Constant-temperature and constant-humidity clean wafer process environment system

Abstract

The invention belongs to the technical field of gluing and developing equipment, and particularly relates to a constant-temperature and constant-humidity clean wafer process environment system. Comprising a vertical partition plate, a temperature and humidity adjusting device, a fan filter unit, a unit cavity air supply main pipe, a unit cavity exhaust pipe, a unit cavity air box, a robot cavity air supply main pipe, a robot cavity exhaust pipe and a robot cavity air box. The temperature and humidity adjusting device, the unit cavity air supply main pipe, the unit cavity air exhaust pipe and the unit cavity air box are arranged in a matched mode, a constant-temperature and constant-humidity clean process gas environment can be effectively supplied to all unit cavities, and through the matched arrangement of the fan filter unit, the robot cavity air supply main pipe, the robot cavity air exhaust pipe and the robot cavity air box, the constant-temperature and constant-humidity clean process gas environment can be effectively supplied to all the unit cavities; a clean non-process gas environment can be effectively provided for each robot cavity, particles in the robot cavities can be effectively prevented from entering the unit cavities, and then the stability of the gluing and developing process and the quality of corresponding products are ensured.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of coating and developing equipment, in particular to a constant-temperature and constant-humidity clean wafer process environment system. BACKGROUND

[0002] In integrated circuit manufacturing, semiconductor wafers are used as carriers for intensive and complex process treatment, especially involving photoresist coating and developing processes. In this process, the photoresist coated on the wafer and the developing solution are extremely sensitive to temperature and humidity, temperature and humidity determine the liquid adhesion, chemical reaction stability, byproduct generation rate, etc. of the coating and developing process, and the dust in the cavity of the coating and developing main module part of the coating and developing equipment can affect the yield of the wafer manufacturing process, especially when multiple cavities are processed in parallel, each unit cavity needs to ensure high consistency, therefore, strict control of temperature and humidity is the key to ensuring the stability of the coating and developing process and product quality. SUMMARY

[0003] In view of the above problems, the present application aims to provide a constant-temperature and constant-humidity clean wafer process environment system.

[0004] The purpose of the present application is achieved by the following technical solutions: A constant-temperature and constant-humidity clean wafer process environment system is suitable for a coating and developing main module, which includes a device shell, a base frame, and horizontal layered partitions. The base frame is arranged inside the device shell of the coating and developing main module, and a plurality of horizontal layered partitions are arranged on the base frame from bottom to top. Each horizontal layered partition is parallel to the horizontal plane and separates the inner cavity of the device shell into a plurality of horizontal layer main cavities from top to bottom. Each horizontal layer main cavity is provided with a plurality of process units and a wafer transfer robot. The constant-temperature and constant-humidity clean wafer process environment system includes vertical partitions, temperature and humidity adjusting devices, fan filter units, unit cavity air supply main pipes, unit cavity air exhaust pipes, unit cavity air boxes, robot cavity air supply main pipes, robot cavity air exhaust pipes, and robot cavity air boxes. The vertical partition plates are symmetrically arranged in two in each horizontal layer main cavity, and the arrangement positions of the two vertical partition plates in each horizontal layer main cavity correspond to the arrangement positions of the two vertical partition plates in the other horizontal layer main cavities adjacent to the horizontal layer main cavity in an up-down manner; the two vertical partition plates in each horizontal layer main cavity are connected with the base frame and divide each horizontal layer main cavity into two unit cavities and a robot cavity, the two unit cavities in each horizontal layer main cavity are respectively located on the two sides of the robot cavity in the horizontal layer main cavity, the wafer transfer robot in each robot cavity is respectively located at a lower side position in the corresponding robot cavity, and each process unit in each robot cavity is respectively located at a lower side position in the two corresponding unit cavities; each vertical partition plate is provided with a wafer access opening corresponding to each process unit in a corresponding unit cavity adjacent to the vertical partition plate, and each vertical partition plate is provided with a movable door for closing or opening the corresponding wafer access opening. Each unit cavity is provided with a unit cavity air box at an upper position, the unit cavity air box in each unit cavity is used for blowing air downward from an upper side of each process unit in the unit cavity, each process unit in each unit cavity has a branch exhaust duct at a lower side of the process unit, each branch exhaust duct connected with all the process units in each unit cavity is connected with a corresponding unit cavity exhaust pipe, each unit cavity exhaust pipe is connected with an external factory exhaust pipe network, each unit cavity air box has an air box air inlet, the air box air inlet of each unit cavity air box is connected with a main pipe air outlet A of a corresponding unit cavity air supply main pipe, a main pipe air inlet A of each unit cavity air supply main pipe is connected with an output end of the temperature and humidity adjusting device, an input end of the temperature and humidity adjusting device is connected with an air environment of a clean room where the glue coating and developing main body module is located, and the temperature and humidity adjusting device is located outside the equipment shell. Each robot cavity is provided with a robot cavity air box at an upper position, the robot cavity air box in each robot cavity is used for blowing air downward from an upper side of a wafer transfer robot in the robot cavity, a lower side position in each robot cavity is connected with a robot cavity exhaust pipe, each robot cavity exhaust pipe is connected with an external factory exhaust pipe network, each robot cavity air box has an air box air inlet B, the air box air inlet B of each robot cavity air box is connected with a main pipe air outlet B of a corresponding robot cavity air supply main pipe, a main pipe air inlet B of each robot cavity air supply main pipe is connected with an output end of a corresponding fan filter unit, an input end of the fan filter unit is connected with an air environment of a clean room where the glue coating and developing main body module is located, and the fan filter unit is located outside the equipment shell.

