Heat exchange module and electronic equipment

Abstract

The invention discloses a heat exchange module and electronic equipment, and relates to the technical field of heat dissipation, the heat exchange module comprises a shell, a working medium and a micropump, a flow channel is arranged in the shell, the visible light transmittance of at least part of the area of the shell is larger than or equal to a threshold value, the working medium is filled in the flow channel, and the micropump is arranged in the shell. The working medium comprises a single medium and a fluorescent dye dissolved or dispersed in the medium, the mass fraction of the fluorescent dye in the working medium is 0.1%-10%, the micropump is arranged in the shell, the micropump is communicated with the flow channel, and the micropump is used for driving the working medium to flow in the flow channel. The heat exchange module not only has better heat dissipation performance, but also enables the working medium to have a flow visualization effect, and can improve the display effect and the sense of science and technology of a product.

Description

Technical Field

[0001] This invention relates to the field of heat exchange technology, and in particular to a heat exchange module and an electronic device using the heat exchange module. Background Technology

[0002] With the development of AI technology, chip power consumption is constantly increasing, and heat dissipation efficiency has become a core bottleneck restricting the release of hardware performance. In the space-constrained consumer electronics field, active cooling has become the evolution direction of next-generation heat dissipation technology, thus liquid cooling modules have emerged.

[0003] The working fluid in a liquid-cooled module serves as the medium for the interconversion of thermal and mechanical energy. The pump acts as the power source for the working fluid, providing power for its flow. During its flow, the working fluid acts as a heat transfer medium, enabling the liquid-cooled module to achieve heat dissipation.

[0004] In recent years, it has become possible to visualize the flow of working fluids, creating a technologically advanced flow display area. The disclosed technologies for visually visualized working fluids include two liquid working fluids forming a liquid interface. This design allows for a visual representation of the fluid's flow process. However, the visual effects presented by these solutions are relatively poor, and they do not strongly convey a sense of technology to the product. Summary of the Invention

[0005] The main objective of this invention is to provide a heat exchange module and electronic device that addresses the problem of poor visibility of the working fluid flow in existing liquid cooling modules. The heat exchange module provided by this invention not only has superior heat dissipation but also provides a visible flow of the working fluid, enhancing the product's appearance and technological appeal.

[0006] To achieve the above objectives, the present invention proposes a heat exchange module, the heat exchange module comprising: A housing having a flow channel inside, wherein the visible light transmittance of at least a portion of the housing is greater than or equal to a threshold. A working fluid, the working fluid filling the flow channel, the working fluid comprising a single medium and a fluorescent dye dissolved or dispersed in the medium, the fluorescent dye having a mass fraction of 0.1% to 10% in the working fluid; and A micropump is disposed in the housing and communicates with the flow channel. The micropump is used to drive the working fluid to flow in the flow channel.

[0007] In one embodiment, the fluorescent dye includes at least one of fluorescein, fluorescent whitening agent, acridine, naphthalimide, rare earth doped oxide, quantum dot, sulfide, luciferase, and fluorescent protein.

[0008] In one embodiment, the surface of the rare earth-doped oxide is coated with a hydrophilic resin or the surface of the rare earth-doped oxide is hydroxylated. Alternatively, the surface of the rare earth-doped oxide may be modified by coating with hydrophobic silanes or long-chain alkyl groups.

[0009] In one embodiment, the quantum dot is a semiconductor nanocrystal, and the size of the quantum dot is 1 nm to 10 nm; And / or, the surface of the quantum dots is coated with carboxyl hydrophilic ligands or amino hydrophilic ligands; or, the surface of the quantum dots is coated with perfluoroalkyl ligands; or, the surface of the quantum dots is coated with oleic acid hydrophobic ligands or octadecylamine hydrophobic ligands.

[0010] In one embodiment, the fluorescent whitening agent, after sulfonation modification, contains a sodium sulfonate hydrophilic group; And / or, the sulfides are modified with hydrophobic surfactants.

[0011] In one embodiment, the medium includes one of water, fluorinated liquid, alcohol, and alkane.

[0012] In one embodiment, the housing includes an intermediate layer and cover plates disposed on opposite sides of the intermediate layer. The intermediate layer is provided with a flow channel groove, and the cover plates and the flow channel groove enclose each other to form a flow channel. The visible light transmittance of at least one of the cover plates is greater than or equal to a threshold. The cover plate is provided with a first inlet and a first outlet that connect to the flow channel, and the micropump is provided with a second inlet and a second outlet. The micropump is located in the housing so that the first inlet is connected to the second outlet and the first outlet is connected to the second inlet.

[0013] In one embodiment, the intermediate layer includes a liquid cooling layer and adhesive layers disposed on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers on both sides together form the sidewall of the flow channel groove. The cover plate is sealed to the liquid cooling layer through the adhesive layers. Wherein, along the thickness direction of the shell, the edge of the adhesive layer is flush with the edge of the liquid cooling layer; and / or, the adhesive layer includes at least one adhesive layer; wherein, the adhesive layer is formed by dispensing or screen printing; and / or, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive; and / or, the thickness of the adhesive layer ranges from 0.001 mm to 0.05 mm; and / or, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

[0014] In one embodiment, the cover plate is a single-layer structure or a multi-layer structure; And / or, the cover plate includes at least one of a modified polymer material layer and a metal layer; wherein the modified polymer material layer is formed by processing a polymer material layer through any one of plasma processing, radiation modification processing, mechanical processing, plating processing, surface grafting polymerization processing, chemical etching processing, and coupling agent processing, and the water vapor transmission rate of the modified polymer material layer is ≤0.01 g / (m²). 2 •24h), the polymer material layer is made of a transparent material, which includes at least one of the following: polyethylene terephthalate, polyethylene naphthalate, polypropylene, cyclic olefin copolymers, polytetramethylpentene, polyimide, polymethyl methacrylate, polyphenylene sulfide, polyetheretherketone, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, and butadiene-styrene copolymer.

