Backboard-free stacked general high-speed interconnection product physical architecture
By employing a backplane-less stacked universal high-speed interconnect physical architecture, and utilizing surface elastic contact connectors and modular support frame design, the challenges of avionics products in terms of universality, modularity, and lightweighting have been addressed. This has enabled high-bandwidth signal transmission and lightweighting, thereby enhancing the computing power and combat effectiveness of low-altitude aircraft such as UAVs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-16
- Publication Date
- 2026-03-27
AI Technical Summary
Existing avionics products face challenges in achieving universality, modularity, and lightweight design, especially in low-altitude aircraft such as drones, where it is difficult to balance the expansion of high-speed computing resources with the cost reduction of interconnection processes.
It adopts a backplane-less stacked universal high-speed interconnect physical architecture, utilizes surface elastic contact connectors and module support frame design to achieve high-bandwidth signal transmission between modules, and optimizes signal paths through single-board signal shifting methods to reduce backplane switching processes.
It achieves lightweight and high-bandwidth interconnection of avionics products, improves computing power, reduces weight and cost, and supports seamless combination of various modules, thereby enhancing combat capabilities.
Smart Images
Figure CN121751547A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the field of interconnection mode between functional modules of avionics products, and relates to a backboard-free stacked general high-speed interconnection product physical architecture. BACKGROUND
[0002] In the contemporary society, a large number of unmanned aerial vehicles and other advanced equipment play a key role in performing complex topography search tasks, pinpoint attack tasks, random search tasks and other fine air operations. Such low-altitude flying vehicles need to be tailored in size, weight and power consumption to meet the overall requirements of flexible flight and low cost, while also taking into account the expansion of a large number of computing resources brought about by intelligentization and controllability. In addition, in the development process of avionics products, generalization, modularization and lightweight have always been the goal of product design, and the realization of rapid local product iteration, barrier-free combination of various types of modules and sharing of computing resources can effectively improve the combat capability of targeted tasks in local wars. SUMMARY
[0003] The present application aims to provide a backboard-free stacked general high-speed interconnection product physical architecture, which aims to be general, modular and lightweight, uses advanced interconnection methods to construct a high-bandwidth internal bus to meet the demand for high-speed computing resources, uses tailoring of the backboard to reduce the interconnection process to achieve the goal of lightweight and low cost, and standardizes the internal bus interconnection of functional modules to achieve the goal of general interface. On the basis of this physical architecture, an operating system platform can be further built to weaken the functional properties of the modules and strengthen the computing resource properties of the modules, further achieving the goals of generalization and modularization.
[0004] The present application achieves the above-mentioned purpose by the following technical solutions:
[0005] A backboard-free stacked general high-speed interconnection product physical architecture is formed by stacking and interconnecting a plurality of modules to form a whole chassis; wherein a single module comprises a fastening structure 1, a printed circuit board 2 and a signal interconnection connector 3, the signal interconnection connector 3 and the printed circuit board 2 are fastened on the fastening structure 1, the signal interconnection connector adopts a surface elastic contact connector, the contacts on one side of the signal interconnection connector are in contact with the corresponding signal points of the printed circuit board, and the contacts on the other side of the signal interconnection connector are in contact with the corresponding signal points of the printed circuit board on the adjacent module.
[0006] Preferably, the fastening structure 1 comprises a module support frame 4 and a side edge locking device 6.
[0007] One side of the module support frame 4 is used to mount the printed circuit board 2 and the signal interconnection connector 3, and the side edge locking device 6 is used to lock and unlock between modules on the side edge of the module support frame 4.
[0008] Preferably, heat dissipation fins 7 are provided on the side of the module support frame 4, and heat dissipation protrusions are designed according to the printed circuit board 2.
[0009] Preferably, the other side of the module support frame is used to install the daughter card, and a window is opened on the module support frame for interconnection between the daughter card and the printed circuit board 2.
[0010] Preferably, the fastening structure 1 on the side of the module stacking contact surface where the signal interconnect connector 3 is mounted should be designed with a sealing strip groove, in which a conductive sealing strip of the corresponding specification is embedded, and the fastening structure 1 on the other side of the module stacking contact surface where the signal interconnect connector 3 is mounted is a smooth conductive plane.
[0011] Preferably, when the module takes signals, it takes signals in whole rows or columns as the smallest unit.
[0012] Preferably, a single-board signal shifting method is used to map the front signals of the printed circuit board to the back, and then the back signals are transmitted to the front of the adjacent printed circuit board through a signal interconnect connector. The single-board signal shifting method is to use the bottom row of signals on the front of the printed circuit board to map the second row of signals from the bottom of the front to the bottom row of signals on the back of the printed circuit board, and at the same time, map the third row of signals from the bottom to the second row of signals from the bottom of the back of the printed circuit board, and so on. Meanwhile, the top row of signals on the back is missing, and the module provides similar signals to fill the gap.
[0013] Preferably, when designing printed circuit boards and signal interconnect connectors, the impedance of the entire signal transmission path should be controlled within 5% of the target impedance; when performing a single signal mapping using the single-board signal shifting method, the insertion loss of the entire signal transmission path should be linear below 16GHz and not greater than 6dB; when performing four or fewer signal mappings using the single-board signal shifting method, the insertion loss of the entire signal transmission path should be linear below 8GHz and not greater than 6dB.