[0005] The number of exhaust pipes for each unit cavity corresponds to the total number of unit cavities, and each exhaust pipe is used in conjunction with a corresponding unit cavity. There are two main air supply pipes for each unit cavity. One main air supply pipe is connected to the air boxes of each unit cavity in all units located on the same side of the foundation frame, and the other main air supply pipe is connected to the air boxes of each unit cavity in all units located on the other side of the foundation frame.

[0006] The projections of the air boxes in each unit cavity on the horizontal plane of each unit cavity located on the same side of the base frame and the projections of the air boxes in each unit cavity on the horizontal plane of each unit cavity located on the other side of the base frame are centrally symmetrical with respect to the projection of the vertical center line of the base frame on the horizontal plane. The projections of the exhaust pipes in each unit cavity corresponding to each unit cavity on the horizontal plane and the projections of the exhaust pipes in each unit cavity corresponding to each unit cavity on the other side of the base frame are centrally symmetrical with respect to the projection of the vertical center line of the base frame on the horizontal plane. The projections of the main air supply pipes of two unit cavities on the horizontal plane are centrally symmetrical with respect to the projection of the vertical center line of the base frame on the horizontal plane. The length directions of all the air boxes in the unit cavities are parallel to each other.

[0007] At least one of the unit cavity air supply main pipes is equipped with a temperature and humidity detection sensor near the main pipe inlet A of the unit cavity air supply main pipe. Each unit cavity air supply main pipe is equipped with a damper actuator A at a position corresponding to each main pipe outlet A of the unit cavity air supply main pipe. Each damper actuator A is used to control the opening and closing of a corresponding main pipe outlet A. Each unit cavity air box is equipped with a wind pressure detection sensor A in its inner cavity.

[0008] Each unit cavity air box has one air box inlet A, which is located on the end face of the main air supply pipe of the corresponding unit cavity air box. Multiple air box outlet holes A are evenly distributed at the bottom of each unit cavity air box. The air box inlet A and each air box outlet hole A of each unit cavity air box are connected to the inner cavity of the unit cavity air box. An air box filter A is located at the lower part of the inner cavity of each unit cavity air box, and an air distribution plate A is located at the upper part of the inner cavity of each unit cavity air box near the air box inlet A. The air distribution plate A has... The unit cavity air box has several air distribution holes. An air distribution plate B is located at the upper part of the inner cavity of each unit cavity air box, away from the air box inlet A. The air distribution plates A and B in the inner cavity of each unit cavity air box are respectively inclined. Gas entering the inner cavity of each unit cavity air box from the air box inlet A can first pass evenly through the corresponding air distribution plate A through each air distribution hole, and then be blocked by the corresponding air distribution plate B. The gas between the air distribution plates A and B in each unit cavity air box can be filtered by the corresponding air box filter A and evenly discharged from each air box outlet A of the unit cavity air box.

[0009] The fan filter unit, the robot cavity air supply main pipe, and the robot cavity exhaust pipe are each provided in twos. Each robot cavity contains two robot cavity air boxes, all of which are parallel to each other in their longitudinal direction. The positions of the two robot cavity air boxes in each robot cavity correspond vertically to the positions of the two robot cavity air boxes in other robot cavities. The two fan filter units are respectively mounted on the top surface of the base frame outside the equipment casing. The output end of each fan filter unit is connected to the main air inlet B of a corresponding robot cavity air supply main pipe. Each machine… Each robot cavity air box located on the same side of the human body is connected to the corresponding main air outlet B of one of the robot cavity air supply main pipes. Each robot cavity air box located on the other side of each robot cavity is connected to the corresponding main air outlet B of the other robot cavity air supply main pipe. The two robot cavity exhaust pipes are respectively connected to the lower part of all robot cavities. Each robot cavity air supply main pipe is provided with a damper actuator B at the corresponding main air outlet B. Each damper actuator B is used to control the opening and closing of the corresponding main air outlet B. Each robot cavity air box is provided with a wind pressure detection sensor B in its inner cavity.

[0010] The projections of the two robot cavity air boxes on the horizontal plane relative to the projection of the vertical center line of the base frame on the horizontal plane are centrally symmetrical; the projections of the two robot cavity air supply mains on the horizontal plane are centrally symmetrical relative to the projection of the vertical center line of the base frame on the horizontal plane; the projections of the two robot cavity exhaust pipes on the horizontal plane are centrally symmetrical relative to the projection of the vertical center line of the base frame on the horizontal plane.

[0011] Each of the robot cavity air boxes has one air box inlet B, which is located on the end face of the main air supply pipe of the robot cavity corresponding to the air box. Multiple air box outlets B are evenly distributed at the bottom of each robot cavity air box, and the air box outlets B at the bottom of each robot cavity air box are located at the middle of the corresponding robot cavity. The air box inlet B and each air box outlet B of each robot cavity air box are connected to the inner cavity of the air box. An air box filter B is provided at the lower part of the inner cavity of each robot cavity air box. Gas entering the inner cavity of each robot cavity air box through the air box inlet B is filtered by the corresponding air box filter B and evenly discharged from each air box outlet B.

