Semiconductor module
By designing a clamping system and an electrically insulating covering element, the problems of potting compound leakage and arcing were solved, enabling a cost-effective semiconductor module design that ensures reliable electrical contact and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-10
- Publication Date
- 2026-03-27
AI Technical Summary
Existing semiconductor modules are at risk of leakage after potting compound filling, resulting in high costs and unwanted arcing, and the potting compound is expensive.
It employs a clamping system and electrically insulating cover elements. The clamps press against the base plate, and the electrically insulating cover elements partially fill the housing. The side walls extend into the potting compound to avoid complete filling and ensure air and creepage distances.
It effectively prevents potting compound leakage, reduces costs, avoids unwanted electric arcs, and simplifies the assembly process.
Smart Images
Figure CN121752101A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to semiconductor modules, and more particularly to semiconductor modules having one or more press-fitted devices. Background Technology
[0002] Semiconductor modules typically have one or more device devices arranged in a housing. These device devices can be, for example, crimped. The crimped device devices are pressed against a base plate, which typically forms the bottom of the housing, by means of corresponding devices. Such device devices typically have semiconductor devices (e.g., diodes, transistors, or thyristors), and pressure plates arranged above and below the semiconductor devices. Furthermore, flat connection terminals are arranged between the semiconductor devices and the pressure plates. Pressure applied to the device devices ensures electrical contact with the semiconductor devices via the flat connection terminals. For external contact, the connection terminals are guided outward from the housing. To prevent unwanted arcing between the device devices and other components of the semiconductor module (e.g., connection terminals), the housing is typically completely filled with electrically insulating potting compound. If the housing is completely filled with potting compound, there is a risk of accidental leakage of the potting compound, for example, when an excessive amount of potting compound is filled into the housing due to dosage tolerances. Undesirable leakage due to thermal expansion of the potting compound after filling is possible, for example. Furthermore, the corresponding potting compounds are relatively expensive, resulting in a high overall cost for the corresponding semiconductor module. Summary of the Invention
[0003] The objective is to provide an insulating semiconductor module having at least one press-fit device device, the semiconductor module reliably preventing potting compound leakage, and which can be manufactured as cost-effectively as possible.
[0004] A semiconductor module has: a housing; a base plate forming the bottom of the housing; device devices disposed in the housing and on the base plate; a clamping system having a clamping plate and one or more fixing elements, wherein the device devices are disposed between the clamping plate and the base plate, and the one or more fixing elements are configured to: pull the clamping plate toward the base plate such that the device devices are pressed against the base plate by means of the clamping plate; an electrically insulating covering element having a cover and sidewalls, wherein the cover extends at least partially on the side of the clamping plate opposite to the device devices, and the sidewalls extend from the cover toward the base plate; and an electrically insulating potting compound covering the base plate and partially filling the housing, wherein the sidewalls of the electrically insulating covering element extend partially into the electrically insulating potting compound toward the base plate, and the lower portion of the device devices toward the base plate is covered by the electrically insulating potting compound, and the upper portion of the device devices extending from the electrically insulating potting compound is at least partially surrounded by the sidewalls of the electrically insulating covering element.
[0005] A method for manufacturing a semiconductor module includes: arranging a device device on a base plate, wherein the base plate forms the bottom of a housing; arranging a clamping plate of a clamping system on the device device, such that the device device is arranged between the clamping plate and the base plate; fixing the clamping plate to the base plate by means of one or more fixing elements, such that the one or more fixing elements pull the clamping plate toward the base plate, such that the device device is pressed against the base plate by means of the clamping plate; arranging an electrically insulating covering element above the device device and the clamping system, wherein the electrically insulating covering element has a cover and sidewalls, wherein the electrically insulating covering element is arranged such that the cover extends at least partially on the side of the clamping plate opposite to the device device, and the sidewalls extend from the cover toward the base plate; and filling the housing with an electrically insulating potting compound such that the potting compound covers the base plate and partially fills the housing, wherein the sidewalls of the electrically insulating covering element extend partially into the electrically insulating potting compound toward the base plate, and the lower portion of the device device toward the base plate is covered by the electrically insulating potting compound, and the upper portion of the device device extending from the electrically insulating potting compound is at least partially surrounded by the sidewalls of the electrically insulating covering element. Attached Figure Description
[0006] The invention will now be explained in more detail with reference to examples and the accompanying drawings. Here, the same reference numerals denote the same elements. The illustrations in the drawings are not drawn to scale.
