Semiconductor packaging structure fragmentation method and system

Abstract

The invention discloses a fragmentation method and system for a semiconductor packaging structure. The semiconductor packaging structure is cut and fragmented by using a fiber cutting line. The fiber cutting lines containing the hard particles are adopted as cutting media to replace a traditional rigid cutter wheel, synchronous cutting of the whole cutting channel is achieved by controlling movement of the fiber cutting lines, the physical limitation of the cutting edge length is broken through, full cutting or half cutting can be efficiently conducted on a large-thickness packaging structure, multi-line simultaneous cutting is supported, and the cutting efficiency is improved. The cutting wheel can complete the processing of the whole cutting channel at one time, greatly improves the slicing efficiency, is particularly suitable for high-density packaging bodies of small-size chips, takes fiber cutting lines as consumables, is obviously lower than a traditional cutting wheel in cost, and is beneficial to reducing the production cost. The defects of low slicing efficiency, large cutter loss and high cost when the existing cutter wheel cutting technology is used for coping with thick packaging bodies and small-size chips are overcome, and a full slicing process, a half slicing process or a composite slicing process can be flexibly selected according to product process requirements.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor packaging, and particularly relates to a method and system for slicing a semiconductor packaging structure. BACKGROUND

[0002] With the manufacturing of large-area packaging bodies, the reduction of chip size, the increase of packaging body thickness, and the introduction of plastic packaging materials, traditional slicing methods such as cutter wheel cutting face great challenges in slicing efficiency and thickness.

[0003] The current mainstream cutter wheel cutting method has the following inherent defects: first, the blade length of the cutting blade is limited, and it is difficult to achieve complete cutting at one time for packaging bodies with large thickness, which is low in efficiency and easy to damage the blade; second, whether it is single-blade or double-blade cutting, the traveling operation mode is low in slicing efficiency for a large number of small-sized units on a wafer or packaging board, and has a prominent production capacity bottleneck, which causes great loss of high-cost cutting knives and further increases production cost. SUMMARY

[0004] To solve the problems in the prior art, the purpose of the present application is to provide a method and system for slicing a semiconductor packaging structure.

[0005] To achieve the above purposes and effects, the technical solution adopted by the present application is as follows: A method for slicing a semiconductor packaging structure, comprising the following steps: providing a semiconductor packaging structure to be sliced; cutting and slicing the semiconductor packaging structure by using a fiber cutting line, wherein the fiber cutting line comprises a fiber base body and hard particles attached thereto.

[0006] Further, the fiber cutting line is tensioned and driven by a first control mechanism and is controlled in horizontal and vertical directions by a second control mechanism.

[0007] Further, the first control mechanism and the second control mechanism are connected through a connecting mechanism.

[0008] Further, a vision mechanism is provided on the connecting mechanism.

[0009] Further, the first control mechanism comprises a plurality of guide wheels with adjustable or fixed spacing for guiding a plurality of fiber cutting lines arranged side by side to achieve simultaneous cutting of a plurality of cutting paths.

[0010] Further, the semiconductor packaging structure is carried on a support mechanism, the support mechanism comprises a vacuum suction mechanism and / or a magnetic suction mechanism for adsorbing and fixing the semiconductor packaging structure, and the support mechanism is provided on a support base.

[0011] Further, the slicing method is full cutting or half cutting; When half cutting is performed, the fiber cutting line is cut to the inside of the semiconductor package structure and stops.

[0012] Further, when half cutting is performed, a temperature change breaking step is further included: the half-cut semiconductor package structure is placed in a temperature change environment, the temperature is changed to a preset temperature value, and then a mechanical force is applied at the corresponding position of the half-cut groove to break and separate the semiconductor package structure along the half-cut groove.

[0013] Further, the mechanical force applying method includes: using a top breaking mechanism to push from below the semiconductor package structure to the position of the half-cut groove; and / or, using a mechanism with a sharp blade to cut along the half-cut groove to initiate breaking.