[0012] The air pressure generated by the temperature and humidity regulating device for the gas delivered to each unit cavity is greater than the air pressure generated by the fan filter unit for the gas delivered to the robot cavity; the inner wall of the equipment shell, each horizontal partition, and each vertical partition are respectively provided with a heat insulation layer.

[0013] The constant temperature and humidity clean wafer process environment system proposed in this invention also includes a heat source mounting interlayer channel. A heat source mounting interlayer channel is respectively provided on the device housing corresponding to the side of the two unit cavities in each horizontal layer main cavity that is away from the robot cavity in the horizontal layer main cavity. The inner cavity of each heat source mounting interlayer channel is used to install cables and I / O control boards that cooperate with each process unit in the corresponding unit cavity. Ventilation holes are opened on the device housing corresponding to the inner cavity of each heat source mounting interlayer channel, and a cooling fan is also provided on the device housing corresponding to the inner cavity of each heat source mounting interlayer channel. The ventilation holes and cooling fans corresponding to each heat source mounting interlayer channel are located on opposite sides of the device housing.

[0014] The advantages and positive effects of this invention are as follows: This invention, through the coordinated arrangement of a temperature and humidity regulating device, a unit cavity air supply main pipe, a unit cavity exhaust pipe, and a unit cavity air box, can effectively supply a constant temperature and humidity clean process gas environment to each unit cavity. Through the coordinated arrangement of a fan filter unit, a robot cavity air supply main pipe, a robot cavity exhaust pipe, and a robot cavity air box, it can effectively supply a clean non-process gas environment to each robot cavity. It can also ensure that the generated particles in the unit cavity can be blown out of the unit cavity, effectively preventing particles from entering the robot cavity, thereby ensuring the stability of the coating and developing processes and the corresponding product quality. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the ventilation system of the main body of the present invention; Figure 2 This is a schematic diagram of the basic framework of the present invention and some related structures on the basic framework; Figure 3 This is a schematic diagram of the vertical partition plate of the present invention; Figure 4 This is a schematic diagram showing the positional distribution of some structures of the present invention when viewed from below at the bottom of the corresponding adhesive coating and developing main module; Figure 5 This is a schematic diagram showing the placement of the process unit, wafer transfer robot, and fan filter unit on the basic frame of the present invention. Figure 6 This is a schematic diagram of the ventilation configuration in one of the horizontal main cavities of the present invention; Figure 7 This is a schematic diagram of the ventilation configuration of each unit cavity located on the same side of the basic frame of the present invention. Figure 8 This is a schematic diagram of the structure of the unit cavity air supply main pipe of the present invention; Figure 9 This is a schematic diagram of the structure of the unit cavity air box of the present invention; Figure 10 This is a schematic diagram of the structure for installing a sandwich channel in the heat source of the present invention.

[0016] In the diagram: 1 is a vertical partition plate, 101 is a wafer inlet / outlet, 2 is a temperature and humidity control device, 3 is a fan and filter unit, 4 is a main air supply pipe for the unit cavity, 401 is the main air outlet A, 402 is the main air inlet A, 5 is the unit cavity exhaust pipe, 6 is the unit cavity air box, 601 is the air box inlet A, 7 is the main air supply pipe for the robot cavity, 8 is the robot cavity exhaust pipe, 9 is the robot cavity air box, 10 is the air valve actuator A, 11 is the air box filter A, 12 is the air distribution plate A, 13 is the air distribution plate B, 14 is the heat source installation interlayer channel, 15 is the ventilation hole, 16 is the cooling fan, and 17 is the IO control board. 001 is the basic framework, 002 is the process unit, 003 is the wafer transfer robot, 004 is the unit cavity, and 005 is the robot cavity. Detailed Implementation

[0017] The following is in conjunction with the appendix Figures 1-10 The present invention will be described in further detail below.

[0018] A constant temperature, humidity, and clean wafer processing environment system is provided, suitable for a coating and developing main module. The coating and developing main module includes an equipment housing, a base frame 001, and horizontally layered partitions. The base frame 001 is disposed inside the equipment housing of the coating and developing main module. Several horizontally layered partitions are sequentially arranged on the base frame 001 from bottom to top. In this embodiment, the arrangement structure between the equipment housing, the base frame 001, and the horizontally layered partitions is all prior art. In this embodiment, each horizontally layered partition is parallel to a horizontal plane and divides the inner cavity of the equipment housing from top to bottom into six horizontal main cavities. Each horizontal main cavity contains six process units 002 and one wafer transfer robot 003. The structures of the process units 002 and the wafer transfer robot 003 themselves adopt prior art, and their actions are controlled by the control system of the coating and developing main module.

[0019] This embodiment includes a vertical partition plate 1, a temperature and humidity control device 2, a fan filter unit 3, a unit cavity air supply main pipe 4, a unit cavity exhaust pipe 5, a unit cavity air box 6, a robot cavity air supply main pipe 7, a robot cavity exhaust pipe 8, and a robot cavity air box 9. The temperature and humidity control device 2 (i.e., STHC) and the fan filter unit 3 (i.e., FFU) are both existing technologies, and their actions are controlled by the control system of the coating and developing main module.

