection effect under different lighting conditions. When incident light 4 shines on the surface of the light-trapping layer 2, the incident light enters the light-trapping structure 21 and undergoes multiple reflections between the inner walls of the structure. During each reflection, some light is absorbed by the substrate material. After multiple reflections, the amount of light that can escape from the surface of the light-trapping layer 2 is greatly reduced, thereby significantly reducing the reflectivity of the shell surface and giving the shell a deep, uniform, dark black texture that is more harmonious with the visual effect of the perforated area.

[0023] In summary, the random light-trapping structure 21 of the light-trapping layer 2 in the electronic device housing disclosed herein enables the incident light 4 to be reflected and absorbed multiple times, effectively reducing surface reflection and giving the housing surface a deeper, more uniform black appearance. This solves the problem of significant visual differences between traditional blind holes and through holes. The random distribution of the light-trapping structure 21 avoids the problem of high brightness or shadows at specific angles due to regular textures, ensuring that the housing surface maintains a consistent low-reflection texture under different lighting and viewing angles. This eliminates the need for additional black film or other materials, simplifying the process and reducing production costs, while also avoiding the negative impact of full through holes on structural strength. The light-trapping layer 2 is formed on the surface of the substrate layer 1, having minimal impact on the structural integrity of the substrate itself, and maintaining the original structural strength and functionality of the housing, such as heat dissipation and waterproof sealing. Furthermore, the electronic device housing disclosed herein has a wide range of applications, suitable for housings of various electronic devices such as laptops, smartphones, and tablets, and is especially suitable for parts that require a balance between aesthetics and structural strength.

[0024] Reference Figure 1 As shown, in one embodiment, the light-trapping structure 21 is a raised structure formed on the surface of the substrate layer 1, and a gap is formed between two adjacent raised structures so that the incident light 4 is reflected multiple times within the gap; the substrate layer 1 and / or the surface of the raised structure are made of light-absorbing material to absorb the incident light 4 after multiple reflections.

[0025] In this embodiment, the light-trapping structure 21 is specifically a raised structure. When incident light 4 irradiates the surface of the light-trapping layer 2, the randomly distributed raised structures can change the propagation path of the incident light 4. That is, the light undergoes multiple reflections between adjacent raised structures. Some light is absorbed by the substrate layer 1 material, and some light intensity is significantly reduced after scattering. Finally, the reflected light escaping the surface is significantly reduced, thereby achieving a low reflectivity and deep black visual effect. In summary, the light-trapping structure 21, which is raised relative to the substrate layer 1, reduces the surface reflectivity by causing light to undergo multiple reflections and scattering, thus making the deep black effect of the blind hole area and the through hole more consistent, solving the problem of light-dark contrast in traditional processes. The micro-velvety appearance on the surface of the molded product enhances the blackening effect, exhibiting a deep black effect similar to black velvet texture.

[0026] Reference Figure 2 As shown, in one embodiment, the light-trapping structure 21 is a recessed structure formed on the surface of the substrate layer 1, and the incident light 4 is reflected multiple times in each recessed structure; the substrate layer 1 and / or the surface of the recessed structure are made of light-absorbing material to absorb the incident light 4 after multiple reflections.

[0027] In this embodiment, the light-trapping structure 21 is specifically a recessed structure. When incident light 4 irradiates the surface of the light-trapping layer 2, the randomly distributed recessed structures (e.g., micro-holes or micro-pits) can change the propagation path of the incident light 4. That is, after the incident light 4 enters the recessed structure, it undergoes multiple reflections between the hole walls or pit walls. Some light is absorbed by the substrate layer 1 material, and some light is significantly attenuated in intensity after scattering. Finally, the reflected light escaping from the surface is significantly reduced, thereby achieving a low reflectivity and a deep black visual effect. In summary, the light-trapping structure 21, which is recessed relative to the substrate layer 1, reduces the surface reflectivity by causing light to undergo multiple reflections and scattering, making the deep black effect of the blind hole area and the through hole more consistent, thus solving the problem of brightness contrast in traditional processes.

[0028] It is understood that in some implementations, both the raised light-trapping structure 21 and the recessed light-trapping structure 21 can coexist, together giving the electronic device housing a deep black appearance.

