Spherical liquid cooling plate

Abstract

The invention belongs to the technical field of liquid cooling heat dissipation, and particularly relates to a sphere type liquid cooling plate, the main body structure of the sphere type liquid cooling plate is composed of an upper metal plate, a lower metal plate and metal spheres, and a liquid medium forms a heat exchange flow channel by utilizing gaps formed among the plurality of metal spheres; the plurality of metal balls are used for increasing the heat conduction area of the liquid cooling plate body, and meanwhile, the plurality of metal balls play a role in supporting between the upper-layer metal plate and the lower-layer metal plate, so that the liquid cooling plate body adopts a thin-wall structure, and the weight or thickness of the liquid cooling plate is reduced. By means of the innovative structural design and the efficient heat dissipation mechanism, the technical problems of a traditional liquid cooling plate in the aspects of heat dissipation efficiency, uniformity and manufacturing cost are solved. According to the liquid cooling plate, flow channel optimization and increase of the heat conduction area are achieved through filling of the metal balls, and meanwhile uniform flowing of a liquid medium and reliability of a system are ensured through reasonable interface design and a sealing technology.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of liquid cooling heat dissipation, and particularly relates to a spherical liquid cooling plate. BACKGROUND

[0002] With the continuous improvement of the power density of electronic equipment, efficient heat dissipation technology has become the key to ensuring the stable operation of the equipment. As an important heat dissipation device, the liquid cooling plate is widely used in high-power electronic devices, new energy automobile battery packs and data centers and other fields. The traditional liquid cooling plate usually adopts a hollow cavity structure or built-in pin column, cylinder, toothed blade and other flow guide structures to realize heat conduction and dissipation through the flow of liquid medium in the cavity.

[0003] However, the existing liquid cooling plate still has many deficiencies in actual application. For example, although the hollow liquid cooling plate has a simple structure, its heat conduction area is limited and the heat dissipation efficiency is low; and although the pin column or cylinder type liquid cooling plate increases the heat conduction area to a certain extent, the flow channel distribution is not uniform enough, which easily leads to the generation of local hot spots and affects the stability of the heat dissipation effect; the plate can be thinner, the cooling liquid is closer to the heat source, and the heat conduction is faster.

[0004] Production and manufacturing cost: The complex structure design requires high precision, material compatibility and process stability, and is prone to problems such as flow channel blockage, welding leakage and poor size consistency, which is difficult to meet the needs of large-scale and batch production.

[0005] Therefore, we propose a spherical liquid cooling plate to solve the technical problems mentioned above. SUMMARY

[0006] The purpose of the present application is to solve the technical problems in the background art by setting up a spherical liquid cooling plate.

[0007] In order to solve the above technical problems, the technical scheme is as follows: the main structure is composed of two metal plates. The metal plate can be made of materials with good heat conductivity, such as copper or steel, to ensure that the heat can be quickly conducted to the liquid medium.

[0008] As a preferred, a cavity is formed between the upper metal plate and the lower metal plate, and a metal ball is filled in the cavity. The metal ball can be made of materials with good heat conductivity, such as copper ball or stainless steel ball, and different sizes of balls can be selected according to the thickness of the liquid cooling plate. In particular, the metal ball can be arranged in single layer or multiple layers to meet the needs of different application scenarios. As preferred, the liquid medium forms flow channels through the gaps between the metal spheres, and the metal spheres increase the heat conduction area of the liquid cooling plate body, while the metal spheres support the upper metal plate and the lower metal plate, so that the liquid cooling plate body adopts a thin-walled structure to reduce the weight or thickness of the liquid cooling plate.

[0009] As preferred, to ensure that the liquid medium in the cavity does not leak, the upper metal plate and the lower metal plate are sealed by mature sealing technology. The sealing methods include but are not limited to welding or using a sealing ring, which have been verified in industrial practice and have high reliability. The welding process can be achieved by laser welding or argon arc welding, and the sealing ring can be made of high-temperature-resistant and corrosion-resistant materials such as silicone or fluororubber.