[0015] The present invention also proposes an electronic device, which includes the heat exchange module described above.

[0016] The heat exchange module of this invention provides a flow channel within the housing, thus creating a flow path / space for the working fluid. The working fluid acts as a heat transfer carrier. Simultaneously, a micropump is connected to the flow channel, providing the flow power for the working fluid within the channel. Under the action of the micropump, the working fluid moves along the flow channel, allowing it to act as a heat transfer medium and enabling the heat exchange module to achieve heat dissipation. Furthermore, by setting the working fluid as a single medium and a fluorescent dye, the fluorescent dye... The mass fraction of the dye in the working fluid is between 0.1% and 10%. This setting simplifies the composition of the working fluid. When the working fluid moves relative to the flow channel, the working fluid containing fluorescent dye will move relative to the flow channel used to contain the working fluid, resulting in diverse flow visualization effects. At the same time, the visible light transmittance of at least a portion of the shell is greater than or equal to the threshold, so that the flow visualization effect of the working fluid can be displayed through the shell in that area. In other words, the heat exchange module can achieve diverse visualization effects, thereby improving the appearance and technological feel of the product. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the heat exchange module provided by the present invention; Figure 2 This is a cross-sectional schematic diagram of an embodiment of the heat exchange module provided by the present invention; Figure 3 This is an exploded view of an embodiment of the heat exchange module provided by the present invention; Figure 4 A cross-sectional schematic diagram of an embodiment of the housing provided by the present invention; Figure 5 A cross-sectional schematic diagram of another embodiment of the housing provided by the present invention; Figure 6 This is a cross-sectional schematic diagram of another embodiment of the housing provided by the present invention.

[0019] Explanation of icon numbers: 100. Heat exchange module; 1. Shell; 11. Cover plate; 111. First cover plate; 112. Second cover plate; 113. First inlet; 114. First outlet; 115. Modified polymer material layer; 116. Metal layer; 12. Intermediate layer; 121. Flow channel; 122. Liquid cooling layer; 123. Adhesive layer; 13. Flow channel; 2. Micro pump; 21. Second inlet; 22. Second outlet.

[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0023] Meanwhile, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three options. Taking "A and / or B" as an example, it includes option A, option B, or an option that satisfies both A and B.

[0024] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0025] This invention proposes a heat exchange module 100. It is understood that the heat exchange module 100 can be applied to electronic devices such as mobile phones, tablets, laptops, VR (Virtual Reality) products, AR (Augmented Reality) products, watches, and wearable devices, and is not limited thereto.

[0026] Please refer to the reference. Figures 1 to 6 As shown, in this embodiment of the invention, the heat exchange module 100 includes a housing 1, a working fluid, and a micropump 2. The housing 1 is provided with a flow channel 13. The visible light transmittance of at least a portion of the housing 1 is greater than or equal to a threshold. The working fluid is filled in the flow channel 13. The working fluid includes a single medium and fluorescent dyes dissolved or dispersed in the medium. The mass fraction of the fluorescent dyes in the working fluid is 0.1% to 10%. The micropump 2 is disposed in the housing 1 and is connected to the flow channel 13. The micropump 2 is used to drive the working fluid to flow in the flow channel 13.

[0027] In this embodiment, the heat exchange module 100 is applied in an electronic device, which can remove the heat generated by the heating element inside the electronic device to achieve a cooling effect, thereby realizing the control of the temperature of the heating element. The housing 1 of the heat exchange module 100 has a flow channel 13 inside, and the working fluid is filled in the flow channel 13 of the housing 1. The working fluid can serve as a heat transfer carrier, and the flow channel 13 provides a flow path / place for the flow of the working fluid.

[0028] Understandably, the micropump 2 is connected to the flow channel 13 of the housing 1, and the micropump 2 can provide the flow power for the working fluid in the flow channel 13. Under the action of the micropump 2, the working fluid in the flow channel 13 of the housing 1 moves along the flow channel 13, so that the working fluid can act as a medium for heat transfer during the flow process, enabling the heat exchange module 100 to achieve the function of heat dissipation.

[0029] In this embodiment, by setting the visible light transmittance of at least a portion of the housing 1 to be greater than or equal to a threshold, the visualization effect of the working fluid flow can be displayed through that portion of the housing 1, meaning the heat exchange module 100 can achieve a visualization effect. It should be noted that the visible light transmittance mentioned in this embodiment is the ratio of the radiant energy projected and transmitted through an object to the total radiant energy projected onto the object. Optionally, the threshold can be 70%, 80%, 90%, etc., and is not limited here.

[0030] Understandably, the heat dissipation performance mentioned in this embodiment can be understood as the amount of heat absorbed or released by the working fluid when changing its temperature per unit. The better the heat dissipation performance of the working fluid, the more heat it absorbs or releases when changing its temperature per unit, and the more significant the temperature control effect of the working fluid.

[0031] Optionally, the micropump 2 can be a miniature piezoelectric hydraulic pump. Miniature piezoelectric hydraulic pumps have an amplitude ≤50µm and are characterized by their ultra-thin design, small size, simple structure, high pressure and low flow rate, absence of electromagnetic interference, and low operating noise. They can achieve precise fluid transport and control, making them particularly suitable for electronic devices such as mobile phones, watches, and accessories. Of course, in other embodiments, the micropump 2 can also be an electrostatic micropump; the specific structure is based on existing technology and is not limited here.