[0020] In this embodiment, two vertical partition plates 1 are symmetrically arranged in each horizontal layer main cavity. The positions of the two vertical partition plates 1 in each horizontal layer main cavity correspond vertically to the positions of the two vertical partition plates 1 in the adjacent horizontal layer main cavities. In this embodiment, the two vertical partition plates 1 in each horizontal layer main cavity are connected to the basic frame 001 and divide each horizontal layer main cavity into two unit cavities 004 and one robot cavity 005. The two unit cavities 004 in each horizontal layer main cavity are located on both sides of the robot cavity 005 in that horizontal layer main cavity. The arrangement of the vertical partition plates 1 also adopts the existing technology. In this embodiment, the wafer transfer robot 003 in each robot cavity 005 is located on the lower side of the corresponding robot cavity 005, and each process unit 002 in each robot cavity 005 is located on the lower side of the two corresponding unit cavities 004. In this embodiment, each unit cavity 004 has three process units 002, and the number of each unit unit 002 is the same. Each vertical partition 1 has a wafer inlet / outlet 101 corresponding to a process unit 002 in a unit cavity 004 adjacent to that vertical partition 1. Each vertical partition 1 also has a door corresponding to each wafer inlet / outlet 101 for closing or opening that door. The door configuration also adopts existing technology, with each door controlled by the control system of the coating and developing main module. The wafer transfer robot 003 can transfer wafers between the open wafer inlet / outlet 101 and the process unit 002 in the unit cavity 004. When the wafer inlet / outlet 101 is closed, the process unit 002 can perform processing on the wafer in the relatively sealed unit cavity 004; at this time, the process unit 002 is not connected to the robot cavity 005.

[0021] Each unit cavity 004 has a corresponding unit cavity air box 6 at its upper part. Each unit cavity air box 6 in each unit cavity 004 is used to blow air downwards from above each process unit 002 within that unit cavity 004. Each process unit 002 in each unit cavity 004 has branch exhaust ducts at its lower part. Each branch exhaust duct connected to all process units 002 in each unit cavity 004 is connected to a corresponding unit cavity exhaust pipe 5. Each unit cavity exhaust pipe 5 is connected to an external plant exhaust network. The external plant exhaust network is an existing technology. Each unit cavity air box 6 has an air box inlet A 601, which is connected to the main outlet A 401 of the corresponding unit cavity air supply main pipe 4. The main inlet A 402 of each unit cavity air supply main pipe 4 is connected to the output end of the temperature and humidity control device 2. The input end of the temperature and humidity control device 2 is connected to the air environment of the clean room where the coating and developing main module is located, and the temperature and humidity control device 2 is located on the outside of the equipment shell. Through the coordinated arrangement of the temperature and humidity control device 2, the unit cavity air supply pipe 4, the unit cavity exhaust pipe 5, and the unit cavity air box 6, a constant temperature and humidity clean process gas environment can be effectively supplied to each unit cavity 004.

[0022] Each robot cavity 005 has a corresponding robot cavity air box 9 at its upper position. The robot cavity air box 9 in each robot cavity 005 is used to blow air downwards from above the wafer transfer robot 003 in that robot cavity 005. The lower position of each robot cavity 005 is connected to the robot cavity exhaust pipe 8. Each robot cavity exhaust pipe 8 is connected to the external plant exhaust pipe network. Each robot cavity air box 9 has an air box inlet B. The air box inlet B of each robot cavity air box 9 is connected to the main outlet B of the corresponding robot cavity air supply main pipe 7. The main outlet B of each robot cavity air supply main pipe 7 is connected to the output end of the corresponding fan filter unit 3. The input end of the fan filter unit 3 is connected to the air environment of the clean room where the coating and developing main module is located. The fan filter unit 3 is located on the outside of the equipment shell. By coordinating the fan filter unit 3, the robot cavity air supply main pipe 7, the robot cavity exhaust pipe 8, and the robot cavity air box 9, a clean non-process gas environment can be effectively supplied to each robot cavity 005.

[0023] Specifically, such as Figures 4-7As shown, in this embodiment, the number of unit cavity exhaust pipes 5 corresponds to the total number of unit cavities 004. Each unit cavity exhaust pipe 5 is used in conjunction with a corresponding unit cavity 004. There are two unit cavity air supply pipes 4. One unit cavity air supply pipe 4 is connected to each unit cavity air box 6 in all unit cavities 004 located on the same side of the base frame 001. The other unit cavity air supply pipe 4 is connected to each unit cavity air box 6 in all unit cavities 004 located on the other side of the base frame 001. In this embodiment, the projections of the air boxes 6 in each unit cavity 004 on the horizontal plane of the unit cavity 004 located on the same side of the base frame 001 and the projections of the air boxes 6 in each unit cavity 004 on the horizontal plane of the unit cavity 004 located on the other side of the base frame 001 are centrally symmetrical with respect to the projection of the vertical center line of the base frame 001 on the horizontal plane; the projections of the exhaust pipes 5 in each unit cavity 004 corresponding to each unit cavity 004 on the horizontal plane and the projections of the exhaust pipes 5 in each unit cavity 004 corresponding to each unit cavity 004 on the other side of the base frame 001 on the horizontal plane are centrally symmetrical with respect to the projection of the vertical center line of the base frame 001 on the horizontal plane; the projections of the two air supply main pipes 4 in the horizontal plane are centrally symmetrical with respect to the projection of the vertical center line of the base frame 001 on the horizontal plane; and the length directions of all unit cavity air boxes 6 are parallel to each other. The specific configuration of the above structure can effectively reduce the variety of sizes and models of the unit cavity air box 6, unit cavity exhaust pipe 5 and unit cavity air supply main pipe 4 involved, making maintenance and replacement easier.