[0007] Figure 1 A schematic cross-sectional view of a semiconductor module with a press-fit device is shown. Figure 2 A cross-section of a semiconductor module with a press-fit device is shown in more detail; Figure 3 A schematic three-dimensional view of a crimped device assembly on a base plate is shown. Figure 4 A schematic three-dimensional view of two crimped device assemblies on the base plate is shown; Figure 5 A schematic three-dimensional view of two press-fitted device assemblies on a base plate within a housing without a housing cover is shown. Figure 6 A schematic three-dimensional view of a semiconductor module with a closed housing is shown. Figure 7 A schematic cross-sectional view of a semiconductor module according to an example is shown; Figure 8 A schematic three-dimensional view of two crimped device assemblies on a base plate according to another example is shown; Figure 9 A schematic cross-sectional view of a semiconductor module according to another example is shown. Detailed Implementation
[0008] The invention can be implemented in the following detailed description with specific examples. It is readily understood that the features of the various examples described herein can be combined with each other unless otherwise stated. If a particular element is referred to as a "first element," "second element," etc., the terms "first" and "second" are used only to distinguish different elements. The terms are not sequential or enumerable. This means that, for example, a "second element" can exist even if a "first element" does not exist.
[0009] Figure 1 A schematic cross-sectional view of a semiconductor module with a press-fitted device assembly is shown. The semiconductor module 100 has a housing 50 and a base plate 30 forming the bottom of the housing 50. The semiconductor module 100 also has a device assembly 10 disposed in the housing 50 and on the base plate 30, and a clamping system with a clamping plate 40 and one or more fixing elements 42. The device assembly 10 is disposed between the clamping plate 40 and the base plate 30. The one or more fixing elements 42 are configured to pull the clamping plate 40 toward the base plate 30, thereby pressing the device assembly 10 against the base plate 30. In this way, reliable electrical contact of the device assembly 10 can be achieved.
[0010] The device assembly 10 may have various elements arranged vertically to each other. This is referred to below. Figure 2 A detailed explanation is provided. Device device 10 typically includes a semiconductor device 12 (e.g., a diode, transistor, or thyristor). Furthermore, device device 10 may also include a first contact pad 14 disposed on a first side of semiconductor device 12 and a second contact pad 16 disposed on a second side of semiconductor device 12 opposite to the first side, wherein the first contact pad 14 is configured to electrically contact semiconductor device 12 from the first side, and the second contact pad 16 is configured to electrically contact semiconductor device 12 from the second side. Semiconductor device 12 typically has two or more metallized surfaces for electrical contact. Here, at least one metallized surface is disposed on the upper and lower sides of semiconductor device 12, respectively. Electrical contact is made with semiconductor device 12, particularly the metallized surfaces, from both sides via the first and second contact pads 14 and 16. As described above, device device 10 is pressed against base plate 30 by means of clamp 40. This presses the first and second contact pads 14 and 16 against semiconductor device 12, thereby ensuring sufficient contact between contact pads 14 and 16 and semiconductor device 12.
[0011] As exemplarily in Figure 2As shown, the device assembly 10 may further include an insulating disk 22 disposed on a first side of the semiconductor device 12, wherein a first contact disk 14 is disposed between the insulating disk 22 and the semiconductor device 12. The insulating disk 22 is made of an electrically insulating material and serves to electrically insulate the first contact disk 14 from the base plate 30. The device assembly 10 may further include a pressure plate 24 disposed on a second side of the semiconductor device 12, wherein a second contact disk 16 is disposed between the pressure plate 24 and the semiconductor device 12. The pressure plate 24 is used to transmit the pressure applied by the clamping plate 40 to the element disposed between the clamping plate 40 and the base plate 30. That is, the first contact disk 14, the second contact disk 16, and the semiconductor device 12 are disposed between the insulating disk 22 and the pressure plate 24. The first and second contact disks 14 and 16 press against the semiconductor device 12 respectively by means of a clamping system for electrical contact.