[0029] In one embodiment, the light trapping structure 21 is inclined relative to the surface of the substrate layer 1, and the angle θ between its inclined surface and the surface normal of the substrate layer satisfies: 0°≤θ≤10°, so as to guide the incident light 4 into the light trapping structure 21 for multiple reflections.

[0030] In this embodiment, the angle between the central axis of the light-trapping structure 21 and the surface normal of the substrate layer 1 can be adjusted as needed. For example, when the light-trapping structure 21 is a raised structure formed on the surface of the substrate layer 1, θ is preferably 0°; while when the light-trapping structure 21 is a recessed structure formed on the substrate surface, θ is preferably 0°~10°. This angle range design can extend the reflection path of light in the light-trapping structure 21 and improve the light absorption efficiency; at the same time, it avoids the problems of difficult demolding or enhanced local reflection caused by excessive angle. Specifically, when light shines on the surface of the light-trapping layer 2, the randomly distributed light-trapping structures 21 with specific angles can change the light propagation path. That is, after the light enters the light-trapping structure 21, it undergoes multiple reflections between the hole walls or pit walls. The presence of the θ angle extends the reflection path, causing some light to be absorbed by the substrate layer 1 material, and some light to be greatly attenuated after scattering. Finally, the reflected light escaping the surface is significantly reduced, thereby achieving a low reflectivity and deep black visual effect.

[0031] In one embodiment, the area coverage ρ of the randomly distributed light-trapping structures 21 on the surface of the light-trapping layer 2 satisfies: 30%≤ρ≤70%, so that the incident light ray 4 can fully contact the light-trapping structure 21.

[0032] In this embodiment, the area coverage ρ of the light-trapping structure 21 on the surface of the light-trapping layer 2 can be adjusted according to requirements. For example, when the light-trapping structure 21 is a raised structure formed on the surface of the substrate layer 1, ρ is preferably 30%~50%; while when the light-trapping structure 21 is a recessed structure formed on the surface of the substrate, ρ is preferably 40%~70%, which can be adjusted according to the requirements of deep black effect and structural strength. When light shines on the surface of the light-trapping layer 2, the randomly distributed light-trapping structures 21 with an area coverage of 30%~70% can efficiently change the light propagation path. That is, the light undergoes multiple reflections between or inside the structure. The reasonable setting of the coverage ensures sufficient contact between the light and the structure. Some light is absorbed by the substrate material, and some light is greatly attenuated in intensity after scattering. Finally, the reflected light escaping from the surface is significantly reduced, thereby achieving a low reflectivity and deep black visual effect. Limiting the coverage ρ to 30%~70% can achieve efficient diffuse reflection through sufficient structural density, avoiding the residual reflective points caused by too low coverage, while avoiding excessive processing of the substrate surface due to too high coverage, such as excessively dense recessed structures leading to thinner shells and excessively dense protruding structures leading to stress concentration, thus ensuring the structural stability and functionality of the shell.

[0033] In one embodiment, the height h of the light trapping structure 21 satisfies: 0.02mm ≤ h ≤ 0.07mm.

[0034] In this embodiment, the height h of the light-trapping structure 21 can be adjusted according to requirements. For example, when the light-trapping structure 21 is a raised structure formed on the surface of the substrate layer 1, h is preferably 0.02mm to 0.03mm; while when the light-trapping structure 21 is a recessed structure formed on the surface of the substrate, h is preferably 0.03mm to 0.07mm, which can be adjusted according to the light absorption requirements. When light shines on the surface of the light-trapping layer 2, the randomly distributed light-trapping structures 21 with a height h of 0.02mm to 0.07mm can provide sufficient reflection space. That is, the light undergoes multiple reflections inside or between the structures. The reasonable setting of the height ensures the length of the light reflection path. Some light is absorbed by the substrate layer 1 material, and some light intensity is greatly reduced after scattering. Finally, the reflected light escaping from the surface is significantly reduced, thereby achieving a low reflectivity and deep black visual effect. By limiting the height h to 0.02mm~0.07mm, efficient light absorption can be achieved through sufficient depth or height, avoiding insufficient light absorption due to a short reflection path caused by too low a height, while avoiding processing difficulties caused by too high a height, such as difficulty in demolding deep holes in the mold transcribing method and excessively long laser engraving time in the direct processing method, thus taking into account the stability of mass production processes.