[0014] The application also discloses a semiconductor package structure slicing system, characterized in that it comprises: a fiber cutting line, which is used to cut and slice the semiconductor package structure, the fiber cutting line comprising a fiber base and hard particles attached thereto; a first control mechanism responsible for the tension, transmission speed and position of the fiber cutting line; a second control mechanism for horizontal and vertical displacement control of the fiber cutting line; a support mechanism for placing the semiconductor package structure, the support mechanism comprising a vacuum adsorption mechanism and / or a magnetic adsorption mechanism for adsorbing and fixing the semiconductor package structure; a support base for supporting the support mechanism; a temperature change platform for forming a temperature change environment, so that the half-cut semiconductor package structure is heated or cooled to a preset temperature value; a breaking execution mechanism including a top breaking mechanism or a mechanism with a sharp blade, which breaks and separates the semiconductor package structure along the half-cut groove by pushing from below the semiconductor package structure to the position of the half-cut groove through the top breaking mechanism or by cutting along the half-cut groove through the mechanism with a sharp blade; The temperature change platform and the breaking execution mechanism are used after half cutting, and if there is no half cutting, the temperature change platform and the breaking execution mechanism are not needed.

[0015] Compared with the prior art, the application has the following beneficial effects: 1) The application uses a fiber cutting line containing hard particles as a cutting medium to replace the traditional rigid cutter wheel. By controlling the movement of the fiber cutting line, synchronous cutting of the entire cutting path can be achieved, breaking through the physical limitations of the cutting edge length. This can efficiently perform full or half cutting on large thickness packaging structures, is no longer limited by the thickness of the packaging body, supports multiple line simultaneous cutting, and can complete the processing of the entire cutting path at one time, greatly improving the dicing efficiency. It is especially suitable for high-density packaging of small-size chips. The fiber cutting line as a consumable has a significantly lower cost than the traditional cutter wheel, which helps to reduce production costs and overcome the defects of low dicing efficiency, high tool wear and high cost of existing cutter cutting technology when dealing with thick packaging and small-size chips. 2) The application proposes a composite dicing process of "half-cut + variable temperature fracture": the fiber cutting line is used to half-cut the packaging structure (such as a plastic package), and then the half-cut product is placed in a variable temperature (heating or cooling) environment. By using the brittleness / plasticity change or thermal stress of the packaging material at different temperatures, combined with a simple mechanical top fracture or cutting operation, the product can be neatly fractured and separated along the half-cut groove. This method separates the main cutting process with high energy consumption and material consumption from the fracture process with low energy consumption and low damage, thereby improving the dicing efficiency and reducing the consumption of the cutting line. The variable temperature fracture process is controllable and has small mechanical stress, which helps to reduce chip edge micro-cracks and collapse, and improve the yield. The full-cut, half-cut or composite dicing process can be flexibly selected according to the product process requirements. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic diagram of the application; Figure 2 is a structural schematic diagram of the fiber cutting line of the application; Figure 3 is a structural schematic diagram of the first control mechanism of the application; Figure 4 is an arrangement diagram of the first control mechanism when single-line cutting of the application; Figure 5 is an arrangement diagram of the first control mechanism when multi-line cutting of the application; Figure 6 is a structural schematic diagram of the support mechanism of the application; Figure 7 is a placement diagram of the semiconductor packaging structure of Example 1 of the application; Figure 8 is a cutting schematic diagram of Example 2 of the application; Figure 9 is a schematic diagram of the overall process flow layout of the dicing system of the application. DETAILED DESCRIPTION

[0017] The present application will be described in detail below so that the advantages and features of the present application can be more easily understood by those skilled in the art, and the scope of protection of the present application can be more clearly defined.

[0018] The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0019] As shown in Figures 1-9 , the present application discloses a method for slicing semiconductor package structure, comprising the following steps: providing a semiconductor package structure to be sliced; slicing the semiconductor package structure by using fiber cutting line 100, wherein the fiber cutting line 100 comprises fiber substrate 101 and hard particles 102 attached thereto.