[0024] like Figure 8As shown, in this embodiment, a temperature and humidity sensor is installed inside the main air supply pipe 4 of one of the unit chambers, near the main air inlet A 402 of the main air supply pipe 4. Each unit chamber air supply pipe 4 has a corresponding air valve actuator A 10 at its respective main air outlet A 401. Each air valve actuator A 10 controls the opening and closing of a corresponding main air outlet A 401. In this embodiment, the temperature and humidity sensor and each air valve actuator A 10 are commercially available products. The temperature and humidity sensor is connected and communicates with the control system of the coating and developing main module. The temperature and humidity sensor can detect whether the temperature and humidity of the gas output to the unit chamber air box 6 reaches the set value. If not, it sends a signal to the control system of the coating and developing main module, which then controls the temperature and humidity regulating device 2 to adjust the temperature and humidity of the output gas, thereby achieving dynamic adjustment of the temperature and humidity of the incoming air. Each damper actuator A 10 is controlled by the control system of the coating and developing main module to open and close, thereby controlling the ventilation and output air pressure of each individual unit cavity 004. Each unit cavity air box 6 is equipped with an air pressure sensor A, which is connected to the control system of the coating and developing main module. The air pressure sensors A are commercially available products used to detect the air pressure inside the corresponding unit cavity air box 6, sending signals to the control system of the coating and developing main module to adjust the output air pressure of the damper actuator A 10 accordingly.

[0025] like Figure 9As shown, in this embodiment, each unit cavity air box 6 has one air box inlet A 601. The air box inlet A 601 of each unit cavity air box 6 is located near the end face of the unit cavity air supply main pipe 4 corresponding to that unit cavity air box 6. Multiple air box outlet holes A are evenly opened at the bottom of each unit cavity air box 6. The air box inlet A 601 and each air box outlet hole A of each unit cavity air box 6 are connected to the inner cavity of that unit cavity air box 6. An air box filter A 11 is provided at the lower part of the inner cavity of each unit cavity air box 6. An air distribution plate A 12 is provided at the upper part of the inner cavity of each unit cavity air box 6 near the air box inlet A 601 of that unit cavity air box 6. The air distribution plate 12 has several air distribution holes. An air distribution plate B13 is located at the upper part of the inner cavity of each unit cavity air box 6, away from the air box inlet A601. The air distribution plates A12 and B13 in the inner cavity of each unit cavity air box 6 are respectively inclined. The mesh size of the air box filter A11, the diameter of the air box outlet A, and the diameter of the air distribution holes are reasonably set according to usage requirements. The gas entering the inner cavity of each unit cavity air box 6 through the air box inlet A 601 can first pass evenly through the corresponding air distribution plate A 12 through each air distribution hole, and then be blocked by the corresponding air distribution plate B 13. The gas between the air distribution plate A 12 and the air distribution plate B 13 of each unit cavity air box 6 can be filtered by the corresponding air box filter A11 and evenly discharged from each air box outlet A of the unit cavity air box 6, which can fully ensure the uniformity and cleanliness of the gas output from the unit cavity air box 6.

[0026] Specifically, in this embodiment, there are two of each of the fan filter unit 3, the robot cavity air supply pipe 7, and the robot cavity exhaust pipe 8. Each robot cavity 005 has two robot cavity air boxes 9. The length directions of all robot cavity air boxes 9 are parallel to each other. The positions of the two robot cavity air boxes 9 in each robot cavity 005 are vertically corresponding to the positions of the two robot cavity air boxes 9 in other robot cavities 005. Two fan-filter units 3 are respectively installed on the top surface of the base frame 001 outside the equipment shell. The output end of each fan-filter unit is connected to the main air inlet B of a corresponding robot cavity air supply main 7. Each robot cavity air box 9 located on the same side in each robot cavity 005 is connected to the corresponding main air outlet B of one robot cavity air supply main 7. Each robot cavity air box 9 located on the other side in each robot cavity 005 is connected to the corresponding main air outlet B of the other robot cavity air supply main 7. Two robot cavity exhaust pipes 8 are respectively connected to the lower part of all robot cavities 005. Each robot cavity air supply main 7 is equipped with a damper actuator B corresponding to each main air outlet B of that robot cavity air supply main 7. Each damper actuator B is used to control the opening and closing of a corresponding main air outlet B. In this embodiment, each air valve actuator B is a commercially available product, and its opening and closing are controlled by the control system of the coating and developing main module, thereby realizing the ventilation start / stop and output air pressure of each individual robot cavity 005. Each robot cavity air box 9 is equipped with an air pressure detection sensor B, and each air pressure detection sensor B is connected and communicates with the control system of the coating and developing main module. The air pressure detection sensors B are all commercially available products, used to detect the air pressure in the corresponding robot cavity air box 9, so as to send a signal to the control system of the coating and developing main module and adjust the output air pressure of the air valve actuator B accordingly.