[0035] In one embodiment, the diameter φ of the light-trapping structure 21 satisfies: 0.005mm≤φ≤0.015mm.

[0036] In this embodiment, the diameter φ of the light-trapping structure 21 can be adjusted according to requirements. For example, when the light-trapping structure 21 is a raised structure formed on the surface of the substrate layer 1, φ is preferably 0.006mm to 0.008mm; while when the light-trapping structure 21 is a recessed structure formed on the surface of the substrate, φ is preferably 0.005mm to 0.015mm. When light shines on the surface of the light-trapping layer 2, the randomly distributed light-trapping structures 21 with a diameter φ of 0.005mm to 0.015mm can efficiently act on the light. That is, the structure of this size can effectively capture incident light of different wavelengths, causing the light to undergo multiple reflections inside or between the structures. The reasonable setting of the diameter ensures that the structure is neither too dense nor too coarse. Some light is absorbed by the substrate layer 1 material, and some light intensity is greatly reduced after scattering. Finally, the reflected light escaping from the surface is significantly reduced, thereby achieving a low reflectivity and deep black visual effect. The diameter range, combined with a height of 0.02mm to 0.07mm, a distribution density of 30% to 70%, and a tilt angle of 0° to 10°, works synergistically to form a multi-dimensional optimized optical structure. Its multi-layered light absorption effect is significantly better than traditional textured patterns, resulting in higher blackness.

[0037] In actual production, a simulation experiment was conducted using the light-trapping structure 21 as a protruding structure formed on the surface of the substrate layer 1. The experimental results are shown in Table 1 below. It can be seen that as the height of the light-trapping structure 21 increases, the light absorption rate steadily increases, showing good optical absorption capability. The high-density light-trapping structure 21 further enhances the diffusion effect and improves the light absorption rate. The maximum light absorption rate appears when the height h is 0.03 mm and the ρ is 60%, which is the optimal value.

[0038] Table 1. Simulation Results Data Table:

[0039] Reference Figures 3-5 As shown, this disclosure also provides a surface processing method for manufacturing an electronic device housing in any of the above-described embodiments. The surface processing method includes the following steps: S1. A contour structure 51 is etched on the surface of mold 5. The characteristic parameters of the contour structure 51 are configured to be adjustable through programmed control. S2. Inject plastic material into mold 5 to fill the contour structure 51, so as to form light trapping structure 21 on the surface of the molded electronic device housing.

[0040] In this embodiment, etching the structure on the surface of mold 5 specifically includes: processing the surface of mold 5 using a programmable laser etching device 3 (e.g., a 532nm wavelength solid-state green laser or a 1064nm fiber laser device), controlling the laser power, focal length, etching path, and action time through a preset digital program, and forming a contoured structure 51 on the surface of mold 5 that is complementary to the target light-trapping structure 21. The characteristic parameters of the contoured structure 51 include, but are not limited to, size, depth, distribution density, and tilt angle. The characteristic parameters of the contouring structure 51 are configured to be adjustable through programmatic control. This means that by modifying the parameter instructions in the control program, various characteristic parameters of the contouring structure 51 can be flexibly adjusted. For example, the size (corresponding to the diameter φ of the light-trapping structure 21) can be adjusted to 0.005mm≤φ≤0.015mm; the depth (corresponding to the height h of the light-trapping structure 21) can be adjusted to 0.02mm≤h≤0.07mm; the distribution density (corresponding to the area coverage ρ of the light-trapping structure 21) can be adjusted to 30%≤ρ≤70%; and the tilt angle (corresponding to the angle θ between the central axis of the light-trapping structure 21 and the surface normal of the substrate layer 1) can be adjusted to 0°≤θ≤10°. This programmatic adjustment capability allows the contouring structure 51 to adapt to the appearance requirements of different electronic device housings, realizing the personalized design and stable mass production of the light-trapping structure 21. The injection of plastic material into mold 5 specifically includes: selecting a suitable plastic material for injection molding, such as PC, ABS, or a mixture of PC and ABS, heating it to a molten state, and then injecting it into the cavity of mold 5 under preset injection pressure, temperature, and holding time conditions. Under pressure, the plastic material fills the contour structure 51 on the surface of mold 5. After cooling and solidification, the contour structure 51 on the surface of mold 5 is transferred back to the surface of the plastic shell, forming a light-trapping structure 21 complementary to the contour structure 51. During this process, plastic particles usually cannot completely fill the fine contour structure 51 of mold 5 under varying injection pressure and temperature conditions during injection molding. Therefore, a more diverse and random light-trapping structure 21 morphology is generated on the surface of the molded electronic device shell. This randomness further enhances the scattering and absorption effect of the light-trapping structure 21 on light, giving the molded surface a unique micro-velvety appearance, effectively scattering light, reducing surface reflection, and exhibiting a deep black effect similar to black velvet texture. Therefore, the electronic device housing made by this method does not need to adopt a full-penetration hole design. The deep black effect can be achieved through the surface light-trapping structure 21, avoiding the negative impact on the structural strength, waterproof sealing and heat dissipation performance of the housing, and taking into account both appearance and functional reliability. Compared with black film substrate and other solutions, this method does not require the addition of additional materials. The target effect can be achieved by combining etching of mold 5 and injection molding, which simplifies the process and reduces the overall cost. By programmatically controlling the depth, density, angle and other parameters of the contour structure 51, the formed light-trapping structure 21 can achieve a multi-layered light absorption effect. Its blackness and low reflection performance are significantly better than traditional plowing and biting processes.