[0010] The liquid cooling plate of the present application is provided with one-in and one-out or multiple-in and multiple-out interfaces distributed diagonally to optimize the flow distribution of the liquid medium in the cavity. The interface can be designed with or without a filter screen according to the size of the sphere to prevent the metal spheres from being discharged and ensure more uniform liquid flow. Further, for small or thin liquid cooling plates, the interface can be arranged at the top and use a vertical pipe; for large or thick liquid cooling plates, the interface can be arranged at the side and use a horizontal pipe. The specific form of the interface can be selected according to the size of the liquid cooling plate.

[0011] As preferred, the liquid medium forms flow channels through the gaps between the metal spheres, and the metal spheres increase the heat conduction area, thereby significantly improving the heat dissipation efficiency. The size and arrangement of the metal spheres can be adjusted according to specific needs. For example, small liquid cooling plates can use smaller metal spheres or a combination of small and large spheres to achieve micro-channel liquid cooling heat dissipation. Further, by adjusting the arrangement density of the metal spheres, the size of the liquid channel can be flexibly controlled to meet the needs of different application scenarios.

[0012] As preferred, the filled metal spheres not only increase the heat conduction area, but also provide support for the upper metal plate and the lower metal plate, so that the liquid cooling plate can adopt a thin-walled structure. The design of the thin-walled structure reduces material costs and overall weight while maintaining good mechanical strength. The support of the metal spheres is achieved by their dense arrangement, avoiding deformation of the metal plate caused by internal pressure in the cavity.

[0013] As preferred, the spherical liquid cooling plate of the present application achieves the goals of high cooling efficiency and uniform heat dissipation through the innovative design described above. The liquid cooling plate has a surface area of the metal spheres much larger than the traditional needle column or cylindrical liquid cooling plate under the same thickness size, and the contact area of the liquid medium with the heat-conducting metal can be increased by more than 200%, thereby significantly improving the heat dissipation efficiency. Further, the dense arrangement of the metal spheres makes the flow channel more uniform, and the flow distribution of the liquid medium in the cavity is more reasonable, avoiding local overheating.

[0014] As preferred, the liquid cooling plate of the present application has a simple structure, a mature manufacturing process, and can realize mass production, has high economic efficiency and practicality. The liquid cooling plate has strong flexibility, and the size and arrangement of the metal spheres can be adjusted according to the specific application scenario, thereby meeting different heat dissipation requirements. Further, by selecting different metal materials and sealing methods, it can adapt to various working environments, such as heat dissipation requirements under high temperature, high pressure or corrosive medium conditions.

[0015] The beneficial effects of the present application are: The spherical liquid cooling plate of the present application is suitable for various application scenarios, including but not limited to electronic equipment heat dissipation, industrial equipment cooling, and new energy vehicle battery thermal management system. The liquid cooling plate optimizes the flow channel design and improves the heat conduction efficiency, providing an efficient and reliable heat dissipation solution for related fields. Further, the technical solution of the present application has wide applicability and can provide customized heat dissipation products for different industries; The spherical liquid cooling plate of the present application solves the technical problems of traditional liquid cooling plates in terms of heat dissipation efficiency, uniformity and manufacturing cost through innovative structural design and efficient heat dissipation mechanism. The liquid cooling plate realizes flow channel optimization and heat conduction area increase through the filling of metal spheres, and at the same time, through reasonable interface design and sealing process, it ensures the uniform flow of the liquid medium and the reliability of the system. Further, the technical solution of the present application has significant technical effects, including high cooling efficiency, uniform heat dissipation, flexible adjustment and low-cost mass production, and exhibits wide application prospects and technical advantages. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0017] In the drawings: Figure 1 Layout diagram of the metal spheres arranged uniformly in multiple layers between the upper and lower metal plates in the present application; Figure 2The layout schematic diagram of the single-layer large ball and the small ball combination filled between the upper and lower metal plates in the application; Figure 3 The design schematic diagram of the one-in and one-out interface of the liquid cooling plate diagonally distributed in the application; Figure 4 The design schematic diagram of the vertical pipe interface of the small or thin liquid cooling plate at the top in the application; Figure 5 The overall structure schematic diagram of the liquid cooling plate without filling metal balls in the application; Figure 6 The overall structure schematic diagram of the liquid cooling plate after filling metal balls in the application, showing the arrangement of the balls in the cavity; Figure 7 The local enlarged view of the metal balls inside the liquid cooling plate in the application; Figure 8 The schematic diagram of the liquid cooling plate with a standard joint in the application.