[0032] It should be noted that the relevant technology visualizes the flow of the working fluid, enabling a technologically advanced flow display area. This flow display area can serve to identify components or enhance the aesthetics of the casing, thereby improving the user experience of electronic devices. Currently, the disclosed technologies for visually displaying the flow state of the working fluid involve two liquid working fluids forming a liquid interface. This design allows for a visually apparent flow process. However, the visual effect presented by this solution is relatively poor, and it doesn't strongly convey a sense of technological sophistication to the product.

[0033] In this embodiment, the working fluid is set as a single medium and a fluorescent dye, with the mass fraction of the fluorescent dye in the working fluid ranging from 0.1% to 10%. This configuration simplifies the composition of the working fluid, and as the working fluid moves relative to the flow channel 13, the working fluid containing the fluorescent dye moves relative to the flow channel 13, resulting in diverse flow visualization effects. The working fluid is placed within the flow channel 13 of the housing 1, and at least a portion of the housing 1 has a visible light transmittance greater than or equal to a threshold, allowing the flow visualization effect of the working fluid to be displayed through this area. This means the heat exchange module 100 can achieve diverse visualization effects. Simultaneously, during the flow process, the working fluid acts as a heat transfer medium, enabling the liquid cooling component to dissipate heat. In this embodiment, using dyes and working fluids with different appearances can achieve colorful display and flow visualization effects, thereby enhancing the product's appearance and technological appeal.

[0034] Understandably, the working fluid medium has excellent heat dissipation properties, ensuring good temperature control; on the other hand, as a solvent for fluorescent dyes, it allows the dyes to dissolve or disperse, thus ensuring the flow visualization function of the working fluid. It should be noted that no specific limitation is made on the type of medium; any medium with excellent heat dissipation properties and capable of dissolving or dispersing fluorescent dyes can be used as a medium in the embodiments of this application, and no limitation is imposed here.

[0035] Optionally, the medium includes one of water, fluorinated liquid, alcohol, and alkanes. Water (H2O), fluorinated liquid, alcohol, and alkanes have better heat dissipation performance, ensuring that the working fluid can achieve better temperature control. In this embodiment, alcohols may optionally include at least one of methanol, ethanol, ethylene glycol, glycerol, and propylene glycol. Fluorinated liquids may optionally include at least one of perfluorocarbon compounds, perfluoropolyethers, hydrofluoroethers, and hydrofluorocarbons, and are not limited thereto.

[0036] Of course, in other embodiments, the medium may also include a water-soluble salt, and the solution formed by the water-soluble salt and water (the medium) can be called a salt solution. The salt solution may include anions and cations, both of which have strong hydrophilic properties, allowing anions to form hydrated anions with H2O and cations to form hydrated cations with H2O. In other words, H2O tends to combine with cations / anions.

[0037] In one embodiment, the fluorescent dyes include at least one of fluorescein, fluorescent whitening agents, acridine, naphthalimide, rare earth doped oxides, quantum dots, sulfides, luciferase, and fluorescent proteins.

[0038] In this embodiment, fluorescein, fluorescent whitening agents, acridine derivatives, rare earth doped oxides, quantum dots, luciferase, and fluorescent proteins are water-soluble fluorescent dyes. When the medium is water or alcohol, the water-soluble fluorescent dyes can dissolve or disperse in the medium, thereby giving the working fluid color and a large color contrast, allowing the working fluid to have a significant flow visualization effect.

[0039] Understandably, fluorescein molecules contain multiple hydrophilic groups such as carboxyl and hydroxyl groups, making them directly soluble in water, such as sodium fluorescein. Fluorescent whitening agents, after sulfonation modification, contain sodium sulfonate hydrophilic groups and exhibit good water solubility. Most commercially available fluorescent whitening agents (such as stilbene biphenyls) are used, and no specific type is specified here. Acridine derivatives can include acridine orange, etc. Pure rare earth-doped oxides (such as Y₂O₃:Eu³) + Gd2O3:Tb³ + The quantum dots are insoluble in water. Optionally, the surface of the rare earth-doped oxide is coated with a hydrophilic resin, or the surface of the rare earth-doped oxide is hydroxylated to form an aqueous dispersion. Optionally, the quantum dots are semiconductor nanocrystals. The size of the quantum dots is 1 nm to 10 nm. In this embodiment, the surface of the quantum dots is coated with carboxyl hydrophilic ligands or amino hydrophilic ligands, and can be directly dispersed in water, such as hydrophilic modified versions of CdSe, ZnS, and InP quantum dots. Luciferase and fluorescent proteins are biological macromolecules containing a large number of hydrophilic amino acid residues, and can be directly soluble in water or buffer solutions.

[0040] Of course, quantum dots are coated with perfluoroalkyl ligands, which can dissolve in fluorinated liquids and maintain fluorescence properties, such as fluorinated CdSe and ZnS quantum dots, and are not limited here.

[0041] In this embodiment, naphthalimide derivatives, rare earth-doped oxides, quantum dots, and sulfides are soluble in alkanes while maintaining their fluorescence properties. It is understood that pure rare earth-doped oxides are insoluble in alkanes; alternatively, the surface of rare earth-doped oxides can be modified by coating with hydrophobic silanes or long-chain alkyl groups to achieve stable dispersion in alkanes. Quantum dots coated with oleic acid hydrophobic ligands or octadecylamine hydrophobic ligands form oil-soluble quantum dots, which can be directly dissolved in alkanes, such as conventional CdSe and ZnS oil-soluble types, which are not limited here. Sulfides, after modification with hydrophobic surfactants, can be dispersed in alkanes, such as ZnS:Cu². + CdS, etc., are not limited here.