[0012] Also refer to Figure 2 The device assembly 10 may also have a contact element 18, which is also configured for electrical contact with the semiconductor device 12, and is arranged between the pressure plate 24 and the second contact pad 16. For example, the contact element 18 is required when the semiconductor device 12 has a transistor or thyristor and thus has three metallized surfaces to be contacted. The contact element 18 may, for example, have a pad made of an electrically insulating material to ensure electrical insulation from the second contact pad 16, which is typically connected to a different potential. Electrical lines or connections may extend through the electrically insulating pad to provide signals (e.g., gate control signals) to the semiconductor device 12. The second contact pad 16 may, for example, have one or more openings through which an electrical contact can be established between the contact element 18 and the semiconductor device 12.
[0013] like Figure 1 and Figure 2 As exemplarily further illustrated, the semiconductor module 100 may also have a first connection terminal 142 having a first end and a second end opposite to the first end. The first end is connected to a first contact pad 14. The first connection terminal 142 extends from the first contact pad 14 through the housing 50, and the second end of the first connection terminal 142 protrudes from the housing 50 on the side opposite to the base plate 30. This is also exemplarily illustrated in... Figure 3 The semiconductor module is schematically shown in a 3D view, where, for clarity, [the following text is missing]. Figure 3 The housing 50 is not shown in the view shown because it would obscure other components of the semiconductor module 100.
[0014] Here, the first connection terminal 142 is arranged spaced apart from the device device 10 in the horizontal direction x. The distance between the first connection terminal 142 and the device device 10 can be, for example, a few millimeters to a few centimeters. The first contact pad 14 can be connected to a first potential via the first connection terminal 142. The second contact pad 16 is typically connected to a second potential different from the first potential. To prevent unwanted arcing between the first connection terminal 142 and other components of the device device 10 (e.g., the second contact pad 16), the housing 50, as Figure 1 and 2 As exemplarily shown, the semiconductor module 100 is typically filled entirely with electrically insulating potting compound 60. Here, in terms of air clearance and creepage distance within the semiconductor module 100, it is generally necessary to completely fill the housing 50 with potting compound 60. However, if the housing 50 is completely filled with potting compound 60, there is a risk that the potting compound 60 may unintentionally leak out of the housing 50. For example, due to dosage tolerances, an excessive amount of potting compound 60 may be undesirably filled into the housing 50. For example, unintentional leakage may occur after filling (e.g., during semiconductor module operation) due to thermal expansion of the potting compound 60. Furthermore, the corresponding potting compound is relatively expensive, resulting in a high overall cost for the corresponding semiconductor module 100.
[0015] Now for reference Figure 7 and Figure 9 Besides reference Figure 1 In addition to the described components, the semiconductor module 100 according to an embodiment of the present invention also has an electrically insulating cover element 70 having a cover and sidewalls. Here, the cover of the electrically insulating cover element 70 extends at least partially over the side of the clamping plate 40 opposite to the device device 10. That is, the clamping plate 40 is arranged between the electrically insulating cover element 70 and the device device 10. The sidewalls of the electrically insulating cover element 70 extend from the cover toward the base plate 30. As described above, the semiconductor module also has an electrically insulating potting compound 60 that covers the base plate 30 but only partially fills the housing 50. The sidewalls of the electrically insulating cover element 70 extend partially into the electrically insulating potting compound 60 toward the base plate 30. The lower portion of the device device 10 toward the base plate 30 is covered by the electrically insulating potting compound 60, and the upper portion of the device device 10 extending from the electrically insulating potting compound 60 is at least partially surrounded by the sidewalls of the electrically insulating cover element 70.
[0016] Therefore, the electrically insulating covering element 70 essentially forms a cover over the device assembly 10 and the clamping system. Figure 1 and Figure 2Unlike other devices, the electrically insulating potting compound 60 does not fill the upper edge of the housing 50, but only partially fills it. This avoids the aforementioned disadvantages of a housing that is completely filled with potting compound 60 (e.g., undesirable overflow, high cost). However, the electrically insulating covering element 70, particularly its sidewalls, extends from above into the potting compound 60, effectively blocking or extending the air distance and creepage distance within the housing.