[0018] Legend: 1, upper metal plate; 2, lower metal plate; 3, metal ball; 4, sealing structure; 5, liquid inlet; 6, liquid outlet; 7, flow channel formed by the gap between the balls; 8, standard joint. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application.

[0020] Specific embodiments are given below.

[0021] Embodiment Please refer to Figures 1-4 The application provides a ball-type liquid cooling plate. The liquid cooling plate of the application comprises an upper metal plate 1, a lower metal plate 2, metal balls 3, a sealing structure 4, a liquid inlet 5, a liquid outlet 6, a flow channel 7 formed by the gap between the balls, and a standard joint 8. These components jointly constitute a high-efficiency heat dissipation device, and the specific implementation manner is as follows.

[0022] First, regarding the overall structure of the liquid cooling plate, the upper metal plate 1 and the lower metal plate 2 are made of materials with excellent heat conduction performance, such as copper or steel. In the actual manufacturing process, the thickness of the upper metal plate 1 and the lower metal plate 2 can be adjusted according to the requirements of the application scene. Generally, the thickness range of 0.5 mm to 3 mm is selected to balance the strength and lightweight requirements; For example Figure 5As shown, without the metal sphere 3, a closed cavity is formed between the upper metal plate 1 and the lower metal plate 2. This cavity is completely sealed by a sealing structure 4, which can be achieved by welding or installing a sealing ring. The welding process can employ laser welding or argon arc welding to ensure uniform welds and eliminate the risk of leakage. The sealing ring can be made of high-temperature resistant and corrosion-resistant silicone or fluororubber to meet the requirements of different working environments. This sealing design not only ensures the stable flow of the liquid medium within the cavity but also prevents external impurities from entering the cavity and affecting heat dissipation.

[0023] Furthermore, such as Figure 6 As shown, a metal sphere 3 is filled in the cavity between the upper metal plate 1 and the lower metal plate 2. The metal sphere 3 can be made of materials with good thermal conductivity, such as copper spheres or stainless steel spheres. The diameter of the metal sphere 3 is typically 0.3 mm or larger. In GPU applications, it is often 1 mm to 10 mm. In industrial equipment applications, it is usually larger than 10 cm. The specific size can be selected according to the thickness of the liquid cooling plate and the heat dissipation requirements. In addition, metal spheres 3 are filled in the cavity between the upper metal plate 1 and the lower metal plate 2. For example, a combination of metal spheres 3 of different sizes or multiple layers can be used. In some embodiments, for small or thin liquid cooling plates, metal spheres with smaller diameters, such as 1 mm to 3 mm, can be used to achieve microchannel liquid cooling; while for large or thick liquid cooling plates, metal spheres with larger diameters, such as 5 mm to 10 mm, can be used to meet higher flow rate requirements.

[0024] In addition, such as Figure 1 As shown, a combination of large and small spheres can also be used for filling, that is, large and small spheres are arranged simultaneously in the cavity. Through reasonable arrangement, the liquid medium can form a denser and more uniform flow channel 7 in the gaps between the spheres. This design significantly increases the contact area between the liquid medium and the heat-conducting metal, thereby improving heat dissipation efficiency.

[0025] The arrangement of the metal spheres 3 within the cavity can be either a single-layer arrangement or a multi-layer arrangement. For example... Figure 2As shown, the multi-layered and uniformly arranged metal spheres 3 can further optimize the distribution density of the flow channels 7, making the flow of the liquid medium in the cavity more uniform. The support of the metal spheres 3 is achieved through their dense arrangement, effectively avoiding the deformation of the metal plates caused by the internal pressure of the cavity. Therefore, the liquid cooling plate can be designed with a thin-walled structure, which not only reduces the material cost but also reduces the overall weight while maintaining good mechanical strength. The support of the metal spheres 3 is also reflected in the uniform stress distribution of the upper metal plate 1 and the lower metal plate 2, allowing the liquid cooling plate to maintain stable structural performance in high-pressure working environments.