[0042] In one embodiment, the housing 1 includes an intermediate layer 12 and cover plates 11 disposed on opposite sides of the intermediate layer 12. The intermediate layer 12 is provided with a flow channel groove 121. The cover plates 11 and the flow channel groove 121 enclose each other to form a flow channel 13. The visible light transmittance of at least one cover plate 11 is greater than or equal to a threshold.

[0043] In this embodiment, as Figures 2 to 6As shown, the cover plate 11 of the housing 1 includes two covers, namely the first cover plate 111 and the second cover plate 112. That is, the first cover plate 111, the intermediate layer 12 and the second cover plate 112 are stacked in sequence, and the intermediate layer 12 is sandwiched between the first cover plate 111 and the second cover plate 112, so that the first cover plate 111 and the second cover plate 112 on both sides can support and protect the intermediate layer 12.

[0044] Understandably, the intermediate layer 12 has a flow channel 121. The flow channel 121 can be a groove structure, in which case the cover plate 11 covering the groove structure and the intermediate layer 12 enclose each other to form a flow channel 13; or, the flow channel 121 can also be a through-slot structure, in which case the flow channel 121 extends through the intermediate layer 12 along its thickness direction, and the two cover plates 11 (i.e., the first cover plate 111 and the second cover plate 112) and the intermediate layer 12 enclose each other to form a flow channel 13. This allows the working fluid to flow smoothly in the flow channel 13 at the flow channel 121 and to fully contact the liquid cooling layer 122, thereby achieving efficient heat conduction.

[0045] In this embodiment, the flow channel 121 is a through-slot disposed on the intermediate layer 12, which simplifies the process of creating the flow channel 121. Depending on the actual design, the shape of the flow channel 121 may include, but is not limited to, straight, serpentine, and spiral shapes to optimize the flow path of the working fluid and heat exchange efficiency. Corresponding connectors or interfaces can also be provided at the inlet and outlet of the flow channel 13 to facilitate connection with external heat exchange systems such as micropumps and radiators, forming a complete heat exchange cycle.

[0046] Of course, in other embodiments, the housing 1 may also be configured to include only two cover plates 11 (i.e., a first cover plate 111 and a second cover plate 112), with at least one of the opposing surfaces of the two cover plates 11 recessed to form a flow channel groove 121, such that the other cover plate 11 cooperates with the flow channel groove 121 or the two flow channel grooves 121 to form a flow channel 13, etc., which is not limited here. It is understood that the flow channel groove 121 can be formed by machining, mold processing or etching process, which is not limited here.

[0047] It should be noted that the structural design of the heat exchange module 100 in the above embodiments is only exemplary. In other embodiments, the structural design of the shell 1 can be diversified. As long as the working fluid scheme of the present invention is adopted, it is within the protection scope of the present invention.

[0048] In one embodiment, the cover plate 11 is provided with a first inlet 113 and a first outlet 114 that connects to the flow channel 13, and the micro pump 2 is provided with a second inlet 21 and a second outlet 22. The micro pump 2 is disposed in the housing 1 so that the first inlet 113 is connected to the second outlet 22 and the first outlet 114 is connected to the second inlet 21.

[0049] In this embodiment, as Figure 2 and Figure 3 As shown, the micropump 2 can be a micropump, which may include a pump base and a piezoelectric component connected to the pump base. The pump base is provided with a second inlet 21 and a second outlet 22. The housing 1 is provided with a first outlet 114 and a first inlet 113. The first outlet 114 is used to communicate with the second inlet 21, and the first inlet 113 is used to communicate with the second outlet 22.

[0050] Understandably, the portion of the housing 1 surrounding the first outlet 114 and the portion of the pump base surrounding the second inlet 21 form a sealed structure to achieve communication between the first outlet 114 and the second inlet 21. The portion of the housing 1 surrounding the first inlet 113 and the portion of the pump base surrounding the second outlet 22 form a sealed structure to achieve communication between the first inlet 113 and the second outlet 22, that is, to achieve communication between the flow channel 13 of the pump base and the housing 1.

[0051] It should be noted that the first outlet 114 is used to connect with the second inlet 21, but this does not mean that the first outlet 114 and the second inlet 21 are always connected. It only indicates that under certain conditions, the working medium can flow from the first outlet 114 into the second inlet 21. The relationship between the first inlet 113 and the second outlet 22 is similar.

[0052] In this embodiment, the micropump 2 (pump base) of the heat exchange module 100 is connected to the flow channel 13 inside the housing 1. The micropump 2 can serve as a power source to provide the flow power for the working fluid in the flow channel 13 of the housing 1. During the flow process, the working fluid can serve as a medium for heat transfer, enabling the housing 1 to achieve a sustained heat dissipation effect.

[0053] It is understandable that the portion of the housing 1 around the first outlet 114 and the portion of the pump base around the second inlet 21 are integrated structures, and the portion of the housing 1 around the first inlet 113 and the portion of the pump base around the second outlet 22 are integrated structures.

[0054] Of course, in other embodiments, the partial housing 1 around the first outlet 114 and the partial pump base around the second inlet 21 are separate structures. The partial housing 1 around the first outlet 114 and the partial pump base around the second inlet 21 can be connected by methods such as high-temperature adhesive bonding, UV-cured adhesive bonding, thermocompression bonding, hot melt welding, ultrasonic welding, ultra-frequency welding, and diffusion welding. Similarly, the partial housing 1 around the first inlet 113 and the partial pump base around the second outlet 22 can be separate structures, and the partial housing 1 around the first inlet 113 and the partial pump base around the second outlet 22 can be connected by the methods described above.