[0014] Compared to traditional ATR and MCU products with similar functions, this invention significantly reduces size and weight. Furthermore, by eliminating the backplane transition process, the overall internal bus bandwidth is greatly increased. Applying this product to aircraft can further reduce the overall weight of the aircraft while improving computing power, possessing significant value and application prospects for enhancing the combat capabilities of aviation equipment. Simultaneously, this invention can also be extended to industries such as automotive electronics and the low-altitude economy. In the field of consumer electronics, the lightweight, high bandwidth, and high spatial adaptability of this invention can be diversified according to actual product forms, increasing utilization and offering broad market prospects. Attached Figure Description
[0015] Figure 1 This is a schematic diagram illustrating an example of the present invention;
[0016] Figure 2 This is a schematic diagram of the instance stacking implementation method of the present invention;
[0017] Figure 3 This is a schematic diagram illustrating the signal acquisition and shifting principles of the present invention. Detailed Implementation
[0018] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.
[0019] This embodiment illustrates a backplane-less stacked general-purpose high-speed interconnect physical architecture. Aiming for generalization, modularity, and lightweight design, it utilizes advanced interconnect methods to construct high-bandwidth internal buses to meet the demands of high-speed computing resources. By reducing the interconnect process through backplane trimming, it achieves lightweight and low-cost design. Furthermore, it standardizes the layout of internal bus interconnects within functional modules to achieve universal interfaces.
[0020] See Figure 2 As shown in the figure, the physical architecture of the backplane-less stacked universal high-speed interconnect product shown in this embodiment is formed by stacking and interconnecting three modules to form a whole chassis. It presents a uniform shape in appearance and meets the design requirements of flat and beautiful appearance and uniform color.
[0021] See Figure 1 As shown, a single module includes a fastening structure 1, a printed circuit board 2, and a signal interconnect connector 3.
[0022] The fastening structural component 1 includes a module support frame 4, 11 printed circuit board fastening screw positions 5, and a side locking device 6, which meets the requirements of a simplified structural design.
[0023] One side of the module support frame is used to install the printed circuit board 2 and the signal interconnection connector 3. The side of the module support frame is provided with heat dissipation fins 7, and heat dissipation protrusions are designed according to the printed circuit board 2 to meet the heat dissipation requirements of the printed circuit board.
[0024] The other side of the module support frame is used to install the daughter card. A window is opened on the module support frame for interconnection between the daughter card and the printed circuit board 2. The daughter card and the printed circuit board 2 share the support frame as a heat conduction structure to meet the design requirements for daughter card assembly.
[0025] The side locking device on the side of the module support frame is a lateral pressure locking device, which meets the locking method design requirements. When multiple modules are cascaded, simply unlock the lateral pressure locking device of the module to be removed to remove the target module. No modifications are required for the remaining modules, which meets the design requirements for a rapid installation method.
[0026] The overall installation method for a single module is as follows: the printed circuit board 2 is tightly installed to one side of the module support frame using 11 PCB fastening screws. The top three screws and bottom three screws also serve to securely install the signal interconnect connector 3 to the fastening structure 1. The printed circuit board 2 is located between the signal interconnect connector 3 and the module support frame 1. If the module has a daughter card, the daughter card needs to be installed on the other side of the module support frame and interconnected with the printed circuit board 2 through a window designed on the module support frame (the connector is customizable, requiring a mating height of no more than 8 mm). Multiple modules assembled as described above are stacked and secured using a side locking device. Except for the heat dissipation boss, which needs adjustment according to the corresponding printed circuit board, the dimensions of all module support frames remain consistent.
[0027] On the fastening structure 1 on the side of the module stacking mounting contact surface where the signal interconnect connector 3 is mounted, a sealing strip groove should be designed, with a conductive sealing strip of the corresponding specification embedded inside, to meet the sealing design requirements. On the other side of the module stacking mounting contact surface where the signal interconnect connector 3 is mounted, the fastening structure 1 should be a smooth conductive plane.
[0028] The signal interconnect connector 3 uses the printed circuit board fastening screws on the upper and lower short sides as a fixing device, and arranges the signals using the gaps between the screws to meet the placement design requirements of the signal interconnect connector.
[0029] The signal interconnect connector adopts a surface elastic contact connector, which meets the selection characteristics and requirements of signal interconnect connector.
[0030] The signal interconnect connector and the printed circuit board are fastened to the module support frame with screws. At this time, the contacts on one side of the signal interconnect connector are in contact with the corresponding signal points on the printed circuit board and conduct. Adjacent modules are stacked and locked together by a lateral pressure locking device. At this time, the contacts on the other side of the signal interconnect connector are in contact with the corresponding signal points on the printed circuit board of the adjacent module and conduct. The two modules form a high-speed and reliable signal channel through the signal interconnect connector, which meets the design requirements for signal communication between adjacent modules.