[0020] The fiber cutting line 100 is tensioned and driven by first control mechanism 200 and is controlled in horizontal and vertical directions by second control mechanism 300.

[0021] In some embodiments, the first control mechanism 200 and the second control mechanism 300 are connected by connecting mechanism 500.

[0022] In some embodiments, visual mechanism 400 is provided on the connecting mechanism 500 to realize alignment, calibration and other operations.

[0023] In some embodiments, the first control mechanism 200 comprises a plurality of wire wheels or grooves 201, the spacing of which can be fixed or electrically or manually adjustable to adapt to the cutting path spacing of products of different sizes. The number of wire wheels or grooves 201 can be one (single-wire cutting, as shown in Figure 4 ) or multiple (multi-wire cutting, as shown in Figure 5 ). In multi-wire cutting, the wires can be arranged in parallel or in an array adapted to a specific cutting pattern, thereby realizing simultaneous cutting of multiple cutting paths and doubling the efficiency.

[0024] In some embodiments, the semiconductor package structure can be carried on support mechanism 600, which comprises vacuum suction mechanism (suitable for non-magnetic materials such as plastic package) and / or magnetic suction mechanism 700 (suitable for package or structure with metal frame) for adsorbing and fixing the semiconductor package structure, and the support mechanism 600 is provided on support base 800, as shown in Figure 6as shown.

[0025] In some embodiments, the support mechanism 600 and the magnetic adsorption mechanism 700 can be replaced by a special jig with a hollow structure to adapt to special-shaped products and facilitate subsequent picking.

[0026] In some embodiments, the dicing method is full cutting or half cutting.

[0027] In some embodiments, the semiconductor package structure is attached to the support mechanism 600 through the film material 1000. According to the process requirements, the cutting depth of the fiber cutting line 100 can be controlled at different positions: 1) cutting into the inside of the silicon-based package 900 (half cutting); 2) cutting through the film material 1000 but not cutting into the support base material (full cutting); 3) cutting into the support base material 620 (such as special glue or wax) below.

[0028] In some embodiments, the support base material 620 temporarily bonds and fixes the chip 630. By pre-setting or cutting to form a clearance space 610. After dicing is completed, the whole is moved to the next process, and the separated single chip 630 is directly adsorbed and picked up by the picking mechanism 640.

[0029] In some embodiments, the "half cutting + temperature change breaking" composite dicing process is to first use the fiber cutting line 100 to half cut the semiconductor package structure to form a cutting groove of a preset depth; after half cutting, the temperature change breaking step is performed: the half-cut semiconductor package structure is placed in a temperature change environment, the temperature of the semiconductor package structure is changed to a preset temperature value, and then a mechanical force is applied at the corresponding position of the half-cut groove to make the semiconductor package structure break and separate along the half-cut groove.

[0030] In some embodiments, the mechanical force applying method includes: using a top breaking mechanism to push from below the semiconductor package structure to align the half-cut groove position; and / or, using a mechanism with a sharp blade to cut along the half-cut groove to initiate breaking.

[0031] The application also discloses a semiconductor package structure dicing system, comprising: a fiber cutting line 100, which is used to cut and dice the semiconductor package structure, the fiber cutting line 100 includes a fiber base 101 and hard particles 102 attached thereto, and the fiber base 101 can be made of diamond, hard alloy or other abrasive materials; a first control mechanism 200 responsible for tensioning, transmission speed and position of the fiber cutting line 100; a second control mechanism 300 for displacement control of the fiber cutting line 100 in horizontal and vertical directions; A visual mechanism 400 is used to identify the scribe line, and to achieve high-precision alignment and calibration. A support mechanism 600 is used to place the semiconductor package structure, and the support mechanism 600 includes a vacuum suction mechanism and / or a magnetic suction mechanism 700 used to adsorb and fix the semiconductor package structure. A support base 800 is used to support the support mechanism 600. A temperature-variable platform is used to form a temperature-variable environment, so that the half-cut semiconductor package structure is heated or cooled to a preset temperature value. A breaking execution mechanism includes a top-breaking mechanism or a mechanism with a sharp blade, and the semiconductor package structure is broken and separated along the half-cut slot by pushing from below the half-cut slot position through the top-breaking mechanism or by cutting along the half-cut slot through the mechanism with a sharp blade. The temperature-variable platform and the breaking execution mechanism are used after half-cutting, and if there is no half-cutting, the temperature-variable platform and the breaking execution mechanism are not needed.