[0027] In this embodiment, the projections of the two robot cavity air boxes 9 on the horizontal plane of each robot cavity 005 are centrally symmetrical with respect to the projection of the vertical center line of the base frame 001 on the horizontal plane; the projections of the two robot cavity air supply mains 7 on the horizontal plane are centrally symmetrical with respect to the projection of the vertical center line of the base frame 001 on the horizontal plane; and the projections of the two robot cavity exhaust pipes 8 on the horizontal plane are centrally symmetrical with respect to the projection of the vertical center line of the base frame 001 on the horizontal plane. Through the specific arrangement of the above structure, the variety of specific sizes and models of the robot cavity air boxes 9, robot cavity air supply mains 7, and robot cavity exhaust pipes 8 can be effectively reduced, facilitating maintenance and replacement.

[0028] Each robot cavity air box 9 has one air box inlet B, located near the end face of the corresponding robot cavity air supply main pipe 7. Multiple air box outlets B are evenly distributed at the bottom of each robot cavity air box 9, with each outlet located at the center of the corresponding robot cavity 005. The air box inlet B and outlets B of each robot cavity air box 9 are connected to its inner cavity. An air box filter B is located at the lower part of the inner cavity of each robot cavity air box 9. The mesh size of the air box filter B and the aperture size of the air box inlet B are reasonably set according to usage requirements. The gas output from the two robot cavity air boxes 9 flows stably from top to bottom and from the center to both sides in each robot cavity 005. The gas entering the inner cavity of each robot cavity air box 9 through the air box inlet B can be filtered through the corresponding air box filter B and evenly discharged from each air box outlet B of the robot cavity air box 9, which can fully ensure the uniformity and cleanliness of the gas output from the robot cavity air box 9.

[0029] In this embodiment, the air pressure generated by the temperature and humidity regulating device 2 supplying gas to each unit cavity 004 is greater than the air pressure generated by the fan filter unit 3 supplying gas to the robot cavity 005. This ensures that when the aforementioned wafer inlet / outlet 101 is opened, the gas flow between each unit cavity 004 and the robot cavity 005 will only be from the unit cavity 004 to the robot cavity 005 (e.g., Figure 1 As shown, this ensures that the generated particles can be blown out of the unit cavity 004, effectively preventing particles from entering the robot cavity 005. Insulation layers are respectively provided on the inner wall of the equipment shell, each horizontal partition, and each vertical partition 1. The insulation layers are installed using existing technology. The insulation layers effectively ensure the temperature stability of each cavity within the equipment, preventing excessively rapid temperature exchange between the cavity and the outside environment.

[0030] Specifically, such as Figure 5 and Figure 10As shown, the constant temperature and humidity clean wafer process environment system in this embodiment also includes a heat source mounting interlayer channel 14. A heat source mounting interlayer channel 14 is respectively provided on the equipment housing corresponding to the side of the two unit cavities 004 in each horizontal layer main cavity that is away from the robot cavity 005 in that horizontal layer main cavity. The inner cavity of each heat source mounting interlayer channel 14 is used to install cables and I / O control boards 17 that cooperate with each process unit 002 in the corresponding unit cavity 004. Ventilation holes 15 are provided on the equipment housing corresponding to the inner cavity of each heat source mounting interlayer channel 14, and a cooling fan 16 is also provided on the equipment housing corresponding to the inner cavity of each heat source mounting interlayer channel 14. The ventilation holes 15 and the cooling fans 16 corresponding to each heat source mounting interlayer channel 14 are located on opposite sides of the equipment housing. The cable and I / O control board 17 are routed through the heat source mounting interlayer channel 14 using existing technology. Since the cables and IO control boards 17 used in conjunction with each process unit 002 generate relatively large amounts of heat, the heat generated can be quickly discharged from the heat source installation interlayer channel 14 to both sides of the equipment by means of the combined arrangement of heat source installation interlayer channel 14, ventilation holes 15 and cooling fans 16, which effectively prevents damage to the temperature and humidity environment inside the unit cavity 004.