[0017] Here, the electrically insulating covering element 70 can be as follows: Figure 7 As shown, the element is, for example, a separate component that can be easily pushed onto the device assembly 10 and the clamping system. Here, the electrically insulating cover element 70 can simply be placed on the device assembly 10 and the clamping system without being forcibly and securely connected to them. For example, displacement of the electrically insulating cover element 70 in the horizontal x-direction is prevented by the sidewalls. Undesirable movement in the vertical y-direction is also prevented because the electrically insulating cover element 70 extends into the potting compound 60. The potting compound 60 is essentially a cured soft or hard potting compound. Here, the potting compound 60 cures only after the electrically insulating cover element 70 has been placed on the device assembly 10 and the clamping system. Thus, the lower ends of the sidewalls extending into the potting compound 60 are securely surrounded by the potting compound 60 and can only be pulled out of the potting compound 60 again under correspondingly large forces.
[0018] like Figure 7 As shown, the electrically insulating cover element 70 can be directly mounted on the device assembly 10 and the clamping system. That is, the electrically insulating cover element 70 can be arranged vertically and spaced apart from the housing cover. However, alternatively, according to another embodiment, it is feasible to fix the cover of the electrically insulating cover element 70 to the housing cover. For example, the electrically insulating cover element 70 can be glued to the housing cover or connected to the housing cover in other suitable ways and methods. According to another embodiment, for example as... Figure 9 As shown, the cover of the electrically insulating cover element 70 can also be formed from a portion of the housing cover. That is, the electrically insulating cover element 70 can be formed at least partially through the housing cover. In this example, the sidewall extends vertically y from the housing cover into the potting compound 60. Here, the sidewall of the electrically insulating cover element 70 can, for example, be fixed to the housing cover in a suitable manner and method. Alternatively, it is also possible to manufacture the housing 50 or at least the housing cover, together with the sidewall of the electrically insulating cover element 70, as a one-piece element by injection molding (or other suitable method).
[0019] In all the described examples, the sidewalls of the electrically insulating covering element 70 may, for example, extend into the electrically insulating potting compound 60 such that less than 50%, less than 25%, or less than 15% of the sidewalls are covered by the electrically insulating potting compound 60. In principle, the very small coverage of the sidewalls by the potting compound 60 (e.g., 1% to 5%) is sufficient to reliably block air distances and creepage distances between the device assembly 10 and other components arranged within the housing 50.
[0020] The electrically insulating potting compound 60 may, for example, fill 80% or less, 75% or less, or 65% or less of the housing 50. By providing an electrically insulating covering element 70, the filling level of the potting compound 60 can be significantly reduced in principle. As described above, the device device 10 may include a semiconductor device 12, a first contact pad 14 disposed on a first side of the semiconductor device 12 (the first contact pad constitutes electrical contact with the semiconductor device 12 from the first side), a second contact pad 16 disposed on a second side of the semiconductor device 12 opposite to the first side (the second contact pad constitutes electrical contact with the semiconductor device 12 from the second side opposite to the first side), an insulating pad 22 disposed on the first side of the semiconductor device 12, and a pressure plate 24 disposed on a second side of the semiconductor device 12, wherein the first contact pad 14, the second contact pad 16, and the semiconductor device 12 are arranged between the insulating pad 22 and the pressure plate 24. Here, the electrically insulating potting compound 60 may, for example, at least cover the insulating pad 22, the first contact pad 14, the semiconductor device 12, and the second contact pad 16. In this manner, at least the current-conducting elements of the device are covered by an electrically insulating potting compound 60. If the device 10 also has contact elements 18, then according to one embodiment, the contact elements 18, which are additional current-conducting elements, can also be covered by an electrically insulating potting compound 60. In this way, air distance and creepage distance between the device 10 and other elements arranged in the housing 50 can be reliably blocked.
[0021] As described above, the semiconductor module may have at least one first connection terminal 142 having a first end and a second end opposite to the first end, wherein the first end is connected to a first contact pad 14, the first connection terminal 142 extends from the first contact pad 14 through the housing 50, and the second end protrudes from the housing 50 on the side opposite to the base plate 30. An electrically insulating cover element 70 (e.g., a sidewall of the electrically insulating cover element 70) may be arranged between the device device 10 and the first connection terminal 142. Since the potting compound 60 does not fill the entire housing 50, in the described device, the electrically insulating cover element 70 prevents unwanted arcing between the first connection terminal 142 and other components of the device device 10 (e.g., the second contact pad 16).