[0032] In some embodiments, the semiconductor package structure is sent into the system by different conveying mechanisms (conveying mechanism one 4 and conveying mechanism two 5). The system can include multiple functional chambers: a waiting chamber 1, which is internally equipped with different suction platforms (suction platform one 2 and suction platform two 3); a conveying mechanism one 4; a conveying mechanism two 5; a multi-line cutting area 6; a single-line cutting area 7; a blade slotting mechanism 8, which can achieve a fast surface cutting function; a temperature-variable chamber 11, which contains a temperature-variable platform 9 and an environmental temperature control unit 10; a breaking chamber 12 (which contains a breaking execution mechanism 13); a cleaning mechanism 14; and a conveying outlet 15. Products can flow through different chambers according to a process route, for example: suction platform one 2-multi-line cutting area 6-temperature-variable chamber 11-breaking chamber 12-cleaning device 14-conveying outlet 15. The system layout is highly flexible and can adapt to the needs of slicing of various products.

[0033] Embodiment 1 As shown in Figures 1-3 , Figures 5-7 , Figure 9 A semiconductor package structure slicing method includes the following steps: A semiconductor package structure to be sliced is provided, and the semiconductor package structure uses a silicon-based package body with a metal frame 900. A fiber cutting line 100 is used to cut and slice the semiconductor package structure, and the fiber cutting line 100 includes a fiber base body 101 and hard particles 102 attached thereto.

[0034] The fiber cutting line 100 is tensioned and driven by the first control mechanism 200, and is controlled in horizontal and vertical directions by the second control mechanism 300. The first control mechanism 200 is connected to the second control mechanism 300 through the connecting mechanism 500, and the visual mechanism 400 is arranged on the connecting mechanism 500 to realize alignment and calibration operations.

[0035] The first control mechanism 200 includes a plurality of guide wheels 201, and the distance between the guide wheels 201 can be fixed or can be adjusted electrically or manually to adapt to the cutting path distance of products of different sizes. Figure 5 When the fiber cutting line 100 is a multi-wire cutting line, the arrangement of the wires can be parallel or in an array suitable for a specific cutting pattern, so that multiple cutting paths can be cut at the same time, thereby greatly improving the efficiency.

[0036] The semiconductor package structure is carried on the support mechanism 600, and the support mechanism 600 includes a magnetic adsorption mechanism 700 for adsorbing and fixing the semiconductor package structure. The support mechanism 600 is arranged on the support base 800.

[0037] The semiconductor package structure is attached to the support mechanism 600 through the film material 1000. According to process requirements, the cutting depth of the fiber cutting line 100 can be controlled at different positions: 1) cutting into the silicon-based package body 900 (half-cut); 2) cutting through the film material 1000 but not cutting into the support mechanism (full-cut); and 3) cutting into the support base material 620 (such as special glue or wax) below.

[0038] The "half-cut + variable-temperature fracture" composite dicing process is as follows: first, the fiber cutting line 100 is used to half-cut the semiconductor package structure to form a cutting groove with a preset depth; after the half-cutting, the variable-temperature fracture step is performed: the half-cut semiconductor package structure is placed in a variable-temperature environment, so that its temperature changes to a preset temperature value, and then a top fracture mechanism is used to push from below the semiconductor package structure to align the half-cut groove position to apply a mechanical force, so that the semiconductor package structure is fractured and separated along the half-cut groove.