Claims

1. A constant temperature and humidity clean wafer process environment system, applicable to a coating and developing main module, the coating and developing main module includes an equipment shell, a basic frame (001), and horizontal layered partitions. The basic frame (001) is located inside the equipment shell of the coating and developing main module. Several horizontal layered partitions are arranged on the basic frame (001) from bottom to top. Each horizontal layered partition is parallel to the horizontal plane and divides the inner cavity of the equipment shell from top to bottom into several horizontal layered main cavities. Several process units (002) and a wafer transfer robot (003) are arranged in each horizontal layered main cavity. Its features are: Includes vertical partition (1), temperature and humidity control device (2), fan filter unit (3), unit cavity air supply main pipe (4), unit cavity exhaust pipe (5), unit cavity air box (6), robot cavity air supply main pipe (7), robot cavity exhaust pipe (8), and robot cavity air box (9). Two vertical partition plates (1) are symmetrically arranged in each horizontal main cavity. The positions of the two vertical partition plates (1) in each horizontal main cavity correspond vertically to the positions of the two vertical partition plates (1) in the adjacent horizontal main cavities. The two vertical partition plates (1) in each horizontal main cavity are connected to the base frame (001) and divide each horizontal main cavity into two unit cavities (004) and one robot cavity (005). The two unit cavities (004) in each horizontal main cavity are located on both sides of the robot cavity (005) in the horizontal main cavity. The wafer transfer robot (003) in the human cavity (005) is located on the lower side of the corresponding robot cavity (005), and each process unit (002) in each robot cavity (005) is located on the lower side of two corresponding unit cavities (004); each vertical partition plate (1) is provided with a wafer inlet / outlet (101) corresponding to each process unit (002) in a corresponding unit cavity (004) adjacent to the vertical partition plate (1), and each vertical partition plate (1) is provided with a movable door for closing or opening the corresponding wafer inlet / outlet (101) corresponding to each wafer inlet / outlet (101); Each unit cavity (004) has a corresponding unit cavity air box (6) at its upper part. The unit cavity air box (6) in each unit cavity (004) is used to blow air downwards from above each process unit (002) in the unit cavity (004). Each process unit (002) in each unit cavity (004) has a branch exhaust duct at its lower part. Each branch exhaust duct connected to all process units (002) in each unit cavity (004) is connected to the corresponding unit cavity exhaust pipe (5). Each unit cavity exhaust pipe (5) is connected to an external plant. The exhaust duct network is connected, and each of the unit cavity air boxes (6) has an air box inlet A (601). The air box inlet A (601) of each of the unit cavity air boxes (6) is connected to the main outlet A (401) of the corresponding unit cavity air supply main pipe (4). The main outlet A (402) of each of the unit cavity air supply main pipes (4) is connected to the output end of the temperature and humidity control device (2). The input end of the temperature and humidity control device (2) is connected to the air environment of the clean room where the coating and developing main module is located. The temperature and humidity control device (2) is located on the outside of the equipment shell. Each robot cavity (005) has a corresponding upper position with a robot cavity air box (9). The robot cavity air box (9) in each robot cavity (005) is used to blow air downwards from above the wafer transfer robot (003) in the robot cavity (005). The lower position of each robot cavity (005) is connected to the robot cavity exhaust pipe (8). Each robot cavity exhaust pipe (8) is connected to an external plant exhaust network. Each cavity air box (9) has an air box inlet B. The air box inlet B of each robot cavity air box (9) is connected to the main outlet B of the corresponding robot cavity air supply main pipe (7). The main outlet B of each robot cavity air supply main pipe (7) is connected to the output end of the corresponding fan filter unit (3). The input end of the fan filter unit (3) is connected to the air environment of the clean room where the coating and developing main module is located. The fan filter unit (3) is located on the outside of the equipment shell.

2. The constant temperature and humidity clean wafer process environment system according to claim 1, characterized in that: The number of exhaust pipes (5) of the unit cavity corresponds to the total number of unit cavities (004). Each exhaust pipe (5) of the unit cavity is used in conjunction with a corresponding unit cavity (004). There are two main air supply pipes (4) of the unit cavity. One of the main air supply pipes (4) of the unit cavity is connected to the air boxes (6) of each unit cavity in all the unit cavities (004) located on the same side of the base frame (001). The other main air supply pipe (4) of the unit cavity is connected to the air boxes (6) of each unit cavity in all the unit cavities (004) located on the other side of the base frame (001).

3. The constant temperature and humidity clean wafer process environment system according to claim 2, characterized in that: The projection of the air box (6) of each unit cavity (004) located on the same side of the base frame (001) onto the horizontal plane and the projection of the air box (6) of each unit cavity (004) located on the other side of the base frame (001) onto the horizontal plane are centrally symmetrical with respect to the projection of the vertical center line of the base frame (001) onto the horizontal plane; the exhaust pipe (5) of each unit cavity corresponding to each unit cavity (004) located on the same side of the base frame (001) is... The projection of the unit cavity exhaust pipe (5) on the horizontal plane and the projection of the unit cavity exhaust pipe (5) corresponding to the unit cavity (004) on the other side of the base frame (001) are centrally symmetrical with respect to the projection of the vertical center line of the base frame (001) on the horizontal plane; the projection of the two unit cavity air supply main pipes (4) on the horizontal plane are centrally symmetrical with respect to the projection of the vertical center line of the base frame (001) on the horizontal plane; the length directions of all the unit cavity air boxes (6) are parallel to each other.

4. The constant temperature and humidity clean wafer process environment system according to claim 1, characterized in that: At least one of the unit cavity air supply main pipes (4) is provided with a temperature and humidity detection sensor near the main pipe inlet A (402) of the unit cavity air supply main pipe (4). Each unit cavity air supply main pipe (4) is provided with a damper actuator A (10) corresponding to each main pipe outlet A (401) of the unit cavity air supply main pipe (4). Each damper actuator A (10) is used to control the opening and closing of a corresponding main pipe outlet A (401). Each unit cavity air box (6) is provided with a wind pressure detection sensor A in its inner cavity.