[0022] The upper portion of the device 10 extending from the electrically insulating potting compound 60 may be at least partially surrounded by the sidewalls of the electrically insulating cover element 70. For example, the sidewalls may be arranged particularly where the connecting terminal 142 extends vertically upward through the housing 50. Sidewalls are not mandatory in other sections of the device 10 immediately adjacent to it where no other conductive elements are arranged. However, in this case, care must be taken to properly arrange the electrically insulating cover element 70 when assembling the semiconductor module 100. According to other embodiments, the upper portion of the device 10 extending from the electrically insulating potting compound 60 may be completely surrounded by the sidewalls of the electrically insulating cover element 70. Therefore, since the portion of the device 10 extending from the potting compound 60 is completely surrounded by the electrically insulating cover element 70, proper arrangement of the electrically insulating cover element 70 is not required during assembly. This simplifies assembly. The electrically insulating cover element 70 may be made of a suitable electrically insulating material. For example, the electrically insulating cover element 70 may be made of ceramic or plastic.
[0023] For example, as in Figure 8 As shown in the three-dimensional view of the semiconductor module, the cover of the electrically insulating covering element 70 may have an opening or a recess. Similarly, as... Figure 8 As shown, the second end of the first connecting terminal 142 extending from the housing 50 extends, for example, along the horizontal direction x above the device device 10. In this way, the first connecting terminal 142 can be easily accessed from outside the housing 50. The second end of the first connecting terminal 142 may, for example, have an opening. The first connecting terminal 142 can be contacted by means of an external connecting terminal (not explicitly shown). Here, the connecting terminals are typically connected to each other by means of screws and firmly pressed together to establish good electrical contact between the connecting terminals, wherein the screws extend through the openings in the first connecting terminal 142 and the external connecting terminal. Here, a nut is typically arranged below the second end of the first connecting terminal 142, particularly between the second end of the first connecting terminal 142 and the device device 10, wherein the screw extends into the nut. Such a nut may be arranged in an opening or groove formed in the electrically insulating cover element 70. This allows for a more compact implementation of the semiconductor module 100.
[0024] according to Figure 2 , Figure 3 , Figure 7 and Figure 9 The semiconductor module described herein, having only one device device 10, is merely an example. In principle, a semiconductor module can also have more than one device device 10. This is in... Figure 4 , 5 Examples are shown in 6 and 8. Here, Figure 4 , 5Figures 6 and 8 exemplarily illustrate a semiconductor module having two device devices 10. However, in principle, a semiconductor module may also have more than two device devices 10. In the examples shown, each of the two or more device devices 10 has a reference... Figure 2 and 3 The components described. For clarity, Figure 4 The housing 50 is not shown. Two device units 10 are arranged side by side on the base plate 30. Figure 4 In the example shown, the second contact pad 16 of the first device device 10 is electrically connected to the first contact pad 14 of the second device device 10. For example, a conductive connection element may extend between corresponding contact pads 14, 16 of the two device devices 10. In addition to the first connection terminal 142 connected to the first contact pad 14, the second device device 10 also has a second connection terminal 162, which has a first end and a second end opposite to the first end. Here, the first end is connected to the second contact pad 16 of the second device device 10. Similar to the description of the first connection terminal 142, the second connection terminal 162 extends from the second contact pad 16 of the second device device 10 through the housing 50, and the second end protrudes from the housing 50 on the side opposite to the base plate 30. Through the second connection terminal 162, it is possible to access the housing 50 from the outside ( Figure 4 (The housing is not shown) electrically contacts the second contact plate 16 of the second device device 10. For example, the first connection terminal 142 of the first device device 10 can be connected to a first potential (e.g., a positive potential). For example, the second connection terminal 162 of the second device device 10 can be connected to a second potential different from the first potential (e.g., a negative potential). For example, the output potential of the device can be provided at the first connection terminal 142 of the second device device 10.
[0025] Figure 5 Show Figure 4 The device has side walls of housing 50, but no housing cover. Figure 6 The device is shown with a fully enclosed housing 50, and first and second connecting terminals 142, 162 extend from the housing 50 for electrical contact. Figure 4 and Figure 5 A device is shown with a covering element 70 that has no electrical insulation. Figure 6 In this case, the components inside the housing are hidden by the housing 50. Figure 8 The device is shown without a housing, but has an electrically insulating covering element 70 arranged on the device assembly 10. Figure 8The sidewalls of the electrically insulating cover element 70 shown substantially follow the shapes of the corresponding clamp 40 and fixing element 42. Here, in the example shown, the electrically insulating cover element 70 has a substantially square shape, with protrusions for fixing element 42 at the corresponding corners. However, this is merely an example. The electrically insulating cover element 70 can, in principle, have any shape. As explained above, the sidewalls of the electrically insulating cover element 70 can also exist only in sections, thus only partially surrounding the corresponding device assembly 10. As described above, Figure 8 The electrically insulating cover element 70 shown has an opening in its cover for receiving a nut. However, such an opening or groove is only optional.