[0039] A semiconductor package structure dicing system includes: A fiber cutting line 100 is used to cut and dice the semiconductor package structure, and the fiber cutting line 100 includes a fiber substrate 101 of diamond and hard particles 102 attached thereto. A first control mechanism 200 is responsible for the tensioning, driving speed and position of the fiber cutting line 100. A second control mechanism 300 is used to control the displacement of the fiber cutting line 100 in horizontal and vertical directions. The visual mechanism 400 is used to identify the cutting groove, and high-precision alignment, calibration, etc. are realized. The support mechanism 600 is used to place the semiconductor packaging structure, and the support mechanism 600 comprises a magnetic adsorption mechanism 700 used to adsorb and fix the semiconductor packaging structure. The support base 800 is used to support the support mechanism 600. The variable-temperature platform is used to form a variable-temperature environment, so that the half-cut semiconductor packaging structure is heated or cooled to a preset temperature value. The breaking execution mechanism comprises a top-breaking mechanism or a mechanism with a sharp blade, and the semiconductor packaging structure is broken and separated along the half-cut groove by pushing from below the half-cut groove position through the top-breaking mechanism or by cutting along the half-cut groove through the mechanism with the sharp blade.

[0040] The semiconductor packaging structure is sent into the system by different conveying mechanisms (conveying mechanism one 4 and conveying mechanism two 5). The system can comprise multiple functional chambers: a waiting chamber 1 internally provided with different adsorption platforms (adsorption platform one 2 and adsorption platform two 3); a conveying mechanism one 4; a conveying mechanism two 5; a multi-line cutting area 6; a single-line cutting area 7; a blade slotting mechanism 8 capable of realizing a fast surface cutting function; a variable-temperature chamber 11 internally comprising a variable-temperature platform 9 and an environmental temperature control unit 10; a breaking chamber 12 (internally comprising a breaking execution mechanism 13); a cleaning mechanism 14; and a conveying outlet 15. The product can flow through different chambers according to a process route, for example: adsorption platform one 2-multi-line cutting area 6-variable-temperature chamber 11-breaking chamber 12-cleaning device 14-conveying outlet 15. The system layout is highly flexible and can adapt to the needs of slicing of various products.

[0041] Embodiment 2 As shown in Figures 1-3 , Figure 5 , Figure 8 A slicing method of a semiconductor packaging structure, comprising the following steps: A semiconductor packaging structure to be sliced is provided, and the semiconductor packaging structure is a chip 630. The semiconductor packaging structure is cut and sliced by using a fiber cutting wire 100, wherein the fiber cutting wire 100 comprises a fiber base body 101 and hard particles 102 attached thereto.

[0042] The fiber cutting wire 100 is tensioned and driven by a first control mechanism 200 and is controlled in horizontal and vertical directions by a second control mechanism 300. The first control mechanism 200 and the second control mechanism 300 are connected through a connecting mechanism 500, and the connecting mechanism 500 is provided with a visual mechanism 400 to realize alignment, calibration, etc.

[0043] The first control mechanism 200 includes a plurality of guide wheels 201, the spacing of the guide wheels 201 can be fixed, or can be electrically or manually adjusted to adapt to the cutting path spacing of products of different sizes. The number of guide wheels 201 is multiple (multi-wire cutting, as shown in Figure 5 When multi-wire cutting, the arrangement of the wires can be parallel or an array adapted to a specific cutting pattern, thereby achieving simultaneous cutting of multiple cutting paths and doubling the efficiency.

[0044] The dicing method is full cutting: the support base material 620 (special glue) temporarily bonds and fixes the chips 630. An avoidance space 610 is formed by pre-setting or cutting. After dicing is completed, the whole is moved to the next process, and the separated single chips 630 are directly adsorbed and picked up by the picking mechanism 640.

[0045] A dicing system of a semiconductor package structure comprises: A fiber cutting wire 100 is used to cut and dice the semiconductor package structure, and the fiber cutting wire 100 comprises a fiber base body 101 and hard particles 102 attached thereto; A first control mechanism 200 is responsible for tensioning, transmission speed and position of the fiber cutting wire 100; A second control mechanism 300 is used for displacement control of the fiber cutting wire 100 in horizontal and vertical directions; A vision mechanism 400 is used for recognizing cutting paths, achieving high-precision alignment, calibration, etc.; A support mechanism 600 is used for placing the semiconductor package structure, and the support mechanism 600 comprises a vacuum adsorption mechanism and / or a magnetic adsorption mechanism 700 for adsorbing and fixing the semiconductor package structure; A support base 800 is used for supporting the support mechanism 600.