[0055] In one embodiment, the intermediate layer 12 includes at least one liquid cooling layer 122. The liquid cooling layer 122 is disposed between the first cover plate 111 and the second cover plate 112 for supporting the first cover plate 111 and the second cover plate 112.

[0056] In this embodiment, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be an integrated structure. This ensures that the flow channel 13 formed by the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 has a better sealing effect, preventing leakage (working fluid) problems. Optionally, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can all be made of transparent materials, so that the heat exchange module 100 can achieve a visible flow effect.

[0057] Of course, in other embodiments, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be separate structures. The first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be connected by means of high-temperature adhesive bonding, UV adhesive light-curing bonding, hot-press bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding for sealing.

[0058] In one embodiment, the intermediate layer 12 includes a liquid cooling layer 122 and adhesive layers 123 disposed on both sides of the liquid cooling layer 122. The liquid cooling layer 122 and the adhesive layers 123 on both sides together form the sidewall of the flow channel 121. The cover plate 11 is sealed to the liquid cooling layer 122 through the adhesive layers 123.

[0059] In this embodiment, as Figure 2 , Figures 4 to 6 As shown, the liquid cooling layer 122 has a first adhesive layer on one side and a second adhesive layer on the opposite side. The first adhesive layer, the liquid cooling layer 122, and the second adhesive layer together form an intermediate layer 12. During the processing of the flow channel 121, the first adhesive layer, the liquid cooling layer 122, and the second adhesive layer can be stacked to form the intermediate layer 12, and then the intermediate layer 12 can be cut to form the flow channel 121. This allows the first adhesive layer, the liquid cooling layer 122, and the second adhesive layer to jointly form the sidewall of the flow channel 121, which facilitates the formation of the flow channel 121 while also enhancing the sealing of the sidewall of the flow channel 121. This, in turn, ensures the sealing of the flow channel 13 formed on the shell 1, thereby guaranteeing the heat exchange effect.

[0060] It is understandable that the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be made of the same or different materials. However, it is necessary to ensure that at least one of the first cover plate 111 and the second cover plate 112 is made of a transparent material.

[0061] In this embodiment, the first adhesive layer and the second adhesive layer are located on both sides of the liquid cooling layer 122, and the first adhesive layer and the second adhesive layer can be made of adhesive or thin film material with good sealing and thermal conductivity. On the one hand, the adhesive layer 123 can firmly connect the cover plate 11 to the liquid cooling layer 122, thereby forming the integral structure of the shell 1; on the other hand, the adhesive layers 123 on both sides can also ensure the sealing of the flow channel groove 121 and prevent poor heat exchange effect caused by working fluid leakage.

[0062] Understandably, this allows for the formation of a five-layer stacked structure for housing 1. Depending on actual design requirements, the thickness of each layer can be adjusted to reduce the overall thickness of housing 1, thereby meeting the need for thinner and lighter electronic devices using housing 1.

[0063] During the production and assembly process, the first cover plate 111 and the second cover plate 112 are respectively sealed to the liquid cooling layer 122 through their respective adhesive layers 123, so that the first cover plate 111, the second cover plate 112, and the intermediate layer 12 form a closed flow channel 13 at the flow channel groove 121. The working fluid flows in the flow channel 13, thereby realizing the heat exchange function of the shell 1. In this way, the adhesive layer 123 can be used to achieve the bonding and sealing of the first cover plate 111, the second cover plate 112 and the liquid cooling layer 122, which simplifies the sealing process and reduces the processing difficulty of the shell 1. In particular, special treatments, such as surface roughening, can be applied to the surfaces of the first cover plate 111 and the second cover plate 112 that are in contact with the adhesive layer 123, which can enhance the bonding strength between the first cover plate 111 and the second cover plate 112 and the adhesive layer 123.

[0064] Additionally, heat dissipation fins can be provided on the first cover plate 111 and / or the second cover plate 112 to increase the heat exchange area and promote air convection, thereby further improving the heat exchange effect of the shell 1. Alternatively, a more efficient working fluid (such as a low-viscosity, high-thermal-conductivity liquid) or a phase change material can be used to further improve the heat exchange effect of the shell 1.

[0065] Optionally, the adhesive layer 123 includes at least one layer of adhesive. Specifically, depending on the actual design requirements, the adhesive layer 123 may include one, two, or even multiple layers of adhesive to achieve different bonding effects. The adhesive layer 123 may include the same type of adhesive, or it may include different types of adhesive to meet different application needs.

[0066] In this embodiment, the adhesive is applied to form the adhesive layer 123 via dispensing or screen printing. It is understood that the dispensing and screen printing processes allow for precise control of the adhesive application amount and distribution, ensuring that the adhesive layer 123 has a uniform thickness on both sides of the liquid cooling layer 122 and covers only the areas requiring bonding. This helps reduce unnecessary material waste and improves bonding strength and sealing performance. Furthermore, the adhesive application shape and spacing can be adjusted as needed to accommodate different shapes and sizes of the liquid cooling layer 122 and cover plate. This helps optimize the structure of the adhesive layer 123, increases the contact area and adhesion of the bonding interface, and thus enhances the overall bonding performance and sealing effect of the housing 1.

[0067] Optionally, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive. It is understood that by designing the adhesive to be any one of polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, and thermosetting adhesive, bonding and sealing between the first cover plate 111 and the liquid cooling layer 122, as well as between the second cover plate 112 and the liquid cooling layer 122, can be achieved, thereby simplifying the molding process of the housing 1 and reducing the processing difficulty of the housing 1.