[0026] In some embodiments, the interface design of the liquid cooling plate is as follows: Figure 3 As shown, the liquid inlet interface 5 and the liquid outlet interface 6 are diagonally distributed on both sides of the liquid cooling plate to optimize the flow distribution of the liquid medium in the cavity. This diagonal distribution design can ensure that the liquid medium flows uniformly along the flow channels 7 formed between the spheres after entering from the liquid inlet interface 5 to the liquid outlet interface 6, avoiding local overheating phenomena; In addition, the specific form of the interface can be selected from standard fittings or pipelines on the market according to the size of the liquid cooling plate. As shown, Figure 4 For small or thin liquid cooling plates, the interface can be set at the top and use vertical pipes; for large or thick liquid cooling plates, the interface can be set on the side and use horizontal pipes. This flexible interface design not only facilitates the actual installation and use of the liquid cooling plate, but also improves its applicability in different application scenarios.

[0027] It should be understood that the working principle of the liquid cooling plate is based on the flow channels 7 formed between the metal spheres 3 to achieve the flow of the liquid medium. When the liquid medium enters the cavity from the liquid inlet interface 5, it will flow along the flow channels 7 formed between the spheres and eventually be discharged from the liquid outlet interface 6; In this process, the liquid medium is in full contact with the surface of the metal spheres 3, and the heat is transferred from the upper metal plate 1 and the lower metal plate 2 to the liquid medium through heat conduction. Since the surface area of the metal spheres 3 is much larger than that of traditional pin or cylindrical liquid cooling plates, the contact area between the liquid medium and the heat-conducting metal can be increased by more than 200%, significantly improving the heat dissipation efficiency. In addition, the dense arrangement of the metal spheres 3 makes the flow channels 7 more uniform, and the flow distribution of the liquid medium in the cavity is more reasonable, avoiding local overheating phenomena. This design is particularly suitable for application scenarios that require efficient heat dissipation, such as electronic device cooling, industrial equipment cooling, and new energy vehicle battery thermal management systems.

[0028] In practical applications, the spherical liquid cooling plate of the present application has wide applicability. For example, in the field of electronic device heat dissipation, the liquid cooling plate can be installed on the CPU or GPU of a high-performance computer, and the heat is quickly removed through the circulation of the liquid medium, thereby ensuring that the device maintains a stable operating temperature during high-load operation. In the field of industrial equipment cooling, the liquid cooling plate can be used to cool large motors or transformers by adjusting the size and arrangement of the metal spheres 3 to meet the cooling needs of different equipment. In the field of new energy vehicle battery thermal management, the liquid cooling plate can be integrated into the battery pack, and by optimizing the flow channel 7 design and improving the heat conduction efficiency, a high-efficiency and reliable cooling solution is provided for the battery. In addition, by selecting different metal materials and sealing methods, the liquid cooling plate can also adapt to various working environments, such as high temperature, high pressure or corrosive medium conditions.

[0029] In the field of servers and GPUs, the liquid cooling plate can be integrated into the server chassis or GPU module, and by adjusting the size and arrangement of the metal spheres 3, it can adapt to the high-density layout of servers and the heat dissipation space requirements of high-power GPU chips. At the same time, by optimizing the flow path and distribution uniformity of the flow channel 7 and improving the adhesion of the metal spheres 3 to the heat dissipation surface, the heat conduction efficiency is enhanced, providing efficient and uniform cooling support for server clusters and high-performance GPUs under long-time high-load operation. In addition, by selecting metal materials with high thermal conductivity and adapting to the working environment of electronic devices, as well as high-airtightness sealing methods, the liquid cooling plate can ensure reliable operation in the narrow installation space of servers and GPUs, as well as in low-noise and high-stability working scenarios, adapting to the cooling needs of long-time continuous operation.