[0041] Reference Figure 3 As shown, this disclosure also provides a mold 5 for implementing the surface processing method of the above-described electronic device housing, wherein the cavity surface of the mold 5 is provided with a contour structure 51 corresponding to the light trapping structure 21.

[0042] In this embodiment, the contouring structure 51 and the light-trapping structure 21 are complementary. If the target light-trapping structure 21 is a concave structure, then the contouring structure 51 is a corresponding micro-protrusion; if the target light-trapping structure 21 is a convex structure, then the contouring structure 51 is a corresponding micro-pore. This complementary relationship ensures that after injection molding, the surface of the electronic device housing can accurately replicate the inverse shape of the contouring structure 51 to form the preset light-trapping structure 21. The characteristic parameters of the contouring structure 51 can be designed according to the requirements of the target light-trapping structure 21. These characteristic parameters can be formed on the surface of the mold cavity 5 through a programmed laser etching process, ensuring the accuracy and randomness of the contouring structure 51. The contouring structure 51 is randomly distributed on the surface of the mold cavity 5. This randomness can avoid directional reflection of the light-trapping structure 21 after molding, ensuring uniform scattering and absorption of incident light at different angles, giving the housing surface a unique micro-velvety appearance and exhibiting a deep black effect similar to black velvet texture.

[0043] Reference Figure 6 As shown, this disclosure also provides a surface processing method for manufacturing an electronic device housing in the aforementioned embodiments. The surface processing method includes: etching a light-trapping structure 21 on the surface of the electronic device housing, wherein the characteristic parameters of the light-trapping structure 21 are configured to be adjustable by programmed control.

[0044] In this embodiment, etching the light-trapping structure 21 on the surface of the electronic device housing specifically includes: processing the surface of the shaped electronic device housing using a programmable laser etching device 3; controlling the laser power, focal length, etching path, and action time through a preset digital program to directly form randomly distributed light-trapping structures 21 on the housing surface. The light-trapping structure 21 is a micro-recessed structure that allows the incident light 4 to be reflected and absorbed multiple times, thereby reducing the surface reflectivity. The characteristic parameters of the light-trapping structure 21 are configured to be adjustable through programmable control. This means that by modifying the parameter instructions in the control program, various characteristic parameters of the light-trapping structure 21 can be flexibly adjusted to adapt to different appearance requirements. For example, the diameter φ can be adjusted to 0.005mm≤φ≤0.015mm to meet the performance requirements of high-precision laser machines on the market; the height h can be adjusted to 0.03mm≤h≤0.07mm according to the light absorption requirements; the area coverage ρ can be adjusted to 40≤ρ≤70% according to the requirements of deep black effect and structural strength; and the tilt angle θ can be adjusted to 0°≤θ≤10°.