[0068] In this embodiment, the adhesive can be selected as a pressure-sensitive hot melt composite adhesive film. The first cover plate 111 and the liquid cooling layer 122, as well as the second cover plate 112 and the liquid cooling layer 122, are bonded using the pressure-sensitive hot melt composite adhesive film. This can improve the reliability of the bonding and sealing, as well as its density, thereby improving the structural stability of the shell 1.

[0069] Optionally, the liquid cooling layer 122 includes at least one of a polymer material layer and a metal layer. In this embodiment, the liquid cooling layer 122 can be made of a metal material, or it can be made of a polymer material, or it can be a composite of a metal material and a polymer material, which can adapt to different application requirements.

[0070] In this embodiment, the liquid cooling layer 122 includes a metal layer. This configuration improves the strength and thermal conductivity of the liquid cooling layer 122, thereby increasing the heat exchange efficiency of the housing 1, reducing the operating temperature of the electronic device with the housing 1, and also facilitating a reduction in the thickness of the liquid cooling layer 122. Alternatively, the liquid cooling layer 122 includes a polymer material layer. This configuration meets the lightweight design requirements of the housing 1, making the electronic device with the housing 1 easier to carry and use. Alternatively, the liquid cooling layer 122 includes both a polymer material layer and a metal layer. This configuration combines the characteristics of both to improve the overall performance of the housing 1.

[0071] Optionally, the metal layer can be made of a metal material with high thermal conductivity and corrosion resistance, such as copper, aluminum, or stainless steel alloy, and there is no limitation on this. Optionally, the polymer material layer can be made of polymer materials such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), and there is no limitation on this.

[0072] In one embodiment, the thickness of the adhesive layer 123 ranges from 0.001 mm to 0.05 mm. It is understood that the thickness of the adhesive layer 123 can be precisely controlled between 0.001 mm and 0.05 mm during the dispensing or screen printing process. This allows for the connection of the liquid cooling layer 122 to the cover plates 11 on both sides using the adhesive layer 123, while simultaneously reducing the thickness of the adhesive layer 123. This reduces the overall thickness of the housing 1, thereby meeting the requirement for thinner and lighter electronic devices using the housing 1.

[0073] Understandably, when the overall thickness of the housing 1 is required to be relatively thin, the thickness of the adhesive layer 123 can be set to 0.001mm~0.02mm; when there is a high requirement for the connection strength of the housing 1, the thickness of the adhesive layer 123 can be set to 0.025mm~0.05mm.

[0074] In this embodiment, along the thickness direction of the shell 1, the edge of the adhesive layer 123 is flush with the edge of the liquid cooling layer 122. Aligning the edges of the adhesive layer 123 and the liquid cooling layer 122 reduces the resistance to the flow of the working fluid in the flow channel, thereby ensuring the heat exchange effect of the shell.

[0075] Understandably, the adhesive layer 123 has a guide portion on the side near the flow channel 121, which is used to guide the flow of the working fluid in the flow channel 13.

[0076] In this embodiment, a guide portion, such as one or more rounded corners, can also be provided on the side of the adhesive layer 123 near the flow channel 121. This smooth transition can reduce the flow resistance of the working fluid in the flow channel 13, help reduce energy loss, reduce the pressure drop in the flow channel 13, and further improve the fluidity of the working fluid, thereby ensuring the heat exchange effect of the shell 1.

[0077] Optionally, the cover plate 11 can be a single-layer structure or a multi-layer structure. In this embodiment, the first cover plate 111 is a single-layer structure or a multi-layer structure; and / or, the second cover plate 112 is a single-layer structure or a multi-layer structure.

[0078] In this embodiment, as Figures 2 to 6As shown, the first cover plate 111 can be provided with a single layer or multiple layers of sealing layers. The first cover plate 111 forms an adhesive seal with the first side of the liquid cooling layer 122 through the adhesive layer 123. The first cover plate 111 also includes a sealing layer and a barrier layer. The barrier layer is disposed close to the flow channel groove 121. The first cover plate 111 forms an adhesive seal with the first side of the liquid cooling layer 122 through the adhesive layer 123. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0079] Understandable, such as Figures 2 to 6 As shown, the second cover plate 112 can be provided, including a single layer or multiple layers of sealing layers. The second cover plate 112 forms an adhesive seal with the second side of the liquid cooling layer 122 through the adhesive layer 123. The second cover plate 112 also includes a sealing layer and a barrier layer. The barrier layer is located close to the flow channel groove 121. The second cover plate 112 forms an adhesive seal with the second side of the liquid cooling layer 122 through the adhesive layer 123. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0080] In one implementation, such as Figures 4 to 6 As shown, the cover plate 11 includes at least one of a modified polymer material layer 115 and a metal layer 116. In this embodiment, the first cover plate 111 includes at least one of a modified polymer material layer 115 and a metal layer 116; and / or, the second cover plate 112 includes at least one of a modified polymer material layer 115 and a metal layer 116.

[0081] In this embodiment, at least one cover plate 11 of the shell 1 is configured to include a modified polymer material layer 115, such that the modified polymer material layer 115 is formed by processing a polymer material layer through any one of the following processes: plasma processing, radiation modification processing, mechanical processing, plating processing, surface grafting polymerization processing, chemical etching processing, and coupling agent processing, and the water vapor transmission rate of the modified polymer material layer 115 is ≤0.01 g / (m²). 2 •24h), thereby increasing the difficulty of the working fluid escaping the flow channel 13 by using the modified polymer material layer 115, which reduces the evaporation loss of the working fluid, thereby improving the heat dissipation performance of the shell 1 in the heat exchange module 100 and extending its service life.