[0026] A method for manufacturing a semiconductor module 100 includes arranging a device device 10 on a base plate 30, wherein the base plate 30 forms the bottom of a housing 50. The method further includes arranging a clamping plate 40 of a clamping system on the device device 10, such that the device device 10 is positioned between the clamping plate 40 and the base plate 30. The method also includes securing the clamping plate 40 to the base plate 30 by means of one or more fixing elements 42, such that the one or more fixing elements 42 pull the clamping plate 40 toward the base plate 30, causing the device device 10 to press against the base plate 30 by means of the clamping plate 40. The method further includes arranging an electrically insulating covering element 70 above the device assembly 10 and the clamping system, wherein the electrically insulating covering element 70 has a cover and sidewalls, wherein the electrically insulating covering element 70 is arranged such that the cover extends at least partially on the side of the clamping plate 40 opposite to the device assembly 10, and the sidewalls extend from the cover toward the base plate 30, and electrically insulating potting compound 60 is filled into the housing such that the potting compound covers the base plate 30 and partially fills the housing 50, wherein the sidewalls of the electrically insulating covering element 70 extend partially into the electrically insulating potting compound 60 toward the base plate 30. After filling with the electrically insulating potting compound, the lower portion of the device assembly 10 toward the base plate 30 is covered by the electrically insulating potting compound 60, and the upper portion of the device assembly 10 extending from the electrically insulating potting compound 60 is at least partially surrounded by the sidewalls of the electrically insulating covering element 70.
[0027] According to one embodiment, after the electrically insulating cover element 70 is arranged above the device device 10 and the clamping system, the electrically insulating potting compound 60 is filled into the housing 50. The electrically insulating potting compound 60 can then be cured. According to an alternative embodiment, the electrically insulating potting compound 60 is filled into the housing 50 before the electrically insulating cover element 70 is arranged above the device device 10 and the clamping system. That is, the electrically insulating cover element 70 can be arranged above the device device 10 such that a portion of the cover element extends into the electrically insulating potting compound 60 already located in the housing 50. In this example, the electrically insulating potting compound 60 is still in a liquid or viscous state when the electrically insulating cover element 70 is arranged above the device device 10. The electrically insulating potting compound 60 can then be cured. Regardless of whether the electrically insulating potting compound 60 is filled into the housing 50 before or after the electrically insulating cover element 70 is arranged above the device device 10, the described methods produce the aforementioned apparatus (e.g., see...). Figure 7 and 9 ).
Claims
1. A semiconductor module (100) has: Casing (50); The bottom plate (30) forms the bottom of the housing (50); Devices (10) arranged in the housing (50) and on the base plate (30); A clamping system having a clamping plate (40) and one or more fixing elements (42), wherein the device (10) is arranged between the clamping plate (40) and the base plate (30), and the one or more fixing elements (42) are configured to: pull the clamping plate (40) toward the base plate (30) such that the device (10) is pressed against the base plate (30) by means of the clamping plate (40). An electrically insulating covering element (70) having a cover and sidewalls, wherein the cover extends at least partially on the side of the clamping plate (40) away from the device assembly (10), and the sidewalls extend from the cover toward the base plate (30). and An electrically insulating potting compound (60) covering the base plate (30) and partially filling the housing (50), wherein The sidewall of the electrically insulating covering element (70) extends partially into the electrically insulating potting compound (60) in the direction toward the base plate (30), and The lower portion of the device (10) facing the base plate is covered by the electrically insulating potting compound (60), and the upper portion of the device (10) extending from the electrically insulating potting compound (60) is at least partially surrounded by the sidewalls of the electrically insulating covering element (70).
2. The semiconductor module (100) according to claim 1, wherein the sidewall of the electrically insulating covering element (70) extends into the electrically insulating potting compound (60) such that less than 50%, less than 25% or less than 15% of the sidewall is covered by the electrically insulating potting compound (60).