[0031] In this embodiment, the single connector is divided into two areas, each containing 4 rows and 24 columns of signal arrangement. Each row is set with 8 pairs of differential signals and 8 signal loops, and each row is an 8-port bus signal channel, which meets the design requirements of the shift signal conflict avoidance method.
[0032] When the module retrieves signals, it will retrieve signals in whole rows or columns as the smallest unit, which meets the design requirements of the shift signal retrieval method.
[0033] During single-board signal shifting, the module takes the bottom row of signals from the front of the printed circuit board (PCB), maps the second row of signals from the bottom down to the bottom row of signals on the back of the PCB, and simultaneously maps the third row of signals from the bottom down to the second row of signals on the back of the PCB, and so on. Meanwhile, the top row of signals on the back is missing, and the module provides similar signals to fill the gap. The two mapping points are interconnected through vias on the PCB, achieving the purpose of shifting the front signal channel to the adjacent back signal channel, thus meeting the design requirements of the shifted signal supplementation method.
[0034] The following content is based on Figure 3 The schematic single-board signal shifting design method is described in detail.
[0035] The signal position of channel 1 on the left side of module D is connected to the signal position of channel 2 on the right side of module D through a single-board shifting method, which meets the design requirements of the single-board signal shifting method.
[0036] When module A and module B transmit data, the impedance of the entire signal transmission path must be controlled within 5% of the target impedance. When performing a single signal mapping using the single-board signal shifting method, the insertion loss of the entire signal transmission path must be linear below 16 GHz and not exceed 6 dB. When performing four or fewer signal mappings using the single-board signal shifting method, the insertion loss of the entire signal transmission path must be linear below 8 GHz and not exceed 6 dB, meeting the signal integrity design requirements for the shifted signal.
[0037] It is understood that those skilled in the art can make equivalent substitutions or modifications to the technical solution and inventive concept of the present invention, and all such substitutions or modifications should fall within the protection scope of the appended claims.
Claims
1. A backplane-less stacked universal high-speed interconnect physical architecture, comprising several modules stacked and interconnected to form a chassis, characterized in that... A single module includes a fastening structure (1), a printed circuit board (2), and a signal interconnection connector (3). The signal interconnection connector (3) is fastened to the printed circuit board (2) on the fastening structure (1). The signal interconnection connector (3) is a surface elastic contact connector. The contact on one side of the signal interconnection connector is in contact with the corresponding signal point on the printed circuit board, and the contact on the other side of the signal interconnection connector is in contact with the corresponding signal point on the printed circuit board of the adjacent module.
2. The physical architecture of a backplane-less stacked universal high-speed interconnect product according to claim 1, characterized in that... The fastening structural component (1) includes a module support frame (4) and a side locking device (6); One side of the module support frame (4) is used to install the printed circuit board (2) and the signal interconnection connector (3), and the side locking device (6) performs locking and unlocking between modules on the side of the module support frame (4).
3. The physical architecture of a backplane-less stacked universal high-speed interconnect product according to claim 2, characterized in that... The module support frame (4) has heat dissipation fins (7) on its side, and heat dissipation bosses are designed according to the printed circuit board (2).
4. The physical architecture of a backplane-less stacked universal high-speed interconnect product according to claim 2, characterized in that... The other side of the module support frame (4) is used to install the daughter card, and the window on the module support frame is used for interconnection between the daughter card and the printed circuit board (2).
5. The physical architecture of a backplane-less stacked universal high-speed interconnect product according to claim 1, characterized in that... On the fastening structure (1) on the side of the module stacking mounting contact surface where the signal interconnect connector (3) is mounted, a sealing strip groove is designed, with a conductive sealing strip of the corresponding specification embedded inside. On the fastening structure (1) on the other side of the module stacking mounting contact surface where the signal interconnect connector (3) is mounted, there is a smooth conductive plane.
6. The physical architecture of a backplane-less stacked universal high-speed interconnect product according to claim 1, characterized in that... When the module retrieves signals, it retrieves signals in whole rows or columns as the smallest unit.
7. The physical architecture of a backplane-less stacked universal high-speed interconnect product according to claim 1, characterized in that... A single-board signal shifting method is used to map the signals on the front side of the printed circuit board to the back side. Then, the signals on the back side are transmitted to the front side of the adjacent printed circuit board through a signal interconnect connector. The single-board signal shifting method is to use the bottom row of signals on the front side of the printed circuit board to map the second row of signals from the bottom of the front side to the bottom row of signals on the back side of the printed circuit board. At the same time, the third row of signals from the bottom row is mapped to the second row of signals from the bottom of the back side of the printed circuit board, and so on. Meanwhile, the top row of signals on the back side is missing, and the module provides similar signals to fill the gap.
8. The physical architecture of a backplane-less stacked universal high-speed interconnect product according to claim 7, characterized in that... When designing printed circuit boards and signal interconnect connectors, the impedance of the entire signal transmission path must be controlled within 5% of the target impedance. When performing a single signal mapping using the single-board signal shifting method, the insertion loss of the entire signal transmission path must be linear below 16GHz and not greater than 6dB. When performing four or fewer signal mappings using the single-board signal shifting method, the insertion loss of the entire signal transmission path must be linear below 8GHz and not greater than 6dB.