[0082] It should be noted that the surface of the polymer material layer is treated using any one of the following processes: plasma processing, radiation modification, mechanical treatment, coating, surface grafting polymerization, chemical etching, or coupling agent processing. During this treatment, active groups are used to form an active layer on the surface of the polymer material layer, resulting in a modified polymer material layer 115. This modified polymer material layer 115 effectively reduces the evaporation loss of the working fluid within the flow channel 13, thus increasing the difficulty for the working fluid to escape the flow channel 13. This improves heat dissipation performance and service life, thereby ensuring the long-term reliability of the heat exchange module 100. Optionally, the active groups can be hydroxyl, carboxyl, etc., and are not limited here.

[0083] Optionally, at least one of the first cover plate 111 and the second cover plate 112 includes a modified polymer material layer 115, that is, the first cover plate 111 and / or the second cover plate 112 includes a modified polymer material layer 115. In this embodiment, the first cover plate 111 and the second cover plate 112 may be made of the same material or different materials, and this is not limited.

[0084] In this embodiment, the visible light transmittance of the modified polymer material layer 115 is greater than or equal to a certain threshold. Optionally, the modified polymer material layer 115 is a transparent material. It is understood that transparent materials have a high visible light transmittance, and the shell 1 formed using the above material has a high visible light transmittance. In some implementations, the visible light transmittance of the shell 1 can reach over 90%, enabling the heat exchange module 100 to achieve a significant flow visualization effect. It should be noted that transparent material can be understood as a material with a visible light transmittance greater than a threshold in the 380nm~760nm wavelength band.

[0085] Understandably, the modified polymer material layer 115 is obtained by surface processing of the polymer material layer. Optionally, the polymer material layer is polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), cyclic olefin copolymer (COC), polytetramethylpentene (PMP), polyimide (PI), polymethyl methacrylate (PMMA), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), or styrene. Acrylonitrile copolymer (AS), acrylonitrile butadiene styrene copolymer (ABS), butadiene It is made of at least one of the following materials: styrene copolymer (BS), etc., without limitation.

[0086] It should be noted that at least a portion of the housing 1 is made of the aforementioned material so that the covering layer has high visible light transmittance, ensuring that the heat exchange module 100 can achieve a significant flow visualization effect. The above embodiment involving the use of a transparent material to form the housing 1 can be understood as the transparent material forming at least a portion of the housing 1 so that at least a portion of the housing 1 has high visible light transmittance.

[0087] In this embodiment, according to actual design requirements, the first cover plate 111 can be configured to include a modified polymer material layer 115 and / or a metal layer 116. For example, the first cover plate 111 can include a metal layer 116, which can improve the overall strength and thermal conductivity of the housing 1, thereby ensuring the stability of the electronic device with the housing 1 in complex working environments and reducing the operating temperature of the electronic device. Alternatively, the first cover plate 111 can also include a modified polymer material layer 115, which can meet the lightweight design requirements of the housing 1, thereby facilitating the carrying and use of the electronic device with the housing 1. The modified polymer material layer 115 also increases the difficulty for the working fluid to escape from the flow channel 13, reducing the evaporation loss of the working fluid, thereby improving the heat dissipation performance of the housing 1 in the heat exchange module 100 and extending its service life. Alternatively, the first cover plate 111 can also include a modified polymer material layer 115 and a metal layer 116, which can combine the characteristics of both to improve the overall performance of the housing.

[0088] Understandably, based on actual design requirements, the second cover plate 112 can include a modified polymer material layer 115 and / or a metal layer 116. For example, the second cover plate 112 can include a metal layer 116, which can improve the overall strength and thermal conductivity of the housing 1, thereby ensuring the stability of the electronic device with the housing 1 in complex working environments and reducing the operating temperature of the electronic device. Alternatively, the second cover plate 112 can include a modified polymer material layer 115, which can meet the lightweight design requirements of the housing 1, thereby facilitating the carrying and use of the electronic device with the housing 1. The modified polymer material layer 115 also increases the difficulty for the working fluid to escape from the flow channel 13, reducing the evaporation loss of the working fluid, thereby improving the heat dissipation performance of the housing 1 in the heat exchange module 100 and extending its service life. Alternatively, the second cover plate 112 can also include a modified polymer material layer 115 and a metal layer 116, combining the characteristics of both to improve the overall performance of the housing.

[0089] It should be noted that, in order to ensure that the visible light transmittance of at least a portion of the housing 1 is greater than or equal to the threshold, the first cover plate 111 and the second cover plate 112 of the cover plate 11 cannot simultaneously contain only the metal layer 116. That is, at least one of the first cover plate 111 and the second cover plate 112 includes at least a modified polymer material layer 115. To further ensure that the visible light transmittance of at least a portion of the housing 1 is greater than or equal to the threshold, such as... Figure 6 As shown, the cover plate 11 includes a modified polymer material layer 115 and a metal layer 116. The area of ​​the metal layer 116 corresponding to the flow channel 13 is processed by etching process so that the visible light transmittance of the area of ​​the cover plate 11 corresponding to the flow channel 13 is greater than or equal to a certain threshold, which is not limited here.

[0090] In this embodiment, at least a portion of the housing 1 may be made of a transparent material, so that at least a portion of the housing 1 has a large visible light transmittance, enabling the heat exchange module 100 to achieve a significant visualization effect. It should be noted that transparent material can be understood as a material with a visible light transmittance greater than a threshold in the wavelength range of 380nm to 760nm.