[0030] The spherical liquid cooling plate of the present application uses mature process technology in the manufacturing process, and can realize mass production. The filling process of the metal spheres 3 can be completed by automatic equipment, ensuring that the spheres are arranged uniformly and closely in the cavity. The sealing and fitting of the upper metal plate 1 and the lower metal plate 2 can also be realized by existing welding or sealing ring installation technology, with high reliability and economy; In addition, the interface design of the liquid cooling plate and the installation of the standard connector 8 are in line with the general specifications on the market, facilitating connection and integration with other cooling systems; As shown in Figure 8 the liquid cooling plate with standard connector 8 exhibits good compatibility and ease of use in practical applications.

[0031] In summary, the spherical liquid cooling plate of the present application solves the technical problems of traditional liquid cooling plates in terms of heat dissipation efficiency, uniformity and manufacturing cost through innovative structural design and efficient heat dissipation mechanism. The liquid cooling plate realizes flow channel 7 optimization and heat conduction area increase through the filling of metal spheres 3, and at the same time, through reasonable interface design and sealing process, it ensures the uniform flow of the liquid medium and the reliability of the system. In actual operation, the liquid cooling plate exhibits high cooling efficiency, uniform heat dissipation, flexible adjustment and low-cost mass production technical advantages, and provides efficient and reliable heat dissipation solutions for electronic equipment heat dissipation, industrial equipment cooling and new energy vehicle battery thermal management fields.

[0032] In the description of the present application, it should be understood that the terms "front and back", "left and right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or component referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0033] Of course, in the present technical solution, those skilled in the art should understand that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of one element can be one, and in another embodiment, the number of the element can be multiple. The term "one" cannot be understood as a limitation on the number.

[0034] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any changes or replacements easily thought of by those skilled in the art under the technical hints of the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A spherical liquid-cooled plate, comprising: The upper metal plate (1), the lower metal plate (2), the metal sphere (3), the sealing structure (4), the liquid inlet (5) and the liquid outlet (6) are characterized in that a cavity is formed between the upper metal plate (1) and the lower metal plate (2), and the cavity is filled with the metal sphere (3). The sealing structure (4) is set at the connection between the upper metal plate (1) and the lower metal plate (2) to achieve the sealing of the cavity. The liquid inlet (5) and the liquid outlet (6) are respectively set at the diagonal positions of the liquid cooling plate. Also includes: The liquid medium utilizes the gaps formed between the metal spheres (3) to form a heat exchange channel; the metal spheres (3) are used to increase the heat conduction area of ​​the liquid cooling plate body, and at the same time, the metal spheres (3) support the upper metal plate (1) and the lower metal plate (2), so that the liquid cooling plate body adopts a thin-walled structure to reduce the weight or thickness of the liquid cooling plate.

2. The spherical liquid cooling plate according to claim 1, characterized in that: The metal sphere (3) is made of copper or stainless steel.

3. A spherical liquid cooling plate according to claim 1, characterized in that: The metal spheres (3) are arranged in a single layer or multiple layers within the cavity.

4. A spherical liquid cooling plate according to claim 1, characterized in that: The sealing structure (4) is achieved through a welding process, including laser welding or argon arc welding.

5. A spherical liquid cooling plate according to claim 1, characterized in that: The sealing structure (4) also includes a sealing ring, which is made of silicone or fluororubber.

6. A spherical liquid cooling plate according to claim 1, characterized in that: The liquid inlet (5) and liquid outlet (6) are located on the top of the liquid cooling plate and are in the form of vertical pipe connections.

7. A spherical liquid cooling plate according to claim 1, characterized in that: The liquid inlet (5) and liquid outlet (6) are located on the side of the liquid cooling plate and are in the form of horizontal pipe connections.

8. A spherical liquid cooling plate according to claim 1, characterized in that: The inlet port (5) and outlet port (6) are connected to a standard connector (8).

9. A spherical liquid cooling plate according to claim 1, characterized in that: The gaps between the metal spheres (3) form flow channels (7), which are used for the flow of liquid media.

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