[0046] The rest is the same as example 1.

[0047] Parts or structures not specifically described in the present application can adopt existing technologies or existing products, which are not described here.

[0048] The above is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the present application specification, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for wafer fabrication of a semiconductor package structure, characterized in that, Includes the following steps: Provides a semiconductor package structure to be sliced; A semiconductor packaging structure is cut into pieces using fiber optic cutting lines, wherein the fiber optic cutting lines include a fiber matrix and hard particles attached thereto.

2. The method for wafer fabrication of a semiconductor packaging structure according to claim 1, characterized in that, The fiber cutting wire is tensioned and driven by the first control mechanism, and its displacement in the horizontal and vertical directions is controlled by the second control mechanism.

3. The method for wafer fabrication of a semiconductor packaging structure according to claim 2, characterized in that, The first control mechanism and the second control mechanism are connected by a connecting mechanism.

4. The method for wafer fabrication of a semiconductor packaging structure according to claim 3, characterized in that, The connecting mechanism is equipped with a vision mechanism.

5. The method for wafer fabrication of a semiconductor package structure according to claim 2, characterized in that, The first control mechanism includes multiple adjustable or fixed-spaced guide wheels for guiding multiple fiber cutting lines arranged side by side to achieve simultaneous cutting of multiple cutting channels.

6. The method for wafer fabrication of a semiconductor package structure according to claim 1, characterized in that, The semiconductor packaging structure is supported on a support mechanism, which includes a vacuum adsorption mechanism and / or a magnetic adsorption mechanism for adsorbing and fixing the semiconductor packaging structure. The support mechanism is disposed on a support base.

7. The method for wafer fabrication of a semiconductor package structure according to claim 1, characterized in that, The slicing method is either full slicing or half slicing; When a half-cut is performed, the fiber cutting wire cuts into the interior of the semiconductor package structure and then stops.

8. The method for wafer fabrication of a semiconductor package structure according to claim 7, characterized in that, After the half-cutting is performed, a variable-temperature fracture step is also included: the half-cut semiconductor package structure is placed in a variable-temperature environment to change its temperature to a preset temperature value, and then mechanical force is applied at the corresponding position of the half-cut groove to cause the semiconductor package structure to break and separate along the half-cut groove.

9. The method for wafering a semiconductor packaging structure according to claim 8, characterized in that, The methods of applying mechanical force include: A jacking mechanism is used to push the semiconductor package from below, aligning it with the half-groove position; and / or, A mechanism with a sharp blade is used to cut along a half-groove to induce fracture.

10. A wafer-level system for a semiconductor packaging structure, characterized in that, include: Fiber cutting wire is used to cut and slice semiconductor packaging structures. The fiber cutting wire includes a fiber matrix and hard particles attached thereto. The first control mechanism is responsible for the tension, transmission speed, and position of the fiber cutting wire; The second control mechanism is used to control the horizontal and vertical displacement of the fiber cutting line; A support mechanism for placing a semiconductor packaging structure, the support mechanism including a vacuum adsorption mechanism and / or a magnetic adsorption mechanism for adsorbing and fixing the semiconductor packaging structure; A support base for supporting the support mechanism; A variable temperature platform is used to create a variable temperature environment, allowing the half-cut semiconductor package structure to be heated or cooled to a preset temperature value. The fracture actuator, including a top-crack mechanism or a mechanism with a sharp blade, pushes the semiconductor package structure from below to the half-cut position, or cuts along the half-cut groove to break and separate the semiconductor package structure along the half-cut groove. The temperature-changing platform and the fracture actuator are used after the partial cut. If there is no partial cut, the temperature-changing platform and the fracture actuator are not required.

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