[0091] Understandably, the heat exchange module 100 can be widely used in the heat exchange of electronic devices such as mobile phones, tablets, laptops, smart glasses, smartwatches, and smart head-mounted devices. It can effectively reduce the operating temperature of electronic devices and improve their operational stability and lifespan. It is thin, lightweight, has high heat exchange efficiency, and is easy to process and install, making it a promising candidate for market applications.

[0092] The present invention also proposes an electronic device comprising the aforementioned heat exchange module 100. The specific structure of the heat exchange module 100 is as described in the foregoing embodiments. Since this electronic device employs all the technical solutions of all the foregoing embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be elaborated upon here.

[0093] Understandably, electronic devices can be small electronic devices, such as mobile phones, tablets, laptops, smart glasses, smartwatches, smart headsets, etc.

[0094] In this embodiment, the electronic device further includes a housing and electronic functional components. The housing forms a cavity for accommodating the electronic functional components, thereby protecting them.

[0095] Electronic functional components of an electronic device include, but are not limited to: processors, internal memory, charging management modules, power management modules, batteries, antennas, communication modules, cameras, audio modules, speakers, receivers, microphones, sensor modules, motors, and indicators. The electronic device may have more or fewer electronic functional components than described above. These various electronic functional components can be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits (ASICs).

[0096] Electronic functional components release heat when they are in operation. When the internal temperature of the electronic device is too high, it will affect the working efficiency of the electronic functional components and the service life of the electronic device. Therefore, a heat exchange module 100 is required to control the temperature rise of the electronic functional components.

[0097] In this embodiment, the heat exchange module 100 is embedded in the housing to achieve temperature control of electronic functional components disposed within the housing's defined area.

[0098] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat exchange module, characterized in that, The heat exchange module includes: A housing having a flow channel inside, wherein the visible light transmittance of at least a portion of the housing is greater than or equal to a threshold. A working fluid, the working fluid filling the flow channel, the working fluid comprising a single medium and a fluorescent dye dissolved or dispersed in the medium, the fluorescent dye having a mass fraction of 0.1% to 10% in the working fluid; and A micropump is disposed in the housing and communicates with the flow channel. The micropump is used to drive the working fluid to flow in the flow channel.

2. The heat exchange module as described in claim 1, characterized in that, The fluorescent dyes include at least one of the following: fluorescein, fluorescent whitening agents, acridines, naphthalimides, rare earth doped oxides, quantum dots, sulfides, luciferase, and fluorescent proteins.

3. The heat exchange module as described in claim 2, characterized in that, The surface of the rare earth doped oxide is coated with a hydrophilic resin or the surface of the rare earth doped oxide is hydroxylated. Alternatively, the surface of the rare earth-doped oxide may be modified by coating with hydrophobic silanes or long-chain alkyl groups.

4. The heat exchange module as described in claim 2, characterized in that, The quantum dot is a semiconductor nanocrystal, and the size of the quantum dot is 1nm~10nm; And / or, the surface of the quantum dots is coated with carboxyl hydrophilic ligands or amino hydrophilic ligands; or, the surface of the quantum dots is coated with perfluoroalkyl ligands; or, the surface of the quantum dots is coated with oleic acid hydrophobic ligands or octadecylamine hydrophobic ligands.

5. The heat exchange module as described in claim 2, characterized in that, The fluorescent whitening agent, after sulfonation modification, contains a sodium sulfonate hydrophilic group; And / or, the sulfides are modified with hydrophobic surfactants.

6. The heat exchange module as described in claim 1, characterized in that, The medium includes one of water, fluorinated liquid, alcohol, and alkane.

7. The heat exchange module as described in any one of claims 1 to 6, characterized in that, The housing includes an intermediate layer and cover plates disposed on opposite sides of the intermediate layer. The intermediate layer is provided with a flow channel groove. The cover plates and the flow channel groove enclose each other to form a flow channel. The visible light transmittance of at least one of the cover plates is greater than or equal to a threshold. The cover plate is provided with a first inlet and a first outlet that connect to the flow channel, and the micropump is provided with a second inlet and a second outlet. The micropump is located in the housing so that the first inlet is connected to the second outlet and the first outlet is connected to the second inlet.

8. The heat exchange module as described in claim 7, characterized in that, The intermediate layer includes a liquid cooling layer and adhesive layers disposed on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers on both sides together form the sidewall of the flow channel groove. The cover plate is sealed to the liquid cooling layer through the adhesive layers. Wherein, along the thickness direction of the shell, the edge of the adhesive layer is flush with the edge of the liquid cooling layer; and / or, the adhesive layer includes at least one adhesive layer; wherein, the adhesive layer is formed by dispensing or screen printing; and / or, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive; and / or, the thickness of the adhesive layer ranges from 0.001 mm to 0.05 mm; and / or, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

9. The heat exchange module as described in claim 7, characterized in that, The cover plate may be a single-layer structure or a multi-layer structure; And / or, the cover plate includes at least one of a modified polymer material layer and a metal layer; wherein the modified polymer material layer is formed by processing a polymer material layer through any one of plasma processing, radiation modification processing, mechanical processing, plating processing, surface grafting polymerization processing, chemical etching processing, and coupling agent processing, and the water vapor transmission rate of the modified polymer material layer is ≤0.01 g / (m²). 2 •24h), the polymer material layer is made of a transparent material, which includes at least one of the following: polyethylene terephthalate, polyethylene naphthalate, polypropylene, cyclic olefin copolymers, polytetramethylpentene, polyimide, polymethyl methacrylate, polyphenylene sulfide, polyetheretherketone, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, and butadiene-styrene copolymer.

10. An electronic device, characterized in that, The electronic device includes a heat exchange module as described in any one of claims 1 to 9.

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