[0045] Specifically, the etching process of the light-trapping structure 21 includes the following steps: 1. Parameter setting: Based on the target appearance effect, input the characteristic parameters of the light trapping structure 21 in the control program, such as diameter, height, coverage, angle, etc. 2. Positioning and calibration: Fix the electronic device housing on the laser etching platform and calibrate the etching area using a vision positioning system; 3. Laser etching: Start the programmable laser equipment and etch the surface of the shell according to the preset program to form a randomly distributed light trapping structure 21; 4. Inspection and optimization: After etching, the parameters of the light trapping structure 21 are checked by microscope. If necessary, the parameters are fine-tuned by the program for secondary processing to ensure that the appearance meets the standards.

[0046] In summary, this solution utilizes laser engraving of micro-deep holes on the shell surface to disrupt light reflection, avoiding the high gloss issues of traditional texturing. Furthermore, the random distribution of different hole angles and depths is a first-time application. By combining micro-deep holes with random distribution, the gloss limitations of existing plowed-out textures are overcome, resulting in a significantly improved visual effect. The programmability of laser technology is fully utilized in this solution, achieving high flexibility and precision in texture processing. Key parameters such as laser power, hole depth, and dispersion can be adjusted according to product requirements, enabling design freedom. Moreover, this solution has a wide range of applications, suitable for laptops, smart devices, and consumer electronics casings, and enjoys high market demand.

[0047] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this is not limited herein.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0049] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A housing for an electronic device, characterized in that, It includes a substrate layer (1) and a light trapping layer (2) formed on the surface of the substrate layer (1); The light trapping layer (2) has randomly distributed light trapping structures (21), which are at least one of protrusions or depressions, and are configured to cause multiple reflections and absorptions between the light trapping structures (21) when the incident light (4) reaches the light trapping layer (2) through geometric optical effects, so as to reduce the reflectivity of the surface of the electronic device housing.

2. The electronic device housing according to claim 1, characterized in that, The light trapping structure (21) is a protrusion structure formed on the surface of the substrate layer (1), and a gap is formed between two adjacent protrusion structures so that the incident light (4) is reflected multiple times in the gap; The substrate layer (1) and / or the surface of the protruding structure are made of light-absorbing material to absorb incident light (4) after multiple reflections.

3. The electronic device housing according to claim 1, characterized in that, The light trapping structure (21) is a recessed structure formed on the surface of the substrate layer (1), and the incident light (4) is reflected multiple times in each recessed structure; The substrate layer (1) and / or the surface of the recessed structure are made of light-absorbing material to absorb incident light (4) after multiple reflections.

4. The electronic device housing according to claim 1, characterized in that, The light trapping structure (21) is inclined relative to the surface of the substrate layer (1), and the angle θ between its inclined surface and the surface normal of the substrate layer (1) satisfies: 0°≤θ≤10°, so as to guide the incident light (4) into the light trapping structure (21) for multiple reflections.

5. The electronic device housing according to claim 1, characterized in that, The area coverage ρ of the randomly distributed light-trapping structures (21) on the surface of the light-trapping layer 2 satisfies: 30%≤ρ≤70%, so that the incident light ray (4) can fully contact the light-trapping structures (21).

6. The electronic device housing according to claim 1, characterized in that, The height h of the light trapping structure (21) satisfies: 0.02mm≤h≤0.07mm.

7. The electronic device housing according to claim 1, characterized in that, The diameter φ of the light trapping structure (21) satisfies: 0.005mm≤φ≤0.015mm.

8. A surface processing method for manufacturing the housing of any one of claims 1-7, characterized in that, The surface processing method includes: A contoured structure (51) is etched on the surface of the mold (5), and the characteristic parameters of the contoured structure (51) are configured to be adjustable by programmed control. Plastic material is injected into the mold (5) to fill the contour structure (51) and form a light-trapping structure (21) on the surface of the molded electronic device housing.

9. A mold for implementing the surface processing method for an electronic device housing according to claim 8, characterized in that, The cavity surface of the mold (5) is provided with a contour structure (51) corresponding to the light trapping structure (21).

10. A surface processing method for manufacturing the housing of an electronic device according to any one of claims 1-7, characterized in that, The surface processing method includes etching a light-trapping structure (21) on the surface of an electronic device housing, wherein the characteristic parameters of the light-trapping structure (21) are configured to be adjustable via programmed control.

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