5. The constant temperature and humidity clean wafer process environment system according to claim 1, characterized in that: Each unit cavity air box (6) has one air box inlet A (601). The air box inlet A (601) of each unit cavity air box (6) is located on the end face of the unit cavity air supply main pipe (4) corresponding to the unit cavity air box (6). Multiple air box outlet holes A are evenly opened at the bottom of each unit cavity air box (6). The air box inlet A (601) and each air box outlet hole A of each unit cavity air box (6) are connected to the inner cavity of the unit cavity air box (6). An air box filter A (11) is provided at the lower part of the inner cavity of each unit cavity air box (6). An air distribution plate A (12) is provided at the upper part of the inner cavity of each unit cavity air box (6) near the air box inlet A (601) of the unit cavity air box (6). The air distribution plate A (12) is opened A plurality of air distribution holes are provided. At the upper part of the inner cavity of each unit cavity air box (6), away from the air box inlet A (601), an air distribution plate B (13) is provided. The air distribution plate A (12) and the air distribution plate B (13) in the inner cavity of each unit cavity air box (6) are respectively inclined. The gas entering the inner cavity of the unit cavity air box (6) from the air box inlet A (601) of each unit cavity air box (6) can first pass evenly through the corresponding air distribution plate A (12) through each air distribution hole, and then be blocked by the corresponding air distribution plate B (13). The gas between the air distribution plate A (12) and the air distribution plate B (13) of each unit cavity air box (6) can be filtered by the corresponding air box filter A (11) and evenly discharged from each air box outlet A of the unit cavity air box (6).

6. The constant temperature and humidity clean wafer process environment system according to claim 1, characterized in that: Two of each of the following are provided: a fan filter unit (3), a robot cavity air supply main pipe (7), and a robot cavity exhaust pipe (8). Two robot cavity air boxes (9) are provided in each robot cavity (005). The length directions of all the robot cavity air boxes (9) are parallel to each other. The positions of the two robot cavity air boxes (9) in each robot cavity (005) are vertically corresponding to the positions of the two robot cavity air boxes (9) in other robot cavities (005). The two fan filter units (3) are respectively set on the top surface of the base frame (001) outside the equipment shell. The output end of each fan filter unit (3) is connected to the main air inlet B of a corresponding robot cavity air supply main pipe (7). The robot cavity air boxes (9) located on the same side in each robot cavity (005) are connected to the corresponding main outlet B of one of the robot cavity air supply main pipes (7), and the robot cavity air boxes (9) located on the other side in each robot cavity (005) are connected to the corresponding main outlet B of another robot cavity air supply main pipe (7). The two robot cavity exhaust pipes (8) are respectively connected to the lower part of all robot cavities (005). Each robot cavity air supply main pipe (7) is provided with a valve actuator B at the corresponding position of each main outlet B of the robot cavity air supply main pipe (7). Each valve actuator B is used to control the opening and closing of a corresponding main outlet B. Each robot cavity air box (9) is provided with a wind pressure detection sensor B in its inner cavity.

7. A constant temperature and humidity clean wafer process environment system according to claim 6, characterized in that: The projection of the two robot cavity air boxes (9) of each robot cavity (005) on the horizontal plane is centrally symmetrical with respect to the projection of the vertical center line of the base frame (001) on the horizontal plane; the projection of the two robot cavity air supply pipes (7) on the horizontal plane is centrally symmetrical with respect to the projection of the vertical center line of the base frame (001) on the horizontal plane; the projection of the two robot cavity exhaust pipes (8) on the horizontal plane is centrally symmetrical with respect to the projection of the vertical center line of the base frame (001) on the horizontal plane.

8. A constant temperature and humidity clean wafer process environment system according to claim 7, characterized in that: Each of the robot cavity air boxes (9) has one air box inlet B, and the air box inlet B of each robot cavity air box (9) is located on the end face of the robot cavity air supply main pipe (7) corresponding to that robot cavity air box (9). Multiple air box outlet holes B are evenly distributed at the bottom of each robot cavity air box (9), and the air box outlet holes B at the bottom of each robot cavity air box (9) are located in the robot cavity (005) corresponding to that robot cavity air box (9). At the middle position, the air inlet B and the air outlet B of each robot cavity air box (9) are connected to the inner cavity of the robot cavity air box (9). An air box filter B is provided at the lower part of the inner cavity of each robot cavity air box (9). The gas entering the inner cavity of the robot cavity air box (9) from the air inlet B of each robot cavity air box (9) can be filtered by the corresponding air box filter B and discharged evenly from the air outlet B of each robot cavity air box (9).

9. A constant temperature and humidity clean wafer process environment system according to claim 1, characterized in that: The air pressure generated by the temperature and humidity regulating device (2) for supplying gas to each unit cavity (004) is greater than the air pressure generated by the fan filter unit (3) for supplying gas to the robot cavity (005); the inner wall of the equipment shell, each horizontal partition, and each vertical partition (1) are respectively provided with a heat insulation layer.

10. A constant temperature and humidity clean wafer process environment system according to claim 1, characterized in that: It also includes a heat source installation interlayer channel (14). A heat source installation interlayer channel (14) is provided on the equipment shell corresponding to the side of the two unit cavities (004) in each horizontal layer main cavity that is away from the robot cavity (005) in the horizontal layer main cavity. The inner cavity of each heat source installation interlayer channel (14) is used to install cables and IO control boards (17) that cooperate with each process unit (002) in the corresponding unit cavity (004). Ventilation holes (15) are opened on the equipment shell corresponding to the inner cavity of each heat source installation interlayer channel (14). A cooling fan (16) is also provided on the equipment shell corresponding to the inner cavity of each heat source installation interlayer channel (14). The ventilation holes (15) and the cooling fans (16) corresponding to each heat source installation interlayer channel (14) are located on opposite sides of the equipment shell.

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