3. The semiconductor module (100) according to claim 1 or 2, wherein the electrically insulating potting compound (60) fills 80% or less, 75% or less, or 65% or less of the housing (50).
4. The semiconductor module (100) according to any one of claims 1 to 3, wherein the device (10) comprises: Semiconductor devices (12); A first contact pad (14) is disposed on a first side of the semiconductor device (12), the first contact pad being configured for electrical contact with the semiconductor device (12). A second contact pad (16) is disposed on a second side of the semiconductor device (12) opposite to the first side, the second contact pad being configured for electrical contact with the semiconductor device (12). An insulating disk (22) is disposed on the first side of the semiconductor device (12); and A pressure plate (24) is disposed on the second side of the semiconductor device (12), wherein The first contact pad (14), the second contact pad (16), and the semiconductor device (12) are arranged between the insulating pad (22) and the pressure plate (24), and The first contact plate (14) and the second contact plate (16) press against the semiconductor device (12) respectively by means of the pressure applied for electrical contact by the clamping system.
5. The semiconductor module (100) according to claim 4, wherein the electrically insulating potting compound (60) at least covers the insulating disk (22), the first contact disk (14), the semiconductor device (12) and the second contact disk (16).
6. The semiconductor module (100) according to claim 4 or 5 further comprises at least one first connection terminal (142) having a first end and a second end opposite to the first end, wherein the first end is connected to the first contact pad (14), the first connection terminal (142) extends from the first contact pad (14) through the housing (50), and the second end extends from the housing (50) on a side opposite to the base plate (30), wherein the electrically insulating cover element (70) is disposed between the device device (10) and the first connection terminal (142).
7. The semiconductor module (100) according to any one of the preceding claims, wherein the device device (10) has a contact element (18) configured to: electrically contact the semiconductor device (12) and disposed between the pressure plate (24) and the second contact pad (16), and wherein the contact element (18) is at least partially covered by the potting compound (60).
8. The semiconductor module (100) according to any one of the preceding claims, wherein the electrically insulating cover element (70) is made of ceramic or plastic.
9. The semiconductor module (100) according to any one of the preceding claims, wherein the cover of the electrically insulating covering element (70) has an opening or a groove.
10. The semiconductor module (100) according to any one of the preceding claims, wherein the upper portion of the device device (10) extending from the electrically insulating potting compound (60) is completely surrounded by the sidewalls of the electrically insulating covering element (70).
11. The semiconductor module (100) according to any one of the preceding claims, wherein the housing (50) has a housing cover, and wherein the cover of the electrically insulating covering element (70) is fixed to the housing cover or formed by a portion of the housing cover.
12. A method for manufacturing a semiconductor module (100), wherein the method comprises: The device assembly (10) is arranged on the base plate (30), wherein the base plate (30) forms the bottom of the housing (50); The clamping plate (40) of the clamping system is arranged on the device (10) such that the device (10) is arranged between the clamping plate (40) and the base plate (30); The clamp (40) is fixed to the base plate (30) by means of one or more fixing elements (42), such that the one or more fixing elements (42) pull the clamp (40) toward the base plate (30), so that the device (10) presses against the base plate (30) by means of the clamp (40). An electrically insulating cover element (70) is arranged above the device assembly (10) and the clamping system, wherein the electrically insulating cover element (70) has a cover and sidewalls, wherein the electrically insulating cover element (70) is arranged such that the cover extends at least partially on the side of the clamping plate (40) opposite to the device assembly (10), and the sidewalls extend from the cover toward the base plate (30); and An electrically insulating potting compound (60) is filled into the housing such that the potting compound covers the base plate (30) and partially fills the housing (50), wherein The sidewall of the electrically insulating covering element (70) extends partially into the electrically insulating potting compound (60) in the direction toward the base plate (30), and The lower portion of the device (10) facing the base plate is covered by the electrically insulating potting compound (60), and the upper portion of the device (10) extending from the electrically insulating potting compound (60) is at least partially surrounded by the sidewalls of the electrically insulating covering element (70).
13. The method according to claim 12, wherein after the electrically insulating covering element (70) is arranged above the device device (10) and the clamping system, the electrically insulating potting compound (60) is filled into the housing (50).
14. The method according to claim 12, wherein the electrically insulating potting compound (60) is filled into the housing (50) before the electrically insulating covering element (70) is arranged above the device device (10) and the clamping system.